TW201434358A - Printed circuit board structure with heat dissipation function - Google Patents

Abstract

A printed circuit board (PCB) structure with a heat dissipation function is provided, including: a package substrate; a landing pad formed over a portion of the package substrate from a first surface thereof, wherein the landing pad has a rectangular configuration and has a plurality of corners; a plurality of ground traces formed over various portions of the package substrate, physically connecting to the landing pad from at least two of the corners thereof, respectively; a first through hole formed through the landing pad and the package substrate from substantially a center portion of the landing pad; and a plurality of second through holes formed through the landing pad and the package substrate from substantially one of the corners of the landing pad, wherein the second through holes are adjacent to the ground traces, respectively.

Description

Printed circuit board structure with heat dissipation function

The present invention relates to a printed circuit board, and more particularly to a printed circuit board structure having a heat dissipation function.

With the development of computer technology, electronic components have been operated at high speeds. However, the faster the electronic device operates, the more heat it will produce. If the generated thermal energy is not properly dissipated, it will seriously impact the operational stability of the electronic components. In general, to ensure proper operation of the electronic device, a heat dissipation device can be used to dissipate the thermal energy generated by the electronic device.

Generally, a heat dissipating component of an electronic device that is in contact with a printed circuit board is a heat sink formed of a solid metal such as a copper alloy, which has a fin-like configuration. ).

However, the use of heat sinks increases the manufacturing cost and manufacturing time of electronic device packages including one of such printed circuit boards and electronic devices. Therefore, there is a need for a novel heat-dissipating printed circuit board structure that eliminates the use of heat sinks.

According to an embodiment, the present invention provides a printed circuit board structure having a heat dissipation function, comprising: a package substrate; a solder pad formed in the package One of the first surfaces of the substrate, wherein the solder pad has a rectangular shape and has a plurality of corners; a plurality of ground lines are formed on the plurality of package substrates, and are physically coupled to at least the pads a plurality of corners of the corners; a first through hole penetrating the pad and the package substrate from a center of the pad; and a plurality of second through holes substantially adjacent to the pad One of the corners penetrates the pad and the package substrate, wherein the second through holes are respectively adjacent to one of the ground lines.

The above-mentioned heat-dissipating printed circuit board structure can eliminate the use of the heat sink, thereby saving manufacturing cost and manufacturing time.

100‧‧‧Printed circuit board structure

102‧‧‧Package substrate

104‧‧‧solder layer

110‧‧‧ solder pads

120‧‧‧ wire

120’‧‧‧ Grounding wire

130‧‧‧ Grounding wire

140‧‧‧Grounding wire

150‧‧‧Area

160‧‧‧through holes

170‧‧‧through holes

175‧‧‧through holes

180‧‧‧through holes

190‧‧‧ Conductive layer

195‧‧‧ Conductive layer

300‧‧‧Printed circuit board structure

310‧‧‧ Grounding wire

320‧‧‧through holes

330‧‧‧ Grounding wire

340‧‧‧through holes

400‧‧‧Printed circuit board structure

500‧‧‧Printed circuit board structure

W1‧‧‧ line width

W2‧‧‧ line width

D1‧‧‧ diameter

D2‧‧‧ diameter

A‧‧‧ top surface

B‧‧‧ bottom

1 is a top plan view showing a printed circuit board structure having a heat dissipation function according to an embodiment of the present invention.

Fig. 2 is a schematic cross-sectional view showing the structure of the printed circuit board having the heat dissipation function in Fig. 1 along line 2-2.

Fig. 3 is a schematic side view showing a printed circuit board structure having a heat dissipation function as shown in Fig. 1.

Figure 4 is a top plan view showing a printed circuit board structure having a heat dissipation function according to another embodiment of the present invention.

Figure 5 is a top plan view showing a printed circuit board structure having a heat dissipation function according to still another embodiment of the present invention.

Figure 6 is a top plan view showing a printed circuit board structure having a heat dissipation function according to another embodiment of the present invention.

Figure 7 is a top plan view showing another embodiment in accordance with the present invention. A printed circuit board structure with heat dissipation function.

Fig. 8 is a schematic cross-sectional view showing the case of the printed circuit board structure having the heat dissipation function in Fig. 7 along the line segment 8-8.

Fig. 9 is a schematic side view showing the structure of a printed circuit board having a heat dissipation function as shown in Fig. 7.

Certain terms are used throughout the description and following claims to refer to particular elements. It should be understood by those of ordinary skill in the art that manufacturers may refer to the same elements by different nouns. The scope of this specification and the subsequent patent application do not use the difference of the names as the means for distinguishing the elements, but the differences in the functions of the elements as the basis for the distinction. The term "including" as used throughout the specification and subsequent claims is an open term and should be interpreted as "including but not limited to". In addition, the term "coupled" is used herein to include any direct and indirect electrical connection. Therefore, if a first device is electrically connected to a second device, it means that the first device can be directly connected to the second device or indirectly connected to the second device through other devices or connection means.

Referring to Figures 1-3, there is shown a printed circuit board structure 100 having a heat dissipation function in accordance with an embodiment of the present invention, which eliminates the use of heat sinks on an electronic device package. 1 shows a top view of a printed circuit board structure 100, and FIG. 2 shows a cross-sectional view of the printed circuit board structure 100 along line 2-2 in FIG. 1, and FIG. 3 shows a first view. A schematic view of one of the printed circuit board structures 100 is shown.

Please refer to Figure 1 for a partial illustration of the package for electronic devices (not A printed circuit board structure 100 having a heat dissipation function is shown. An area 150 for accommodating an electronic device package is defined on the printed circuit board structure 100, and the electronic device package is one of specific functions formed by being packaged in a non-BGA form. The semiconductor wafer is, for example, a small outline package (SOP), a quad flat package (QFP), or a quad flat no-lead package (QFN package). In addition, the printed circuit board structure 100 includes a landing pad 110, a plurality of conductive traces 120, and two ground traces 130 and 140.

As shown in FIG. 1, the pad 110 is generally located at the center of the region 150 and has a generally rectangular shape, and the wires 120 are aligned in parallel and disposed at opposite sides of the pad 110. The wires 120 are separated from each other by a solder mask layer 104, wherein each of the wires 120 is wire bonded to one of the electronic device packages (not shown) that is subsequently mounted over the region 150. . The arrangement of the wires 120 is not limited to the case shown in FIG. 1 , and the wires 120 may be formed on two or more sides of the pad 150 based on the design of the pin form of the electronic device package (not shown). side. The two grounding wires 130 and 140 are formed at two lower corners of the bonding pad 110 to be physically connected to one of the two lower corners of the bonding pad 150, respectively. In an embodiment, the pad 110 may comprise a copper foil material.

In one embodiment, the ground lines 130 and 140 are coupled to a ground plane formed on the printed circuit board structure 100 or a grounded component (all not shown). The ground line may comprise a copper foil and may have a line width W1 that is greater than the line width W2 of the wire 120. In one embodiment, the line width W1 of the ground line 130 is about 16-20 mils, and the line width W2 of the wire 120 is about 6-8 mils.

Continuing to refer to FIG. 1, a plurality of through holes 160, 170, 180 having a circular top view through the printed circuit board structure 100 are formed over a plurality of locations of the pads 110. As shown in FIG. 1, the through hole 160 is formed at the center of the pad 110, and the through holes 170 and 180 are formed at positions close to one of the plurality of lower corners of the pad 110, respectively. The through hole 160 has a diameter D1 which is larger than the diameter D2 of the through holes 170 and 180. In one embodiment, the through hole 160 has a diameter D1 of about 1.8 to 2.0 mm, and the through holes 170 and 180 have a diameter of about 0.8 to 1.2 mm. In the printed circuit board structure 100 shown in FIG. 1, after mounting an electronic device package (not shown) on the area 150, the through holes 160, 170 and 180 and the ground lines 130 and 140 can be used as The heat dissipating component is used to dissipate the thermal energy generated by the semiconductor wafer in the electronic device package (not shown) during operation, so that it is no longer necessary to mount a conventional heat sink on the electronic device package.

Referring to Fig. 2, there is shown a cross-sectional view of the printed circuit board structure 100 having the heat dissipation function in Fig. 1 along line 2-2. The printed circuit board structure 100 includes a package substrate 102 formed of an insulating material including a glass fiber, an epoxy, an FR-4 material. Solder pad 110 and solder resist layer 104 are defined and formed on one of top surfaces A of package substrate 102 to mount an electronic device package (not shown). In addition, a conductive layer 190 is formed on the bottom surface B of the top surface A of the package substrate 102. A conductive layer 195 is formed over the sidewalls of the package substrate 102, the pad 110, and the conductive layer 190 exposed by the via holes 160, 170, and 180 to further bond the pad 110 and the conductive layer 190. In an embodiment, the conductive layer 195 may comprise a conductive material such as copper. The electronic device mounted on the bonding pad 110 due to the bonding of the bonding pad 110 to the grounding lines 130 and 140 and the conductive layer 190 The thermal energy generated by the package (not shown) during its operation can be largely dissipated by the heat conduction means by the ground lines 130 and 140 and the conductive layer 190. In addition, due to the formation of the through holes 160, 170 and 180 (see Figures 1 and 3), the thermal energy generated by the semiconductor wafer mounted in the electronic device package (not shown) on the pad 110 during operation thereof may also be It is partially diffused by the thermal diffusion through the through holes 160, 170 and 180 to the bottom surface B of the package substrate 102.

Figure 3 shows a schematic view of the printed circuit board structure 100 as shown in Figures 1-2. As shown in FIG. 3, the conductive layer 190 is formed over the bottom surface B of the package substrate 102 (see FIG. 2). In one embodiment, the conductive layer 190 may not be formed over the bottom surface B of the package substrate 102. Based on the design of the printed circuit board structure 100, the bottom surface B of the package substrate 102 may also be formed with The conductive layer 190 is separated by a plurality of wires (not shown).

It should be noted that in other embodiments, the number of ground lines connected to the pad 110 and their positions may be varied, rather than being limited by the situation shown in FIGS. 1-3.

4 is a top plan view showing a heat-dissipating printed circuit board structure 200 in accordance with another embodiment of the present invention, which eliminates the use of heat sinks on an electronic device package. Printed circuit board structure 200 is obtained by modifying printed circuit board structure 100 as shown in Figures 1-3. Here, similar components are shown with the same reference numerals in FIG. 4, and for the sake of simplicity, only the differences between the two printed circuit board structures 100 and 200 will be explained herein.

Referring to FIG. 4 , the grounding wire 140 is formed at the upper right corner of the bonding pad 110 to be physically connected to the bonding pad 110 , and the through hole 180 is formed adjacent to the upper right corner of the bonding pad 110 . . Installing an electronic device seal on the area 150 After the loading (not shown), the through holes 160, 170, 180 and the grounding wires 130 and 140 can be used as heat dissipating components to dissipate heat generated during operation of the semiconductor wafer in the electronic device package. Therefore, it is no longer necessary to install a conventional heat sink on the electronic device package.

Figure 5 is a top plan view showing a printed circuit board structure 300 having a heat dissipation function in accordance with yet another embodiment of the present invention to eliminate the use of heat sinks on an electronic device package. Printed circuit board structure 300 is obtained by modifying printed circuit board structure 100 as shown in Figures 1-3. Here, similar components are shown with the same reference numerals in FIG. 5, and for the sake of simplicity, only the differences between the printed circuit board structures 100 and 300 will be explained herein.

Referring to FIG. 5 , an additional grounding line 310 is further formed at the upper right corner of the bonding pad 110 , and is physically coupled to the bonding pad 110 . An additional through hole 320 similar to the through holes 130 and 140 penetrating the printed circuit board structure 300 is formed near the upper right corner of the pad 110.

In the printed circuit board structure 300 as shown in FIG. 5, after mounting an electronic device package (not shown) on the area 150, the through holes 160, 170, 180, and 320, and the ground lines 130, 140 And 310 can be used as a heat dissipating component to dissipate the thermal energy generated by the semiconductor wafer in the electronic device package during operation, so that it is no longer necessary to install a conventional heat sink on the electronic device package.

Figure 6 is a top plan view showing a printed circuit board structure 400 having a heat dissipation function in accordance with another embodiment of the present invention, thereby eliminating the use of heat sinks on an electronic device package. The printed circuit board structure 400 is obtained by modifying the printed circuit board 300 as shown in FIG. Here, in Figure 6 Similar components are shown with the same reference numerals, and for the sake of simplicity, only the differences between printed circuit board structures 400 and 300 are illustrated herein.

Referring to FIG. 6 , an additional grounding line 330 is formed at the upper left corner of the bonding pad 110 , and is physically coupled to the upper left corner of the bonding pad 110 . An additional through hole 340 penetrating the printed circuit board structure 600 similar to the through holes 130 and 140 and 320 is also formed near the upper left corner of the pad 110.

In the printed circuit board structure 400 as shown in FIG. 6, after mounting an electronic device package (not shown) on the area 150, the through holes 160, 170, 180, 320 and 340, and the ground line 130, 140, 310 and 330 can be used as heat dissipating components to dissipate the thermal energy generated during operation of the semiconductor wafer in the electronic device package, so that it is no longer necessary to install a conventional heat sink on the electronic device package.

Figure 7 is a schematic top plan view showing a printed circuit board structure 500 having a heat dissipation function in accordance with yet another embodiment of the present invention, thereby eliminating the use of heat sinks on an electronic device package. Printed circuit board structure 500 is obtained by modifying printed circuit board structure 100 as shown in Figures 1-3. Here, similar components are shown with the same reference numerals in FIG. 7, and for the sake of simplicity, only the differences between the printed circuit board structures 100 and 500 will be explained herein.

Referring to FIG. 7, one of the plurality of wires 120 (labeled 120') adjacent to the central portion of the left side of the pad 110 may extend toward the pad 110 and be physically coupled to the pad 110. Similar to the via holes 160 and 170, a uniform hole 175 penetrating the pad 110 may be formed adjacent to the wire 120' attached to the pad 110, having a diameter D3 of between 0.8 and 1.2 mm. Here, the wire 120' is made to be similar to one of the ground lines 130 and 140. An electronic device package is mounted on the area 150 (not shown) After the display, the through holes 160, 170, 175, and 180, and the ground lines 120', 130, and 140 can be used as a heat dissipating component to dissipate the semiconductor wafer in the electronic device package during operation. The heat generated, so that it is no longer necessary to install a conventional heat sink on the electronic device package.

Referring to Fig. 8, there is shown a cross-sectional view of a printed circuit board structure 500 having a heat dissipation function along line 8-8 in Fig. 7. The printed circuit board structure 500 includes a package substrate 102, and a pad 110 and a solder resist layer 104 defined and formed on the top surface A of the package substrate 102 for mounting an electronic device package (not shown). In addition, a conductive layer 190 is formed over the bottom surface B of the top surface A of the package substrate 102. A conductive layer 195 is formed over the sidewalls of the package substrate 102, the pad 110 and the conductive layer 190 exposed by the via holes 160 and 175 to further bond the pad 110 and the conductive layer 190. Due to the bonding of the bonding pad 110 to the grounding wire 120' and the conductive layer 190, an electronic device package (not shown) mounted on a specific position on the bonding pad 110 (such as at the left intermediate position of the bonding pad 110) is The thermal energy generated during operation can be largely dissipated by the grounding wire 120' and the conductive layer 190 through thermal conduction, thereby locally reducing the thermal energy at a specific position of one of the electronic device packages (not shown). . In addition, due to the formation of the vias 160, 170, 175 and 180 (see Figures 7 and 9), the thermal energy generated by the semiconductor wafer mounted in the electronic device package (not shown) on the pad 110 during operation thereof It can also be partially dissipated by the thermal diffusion method through the through holes 160, 170, 175 and 180 to the bottom surface B of the package substrate 102.

Fig. 9 is a schematic side view showing a bottom surface B of a printed circuit board structure 500 having a heat dissipation function in Fig. 7 (refer to Fig. 8). As shown in FIG. 9, it is said to be on the bottom surface B of the top surface A of the package substrate 102. A conductive layer 190 is formed on the ground. In one embodiment, the conductive layer 190 may not be formed over the bottom surface B of the package substrate 102. Based on the design of the printed circuit board structure 100, the bottom surface B of the package substrate 102 may also be formed with The conductive layer 190 is separated by a plurality of wires (not shown).

It should be noted that in other embodiments, the number of grounding wires 120' connected to the bonding pads 110 and their positions may be varied by different embodiments, thereby being locally lowered in an electronic device package (not shown). The heat energy generated at a particular location is not limited to the situation shown in Figures 7-9.

While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the invention may be modified and retouched without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application attached.

100‧‧‧Printed circuit board structure

102‧‧‧Package substrate

104‧‧‧solder layer

110‧‧‧ solder pads

120‧‧‧ wire

130‧‧‧ Grounding wire

140‧‧‧Grounding wire

150‧‧‧Area

160‧‧‧through holes

170‧‧‧through holes

180‧‧‧through holes

W1‧‧‧ line width

W2‧‧‧ line width

D1‧‧‧ diameter

D2‧‧‧ diameter

Claims (19)

A printed circuit board structure having a heat dissipation function, comprising: a package substrate; a solder pad formed on one of the first surfaces of the package substrate, wherein the pad has a rectangular shape and has a plurality of corners a plurality of grounding wires are formed on the plurality of portions of the package substrate, and are respectively physically connected to at least two corners of the corners of the bonding pad; a first through hole from a center of the bonding pad Passing through the pad and the package substrate; and a plurality of second through holes substantially penetrating the pad and the package substrate from one of the corners adjacent to the pad, wherein the second through holes are Adjacent to one of the ground lines. The printed circuit board structure with heat dissipation function according to claim 1 further includes a plurality of wires formed on one side of the solder pad from the package substrate. The heat-dissipating printed circuit board structure of claim 2, wherein the wires have a line width of about 6-8 mils. The heat-dissipating printed circuit board structure of claim 2, further comprising: another grounding wire formed on the package substrate from the side of the soldering pad and located between the wires And a third through hole penetrating the pad and the package substrate from a portion of the pad adjacent to the other ground line. Printed circuit board junction with heat dissipation function as described in claim 4 The grounding wire body formed between the wires is connected to the bonding pad. The printed circuit board structure with heat dissipation function according to claim 1, wherein two grounding wires are formed on two different portions of the package substrate, and the grounding wires are respectively adjacent to the two adjacent pads. The corner is physically connected to the pad. The printed circuit board structure with heat dissipation function according to claim 1, wherein two grounding wires are formed on two different portions of the package substrate, and the grounding wires are respectively from opposite corners of the bonding pad. The entity is attached to the pad. The printed circuit board structure with heat dissipation function according to claim 1, wherein three grounding wires are formed on a plurality of different portions of the package substrate, and the grounding wires are respectively from three adjacent corners of the bonding pad. The entity is attached to the pad. The printed circuit board structure with heat dissipation function according to claim 1, wherein four grounding wires are formed on a plurality of different portions of the package substrate, and the grounding wires are from four corners of the bonding pad. The entity is attached to the pad. The printed circuit board structure having a heat dissipation function according to claim 1, further comprising a conductive layer formed on one of the second surfaces of the substrate, wherein the second surface is opposite to the first a surface, and the conductive layer is adjacent to one of the second through holes. The printed circuit board structure having the heat dissipation function according to claim 10, further comprising another conductive layer, the solder pad formed on the first through hole and the second through holes, the package substrate And a plurality of sidewalls of the conductive layer. The heat-dissipating printed circuit board structure according to claim 1, wherein the package substrate comprises a glass fiber, an epoxy resin or an FR-4 material. The printed circuit board structure having a heat dissipation function according to claim 1, wherein the bonding pad and the grounding wire comprise a copper foil. The heat-dissipating printed circuit board structure of claim 1, wherein the first through hole has a diameter of about 1.8-2.0 mm. The heat-dissipating printed circuit board structure of claim 1, wherein the second through holes have a diameter of about 0.8-1.2 mm. The heat-dissipating printed circuit board structure of claim 1, wherein the ground lines have a line width of about 16-20 mils. The printed circuit board structure having a heat dissipation function according to claim 1, wherein an area for mounting an electronic device package is defined on the package substrate, and the area includes the pad, the first Consistent holes, the second through holes, and a portion of the ground lines. The heat-dissipating printed circuit board structure of claim 17, wherein the electronic device package is an encapsulation of an aspherical grid array. The printed circuit board structure having a heat dissipation function according to claim 18, wherein the electronic device package is a miniaturized package, a quad flat package or a quad flat no-lead package.