TWM599471U - Cleaning structure of electronic components - Google Patents

Abstract

A cleaning structure for electronic components includes a barrel, a rack and at least one oscillating unit, the barrel is used for filling a cleaning liquid, the rack is used for placing at least one electronic component, the rack The oscillating unit is arranged in the accommodating space, and the oscillating unit is used to make the cleaning liquid filled in the accommodating space generate an oscillating wave to clean or soak the electronic component.

Description

Cleaning structure of electronic components

This creation is about a cleaning structure for electronic components, especially for cleaning or soaking wafers.

During the manufacturing process of electronic components, waste particles or chemical agents will remain on the electronic components, so the waste particles or chemical agents must be removed during the manufacturing process.

Take the wafer process as an example. During the wafer process, a patterned photoresist layer is temporarily formed on the surface of a wafer, and the patterned photoresist layer is used to perform subsequent processes such as circuit layout, and the aforementioned process is completed. After that, the patterned photoresist layer must be removed.

In the conventional technology, in order to remove the patterned photoresist layer, the wafer is immersed in a stripper to make the patterned photoresist layer peel off the wafer, but the stripper is used It takes a long time to remove the patterned photoresist layer by soaking, which is not conducive to process efficiency.

The main purpose of this creation is to use at least one oscillating unit to make a cleaning liquid filled in a barrel generate an oscillating wave, and to make the cleaning liquid oscillate by the oscillating wave, so that the cleaning liquid can accelerate the cleaning and immersion in the cleaning liquid. At least one electronic component in the cleaning solution is used to reduce the soaking time of the electronic component and to improve the problem of poor efficiency of the prior art process.

An electronic component cleaning structure of this invention includes a barrel body, a rack and at least one oscillating unit. The barrel body has a barrel wall and an accommodating space. The barrel wall surrounds the accommodating space. Used to fill a cleaning fluid, the rack is used to place at least one electronic component, the rack is disposed in the accommodating space, the oscillating unit is disposed in the barrel, and the oscillating unit is used to make The cleaning liquid filled in the accommodating space generates a shock wave.

This creation uses the oscillating unit to make the cleaning fluid filled in the accommodating space fluctuate, so as to accelerate the cleaning of the electronic component by the cleaning fluid and reduce the immersion time of the electronic component, which has effectively improved the prior art due to the relatively short immersion time. Long, causing the problem of poor process efficiency.

Please refer to Figures 1, 2 and 3, which are an embodiment of the creation, an electronic component cleaning structure 100, which includes a barrel 110, a rack 120, and at least one oscillating unit 130. The barrel 110 It has a barrel wall 111 and an accommodating space 112. The barrel wall 111 surrounds the accommodating space 112. The accommodating space 112 is used to fill a cleaning fluid 200 that can be replaced according to different electronic components to be cleaned. The rack 120 is used to place at least one electronic component 300. In this embodiment, the electronic component 300 is used as an example, but not limited to this. The rack 120 is also disposed on the In the accommodating space 112, the electronic component 300 placed in the rack 120 can be immersed in the cleaning liquid 200.

Please refer to Figures 1, 2 and 3, the oscillating unit 130 is disposed on the barrel 110. In this embodiment, the oscillating unit 130 is disposed on an outer surface 111a of the barrel wall 111, or, in another embodiment , The oscillating unit 130 is disposed on an inner surface 111b of the barrel wall 111, or, in another embodiment, the oscillating unit 130 is disposed in the accommodating space 112 of the barrel 110, and the oscillating unit 130 Used to make the cleaning liquid 200 filled in the accommodating space 112 generate an oscillating wave, so that the cleaning liquid 200 fluctuates and performs a cleaning operation on the electronic component 300 to clean the fine particles attached to the electronic component 300 /Contaminants, or remove the temporary chemical layer (such as photoresist) on the electronic component 300. In this embodiment, the cleaning solution 200 is selected from strippers, but it is not limited to this. The cleaning fluid 200 (removing agent) is used to chemically change a photoresist layer (not shown) on the electronic component 300 (wafer), so that the photoresist layer can peel off the wafer or be dissolved in the cleaning fluid 200 in.

Please refer to Figures 1 to 4. The oscillating unit 130 includes a plurality of first oscillators 131, and the first oscillators 131 are symmetrically arranged around the barrel 110. Please refer to Figures 1 and 5. Preferably, According to the depth of the accommodating space 112 of the barrel 110, the oscillating unit 130 may include a plurality of second oscillators 132. The second oscillators 132 are arranged around the barrel 110. A portion of the cleaning liquid 200 There is a first deep cross H1 between a virtual extension line A of the liquid level 210 and each of the first oscillators 131, and a second deep cross H2 is formed between the virtual extension line A and each of the second oscillators 132, The first deep crossing H1 is not greater than the second deep crossing H2. In this embodiment, the second oscillators 132 are symmetrically arranged around the barrel 110, or, in a different embodiment, the first The two oscillators 132 are arranged asymmetrically on the barrel 110, or, referring to FIG. 6, in another different embodiment, the oscillator unit 130 includes a plurality of oscillators 130a, and the oscillators 130a are asymmetrically Set on the barrel 110, the oscillators 130a can be asymmetrically set on the barrel 110 according to actual needs or different objects to be cleaned (electronic components 300), and the oscillator 130 (such as the first The oscillator 131, the second oscillators 132, or the oscillators 130a) are selected from ultrasonic oscillators.

Please refer to Figures 2 and 3. In this embodiment, the oscillating unit 130 is provided on the outer surface 111a of the barrel wall 111 to illustrate that when the electronic component 300 is placed in the cleaning rack 120 by the mounting rack 120 When the accommodating space 112 of the liquid 200 is immersed in the cleaning liquid 200, the oscillating unit 130 (such as the first oscillators 131, the second oscillators 132, or the oscillators 130a) ) Shake the barrel wall 111 of the barrel 110, and oscillate the cleaning liquid 200 by the barrel wall 111. The cleaning liquid 200 generates a shock wave to make the cleaning liquid 200 fluctuate. By the fluctuation of the cleaning liquid 200, The electronic component 300 immersed in the cleaning liquid 200 is speeded up to clean the electronic component 300 so as to reduce the immersion time of the electronic component 300 and to improve the poor efficiency of the prior art process.

Or, in different embodiments, when the oscillating unit 130 is disposed on the inner surface 111b of the barrel wall 111 of the barrel 110, or the oscillating unit 130 is disposed in the cleaning liquid 200 in the containing space 112 At this time, the oscillating unit 130 directly oscillates the cleaning liquid 200 to cause the cleaning liquid 200 to fluctuate. Similarly, the fluctuation of the cleaning liquid 200 can accelerate the cleaning of the electronic component 300 immersed in the cleaning liquid 200. In order to reduce the soaking time of the electronic component 300, and to solve the problem of poor efficiency of the prior art process.

Please refer to FIGS. 2 and 7. In this embodiment, the cleaning structure 100 for electronic components further includes a swing unit 140. The swing unit 140 has a first bracket 141 and a second bracket 142. The mounting rack 120 Movably coupled to the first bracket 141 and the second bracket 142, the second bracket 142 selectively moves along an axis Y to make the placing frame 120 swing. In this embodiment, the second bracket 142 It movably passes through the first bracket 141.

Please refer to Figures 2 and 7. In this embodiment, the mounting frame 120 has a first shaft base 121 and a second shaft base 122. The first bracket 141 is pivotally connected to the first shaft 141a by a first shaft 141a. A shaft seat 121, the swing unit 140 has a linkage rod 143, the linkage rod 143 is pivoted to the second bracket 142 by a second shaft 142a, and the linkage rod 143 is pivoted to the second bracket 142 by a third shaft 143a For the shaft base 122, please refer to FIG. 8. In another embodiment, the second bracket 142 is pivotally connected to the second shaft base 122 by the second shaft 142a.

Please refer to FIG. 7, because the first shaft seat 121 of the placing frame 120 is pivotally connected to the first bracket 141 by the first shaft 141a, so when the second bracket 142 reciprocates along the axis Y, The rack 120 reciprocally swings with the first shaft 141a as a fulcrum. The reciprocating swing of the rack 120 causes the cleaning fluid 200 to fluctuate to accelerate the cleaning of the cleaning fluid 200 immersed in the cleaning fluid 200. The electronic component 300 can reduce the soaking time of the electronic component 300 and improve the problem of poor efficiency of the prior art process.

The scope of protection of this creation shall be subject to the scope of the attached patent application. Any change and modification made by anyone who is familiar with this technique without departing from the spirit and scope of this creation shall belong to the scope of protection of this creation. .

100: Cleaning structure of electronic components 110: barrel 111: Barrel Wall 111a: outer surface 111b: inner surface 112: housing space 120: Shelf 121: The first shaft seat 122: second shaft seat 130: shock unit 130a: Oscillator 131: First Oscillator 132: Second Oscillator 140: swing unit 141: The first bracket 141a: first shaft 142: second bracket 142a: second shaft 143: Link rod 143a: third shaft 200: cleaning fluid 210: liquid level 300: electronic components A: Virtual extension line H1: The first deep crossing H2: Second deep crossing Y: axis

Figure 1: A three-dimensional view of the cleaning structure of the electronic component of this creation. Figure 2: A three-dimensional cross-sectional view of the cleaning structure of the electronic component of this creation. Figure 3: A cross-sectional view of the cleaning structure of the electronic component of this creation. Figure 4: A cross-sectional view of the barrel of the cleaning structure for electronic components of the invention. Figure 5: A transverse cross-sectional view of the barrel of the electronic component cleaning structure of this creation. Figure 6: The unfolded schematic diagram of the barrel of the electronic component cleaning structure of this creation. Figure 7: A three-dimensional cross-sectional view of the cleaning structure of the electronic component of this creation. Figure 8: A perspective cross-sectional view of another embodiment of the cleaning structure for electronic components of the present invention.

100: Cleaning structure of electronic components

110: barrel

130: shock unit

131: First Oscillator

132: Second Oscillator

140: swing unit

141: The first bracket

Claims (15)

A cleaning structure for electronic components, including: A barrel with a barrel wall and an accommodating space, the barrel wall surrounds the accommodating space, and the accommodating space is used for filling a cleaning liquid; A rack for placing at least one electronic component, the rack being arranged in the accommodating space; and At least one oscillating unit is arranged on the barrel, and the oscillating unit is used to generate an oscillating wave for the cleaning liquid filled in the containing space. Such as the cleaning structure for electronic components of claim 1, wherein the oscillating unit is disposed on an outer surface of the barrel wall of the barrel body. Such as the cleaning structure for electronic components of claim 1, wherein the oscillating unit is disposed on an inner surface of the barrel wall of the barrel body. For example, the cleaning structure for electronic components of claim 1, wherein the oscillating unit is disposed in the accommodating space of the barrel. For example, the cleaning structure for electronic components of claim 2 or 3, wherein the oscillating unit includes a plurality of first oscillators, and the first oscillators are symmetrically arranged around the barrel. For example, the cleaning structure for electronic components of claim 2 or 3, wherein the oscillating unit includes a plurality of oscillating devices, and the oscillating devices are arranged asymmetrically on the barrel. For example, the cleaning structure for electronic components of claim 5, wherein the oscillating unit includes a plurality of second oscillating devices, the second oscillating devices are arranged around the barrel, and a liquid level of the cleaning solution extends a virtual extension line, the There is a first deep transition between the virtual extension line and each of the first oscillators, and there is a second deep transition between the virtual extension line and each of the second oscillators, and the first deep transition is not greater than the second deep transition Crossing. For example, the cleaning structure for electronic components of claim 7, wherein the second oscillators are symmetrically arranged around the barrel. For example, the cleaning structure for electronic components of claim 7, wherein the second oscillators are asymmetrically arranged on the barrel. For example, the cleaning structure for electronic components of claim 1, which further includes a swing unit having a first support and a second support, and the placing rack is movably coupled to the first support and the second support, The second bracket selectively moves along an axis to make the placing frame swing. For example, the cleaning structure for electronic components of claim 10, wherein the rack has a first shaft seat, and the first bracket is pivotally connected to the first shaft seat by a first shaft. For example, the cleaning structure for electronic components of claim 11, wherein the rack has a second shaft seat, and the second bracket is pivotally connected to the second shaft seat by a second shaft. For example, the cleaning structure for electronic components of claim 11, wherein the swing unit has a linkage rod, the rack has a second shaft seat, the linkage rod is pivoted to the second bracket by a second shaft rod, and the linkage rod A third shaft is pivotally connected to the second shaft seat. According to the cleaning structure for electronic components in any one of claims 10 to 13, wherein the second bracket is movably penetrated in the first bracket. According to the cleaning structure for electronic components of claim 1, wherein the oscillating unit is selected from an ultrasonic oscillator.

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