TWM587810U - Laminated circuit board with insulating soft magnetic film - Google Patents

Abstract

This creation proposes an insulating soft magnetic film laminated circuit board, which includes: a substrate, an insulating soft magnetic film, and a solder mask, wherein the insulating soft magnetic film is directly covered on a circuit pattern provided on the surface of the substrate and is in contact with the circuit pattern. In contact, the solder resist film covers a side of the insulating soft magnetic film opposite to the substrate. The insulating soft magnetic film is an electrically insulating wave absorbing layer, especially when it is covered on the circuit pattern of the circuit board, it will not cause a short circuit of the circuit, and has a large wave absorbing effect at a high frequency band, so that the wave absorbing layer covered with the wave absorbing layer Insulated soft magnetic film laminated circuit board can effectively eliminate electromagnetic interference in high frequency bands.

Description

Insulated soft magnetic film laminated circuit board

This creation relates to an insulated soft magnetic film laminated circuit board with electromagnetic interference (EMI) prevention.

The main board (usually a circuit board) installed on the currently used host devices often has electronic components such as a central processing unit that are prone to emit high-frequency noise, as well as many other components (such as chips) and circuits that are susceptible to external interference. . In order to prevent the electronic components from interfering with the operation of other components and circuits, and the mutual interference between the electronic components and other components and circuits, electromagnetic interference prevention is required to protect the electronic components and other components and circuits.

The motherboard is usually provided with a large number of circuits to form a circuit pattern. One of the ways to prevent electromagnetic interference is to directly cover the circuit pattern of the motherboard and place it between high-frequency electronic components and other components. One of the currently known methods for setting the shielding layer for electromagnetic interference prevention is to use conductive ink generally composed of conductive particles, resin and solvent, and cover the entire electronic component or wafer to form a conductive layer as an electromagnetic interference shielding layer. . However, in the high frequency band (not less than 1GHz), the electromagnetic waves shielded by the electromagnetic interference shielding layer are not absorbed and eliminated. Therefore, high-frequency electronic components and other components will interfere with each other, which instead forms new electromagnetic interference. . What's more difficult to avoid is that the electromagnetic interference shielding layer formed by conductive ink can easily cover two adjacent circuits around electronic components or wafers at the same time, which causes a short circuit of the circuit and causes the motherboard to be scrapped.

Furthermore, according to the test of the international standard IEC62333, the S21 parameter is the transmission coefficient and the S11 parameter is the reflection coefficient. The test results of the electromagnetic interference shielding layer formed by the conductive ink, although there is a large S21 in the high frequency band (not less than 1.0GHz). Shielding effect, but S11 is approaching zero, which means that not only is the electromagnetic wave not attenuated by the electromagnetic interference shielding layer, but new electromagnetic interference may be formed because it is close to total reflection. Therefore, the motherboard covered with the aforementioned electromagnetic interference shielding layer cannot effectively eliminate the electromagnetic interference suffered in the high frequency band.

In consideration of the above circumstances, the purpose of this creation is to provide an insulated soft magnetic film laminated circuit board with electromagnetic interference prevention.

An insulating soft magnetic film laminated circuit board proposed in this creation includes a substrate, an insulating soft magnetic film, and a solder resist film, wherein the insulating soft magnetic film is directly covered on a circuit pattern provided on the surface of the substrate and is in contact with the circuit pattern. Circuit pattern contact, the solder mask is on the side of the insulating soft magnetic film opposite to the substrate; the insulating soft magnetic film comprises a resin layer and a plurality of insulating soft magnetic particles dispersed in the resin layer; the insulating soft magnetic The particle has a core portion and a shell portion surrounding the core portion. The shape of the insulating soft magnetic particle is spherical and the particle size is between 1 μm and 50 μm. The core portion is an iron-silicon-chrome alloy ball and the shell portion is Phosphate film, silicate film or silicon dioxide film, the insulation resistance value of the shell part is greater than 5x10 ⁹ Ω; the shell part and the resin layer are made of different materials.

The insulated soft magnetic film laminated circuit board, wherein the insulated soft magnetic film laminated circuit board further includes two electronic components, and the insulated soft magnetic film is disposed between the two electronic components.

In the laminated soft magnetic film circuit board, the insulated soft magnetic film is disposed between the two electronic components and does not cover any one of the electronic components, and the insulated soft magnetic film is not in contact with any of the electronic components.

In the foregoing laminated soft magnetic film circuit board, the weight of the shell is 1% to 10% of the weight of the core.

The insulating soft magnetic film laminated circuit board described above, wherein the iron-silicon-chromium alloy ball is 100wt% is measured, and the core includes 85wt% to 95wt% iron, 1wt% to 10wt% silicon, and 1wt% to 5wt% chromium.

The insulating soft magnetic film laminated circuit board described above, wherein a plurality of the insulating soft magnetic particles and the resin layer are measured at 100 wt%, and the insulating soft magnetic film system includes a plurality of the insulating soft magnetic particles of 55.56 to 95.74 wt%; the resin layer Is made of a first resin and a second resin, the material of the shell part, the first resin and the second resin are different from each other; and, a plurality of the insulating soft magnetic particles, the first resin and the The second resin is 100% by weight. The insulating soft magnetic film contains 3.06 to 33.33% by weight of the first resin and 1.01 to 11.11% by weight of the second resin. The first resin is a phenolic epoxy resin. The two resins are polymers of phenol and formaldehyde glycidyl ether.

Because the aforementioned insulating soft magnetic film is an electromagnetic wave absorbing layer for electrical insulation (surface resistance value is not less than 1.0x10 ⁹ ohm / square (Ω / □)), especially when it covers a large area on a circuit pattern of a circuit board , Will not cause a short circuit of the circuit, and has a large attenuation signal in the high frequency band (not less than 1.0GHz), so that the insulating soft magnetic film laminated circuit board covered with the insulating soft magnetic film (wave absorbing layer) can effectively be used in high frequency Eliminate electromagnetic interference. In addition, the insulating soft magnetic film, for electromagnetic waves radiated in a high frequency band (not less than 1GHz), the electromagnetic waves will be absorbed and attenuated by the magnetic material contained in the insulating soft magnetic film, so the display is extremely high Good S21 (transmittance coefficient) shielding effect. When the thickness of the insulating soft magnetic film is 1mm, S21 has a shielding attenuation effect of about 1 ~ 15dB. When the thickness of the insulating soft magnetic film is 2.6mm, S11 (reflection coefficient) appears. The reflection attenuation effect can reach more than 20dB at 2.64GHz. Therefore, the insulated soft magnetic film laminated circuit board of this creation can effectively eliminate the electromagnetic interference in the high frequency band. However, it is known that the electromagnetic interference shielding layer in the high frequency band (not less than 1GHz) shows that the S11 is almost zero, which indicates that it is a total reflection of electromagnetic waves without the effect of absorbing (not absorbing electromagnetic waves). Although the electromagnetic interference shielding layer has a large S21 shielding effect in the high frequency band (not less than 1.0GHz), but because S11 approaches zero, it means that the electromagnetic waves are not attenuated by the electromagnetic interference shielding layer at all, but because they are close to fully reflecting the electromagnetic waves And new electromagnetic interference may be formed. Therefore, the motherboard covered with the aforementioned electromagnetic interference shielding layer cannot effectively eliminate the electromagnetic interference it receives in a high frequency band.

In order to make it easier for reviewers to understand the technical content, characteristics, and effects of this creation, it will be more clearly explained in conjunction with the presentation of the examples and comparative examples, but this creation is not limited by these examples. In addition, the use of "~" in this specification and the scope of patent applications indicates that the numerical range refers to the range that covers the values recorded before and after "~" as the lower and upper limits; "wt%" is used in this specification and the scope of patent applications , Refers to the percentage by weight; the use of "particle size" in this specification and the scope of the patent application refers to the particle size measured by a laser particle size analyzer.

Please refer to FIG. 1 to FIG. 4 at the same time. An insulating soft magnetic film laminated circuit board 3 of this creation includes: a substrate 31, an insulating soft magnetic film 100, and a solder resist film 33. The insulating soft magnetic film 100 is made of an insulating soft magnetic film. Prepared by an ink, the insulating soft magnetic ink comprises: 50wt% to 90wt% of a plurality of insulating soft magnetic particles, 3wt% to 30wt% of a first resin, 1wt% to 10wt% of a second resin, and 1wt% to 10wt% Of a solvent.

Please refer to FIG. 1. The aforementioned soft magnetic particle 1 has a core portion 11 and a shell portion 12 surrounding the core portion. Wherein, the core portion 11 is a soft magnetic core portion composed of a soft magnetic material (ferromagnetic alloy material), and the core portion 11 may be: magnetic stainless steel (Fe-Cr-Al-Si alloy), iron-silicon aluminum alloy (Fe -Si-Al alloy), nickel iron alloy (Fe-Ni alloy), iron silicon copper alloy (Fe-Cu-Si alloy), iron silicon alloy Fe-Si alloy, iron silicon chromium nickel alloy (Fe-Si-Cr-Ni Alloy), iron-silicon-chromium alloy (Fe-Si-Cr alloy), ferrite, etc., and in terms of the magnetic characteristics of this creation, iron-silicon-chromium alloy (Fe-Si-Cr alloy) is preferred. The shell portion 12 is made of an insulating material. The shell portion 12 may be a phosphate film, a silicate film, or a silicon dioxide film. The shell portion 12 is formed by 1% of the weight of the core portion 11 ~ 10% is formed by performing a surface insulation treatment, for example, the shell portion 12 is completed by phosphating the core portion 11 or covering the core portion 11 with sodium silicate. That is, the weight of the shell portion 12 is 1% to 10% of the weight of the core portion. The phosphating treatment uses a phosphoric acid or a phosphate solution to perform a conversion reaction with iron atoms on the surface of the alloy listed in the core 11 to form a phosphate film. In addition, a water glass insulating material formed by a sodium silicate salt may be directly added to the surface of the core portion 11 and dried to remove water to form a silicate film. Furthermore, silane monomers can also be polymerized to form polysiloxane molecules, and then directly coated on the surface of the core portion 11 and dried to remove water to form a silicon dioxide film. In particular, the insulation resistance value of the shell portion 12 is greater than 5 GΩ (5 × ^{10 9} Ω). The aforementioned shape of the insulating soft magnetic particles 1 may be spherical, flat, or fibrous. In the present invention, the shape is preferably spherical, and the particle size is between 1 μm and 50 μm. That is, the core portion 11 may be iron-silicon. Chromium alloy balls; and, based on iron-silicon-chrome alloy as 100 wt%, the core contains 85 wt% to 95 wt% iron, 1 wt% to 10 wt% silicon, and 1 wt% to 5 wt% chromium.

The first resin may be a phenolic epoxy resin or an O-Methyl phenolic epoxy resin. Preferably, the first resin is a phenolic epoxy resin.

The aforementioned second resin may be a polymer of phenol and formaldehyde glycidyl ether (CAS Number: 28064-14-4) (Phenol polymer with formaldehyde glycidyl ether), a bisphenol F-type epoxy resin or a linear aldehyde epoxy resin.

The first resin and the second resin are different, and the material of the shell portion, the first resin, and the second resin are different from each other.

The aforementioned solvent may be ethylene glycol butyl ether acetate, ethylene glycol ether acetate, diethylene glycol butyl ether acetate, diethylene glycol ether acetic acid, or 1,1,3-trimethylcyclohexenone .

In order to improve the dispersibility of the plurality of insulating soft magnetic particles in the insulating soft magnetic ink, the insulating soft magnetic ink system may include a dispersant. The measurement is based on 100 wt% of the plurality of insulating soft magnetic particles, the first resin, the second resin, and the solvent, and the dispersant is 0.001 wt% to 0.01 wt%. The dispersant can be vinyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, p-styryltrimethoxysilane, 3-propenyloxypropyltrimethoxysilane, or 3- Mercaptopropylmethyldimethoxysilane.

In order to reduce the amount of bubbles generated by the insulating soft magnetic ink during the stirring process, the insulating soft magnetic ink system may include a defoamer. Based on 100 wt% of the plurality of insulating soft magnetic particles, the first resin, the second resin, and the solvent, the defoamer is 0.1 wt% to 0.2 wt%. The defoamer may be a silicone-based defoamer or a polymer-based defoamer.

Preparation of the insulated soft magnetic ink of this creation:

The insulated soft magnetic ink of this creation can be manufactured by a method of manufacturing an insulated soft magnetic ink including the following steps: (1) According to a set of a plurality of each of the insulated soft magnetic particles, the first resin, the second resin, and the Prepare the material by weight of the solvent; (2) Mix a plurality of the insulating soft magnetic particles, the first resin, the second resin, and the solvent with a planetary stirrer at room temperature and mix well, and optionally add an appropriate Dispersant and / or defoamer additives to complete the insulating soft magnetic ink.

The preparation of this insulation soft magnetic film:

The soft insulating film is prepared by a method of preparing an insulating soft magnetic film as follows: using a screen printing method or a doctor blade coating method of a stainless steel plate on a host circuit board without a wafer and components and having a circuit pattern, Apply the insulating soft magnetic ink to the circuit pattern of the host circuit board to form a coating of a predetermined size and shape, and then use an oven to dry at a predetermined temperature (for example, 150 ^o C) for a predetermined time (for example, 30 minutes). ) The solvent is volatilized to form a sheet-shaped insulating soft magnetic film, and the thickness of the insulating soft magnetic film is 100 μm to 2.6 mm; preferably, the thickness of the insulating soft magnetic film is 100 μm to 300 μm. Please refer to FIG. 2 together. In particular, the insulating soft magnetic film 100 includes a resin layer 2 and a plurality of the insulating soft magnetic particles 1 dispersed in the resin layer. The resin layer 2 is formed by the first A resin and the second resin are formed, and the material of the shell portion 12, the first resin, and the second resin are different from each other. Please refer to FIG. 3 together. In other words, the insulating soft magnetic film laminated circuit board 3 includes at least: the substrate 31, the circuit pattern 32 provided on the surface of the substrate 31, and directly covering the circuit pattern 32 and connecting with the circuit pattern. 32 contacts the insulating soft magnetic film 100.

Evaluation and test of the effect of this insulating soft magnetic film produced by using this insulating soft magnetic ink:

The insulating soft magnetic film is evaluated by film formation test; the insulating soft magnetic film is measured by surface resistance to evaluate whether the insulating soft magnetic film system is electrically insulated; the insulating soft magnetic film system is attracted by porter The S11 and S21 parameters are measured to evaluate the amount of electromagnetic waves absorbed by the insulating soft magnetic film.

Film formation test:

Visually observe the surface of the insulating soft magnetic film: if cracking is found, it is judged as film-forming failure and marked as "X"; if there is no cracking, but the surface is warped, it is judged as film-forming It is acceptable and marked as "△"; if there is no cracking and warping, and it is flat and adheres well, it is judged that the film forming property is good and marked as "○".

Surface resistance measurement:

A four-point probe measurement was performed on the insulating soft magnetic film to measure the surface resistance value of the insulating soft magnetic film. After measuring a total of five points on the insulating soft magnetic film, the average value was taken as the recorded surface resistance value. When the surface resistance value is not less than 1.0x10 ⁹ ohm / square (Ω / □), it is judged as electrical insulation and marked as "○"; when the surface resistance value is not less than 1.0 ohm / square (Ω / □), it is judged It is non-electrically insulated and marked with "X", which means that it does not meet the electrical insulation conditions of the insulating soft magnetic film.

Measurement of absorption characteristics:

A Keysight E-5071C network analyzer is used to connect two pyramid antennas with a transmission line to perform S21 (or transmission coefficient) and S11 (or reflection coefficient) measurements in the electromagnetic wave band of 2 to 18 GHz. Among them, the S11 parameter is measured by placing two pyramid antennas on the same side of the insulating soft magnetic film, and the measured electromagnetic wave reflection attenuation value is the S11 parameter. The thickness of the insulating soft magnetic film is 2.6mm; The S11 parameters measured in the examples and comparative examples are negative numbers, and the negative numbers indicate that the electromagnetic waves are absorbed. The absolute value of the frequency value (GHz) at which the S11 parameter reaches the maximum value and the S11 parameter value (dB) at this time are described later. Table 1. The S21 parameter is measured by placing two pyramid antennas on opposite sides of the insulating soft magnetic film, and measuring the transmission attenuation value of each frequency of the electromagnetic wave is the S21 parameter. The thickness of the insulating soft magnetic film is 1.0mm; The S21 parameters measured in the examples and comparative examples in Table 1 are negative numbers, and the negative numbers indicate that the electromagnetic waves are absorbed. The maximum and minimum values of the absolute values of the S21 parameters in this frequency band are recorded in Table 1 described below. The S11 parameter is a negative number. The negative number indicates that the electromagnetic wave is absorbed. Therefore, the larger the absolute value of the S11 parameter, the larger the amount of electromagnetic waves absorbed by the insulating soft magnetic film, and the greater the degree of electromagnetic wave reflection attenuation by the insulating soft magnetic film. The more effectively the insulating soft magnetic film absorbs electromagnetic waves and eliminates electromagnetic interference; similarly, the S21 parameter is a negative number, which means that the electromagnetic wave is absorbed. Therefore, the larger the maximum value of the absolute value of the S21 parameter, the larger the electromagnetic wave in this band is. The greater the degree of shielding attenuation of the insulating soft magnetic film, the more effectively the insulating soft magnetic film shields the electromagnetic interference it receives. When the maximum value of the absolute value in the S21 parameter is less than 8dB, the ability of the insulating soft magnetic film to shield electromagnetic waves is judged to be poor and marked as "X"; when the maximum value of the absolute value in the S21 parameter is greater than or equal to 8dB and less than 13.5 In dB, the ability of the insulating soft magnetic film to shield electromagnetic waves is judged to be acceptable and marked as "△"; when the maximum value of the absolute value in the S21 parameter is greater than or equal to 13.5 dB, the ability of the insulating soft magnetic film to shield electromagnetic waves is judged Is good and marked as "○".

Overall evaluation results:

In the same embodiment or comparative example, if "X" appears in any of the film formation test, surface resistance measurement, and absorption characteristic measurement, the overall evaluation result is bad and recorded as "X"; If "△" appears in any of the film-forming test, surface resistance measurement, and absorption characteristic measurement, the overall evaluation result is acceptable and recorded as "△"; film-forming test, surface resistance In both the measurement and the absorption characteristic measurement, if "○" appears, the overall evaluation result is good and recorded as "○".

According to the manufacturing method of the insulated soft magnetic ink created above, the insulated soft magnetic ink having the composition corresponding to each of the embodiments (Example 1 to Example 9) described in Table 1 below is first prepared, and then the Preparation method of insulating soft magnetic film The insulating soft magnetic film is prepared, and then the effects of the insulating soft magnetic film are evaluated and tested, and the results are recorded in Table 1. The core of the insulating soft magnetic particles in Table 1 is a ferrosilicon alloy and the shell is a phosphate film; the first resin is a phenolic epoxy resin; and the second resin is a polymerization of phenol and formaldehyde glycidyl ether. The solvent is ethylene glycol butyl ether acetate. Table 1 additionally describes Comparative Example 1 and Comparative Example 2, Comparative Example 1 and Comparative Example 2 are methods of imitating the manufacturing of the insulating soft magnetic ink, the method of preparing the insulating soft magnetic film, and the evaluation and testing of the effects of the insulating soft magnetic film. Except that Comparative Example 2 replaces the insulating soft magnetic particles of each example with conductive particles, the same points will not be repeated.

Table I
project Composition of insulating soft magnetic ink (wt%) Characteristics of insulating soft magnetic film (Comparative Example 1 and Examples 1 to 9) Characteristics of electromagnetic interference shielding layer (Comparative Example 2) Conductive particles Insulating soft magnetic particles First resin Second resin Solvent Sum up Film forming Surface resistance Ω / □ Absorption characteristics @ 2 ~ 18GHz Overall assessment results S11 Absolute frequency (GHz) Parameter value (dB) S21 absolute minimum (dB) ~ maximum (dB) Example 1 0 50 30 10 10 100 △ ○ greater than 10 ¹⁰ 5.60GHz 8.39dB △ 1.17 ~ 8.23 △ Example 2 0 60 20 10 10 100 △ ○ greater than 10 ¹⁰ 4.30GHz 10.16dB △ 1.41 ~ 9.88 △ Example 3 0 70 10 10 10 100 △ ○ greater than 10 ¹⁰ 3.20GHz 12.56dB △ 1.64 ~ 11.5 △ Example 4 0 80 3 10 7 100 △ ○ greater than 10 ¹⁰ 2.50GHz 16.33dB △ 1.88 ~ 13.1 △ Example 5 0 84 9 4 3 100 △ ○ greater than 10 ¹⁰ 2.75GHz 18.12dB ○ 1.95 ~ 13.7 △ Example 6 0 85 9 3 3 100 ○ ○ 1x10 ¹⁰ 2.64GHz 20.69dB ○ 2.0 ~ 14.0 ○ Example 7 0 90 3 1 6 100 ○ ○ 5x10 ⁹ 2.0GHz 18.1dB ○ 2.1 ~ 14.7 ○ Example 8 0 90 3 5 2 100 ○ ○ 5x10 ⁹ 2.0GHz 18.3dB ○ 2.1 ~ 14.7 ○ Example 9 0 90 8 1 1 100 ○ ○ 5x10 ⁹ 2.0GHz 18.2dB ○ 2.1 ~ 14.7 ○ Comparative Example 1 0 95 3 1 1 100 X ○ 5x10 ⁹ 1.56GHz 12.6dB △ 2.4 ~ 12.5 X Comparative Example 2 90 0 8 1 1 100 X X 1x10 ⁰ 5.60GHz 0.56dB X 2.15 ~ 7.30 X

As shown in Table 1, the overall evaluation results are: The overall evaluation results of Comparative Examples 1 and 2 are bad; the overall evaluation results of Examples 1 to 5 are acceptable; and the overall evaluation results of Examples 6 to 9 are good.

Comparative Example 2 is a conventional electromagnetic interference shielding layer. Under high-frequency electromagnetic waves, the electromagnetic interference shielding layer shows that the absolute value of the S11 parameter is almost zero (0.56dB), which indicates that it is a total reflection of electromagnetic waves without the effect of absorbing electromagnetic waves. It also means that the electromagnetic waves are not attenuated by the electromagnetic interference shielding layer at all, but may cause new electromagnetic interference because they are close to totally reflecting the electromagnetic waves. The absolute value of the S11 parameter of the insulating soft magnetic film of Examples 1 to 9 is at least 8.39dB (Example 1) or even as high as 20.69dB (Example 6), indicating that the electromagnetic wave is affected by the insulating soft magnetic material of Examples 1 to 9. The degree of reflection attenuation of the film is large. The insulating soft magnetic films of Examples 1 to 9 can effectively eliminate the electromagnetic interference, so no new electromagnetic interference will be generated.

In addition, the electromagnetic interference shielding layer of Comparative Example 2 and the surface of the insulating soft magnetic film of Comparative Example 1 had cracks. The cracks were likely to cause leakage of electromagnetic waves, which might lead to the risk of failure of electromagnetic interference prevention. The insulating soft magnetic films of Examples 1 to 9 are not cracked, so the risk of electromagnetic wave leakage is reduced.

In addition, the surface resistance value of Comparative Example 2 is 1 × 10 ⁰ Ω / □, which is conductive. Therefore, when it is directly covered on the circuit pattern on the host circuit board, a short circuit of the circuit may be caused and the host circuit board may be scrapped. The surface resistance value of the insulating soft magnetic film of Examples 1 to 9 is at least 5 × ^{10 9} Ω / □, so it can directly cover the circuit pattern on the host circuit board without causing a short circuit of the circuit.

Of course, according to the S11 parameters of Examples 1 to 9 in Table 1, it can be known that the insulating soft magnetic film has different contents of the insulating soft magnetic particles, and can be at different frequencies (2.0 GHz of Examples 7 to 9 to Example 1). 5.60 GHz) exhibits reflection attenuation effect, so the insulating soft magnetic ink having different contents of the insulating soft magnetic particles and the insulating soft magnetic film made using the insulating soft magnetic ink have the effect of absorbing electromagnetic waves.

In particular, the aforementioned method for preparing the insulating soft magnetic film is to volatilize the solvent of the insulating soft magnetic ink in the coating layer to form the insulating soft magnetic film. Therefore, after the solvent is removed from each of the examples in Table 1, The ratios of the plurality of insulating soft magnetic particles, the first resin, and the second resin in the insulating soft magnetic film are calculated and listed in Table 2 below.

Table II
project Composition of insulating soft magnetic film (wt%) Insulating soft magnetic particles First resin Second resin Example 1 55.56 33.33 11.11 Example 2 66.67 22.22 11.11 Example 3 77.78 11.11 11.11 Example 4 86.02 3.23 10.75 Example 5 86.60 9.28 4.12 Example 6 87.63 9.28 3.09 Example 7 95.75 3.19 1.06 Example 8 91.84 3.06 5.10 Example 9 90.91 8.08 1.01

Based on Table 2, based on 100 wt% of the plurality of insulating soft magnetic particles, the first resin and the second resin, the insulating soft magnetic film contains: 55.56 ~ 95.74wt% of the plurality of insulating soft magnetic particles, 3.06 ~ 33.33 wt% of the first resin and 1.01 to 11.11 wt% of the second resin. In other words, based on the measurement that the plurality of insulating soft magnetic particles and the resin layer are 100 wt%, the insulating soft magnetic film includes 55.56 to 95.74 wt% of the plurality of insulating soft magnetic particles and 4.07 to 44.44 wt% of the resin layer.

In addition, please refer to FIG. 4 together. The aforementioned insulated soft magnetic film laminated circuit board 3 further includes the solder resist film 33 covering the insulating soft magnetic film 100. The solder resist film 33 covers the insulating soft magnetic film 100. The side of the substrate. Therefore, based on the embodiment of FIG. 4, the insulated soft magnetic film laminated circuit board of the present invention includes: the substrate 31, the insulated soft magnetic film 100, and the solder mask 33, wherein the insulated soft magnetic film 100 is directly covered in the setting On the circuit pattern 32 on the surface of the substrate 31 and in contact with the circuit pattern 32, the solder resist film 33 covers a side of the insulating soft magnetic film 100 opposite to the substrate 31; the insulating soft magnetic film 100 includes the A resin layer 2 and a plurality of the insulating soft magnetic particles 1 dispersed in the resin layer 2; the insulating soft magnetic particles 1 having the core portion 11 and the shell portion 12 surrounding the core portion 11; The shape is spherical, and the particle size is between 1 μm and 50 μm. The core 11 is an iron-silicon-chrome alloy ball, and the iron-silicon-chromium alloy ball is 100 wt%. The core 11 contains 85 wt% to 95 wt% 1wt% ~ 10wt% of Si and 1wt% ~ 5wt% chromium, 12 to the housing portion phosphate film, silicon dioxide or silicate coating film, the insulation resistance of the shell portion 12 is greater than the value of 5x10 ⁹ Ω; the The shell portion 12 and the resin layer 2 are made of different materials; the weight of the shell portion 12 is 1% ~ 1 of the weight of the core portion 11 0%; and based on 100 wt% of the plurality of insulating soft magnetic particles 1 and the resin layer 2, the insulating soft magnetic film 100 contains 55.56 to 95.74wt% of the plurality of insulating soft magnetic particles 1; the resin layer 2 Is made of a first resin and a second resin, the material of the shell portion 12, the first resin and the second resin are different from each other; and, a plurality of the insulating soft magnetic particles 1, the first resin And the second resin is 100wt% as a meter, the insulating soft magnetic film contains 3.06 to 33.33wt% of the first resin and 1.01 to 11.11wt% of the second resin; the first resin is a phenolic epoxy resin, This second resin is a polymer of phenol and formaldehyde glycidyl ether.

Please refer to FIG. 5 together. The insulating soft magnetic film laminated circuit board 3 in the foregoing FIG. 4 further includes two electronic components 5 disposed on the surface of the substrate 31 on the same side as the circuit pattern 32. The insulating soft magnetic film 100 is It is disposed between two of the electronic components 5. Preferably, the insulating soft magnetic film 100 is disposed between the two electronic components 5 and does not cover any one of the electronic components 5, and the insulating soft magnetic film 100 is not in contact with any one of the electronic components 5.

The above is only a preferred embodiment of this creation, and the scope of implementation of this creation cannot be limited by this. Any simple and equivalent modifications and changes made in accordance with the scope of the patent application for creation and the contents of the new specification shall still fall within the scope of this creation patent.

1‧‧‧ insulated soft magnetic particles
11‧‧‧ Core
12‧‧‧Shell
100‧‧‧Insulation soft magnetic film
2‧‧‧ resin layer
3‧‧‧ Insulated Soft Magnetic Film Laminated Circuit Board
31‧‧‧ substrate
32‧‧‧Circuit pattern
33‧‧‧Solder Mask
5‧‧‧Electronic components

Figure 1 is a schematic diagram of the structure of the insulating soft magnetic particles in the creation.
Figure 2 is a schematic diagram of the structure of an insulating soft magnetic film.
Figure 3 is a schematic diagram of the structure of an insulated soft magnetic film laminated circuit board (1).
Figure 4 is a schematic diagram of the structure of an insulated soft magnetic film laminated circuit board (2).
Figure 5 is a schematic diagram of the structure of an insulated soft magnetic film laminated circuit board (3).

Claims (6)

An insulating soft magnetic film laminated circuit board includes a substrate, an insulating soft magnetic film, and a solder resist film, wherein the insulating soft magnetic film is directly covered on a circuit pattern disposed on the surface of the substrate and is in contact with the circuit pattern. A solder resist film covers a side of the insulating soft magnetic film opposite to the substrate; the insulating soft magnetic film includes a resin layer and a plurality of insulating soft magnetic particles dispersed in the resin layer; the insulating soft magnetic particles have a core portion And a shell part surrounding the core part, the shape of the insulating soft magnetic particles is spherical, the particle size is between 1 μm and 50 μm, the core part is an iron silicon chromium alloy ball, the shell part is a phosphate film, silicon The acid resistance film or silicon dioxide film has an insulation resistance value of more than 5 × ^{10 9} Ω at the shell portion; the shell portion and the resin layer are made of different materials. The insulated soft magnetic film laminated circuit board according to item 1 of the patent application scope, wherein the insulated soft magnetic film laminated circuit board further includes two electronic components, and the insulated soft magnetic film is disposed between the two electronic components. The insulated soft magnetic film laminated circuit board according to item 2 of the scope of patent application, wherein the insulated soft magnetic film is disposed between two of the electronic components and does not cover any one of the electronic components, and the insulated soft magnetic film is not connected with any of the electronic components. The electronic component is in contact. The insulated soft magnetic film laminated circuit board according to item 3 of the scope of patent application, wherein the weight of the shell portion is 1% to 10% of the weight of the core portion. The insulated soft magnetic film laminated circuit board according to item 4 of the scope of the patent application, wherein the iron-silicon-chromium alloy ball is 100wt%, and the core includes 85wt% to 95wt% iron, 1wt% to 10wt% silicon and 1wt% ~ 5wt% chromium. The insulated soft magnetic film laminated circuit board according to item 5 of the scope of the patent application, wherein a plurality of the insulating soft magnetic particles and the resin layer are 100wt%, and the insulating soft magnetic film system includes a plurality of 55.56 to 95.74wt%. The insulating soft magnetic particles; the resin layer is composed of a first resin and a second resin, and the material of the shell portion, the first resin, and the second resin are different from each other; and, a plurality of the insulating soft magnetics The particles, the first resin, and the second resin are 100 wt% as a measurement. The insulating soft magnetic film includes 3.06 to 33.33 wt% of the first resin and 1.01 to 11.11 wt% of the second resin; the first resin system It is a phenolic epoxy resin, and the second resin is a polymer of phenol and formaldehyde glycidyl ether.