DE202020104570U1 - Electronic device - Google Patents

Abstract

An electronic device comprising: a circuit board; at least one electronic element disposed on the circuit board; a thermally conductive element disposed on the circuit board, the position of the thermally conductive element corresponding to the electronic element; anda heat dissipating element disposed on the thermally conductive element, wherein the heat dissipating element comprises graphene.

Description

REFERENCE TO RELATED APPLICATIONS

This application claims benefit from Taiwanese Patent Application No. 108215671, filed November 26, 2019, the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

Field of invention

The invention relates generally to an electronic device and, more particularly, to an electronic device having a graphene heat sink.

Description of the prior art

As the technology industries have developed in recent years, various types of electronic devices (e.g., desktop computers and notebook computers) are widely used in daily life. In these electronic devices, there are electronic devices that can generate a large amount of heat while they are in operation, and this high temperature can cause the electronic devices to fail. Consequently, the constant improvement of heat dissipation efficiency has always been a goal.

For example, a video card is one of the basic components of an electronic device in a computer. The video card is designed to transform the display signal required in the computer system and to provide a display signal to a monitor so that the monitor can display an image. The video card is an important component that connects the monitor to the computer motherboard.

The video card contains a microprocessor to manipulate computer graphics and process digital images (also known as a graphics processing unit or GPU). A GPU is a special type of processor with hundreds or thousands of cores, optimized to perform a large number of calculations in parallel. A GPU can generate a large amount of heat while in operation, so heat dissipation efficiency is an important consideration.

SUMMARY OF THE INVENTION

One embodiment of the invention provides an electrical device comprising a printed circuit board, at least one electronic element, a thermally conductive element and a heat dissipating element. The electronic element and the thermally conductive element are arranged on the circuit board, and the position of the thermally conductive element corresponds to the electronic element. The heat dissipating element is arranged on the thermally conductive element and comprises graphene.

In some embodiments, the electronic device also includes a heat dissipation element associated with the electronic element. The electronic element is arranged between the heat dissipating element and the circuit board, and the heat dissipating element comprises graphene.

In some embodiments, the heat dissipating element includes a heating region and a heat dissipating region. The heating region corresponds to the electronic element, and the thickness of the heating region is different from the thickness of the heat dissipating region. For example, the thickness of the heating region is smaller or larger than the thickness of the heat dissipating element. In some embodiments, the thickness of the heating region is 0.5-1.5 times the thickness of the heat dissipation region.

In some embodiments, the heat dissipation element is heterogeneous and also comprises plastic material.

In some embodiments, the heat dissipating element includes a heating region and a heat dissipating region. The heating region corresponds to the electronic element, and the roughness of the surface of the heating region facing the electronic element is less than the roughness of the surface of the heat dissipating region.

In some embodiments, the electronic device also includes an additional thermally conductive element disposed between the electronic element and the heat dissipating element, and the additional thermally conductive element is in contact with the electronic element and the heat dissipating element.

In some embodiments, the circuit board also includes a main body and a locking portion connected to the main body. The heat dissipating element also includes a supporting portion connected to the locking portion, and the supporting portion provides a supporting force on the locking portion. The normal direction of the main body is perpendicular to the normal direction of the supporting portion.

In some embodiments, the electronic device is a video card.

Since the heat dissipation element and the heat dissipation element in the electronic device comprise graphene, the heat from the electronic element can be uniformly and quickly transferred to the entire heat dissipation element and the entire heat dissipation element. As a result, the heat dissipation area is increased and the heat dissipation efficiency is improved. In addition, since the heat dissipating member comprises graphene, its rigidity is improved. The heat dissipating member may further include the supporting portion expanded to the locking portion of the circuit board, and the supporting portion can provide a supporting force on the locking portion. In addition, the user can adjust the thickness of the portion (heating portion) of the heat dissipating member as necessary, or apply surface treatment to the surface of the portion of the heat dissipating member to increase the heat dissipation efficiency or the protection of the electronic element.

The invention can be better understood by reading the following detailed description and examples with reference to the accompanying drawings.

Figure list

• 1 ist eine auseinandergezogene Darstellung einer elektronischen Vorrichtung gemäß einer Ausführungsform der Erfindung.
• 2A ist eine schematische Darstellung eines Wärmeabführelements gemäß einer Ausführungsform der Erfindung; und
• 2B ist eine schematische Darstellung des Wärmeabführelements in einer anderen Ansicht gemäß einer Ausführungsform der Erfindung.

Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It should be noted that, in accordance with common industry practice, various features are not drawn to scale. Indeed, the dimensions of the various features can be increased or decreased arbitrarily in the interest of clarity of discussion.

• 1 Figure 3 is an exploded view of an electronic device according to an embodiment of the invention.
• 2A Figure 3 is a schematic representation of a heat dissipation element according to an embodiment of the invention; and
• 2 B is a schematic representation of the heat dissipation element in another view according to an embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

The making and using of the embodiments of the electronic device are discussed in detail below. It should be understood, however, that the embodiments provide many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative of specific ways of producing and using the embodiments and do not limit the scope of protection of the disclosure.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention pertains. It should be understood that any term defined in a commonly used dictionary should be interpreted as having a meaning consistent with the relative skill level and background or context of the present disclosure, and not in an idealized or exaggeratedly formal one Should be interpreted wisely, unless otherwise defined.

The present disclosure provides many different embodiments or examples for implementing various features of the subject matter provided. Concrete examples of solutions and arrangements are described below in order to simplify the present disclosure. These are of course only examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the following description can include embodiments in which the first and second features are formed in direct contact, and can also include embodiments in which additional features are formed between the first and second features may be so that the first and second features may not be in direct contact. Furthermore, to facilitate the description of an element or the relationship of a feature to (another) element (s) or feature (s), as illustrated in the figures, terms with spatial reference, such as “under”, “below”, “deeper "," Above "," above "and similar terms may be used. The spatial terms are intended to encompass different orientations of the device in use or in operation, in addition to the orientation depicted in the figures. The device may be oriented differently (rotated 90 degrees or in other orientations) and the spatial keywords used herein may be construed accordingly.

Referring to 1 , In one embodiment of the invention, the electronic device E primarily comprises a circuit board 100 , at least one electronic element 200 , a variety of thermally conductive elements 300 , 300A , 300B , one Heat dissipation element 400 , at least one fan 500 , a heat sink 600 and a heat dissipation module 700 .

The circuit board 100 includes a main body 110 and a locking portion 120 , and the main body 110 has at least one pen 111 and a plurality of wires (not shown). The pencils 111 are configured to connect an external electronic device (such as a motherboard of a personal computer or a server), and the wires are configured to connect the electronic element 200 with the pen 111 connect to.

One or more connection ports 121 can at the locking connector 120 be arranged, the connection terminals 121 are of the same type or of different types. For example, the connection terminals 121 a High Definition Multimedia Interface (HDMI), a DisplayPort (DP), a Digital Visual Interface (DVI), a Video-Graphics-Array connection or a Universal Serial Bus (USB) (like a standard USB, a Mini-USB , a micro-USB or a USB TYPE-C). The connection ports 121 can also go through the wires electrically to the pen 111 be connected.

It should be noted that the main body 111 the circuit board 100 essentially has a plate structure and the locking portion 120 essentially in the normal direction of the main body 110 (the Z-axis) extends. Furthermore, the locking portion 120 a metal plaque 122 and the connection terminals 121 can from the holes 123 on the metal plate 122 protrude.

The electronic element 200 is on the main body 110 the circuit board 100 arranged. In this embodiment, the electronic device E is a video card and the electronic element 200 includes a graphics processing unit (GPU), a memory, a MOSFET, a choke, an integrated circuit (CI), a resistor and / or a capacitance. In some embodiments, the electronic device E may be an interface card of another type, for example a network interface controller, a sound card, or a TV tuner card.

The thermally conductive element 300 is on the electronic element 200 arranged. The heat dissipation element 400 is on the thermally conductive element 300 arranged. The thermally conductive element 300 is between the electronic element 200 and the heat dissipation element 400 arranged. In particular, there are the opposing surfaces 310 and 320 of the thermally conductive element 300 each in contact with the electronic element 200 and the heat dissipation element 400 and are adhesive and flexible. As a result, the contact area can be increased. In this embodiment, the thermally conductive element 300 be a heat pad or paste.

Referring to the 1 , 2A and 2 B comprises the heat dissipation element 400 a plate section 410 and a supporting section 420 that are connected to each other. The plate section 410 is substantially parallel to the main body 110 the circuit board 100 , and the supporting section 420 extends from the plate section 410 to the locking section 120 the circuit board 100 . The plate section 410 and the supportive section 420 can each by the locking elements (such as screws) on the main body 110 and the locking section 120 be attached.

The heat dissipation element is concrete in this embodiment 400 made from the mixture of graphene and plastic material (such as polycarbonate [PC] or acrylonitrile-butadiene-styrene). Consequently, the heat dissipating element 400 relative to a normal plastic cover a better rigidity and can the locking section 120 support permanently. The deformation of the locking section 120 by the external force can be prevented. At the same time, the plate section 410 the electronic element 200 can protect and flex the main body 110 the circuit board 100 prevent. It should be noted that in this embodiment, since the plate portion 410 through the screws on the main body 110 the circuit board 100 is attached to the thermally conductive element 300 a preload can be applied and the fastening force of the thermally conductive member 300 can be increased.

In this embodiment, the graphene is mixed with the plastic material, and the mixture of the graphene and the plastic material is heterogeneous. Because beyond that, the supportive section 420 on the locking portion 120 is attached and the locking section 120 essentially in the normal direction of the main body 110 is the normal direction of the supporting section 420 substantially perpendicular to the normal direction of the plate section 410 .

As in the 2A and 2 B shown, the plate section 410 in one or more warming regions S1 and one or more heat dissipation regions S2 to be shared. The warming region S1 corresponds to the position of the electronic element 200 . In other words, if the heat dissipation element 400 via the thermally conductive element 300 with the electronic element 200 connected is the warming region S1 of the plate section 410 in contact with the thermally conductive element 300 .

In the Z-axis is the thickness of the heating region S1 of the plate section 410 smaller than the thickness of the heat dissipation region S2 . As a result, the user can put pressure on the heating region during assembly S1 deploy so that the warming region S1 closer to the thermally conductive element 300 and / or the electronic element 200 can be. The one from the electronic element 200 generated heat can be more uniform and faster on the heat dissipation element 400 pass over.

In some embodiments, the thickness is the heating region S1 greater than the thickness of the heat dissipation region S2 to protect the electronic element 200 to improve. For example, the thickness of the heating region is S1 0.5-1.5 times the thickness of the heat dissipation region S2 .

In this embodiment, the surface 411 the warming region S1 , the thermally conductive element 300 and the electronic element 200 facing, a surface treatment can be applied to the roughness of the surface 411 less than the roughness of the other section of the heat dissipating element 400 (For example the roughness of the heat dissipation region S2 ) close. That is, the surface 411 the warming region S1 is smoother than the other surface, and the heat conduction efficiency can be improved. In some embodiments, the thermally conductive element is 300 deformed after applying pressure, and the distance between the surface 411 the warming region S1 and the electronic element 200 is smaller than the distance between the surface of the heat dissipation region S2 , the thermally conductive element 300 and the electronic element 200 facing, so that the attachment of the contacting area between the thermally conductive element 300 and the electronic element 200 can be improved, and the vertical distance between the thermally conductive member 300 and the electronic element 200 can be reduced. The transmission speed of the to the heat dissipation element 400 transferred heat can be increased.

As the heat dissipation element 400 Graph includes, if the electronic element 200 works and generates heat, the heat via the thermally conductive element 300 quickly and uniformly on the heat dissipation element 400 and the heat dissipation of the electronic device E is significantly increased.

In addition, the heat dissipation element 400 insulated so that the metallic shield can be prevented, and the electronic device E can operate normally.

Referring to 1 can the heat dissipation module 700 be a heat sink arranged between the heat dissipating element 400 and the fan 500 . The blower 500 is on the heat dissipation module 700 arranged. When the blower 500 works, the fan can 500 drive the air to flow through the heat sink, the heat can be dissipated, and the temperature of the heat dissipating element 400 can be reduced. In this embodiment, the heat dissipation module 700 via the thermally conductive element 300A was with the thermally conductive element 400 connected, so reducing the contact area between the heat dissipation module 700 with the heat dissipation element 400 is prevented due to the poor flatness. For example, the thermally conductive element 300A be a heat pad or paste. In some embodiments, the heat dissipation module 700 furthermore include heat pipes, aluminum articles or copper billets.

In this embodiment, the fan comprises 500 leaves 510 and a cover 520 . The leaves 510 and the cover 520 can also be made of graphene and the plastic material. The number and structure of the fan 500 can be adjusted if necessary, and it is not limited to the number and structure shown in the figures. In some embodiments, the fan 500 can be replaced by a tube of fluid (such as water), and the tube can be in contact with the heat dissipating element 400 be.

The heat sink 600 is on the other side of the circuit board 100 arranged and can via a locking element (such as a screw) on the main body 110 the circuit board 100 be attached. The circuit board 100 is between the heat dissipation element 400 and the heat sink 600 arranged. The heat sink 600 can be made of the same material as the heat dissipation element 400 be made. In other words, the heat sink 600 may include graphene and plastic material. The heat sink 600 is about the thermally conductive element 300B with the circuit board 100 connected, and the position of the thermally conductive element 300B corresponds to the position of the electronic element 200 . Consequently, the heat from the electronic element 200 also on the heat sink 600 and the heat dissipation efficiency of the electronic device E can be further improved.

As in 1 shown comprises the heat sink 600 at least one warming region S1 ' and at least one heat dissipation region S2 ' . The warming region S1 ' corresponds to the electronic element 200 , and the heat dissipation regions S2 ' are with the warming region S1 ' connected. The structures of the warming region S1 ' and the heat dissipation region S2 ' (for example, the thickness and the surface treatment) can be the same as the heating region S1 and the heat dissipation region S2 of the heat dissipation element 400 to increase the heat dissipation efficiency.

In some embodiments, one or more electronic elements are on the surface of the heat sink 600 , the circuit board 100 facing, arranged. The thermally conductive element 300B may be arranged on these electronic elements, and the heat from these electronic elements may be transmitted to the heat dissipating element 600 be transmitted.

In summary, an electronic device is provided which comprises a printed circuit board, at least one electronic element, a thermally conductive element and a heat dissipating element. The electronic element and the thermally conductive element are arranged on the circuit board, and the position of the thermally conductive element corresponds to the electronic element. The heat dissipating element is arranged on the thermally conductive element and comprises graphene.

Since the heat dissipation element and the heat dissipation element in the electronic device comprise graphene, the heat from the electronic element can be uniformly and quickly transferred entirely to the heat dissipation element and the heat dissipation element. As a result, the heat dissipation area is increased and the heat dissipation efficiency is improved. In addition, since the heat dissipating member comprises graphene, its rigidity is improved. The heat dissipating member may further include the supporting portion expanded to the locking portion of the circuit board, and the supporting portion can provide a supporting force on the locking portion. In addition, the user can adjust the thickness of the portion (heating portion) of the heat dissipating member as necessary, or apply surface treatment to the surface of the portion of the heat dissipating member to increase the heat dissipation efficiency or the protection of the electronic element.

Furthermore, in some embodiments, the heat dissipation element 400 that has graphs can be used to increase protection on other devices. The aforementioned devices may include, for example, a keyboard, mouse, and / or heat sink base of a notebook computer.

Although some embodiments of the present disclosure and their advantages have been described in detail, it should be understood that various changes, substitutions, and modifications can be made herein without departing from the spirit and scope of the disclosure as defined in the appended claims. For example, it will be understood by those skilled in the art that many of the features, functions, processes, and materials described herein can be varied while remaining within the scope of the present disclosure. Furthermore, the scope of protection of the present application is not intended to be limited to the specific embodiments of the process, the machine, the manufacture, the compositions of matter, means, methods and steps described in the description. As one skilled in the art will readily appreciate from the disclosure of the present disclosure, processes, machines, manufacture, compositions of matter, means, methods, and steps that currently exist or are later to be developed can perform substantially the same function or achieve substantially the same result as the respective embodiments described herein can be used in accordance with the present disclosure. Accordingly, it is intended that the appended claims encompass such processes, machines, manufacture, compositions of matter, means, methods or steps within their scope. Furthermore, the scope of the appended claims should be accorded the broadest interpretation so as to cover all such modifications and like arrangements.

While the invention has been described by way of example and with respect to the preferred embodiment, it should be understood that the invention is not so limited. On the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to one skilled in the art). Accordingly, the scope of the appended claims should be accorded the broadest interpretation so as to cover all such modifications and like arrangements.

Claims (14)

An electronic device comprising: a circuit board; at least one electronic element arranged on the circuit board; a thermally conductive element disposed on the circuit board, the position of the thermally conductive element corresponding to the electronic element; and a heat dissipating element disposed on the thermally conductive element, the heat dissipating element comprising graphene. Electronic device according to Claim 1 wherein the electronic device further comprises a heat dissipation element connected to the electronic element, wherein the electronic element is arranged between the heat dissipation element and the circuit board and the heat dissipation element comprises graphene. Electronic device according to Claim 2 wherein the heat dissipating element comprises a heating region and a heat dissipating region, the heating region corresponding to the electronic element and the thickness of the heating region being different from the thickness of the heat dissipating region. Electronic device according to Claim 3 , wherein the thickness of the heating region is 0.5-1.5 times the thickness of the heat dissipating region. Electronic device according to one of the Claims 2 to 4th wherein the heat dissipating element and the heat dissipating element further comprise plastic material. Electronic device according to one of the Claims 2 to 5 , wherein the heat dissipation element is heterogeneous. Electronic device according to one of the Claims 2 to 6th wherein the heat dissipating element comprises a heating region and a heat dissipating region, the heating region corresponding to the electronic element and the roughness of the surface of the heating region facing the electronic element is smaller than the roughness of the surface of the heat dissipating region. Electronic device according to one of the Claims 2 to 7th wherein the electronic device further comprises an additional thermally conductive element disposed between the electronic element and the heat dissipating element, and the additional thermally conductive element is in contact with the electronic element and the heat dissipating element. Electronic device according to one of the Claims 2 to 8th wherein the electronic device further comprises a heat dissipation module and a fan, wherein the heat dissipation module is disposed between the fan and the heat dissipation element, the fan has a blade and a cover, and the fan and the cover comprise graphene. Electronic device according to one of the Claims 2 to 9 wherein the circuit board further comprises a locking portion and the heat dissipating element further comprises a supporting portion, wherein the supporting portion is connected to the locking portion. Electronic device according to Claim 10 wherein the heat dissipating member comprises a plate portion connected to the supporting portion, and the normal direction of the plate portion is substantially perpendicular to the normal direction of the supporting portion. Electronic device according to one of the Claims 1 to 11 wherein the heat dissipating member is connected to the electronic element and corresponds to the back of the main body of the circuit board. Electronic device according to one of the Claims 1 to 12 wherein the electronic device is a video card. Electronic device according to one of the Claims 1 to 13 wherein the electronic device further comprises a screw, and the heat sink is fixed to the circuit board by the screw.

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