TWI706855B - Electromagnetic protection component - Google Patents

Abstract

The present invention provides an electromagnetic protection component, which includes an insulating soft magnetic film covering the surface of a body, and the system is a substrate, a carriage or a casing. The insulating soft magnetic film is an electrically insulating wave absorbing layer, which has a large wave absorbing effect in high frequency bands, so that the body covered with the wave absorbing layer can effectively eliminate electromagnetic interference in high frequency bands.

Description

Electromagnetic protection component

The invention relates to an electromagnetic protection component with electromagnetic interference (EMI) prevention.

At present, a host device is installed inside the vehicle, especially the host device of a tram powered by high-voltage electricity, which is susceptible to electromagnetic interference from the high-voltage electricity, which may cause the host device to misjudge or be easily damaged. Similarly, the host device located inside the casing of the medical instrument may also be subject to electromagnetic interference from other instruments, which may cause the host device to misjudge.

In addition, the motherboard (usually a circuit board) mounted on the commonly used host devices currently has electronic components that are prone to high-frequency noise, such as a central processing unit, and many other components (such as chips) that are susceptible to external interference. And circuit. In order to prevent electronic components from interfering with the operation of other components and circuits, and to avoid interference between electronic components and other components and circuits, electromagnetic interference prevention is required to protect the electronic components and other components and circuits.

The motherboard is usually equipped with many circuits to form circuit patterns. One of the ways to prevent electromagnetic interference is to directly cover the circuit of the motherboard with a shielding layer and set it between high-frequency electronic components and other components. One of the currently known ways to set up a shielding layer for electromagnetic interference prevention is to use a conductive ink usually composed of conductive particles, resin and solvent, which is entirely covered on electronic components or chips to form a conductive layer as an electromagnetic interference shielding layer . However, in the high frequency band (not less than 1GHz) Since the electromagnetic waves shielded by the electromagnetic interference shielding layer are not absorbed and eliminated, high-frequency electronic components and other components will interfere with each other, which instead forms new electromagnetic interference. What's more, it is difficult to avoid that conductive ink can easily cover two adjacent circuits around electronic components or chips at the same time, which causes a short circuit of the circuit and causes the motherboard to be scrapped. For the same reason, the conductive ink cannot cover a large area on the circuit pattern. Therefore, the conductive ink has its use restrictions, but it is not completely suitable for the electromagnetic interference prevention of the circuit pattern.

Furthermore, according to the test of the international standard IEC62333, the S21 parameter is the transmission coefficient and the S11 parameter is the reflection coefficient. The test result of the electromagnetic interference shielding layer formed by conductive ink, although there is a large S21 in the high frequency band (not less than 1.0GHz) The shielding effect, but S11 is close to zero, which means that the electromagnetic wave has not been attenuated by the electromagnetic interference shielding layer at all, but may form new electromagnetic interference because it is close to total reflection. Therefore, the motherboard covered with the aforementioned electromagnetic interference shielding layer cannot effectively eliminate the electromagnetic interference received in the high frequency range.

The present invention takes the above situation into consideration, and aims to provide an electromagnetic protection member with electromagnetic interference prevention.

The present invention provides an electromagnetic protection component, which includes an insulating soft magnetic film covering the surface of a body, and the system is a substrate, a carriage or a casing.

In the aforementioned electromagnetic protection member, the insulating soft magnetic film covers the outer surface or the inner surface of the main body.

The aforementioned electromagnetic protection member, wherein the insulating soft magnetic film includes a resin layer and a plurality of insulating soft magnetic particles dispersed in the resin layer; the insulating soft magnetic particles have a core and a shell surrounding the core , The shape of the insulating soft magnetic particles is spherical, the particle size is between 1 μ m~50 μ m, the core is iron-silica-chromium alloy ball, and the shell is phosphate film, silicate film or silicon dioxide For the film, the insulation resistance value of the shell is greater than 5x10 ⁹ Ω; the shell and the resin layer are made of different materials.

In the aforementioned electromagnetic protection member, the iron-silicon-chromium alloy ball is 100wt% as the measurement, and the core contains 85wt%~95wt% iron, 1wt%~10wt% silicon and 1wt%~5wt% chromium.

In the aforementioned electromagnetic protection member, the weight of the shell is 1%-10% of the weight of the core.

In the aforementioned electromagnetic protection member, a plurality of the insulating soft magnetic particles and the resin layer are 100% by weight, and the insulating soft magnetic film contains 55.56 to 95.74% by weight of the insulating soft magnetic particles.

In the aforementioned electromagnetic protection member, wherein the resin layer is composed of a first resin and a second resin, the material of the shell, the first resin and the second resin are different from each other; and a plurality of the 100wt% of the insulating soft magnetic particles, the first resin and the second resin are measured, and the insulating soft magnetic film contains 3.06~33.33wt% of the first resin and 1.01~11.11wt% of the second resin.

In the aforementioned electromagnetic protection member, the first resin is novolac epoxy resin, and the second resin is a polymer of phenol and formaldehyde glycidyl ether.

In the aforementioned electromagnetic protection component, the present system is the substrate, and the insulating soft magnetic film directly covers and contacts a circuit pattern provided on the surface of the substrate.

In the aforementioned electromagnetic protection member, the electromagnetic protection member further includes a solder mask covering the insulating soft magnetic film, the solder mask covering the side of the insulating soft magnetic film opposite to the substrate.

In the aforementioned electromagnetic protection member, the electromagnetic protection member further includes two electronic components arranged on the surface of the substrate on the same side as the circuit pattern, and the insulating soft magnetic film is arranged between the two electronic components.

In the aforementioned electromagnetic protection member, the insulating soft magnetic film is disposed between the two electronic components and does not cover any one of the electronic components, and the insulating soft magnetic film does not contact any of the electronic components.

In the aforementioned electromagnetic protection member, wherein the insulating soft magnetic film is made of an insulating soft magnetic ink, the insulating soft magnetic ink includes: 50wt%~90wt% of the plurality of insulating soft magnetic particles, 3wt%~30wt% of the first resin , 1wt%~10wt% of the second resin and 1wt%~10wt% of a solvent.

In the aforementioned electromagnetic protection member, the solvent is ethylene glycol butyl ether acetate.

In the aforementioned electromagnetic protection member, the insulating soft magnetic ink may include a dispersant, and the dispersing agent is 100wt% of a plurality of the insulating soft magnetic particles, the first resin, the second resin, and the solvent. 0.001wt%~0.01wt%, the dispersant is 3-glycidoxypropyltrimethoxysilane.

In the aforementioned electromagnetic protection member, the insulating soft magnetic ink may include a defoaming agent, and the defoaming agent is measured by 100wt% of the insulating soft magnetic particles, the first resin, the second resin, and the solvent. It is 0.1wt~0.2wt%. The defoamer can be organosilicon defoamer or polymer defoamer.

The insulating soft magnetic film is an electromagnetic wave absorbing layer for electrical insulation (surface resistance not less than 1.0x10 ⁹ ohm/square (Ω/□)), especially when it covers a large area on the circuit pattern of the circuit board. It causes a short circuit of the circuit and a large attenuation signal in the high frequency band (not less than 1.0GHz), so that the circuit board covered with the insulating soft magnetic film (wave-absorbing layer) can effectively eliminate the electromagnetic interference in the high frequency band. The insulating soft magnetic film provided by the present invention, for electromagnetic waves radiated in the high frequency range (not less than 1GHz), the electromagnetic waves will be absorbed and attenuated by the magnetic material contained in the insulating soft magnetic film, so in the high frequency range (not less than 1GHz) ) Shows excellent S21 (transmission coefficient) shielding effect. When the thickness of the insulating soft magnetic film is 1mm, S21 has a shielding attenuation effect of about 1~15dB; when the thickness of the insulating soft magnetic film is 2.6mm, S11 (reflection Coefficient) shows a reflection attenuation effect of up to more than 20dB at 2.64GHz. Therefore, the main body (mother board) covered with the insulating soft magnetic film provided by the present invention can effectively eliminate electromagnetic interference in the high frequency range. However, the conventional electromagnetic interference shielding layer shows almost zero S11 in the electromagnetic interference shielding layer at a high frequency (not less than 1 GHz), indicating that it totally reflects electromagnetic waves without absorbing electromagnetic waves. Although the electromagnetic interference shielding layer has a large S21 shielding effect in the high frequency band (not less than 1.0GHz), because S11 is close to zero, this means that the electromagnetic wave is not attenuated by the electromagnetic interference shielding layer at all, but because it is close to the total reflection of the electromagnetic wave It may form a new electromagnetic interference. Therefore, the motherboard covered with the aforementioned electromagnetic interference shielding layer cannot effectively eliminate the electromagnetic interference received in the high frequency range.

1: Insulating soft magnetic particles

11: Core

12: Shell

100: Insulating soft magnetic film

2: Resin layer

200: Electromagnetic protection component

3: Insulating soft magnetic film laminated circuit board

31: substrate

32: circuit pattern

33: solder mask

4: Ontology

5: Electronic components

6: Carriage

7: Chassis

Figure 1 is a schematic diagram of the structure of insulating soft magnetic particles in the present invention.

Figure 2 is a schematic diagram of the structure of the insulating soft magnetic film in the present invention.

Figure 3 is a schematic diagram of the structure of the electromagnetic shielding member of the present invention as the base plate.

Figure 4 is a schematic diagram of the structure of the electromagnetic shielding member of the present invention as a carriage body.

Figure 5 is a schematic structural view of the electromagnetic shielding component body of the present invention as a casing.

Figure 6 is a schematic diagram (1) of the structure of the electromagnetic protection component of the present invention is an insulating soft magnetic film laminated circuit board.

Figure 7 is a schematic diagram (2) of the structure of the electromagnetic protection component of the present invention is an insulating soft magnetic film laminated circuit board.

Figure 8 is a structural diagram (3) of the electromagnetic protection component of the present invention is an insulating soft magnetic film laminated circuit board.

Figure 9 is a schematic diagram of the protection of electronic components by the main body of the electromagnetic protection member of the present invention as a casing.

Figure 10 is a schematic diagram of the electromagnetic protection component body of the present invention for protecting electronic components from the carriage.

In order to make it easier for the examiner to understand the technical content, features and effects of the present invention, it will be explained more clearly in conjunction with the presentation of the embodiments and comparative examples, but the present invention is not limited by these embodiments. In addition, the use of "~" in this specification and the scope of the patent application indicates that the numerical range refers to the range that covers the values before and after the "~" as the lower and upper limits; the use of "wt%" in this specification and the scope of the patent application , Refers to the weight percentage; the "particle size" used in this specification and the scope of the patent application refers to the particle size measured by a laser particle size analyzer.

Please refer to FIGS. 1 to 5 at the same time. An electromagnetic protection member 200 of the present creation includes an insulating soft magnetic film 100 covering the surface of a body 4, and the present system is a substrate 31 (FIG. 3) and a carriage 6 (Figure 4) or a case 7 (Figure 5), the insulating soft magnetic film 100 is made of an insulating soft Prepared by a magnetic ink, the insulating soft magnetic ink includes: 50wt%~90wt% of a plurality of insulating soft magnetic particles, 3wt%~30wt% of a first resin, 1wt%~10wt% of a second resin, and 1wt%~10wt% A solvent.

Please refer to Fig. 1. The aforementioned insulating soft magnetic particle 1 has a core 11 and a shell 12 surrounding the core. Wherein, the core portion 11 is a soft magnetic core portion composed of a soft magnetic material (ferromagnetic alloy material), and the core portion 11 may be: magnetic stainless steel (Fe-Cr-Al-Si alloy), iron-silicon aluminum alloy (Fe -Si-Al alloy), nickel-iron alloy (Fe-Ni alloy), iron-silicon-copper alloy (Fe-Cu-Si alloy), iron-silicon alloy Fe-Si alloy, iron-silicon chromium-nickel alloy (Fe-Si-Cr-Ni) Alloy), Fe-Si-Cr alloy (Fe-Si-Cr alloy) or ferrite, etc., and in terms of the magnetic properties of the present invention, Fe-Si-Cr alloy (Fe-Si-Cr alloy) is preferred. The shell portion 12 is made of insulating material. The shell portion 12 can be a phosphate film, a silicate film or a silicon dioxide film. The shell portion 12 is made of 1% of the weight of the core 11 10% is formed by performing a surface insulation treatment. The surface insulation treatment is, for example, that the shell portion 12 is phosphated to the core portion 11 or sodium silicate to coat the core portion 11. That is, the weight of the shell portion 12 is 1%-10% of the weight of the core portion. The aforementioned phosphating treatment utilizes phosphoric acid or a phosphate solution to carry out a conversion reaction (Conversion Reaction) reaction with the iron atoms on the surface of the alloy listed in the aforementioned core portion 11 to form a phosphate film. In addition, the water glass insulating material formed by sodium silicate salt can be directly added to overlay (Overlay Coating) on the surface of the core 11, and dried to remove water to form a silicate film. Furthermore, silane monomers can also be polymerized to form polysiloxane molecules, which are then directly added to coat the surface of the core 11, and dried to remove water to form a silicon dioxide film. In particular, the insulation resistance value of the aforementioned shell portion 12 is greater than 5 GΩ (5× ^{10 9} Ω). The shape of the aforementioned insulating soft magnetic particles 1 can be spherical, flat or fibrous. In the present invention, the shape is preferably spherical, and the particle size is between 1 μm and 50 μm. That is to say, the core 11 can be ferrosilicon. Chromium alloy ball; and, based on the iron-silicon-chromium alloy as 100wt%, the core contains 85wt%~95wt% iron, 1wt%~10wt% silicon and 1wt%~5wt% chromium.

The aforementioned first resin may be phenolic epoxy resin or O-Methyl phenolic epoxy resin. Preferably, the first resin is novolac epoxy resin.

The aforementioned second resin may be a polymer of phenol and formaldehyde glycidyl ether (CAS Number: 28064-14-4) (Phenol polymer with formaldehyde glycidyl ether), bisphenol F epoxy resin or linear aldehyde epoxy resin.

The first resin and the second resin series are different, and the material of the shell part, the first resin and the second resin series are different from each other.

The aforementioned solvent can be ethylene glycol butyl ether acetate, ethylene glycol ethyl ether acetate, diethylene glycol butyl ether acetate, diethylene glycol ethyl ether acetic acid or 1,1,3-trimethylcyclohexenone .

In order to improve the dispersibility of the insulating soft magnetic particles in the insulating soft magnetic ink, the insulating soft magnetic ink may contain a dispersant. Taking a plurality of the insulating soft magnetic particles, the first resin, the second resin, and the solvent as 100 wt% as a measurement, the dispersant system is 0.001 wt% to 0.01 wt%. The dispersing agent can be vinyl trimethoxysilane, 3-glycidoxypropyl trimethoxysilane, p-styryl trimethoxysilane, 3-propenoxypropyl trimethoxysilane or 3- Mercaptopropylmethyldimethoxysilane.

In order to reduce the amount of bubbles generated by the insulating soft magnetic ink during the stirring process, the insulating soft magnetic ink may contain a defoaming agent. Taking a plurality of the insulating soft magnetic particles, the first resin, the second resin and the solvent as 100wt% as a measurement, the defoaming agent is 0.1wt% to 0.2wt%. The defoamer can be an organosilicon defoamer or a polymer defoamer.

The preparation of the insulating soft magnetic ink of the present invention: the insulating soft magnetic ink of the present invention can be manufactured by a method of manufacturing an insulating soft magnetic ink including the following steps: (1) According to a set of a plurality of the insulating soft magnetic particles, the The weight percentage of the first resin, the second resin and the solvent to prepare materials; (2) Mix a plurality of the insulating soft magnetic particles, the first resin, the second resin and the solvent at room temperature and stir and mix with a planetary mixer Evenly, and optionally, appropriate dispersant and/or defoamer additives can be added to complete the insulating soft magnetic ink.

The preparation of the insulating soft magnetic film of the present invention: The insulating soft magnetic film is prepared by the following preparation method of the insulating soft magnetic film: screen printing is used on a host circuit board without assembled chips and components and with circuit patterns Or a stainless steel blade coating method, the insulating soft magnetic ink is coated on the circuit pattern of the host circuit board to form a coating of a predetermined size and shape, and then an oven is used at a predetermined temperature (for example, 150°C) Dry for a predetermined time (for example, 30 minutes) to volatilize the solvent and form the insulating soft magnetic film in a sheet shape. The thickness of the insulating soft magnetic film is 100 μm ~2.6 mm; preferably, the thickness of the insulating soft magnetic film is 100 μ m~300 μ m. Please refer to FIG. 2 together. It is particularly noted that the insulating soft magnetic film 100 includes a resin layer 2 and a plurality of the insulating soft magnetic particles 1 dispersed in the resin layer; wherein, the resin layer 2 is formed by the first It is composed of a resin and the second resin, and the material of the shell portion 12, the first resin and the second resin are different from each other. Please refer to FIG. 6 together. In other words, an insulating soft magnetic film laminated circuit board 3 includes: the substrate 31, a circuit pattern 32 disposed on the surface of the substrate 31, and directly covering the circuit pattern 32 and interacting with the circuit pattern 32 The insulating soft magnetic film 100 is in contact. In particular, in the embodiments described later, the electromagnetic protection member 200 of the present invention can be regarded as the insulating soft magnetic film laminated circuit board 3.

The effect evaluation and test of the insulating soft magnetic film made by using the insulating soft magnetic ink of the present invention: the insulating soft magnetic film is evaluated by the film forming property test; the insulating soft magnetic film is measured by the surface resistance Evaluate whether the insulating soft magnetic film is electrically insulated; the insulating soft magnetic film measures the S11 parameters and S21 parameters through the absorption characteristics to evaluate the amount of electromagnetic waves absorbed by the insulating soft magnetic film.

Film formation test: Observe the surface of the insulating soft magnetic film by visual inspection: If cracks are found, it is judged as film formation failure and marked as "X"; if there is no cracking, but the surface is warped, then It was judged that the film formation was acceptable and marked as "△"; if there was no cracking, no warpage, flat and good adhesion, it was judged as good film formation and marked as "○".

Surface resistance measurement: The surface resistance of the insulating soft magnetic film is measured by a four-point probe measurement method for the above-mentioned insulating soft magnetic film. After measuring a total of 5 points on the insulating soft magnetic film, the average value is taken as the recorded surface resistance value . When the surface resistance value is not less than 1.0x10 ⁹ ohm/square (Ω/□), it is judged as electrical insulation and marked as "○"; when the surface resistance value is not less than 1.0 ohm/square (Ω/□), it is judged It is non-electrically insulated and marked as "X", indicating that it does not meet the electrical insulation conditions of the insulating soft magnetic film.

Absorption characteristics measurement: Use Keysight E-5071C network analyzer to connect two pyramid antennas with transmission lines to perform S21 parameters (or transmission coefficient) and S11 parameters (or reflection coefficient) in the electromagnetic wave frequency band of 2-18GHz ) Measurement. Among them, the measurement of the S11 parameter is to place two pyramid antennas on the same side of the insulating soft magnetic film to measure the electromagnetic wave reflection and attenuation value as the S11 parameter. The thickness of the insulating soft magnetic film is 2.6mm; S11 parameters measured in Examples and Comparative Examples It is a negative number, which means electromagnetic waves are absorbed. The frequency value (GHz) at which the S11 parameter reaches the maximum value and the absolute value of the S11 parameter value (dB) at this time are recorded in Table 1 below. The measurement of S21 parameter is to place two pyramid antennas on the opposite side of the insulating soft magnetic film to measure the transmission attenuation value of each frequency of the electromagnetic wave, which is the S21 parameter. The thickness of the insulating soft magnetic film is 1.0mm; similarly, described later The measured S21 parameters in the examples and comparative examples in Table 1 are negative numbers, which represent electromagnetic waves are absorbed. The maximum and minimum absolute values of the S21 parameters in this frequency band are recorded in Table 1 below. The S11 parameter is a negative number. A negative number means electromagnetic waves are absorbed. Therefore, the larger the absolute value of the S11 parameter, the greater the amount of electromagnetic waves absorbed by the insulating soft magnetic film, and the greater the attenuation of electromagnetic waves by the insulating soft magnetic film. The insulating soft magnetic film absorbs electromagnetic waves more effectively and eliminates electromagnetic interference. Similarly, the S21 parameter is a negative number, which means that electromagnetic waves are absorbed. Therefore, the greater the absolute value of the S21 parameter, the greater the value of the electromagnetic wave in this frequency band. The greater the degree of shielding attenuation of the insulating soft magnetic film, the more effectively the insulating soft magnetic film shields electromagnetic interference. When the maximum value of the absolute value of the S21 parameter is less than 8dB, it is determined that the insulating soft magnetic film has poor electromagnetic shielding ability and marked as "X"; when the maximum value of the absolute value of the S21 parameter is greater than or equal to 8dB and less than 13.5 dB, the ability of the insulating soft magnetic film to shield electromagnetic waves is determined to be acceptable and marked as "△"; when the maximum absolute value of the S21 parameter is greater than or equal to 13.5dB, the ability of the insulating soft magnetic film to shield electromagnetic waves is determined It is good and marked as "○".

Overall evaluation result: In the same embodiment or comparative example, if an "X" appears in any of the film formation test, surface resistance measurement, and absorption characteristic measurement, the overall evaluation result is bad and recorded as "X"; if any of the film formation test, surface resistance measurement and wave absorption characteristic measurement shows "△", the overall evaluation result is acceptable and recorded as "△"; film formation test Surface electricity In the resistance measurement and the absorption characteristic measurement, if both "○" appear, the overall evaluation result is good and recorded as "○".

According to the manufacturing method of the insulating soft magnetic ink of the present invention, the insulating soft magnetic ink is first prepared into the insulating soft magnetic ink corresponding to the respective embodiments (Example 1 to Example 9) described in Table 1 below, and then by the Preparation method of insulating soft magnetic film The insulating soft magnetic film is prepared, and then the effect evaluation and test of the insulating soft magnetic film are performed, and the results are recorded in Table 1. Among them, the core of the insulating soft magnetic particles in Table 1 is iron-silicon-chromium alloy, and the shell is a phosphate film; the first resin is phenolic epoxy resin; the second resin is a polymerization of phenol and formaldehyde glycidyl ether物; The solvent is ethylene glycol butyl ether acetate. Table 1 additionally records Comparative Example 1 and Comparative Example 2. Comparative Example 1 and Comparative Example 2 imitate the manufacturing method of the insulating soft magnetic ink, the preparation method of the insulating soft magnetic film, and the evaluation and testing of the effect of the insulating soft magnetic film. Except that Comparative Example 2 uses conductive particles to replace the insulating soft magnetic particles of each embodiment, the remaining similarities will not be repeated.

As shown in Table 1, the overall evaluation results are: the overall evaluation results of Comparative Examples 1 and 2 are bad; the overall evaluation results of Examples 1 to 5 are acceptable; the overall evaluation results of Examples 6 to 9 are good.

Comparative Example 2 is a conventional electromagnetic interference shielding layer. Under high frequency electromagnetic waves, the electromagnetic interference shielding layer shows that the absolute value of the S11 parameter is almost zero (0.56dB), which means that it totally reflects electromagnetic waves without absorbing electromagnetic waves. , It also means that the electromagnetic wave is not attenuated by the electromagnetic interference shielding layer at all, but because it is close to totally reflecting the electromagnetic wave, new electromagnetic interference may be formed. The absolute value of the S11 parameter of the insulating soft magnetic film of Examples 1-9 is at least 8.39dB (Example 1) and even as high as 20.69dB (Example 6), indicating that electromagnetic waves are affected by the insulating soft magnetic film of Examples 1-9. The degree of film reflection attenuation is large, and the insulating soft magnetic film of Examples 1-9 can effectively eliminate the electromagnetic interference received, so no new electromagnetic interference will be generated.

Furthermore, the surface of the electromagnetic interference shielding layer of Comparative Example 2 and the insulating soft magnetic film of Comparative Example 1 have cracks, and the cracks are likely to cause electromagnetic wave leakage, which may lead to the risk of failure of electromagnetic interference control. None of the insulating soft magnetic films of Examples 1 to 9 are cracked, thereby reducing the risk of electromagnetic wave leakage.

In addition, the surface resistance value of Comparative Example 2 is 1×10 ⁰ Ω/□, which has conductive properties. Therefore, when it is directly covered on the circuit pattern on the host circuit board, it will cause a short circuit of the circuit and cause the host circuit board to be scrapped. The surface resistance of the insulating soft magnetic film of Examples 1-9 is at least 5× ^{10 9} Ω/□, so it can directly cover the circuit pattern on the host circuit board without causing short circuit of the circuit.

Of course, from the S11 parameters of Examples 1 to 9 in Table 1, the insulating soft magnetic film has a different content of the insulating soft magnetic particles and can operate at different frequencies (from 2.0 GHz in Examples 7 to 9 to Example 1 (5.60GHz) shows the reflection attenuation effect, so the insulating soft magnetic ink with different contents of the insulating soft magnetic particles and the insulating soft magnetic film made by using the insulating soft magnetic ink have the effect of absorbing electromagnetic waves.

In particular, the aforementioned method for preparing the insulating soft magnetic film is to volatilize the solvent of the insulating soft magnetic ink in the coating to form the insulating soft magnetic film. Therefore, after removing the solvent from the examples in Table 1, The proportions of the insulating soft magnetic particles, the first resin and the second resin in the insulating soft magnetic film are calculated and listed in Table 2 below.

Based on Table 2, taking a plurality of the insulating soft magnetic particles, the first resin and the second resin as 100wt%, the insulating soft magnetic film contains: 55.56~95.74wt% of the plurality of insulating soft magnetic particles, 3.06~ 33.33wt% of the first resin and 1.01-11.11wt% of the second resin. In other words, taking a plurality of the insulating soft magnetic particles and the resin layer as 100wt% as a measurement, the insulating soft magnetic film contains: 55.56~95.74wt% of the plurality of insulating soft magnetic particles and 4.07~44.44wt% of the resin layer.

In addition, please also refer to FIG. 7, the aforementioned insulating soft magnetic film laminated circuit board 3 may further include a solder resist film 33 covering the insulating soft magnetic film 100, and the solder resist film 33 covering the insulating soft magnetic film 100. On one side of the substrate. Based on the foregoing, since the electromagnetic shielding member 200 can be regarded as the insulating soft magnetic film laminated circuit board 3, in other words, the electromagnetic shielding member 200 may further include the solder mask 33 covering the insulating soft magnetic film 100, the The solder mask 33 covers the side of the insulating soft magnetic film 100 opposite to the substrate. Therefore, based on the embodiment in FIG. 7, the insulating soft magnetic film laminated circuit board (ie, the electromagnetic shielding member) of the present invention includes: the substrate 31, the insulating soft magnetic film 100, and the solder resist film 33, wherein the insulating soft magnetic film The soft magnetic film 100 directly covers the circuit pattern 32 provided on the surface of the substrate 31 and is in contact with the circuit pattern 32, and the solder resist film 33 covers the insulating soft magnetic film 100 on the opposite side of the substrate 31; the The insulating soft magnetic film 100 includes the resin layer 2 and a plurality of the insulating soft magnetic particles 1 dispersed in the resin layer 2; the insulating soft magnetic particle 1 has the core portion 11 and the shell portion surrounding the core portion 11 12. The shape of the insulating soft magnetic particles 1 is spherical, with a particle size ranging from 1 μm to 50 μm . The core 11 is an iron-silicon-chromium alloy ball, and the iron-silicon-chromium alloy ball is 100wt% as the measurement. The core 11 contains 85wt%~95wt% iron, 1wt%~10wt% silicon, and 1wt%~5wt% chromium. The shell part 12 is a phosphate film, a silicate film or a silicon dioxide film. The insulation resistance value of 12 is greater than 5x10 ⁹ Ω; the shell portion 12 and the resin layer 2 are made of different materials; the weight of the shell portion 12 is 1% to 10% of the weight of the core portion 11; and, A plurality of the insulating soft magnetic particles 1 and the resin layer 2 are measured at 100wt%. The insulating soft magnetic film 100 contains 55.56~95.74wt% of the insulating soft magnetic particles 1; the resin layer 2 is made of a first resin And a second resin, the material of the shell portion 12, the first resin and the second resin are different from each other; and a plurality of the insulating soft magnetic particles 1, the first resin and the second resin are used as 100wt% is the measurement, the insulating soft magnetic film contains 3.06~33.33wt% of the first resin and 1.01~11.11wt% of the second resin; the first resin is phenolic epoxy resin, and the second resin is A polymer of phenol and formaldehyde glycidyl ether.

Please also refer to FIG. 8. The insulating soft magnetic film laminated circuit board 3 (that is, the electromagnetic protection member) in the foregoing FIG. 7 further includes two electronic components 5 disposed on the substrate 31 on the same side as the circuit pattern 32 The surface, and the insulating soft magnetic film 100 is disposed between the two electronic components 5. Preferably, the insulating soft magnetic film 100 is disposed between the two electronic components 5 and does not cover any one of the electronic components 5, and the insulating soft magnetic film 100 does not contact any of the electronic components 5 either.

Please also refer to Figure 9. For example, the main body 4 can be the casing 7 of the medical device, the electronic component 5 can be a calculator inside the casing of the medical device, and the insulating soft magnetic film 100 can be coated on the medical device The outer surface of the casing 7 constitutes the electromagnetic shielding member 200 to prevent the aforementioned calculator from being interfered by electromagnetic waves from other machines and causing misjudgment. Please also refer to Figure 10. For another example, the main body 4 can be the carriage 6 of the tram, the electronic component 5 can be a trip computer inside the casing of the carriage 6, and the insulating soft magnetic film 100 can be covered on the carriage 6 The outer surface of the housing to form The electromagnetic protection member 200 prevents the aforementioned trip computer from being interfered by the electromagnetic wave of the high-voltage power line to cause misjudgment.

The above are only preferred embodiments of this creation, and should not be used to limit the scope of implementation of the present invention. All simple and equivalent modifications and changes made according to the scope of the patent application of the present invention and the content of the description of the invention shall still fall within the scope of the patent of the present invention.

100: Insulating soft magnetic film

200: Electromagnetic protection component

31: substrate

Claims (9)

An electromagnetic protection component, comprising an insulating soft magnetic film covering the surface of a body, the system is a substrate, and the insulating soft magnetic film directly covering a circuit pattern arranged on the surface of the substrate and contacting the circuit pattern; The insulating soft magnetic film includes a resin layer and a plurality of insulating soft magnetic particles dispersed in the resin layer; the insulating soft magnetic particle has a core and a shell surrounding the core, the insulating soft magnetic particle The shape is spherical and the particle size is between 1 μm and 50 μm . The core is a Fe-SiCr alloy ball, and the shell is a phosphate film, a silicate film or a silicon dioxide film. The insulation resistance value is greater than 5x10 ⁹ Ω; the shell and the resin layer are composed of different materials; the iron-silicon-chromium alloy ball is 100wt% as the measurement, and the core contains 85wt%~95wt% iron, 1wt%~ 10wt% silicon and 1wt%~5wt% chromium; the weight of the shell part is 1%~10% of the weight of the core part; and the insulating soft magnetic particles and the resin layer are 100wt% as the measurement, the insulation The soft magnetic film contains 55.56~95.74wt% of a plurality of the insulating soft magnetic particles; the resin layer is composed of a first resin and a second resin, the material of the shell, the first resin and the second resin The systems are different from each other; taking a plurality of the insulating soft magnetic particles, the first resin and the second resin as 100wt%, the insulating soft magnetic film contains 3.06~33.33wt% of the first resin and 1.01~11.11wt% The second resin; and, the first resin is a novolac epoxy resin, and the second resin is a polymer of phenol and formaldehyde glycidyl ether. As for the electromagnetic protection member described in item 1 of the scope of patent application, the insulating soft magnetic film is an electromagnetic wave absorbing layer for electrical insulation, and the surface resistance of the insulating soft magnetic film is not less than 1.0x10 ⁹ ohm/square and can absorb High-frequency electromagnetic waves not less than 1GHz. The electromagnetic protection member described in item 2 of the scope of patent application, wherein the electromagnetic protection member further includes a solder mask covering the insulating soft magnetic film, and the solder mask covering the insulating soft magnetic film opposite to the substrate side. The electromagnetic protection member described in item 3 of the scope of patent application, wherein the electromagnetic protection member further includes two electronic components arranged on the surface of the substrate on the same side as the circuit pattern, and the insulating soft magnetic film is arranged on the two electronic components between. For the electromagnetic protection member described in item 4 of the scope of patent application, the insulating soft magnetic film is disposed between the two electronic components and does not cover any one of the electronic components, and the insulating soft magnetic film is not connected to any one of the electronic components. contact. The electromagnetic protection member according to item 5 of the scope of patent application, wherein the insulating soft magnetic film is made of an insulating soft magnetic ink, and the insulating soft magnetic ink includes: a plurality of the insulating soft magnetic particles, the first resin, and the second resin And a solvent. The electromagnetic protection member described in item 6 of the scope of patent application, wherein the solvent is ethylene glycol butyl ether acetate. The electromagnetic protection member described in item 7 of the scope of patent application, wherein the insulating soft magnetic ink contains a dispersant, and the dispersant is 3-glycidoxypropyltrimethoxysilane. According to the eighth item of the patent application, the insulating soft magnetic ink contains a defoamer, and the defoamer is an organosilicon defoamer or a polymer defoamer.

Images