TWM590499U - Laser device for cleaning probe card - Google Patents
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- TWM590499U TWM590499U TW108216180U TW108216180U TWM590499U TW M590499 U TWM590499 U TW M590499U TW 108216180 U TW108216180 U TW 108216180U TW 108216180 U TW108216180 U TW 108216180U TW M590499 U TWM590499 U TW M590499U
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Abstract
一種用於清潔探針卡的雷射裝置,包括治具、運動平台、清潔雷射頭、自動光學檢測鏡頭及控制台。治具供可移除的固持一探針卡。清潔雷射頭與自動光學檢測鏡頭設置於運動平台上。自動光學檢測鏡頭用於取得探針卡的一探針區的三維表面形貌影像。控制台電連接運動平台、清潔雷射頭及自動光學檢測鏡頭,以根據三維表面形貌影像選定待清潔探針,並控制清潔雷射頭對於待清潔探針輸出一清潔雷射光。A laser device for cleaning a probe card includes a jig, a sports platform, a cleaning laser head, an automatic optical detection lens and a console. The fixture provides a probe card that can be held in a removable manner. The cleaning laser head and automatic optical detection lens are set on the motion platform. The automatic optical inspection lens is used to obtain a three-dimensional surface topography image of a probe area of the probe card. The console is electrically connected to the motion platform, the cleaning laser head and the automatic optical detection lens to select the probe to be cleaned according to the three-dimensional surface topography image, and controls the cleaning laser head to output a clean laser light to the probe to be cleaned.
Description
本新型是有關於一種雷射控制技術,尤指一種用於清潔探針卡的雷射裝置。The present invention relates to a laser control technology, especially a laser device for cleaning probe cards.
探針卡(probe card)是應用在積體電路(IC)尚未封裝前,對裸晶以探針(probe)做功能測試,藉以篩選掉不良品,再進行之後的封裝工程。然而,探針卡在大量使用次數之後,在探針接觸部位會積累髒污,導致接觸不良的現象。The probe card is used before the integrated circuit (IC) has been packaged. The probe is used to test the function of the probe, so as to filter out the defective products and then carry out the subsequent packaging project. However, after a large number of probe cards are used, dirt will accumulate in the probe contact area, resulting in poor contact.
有鑑於此,本新型實施例提出一種用於清潔探針卡的雷射裝置,能夠確實檢測探針的髒污積累情形,對需要清潔的探針精準、有效率的執行清潔。In view of this, the embodiment of the present invention provides a laser device for cleaning a probe card, which can accurately detect the accumulation of dirt on the probe and accurately and efficiently perform cleaning on the probe that needs to be cleaned.
用於清潔探針卡的雷射裝置,包括治具、運動平台、清潔雷射頭、自動光學檢測鏡頭及控制台。治具供可移除的固持一探針卡。清潔雷射頭與自動光學檢測鏡頭設置於運動平台上。自動光學檢測鏡頭用於取得探針卡的一探針區的三維表面形貌影像。控制台電連接運動平台、清潔雷射頭及自動光學檢測鏡頭,以根據三維表面形貌影像選定待清潔探針,並控制清潔雷射頭對於待清潔探針輸出一清潔雷射光。Laser device for cleaning probe card, including jig, motion platform, cleaning laser head, automatic optical detection lens and console. The fixture provides a probe card that can be held in a removable manner. The cleaning laser head and automatic optical detection lens are set on the motion platform. The automatic optical inspection lens is used to obtain a three-dimensional surface topography image of a probe area of the probe card. The console is electrically connected to the motion platform, the cleaning laser head and the automatic optical detection lens to select the probe to be cleaned according to the three-dimensional surface topography image, and controls the cleaning laser head to output a clean laser light to the probe to be cleaned.
綜上所述,根據本新型的實施例,可精準量測探針的位置及高度,並可確實判斷探針是否需要清潔,而可精確的將探針的髒污去除,同時避免傷害探針與探針卡座體。In summary, according to the embodiment of the present invention, the position and height of the probe can be accurately measured, and whether the probe needs to be cleaned can be accurately determined, and the dirt of the probe can be accurately removed while avoiding damage to the probe With probe card body.
參照圖1A及圖1B,圖1A為本新型一實施例之探針卡100之俯視圖,圖1B為圖1A中區域1B的放大圖。探針卡100具有供積體電路電性連接的探針區110,探針區110包括複數探針111。在此,為了清楚呈現圖式,刻意將探針111放大,而未依比例關係繪製。1A and 1B, FIG. 1A is a top view of a
分別參照圖2及圖3,圖2為本新型一實施例之用於清潔探針卡100的雷射裝置之立體圖,圖3為本新型一實施例之用於清潔探針卡100的雷射裝置之側視圖。雷射裝置包括治具210、運動平台220、清潔雷射頭230、自動光學檢測(Automated Optical Inspection)鏡頭240、及控制台250。控制台250電連接運動平台220、清潔雷射頭230及自動光學檢測鏡頭240,以對此些裝置進行控制。2 and 3, respectively, FIG. 2 is a perspective view of a laser device for cleaning the
治具210供可移除的固持探針卡100。在一些實施例中,雷射裝置還包括具有窗口212的防護殼體211,與治具210相連接。窗口212位於靠近清潔雷射頭230的一側,以於探針卡100裝載於治具210時可通過窗口212露出探針111,其餘被防護殼體211遮蔽的區域可受防護殼體211保護以避免受到雷射破壞。也就是說,雷射光可通過窗口212並受防護殼體211的阻隔。治具210可透過夾持、吸附、鎖固等方式可移除的固定探針卡100。The
如圖4所示,係為本新型另一實施例之治具210連接探針卡100之示意圖。在此,為了清楚呈現圖式,刻意將探針111放大,而未依比例關係繪製。在一些實施例中,治具210還經由轉接座300連接至探針卡100,也就是說,轉接座300可與探針卡100匹配結合,以經由轉接座300固定探針卡100於治具210上。探針卡100上具有一個或多個定位孔120,適配於轉接座300上,例如透過緊配、拴鎖等方式。在此,定位孔120可以是通孔或盲孔。轉接座300包括固定部320,如凸部、定位柱等方式,以與治具210連接。也就是說,探針卡100可與轉接座300相結合,治具210與轉接座300連接。如此,可使得治具210可適用於不同形狀、尺寸的探針卡100。As shown in FIG. 4, it is a schematic diagram of a
運動平台220為三維運動平台,具有三軸移動方向,可相對於治具210沿三維方向移動。清潔雷射頭230和自動光學檢測鏡頭240均設置於運動平台220上,使得清潔雷射頭230和自動光學檢測鏡頭240可因運動平台220而移動,據以改變作用位置。例如,沿平行於探針卡100表面的方向二維移動,或者沿垂直於探針卡100表面(即沿探針111長軸方向)一維移動。在此,治具210是位於運動平台220上方,使得清潔產生的粉塵、灰塵等受重力落下而不會殘留在探針111上。The
清潔雷射頭230可輸出雷射光(後稱「清潔雷射光」)。清潔雷射光經控制其能量、頻率、聚焦範圍等參數而能去除探針卡100上的待清潔探針上的髒污,同時避免傷害待清潔探針或探針卡100。The
自動光學檢測鏡頭240可取得探針區110的三維表面形貌影像。控制台250能根據三維表面形貌影像選定探針區110上的待清潔探針。控制台250執行有自動光學檢測系統之軟體,能高速對三維表面形貌影像進行影像處理分析,依據影像上探針111的形貌與正常的探針111的形貌進行比較。若有嚴重髒污,則探針111上會有明顯的髒污凸出形體。藉此,可判定探針111上是否有髒污或髒污程度是否需要進行清潔。若需要清潔,則將該探針111判定為待清潔探針。在選定待清潔探針之後,控制台250可驅動運動平台220移動,使得清潔雷射頭230能對位該待清潔探針,以執行雷射清潔動作。The automatic
在一些實施例中,控制台250能根據待清潔探針的三維表面形貌影像來識別待清潔探針上的髒污位置,以控制清潔雷射頭230針對髒污位置執行雷射清潔動作。也就是說,能精準的依據髒污位置,決定對待清潔探針施以清潔雷射光的位置及次數。例如,若面對待清潔探針的針端右上側及左下侧均具有需要清潔的髒污時,則可控制清潔雷射頭230針對該兩位置分別施以清潔雷射光。In some embodiments, the
在一些實施例中,控制台250可將探針卡100劃分多個區域,對於其中一個區域內的探針111都檢測過髒污後,標記此區域內的所有待清潔探針之後,再根據所標記的待清潔探針的位置驅動運動平台220移動而依次清潔此區域內的待清潔探針。完成清潔後,再對下一個區域檢測、清潔髒污。In some embodiments, the
在一些實施例中,控制台250能根據三維表面形貌影像識別待清潔探針的高度,以控制運動平台220沿待清潔探針的長軸移動清潔雷射頭230,使清潔雷射頭230聚焦於待清潔探針的針端,避免清潔雷射光傷害到探針卡100。在一些實施例中,控制台250不是控制運動平台220移動,而是依據待清潔探針的高度,控制清潔雷射頭230的聚焦範圍,使得清潔雷射頭230聚焦於待清潔探針的針端。In some embodiments, the
在一些實施例中,雷射裝置還包括電連接控制台250的加熱雷射頭260。加熱雷射頭260用於對探針卡100的探針區110加熱,以幫助髒污中的物質產生共晶、共熔,使其容易被清潔雷射光去除。In some embodiments, the laser device further includes a heated
在一些實施例中,可僅對探針區110的特定區域加熱,例如僅對於待清潔探針進行加熱。In some embodiments, only a specific area of the
在一些實施例中,雷射裝置還包括電連接控制台250的熱像儀270。熱像儀270用以於加熱雷射頭260對於探針區110加熱的過程中,拍攝探針區110之熱影像。控制台250根據熱影像識別探針區110表面的溫度,以確認加熱的程度。藉此,可在加熱達到所需溫度時,停止或減弱加熱雷射頭260的輸出,以避免加熱溫度過高而傷害到探針卡100。In some embodiments, the laser device further includes a
在一些實施例中,控制台250載入有對應探針區110的探針分布圖,例如以AutoCAD電腦軟體繪製的電路佈局圖檔。藉此,控制台250可以根據探針分布圖得知探針區110內的每個探針111的位置,而可驅動運動平台220運動,使得自動光學檢測鏡頭240或/及清潔雷射頭230與探針卡100上的探針對位。In some embodiments, the
參照圖5,係為本新型另一實施例之用於清潔探針卡100的雷射裝置之側視圖。與前述實施例的差異在於,雷射裝置的罩覆治具210(即包容探針卡100)的腔室280可充入幫助共晶或抑制氧化的氣體。5 is a side view of a laser device for cleaning the
在一些實施例中,雷射裝置還包括吸塵裝置290,以於清潔雷射光清潔髒污時同時吸取產生的粉屑、灰塵、或煙霧。In some embodiments, the laser device further includes a
參照圖6,係為本新型一實施例之利用雷射清潔探針卡100的方法流程圖。首先,利用治具210,可移除的固持探針卡100(步驟S601)。接著,利用自動光學檢測鏡頭240對探針卡100的探針區110進行三維掃描,以取得三維表面形貌影像(步驟S603)。根據三維表面形貌影像,可獲得探針區110中的探針111的位置及高度,以利後續清潔雷射光能精準打在目標位置上(步驟S605)。根據三維表面形貌影像,可檢測各個探針111的髒污程度,以選定待清潔探針(步驟S607)。於是,可利用清潔雷射頭230對探針卡100上的待清潔探針輸出清潔雷射光,以清潔待清潔探針的髒污(步驟S609)。Referring to FIG. 6, it is a flowchart of a method for cleaning the
參照圖7,係為本新型另一實施例之利用雷射清潔探針卡100的方法流程圖。在一些實施例中,在步驟S609之前,還可利用加熱雷射光對待清潔探針加熱,以幫助後續清潔髒污(步驟S608)。Referring to FIG. 7, it is a flowchart of a method for cleaning the
在一些實施例中,在步驟S608中,還包括於加熱過程中拍攝探針區110之熱影像,以確認加熱的溫度是否滿足需求。In some embodiments, in step S608, it also includes taking a thermal image of the
在一些實施例中,在步驟S609之後,可再次利用自動光學檢測鏡頭240取得三維表面形貌影像,以供控制台250判定該待清潔探針是否完成清潔(步驟S610)。若該待清潔探針已完成清潔,則判斷是否還有其他待清潔探針(步驟S611)。若是,則移動到下一個待清潔探針(步驟S612),並接續步驟S609,繼續對所述下一個待清潔探針清潔;若否,則可卸下探針卡100(步驟S613),而結束流程。在步驟S610中,若判斷該待清潔探針還沒完成清潔(即需要再次清潔髒污),則回到步驟S609繼續清潔。In some embodiments, after step S609, the automatic
綜上所述,根據本新型的實施例所提出的用於清潔探針卡的雷射裝置及利用雷射清潔探針卡的方法,可精準量測探針的位置及高度,並可確實判斷探針是否需要清潔,而可精確的將探針的髒污去除,同時避免傷害探針與探針卡座體。In summary, according to the laser device for cleaning the probe card and the method for cleaning the probe card provided by the embodiments of the present invention, the position and height of the probe can be accurately measured and the judgment can be made accurately Whether the probe needs to be cleaned, and the dirt of the probe can be accurately removed, and at the same time, the probe and the probe holder body are not damaged.
100‧‧‧探針卡
110‧‧‧探針區
111‧‧‧探針
120‧‧‧定位孔
210‧‧‧治具
211‧‧‧防護殼體
212‧‧‧窗口
220‧‧‧運動平台
230‧‧‧清潔雷射頭
240‧‧‧自動光學檢測鏡頭
250‧‧‧控制台
260‧‧‧加熱雷射頭
270‧‧‧熱像儀
280‧‧‧腔室
290‧‧‧吸塵裝置
300‧‧‧轉接座
320‧‧‧固定部
1B‧‧‧區域
S601~S603‧‧‧步驟100‧‧‧
[圖1A]為本新型一實施例之探針卡之俯視圖。
[圖1B]為圖1A中區域1B的放大圖。
[圖2]為本新型一實施例之用於清潔探針卡的雷射裝置之立體圖。
[圖3]為本新型一實施例之用於清潔探針卡的雷射裝置之側視圖。
[圖4]為本新型另一實施例之治具連接探針卡之示意圖。
[圖5]為本新型另一實施例之用於清潔探針卡的雷射裝置之側視圖。
[圖6]為本新型一實施例之利用雷射清潔探針卡的方法流程圖。
[圖7]為本新型另一實施例之利用雷射清潔探針卡的方法流程圖。
[FIG. 1A] A top view of a probe card according to an embodiment of the new model.
[FIG. 1B] is an enlarged view of the
100‧‧‧探針卡 100‧‧‧Probe card
210‧‧‧治具 210‧‧‧ Fixture
211‧‧‧防護殼體 211‧‧‧Protection shell
212‧‧‧窗口 212‧‧‧window
220‧‧‧運動平台 220‧‧‧Sports platform
230‧‧‧清潔雷射頭 230‧‧‧ clean laser head
240‧‧‧自動光學檢測鏡頭 240‧‧‧Automatic optical inspection lens
250‧‧‧控制台 250‧‧‧Console
260‧‧‧加熱雷射頭 260‧‧‧Heating laser head
270‧‧‧熱像儀 270‧‧‧ thermal imager
280‧‧‧腔室 280‧‧‧chamber
Claims (10)
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TW108216180U TWM590499U (en) | 2019-12-04 | 2019-12-04 | Laser device for cleaning probe card |
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TWM590499U true TWM590499U (en) | 2020-02-11 |
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2019
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