TWM587366U - Conductive frame with inclined angle - Google Patents

Abstract

A conductive frame with an inclined angle includes a plurality of support members, each of which includes an insulating support body and a conductive unit. The insulating support body has two connection surfaces, and the conductive units are disposed on the installation surfaces. There is an included angle between the setting surfaces, and the included angle is an acute angle or an obtuse angle.

Description

Conductive frame with inclined angle

The present invention relates to a conductive frame, in particular to a conductive frame having an inclined angle.

Generally, a wearable device mainly cooperates with a light emitting module and a sensing module, and often needs to cooperate with the sensing module by making the light emitting module present a specific light emitting angle to achieve a predetermined effect.

An existing light-emitting module is provided with a light-emitting element on a circuit board, and then a reflecting mirror is provided corresponding to the light path of the light-emitting element, and the light emitted from the light-emitting element is refracted through the mirror to reach a predetermined light exit angle. However, the cost of installing a reflector is high, and the light energy refracted by the light emitted by the light-emitting component via the reflector is easily attenuated, thereby reducing the light output efficiency.

Another existing light-emitting module is to make the light-emitting element have two pins for electrically connecting the circuit board when packaging the light-emitting element, and reach a predetermined light-emitting angle by bending the pins to a required angle. However, the light-emitting element in this manner cannot be disposed on a flexible circuit board, and the packaging cost of the light-emitting element is high.

Therefore, an object of the present invention is to provide a conductive frame having an inclined angle.

Therefore, the novel conductive frame with an inclined angle includes a plurality of supports. Each support includes an insulating support and a conductive unit. The insulating support has two installation surfaces connected to each other. The conductive unit is disposed on the installation surfaces. The installation surfaces have an included angle. The included angle is acute or obtuse.

The effect of the new model is that when an electrically conductive frame is formed, an insulating support with an angle is formed, and then a conductive unit is arranged on the insulating support, so that subsequent light-emitting components can be directly connected to the conductive unit in a mass production manner, and then The single support provided with the light-emitting components by punching has an inclined angle, and can be directly connected to the circuit board for use. There is no need to additionally install a reflector or bend the light-emitting component pins, which can save production costs and In response to the miniaturization of module space requirements, it is easier to tilt the light-emitting component, and the angle can be flexibly changed while being applied to the production of the conductive frame.

Referring to FIGS. 1 to 3, an embodiment of the novel conductive frame 2 with an inclined angle includes a plurality of support members 21 arranged in an array and spaced apart from each other, and a plurality of connection members 22 for connecting the support members 21. .

Specifically, each of the supporting members 21 includes an insulating supporting body 211 and a conductive unit 212 disposed on the insulating supporting body 211, and the connecting members 22 are located between adjacent insulating supporting bodies 211. For connecting the adjacent insulating supports 211.

Preferably, each of the insulating support bodies 211 has two installation surfaces 210 connected to each other, and the installation surfaces 210 are connected at an angle, and an included angle θ is included. The included angle θ is an acute or obtuse angle, that is, 0 °. <Θ <90 ° or 90 ° <θ <180 °, so that each of the insulating supports 211 has an inclined setting surface 210. The shape of the insulating supports 211 is not particularly limited, as long as the insulating support It suffices that the body 211 has an inclined surface. In this embodiment, the shape of the insulating support 211 is described by taking a parallelepiped as an example.

Further, in this embodiment, the formation of the conductive frame 2 is mainly to directly produce the non-conductive insulating supports 211 and the connecting members 22 by injection molding, so that the insulating bodies 211 are connected to the The piece 22 is integrally formed to form a continuous layout (as shown in FIG. 1). The included angle θ of each of the insulating supports 21 can be determined during injection molding.

Each of the conductive units 212 is correspondingly disposed on the setting surfaces 210 of each of the insulating supports 211. Specifically, the conductive unit 212 has two conductive portions 213 disposed at intervals on the installation surfaces 210, and two opposite ends of each of the conductive portions 213 are respectively located on the installation surfaces 210, so that the The conductive portions 213 are attached to the installation surfaces 210 and also have the same included angle θ as the installation surfaces 210. FIG. 3 shows the insulating support 211 in which the conductive portions 213 are individually provided.

Refer to FIGS. 4 and 5 for cooperation. In actual application, after the conductive frame 2 is produced in a continuous layout, the conductive portion on the installation surface 210 in the same direction of each insulating support 211 is directly transmitted through mass production. A light-emitting member 3 is provided in 213, and then the connecting member 22 between the insulating support bodies 211 is die-cut to complete a single light-emitting module 4 having an inclined angle as shown in FIG. 4.

In other words, the conductive frame 2 of the present invention can be used for the light-emitting components 3 to be directly mass-produced on the conductive portion 213 of the insulating support 211 having an inclined surface through a surface mount welding technology (SMT). Then, it is fixed by reflow, and then the connection members 22 are punched out to make the light-emitting module 4 a surface-adhesive light-emitting diode (SMD LED), and the obtained light-emitting module 4 is obtained. The mounting surface 210 is mounted on a circuit board 5 by using surface mount soldering technology (SMT) (as shown in FIG. 5) and fixed by reflow, so that the The light-emitting module 4 has an inclined angle, and can emit light obliquely toward a specific angle.

In summary, when the conductive frame 2 is manufactured, an insulating support 211 having an included angle θ is formed, and then a conductive unit 212 is provided on the insulating support 211, so that the subsequent light-emitting parts 3 can be directly connected to the mass production method. The single supporting member 21 provided with the light-emitting member 3 on the conductive unit 212 and obtained through punching has an inclined angle, and can be directly connected to the circuit board 5 for use. This can save manufacturing costs and respond to minimizing module space requirements. The light-emitting element can be easily tilted, and the tilt angle can be flexibly changed while being applied to the production of the conductive frame 2. Therefore, the purpose of new cost can be achieved.

However, the above are only examples of the new model. When the scope of implementation of the new model cannot be limited by this, any simple equivalent changes and modifications made in accordance with the scope of the patent application of the new model and the content of the patent specification are still Within the scope of this new patent.

2‧‧‧ conductive frame

22‧‧‧Connector

21‧‧‧ support

3‧‧‧ light-emitting parts

210‧‧‧ Setting surface

4‧‧‧light emitting module

211‧‧‧ insulated support

5‧‧‧Circuit Board

212‧‧‧ conductive unit

θ‧‧‧ angle

213‧‧‧Conductive Section

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, among which:
FIG. 1 is a schematic partial plan view illustrating an embodiment of the novel conductive frame having an inclined angle;
2 is a schematic partial side view illustrating a partial cross-sectional view taken along the line II-II of FIG. 1 in this embodiment;
FIG. 3 is a schematic perspective view illustrating a state of a single support member of the embodiment; FIG.
4 is a schematic side view illustrating a light-emitting element disposed on the support; and FIG. 5 is a schematic side view illustrating a support having the light-emitting element disposed on a circuit board.

Claims (5)

A conductive frame with an inclined angle includes:
A plurality of support members, each of which includes an insulating support body and a conductive unit, the insulating support body has two installation surfaces connected to each other, the conductive unit is disposed on the installation surfaces, and the installation surfaces have An included angle, and the included angle is an acute angle or an obtuse angle. The conductive frame with an oblique angle according to claim 1, wherein the conductive unit has two conductive portions spaced apart from each other on the setting surfaces, and two opposite ends of each conductive portion are respectively located on the settings Surface. The conductive frame with an oblique angle according to claim 1, further comprising a plurality of connecting members for connecting the supporting members disposed at a distance from each other, and the connecting members are located between the adjacent insulating supporting bodies. The conductive frame with an oblique angle according to claim 3, wherein the insulating supports and the connecting members are integrally formed. The inclined conductive frame according to claim 1, wherein the insulating supports are arranged in an array.