TWM594118U - Electronic device - Google Patents

Abstract

An electronic device is provided, including a circuit board, at least one electronic member, a thermal conductive member, and a heat removal member. The electronic member and the thermal conductive member are disposed on the circuit board, and the position of the thermal conductive member corresponds to the electronic member. The heat removal member is disposed on the thermal conductive member and includes graphene.

Description

Electronic device

This creation is about an electronic device. More specifically, the present invention relates to an electronic device having a pyrolysis element containing graphene.

In recent years, with the development of the technology industry, various types of electronic devices (such as desktop computers or notebook computers) have frequently appeared in daily life. Electronic devices in electronic equipment often generate a large amount of heat energy during operation. Excessively high temperature may cause malfunctions. How to further improve heat dissipation efficiency has always been the goal of discussion.

For example, a display card is one of the most basic electronic devices of a computer. Its purpose is to convert the display information required by the computer system, provide a signal to the display, and allow the display to display images. The display card is an important element for connecting the monitor and the computer motherboard.

The graphics card has a microprocessor that performs drawing operations, that is, a graphics processing unit (Graphics Processing Unit, GPU). A graphics processor is a special type of processor with hundreds or thousands of cores that is optimized to perform a large number of calculations in parallel. During operation, the graphics processor generates a lot of heat energy. Therefore, how to improve the heat dissipation efficiency has become an important issue.

An embodiment of the present invention provides an electronic device, which includes a circuit board, at least one electronic component, a heat-conducting component, and a heat-removing component. The electronic component and the heat conduction element are both disposed on the circuit board, and the position of the heat conduction element corresponds to the aforementioned electronic element. The pyrolysis element is arranged on the heat conduction element and has graphene.

In some embodiments of the present invention, the electronic device further includes a heat dissipation element, which is connected to the electronic element. The electronic component is located between the heat dissipation component and the circuit board, and the aforementioned heat dissipation component has graphene.

In some embodiments of the present invention, the aforementioned heat dissipation element includes a heat zone and a heat dissipation zone, wherein the heat zone corresponds to the electronic component, and the thickness of the heat zone is different from the thickness of the heat dissipation zone. For example, the thickness of the heat zone may be smaller than the thickness of the heat dissipation zone, or the thickness of the heat zone may be greater than the thickness of the heat dissipation zone. In some embodiments of the present creation, the thickness of the heat zone is 0.5 to 1.5 times the thickness of the heat dissipation zone.

In some embodiments of the present invention, the aforementioned heat dissipation element is non-homogeneous and has a plastic material.

In some embodiments of the present invention, the aforementioned heat dissipation element includes a heat zone and a heat dissipation zone, wherein the heat zone corresponds to the electronic component, and the roughness of the surface of the heat zone facing the electronic component is less than the roughness of the surface of the heat dissipation zone.

In some embodiments of the present invention, the aforementioned electronic device further includes another thermally conductive element disposed between the electronic element and the heat dissipating element, and the thermally conductive element contacts the aforementioned electronic element and the heat dissipating element.

In some embodiments of the present invention, the aforementioned circuit board further includes a body and a locking portion, and the locking portion is connected to the body. The heat-dissipating element further includes a supporting portion connected to the locking portion to provide supporting force of the locking portion. Wherein, the normal direction of the body is substantially perpendicular to the normal direction of the support portion.

In some embodiments of the present creation, the aforementioned electronic device is a display card.

Through the aforementioned heat dissipation element with graphene, the heat energy generated by the electronic element in the electronic device can be uniformly and quickly transferred to the entire heat dissipation element, increasing the heat dissipation area and increasing the heat dissipation efficiency. Furthermore, since the heat dissipating element has graphene, its rigidity can be improved, and it can further have a supporting portion that extends to the locking portion of the circuit board to provide the aforementioned supporting force of the locking portion. In addition, the user can also adjust the thickness of the heat dissipation component (heat area) or perform surface treatment on the local surface according to the usage requirements to improve the heat dissipation efficiency of the electronic device or the protection effect of the electronic component.

In order to make the above-mentioned and other purposes, features, and advantages of this creation more obvious and understandable, the preferred embodiments are specifically described below, and in conjunction with the accompanying drawings, detailed descriptions are as follows.

The electronic device of this creative embodiment is described below. However, it can be easily understood that this creative embodiment provides many suitable creative concepts that can be implemented in a wide variety of specific contexts. The specific embodiments disclosed are only used to illustrate the use of the creation in a specific way, and are not intended to limit the scope of the creation.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill to which this article belongs. It is understandable that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and this creation, and should not be in an idealized or excessively formal manner Interpretation, unless specifically defined here.

The following disclosure content of this specification describes specific examples of various components and their arrangement, in order to simplify the description of the invention. Of course, these specific examples are not intended to limit the invention. For example, if the following disclosure of this specification describes the formation of a first feature on or above a second feature, it means that it includes an embodiment in which the formed first feature is in direct contact with the second feature It also includes embodiments in which additional features can be formed between the first feature and the second feature, so that the first feature and the second feature may not be in direct contact. Furthermore, in order to facilitate the description of the relationship between one feature and another feature in the diagram, spatially related terms such as "below", "below", "below", "above", "above", and the like can be used Terminology etc. In addition to the orientation shown in the drawings, spatially related terms encompass different orientations of the device in use or operation. The device can also be otherwise positioned (rotated 90 degrees or at other orientations), and the spatially related descriptions used herein can also be interpreted correspondingly.

First, please refer to FIG. 1, an electronic device E of an embodiment of the present invention mainly includes a circuit board 100, at least one electronic component 200, a plurality of thermally conductive components 300, 300A, 300B, a heat dissipating component 400, at least one fan 500, a The pyrolysis element 600 and a heat dissipation module 700.

The circuit board 100 has a body 110 and a locking portion 120, wherein the body 110 may be provided with at least one pin 111 and a plurality of lines (not shown). The pin 111 is used to connect with an external electronic device (such as a motherboard of a personal computer or a server), and the circuit can electrically connect the electronic component 200 and the pin 111.

The locking portion 120 is provided with one or more connection ports 121, and the connection ports 121 may be the same or different types. For example, the port 121 may be a high definition multimedia interface (High Definition Multimedia Interface, HDMI), a display port (DisplayPort, DP), a digital video interface (Digital Visual Interface, DVI), a VGA terminal (Video Graphics Array connector) , Or various universal serial buses (Universal Serial Bus, USB) (such as standard USB, mini USB, micro USB, or USB TYPE-C, etc.). The aforementioned port 121 can also be electrically connected to the pin 111 through a line.

It should be noted that the body 110 of the circuit board 100 generally has a flat plate structure, and the locking portion 120 extends substantially along the normal direction (Z-axis direction) of the body 110. In addition, the locking portion 120 may further include a metal foil 122, and the connection port 121 may be exposed through the hole 123 in the metal foil 122.

The electronic component 200 is disposed on the body 110 of the circuit board 100. In this embodiment, the electronic device E is a display card, and the electronic device 200 may include a graphics processor (Graphics Processing Unit, GPU), memory, transistor (MOSFET), inductor (choke), and integrated circuit (integrated) circuit, IC), resistance, and/or capacitance. In some embodiments, the electronic device E may also be another type of interface card, such as a network card, a sound card, or a TV card.

The heat conducting element 300 is disposed on the electronic component 200, the heat dissipating element 400 is disposed on the heat conducting element 300, and the heat conducting element 300 is located between the electronic component 200 and the heat dissipating element 400. Specifically, the opposite surfaces 310 and 320 of the heat conductive element 300 contact the electronic element 200 and the heat dissipation element 400 respectively, and may have adhesiveness and flexibility to increase the contact area. In this embodiment, the heat-conducting element 300 may be a heat-conducting sheet or a heat-dissipating paste.

Please refer to FIGS. 1, 2A, and 2B together. The heat dissipation element 400 includes a flat plate portion 410 and a support portion 420, which are connected to each other. The flat portion 410 and the body 110 of the circuit board 100 are substantially parallel, and the support portion 420 extends from the flat portion 410 to the locking portion 120 of the circuit board 100. The flat plate portion 410 and the support portion 420 can be fixed to the body 110 and the locking portion 120 by using locking elements (such as screws), respectively.

In particular, in this embodiment, the heat dissipation element 400 is formed by mixing graphene and plastic materials (such as polycarbonate (Polycarbonate, PC) or ABS resin (Acrylonitrile Butadiene Styrene)). Therefore, compared with the general plastic cover, the heat dissipation element 400 of the present invention has better rigidity to effectively support the locking portion 120 and prevent the locking portion 120 from being deformed due to force. At the same time, the flat plate portion 410 can protect the electronic component 200 and prevent the body 110 of the circuit board 100 from being bent. It should be particularly noted that, in this embodiment, the flat plate portion 410 is fixed to the body 110 of the circuit board 100 by screws, so it can provide a pre-pressure to the heat conductive element 300 to increase the bonding strength of the heat conductive element 300.

In this embodiment, graphene is mixed with plastic materials and may be formed to be heterogeneous. In addition, since the supporting portion 420 needs to be attached to the locking portion 120, and the locking portion 120 extends substantially along the normal direction of the body 110, the normal direction of the supporting portion 420 is also substantially perpendicular to the normal direction of the flat plate portion 410 .

As shown in FIGS. 2A and 2B, the flat plate portion 410 of the heat dissipation element 400 may be divided into one or more heat zones S1 and one or more heat dissipation zones S2, where the heat zone S1 corresponds to the position of the electronic component 200. In other words, when the heat dissipating element 400 is connected to the electronic component 200 through the heat conducting element 300, the thermal zone S1 of the flat plate portion 410 will contact the heat conducting element 300.

The thickness of the heat zone S1 of the flat plate part 410 in the Z-axis direction may be smaller than the thickness of the heat dissipation zone S2, whereby the heat zone S1 may be pressurized during assembly, making it closer to the heat conducting element 300/electronic element 200, electronic The heat energy generated by the element 200 can be more uniformly and quickly transferred to the depyrogenation element 600.

In some embodiments, the thickness of the thermal zone S1 may also be greater than the thickness of the heat dissipation zone S2 to increase the protection strength of the electronic component 200. For example, the thickness of the thermal zone S1 may be 0.5 to 1.5 times the thickness of the heat dissipation zone S2.

In this embodiment, the surface 411 of the thermal zone S1 facing the heat conducting element 300 / the electronic element 200 can be surface-treated to make its roughness less than the roughness of other parts of the heat dissipating element 400 (such as the roughness of the heat dissipating zone S2 ). That is, the surface 411 of the heat zone S1 will be smoother, which can enhance the effect of heat conduction. In some embodiments, the heat-conducting element 300 will be deformed after being pressed, and the distance between the surface 411 of the heat zone S1 and the electronic component 200 may be smaller than the surface of the heat-dissipating area S2 facing the heat-conducting element 300 and the electronic component 200 The distance between the heat conduction element 300 and the electronic element 200 is increased and the vertical distance is reduced to increase the heat conduction to the heat dissipation element 400.

Since the heat dissipating element 400 of the present invention has graphene, when the electronic element 200 operates and generates heat energy, the heat energy conducted to the heat dissipating element 400 through the heat conducting element 300 can be quickly and evenly diffused to the entire heat dissipating element 400, so it can be greatly Increase the heat dissipation capacity of the electronic device E.

Furthermore, the heat dissipation element 400 can be insulated to avoid the occurrence of metal shielding, so that the electronic device E can operate normally.

Please return to FIG. 1, the heat dissipation module 700 may be a heat dissipation fin, which is disposed between the heat dissipation element 400 and the fan 500. The fan 500 can be disposed on the heat dissipation module 700, and can drive gas to flow through the heat dissipation fins during operation, thereby taking away heat energy to reduce the temperature of the heat dissipation element 400. In this embodiment, the heat dissipation module 700 is connected to the heat dissipation element 400 through the heat conducting element 300A, so the contact area of the two due to poor flatness can be avoided. In rare cases, the thermally conductive element 300A may be, for example, a thermally conductive sheet or a thermal paste. In some embodiments, the heat dissipation module 700 may further include heat pipes, aluminum parts, or copper blocks.

In addition, in this embodiment, the fan 500 includes a fan blade 510 and an outer cover 520, and both of them may also be formed of graphene and plastic materials. The number and structure of the fan 500 can be adjusted according to usage requirements, and is not limited to the number and structure drawn in the drawings. In some embodiments, a pipeline through which fluid (eg, water) passes may be used instead of the fan 500, wherein the pipeline may contact the heat dissipation element 400.

The pyrolysis element 600 is disposed on the other side of the circuit board 100, and can also be fixed on the body 110 of the circuit board 100 with a locking element (such as a screw). The circuit board 100 can be located between the heat dissipation element 400 and the pyrolysis element 600. The pyrolysis element 600 may be formed of the same material as the heat dissipation element 400, that is, the pyrolysis element 600 may also have graphene and plastic materials. The pyrolysis element 600 can be connected to the circuit board 100 through the thermal conduction element 300B, wherein the position of the thermal conduction element 300B can correspond to the position of the electronic element 200, therefore, the heat energy generated by the electronic element 200 is also conducted to the pyrolysis element 600, so that the heat dissipation efficiency of the electronic device E Further improve.

As shown in FIG. 6, the pyrolysis element 600 also includes a pair of heat zones S1' and a heat dissipation zone S2'. The heat zone S1' corresponds to the electronic component 200, and the heat dissipation zone S2' is connected to the heat zone S1'. The structure (e.g., thickness and surface treatment) of the heat zone S1' and the heat dissipation zone S2' may be the same as the heat zone S1 and the heat dissipation zone S2 of the heat dissipation element 400, thereby increasing heat dissipation efficiency.

In some embodiments, the surface of the circuit board 100 facing the heat-removing element 600 is also provided with other electronic components. At this time, the heat-conducting element 300B can be disposed on these electronic components, so that the heat energy generated by these electronic components can be conducted to the heat-removing component 600 .

In summary, the present invention provides an electronic device, which includes a circuit board, at least one electronic component, a heat-conducting component, and a heat-removing component. The electronic component and the heat conduction element are both disposed on the circuit board, and the position of the heat conduction element corresponds to the aforementioned electronic element. The pyrolysis element is arranged on the heat conduction element and has graphene.

Through the aforementioned heat dissipation element with graphene, the heat energy generated by the electronic element in the electronic device can be uniformly and quickly transferred to the entire heat dissipation element, increasing the heat dissipation area and increasing the heat dissipation efficiency. Furthermore, since the heat dissipating element has graphene, its rigidity can be improved, and it can further have a supporting portion that extends to the locking portion of the circuit board to provide the aforementioned supporting force of the locking portion. In addition, the user can also adjust the thickness of the heat dissipation component (heat area) or perform surface treatment on the local surface according to the usage requirements to improve the heat dissipation efficiency of the electronic device or the protection effect of the electronic component.

In addition, in some embodiments, the heat dissipation element 400 and the heat dissipation element 600 with graphene can also be applied to devices such as keyboards, mice, and notebook heat dissipation frames to increase the protection strength.

Although the embodiments and advantages of this creation have been created as above, it should be understood that any person with ordinary knowledge in the technical field can make changes, substitutions, and retouching without departing from the spirit and scope of this creation. In addition, the scope of protection of this creation is not limited to the processes, machines, manufacturing, material composition, devices, methods, and steps in the specific embodiments described in the specification. Anyone who has ordinary knowledge in the technical field can disclose content from this creation Understand the current or future developed processes, machines, manufacturing, material composition, devices, methods and steps, as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein can be used according to this creation. Therefore, the protection scope of this creation includes the above-mentioned processes, machines, manufacturing, material composition, devices, methods and steps. In addition, each patent application scope constitutes an individual embodiment, and the scope of protection of this creation also includes a combination of each patent application scope and embodiment.

Although this creation is created as described above in several preferred embodiments, it is not intended to limit this creation. Those who have common knowledge in the technical field to which this creation belongs can make some changes and retouching without departing from the spirit and scope of this creation. Therefore, the scope of protection of this creation shall be deemed as defined by the scope of the attached patent application. In addition, each patent application scope is constructed as an independent embodiment, and various combinations of patent application scopes and embodiments are within the scope of this creation.

100: circuit board 110: Ontology 111: Pin 120: Locking part 121: Port 122: Metal foil 123: Hole 200: Electronic components 300, 300A, 300B: thermally conductive elements 310: surface 320: surface 400: cooling element 410: Flatbed 411: Surface 420: Support 500: fan 510: Fan blade 520: outer cover 600: antipyretic element 700: cooling module E: Electronic device S1, S1’: heat zone S2, S2’: cooling area

The embodiments of the present invention can be better understood according to the following detailed description and the accompanying drawings. It should be noted that according to the standard practice of the industry, the various components in the drawings are not necessarily drawn to scale. In fact, it is possible to arbitrarily enlarge or reduce the size of various components for clear explanation. In this specification and the drawings, similar reference numerals indicate similar features. Figure 1 is an exploded view of an electronic device according to an embodiment of the present invention. FIG. 2A is a schematic diagram showing a heat dissipating element in an embodiment of the present invention. FIG. 2B is a schematic diagram showing the heat dissipation element in an embodiment of the present invention viewed from another perspective.

100: circuit board

110: Ontology

111: Pin

120: Locking part

121: Port

122: Metal foil

123: Hole

200: Electronic components

300, 300A, 300B: thermally conductive components

310: surface

320: surface

400: cooling element

410: Flatbed

420: Support

500: fan

510: Fan blade

520: outer cover

600: antipyretic element

700: cooling module

E: Electronic device

S1’: Hot zone

S2’: Cooling area

Claims (14)

An electronic device, including: A circuit board; At least one electronic component is arranged on the circuit board; A thermally conductive element disposed on the circuit board, and the position of the thermally conductive element corresponds to the electronic element; and A pyrolysis element is disposed on the heat conduction element, wherein the pyrolysis element has graphene. The electronic device as described in item 1 of the patent application scope, wherein the electronic device further includes a heat dissipating element connected to the electronic element, the electronic element is located between the heat dissipating element and the circuit board, and the heat dissipating element has graphene. The electronic device as described in item 1 of the patent application range, wherein the electronic device further includes a pyrolysis element connected to the back surface of the corresponding body of the electronic element, and the pyrolysis element has graphene. The electronic device as described in item 2 of the patent application scope, wherein the heat dissipation element includes a heat zone and a heat dissipation zone, the heat zone corresponds to the electronic element, and the thickness of the heat zone is different from the thickness of the heat dissipation zone. The electronic device as described in item 3 of the patent application scope, wherein the thickness of the thermal zone is 0.5 to 1.5 times the thickness of the heat dissipation zone. The electronic device as described in item 2 of the scope of the patent application, wherein the heat dissipating element and the heat-reducing element further have a plastic material. The electronic device as described in item 2 of the patent application scope, wherein the heat dissipation element is heterogeneous. The electronic device as described in item 2 of the patent application range, wherein the heat dissipation element includes a heat zone and a heat dissipation zone, the heat zone corresponds to the electronic element, and the roughness of the surface of the heat zone facing the electronic element is less than the heat dissipation The roughness of the surface of the zone. The electronic device as described in item 2 of the patent application scope, wherein the electronic device further includes another thermally conductive element disposed between the electronic element and the heat dissipating element and in contact with the electronic element and the heat dissipating element. The electronic device as described in item 2 of the patent application scope, wherein the electronic device further includes a heat dissipation module and a fan, the heat dissipation module is disposed between the fan and the heat dissipation element, wherein the fan has a blade and An outer cover, and both the fan blade and the outer cover have graphene. The electronic device as described in item 2 of the patent application scope, wherein the circuit board further includes a locking portion, and the heat dissipating element further includes a supporting portion, wherein the supporting portion is connected to the locking portion. An electronic device as described in item 10 of the patent application range, wherein the heat dissipation element includes a flat plate portion connected to the support portion, and the normal direction of the flat plate portion is substantially perpendicular to the normal direction of the support portion. The electronic device as described in item 1 of the patent application scope, wherein the electronic device is a display card. The electronic device as described in item 1 of the patent application scope, wherein the electronic device further includes a screw, and the heat-removing element is fixed to the circuit board through the screw.

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