TWM600934U - Wafer alignment system and its wafer alignment equipment - Google Patents

Abstract

A wafer alignment equipment includes a platform, a vacuum device, a photographing device, a positioning mechanism and a rotating mechanism. The platform is able to be placed with a load board having a semiconductor wafer placed thereon. The vacuum device is used to vacuum the semiconductor wafer. The photographing device is used to capture a capturing image of the semiconductor wafer. The positioning mechanism can be three-dimensionally movable on the platform for three-dimensional linear motion on the platform. The rotating mechanism is connected to the positioning mechanism, the vacuum device and the photographing device for rotating the vacuum device and the photographing device to a desired position.

Description

Wafer alignment system and wafer alignment equipment

This creation is about a kind of alignment equipment, especially a wafer alignment system and its wafer alignment equipment.

Press, before the semiconductor wafer (Wafer) is made into the thermal print head (TPH) component of the printer, the semiconductor wafer needs to be placed on the mobile carrier first, in order to compare the semiconductor wafer on the mobile carrier. The circle performs subsequent processing (such as film formation or etching, etc.).

However, if there is an error in the positioning operation of the semiconductor wafer on the mobile carrier, the semiconductor wafer will be processed to the wrong position. In severe cases, the semiconductor wafer may be damaged, which will waste material and labor costs, causing inconvenience and Troubled.

Therefore, how to develop a solution to alleviate the above-mentioned shortcomings and inconveniences is actually one of the important issues of the relevant industry that cannot be delayed.

This creation proposes a wafer alignment system and its wafer alignment equipment to solve the problems of the prior art.

According to one embodiment of the present invention, the wafer alignment equipment includes a platform, at least one suction device, at least one photographing device, a positioning mechanism and a rotating mechanism. A workpiece is placed on the platform, and the workpiece includes a carrier and a semiconductor wafer. The semiconductor wafer is placed on the carrier. The adsorption device is used to adsorb the semiconductor wafer. The photographing device is used to obtain a captured image of the workpiece. The positioning mechanism can be three-dimensionally movably set on the platform for three-dimensional linear movement on the platform. The rotating mechanism is connected with the positioning mechanism, the suction device and the photographing device, and is used to rotate the suction device and the photographing device to a preset position.

According to one or more embodiments of the present invention, in the above-mentioned wafer alignment equipment, the platform includes a carrier. The carrier is located on one of the placement surfaces of the platform, and is used to carry the workpiece carrier. The positioning mechanism includes a first traverse module and a second traverse module. The first traverse module is slidably located on the placement surface and is connected to the carrier to drive the carrier to move along the X axis direction of the right-angle coordinate system. The second traverse module is slidably located on the placement surface and is connected to the carrier to drive the carrier to move along the Y-axis direction of the rectangular coordinate system.

According to one or more embodiments of the present invention, in the above-mentioned wafer alignment equipment, the platform includes a bridge type frame. The bridge type frame is located on one of the placement surfaces of the platform, and is used to carry the adsorption device, the photographing device and the rotating mechanism. The positioning mechanism includes a lifting part and a bracket. The lifting part is located on the bridge frame so as to be liftable and used for moving along the Z axis direction of the right-angle coordinate system. The bracket is fixedly connected with the lifting part, the rotating mechanism, the adsorption device and the photographing device.

According to one or more embodiments of the present invention, in the above-mentioned wafer alignment equipment, the suction device sucks the semiconductor wafer through vacuum suction.

According to one or more embodiments of the present invention, in the above-mentioned wafer alignment equipment, the rotating mechanism includes a motor and a connecting part. The motor is fixedly connected to the positioning mechanism and drives the connecting part to rotate. The connecting part is fixedly connected to the suction device and the camera. Device, the motor is a stepping motor or a servo motor.

According to one embodiment of the present invention, the wafer alignment system includes a platform, a carrier, a suction device, a photographing device, a positioning mechanism, a rotating mechanism, and a control device. The carrier is used to carry a semiconductor wafer and includes at least one first alignment mark. The semiconductor wafer has at least one second alignment mark. The platform has a placement surface, and the placement surface is used to carry the carrier board. The adsorption device is used to adsorb the semiconductor wafer. The photographing device is used for obtaining a captured image of the first alignment mark of the carrier and the second alignment mark of the semiconductor wafer. The positioning mechanism can be movably arranged on the platform in three dimensions for linear movement on the platform along at least two of the X, Y and Z axis directions of the right-angle coordinate system. The rotating mechanism is connected with the positioning mechanism, the suction device and the photographing device, and is used to rotate the suction device and the photographing device to a preset position. The control device is electrically connected to the photographing device, the positioning mechanism and the rotating mechanism, and is used to control the positioning mechanism and the rotating mechanism to adjust the position of the semiconductor wafer according to the position information of the first alignment mark and the second alignment mark to make the second alignment mark Align the first alignment mark.

According to one or more embodiments of the present invention, in the above-mentioned wafer alignment system, the positioning mechanism includes a bridge frame, a lateral movement module, a lifting part and a bracket. The bridge frame is located on the platform. The traverse module is slidably located on the bridge support for moving along at least one of the X-axis direction and the Y-axis direction. The elevating part is located on the traverse module so as to move along the Z axis. The bracket is fixedly connected with the adsorption device and the photographing device.

According to one or more embodiments of the present invention, in the above-mentioned wafer alignment system, the suction device sucks the semiconductor wafer through vacuum suction.

According to one or more embodiments of the present invention, in the above-mentioned wafer alignment system, the rotating mechanism includes a motor and a connecting part. The motor is fixed to the positioning mechanism and drives the connecting part to rotate. The connecting part is fixed to the suction device and the camera. Device, the motor is a stepping motor or a servo motor.

According to one or more embodiments of the present invention, in the aforementioned wafer alignment system, the platform includes a carrier. The carrier is located on one of the placement surfaces of the platform, and is used to carry the workpiece carrier. The positioning mechanism includes a first traverse module and a second traverse module. The first traverse module is slidably located on the placement surface and is connected to the carrier to drive the carrier to move along the X axis. The second traverse module is slidably located on the placement surface and is connected to the carrier to drive the carrier to move along the Y axis.

According to one or more embodiments of the present invention, in the aforementioned wafer alignment system, the platform includes a bridge type frame. The bridge type frame is located on one of the placement surfaces of the platform, and is used to carry the adsorption device, the photographing device and the rotating mechanism. The positioning mechanism includes a lifting part and a bracket. The lifting part is located on the bridge frame so as to be liftable and used for moving along the Z-axis direction. The bracket is fixedly connected with the lifting part, the rotating mechanism, the adsorption device and the photographing device.

According to one or more embodiments of the present invention, in the aforementioned wafer alignment system, the carrier is a glass carrier or a silicon carrier.

According to one or more embodiments of the present invention, in the above-mentioned wafer alignment system, the carrier further includes a plate body and a recessed groove. The board is used for placing on the placement surface. The recessed groove is formed on the side of the board body opposite to the placement surface for placing the semiconductor wafer so that there is a gap between this side of the board body and the semiconductor wafer. The first alignment mark is located on this surface of the board and adjacent to the recessed groove.

In this way, through the structure described in the above embodiments, the semiconductor wafer can be accurately positioned on the carrier board, reducing the semiconductor wafer being processed to the wrong position, thereby wasting material cost and labor cost.

The above description is only used to explain the problem to be solved by this creation, the technical means to solve the problem, and the effect it produces, etc. The specific details of this creation will be introduced in detail in the following embodiments and related drawings.

The plural implementations of this creation will be disclosed in schematic form below. For the sake of clarity, many practical details will be explained in the following description. However, those skilled in the art should understand that in the implementation of this creation part, these practical details are not necessary, and therefore should not be used to limit this creation. In addition, in order to simplify the drawings, some conventionally used structures and elements will be shown in a simple schematic manner in the drawings. In addition, for the convenience of readers, the size of each element in the drawings is not drawn according to actual scale.

FIG. 1 is a perspective view of the wafer alignment system 10 according to an embodiment of the invention. Figure 2 is a partial enlarged view of position M in Figure 1. Figure 3 is a front view of the workpiece 900 of Figure 1. As shown in FIGS. 1 to 3, in this embodiment, the wafer alignment system 10 includes a wafer alignment device 100 and a control device 800. The wafer alignment equipment 100 includes a platform 200, one or more (for example, two) suction devices 300, one or more (for example, two) photographing devices 400, a positioning mechanism 500 and a rotating mechanism 600. The platform 200 has a placing surface 210 and a carrier 211. The carrier 211 is located on the placing surface 210 and can be used for placing a workpiece 900. For example, but not limited to this, the workpiece 900 includes a carrier 910 and a semiconductor wafer 950. The carrier 910 lies flat on the carrier 211. The carrier 211 further has a plurality of suction holes 212. The suction hole 212 is placed under the carrier board 910 (it cannot be represented by a dashed line in the figure). The carrier 211 fixes the carrier 910 thereon through the suction hole 212. The carrier 910 includes one or more first alignment marks 940. The semiconductor wafer 950 has one or more second alignment marks 952.

The adsorption device 300 is used to adsorb the semiconductor wafer 950. For example, but not limited to this, the adsorption device 300 adsorbs the semiconductor wafer 950 through vacuum suction. For example, but not limited to this, the adsorption device 300 is controlled by the control device 800. The photographing device 400 is used to obtain captured images of the workpiece 900. For example, but not limited to this, the camera 400 is used to obtain captured images of the first alignment mark 940 of the carrier 910 and the second alignment mark 952 of the semiconductor wafer 950. For example, but not limited to this, the photographing device 400 is controlled by the control device 800.

The positioning mechanism 500 can be three-dimensionally movably set on the platform 200 to perform three-dimensional linear movement on the platform 200. For example, but not limited to this, the positioning mechanism 500 is used for linear movement on the platform 200 along the X, Y, and Z axis directions of the rectangular coordinate system. The rotating mechanism 600 is connected to the positioning mechanism 500, the suction device 300 and the photographing device 400, and is used to rotate the suction device 300 and the photographing device 400 to a preset position around the Z-axis direction. The rotating mechanism 600 is connected to the positioning mechanism 500, the suction device 300 and the photographing device 400, and is used to rotate the suction device 300 and the photographing device 400 to a preset position.

The control device 800 is electrically connected to the photographing device 400, the positioning mechanism 500 and the rotation mechanism 600, and is used to control the positioning mechanism 500 and the rotation mechanism 600 so that the semiconductor wafer 950 is removably placed on the carrier 910. For example, but not limited to this, the control device 800 controls the positioning mechanism 500 and the rotating mechanism 600 to adjust the position of the semiconductor wafer 950 according to the position information of the first alignment mark 940 and the second alignment mark 952 so that the second alignment The bit mark 952 is aligned with the first alignment mark 940. For example, but not limited to this, the control device 800 is a computer device or a processing chip.

As shown in FIGS. 1 to 3, in this embodiment, the positioning mechanism 500 includes a first traverse module 521 and a second traverse module 522. For example, but not limited to this, the first traverse module 521 and the second traverse module 522 are controlled by the control device 800 respectively. The first traverse module 521 is slidably located on the placement surface 210 and is connected to the carrier 211 to drive the carrier 211 to move along the X axis. The second traverse module 522 is slidably located on the placement surface 210 and is connected to the carrier 211 to drive the carrier 211 to move along the Y axis. The first traverse module 521 and the second traverse module 522 are respectively driving air cylinders for driving the carrier 211 along the X axis or the Y axis, respectively.

In addition, the platform 200 further includes a bridge 240. The bridge 240 straddles the placement surface 210 of the platform 200 to support the suction device 300, the photographing device 400, and the rotating mechanism 600. The positioning mechanism 500 includes a lifting part 530 and a bracket 540. The lifting part 530 is located on the bridge frame 240 so as to be liftable and capable of moving along the Z axis. The bracket 540 is fixedly connected to the lifting part 530, the rotating mechanism 600, the adsorption device 300 and the photographing device 400.

In this embodiment, the rotating mechanism 600 includes a motor 610 and a connecting portion 620. The motor 610 is fixedly connected to the lifting part 530 of the positioning mechanism 500 and drives the connecting part 620 to rotate. For example, but not limited to this, the motor 610 is controlled by the control device 800. The connecting part 620 connects the suction device 300 and the photographing device 400 through the bracket 540. For example, but not limited to this, the motor 610 is a stepping motor 610 or a servo motor 610.

Figure 4 is a cross-sectional view of the workpiece 900 in Figure 3 along the line AA. More specifically, as shown in FIG. 1 and FIG. 3, the carrier board 910 further includes a board body 920 and a recessed groove 930. The board 920 is used to be placed on the carrier 211. The recessed groove 930 is formed on a surface 921 of the plate body 920 facing away from the carrier 211 for placing the semiconductor wafer 950 so that this surface 921 of the plate body 920 and the semiconductor wafer 950 have a gap 960. The surface 951 of the semiconductor wafer 950 facing away from the carrier 211 is higher than the surface 921 of the board body 920 facing away from the carrier 211. The first alignment mark 940 is located on this surface 921 of the board 920 and adjacent to the recessed groove 930. The plate body 920 is rectangular and includes two opposite first sides 922 and two opposite second sides 923. Each first side 922 is located between the two second sides 923 and adjacent to the two second sides 923. In this embodiment, the material of the carrier 910 is glass, that is, the carrier 910 is a glass carrier. The material of the semiconductor wafer 950 is silicon crystal. However, the present creation is not limited to this. In other embodiments, the carrier 910 may also be a silicon carrier.

It should be understood that although the semiconductor wafer 950 and the carrier 910 are made of different materials, the imaging device 400 can still directly capture the first alignment mark 940 and the second alignment mark 952 on different materials for subsequent follow-up by the control device 800 use.

The wafer alignment equipment 100 further includes a clamping device 700, a plurality of first stop blocks 220 and a plurality of second stop blocks 230. The first stop blocks 220 are spaced apart on the carrier 211 to directly stop one of the first sides 922 of the baffle body 920, and the second stop blocks 230 are spaced apart on the carrier 211 to directly stop the baffle One of the second sides 923 of the body 920. The fixing device 700 includes a device body 710 and a telescopic arm 720. The device body 710 is located on the platform 200, and the telescopic arm 720 is telescopically located on the device body 710 to extend to directly stop the other first side 922 and the other second side 923 of the baffle body 920. Therefore, the carrier board 910 is firmly located on the carrier platform 211 without any shaking.

In addition, the wafer alignment device 100 further includes a display screen 810. The display screen 810 is located on the bridge 240 and is used to display relevant data of the wafer alignment system 10, such as the captured image obtained by the camera 400. The display screen 810 can be integrated with the control device 800 as a whole. However, the present creation is not limited to this, and the control device 800 is not limited to be located on the platform 200.

More specifically, the control device 800 completes the alignment procedure according to the following steps. In step (a), the first traverse module 521 and/or the second traverse module 522 are driven to laterally move the carrier 211 so that the carrier 910 is positioned. In step (b), the lifting part 530 is driven to descend, so that the semiconductor wafer 950 adsorbed by the adsorption device 300 is approximately located in the recess 930 of the carrier 910; in step (c), the photographing device 400 is driven to the carrier 910 The first alignment mark 940 of the semiconductor wafer 950 and the second alignment mark 952 of the semiconductor wafer 950 obtain the captured image; in step (d), according to the captured image of the camera 400, the first alignment in the captured image The mark 940 and the second alignment mark 952 are respectively converted into the first coordinate and the second coordinate; then, in step (e), it is determined whether the first coordinate and the second coordinate are aligned with each other (for example, the second alignment mark 952 and the second coordinate Whether the connection of the alignment mark 940 passes through the center of the semiconductor wafer 950); if so, complete the alignment procedure; otherwise, calculate the difference between the first coordinate and the second coordinate, and drive the lifting part 530 to rise, so that the adsorbed device 300 The adsorbed semiconductor wafer 950 leaves the recessed groove 930; then, in step (f), based on the above difference, the rotating mechanism 600 is driven to rotate a certain range, and then step (b) is returned.

In this way, through the structure described in the above embodiment, the semiconductor wafer 950 can be accurately positioned on the carrier 910, which reduces the semiconductor wafer 950 being processed to the wrong position, thereby wasting material costs and labor costs.

Finally, the various embodiments disclosed above are not intended to limit the creation. Anyone who is familiar with this technique can make various changes and modifications without departing from the spirit and scope of the creation, and they can all be protected in this creation. In creation. Therefore, the scope of protection of this creation shall be subject to the scope of the attached patent application.

10: Wafer alignment system 100: Wafer alignment equipment 200: platform 210: Place the surface 211: Stage 212: Suction hole 220: first stop 230: second stop 240: Bridge type frame 300: Adsorption device 400: Photography installation 500: positioning mechanism 521: The first traverse module 522: The second traverse module 530: Lifting Department 540: bracket 600: Rotating mechanism 610: Motor 620: Connection 700: Clamping device 710: device body 720: Telescopic boom 800: control device 810: display screen 900: Workpiece 910: carrier board 920: Board 921: face 922: first side 923: second side 930: sunken slot 940: First alignment mark 950: Semiconductor wafer 951: face 952: second alignment mark 960: gap AA: line segment M: location X, Y, Z: axis direction

In order to make the above and other purposes, features, advantages and embodiments of this creation more obvious and understandable, the description of the attached drawings is as follows: Figure 1 is a perspective view of a wafer alignment system according to an embodiment of the invention; Figure 2 is a partial enlarged view of position M in Figure 1; Figure 3 is a front view of the workpiece in Figure 1; and Figure 4 is a cross-sectional view of the workpiece in Figure 3 along line AA.

10: Wafer alignment system

100: Wafer alignment equipment

200: platform

210: Place the surface

211: Stage

220: first stop

230: second stop

240: Bridge type frame

400: Photography installation

521: Transverse Module

522: The second traverse module

700: Clamping device

710: device body

720: Telescopic boom

800: control device

810: display screen

900: Workpiece

910: carrier board

920: Board

922: first side

923: second side

950: Semiconductor wafer

M: location

X, Y, Z: axis direction

Claims (12)

A wafer alignment device, including: A platform for placing a workpiece, the workpiece including a carrier and a semiconductor wafer, and the semiconductor wafer is placed on the carrier; At least one adsorption device for adsorbing the semiconductor wafer; At least one photographing device for obtaining a captured image of the workpiece; A positioning mechanism can be movably set on the platform in three dimensions for performing three-dimensional linear motion on the platform; and A rotating mechanism is connected to the positioning mechanism, the suction device and the photographing device, and is used to rotate the suction device and the photographing device to a preset position. The wafer alignment device according to claim 1, wherein the platform includes a carrier, the carrier is located on a placement surface of the platform, and is used to carry the carrier of the workpiece; and The positioning mechanism includes: A first traverse module, slidably located on the placement surface, connected to the carrier, and used to drive the carrier to move along the X-axis direction of the right-angle coordinate system; and A second traverse module is slidably located on the placement surface and connected to the carrier to drive the carrier to move along the Y axis of the rectangular coordinate system. The wafer alignment equipment according to claim 1, wherein the platform includes a bridge type frame, the bridge type frame is located on a placement surface of the platform, and is used to carry the adsorption device, the photographing device and the rotating mechanism; and The positioning mechanism includes: An elevating part located on the bridge frame so as to move along the Z axis direction of the right-angle coordinate system; and A bracket is fixedly connected with the lifting part, the rotating mechanism, the suction device and the photographing device. The wafer alignment device according to claim 1, wherein the suction device suctions the semiconductor wafer through vacuum suction. The wafer alignment device according to claim 1, wherein the rotating mechanism includes a motor and a connecting portion, the motor is fixedly connected to the positioning mechanism and drives the connecting portion to rotate, and the connecting portion is fixedly connected to the adsorption device and the The photographing device, wherein the motor is a stepping motor or a servo motor. A wafer alignment system, including: A carrier for carrying a semiconductor wafer, the carrier including at least one first alignment mark, and the semiconductor wafer has at least one second alignment mark; A platform with a placement surface for carrying the carrier board; At least one adsorption device for adsorbing the semiconductor wafer; At least one photographing device for obtaining a captured image of the first alignment mark of the carrier and the second alignment mark of the semiconductor wafer; A positioning mechanism can be movably set on the platform in three dimensions for linear motion on the platform along at least two of the X, Y, and Z axis directions of the rectangular coordinate system; A rotating mechanism connected to the positioning mechanism, the suction device and the photographing device, for turning the suction device and the photographing device to a preset position; and A control device is electrically connected to the photographing device, the positioning mechanism and the rotating mechanism, and is used for controlling the positioning mechanism and the rotating mechanism to adjust the semiconductor crystal according to the position information of the first alignment mark and the second alignment mark The position of the circle makes the second alignment mark align with the first alignment mark. The wafer alignment system according to claim 6, wherein the rotating mechanism includes a motor and a connecting portion, the motor is fixedly connected to the positioning mechanism and drives the connecting portion to rotate, and the connecting portion is fixedly connected to the adsorption device and the The photographing device, wherein the motor is a stepping motor or a servo motor. The wafer alignment system according to claim 6, wherein the platform includes a carrier, and the carrier is located on a placement surface of the platform for supporting the carrier; and The positioning mechanism includes: A first traverse module, slidably located on the placement surface, connected to the carrier, and used to drive the carrier to move along the X-axis direction; and A second traverse module is slidably located on the placement surface and is connected to the carrier to drive the carrier to move along the Y axis. The wafer alignment system according to claim 6, wherein the platform includes a bridge frame, the bridge frame is located on a placement surface of the platform, and is used to carry the adsorption device, the photographing device and the rotating mechanism; and The positioning mechanism includes: A lifting part located on the bridge frame so as to move along the Z axis; and A bracket is fixedly connected with the lifting part, the rotating mechanism, the suction device and the photographing device. The wafer alignment system according to claim 6, wherein the suction device suctions the semiconductor wafer through vacuum suction. The wafer alignment system according to claim 6, wherein the carrier board is a glass carrier board or a silicon wafer carrier board. The wafer alignment system according to claim 6, wherein the carrier board further includes: A board for placing on the placement surface; and A recessed groove formed on a side of the board body back to the placement surface for placing the semiconductor wafer so that the surface of the board body has a gap with the semiconductor wafer; The first alignment mark is located on the surface of the board and adjacent to the recessed groove.

Images