TWM599023U - Wafer cutting system having two adjustable fluids unit - Google Patents

Abstract

A wafer cutting system with adjustable two fluids: including a cutting machine body, a water resistance generating device, a two fluid generating device, and a compressed air supply unit. The water resistance generating device is equipped with a liquid supply tube to output the adjusted resistance value for cutting The compressed air supply unit is equipped with a gas supply pipe to output high-pressure gas. The two-fluid generating device includes a plurality of pressure control units. Each pressure control unit is connected to the first branch pipe and the second branch pipe as the input end, and serves as each pressure output For the liquid spray pipe at the output end of the control unit, multiple first branch pipes are connected in parallel to the liquid supply pipe, multiple second branch pipes are connected in parallel to the air supply pipe, and the spray pipe is connected to the nozzle of the cutting machine body. The input cutting fluid and high-pressure gas are controlled by pressure After the unit is modulated, it outputs the two fluids of gas-liquid mixture and transports them to the spray head to be sprayed through the spray pipe.

Description

Wafer cutting system with adjustable two fluids

This creation is the technical field of a wafer cutting system, especially a system for controlling the cutting fluid into a two-fluid state.

With the development of semiconductor technology, the integration of wafers is getting higher and higher, and the corresponding wafer size is getting smaller and smaller. In the semiconductor manufacturing process, the wafers need to be cut into individual wafers, and then these wafers are subjected to corresponding semiconductor packaging operations. During the cutting process of the knife, high-pressure cutting fluid is sprayed on the knife and the cutting part, and the cutting fluid is used to remove the debris and particles generated during the cutting process. However, as the size of the chip and the cutting gap shrink, the cutting fluid formed by high-pressure water injection can no longer meet the quality requirements of product cleanliness. For example, the wafer products of CMOS image sensor, the CMOS image sensor during cutting The glass surface is easy to adhere to debris and particles, so how to make the liquid of the cutting fluid into particles, even in a water mist state, is more helpful to improve the cleaning effect. In addition, if the resistance value of the cutting fluid can be adjusted, the chip on the wafer can also be prevented from being damaged by electrostatic discharge through the cutting fluid.

In order to solve the above problems, the main purpose of this creation is to have a variable two-fluid wafer cutting system, which can adjust the output of the cutting fluid to the gas-liquid two-fluid state, and control the pressure value, resistance value and intensity, etc., so that the spray The uniformity, strength and properties of the spray on the wafer surface are better controlled to improve the cleaning effect during cutting and improve the quality and yield of wafer cutting.

In order to achieve the above purpose, this creation is a wafer cutting system with adjustable two fluids: including a cutting body, a water resistance generating device, a two fluid generating device, a compressed air supply unit, and the water resistance generating device is equipped with a liquid supply. The compressed air supply unit is equipped with an air supply pipe to output high-pressure gas. The two fluid generating device includes a plurality of pressure control units. Each pressure control unit is connected to the first branch pipe and the second pipe which are input ends. The branch pipe and the liquid spray pipe as the output end of each pressure control unit. Multiple first branch pipes are connected in parallel to the liquid supply pipe, multiple second branch pipes are connected in parallel to the air supply pipe, and the liquid spray pipe is connected to the nozzle of the cutting machine body. The liquid and high-pressure gas are adjusted by the pressure control unit and output the gas-liquid two-fluid and are transported to the spray nozzle through the spray pipe.

As one of the preferred embodiments, a pressure gauge is installed on the second branch pipe to monitor the output gas pressure.

The device is one of the preferred embodiments. The cutting tool of the cutting machine body is provided with at least two nozzles, and each pressure control unit individually controls the two fluid pressure values output by the corresponding nozzle.

As one of the preferred embodiments, an electromagnetic switch is installed on the spray pipe.

As one of the preferred embodiments, each first branch pipe connected to the liquid supply pipe and each second branch pipe connected to the air supply pipe are provided with a flow control valve.

Compared with the prior art, the beneficial effects of the present invention include: 1. The water resistance value generating device and compressed air supply unit connected to the two-fluid generating device can adjust the output of the gas-liquid two-fluid cutting fluid to adjust the uniformity and intensity of the spray sprayed on the wafer surface to achieve the best cleaning. Effect, improve cutting quality and yield. 2. The pressure values of the gas and liquid two fluids output by the corresponding nozzles can be individually controlled, and sprays with different and appropriate uniformity strengths are provided for different cutting positions to improve the cleanliness of the product and further improve the cutting quality.

The technical solution of this creation will be clearly and completely described below in conjunction with specific embodiments and drawings. It should be noted that when a component is referred to as being "fixed to" another component, it means that it can be directly on the other component or there may also be a centered component. When an element is considered to be "connected" to another element, it means that it can be directly connected to the other element or there may be a central element at the same time. In the illustrated embodiment, the directions indicate that up, down, left, right, front and back, etc. are relative, and are used to explain that the structure and movement of different components in this case are relative. These representations are appropriate when the parts are in the positions shown in the figure. However, if the description of the component location changes, it is considered that these representations will also change accordingly.

Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art of creation. The terminology used herein is only for the purpose of describing specific embodiments, and is not intended to limit the creation. The term "and/or" as used herein includes any and all combinations of one or more related listed items.

As shown in Figure 1, the system architecture diagram of this creation. The wafer cutting system with adjustable two fluids in this creation includes a cutting body 1, a water resistance generating device 2, a two fluid generating device 3, and a compressed air supply unit 4. .

The cutting machine body 1 is a wafer cutting machine. The figure only shows a schematic diagram of the cutting tool 11 in the machine. The cutting tool 11 is driven by other mechanisms to rotate to cut the wafer into tiny wafers. There is also a bracket 12 where the cutter 11 is installed with a nozzle 13, and the spray direction of the nozzle 13 corresponds to the cutter 11, so that during the cutting process, the nozzle 13 sprays the cutting fluid mixed with air and water in a timely manner to remove cutting Scattered materials and fine particles on the surface.

The water resistance value generator 2 is used to adjust the resistance value of the output cutting fluid. Generally, the main component of the cutting fluid is deionized water. Due to the high electrical resistance in deionized water, it is easy to generate static electricity on the surface of the product during cutting. In order to avoid charging during the cutting process, carbon dioxide can be added to the cutting fluid to adjust the resistance of the cutting fluid to prevent wafer damage. To the destruction of electrostatic discharge. In this embodiment, the water resistance value generating device 2 outputs the cutting fluid with the adjusted resistance value from the liquid supply pipe 21 to the two fluid generating device 3.

The compressed air supply unit 4 is responsible for supplying high-pressure gas to the second-stream generating device 3, and can be an air compressor or a gas cylinder that has stored high-pressure gas. The compressed air supply unit 4 is provided with an air supply pipe 41 for outputting gas at a set pressure.

The two fluid generating device 3 includes a plurality of pressure control units 31, and each pressure control unit 31 is connected to a first branch pipe 311 and a second branch pipe 312 as an input end, and a liquid spray pipe 313 as an output end. The first branch pipe 311 is connected to the liquid supply pipe 21, and receives the cutting fluid after adjusting the resistance value. The second branch pipe 312 is connected to the gas supply pipe 41 to provide high-pressure gas to the pressure control unit 31. The spray pipe 313 is connected to the spray head 13. The pressure control unit 31 controls the water pressure of the liquid supply pipe 21, and cooperates with the gas input from the air supply pipe 42 to form a cutting fluid that mixes air and water, and then is delivered to the nozzle 13 by the liquid spray pipe 32 and sprayed on the crystal. The cutting position of the round surface can effectively control the spray uniformity and intensity, achieve the best cleaning effect, and improve the quality and yield of wafer cutting. In this embodiment, each second branch pipe 312 is additionally equipped with a pressure gauge 314, and the pressure gauge 42 monitors the output gas pressure.

As shown in Figure 2, this is the second embodiment of the creation. In this embodiment, at least two nozzles 13 are provided at the position of the cutter 11 of each cutting machine body 1, and the same number of pressure control units 31, spray pipes 313, and nozzles 13 are also provided inside the two fluid generating devices 3. In this embodiment, an electromagnetic switch 315 is installed in each spray pipe 313, and the electromagnetic switch 315 controls the opening or closing of the pipeline. The different pressure control units 31 can control the nozzle 13 to output two-fluid cutting fluid with different pressure values, provide different and appropriate uniformity sprays for different cutting positions, and can also adjust the liquid-gas mixing ratio of the two-fluid cutting fluid. Improve cutting quality. The electromagnetic switches 315 in different positions can be turned off synchronously when the nozzle 13 stops spraying, so as to prevent some sewage from entering the nozzle 13 and contaminating the pipeline during the subsequent cutting process.

As shown in Figure 3, this is the third embodiment of the creation. In this embodiment and the second embodiment, each first branch pipe 311 connected to the liquid supply pipe 21 and each second branch pipe 312 connected to the air supply pipe 41 are provided with a flow control valve 316, which can be adjusted separately. The liquid and gas flow of the branch pipe 311 and the second branch pipe 312. The first branch pipe 311 and the second branch pipe 312 whose flow is adjusted by the flow control valve 316 respectively flow into the pressure control unit 31 for mixing the cutting fluid of two fluids with a specific liquid-gas ratio. The pressure control unit 31 can also adjust the cutting fluid pressure of the two fluids flowing into the spray pipe 313, so that the specific liquid-gas mixture ratio and the specific pressure of the two fluid cutting fluid are adjusted by the pressure control unit 31 and sprayed on by the nozzle 13 Wafer surface to improve the ability to remove debris and particles on the wafer surface.

Next, as shown in FIGS. 4A to 4D, it is a schematic diagram of the wafer 5 cutting operation with a plurality of nozzles 13 in cooperation with the cutter 11 in FIG. 2. As shown in Figures 4A, 4B and 4C, the two-fluid generator 3 is provided with a plurality of pressure control units 31, which can individually control the nozzles 13 at different positions to spray the two-fluid cutting fluid with appropriate strength to prevent adjacent nozzles from spraying 13 Simultaneous spraying makes the water mist fork interfere and affect the water mist cleaning effect. Of course, at this time, multiple pressure control units 31 can also provide different output pressure values, so that the cleaning effect is improved. As shown in FIG. 4D, although multiple nozzles 13 spray water mist at the same time, the intensity has been adjusted to reduce cross-interference, and the increase in the amount of water mist makes the cleaning effect better.

Based on the above, the wafer cutting system with adjustable two fluids in this invention uses the pressure control unit of the two fluid generating device to adjust the water-air ratio of the two fluids to achieve the best cleaning effect. In addition, this creation can individually adjust the control pressure value or directly close the nozzles at different positions, so that different cutting positions can obtain the required strength of water mist, improve cleanliness and improve cutting quality.

However, the above-mentioned embodiments are only illustrative of the effects of this creation, not for limiting this creation. Anyone familiar with this technical field can modify and change the above-mentioned embodiments without departing from the spirit and scope of this creation. . In addition, the number of elements in the above-mentioned embodiments is merely illustrative, and is not used to limit the creation. Therefore, the scope of protection of the rights of this creation should be listed in the following patent scope.

1: Cutting body 11: Tool 12: Bracket 13: Nozzle 2: Water resistance value generating device 21: Liquid supply pipe 3: Two fluid generating device 31: Pressure control unit 311: The first pipe 312: second pipe 313: Spray pipe 314: Pressure gauge 315: Electromagnetic switch 316: Flow control valve 4: Compressed air supply unit 41: air supply pipe 5: Wafer

Figure 1 is a system architecture diagram of the first embodiment of the creation.

Figure 2 is a system architecture diagram of the second embodiment of the authoring.

Figure 3 is a system architecture diagram of the third embodiment of the authoring.

Figure 4A is a schematic diagram of the operation of this creation during wafer cutting.

Figure 4B is a schematic diagram of the operation of this creation during wafer cutting.

Figure 4C is a schematic diagram of the operation of this creation during wafer cutting.

Figure 4D is a schematic diagram of the operation of this creation during wafer cutting.

1: Cutting body

11: Tool

12: Bracket

13: Nozzle

2: Water resistance value generating device

21: Liquid supply pipe

3: Two fluid generating device

31: Pressure control unit

311: The first pipe

312: second pipe

313: Spray pipe

314: Pressure gauge

4: Compressed air supply unit

41: air supply pipe

Claims (5)

A wafer cutting system with adjustable two fluids: including a cutting machine body, a water resistance value generating device, a two fluid generating device, and a compressed air supply unit. The water resistance value generating device is provided with a liquid supply pipe that outputs the adjusted resistance value. Cutting fluid, the compressed air supply unit is provided with an air supply pipe to output high-pressure gas, the two fluid generating devices include a plurality of pressure control units, each of the pressure control units is connected to a first branch pipe and a second branch pipe that are used as input ends, and as For each liquid spray pipe at the output end of the pressure control unit, a plurality of the first branch pipes are connected in parallel with the liquid supply pipe, a plurality of the second branch pipes are connected in parallel with the air supply pipe, and the liquid spray pipe is connected with the spray head of the cutting machine body, After the input cutting fluid and high-pressure gas are adjusted by the pressure control unit, the gas-liquid two-fluid is output and delivered to the spray head through the spray pipe. The wafer cutting system with adjustable two fluids according to claim 1, wherein a pressure gauge is installed on the second branch pipe to monitor the output gas pressure. The wafer cutting system with adjustable two fluids according to claim 1, wherein an electromagnetic switch is installed on the liquid spray pipe. The wafer cutting system with adjustable two fluids as described in application item 1, wherein the cutting tool of the cutting machine body is provided with at least two nozzles, and each pressure control unit individually controls the gas, liquid, and two fluids output by the corresponding nozzle Pressure value. The wafer cutting system with adjustable two fluids according to claim 1, wherein each of the first branch pipe connected to the liquid supply pipe and each second branch pipe connected to the gas supply pipe is provided with a Flow control valve.

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