TWM595633U - Vibration feeding mechanism for test system - Google Patents
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- 229910052742 iron Inorganic materials 0.000 claims description 8
- 230000000737 periodic effect Effects 0.000 claims description 2
- 230000001141 propulsive effect Effects 0.000 abstract description 3
- 230000005484 gravity Effects 0.000 description 12
- 238000003825 pressing Methods 0.000 description 12
- 238000007599 discharging Methods 0.000 description 11
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Abstract
一種測試系統的振動送料機構,包括一送料平台,在該送料平台上包括至少一料管槽道,以一延伸方向形成在該送料平台上,用以承置至少一料管;至少一元件輸送槽道,其一端係以相同於該延伸方向連通於該至少一料管槽道,而另一端則形成一元件承置區段。一振動推進裝置結合在該送料平台的底部,用以產生一由該至少一料管槽道向該至少一元件輸送槽道方向的振動推進力,施加至該送料平台。容置在該料管中的待測元件受到該振動推進力而由料管的出料端進入元件輸送槽道中,再送扺元件輸送槽道的元件承置區段。A vibrating feeding mechanism of a test system includes a feeding platform including at least one material tube channel formed on the feeding platform in an extending direction for supporting at least one material tube; at least one component conveying One end of the channel is connected to the at least one material tube channel in the same extension direction, and the other end forms an element receiving section. A vibrating propulsion device is coupled to the bottom of the feed platform to generate a vibratory propulsive force from the at least one material tube channel to the at least one component conveying channel, which is applied to the feed platform. The component to be measured contained in the material tube is subjected to the vibration propulsion force and enters the component conveying channel from the discharge end of the material tube, and then sends the component bearing section of the component conveying channel.
Description
本創作係關於一種電子元件的測試系統,特別是一種測試系統的振動送料機構。This creation is about a test system for electronic components, especially a vibration feeding mechanism of the test system.
在現今各種可攜式電子裝置、測量裝置、檢測裝置、運動設計、電子設備均可能裝設各種信號感測器。例如,為了要量測出加速度或重力,即需裝設重力感測器。藉由重力感測器可感測出物件的加速度、振動、角速度。In today's various portable electronic devices, measuring devices, detecting devices, motion design, and electronic equipment, various signal sensors may be installed. For example, in order to measure acceleration or gravity, it is necessary to install a gravity sensor. The acceleration, vibration and angular velocity of the object can be sensed by the gravity sensor.
在產製重力感測器的過程中,需對產品進行電性能測試,以確保產品良率與電性能。因應重力感測器在測試時必須予以旋轉的需求,業界已設計出各種不同的重力感測器旋轉測試裝置(例如六軸機械手臂、旋轉測試台),以對待測的重力感測器進行旋轉測試。During the production of the gravity sensor, electrical performance testing of the product is required to ensure product yield and electrical performance. In response to the requirement that the gravity sensor must be rotated during the test, the industry has designed a variety of different gravity sensor rotation test devices (such as a six-axis robotic arm and a rotating test bench) to rotate the gravity sensor to be tested test.
在將待測的重力感測器承置定位於旋轉測試裝置時,由於待測的重力感測器需進行各種角度的翻轉,故必須同時考慮到感測器定位穩定性、適當壓緊、防止震動、定位位置的一致性、操作簡便性等。然而,在現有各種不同的重力感測器旋轉測試裝置的設計中,仍普遍無法符合這些要求。When positioning the gravity sensor to be tested on the rotating test device, since the gravity sensor to be tested needs to be flipped at various angles, the positioning stability of the sensor, proper compression, and prevention must also be considered Vibration, consistency of positioning position, easy operation, etc. However, in the design of various existing gravity sensor rotation testing devices, it is still generally unable to meet these requirements.
再者,在現有各種不同的重力感測器旋轉測試裝置的設計中,對於待測元件的入料、出料等系統配置尚無法達到最佳化,往往會使測試系統的效能受到很大限制。Furthermore, in the design of various existing gravity sensor rotation test devices, the system configuration of the input and output of the component to be tested cannot be optimized, which often limits the performance of the test system greatly .
緣此,本創作之主要目的即是提供一種測試系統的振動送料機構的最佳化設計,以使重力感測器的測試程序中,待測元件的入料、出料過程能達到平順、流暢、確實的目的。Therefore, the main purpose of this creation is to provide an optimized design of the vibration feeding mechanism of the test system, so that the feeding and discharging process of the component to be tested can be smooth and smooth in the test procedure of the gravity sensor , A real purpose.
本創作所採用之技術手段係在測試系統的振動送料機構中包括一送料平台,在該送料平台上包括至少一料管槽道,以一延伸方向形成在該送料平台上,用以承置至少一料管;至少一元件輸送槽道,其一端係以相同於該延伸方向連通於該至少一料管槽道,而另一端則形成一元件承置區段。一振動推進裝置結合在該送料平台的底部,用以產生一由該至少一料管槽道向該至少一元件輸送槽道方向的振動推進力,施加至該送料平台。容置在該料管中的待測元件受到該振動推進力而由料管的出料端進入元件輸送槽道中,再送扺元件輸送槽道的元件承置區段。The technical method used in this creation is to include a feeding platform in the vibration feeding mechanism of the test system, including at least one material pipe channel on the feeding platform, formed on the feeding platform in an extending direction to support at least A material tube; at least one component conveying channel, one end of which is connected to the at least one material channel in the same extension direction, and the other end forms a component receiving section. A vibrating propulsion device is coupled to the bottom of the feed platform to generate a vibratory propulsive force from the at least one material tube channel to the at least one component conveying channel, which is applied to the feed platform. The component to be measured contained in the material tube is subjected to the vibration propulsion force and enters the component conveying channel from the discharge end of the material tube, and then sends the component bearing section of the component conveying channel.
在效果方面,透過本創作的振動送料機構,可使容置在料管中的待測元件能在入料過程中平順、流暢、確實地供應至入料區,再配合測試系統的週邊裝置供應至測試系統進行元件性能測試。相同地,在出料過程中,通過本創作的振動送料機構,亦可使測試完成的待測元件能平順、流暢、確實地送至出料區。In terms of effect, through the vibration feeding mechanism of this creation, the components to be tested contained in the material tube can be smoothly, smoothly, and reliably supplied to the feeding area during the feeding process, and then supplied with the peripheral devices of the test system To the test system for component performance testing. Similarly, during the discharging process, the vibration feeding mechanism of this creation can also make the tested components to be tested smoothly, smoothly and surely sent to the discharging area.
本創作所採用的具體技術,將藉由以下之實施例及附呈圖式作進一步之說明。The specific technology used in this creation will be further explained by the following examples and accompanying drawings.
參閱圖1所示,其顯示本創作的立體圖。本創作主要係由一測試裝置100、一元件承置定位裝置200、一入料機構300、一出料機構400、一元件取放裝置500所組成。為了使圖式各組件間的配置關係較為清楚,故後續圖式中若無必要,將省略入料機構300、一出料機構400、一元件取放裝置500。入料機構300係設置在元件承置定位裝置200的一側邊鄰近位置處,用以將複數個待測元件供應至一入料區。入料機構300係設置在元件承置定位裝置200的另一側邊,用以將位在出料區的複數個測畢元件送出。Refer to FIG. 1, which shows a perspective view of the original creation. This creation is mainly composed of a
同時參閱圖2-4所示,圖2顯示本創作的前視圖,圖3顯示本創作的頂視圖,圖4顯示本創作的左側視圖。本創作的測試裝置100包括一支架11、一第一馬達12、一第二馬達13、一旋轉座14、一載台15。其中,第一馬達12係定位在支架11的一側,支架11再安裝在一共同基座10上。第二馬達12的驅動軸係結合於旋轉座14,可驅動該旋轉座14轉動。第二馬達13係定位在旋轉座14,且其驅動軸係結合該載台15,可驅動該載台15轉動。第一馬達2與第二馬達3彼此呈正交角度配置。Referring also to Figures 2-4, Figure 2 shows the front view of the creation, Figure 3 shows the top view of the creation, and Figure 4 shows the left side view of the creation. The
同時參閱圖5、6所示,其中圖5顯示圖1中的部分組件分離時的立體分解圖,圖6顯示圖1中的壓板移離時的頂視圖。載台15的頂面配置複數個定位件16,利用這些定位件16所定義一工作區,且在該工作區結合一承板17,再結合一電路板3。電路板3上配置數個插槽4。每一個插槽4可供插置一待測元件。Also refer to FIGS. 5 and 6, wherein FIG. 5 shows an exploded perspective view of some components in FIG. 1 when separated, and FIG. 6 shows a top view of the pressing plate in FIG. 1 when it is moved away. A plurality of positioning
通過第一馬達12驅動旋轉座14轉動以及第二馬達13驅動載台15轉動,可使載台15順序地位於複數個測試面向中的其中一測試面向,以使測試裝置100的控制器(未示)對插置在插槽4中的待測元件進行電性功能測試。The
本創作的元件承置定位裝置200主要包括一滑座21、一承架22、一垂直導軌23、一壓板24、一水平位移驅動機構5、一昇降驅動機構6。The device bearing
滑座21係結合於水平位移驅動機構5,可由水平位移驅動機構5利用螺桿51驅動沿著一水平滑軌52進行水平方向位移,使該滑座21上的壓板24位在對應於該電路板3的上方位置或遠離該電路板3的位置。The sliding
承架22大致呈U形承架結構,其係藉由複數個垂直導軌23而可昇降地結合在滑座21上,而在承架22的頂面則結合一壓板24。The supporting
承架22的一側緣鄰近位置處,設置一昇降驅動機構6。昇降驅動機構6的驅動軸設置一偏心軸柱61。昇降驅動機構6可帶動偏心軸柱61進行偏心轉動。當偏心軸柱61位在高點時,會扺頂承架22相對應處所設置的一扺頂板221,而當偏心軸柱61離開該高點時,因扺頂板221不再受扺頂,故承架22會下降。如此,可使承架22相對於該滑座21進行垂直方向位移,而使壓板24上昇至一上死點位置或下降至一下死點位置。An up-and-down
承架22和滑座21之間配置至少一拉引彈簧25,藉由拉引彈簧25的彈力,可提供一拉引力於該承架22,將該承架22向著該滑座21的方向拉引。At least one
同時參閱圖7A、7B所示,其中圖7A顯示承架22位在托持電路板3的兩側緣時的示意圖,而圖7B顯示承架22遠離電路板3時的示意圖。承架22在水平位移驅動機構5的驅動之下,可藉由螺桿51驅動滑座21連同承架22沿著水平滑軌52移動位在對應於該電路板3的兩側緣位置。此時,承架22的兩對應滑槽222會滑移托持住載台15的兩側緣(如圖7A所示),故可使載台15受到穩定的托持。相反地,當承架22受到水平位移驅動機構5的反向驅動之下,藉由螺桿51驅動滑座21連同承架22沿著水平滑軌52反向移動而遠離電路板3(如圖7B所示)。7A and 7B, FIG. 7A shows a schematic view when the
參閱圖8A、8B所示,其中圖8A顯示壓板24位在電路板3上方、且位在上死點位置時的剖視示意圖,而圖8B顯示壓板24位在電路板3上方、且位在下死點位置時的剖視示意圖。當承架22位在如圖7A所示的對應於電路板3的兩側緣位置時,壓板24即位在電路板3上方。此時,昇降驅動機構6經由帶動偏心軸柱61進行偏心轉動。當偏心軸柱61位在高點時,會扺頂承架22的扺頂板221,而使壓板24和電路板3上的插槽4相隔一高度(如圖8A所示)。Refer to FIGS. 8A and 8B, where FIG. 8A shows a schematic cross-sectional view when the
相反地,當偏心軸柱61受昇降驅動機構6的轉動而離開該高點時,因承架22的扺頂板221不再受扺頂,故承架22會受到拉引彈簧25的拉引而下降,使壓板24壓扺於插槽4。Conversely, when the
參閱圖9A、9B所示,其中圖9A顯示插槽4的可壓縮座41被向下壓扺時的剖視動作示意圖,而圖9B顯示插槽4的可壓縮座41不受壓扺時的剖視動作示意圖。插槽4中具有一基座40、一結合在該基座40上的可壓縮座41、至少一位在基座40和可壓縮座41間的彈性件42、複數個配置在基座40中的導電部43、一開設在該基座40上的槽座45。可壓縮座41在未受到向下壓力時,藉由彈性件42的彈性力而位在舉昇位置。9A and 9B, wherein FIG. 9A shows a schematic view of the cross-sectional action when the
當壓板24壓扺於插槽4頂部的可壓縮座41時,可壓縮座41的下滑緣411向下壓觸對應的導電部43,而使各個導電部43的接觸端44位在移開位置(參圖9A所示)。此時,即可將待測元件7通過壓板24的開口241置入插槽4中的槽座45中。When the
而當壓板24不再壓扺於插槽4頂部的可壓縮座41時,因壓縮件41的下滑緣411不再壓觸各個導電部43,而使各個接觸端44得以觸壓待測元件7的對應元件引腳71(參圖9B所示)。此後,水平位移驅動機構5即可驅動承架22沿著水平滑軌52移動而遠離電路板3,以便測試裝置100的控制器開始對插槽4中的待測元件7進行電性功能測試。When the
在實際產品化時,基於上述的結構實施例,亦可只配置該承架和結合於該承架的昇降驅動機構。昇降驅動機構用以驅動該承架沿著一垂直方向位移。當該壓板受該昇降驅動機構驅動至下死點位置時,該壓板壓扺於該電路板上所配置的複數個插槽頂部;而當該壓板受該昇降驅動機構驅動至位在上死點位置時,該壓板不再壓扺於該複數個插槽頂部。In actual production, based on the above structural embodiment, only the support frame and the lifting drive mechanism combined with the support frame may be configured. The lifting drive mechanism is used to drive the support frame to move along a vertical direction. When the pressure plate is driven by the elevating drive mechanism to the bottom dead center position, the pressure plate presses on top of the plurality of slots arranged on the circuit board; and when the pressure plate is driven by the elevating drive mechanism to the top dead center When in position, the pressure plate no longer presses on the top of the plurality of slots.
同時參閱圖1、10、11、12所示,入料機構300包括一送料平台301,且在該送料平台301上開設複數個以一延伸方向延伸且用以承置料管的料管槽道302。送料平台301的設置位置即係定義為入料區。At the same time, referring to FIGS. 1, 10, 11, and 12, the
每一個料管槽道302的前端各以相同於料管槽道302的延伸方向延伸出一元件輸送槽道303。元件輸送槽道303的一元件導入端303a係連通於料管槽道302,而另一端則呈一元件承置區段304。該元件輸送槽道303具有一漸縮寬度結構,位在該元件導入端303a的寬度較大,而在相鄰於該元件承置區段304的寬度較小,如此可使待測元件7在振動送料過程中平順地通過元件輸送槽道303。The front end of each
較佳地,每一個元件輸送槽道303的表面形成有一沿著該元件輸送槽道303方向的導引結構,該導引結構包括一沿著該延伸方向延伸的導引凸部303b,且該導引凸部303b距離該元件輸送槽道303的兩側槽壁之間各別形成一側溝槽303c。側溝槽303c的寬度是作為待測元件7兩側的元件引腳71通過的空間。當待測元件7通過元件輸送槽道303時,待測元件7的腹部會貼附移行於導引凸部303b上,使待測元件7在振動送料過程中平順地受到導引凸部303b的導引。Preferably, a guiding structure along the direction of the
相似地,如圖12、13所示,元件承置區段304包括一沿著該延伸方向延伸的承置凸部304a,且該承置凸部304a距離該元件承置區段304的兩側槽壁之間各別形成一側溝槽304b。更佳地,承置凸部304a的高度係低於導引凸部303b的高度,且側溝槽304b可與元件輸送槽道303的側溝槽303c同一高度。如此,可使待測元件7受振動而移行至元件承置區段304時,待測元件7恰精準承置定位在元件承置區段304中,而不會有愰動、偏斜的問題。Similarly, as shown in FIGS. 12 and 13, the
複數個料管305在各別插置在複數個料管槽道302之後,受一垂直於該延伸方向配置的料管定位板306壓制而穩固定位在各別的料管槽道302中。複數個待測元件7係由料管305的第一自由端順序地進到料管305中。較佳地,在料管305的通過路徑可設一頂昇架307,將料管305適當地頂昇其後端高度。The plurality of
送料平台301由於受到底部結合的振動推進裝置8的振動力,故待測元件7會由料管305的第二自由端進入元件輸送槽道303中,再送扺元件輸送槽道303的元件承置區段304。The
為了感測待測元件7在運送過程的位置,可在料管槽道302在對應於料管305的出料端處(即相鄰於元件輸送槽道303處)設置一料管感測器s1、在元件輸送槽道303相鄰於元件承置區段304處設置一元件通過感測器s2、在元件承置區段304設置一元件定位感測器s3。In order to sense the position of the
再如圖1所示,出料機構400包括一出料平台401,且在該出料平台401上開設複數個用以承置複數個出料料管402的出料料管槽道403。出料平台401的設置位置即係定義為出料區。As shown in FIG. 1 again, the
每一個出料料管槽道403的前端各延伸出一元件輸出槽道404。元件輸出槽道404的一端係連通於出料料管槽道403,而另一端則呈一元件承置區段405。A
複數個出料料管402在各別插置在出料料管槽道403之後,受一出料料管定位板406壓制而穩固定位在各別的出料料管槽道403中。出料平台401由於受到底部結合的出料振動推進裝置9的振動力,故測畢後的待測元件會由元件輸出槽道404順序地進入出料料管402中。當出料料管402中容置預定數量的測畢的待測元件之後,操作者即可將出料料管402取出。The plurality of
入料機構300和出料機構400之間,配置一元件取放裝置500,其亦位在元件承置定位裝置200的鄰近位置。元件取放裝置500包括至少一元件取放吸嘴501,其可以採用例如一連通於真空裝置(未示)的真空吸嘴。元件取放吸嘴501連結一X軸向驅動單元502,可由該X軸向驅動單元502帶動進行X軸向位移。X軸向驅動單元502再結合一設置在導引機構504的Y軸向驅動單元503,可由Y軸向驅動單元503驅動沿著導引機構504進行Y軸向位移。Between the
當元件承置定位裝置200的壓板24位在電路板3上方、且位在下死點位置時(同時參閱圖8B所示),元件取放裝置500的元件取放吸嘴501會由入料區取出待測元件7並放入該電路板3的插槽4中。然後,壓板24受昇降驅動機構6的驅動離開該下死點位置(同時參閱圖8A所示)、且由水平位移驅動機構5將壓板24水平位移至遠離電路板3的位置時(同時參閱圖7B所示)時,測試裝置100即可驅動載台15順序地位於複數個測試面向中的其中一測試面向,以對插置在該插槽4中的複數個待測元件7進行電性功能測試。When the
當測試裝置100完成待測元件7的測試後,該元件取放裝置500將待測元件7由插槽4中取出一一地送至出料區,再由出料機構400將測畢的待測元件送入出料料管402中。After the
參閱圖14所示,送料平台301的底部係結合在振動推進裝置8上。振動推進裝置8包括一對前後對應的主振板81。主振板81的頂部及底部各別結合一頂板82和一底板83。頂板82可以鐵質材料所製成,或是以例如鋁質材料製成,但在其底面結合一鐵板84。一電磁產生器85定位在底板83上,且電磁產生器85的頂面和鐵板84之間具有一間隙。電磁產生器85可以採用例如將預定匝數的線圈繞置在一矽鋼片鐵芯的結構。Referring to FIG. 14, the bottom of the
參閱圖15所示,當電磁產生器85受電激磁時,即產生一週期性脉動電磁力施加予該鐵板84,經由頂板82使該主振板81產生一週期性變形/復位,從而使該送料平台301產生由料管槽道302向著元件輸送槽道303方向的振動推進力。因此,容置在料管305中的待測元件7會受到該振動推進力,而順序地由料管305中進入元件輸送槽道303中,最後送扺元件輸送槽道303的元件承置區段304。Referring to FIG. 15, when the
送料平台301上更結合一限位板308,該限位板308位在元件輸送槽道303上,且垂直於該元件輸送槽道303的延伸方向,該限位板308至少部分地覆蓋該元件輸送槽道303,但未覆蓋該元件承置區段304,以在該元件承置區段304上形成一元件取出空間,以便於元件取放裝置500的元件取放吸嘴501將位在元件承置區段304的待測元件7取出。當元件取放吸嘴501將位在元件承置區段304的待測元件7時,由於尚未進入元件承置區段304的待測元件7會受到限位板308的前緣的限制,故不會誤被附著取出。更者,如同前述,因待測元件7係被精準承置定位在元件承置區段304中而不會有愰動、彈跳、偏斜的問題,故當元件取放吸嘴501將位在元件承置區段304的待測元件7取出欲插置在插槽4中時,即不須再進行例如習知技術中的光學定位工序,而可簡化測試工序、增進測試效能。The
以上實施例是針對包括有振動推進裝置8的入料機構300作一說明。相同的結構及動作,亦同樣適用於包括出料振動推進裝置9的出料機構400。The above embodiment is a description of the
以上所舉實施例僅係用以說明本創作,並非用以限制本創作之範圍,凡其他未脫離本創作所揭示之精神下而完成的等效修飾或置換,均應包含於後述申請專利範圍內。The above-mentioned embodiments are only used to illustrate this creation, not to limit the scope of this creation. All other equivalent modifications or replacements that are completed without departing from the spirit disclosed in this creation should be included in the scope of the patent application described later Inside.
100:測試裝置 200:元件承置定位裝置 10:共同基座 11:支架 12:第一馬達 13:第二馬達 14:旋轉座 15:載台 16:定位件 17:承板 21:滑座 22:承架 221:扺頂板 222:滑槽 23:垂直導軌 24:壓板 241:開口 25:拉引彈簧 3:電路板 4:插槽 40:基座 41:可壓縮座 42:彈性件 43:導電部 44:接觸端 45:槽座 5:水平位移驅動機構 51:螺桿 52:水平滑軌 6:昇降驅動機構 61:偏心軸柱 7:待測元件 71:元件引腳 8:振動推進裝置 81:主振板 82:頂板 83:底板 84:鐵板 85:電磁產生器 9:出料振動推進裝置 300:入料機構 301:送料平台 302:料管槽道 303:元件輸送槽道 303a:元件導入端 303b:導引凸部 303c:側溝槽 304:元件承置區段 304a:承置凸部 304b:側溝槽 305:料管 306:料管定位板 307:頂昇架 308:限位板 400:出料機構 401:出料平台 402:出料料管 403:出料料管槽道 404:元件輸出槽道 405:元件承置區段 406:出料料管定位板 500:元件取放裝置 501:元件取放吸嘴 502:X軸向驅動單元 503:Y軸向驅動單元 50:4導引機構 s1:料管感測器 s2:元件通過感測器 s3:元件定位感測器100: test device 200: Component bearing positioning device 10: Common base 11: Bracket 12: First motor 13: Second motor 14: Rotating seat 15: stage 16: Positioning piece 17: bearing plate 21: Slide 22: Carrier 221: The top plate 222: Chute 23: Vertical rail 24: pressure plate 241: opening 25: tension spring 3: circuit board 4: slot 40: Dock 41: Compressible seat 42: Elastic piece 43: conductive part 44: contact end 45: Slot 5: Horizontal displacement drive mechanism 51: screw 52: Horizontal rail 6: Lifting drive mechanism 61: Eccentric shaft column 7: component under test 71: component pin 8: vibration propulsion device 81: Main vibration plate 82: top plate 83: bottom plate 84: iron plate 85: Electromagnetic generator 9: Discharge vibration propulsion device 300: feeding mechanism 301: Feeding platform 302: material channel 303: Component conveying channel 303a: component lead-in 303b: Guide convex part 303c: Side groove 304: component bearing section 304a: Bearing convex part 304b: side groove 305: feed tube 306: material tube positioning plate 307: jacking frame 308: Limit plate 400: Discharging mechanism 401: Discharging platform 402: Discharge tube 403: Discharge tube channel 404: component output channel 405: Component receiving section 406: Discharge tube positioning plate 500: component pick and place device 501: component pick and place nozzle 502: X axial drive unit 503: Y axial drive unit 50:4 guidance mechanism s1: feed tube sensor s2: element passing sensor s3: component positioning sensor
圖1顯示本創作的立體圖。 圖2顯示本創作的前視圖。 圖3顯示本創作的頂視圖。 圖4顯示本創作的左側視圖。 圖5顯示圖1中的部分組件分離時的立體分解圖。 圖6顯示圖1中的壓板移離時的頂視圖。 圖7A顯示承架位在托持電路板的兩側緣時的示意圖。 圖7B顯示承架遠離電路板時的示意圖。 圖8A顯示壓板位在電路板上方、且位在上死點位置時的剖視示意圖。 圖8B顯示壓板位在電路板上方、且位在下死點位置時的剖視示意圖。 圖9A顯示插槽的可壓縮座被向下壓扺時的動作示意圖。 圖9B顯示插槽的可壓縮座不受壓扺時的剖視動作示意圖。 圖10顯示本發明中入料機構的俯視圖。 圖11顯示本發明中入料機構的部分組件分離時的立體圖。 圖12顯示圖11中元件輸送槽道和元件承置區段的擴大立體圖。 圖13顯示一待測元件位在元件輸送槽道的元件承置區段時的俯視圖。 圖14顯示本發明中入料機構和振動推進裝置結合的剖視圖。 圖15顯示本發明中入料機構和振動推進裝置的剖視動作示意圖。 Figure 1 shows a perspective view of this creation. Figure 2 shows the front view of this creation. Figure 3 shows the top view of this creation. Figure 4 shows the left side view of this creation. FIG. 5 shows an exploded perspective view of some components in FIG. 1 when separated. Fig. 6 shows a top view of the pressing plate of Fig. 1 when it is removed. FIG. 7A shows a schematic diagram when the bracket is positioned on both sides of the circuit board. FIG. 7B shows a schematic diagram when the carrier is away from the circuit board. FIG. 8A shows a schematic cross-sectional view when the pressing plate is positioned above the circuit board and is positioned at the top dead center. FIG. 8B shows a schematic cross-sectional view when the pressing plate is positioned above the circuit board and is positioned at the bottom dead center. 9A shows a schematic diagram of the action when the compressible seat of the slot is pressed down. 9B shows a schematic cross-sectional view of the compressible seat of the slot when it is not pressed. Fig. 10 shows a top view of the feeding mechanism in the present invention. Fig. 11 shows a perspective view of a part of the feed mechanism of the present invention when separated. FIG. 12 shows an enlarged perspective view of the component conveying channel and the component receiving section in FIG. 11. 13 shows a top view of a component to be tested when it is located in the component receiving section of the component conveying channel. 14 shows a cross-sectional view of the combination of the feeding mechanism and the vibration propulsion device in the present invention. FIG. 15 shows a schematic sectional view of the feeding mechanism and the vibration propulsion device of the present invention.
8:振動推進裝置 8: vibration propulsion device
300:入料機構 300: feeding mechanism
301:送料平台 301: Feeding platform
302:料管槽道 302: material channel
303:元件輸送槽道 303: Component conveying channel
303a:元件導入端 303a: component lead-in
303b:導引凸部 303b: Guide convex part
303c:側溝槽 303c: Side groove
304:元件承置區段 304: component bearing section
304a:承置凸部 304a: Bearing convex part
304b:側溝槽 304b: side groove
305:料管 305: feed tube
306:料管定位板 306: material tube positioning plate
308:限位板 308: Limit plate
Claims (10)
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TW108217250U TWM595633U (en) | 2019-12-26 | 2019-12-26 | Vibration feeding mechanism for test system |
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TW108217250U TWM595633U (en) | 2019-12-26 | 2019-12-26 | Vibration feeding mechanism for test system |
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