TWM593131U - Heat dissipation structure of bare crystal (die) - Google Patents

Abstract

A bare crystal heat dissipation structure includes a heat dissipation unit and a die, the heat dissipation unit has a first side and a second side, a contact portion is protrudingly formed on the second side, and one end of the contact portion is a A slightly convex curved surface, the bare crystal has an upper surface and a lower surface, one end of the contact portion is in contact with the upper surface, and the upper surface is in a slightly concave curved surface shape to contact the contact portion Match the appearance of slightly convex surfaces.

Description

Heat dissipation structure of die

This creation is about a heat dissipation structure of a die, especially a heat dissipation structure of a die that can greatly reduce the thermal resistance problem and effectively improve the heat dissipation performance.

The semiconductor integrated circuit industry has experienced rapid growth, and the technological advances in semiconductor integrated circuit materials and design have produced multiple generations of semiconductor integrated circuits, each of which has a smaller size than the previous generation of semiconductor integrated circuits. More complex circuits, however, these advances have also increased the complexity of processing and manufacturing semiconductor integrated circuits. The traditional wafer system includes a die and a package case. Usually, the die and the package case are combined by indium welding or other bonding methods. However, this structural design will cause the interface heat between the die and the package case The resistance is very large. Therefore, in recent years, as the power has increased and the heat flux density has become larger, in order to effectively improve the heat dissipation efficiency of the chip, the chip factory has eliminated the package shell components covering the chip in the design, and wants to reduce the package shell material The thermal conductivity of the body and the thermal resistance of the interface material have become the design mode of the structure of the die, thermal paste and heat sink. However, due to the flatness of the bare silicon material of this design, the weight of the heat sink, and the fastening force The requirements are relatively high. When the die is operated at high temperature, it will deform, causing the surface of the die to exhibit a slightly concave curved shape, resulting in a gap when contacting with the heat sink and still having thermal resistance problems, making the die The heat cannot be quickly taken away by the radiator, resulting in very limited improvement in heat dissipation efficiency. As mentioned above, conventional knowledge has the following disadvantages: 1. Serious thermal resistance problem; 2. Poor cooling efficiency. Therefore, how to solve the above-mentioned problems and deficiencies in practice is the one where the creators of this case and the relevant manufacturers engaged in this industry are desperate to study the direction of improvement.

Therefore, in order to effectively solve the above problems, the main purpose of this creation is to provide a heat dissipation structure of bare crystals that greatly reduces the problem of thermal resistance. The secondary purpose of this creation is to provide a heat dissipation structure with bare die that greatly improves the heat dissipation efficiency. In order to achieve the above purpose, the present invention provides a heat dissipation structure of a die, which includes a heat dissipation unit and a die, the heat dissipation unit has a first side and a second side, and a contact is protruded on the second side Part (that is, the contact part 210 is formed on the surface of the second side 21 of the heat dissipation unit), one end of the contact part is in the form of a slightly convex curved surface, the die has an upper surface and a lower surface, the contact part One end is in contact with and attached to the upper surface, and the upper surface is in a slightly concave curved surface shape to match the slightly convex curved surface shape of the contact portion. Through the design of this structure, heat will be generated when the die starts to work, so that the upper surface of the die will be deformed under a high temperature state and present a slightly concave curved surface shape, through the contact portion of the heat dissipation unit The structure at one end is a slightly convex curved surface, so that the upper surface of the die can be fully contacted with the contact part, effectively reducing the thermal resistance problem, and then the heat on the die can be quickly dissipated by the heat The unit is removed, greatly improving the heat dissipation efficiency.

The above-mentioned object of this creation and its structural and functional characteristics will be explained based on the preferred embodiments of the attached drawings. Please refer to Figures 1 and 2 for an exploded view and an enlarged schematic diagram of the heat dissipation structure of the bare crystal for the creation. As shown in the figure, a heat dissipation structure of the bare crystal includes a heat dissipation unit 2 and a bare crystal 3. The heat dissipation unit 2 is a heat sink, a heat dissipation base, a temperature equalizing plate and other components with heat dissipation, and has a first side 20 and a second side 21 on which a plurality of heat dissipation fins 200 are formed , A contact portion 210 is protrudingly formed on the second side 21 (ie, the contact portion 210 is formed on the surface of the protrusion of the second side 21 of the heat dissipation unit), and one end of the contact portion 210 is in the form of a slightly convex curved surface. In this embodiment, the contact part 210 and the heat dissipation unit 2 are described as integrally formed, but it is not limited to this, and the user may also make the contact part 210 and the heat dissipation unit 2 non-integrally formed according to usage requirements , And the contact part 210 and the heat dissipation unit 2 are made of silver, copper, aluminum, iron or other high thermal conductivity materials. The contact part 210 and the heat dissipation unit 2 may be made of the same material or different materials. Bright. The die 3 has an upper surface 30 and a lower surface 31, one end of the contact portion 210 is in contact with the upper surface 30, and the upper surface 30 is in a slightly concave curved surface to be in contact with the surface The micro-convex surface of the portion 210 matches, and the lower surface 31 is correspondingly mounted on a substrate 4. Please refer to FIG. 2 again. A micro gap (not shown in the figure) is further formed between the contact surface of the heat dissipation unit 2 and the die 3 of this creation. The micro gap corresponds to a thermally conductive coating 32 coated thereon. The layer 32 is a thermal grease, a thermal paste, and a thermal pad, and the thermally conductive coating 32 is used to more closely fill the micro gap to avoid the formation of the aforementioned micro gap to cause thermal resistance. Therefore, through the design of this structure, when the die 3 starts to work, heat will be generated to gradually increase the temperature of the die 3, and due to the material and manufacturing process of the die 3, the die 3 The deformation occurs at a high temperature, that is, the deformation at the center of the upper surface 30 of the die 3 gradually sags down to assume a slightly concave curved surface. At this time, the structure through the end of the contact portion 210 of the heat dissipation unit 2 is A slightly convex curved surface shape, and the shape of the slightly convex curved surface shape and the slightly concave curved surface shape are completely matched, so that the contact portion 210 and the upper surface 30 of the die 3 are completely in contact with and attached, so , Can improve the gap between the contact surface of the conventional heat dissipation unit and the upper surface of the deformed die when contacting and bonding, resulting in thermal resistance problems. This creation effectively improves the thermal resistance problem of the conventional structure, and The heat reaching the die 3 can be quickly taken away by the heat dissipation unit 2 to greatly improve the heat dissipation efficiency. It should be noted that since the deformation (micro concave surface shape) generated on the upper surface 30 of the die 3 is very small, the deformation variable is usually in the order of microns ( ㎛ ) as a unit, so the bending curvature of the deformation is between 50 ㎛ ～70 ㎛ , and the drawings shown in this creation are explained by magnification, so that the structural design of this creation can be more clearly understood, and the curved curvature of the slightly convex surface of the contact portion 210 of the heat dissipation unit 2 is also quite In addition, because of the bending curvature of the order of micrometer ( ㎛ ), the second side 21 of the heat dissipation unit 2 usually chooses to use a grinding process to make the contact portion 210 assume a slightly convex curved surface, however, the slightly convex The manufacturing method of the curved surface is not limited to grinding, but can also use CNC processing, planing processing or other processing methods, which will be described first. As mentioned above, this creation has the following advantages over conventional ones: 1. Significantly reduces thermal resistance issues; 2. Significantly improves heat dissipation performance. The above has made a detailed description of this creation, but the above is only one of the preferred embodiments of this creation, but the scope of the implementation of this creation cannot be limited, that is, any equal changes and modifications made according to the scope of this creative application Etc., should still fall within the scope of the patent of this creation.

2: cooling unit 20: First side 200: cooling fins 21: Second side 210: contact 3: die 30: upper surface 31: Lower surface 32: Thermally conductive coating 4: substrate

Figure 1 is an exploded view of the heat dissipation structure of the bare crystal creation; Figure 2 is an enlarged schematic diagram of the heat dissipation structure of the bare die.

2: cooling unit

20: First side

200: cooling fins

21: Second side

210: contact

3: die

30: upper surface

31: Lower surface

4: substrate

Claims (7)

A bare crystal heat dissipation structure includes: A heat dissipation unit having a first side and a second side, a contact portion is protrudingly formed on the second side, and one end of the contact portion is a slightly convex curved surface; and A die has an upper surface and a lower surface. One end of the contact portion is in contact with the upper surface, and the upper surface is a slightly concave curved surface to match the slightly convex curved surface of the contact portion. The heat dissipation structure of the bare crystal according to claim 1, wherein a micro gap is further formed between the heat dissipation unit and the bare crystal, and the micro gap is coated with a thermal conductive coating. The heat dissipation structure of the bare crystal according to claim 1, wherein the contact portion and the heat dissipation unit are formed integrally or non-integrally. The heat dissipation structure of the bare crystal according to claim 1, wherein the curved curvature of the micro convex surface and the micro concave surface is between 0.05 mm and 0.07 mm. The heat dissipation structure of the bare crystal according to claim 1, wherein the heat dissipation unit is further formed with a plurality of heat dissipation fins, and the heat dissipation fins are arranged on the first side at intervals. The heat dissipation structure of the die according to claim 1, wherein the lower surface of the die is correspondingly mounted on a substrate. The heat dissipation structure of the bare crystal according to claim 1, wherein the contact portion of the heat dissipation unit is made to have a slightly convex curved surface by grinding.

Images