TWM593656U - Chip package structure and chip package module - Google Patents

Abstract

A chip packaging module is suitable for electrically connecting a circuit board. The chip packaging module includes an electronic component and a chip packaging structure. The chip packaging structure includes a circuit substrate, a chip, a first thermally conductive component and a packaging layer. The circuit substrate has a first surface facing the circuit board, and a second surface opposite to the first surface and provided with the electronic component, and the circuit substrate is electrically connected to the circuit board. The chip is disposed on the first surface of the circuit board. The first thermally conductive component is located between the wafer and the circuit board, and is disposed on the surface of the wafer away from the circuit substrate, and its thermal conductivity is greater than that of the wafer. The encapsulation layer is located between the circuit substrate and the circuit board, and covers the wafer and a part of the first heat-conducting component to expose the part of the first heat-conducting component to the encapsulation layer.

Description

Chip packaging structure and chip packaging module

The present invention relates to a packaging structure, particularly a chip packaging structure and a chip packaging module.

With the development of electronic products toward light, thin, short, small, etc., and along the direction of multi-function and high performance, in the field of system in package (System in package), the size of its components or systems ranges from micrometers to μm ( 10 ^-6 meters) to millimeters (10 ^-3 meters). Among them, a system-in-package module contains a chip and an electronic component. In the process of reducing the size and performing high-power calculations, the waste heat generated by the chip and the electronic component will increase as a result (and because of the small size Relationship, its heat dissipation area is limited so that a large amount of waste heat will remain in the chip and the electronic component), which in turn will affect the operating efficiency of the chip package module. Therefore, how to improve the operation efficiency of the chip package module is a subject that the industry wants to achieve.

Therefore, the purpose of the present invention is to provide a chip package structure that improves the chip heat dissipation efficiency.

Therefore, the purpose of the present invention is to provide a chip package module that improves the chip heat dissipation efficiency.

Therefore, the new chip packaging structure is suitable for an electronic component. The chip packaging structure includes a circuit substrate, a chip, a first thermally conductive component, and a packaging layer. The circuit board includes a first surface and a second surface opposite to the first surface and provided for the electronic component. The wafer is disposed on the first surface of the circuit board. The first thermally conductive component is disposed on the surface of the wafer away from the circuit substrate, and its thermal conductivity is greater than that of the wafer. The encapsulation layer wraps the chip and a portion of the first thermally conductive component so that the portion of the first thermally conductive component exposes the encapsulation layer.

In some embodiments, the first thermally conductive component includes a first thermally conductive adhesive layer disposed on the surface of the chip away from the circuit substrate, and a first thermally conductive adhesive layer disposed on the first thermally conductive adhesive layer and partially exposing the packaging layer A thermally conductive structure.

In some embodiments, the electronic component includes an electronic component disposed on the second surface, wherein the chip package structure further includes a second thermally conductive component disposed on the first surface, and the second thermally conductive component is disposed on The position of the first surface and the position of the vertical projection of the electronic component onto the first surface at least partially overlap, the thermal conductivity of the second thermally conductive component is greater than that of the circuit substrate, and a portion of the second thermally conductive component is covered by the encapsulation layer The part of the second heat conducting component is exposed to the encapsulation layer.

In some embodiments, the second thermally conductive component includes a second thermally conductive adhesive layer disposed on the first surface of the circuit substrate, and a second thermally conductive adhesive layer disposed on the second thermally conductive adhesive layer and partially exposing the packaging layer 2. Thermally conductive structure.

Therefore, the new chip packaging module is suitable for electrically connecting a circuit board. The chip packaging module includes an electronic component and a chip packaging structure. The chip packaging structure includes a circuit substrate, a chip, a first thermally conductive component and a packaging layer. The circuit board has a first surface facing the circuit board, and a second surface opposite to the first surface and provided for the electronic component, and the circuit board is electrically connected to the circuit board. The wafer is disposed on the first surface of the circuit board. The first thermally conductive component is located between the wafer and the circuit board, and is disposed on the surface of the wafer away from the circuit substrate, and its thermal conductivity is greater than that of the wafer. The encapsulation layer is located between the circuit substrate and the circuit board, and covers the chip and a part of the first heat-conducting component to expose the part of the first heat-conducting component to the encapsulation layer.

In some embodiments, the surface of the first thermal conductive structure exposed on the encapsulation layer is a flat surface.

In some embodiments, the chip package module further includes a lead frame at least partially covered by the encapsulation layer, one end of the lead frame protrudes beyond the encapsulation layer to electrically connect the circuit board, and the other end electrically Connect the circuit board.

The effect of the present invention lies in: by adding a layered first heat conductive structure on the surface of the chip, and covering the first heat conductive structure through the encapsulation layer to improve the fixing and protection effect, so that the first heat conductive structure can Stably absorb the waste heat generated by the chip and remove the waste heat, thereby improving the operation efficiency of the chip. Furthermore, by positioning the second heat-conducting component and the electronic component on the circuit board to correspond to each other, the waste heat energy generated by the electronic component is transmitted to the second heat-conducting component in the shortest path, thereby reducing waste heat residue The electronic component and the circuit board.

Referring to FIG. 1, an embodiment of the new chip packaging module is a system-level packaging structure suitable for electrically connecting a circuit board 9. The chip packaging module includes a chip packaging structure 1 and an electronics Component 2, wherein the chip packaging structure 1 and the electronic component 2 are all in the millimeter scale. In this embodiment, the chip package module is an optical module, for example, which is used for 3D image recognition.

The chip packaging structure 1 includes a circuit substrate 11, a chip 12, a first thermally conductive component 13, a second thermally conductive component 14, a lead frame 15 and a packaging layer 16.

The circuit board 11 has a first surface 111 facing the circuit board 9 and a second surface 112 opposite to the first surface 111 and provided for the electronic component 2, and the circuit board 11 is electrically connected to the circuit board 9 . In this embodiment, the circuit board 11 is exemplified by a double layer circuit board 11 (Double Layer Circuit Board), that is, the first surface 111 and the second surface 112 of the circuit substrate 11 are provided with wire circuits for The electronic components are electrically connected, and the electronic components disposed on the first surface 111 and the electronic components disposed on the second surface 112 can be electrically connected by the wires of the circuit board 11, thereby effectively utilizing the space on the circuit board 11 , And further reduce the area of the circuit board 11 to reduce the overall volume. In this embodiment, the circuit board 11 is spaced from the circuit board 9 and faces the circuit board 9 from the first surface 111. Furthermore, the circuit board 11 is made of a ceramic material (for example, aluminum nitride or aluminum oxide), and the circuit board 11 has a surface area that is more in contact with air than the electronic components, and has high thermal conductivity through the ceramic material Features and more heat dissipation area than electronic parts, so as to absorb and dissipate the waste heat generated during the operation of electronic parts in real time, so that electronic parts maintain proper operating performance.

The wafer 12 is disposed on the first surface 111 of the circuit substrate 11. In this embodiment, the wafer 12 is, for example, a flip chip wafer, which is used to control the electronic component 2 disposed on the second surface 112. The chip 12 has an upper connection surface 121 electrically connected to the first surface 111, and a lower connection surface 122 opposite to the upper connection surface 121 and spaced apart from the circuit board 9.

The first heat-conducting member 13 is disposed on the surface of the wafer 12 away from the circuit substrate 11, and its thermal conductivity is greater than that of the wafer 12. More specifically, the first thermally conductive component 13 has a first thermally conductive adhesive layer 131 and a first thermally conductive structure 132. The first thermally conductive adhesive layer 131 is, for example, an adhesive containing metal components, such as silver glue or solder paste. In terms of silver adhesive, the thermal conductivity is greater than 30 (W/mK), and the first thermally conductive adhesive layer 131 is complete Coated on the lower connection surface 122 of the wafer 12 so that the lower connection surface 122 is not exposed and air cannot remain between the first thermally conductive adhesive layer 131 and the lower connection surface 122, thereby providing A certain degree of adhesion. In addition, the first thermally conductive structure 132 is disposed on the first thermally conductive adhesive layer 131, in other words, the first thermally conductive structure 132 is connected to the chip 12 by the adhesiveness of the first thermally conductive adhesive layer 131, and the first thermally conductive structure 132 An example is a metal layer made of copper and completely covering a side of the first thermally conductive adhesive layer 131 facing away from the wafer 12, thereby enabling the first thermally conductive adhesive layer 131 to be supported and in a narrow space To achieve the cooling effect. The first thermally conductive structure 132 has a first top surface 133 connected to the first thermally conductive adhesive layer 131 and a first bottom surface 134 opposite to the first top surface 133 and spaced apart from the circuit board 9. In this way, the first thermally conductive adhesive layer 131 can absorb the waste heat of the wafer 12 and conduct it to the first thermally conductive structure 132. In this case, the influence of the waste heat on the wafer 12 can be reduced, and the wafer 12 can be maintained as it should. Operating efficiency. It is worth mentioning that the first bottom surface 134 is a flat surface, and the first bottom surface 134 is not limited to being spaced apart from the circuit board 9, in another embodiment, since the first bottom surface 134 is a flat surface, Therefore, the first bottom surface 134 can also directly adhere to the heat conducting structure on the circuit board 9 and increase the contact area through the flat surface, thereby improving the heat dissipation efficiency.

The second thermally conductive member 14 is disposed on the first surface 111. The thermal conductivity of the second thermally conductive member 14 is greater than that of the circuit board 11. The second heat-conducting component 14 is spaced apart from the chip 12 and the first heat-conducting component 13 and includes a second thermally conductive adhesive layer 141 and a second thermally conductive structure 142. Further, the second thermally conductive adhesive layer 141 is, for example, an adhesive containing a metal component, such as silver glue or solder paste, and the second thermally conductive adhesive layer 141 is applied to a portion of the first surface 111 but not with the The installation positions of the wafers 12 overlap. The second thermally conductive structure 142 is disposed on the second thermally conductive adhesive layer 141 and is connected to the circuit substrate 11 by the adhesiveness of the second thermally conductive adhesive layer 141. The second thermally conductive structure 142 is made of copper, for example The metal block completely covers a side of the second thermal conductive adhesive layer 141 facing away from the circuit substrate 11. The second thermally conductive structure 142 has a second top surface 143 connected to the second thermally conductive adhesive layer 141 and a second bottom surface 144 opposite to the second top surface 143 and having the same height as the first bottom surface 134. Thereby, the second heat conductive adhesive layer 141 can absorb the waste heat of the circuit substrate 11 and conduct to the second heat conductive structure 142, in this case, the influence of the waste heat on the electronic components disposed on the circuit substrate 11 can be reduced , So that these electronic parts maintain their due operational efficiency. Of course, the materials of the first heat-conducting member 13 and the second heat-conducting member 14 can be adjusted according to actual needs, and are not limited to the above. It is worth mentioning that the second bottom surface 144 is also a flat surface, and the second bottom surface 144 can be spaced apart from the circuit board 9 to achieve the heat dissipation effect by air flow, and can also be directly attached to the heat conduction structure on the circuit board 9 , Increase the contact area by flattening the surface, thereby improving the heat dissipation efficiency.

The lead frame 15 has a plurality of pins 151 between the circuit substrate 11 and the circuit board 9, wherein the two opposite ends of each pin 151 are electrically connected to the circuit substrate 11 and the circuit board 9 respectively.

In this embodiment, the composition of the encapsulation layer 16 includes epoxy resin, which is filled on the first surface 111 of the circuit board 11 by a mold, and covers the chip 12 and a part of the first heat-conducting member 13, A portion of the second thermally conductive member 14 and a portion of each pin 151 make the first bottom surface 134 of the first thermally conductive member 13, the second bottom surface 144 of the second thermally conductive member 14, and the pins 151 The portion electrically connected to the circuit board 9 is exposed. The encapsulation layer 16 can simultaneously protect and fix the chip 12, the first heat-conducting component 13, the second heat-conducting component 14 and the lead frame 15. The encapsulation layer 16 has a contact surface 161 connected to the first surface 111, and a non-contact surface 162 opposite to the contact surface 161 and having a height equal to or slightly lower than the first bottom surface 134, when the circuit board 9 When the pins 151 are electrically connected, the first bottom surface 134 and the second bottom surface 144 are separated from the circuit board 9 by a gap, so that air can flow in the gap and communicate with the first bottom surface 134 and the second The bottom surface 144 contacts. Of course, the contact between the non-contact surface 162 and the circuit board 9 can be adjusted according to design requirements, and is not limited to the above-mentioned interval.

The electronic component 2 includes an electronic component 21 disposed on the second surface 112 and controlled by the wafer 12. In this embodiment, the electronic component 21 is exemplified as an optical component, and in one embodiment, the position where the electronic component 21 is electrically connected to the second surface 112 corresponds to the second heat-conducting member 14, meaning that the The position where the electronic component 21 is vertically projected onto the first surface 111 at least partially overlaps with the position where the second heat conducting member 14 is disposed on the first surface 111. In this way, the waste heat energy generated by the electronic component 21 is transmitted to the second heat-conducting component 14 through the circuit substrate 11 in the shortest path to maintain the optimal operating performance. Of course, the position where the electronic component 21 is vertically projected onto the first surface 111 can also completely overlap with the position where the second heat-conducting component 14 is disposed on the first surface 111, so that most of the waste heat is directly caused by the second heat-conducting component 14 Absorption, thereby reducing the impact on the wafer 12 and other electronic components.

When the first bottom surface 134, the second bottom surface 144 and the non-contact surface 162 are spaced apart from the circuit board 9, the waste heat generated during the operation of the wafer 12 will be conducted to the first heat-conducting member 13 and flow through the air The first bottom surface 134 dissipates, thereby reducing the influence of waste heat on the wafer 12. In addition, the waste heat energy generated by the electronic component 21 or other electronic components is conducted to the circuit substrate 11 and then to the second heat-conducting member 14 and is radiated from the second bottom surface 144 via the flow of air, thereby causing the The electronic component 21 and other electronic components maintain better operating performance. In addition, when the first heat-conducting component 13 and the second heat-conducting component 14 are directly attached to the heat-conducting structure on the circuit board 9, the waste heat generated during the operation of the chip 12 will be conducted all the way through the first heat-conducting component 13 to The circuit board 9, and the waste heat generated by the electronic component 21 and other electronic components are also conducted to the circuit board 9 via the second heat-conducting member 14, and the heat conduction structure on the circuit board 9 dissipates heat.

In another embodiment, the electronic component 2 can be omitted, and only the chip packaging structure 1 is provided for users to design the configuration of the electronic component 2 by themselves.

To sum up, in the present invention, by adding a layered first heat conductive structure 132 on the surface of the chip 12 and covering the first heat conductive structure 132 through the encapsulation layer 16 to improve the fixing and protection effect, the new The first heat conducting structure 132 can stably absorb the waste heat generated by the chip 12 and remove the waste heat, thereby improving the operation efficiency of the chip 12. Furthermore, by positioning the second heat-conducting member 14 and the electronic component 21 on the circuit board 11 to correspond to each other, the waste heat energy generated by the electronic component 21 is transmitted to the second heat-conducting member 14 in the shortest path In order to reduce the waste heat remaining in the electronic component 21 and the circuit board 11, it can really achieve the purpose of new cost.

However, the above are only examples of the new model. When the scope of the new model cannot be limited by this, any simple equivalent changes and modifications made according to the patent application scope and patent specification content of the new model are still regarded as Within the scope of this new patent.

1: chip package structure 11: Circuit board 111: first side 112: second side 12: Wafer 121: Upper connection surface 122: Lower connection surface 13: The first heat conduction component 131: The first thermally conductive adhesive layer 132: The first heat conduction structure 133: first top surface 134: the first bottom 14: Second heat conduction component 141: Second thermally conductive adhesive layer 142: Second heat conduction structure 143: Second top surface 144: second bottom 15: lead frame 151: Pin 16: Encapsulation layer 161: contact surface 162: Non-contact surface 2: Electronic components 21: Electronic components 9: Circuit board

Other features and functions of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: FIG. 1 is a schematic cross-sectional view of an embodiment of the present invention.

1: chip package structure

11: Circuit board

111: first side

112: second side

12: Wafer

121: Upper connection surface

122: Lower connection surface

13: The first heat conduction component

131: The first thermally conductive adhesive layer

141: Second thermally conductive adhesive layer

142: Second heat conduction structure

143: Second top surface

144: second bottom

15: lead frame

151: Pin

16: Encapsulation layer

161: contact surface

162: Non-contact surface

132: The first heat conduction structure

133: first top surface

134: the first bottom

14: Second heat conduction component

2: Electronic components

21: Electronic components

9: Circuit board

Claims (10)

A chip packaging structure is suitable for setting an electronic component. The chip packaging structure includes: A circuit board including a first surface and a second surface opposite to the first surface and provided for the electronic component; A chip disposed on the first surface of the circuit substrate; A first thermally conductive component disposed on the surface of the chip away from the circuit substrate and having a thermal conductivity greater than that of the chip; and An encapsulation layer encapsulates the chip and a portion of the first thermally conductive component so that the portion of the first thermally conductive component exposes the encapsulation layer. The chip package structure as claimed in claim 1, wherein the first thermally conductive component includes a first thermally conductive adhesive layer disposed on a surface of the chip away from the circuit substrate, and a partially exposed thermally conductive adhesive layer disposed on the first thermally conductive adhesive layer The first heat conduction structure of the encapsulation layer. The chip packaging structure according to claim 1, the electronic component includes an electronic component disposed on the second surface, wherein the chip packaging structure further includes a second thermally conductive component disposed on the first surface, the second The position where the heat conduction member is disposed on the first surface and the position where the electronic component is vertically projected onto the first surface at least partially overlap, the thermal conductivity of the second heat conduction member is greater than that of the circuit substrate, and a part of the second heat conduction member is encapsulated The cladding layer exposes a portion of the second thermally conductive component to the encapsulation layer. The chip package structure according to claim 3, wherein the second thermally conductive component includes a second thermally conductive adhesive layer disposed on the first surface of the circuit substrate, and a partially exposed thermally conductive adhesive layer disposed on the second thermally conductive adhesive layer The second heat conduction structure of the encapsulation layer. A chip packaging module is suitable for electrically connecting a circuit board. The chip packaging module includes: An electronic component; and A chip package structure, including A circuit board having a first surface facing the circuit board and a second surface opposite to the first surface and provided for the electronic component, and the circuit board is electrically connected to the circuit board, A chip disposed on the first surface of the circuit board, A first thermally conductive component, located between the chip and the circuit board, and disposed on the surface of the chip away from the circuit board, and having a thermal conductivity greater than that of the chip, and An encapsulation layer is located between the circuit substrate and the circuit board, and covers the chip and a part of the first heat-conducting component to expose the part of the first heat-conducting component to the encapsulation layer. The chip package module according to claim 5, wherein the first thermally conductive component has a first thermally conductive adhesive layer disposed on a surface of the chip away from the circuit substrate, and a partially disposed portion of the first thermally conductive adhesive layer The first heat conducting structure of the encapsulation layer is exposed. The chip packaging module according to claim 6, wherein the surface of the first heat conductive structure exposed on the packaging layer is a flat surface. The chip packaging module according to claim 5, wherein the electronic component includes an electronic component disposed on the second surface; the chip packaging structure further includes a second thermally conductive component disposed on the first surface, the first The position where the two heat-conducting components are disposed on the first surface and the position where the electronic component is vertically projected onto the first surface at least partially overlap. The thermal conductivity of the second heat-conducting component is greater than that of the circuit substrate, and a part of the second heat-conducting component is The encapsulation layer is covered to expose a part of the second heat-conducting component to the encapsulation layer. The chip package module according to claim 8, wherein the second thermally conductive component includes a second thermally conductive adhesive layer disposed on the first surface of the circuit substrate, and a partially disposed thermally conductive adhesive layer The second heat conducting structure of the encapsulation layer is exposed. The chip packaging module according to claim 5, further comprising a lead frame at least partially covered by the packaging layer, one end of the lead frame protruding out of the packaging layer is electrically connected to the circuit board, and the other end is electrically connected Connect the circuit board.

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