TWM589611U - Wafer holder for chemical mechanical polishing - Google Patents

Abstract

This creation provides a wafer holder for chemical mechanical polishing, which is characterized in that the wafer holder is a flat sheet-like elastic structure, and has a bearing surface and a back surface, wherein the bearing surface is used to carry a A wafer, and a side of the bearing surface is concavely formed toward the back surface to form a flow channel, one end of the flow channel is connected to the side edge of the wafer holder, and the other end is not connected to the side edge of the wafer holder connection. In this way, the wafer holder of this creation does not need to have different carriers for different sizes of wafers, but can be adapted to wafers of various sizes and quickly fix and complete the removal operation, which greatly reduces the process cost and reduces the stress during removal The resulting fragmentation and inconvenience.

Description

Wafer holder for chemical mechanical polishing

This creation is related to the field of chemical mechanical polishing, especially a wafer holder for chemical mechanical polishing that can be adapted to various wafer sizes and can quickly remove the wafer.

Chemical mechanical polishing is the most widely used wafer planarization method today. As the name implies, this process principle mainly uses the mechanical principle of polishing, combined with polishing chemicals, to further reduce the high and low profile of the wafer surface due to the process of crystal growth, such as the back grinding of the semiconductor after the front metallization in the semiconductor process According to the demand, the wheel is further pressed and polished to the wafer to make it flat and meet the electrical requirements of the end product. To put it simply, the purpose of chemical mechanical polishing is to smooth the surface of the completed integrated circuit, so that the next layer of metal wires can have a better growth yield.

Traditionally, chemical mechanical polishing equipment is generally composed of a high-speed rotating base table with a polishing pad, and a wafer carrier to fix the wafer, so that the wafer is pressed to the polishing pad from top to bottom, and auxiliary A slurry slurry nozzle on one side sprays the polishing liquid onto the polishing pad, and rotates, pressurizes, and sprays material repeatedly until the predetermined wafer thickness. Therefore, those who affect the effectiveness of chemical mechanical grinding are nothing more than the various equipment conditions mentioned above. Differences in the setting of any of these conditions may lead to wafer fragmentation and affect yield performance. Therefore, in order to avoid sacrificing too many wafers that have been partially metallized due to poor process parameters, resulting in fragmentation, and there is a need to reuse the used wafers for recycling, according to which the recycled wafers after grinding are tested For film use.

As for the wafer holder for chemical mechanical polishing, it is conventionally implemented by means of mechanical clamping, so different carriers must be prepared for different wafer sizes. In addition, since the clamping method is used to apply force to the side edges of the wafer, the polished wafers often have fragmentation due to uneven internal stress performance.

In view of this, in order to make the wafers have a better fixing effect during the wafer grinding process, to avoid uneven stress and cause fragments during fixing, grinding, or removal, and in order to meet the needs of various sizes of wafers Due to the inconvenience and other shortcomings of the vehicle, the creator has exhausted his mind and painstakingly studied, and based on his accumulated experience in the industry for many years, he has proposed a chemical mechanical polishing machine for wafers to effectively improve the conventional technology. Missing.

One of the purposes of this creation is to provide a wafer holder for chemical mechanical polishing, so that there is no need to prepare different carriers for wafers of different sizes, but can be adapted to wafers of various sizes and can be quickly fixed and removed. , Significantly reduce the cost of the process, reduce the fragmentation and inconvenience caused by the stress during removal.

In order to achieve the above purpose, the present invention discloses a wafer holder for chemical mechanical polishing, which is characterized in that the wafer holder is a flat sheet-like elastic structure, and has a bearing surface and a back surface, wherein the bearing The surface is provided to carry a wafer, and one side of the bearing surface is concavely formed toward the back surface to form a flow channel, one end of the flow channel is connected to the side edge of the wafer holder, and the other end is not connected to the wafer The side edges of the fixing seat are connected to each other. According to this, after pressing between the wafer and the wafer holder, a negative pressure adsorption fixing effect is formed on the contact surface, and the fixing method is quickly completed; the air flow channel is used to blow and the wafer can be quickly removed from the crystal during removal Round mount.

Preferably, in order to enhance the removal effect of the entire wafer relative to the wafer holder after the airflow channel is blown, the airflow channel is formed into a circular vortex or a square vortex.

Preferably, in order to enhance the adsorption strength between the wafer holder and the wafer, a plurality of micro blind holes are further provided on one side of the carrying surface, and none of the micro blind holes are in contact with the air passage.

Preferably, in order to improve the wafer removal efficiency, the airflow channel is generally distributed in the middle area of the bearing surface.

Preferably, the wafer holder is made of silicon rubber.

In summary, the wafer holder for the chemical mechanical polishing of this creation uses the flat sheet-like elastic structure of the wafer holder to form a negative pressure adsorption on the contact surface after being pressed between the wafer and the wafer holder The fixing effect can quickly complete the fixing method; when removing, the air flow channel can be used to quickly remove the wafer from the wafer holder, so there is no need to prepare different carriers for different sizes of wafers, and it can be adapted to All sizes of wafers are quickly fixed and removed, which greatly reduces the cost of the process and reduces the fragmentation and inconvenience caused by stress during removal.

In order for your review committee to clearly understand the content of this creation, please refer to the following description with the schema, please refer to it.

Please refer to Figures 1, 2, 3 and 4, which are three-dimensional schematic diagrams and application schematic diagrams of the wafer holder of the preferred embodiment of the creation, another three-dimensional schematic diagram of the wafer holder and another embodiment. 3D schematic view of the wafer holder. This creation proposes a wafer holder 1 for chemical mechanical polishing, which is characterized in that the wafer holder 1 is a flat elastic structure and has a bearing surface 10 and a back surface 11, wherein the back surface 11 The carrier surface 10 is disposed opposite to the carrier surface 10 for supporting a wafer 2, and a side of the carrier surface 10 is concavely formed toward the back surface 11 to form an airflow channel 101, one end of the airflow channel 101 It is connected to the side edge of the wafer holder 1 and the other end is not connected to the wafer holder 1. In this way, after pressing between the wafer holder 1 and the wafer 2 which are flat elastic structures, a negative pressure adsorption state will be formed on the bearing surface 10 to achieve the fixing effect of preventing the wafer 2 from moving. In addition, when the airflow is injected into the airflow channel 101, the wafer 2 can be quickly detached from the wafer holder 1, which has the advantage of being quickly fixed and removed, and can reduce the occurrence of removal The fragmentation problem and inconvenience caused by the stress. And with this structural feature, in the wafer chemical polishing process, the wafer holder 1 can be applied to various wafer sizes, and there is no need to prepare a variety of corresponding carriers that meet wafers of various sizes, thereby greatly reducing Process cost. Preferably, the air flow channel 101 is formed into a circular vortex shape, as shown in the figure, which can enhance the blowing efficiency, so that the wafer 2 can be quickly and surely separated from the wafer holder 1. In addition, the wafer fixing base 1 can be made of silicon rubber to form a better adsorption effect relative to the wafer 2.

In application, after the wafer 2 is correspondingly placed on the carrier surface 10, the wafer 2 and the carrier surface 10 will form a negative pressure adsorption state, so that the wafer 2 is fixed on the wafer holder 1 until After the wafer 2 is adsorbed and fixed on the wafer holder 1, a chemical mechanical polishing process can be performed, as shown in FIG. 2. When the wafer 2 needs to be removed after grinding, it is only necessary to blow and inject gas toward the air flow channel 101 to quickly remove the wafer 2 from the wafer holder 1 and reduce accordingly Fragmentation and inconvenience caused by stress during removal. Among them, in order to improve the fixing effect of the wafer 2 and the wafer fixing seat 1, it is also possible to spread between the wafer 2 and the wafer fixing seat 1 without interfering with the wafer 2 and the wafer fixing seat 1 A liquid that generates a chemical reaction to enhance the adsorption effect of the wafer 2 and the wafer holder 1 through the liquid.

As shown in FIG. 3, further, in order to enhance the adsorption strength of the wafer 2 after being disposed on the wafer holder 1, preferably, the side of the carrying surface 10 further has a plurality of micro blind holes 102, and None of the micro blind holes 102 are in contact with the air passage 101. In this way, after the wafer 2 is placed on the wafer holder 1, the negative pressure adsorption strength can be improved through the micro blind holes 102 structure, and the fixing effect of the wafer 2 and the wafer holder 1 is improved. Reduce the probability of the wafer 2 being misaligned or broken during grinding. Wherein, the micro blind holes 102 may be evenly distributed on the bearing surface 10, or may be arranged in a radial or matrix manner. In addition, the airflow channel 101 may be distributed substantially in the middle region of the carrying surface 10 to improve the removal efficiency of the wafer 2. Through the structure of the air passage 101 substantially distributed in the middle area, when the wafer 2 is removed by blowing, the entire wafer 2 can be more reliably separated from the wafer holder 1 by the air flow, avoiding only The local area is in a separated state, which reduces the removal efficiency of the wafer 2. In application, the wafer 2 is disposed on the carrier surface 10 as shown in FIG. 2, and when the carrier surface 10 is further provided with the micro blind holes 102, the wafer 2 can be further improved The fixed strength with the wafer holder 1.

Continuing to refer to FIG. 4, in addition to making the airflow channel 101 into a circular swirl shape, the airflow channel 101 may also be made into a square swirl shape, as shown in FIG. 4. The airflow channel 101 having a square vortex shape can also achieve an excellent guiding effect relative to the airflow, so that after blowing toward the airflow channel 101, the airflow can fill the airflow channel 101 to make the wafer 2 The wafer holder 1 is detached and detached. When the air flow channel 101 is in the shape of a square vortex, the micro blind holes 102 can be further provided on the side of the bearing surface 10 to enhance the negative pressure adsorption and fixing effect of the wafer 2 and the wafer holder 1 . Moreover, the air flow channel 101 may also be substantially distributed in the middle area of the supporting surface 10 to enhance the removal effect of the wafer 2. For the application status during the grinding process, please refer to the content shown in Figure 3.

In summary, the wafer holder for the chemical mechanical polishing of this creation uses the flat sheet-like elastic structure of the wafer holder to form a negative pressure adsorption on the contact surface after being pressed between the wafer and the wafer holder The fixing effect can quickly complete the fixing method; when removing, the air flow channel can be used to quickly remove the wafer from the wafer holder, so there is no need to prepare different carriers for different sizes of wafers, and it can be adapted to All sizes of wafers are quickly fixed and removed, which greatly reduces the cost of the process and reduces the fragmentation and inconvenience caused by stress during removal.

The above are only the preferred embodiments of this creation, and are not intended to limit the scope of the rights of this creation; therefore, changes, modifications, or replacements of elements with the same function made without departing from the equal scope of this creation All should be covered by the patent scope of this creation.

1‧‧‧wafer holder 10‧‧‧ bearing surface 101‧‧‧Ventilation channel 102‧‧‧mini blind hole 11‧‧‧Back 2‧‧‧ Wafer

Figure 1 is a three-dimensional schematic view of the wafer holder of the preferred embodiment of the present invention. Fig. 2 is a schematic diagram of the application of the wafer holder according to the preferred embodiment of the present invention. FIG. 3 is a three-dimensional schematic diagram of a wafer holder according to another embodiment of the preferred embodiment of the present invention. FIG. 4 is a schematic diagram of a wafer holder according to another embodiment of the preferred embodiment of the present invention.

1‧‧‧wafer holder

10‧‧‧ bearing surface

101‧‧‧Ventilation channel

11‧‧‧Back

Claims (7)

A wafer holder for chemical mechanical polishing, characterized by: The wafer holder is a flat sheet-shaped elastic structure, and has a bearing surface and a back surface, wherein the bearing surface is used to carry a wafer, and a side of the bearing surface is concavely formed toward the back surface to form a pass In the airflow channel, one end of the airflow channel is connected to the side edge of the wafer holder, and the other end is not connected to the side edge of the wafer holder. The wafer holder for chemical mechanical polishing as described in item 1 of the scope of patent application, wherein the air passage is formed into a circular vortex. The wafer holder for chemical mechanical polishing as described in item 2 of the patent application scope, wherein a plurality of micro blind holes are further provided on one side of the bearing surface, and none of the micro blind holes are in contact with the air passage. The wafer holder for chemical mechanical polishing as described in item 1 of the scope of the patent application, wherein the air passage is formed into a square spiral shape. The wafer holder for chemical mechanical polishing as described in item 4 of the patent application scope, wherein a plurality of micro blind holes are further provided on one side of the bearing surface, and none of the micro blind holes is in contact with the air passage. The wafer holder for chemical mechanical polishing according to any one of the items 1 to 5 of the patent application range, wherein the airflow channel is substantially distributed in the middle region of the bearing surface. For example, the wafer holder for chemical mechanical polishing according to item 6 of the patent scope, wherein the wafer holder is made of silicon rubber.

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