TWM589611U - Wafer holder for chemical mechanical polishing - Google Patents
Wafer holder for chemical mechanical polishing Download PDFInfo
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- TWM589611U TWM589611U TW108211520U TW108211520U TWM589611U TW M589611 U TWM589611 U TW M589611U TW 108211520 U TW108211520 U TW 108211520U TW 108211520 U TW108211520 U TW 108211520U TW M589611 U TWM589611 U TW M589611U
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- 238000005498 polishing Methods 0.000 title claims abstract description 27
- 239000000126 substance Substances 0.000 title claims abstract description 25
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract description 128
- 238000000034 method Methods 0.000 abstract description 16
- 238000013467 fragmentation Methods 0.000 abstract description 9
- 238000006062 fragmentation reaction Methods 0.000 abstract description 9
- 239000000969 carrier Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 13
- 238000001179 sorption measurement Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 6
- 238000007664 blowing Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
Abstract
本創作提供一種化學機械研磨用之晶圓固定座,其特徵在於:該晶圓固定座係為扁平片狀之彈性結構體,並具有一承載面及一背面,其中該承載面供以承載一晶圓,且該承載面一側朝該背面方向凹設成形有一通氣流道,該通氣流道之一端與該晶圓固定座側緣相互連接,另一端未與該晶圓固定座側緣相互連接。藉此,本創作之晶圓固定座無須針對不同尺寸晶圓備有不同載具,而可適應於各尺寸晶圓且快速固定並完成移除作業,大幅降低製程成本,減少移除時應力所造成之破片現象與不便性。This creation provides a wafer holder for chemical mechanical polishing, which is characterized in that the wafer holder is a flat sheet-like elastic structure, and has a bearing surface and a back surface, wherein the bearing surface is used to carry a A wafer, and a side of the bearing surface is concavely formed toward the back surface to form a flow channel, one end of the flow channel is connected to the side edge of the wafer holder, and the other end is not connected to the side edge of the wafer holder connection. In this way, the wafer holder of this creation does not need to have different carriers for different sizes of wafers, but can be adapted to wafers of various sizes and quickly fix and complete the removal operation, which greatly reduces the process cost and reduces the stress during removal The resulting fragmentation and inconvenience.
Description
本創作係與化學機械研磨領域相關,尤其是一種可適應於各種晶圓尺寸,並可快速移除晶圓之化學機械研磨用之晶圓固定座。This creation is related to the field of chemical mechanical polishing, especially a wafer holder for chemical mechanical polishing that can be adapted to various wafer sizes and can quickly remove the wafer.
化學機械研磨(Chemical Mechanical Polishing)為現今最為廣泛使用之晶圓平坦化方式。顧名思義地,此製程原理主要係利用研磨的機械原理,搭配研磨用之化學藥劑,進一步將晶圓表面因製程長晶過程所造成之高低輪廓,例如半導體製程中於正面金屬化後之晶背研磨需求,進一步加壓研磨輪至晶圓,使之呈現平坦化並符合終端產品之電性需求。簡單來說,化學機械研磨之目的係為將製作完成之積體電路表面磨平,以方便下一層金屬導線具有較佳之成長良率。Chemical mechanical polishing is the most widely used wafer planarization method today. As the name implies, this process principle mainly uses the mechanical principle of polishing, combined with polishing chemicals, to further reduce the high and low profile of the wafer surface due to the process of crystal growth, such as the back grinding of the semiconductor after the front metallization in the semiconductor process According to the demand, the wheel is further pressed and polished to the wafer to make it flat and meet the electrical requirements of the end product. To put it simply, the purpose of chemical mechanical polishing is to smooth the surface of the completed integrated circuit, so that the next layer of metal wires can have a better growth yield.
傳統來說,化學機械研磨設備大致由設有研磨墊之高速旋轉基台上,搭配一晶圓乘載座將晶圓固定,而使晶圓由上而下地加壓至該研磨墊,並輔以一側之研磨漿料噴嘴將研磨液噴至研磨墊上,反覆旋轉、加壓、噴料,直至預定晶圓厚度。因此,影響化學機械研磨之功效者不外乎上述之各種設備條件。其中任一條件之設定差異,都將可能導致晶圓破片進而影響良率表現。是以,為避免犧牲過多已部分完成金屬化之晶圓因製程參數不佳導致破片,進而衍生有利用將使用過後之晶圓予以再生利用之需求,據此將研磨後之再生晶圓作為測試片之用。Traditionally, chemical mechanical polishing equipment is generally composed of a high-speed rotating base table with a polishing pad, and a wafer carrier to fix the wafer, so that the wafer is pressed to the polishing pad from top to bottom, and auxiliary A slurry slurry nozzle on one side sprays the polishing liquid onto the polishing pad, and rotates, pressurizes, and sprays material repeatedly until the predetermined wafer thickness. Therefore, those who affect the effectiveness of chemical mechanical grinding are nothing more than the various equipment conditions mentioned above. Differences in the setting of any of these conditions may lead to wafer fragmentation and affect yield performance. Therefore, in order to avoid sacrificing too many wafers that have been partially metallized due to poor process parameters, resulting in fragmentation, and there is a need to reuse the used wafers for recycling, according to which the recycled wafers after grinding are tested For film use.
以化學機械研磨用之晶圓固定座而言,習知多以機構夾持方式實現,因此針對不同晶圓大小須備有不同之載具。再者,由於利用夾持之固定方式,係針對晶圓之側緣進行施力,故對於研磨後之晶圓亦常有因內應力表現不均導致破片情況發生。As for the wafer holder for chemical mechanical polishing, it is conventionally implemented by means of mechanical clamping, so different carriers must be prepared for different wafer sizes. In addition, since the clamping method is used to apply force to the side edges of the wafer, the polished wafers often have fragmentation due to uneven internal stress performance.
有鑑於此,為了於晶圓研磨過程中,使晶圓具有較佳之固定效果,避免應力不均而於固定、研磨、或移除時造成破片,以及為因應各式尺寸晶圓需備有多數載具的不便性等缺點,本創作人竭其心智苦心研究,並憑其從事該項產業多年之累積經驗,進而提出一種晶圓用之化學機械研磨機台,以利有效改善習知技術之缺失。In view of this, in order to make the wafers have a better fixing effect during the wafer grinding process, to avoid uneven stress and cause fragments during fixing, grinding, or removal, and in order to meet the needs of various sizes of wafers Due to the inconvenience and other shortcomings of the vehicle, the creator has exhausted his mind and painstakingly studied, and based on his accumulated experience in the industry for many years, he has proposed a chemical mechanical polishing machine for wafers to effectively improve the conventional technology. Missing.
本創作之一目的,旨在提供一種化學機械研磨用之晶圓固定座,藉此無須針對不同尺寸晶圓備有不同載具,而可適應於各尺寸晶圓且快速固定並完成移除作業,大幅降低製程成本,減少移除時應力所造成之破片現象與不便性。One of the purposes of this creation is to provide a wafer holder for chemical mechanical polishing, so that there is no need to prepare different carriers for wafers of different sizes, but can be adapted to wafers of various sizes and can be quickly fixed and removed. , Significantly reduce the cost of the process, reduce the fragmentation and inconvenience caused by the stress during removal.
為達上述目的,本創作揭露一種化學機械研磨用之晶圓固定座,其特徵在於:該晶圓固定座係為扁平片狀之彈性結構體,並具有一承載面及一背面,其中該承載面供以承載一晶圓,且該承載面一側朝該背面方向凹設成形有一通氣流道,該通氣流道之一端與該晶圓固定座側緣相互連接,另一端未與該晶圓固定座側緣相互連接。據此,透過晶圓與晶圓固定座間壓制後,於接觸面形成負壓吸附之固定效果,快速完成固定方式;移除時利用該通氣流道吹氣即可快速將晶圓卸除脫離晶圓固定座。In order to achieve the above purpose, the present invention discloses a wafer holder for chemical mechanical polishing, which is characterized in that the wafer holder is a flat sheet-like elastic structure, and has a bearing surface and a back surface, wherein the bearing The surface is provided to carry a wafer, and one side of the bearing surface is concavely formed toward the back surface to form a flow channel, one end of the flow channel is connected to the side edge of the wafer holder, and the other end is not connected to the wafer The side edges of the fixing seat are connected to each other. According to this, after pressing between the wafer and the wafer holder, a negative pressure adsorption fixing effect is formed on the contact surface, and the fixing method is quickly completed; the air flow channel is used to blow and the wafer can be quickly removed from the crystal during removal Round mount.
較佳者,為加強通氣流道吹氣後,晶圓整體相對該晶圓固定座之卸除效果,其中該通氣流道係成圓型漩渦狀或方型漩渦狀。Preferably, in order to enhance the removal effect of the entire wafer relative to the wafer holder after the airflow channel is blown, the airflow channel is formed into a circular vortex or a square vortex.
較佳者,為加強晶圓固定座與晶圓間之吸附強度,其中該承載面一側更具有複數個微型盲孔,且該等微型盲孔皆未與該通氣流道接觸。Preferably, in order to enhance the adsorption strength between the wafer holder and the wafer, a plurality of micro blind holes are further provided on one side of the carrying surface, and none of the micro blind holes are in contact with the air passage.
較佳者,為提升晶圓移除功效,其中該通氣流道係大致分佈於該承載面之中間區域。Preferably, in order to improve the wafer removal efficiency, the airflow channel is generally distributed in the middle area of the bearing surface.
較佳者,其中該晶圓固定座為矽膠材質。Preferably, the wafer holder is made of silicon rubber.
綜上所述,本創作之化學機械研磨用之晶圓固定座,利用該晶圓固定座之扁平片狀彈性結構體,透過晶圓與晶圓固定座間壓制後,於接觸面形成負壓吸附之固定效果,快速完成固定方式;移除時利用該通氣流道吹氣即可快速將晶圓卸除脫離晶圓固定座,因此無須針對不同尺寸晶圓備有不同載具,而可適應於各尺寸晶圓且快速固定並完成移除作業,大幅降低製程成本,減少移除時應力所造成之破片現象與不便性。In summary, the wafer holder for the chemical mechanical polishing of this creation uses the flat sheet-like elastic structure of the wafer holder to form a negative pressure adsorption on the contact surface after being pressed between the wafer and the wafer holder The fixing effect can quickly complete the fixing method; when removing, the air flow channel can be used to quickly remove the wafer from the wafer holder, so there is no need to prepare different carriers for different sizes of wafers, and it can be adapted to All sizes of wafers are quickly fixed and removed, which greatly reduces the cost of the process and reduces the fragmentation and inconvenience caused by stress during removal.
為使貴審查委員能清楚了解本創作之內容,謹以下列說明搭配圖式,敬請參閱。In order for your review committee to clearly understand the content of this creation, please refer to the following description with the schema, please refer to it.
請參閱第1、2、3及4圖,其係為本創作較佳實施例之晶圓固定座立體示意圖及應用示意圖、另一實施態樣之晶圓固定座立體示意圖以及再一實施態樣之晶圓固定座立體示意圖。本創作係提出一種化學機械研磨用之晶圓固定座1,其特徵在於,該晶圓固定座1係為扁平狀之彈性結構體,並具有一承載面10及一背面11,其中該背面11與該承載面10係呈相對設置,該承載面10供以承載一晶圓2,且該承載面10一側朝該背面11方向凹設成形有一通氣流道101,該通氣流道101之一端係與該晶圓固定座1側緣相互連接,另一端未與該晶圓固定座1相互連接。藉此,為扁平狀彈性結構體之該晶圓固定座1與該晶圓2間壓制後,於該承載面10係會形成負壓吸附狀態,達到防止該晶圓2移動之固定功效,移除時,則朝向該通氣流道101注入氣流即可使該晶圓2快速地與該晶圓固定座1卸除脫離,具備可快速固定放置與移除之優點,而可減少移除時產生的應力所導致的破片問題與不便。並於此結構特徵下,於晶圓之化學研磨製程中,該晶圓固定座1即可適用於各式晶圓尺寸,無須再備有多種符合各尺寸晶圓之對應載具,進而大幅降低製程成本。較佳者,該通氣流道101係成圓型漩渦狀,如圖所示,而可加強吹氣效能,使該晶圓2快速確實地脫離該晶圓固定座1。此外,該晶圓固定座1係可為矽膠材質,以相對該晶圓2形成較佳之吸附效果。Please refer to Figures 1, 2, 3 and 4, which are three-dimensional schematic diagrams and application schematic diagrams of the wafer holder of the preferred embodiment of the creation, another three-dimensional schematic diagram of the wafer holder and another embodiment. 3D schematic view of the wafer holder. This creation proposes a
應用上,將該晶圓2對應置於該承載面10後,該晶圓2與該承載面10即會形成負壓吸附狀態,使該晶圓2固定於該晶圓固定座1上,待該晶圓2被吸附固定於該晶圓固定座1後,即可進行化學機械研磨製程,如第2圖所示。在研磨完畢須將該晶圓2卸除時,僅需朝向該通氣流道101吹氣注入氣體,即可快速地讓該晶圓2自該晶圓固定座1卸除,並可據此減少移除時應力造成之破片現象與不便。其中,為提升該晶圓2與該晶圓固定座1之固定效果,亦可於該晶圓2即該晶圓固定座1之間灑佈不會與該晶圓2及該晶圓固定座1產生化學反應之液體,以透過液體來加強該晶圓2與該晶圓固定座1之吸附效果。In application, after the
續如第3圖所示,進一步地,為加強該晶圓2設置於該晶圓固定座1後的吸附強度,較佳者,該承載面10一側更具有複數個微型盲孔102,且該等微型盲孔102皆未與該通氣流道101接觸。藉此,當該晶圓2放置於該晶圓固定座1後,係可透過該等微型盲孔102結構提升負壓吸附強度,增進該晶圓2與該晶圓固定座1之固定效果,降低研磨過程中該晶圓2產生偏移或破片等情況之機率。其中,該等微型盲孔102係可均勻遍布於該承載面10,或是呈放射狀、矩陣狀排列皆可。此外,亦可使該通氣流道101大致分佈於該承載面10之中間區域,以提升該晶圓2之移除功效。透過大致分佈於中間區域之該通氣流道101結構,在吹氣移除該晶圓2時係可更確實地藉由氣流讓整個該晶圓2與該晶圓固定座1脫離,避免僅有局部區域呈現分離狀態而降低了該晶圓2之移除效率。於應用時,該晶圓2係如第2圖所示般設置於該承載面10處,且當該承載面10進一步設有該等微型盲孔102時,即可更為增進該晶圓2與該晶圓固定座1之固定強度。As shown in FIG. 3, further, in order to enhance the adsorption strength of the
接續參閱第4圖,除了使該通氣流道101為圓形漩渦狀以外,亦可使該通氣流道101成方型漩渦狀,而如第4圖所示。為方型漩渦狀之該通氣流道101,也可相對氣流達到極佳之導引功效,以於朝向該通氣流道101吹氣後,氣流可充滿該通氣流道101而使該晶圓2卸除脫離該晶圓固定座1。當該通氣流道101為方型漩渦狀時,亦可使該承載面10一側更具有該等微型盲孔102,以加強該晶圓2與該晶圓固定座1之負壓吸附固定效果。並且,該通氣流道101亦可大致分佈於該承載面10之中間區域,以提升該晶圓2之卸除效果。於研磨製程時之應用狀態,則請參閱第3圖所示內容。Continuing to refer to FIG. 4, in addition to making the
綜上所述,本創作之化學機械研磨用之晶圓固定座,利用該晶圓固定座之扁平片狀彈性結構體,透過晶圓與晶圓固定座間壓制後,於接觸面形成負壓吸附之固定效果,快速完成固定方式;移除時利用該通氣流道吹氣即可快速將晶圓卸除脫離晶圓固定座,因此無須針對不同尺寸晶圓備有不同載具,而可適應於各尺寸晶圓且快速固定並完成移除作業,大幅降低製程成本,減少移除時應力所造成之破片現象與不便性。In summary, the wafer holder for the chemical mechanical polishing of this creation uses the flat sheet-like elastic structure of the wafer holder to form a negative pressure adsorption on the contact surface after being pressed between the wafer and the wafer holder The fixing effect can quickly complete the fixing method; when removing, the air flow channel can be used to quickly remove the wafer from the wafer holder, so there is no need to prepare different carriers for different sizes of wafers, and it can be adapted to All sizes of wafers are quickly fixed and removed, which greatly reduces the cost of the process and reduces the fragmentation and inconvenience caused by stress during removal.
以上所述者,僅為本創作之較佳實施例而已,並非用以限定本創作之權利範圍;故在不脫離本創作之均等範圍下所做之變化、修飾或替換相同功能之元件,仍皆應涵蓋於本創作之專利範圍內。The above are only the preferred embodiments of this creation, and are not intended to limit the scope of the rights of this creation; therefore, changes, modifications, or replacements of elements with the same function made without departing from the equal scope of this creation All should be covered by the patent scope of this creation.
1‧‧‧晶圓固定座
10‧‧‧承載面
101‧‧‧通氣流道
102‧‧‧微型盲孔
11‧‧‧背面
2‧‧‧晶圓1‧‧‧
第1圖,為本創作較佳實施例之晶圓固定座立體示意圖。 第2圖,為本創作較佳實施例之晶圓固定座應用示意圖。 第3圖,為本創作較佳實施例另一實施態樣之晶圓固定座立體示意圖。 第4圖,為本創作較佳實施例再一實施態樣之晶圓固定座示意圖。 Figure 1 is a three-dimensional schematic view of the wafer holder of the preferred embodiment of the present invention. Fig. 2 is a schematic diagram of the application of the wafer holder according to the preferred embodiment of the present invention. FIG. 3 is a three-dimensional schematic diagram of a wafer holder according to another embodiment of the preferred embodiment of the present invention. FIG. 4 is a schematic diagram of a wafer holder according to another embodiment of the preferred embodiment of the present invention.
1‧‧‧晶圓固定座 1‧‧‧wafer holder
10‧‧‧承載面 10‧‧‧ bearing surface
101‧‧‧通氣流道 101‧‧‧Ventilation channel
11‧‧‧背面 11‧‧‧Back
Claims (7)
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TW108211520U TWM589611U (en) | 2019-08-29 | 2019-08-29 | Wafer holder for chemical mechanical polishing |
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TW108211520U TWM589611U (en) | 2019-08-29 | 2019-08-29 | Wafer holder for chemical mechanical polishing |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113183023A (en) * | 2021-05-14 | 2021-07-30 | 嘉兴星微纳米科技有限公司 | Semiconductor wafer grinding equipment |
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2019
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113183023A (en) * | 2021-05-14 | 2021-07-30 | 嘉兴星微纳米科技有限公司 | Semiconductor wafer grinding equipment |
CN113183023B (en) * | 2021-05-14 | 2022-06-17 | 嘉兴星微纳米科技有限公司 | Semiconductor wafer grinding equipment |
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