JP2013197064A - Lighting device, and manufacturing method thereof - Google Patents

Lighting device, and manufacturing method thereof Download PDF

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JP2013197064A
JP2013197064A JP2012066336A JP2012066336A JP2013197064A JP 2013197064 A JP2013197064 A JP 2013197064A JP 2012066336 A JP2012066336 A JP 2012066336A JP 2012066336 A JP2012066336 A JP 2012066336A JP 2013197064 A JP2013197064 A JP 2013197064A
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light emitting
housing
mounting substrate
holes
hole
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Daigo Suzuki
大悟 鈴木
Michinobu Inoue
道信 井上
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Toshiba Corp
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Toshiba Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a lighting device capable of improving productivity by automatization, and to provide a manufacturing method thereof.SOLUTION: A lighting device includes a case, a plurality of light-emitting modules, and conductors. The plurality of light-emitting modules are arranged on the case. The conductors electrically connect the neighboring light-emitting modules among the plurality of light-emitting modules. Each of the plurality of light-emitting modules has a mounting substrate, and light-emitting elements. The mounting substrate: has through-holes reached to the back face from a front face and separated from the case; and comes in contact with the case. The light-emitting elements are arranged on the mounting substrate, and are supplied with power via the through-holes. A part of the conductors is connected with the neighboring light-emitting modules by respectively being inserted into the through-holes of the neighboring light-emitting modules.

Description

本発明の実施形態は、照明装置及びその製造方法に関する。   Embodiments described herein relate generally to a lighting device and a method for manufacturing the same.

近年、照明装置において、照明光源は白熱電球や蛍光灯から省エネルギー・長寿命の光源、例えば発光ダイオード（Light-emitting diode：ＬＥＤ）への置き換えが進んでいる。直管形の照明装置は、ＬＥＤを実装した複数の発光モジュールで構成しているため、低コスト化、生産性向上のために自動化を進める必要がある。   2. Description of the Related Art In recent years, in illumination devices, replacement of incandescent bulbs and fluorescent lamps with light-saving, long-life light sources such as light-emitting diodes (LEDs) has been progressing. Since the straight tube type lighting device is composed of a plurality of light emitting modules mounted with LEDs, it is necessary to promote automation for cost reduction and productivity improvement.

特開２００７−２１２２１２号公報JP 2007-212212 A

本発明の実施形態は、自動化により生産性向上可能な照明装置及びその製造方法を提供する。   Embodiments of the present invention provide a lighting device capable of improving productivity by automation and a manufacturing method thereof.

実施形態によれば、筐体と、複数の発光モジュールと、導電体と、を備えた照明装置が提供される。前記複数の発光モジュールは、前記筐体に接して設けられる。前記導電体は、前記複数の発光モジュールにおける隣接する発光モジュールを電気的に接続する。前記複数の発光モジュールのそれぞれは、実装基板と、発光素子とを有する。前記実装基板は、表面から裏面まで達し前記筐体から離間した貫通孔を有し、前記筐体と接触している。前記発光素子は、前記実装基板上に設けられ、前記貫通孔を介して電源を供給される。前記導電体の一部は、前記隣接する発光モジュールの前記貫通孔のそれぞれに挿入されて接続されている。   According to the embodiment, an illumination device including a housing, a plurality of light emitting modules, and a conductor is provided. The plurality of light emitting modules are provided in contact with the casing. The conductor electrically connects adjacent light emitting modules in the plurality of light emitting modules. Each of the plurality of light emitting modules includes a mounting substrate and a light emitting element. The mounting substrate has a through-hole that extends from the front surface to the back surface and is separated from the housing, and is in contact with the housing. The light emitting element is provided on the mounting substrate and supplied with power through the through hole. A part of the conductor is inserted and connected to each of the through holes of the adjacent light emitting modules.

第１の実施形態に係る照明装置を例示する模式図である。It is a schematic diagram which illustrates the illuminating device which concerns on 1st Embodiment. 第１の実施形態に係る照明装置を例示する斜視図である。It is a perspective view which illustrates the illuminating device which concerns on 1st Embodiment. 第２の実施形態に係る照明装置を例示する模式図である。It is a schematic diagram which illustrates the illuminating device which concerns on 2nd Embodiment. 第３の実施形態に係る照明装置を例示する模式図である。It is a schematic diagram which illustrates the illuminating device which concerns on 3rd Embodiment. 第４の実施形態に係る照明装置を例示する模式図である。It is a schematic diagram which illustrates the illuminating device which concerns on 4th Embodiment. 第５の実施形態に係る照明装置を例示する模式図である。It is a schematic diagram which illustrates the illuminating device which concerns on 5th Embodiment. 第６の実施形態に係る照明装置を例示する模式図である。It is a schematic diagram which illustrates the illuminating device which concerns on 6th Embodiment. 第７の実施形態に係る照明装置の製造方法を例示するフローチャートである。It is a flowchart which illustrates the manufacturing method of the illuminating device which concerns on 7th Embodiment.

以下、実施形態について図面を参照して詳細に説明する。なお、図面は模式的または概念的なものであり、各部分の形状や縦横の寸法の関係、部分間の大きさの比率などは、必ずしも現実のものと同一とは限らない。また、同じ部分を表す場合であっても、図面により互いの寸法や比率が異なって表される場合もある。また、本願明細書と各図において、既出の図に関して前述したものと同様の要素には同一の符号を付して詳細な説明は適宜省略する。   Hereinafter, embodiments will be described in detail with reference to the drawings. The drawings are schematic or conceptual, and the shape of each part, the relationship between vertical and horizontal dimensions, the size ratio between the parts, and the like are not necessarily the same as the actual ones. Further, even when the same part is represented, the dimensions and ratios may be represented differently depending on the drawings. Further, in the present specification and each drawing, the same reference numerals are given to the same elements as those described above with reference to the previous drawings, and detailed description thereof will be omitted as appropriate.

（第１の実施形態）
まず、第１の実施形態について説明する。
図１は、第１の実施形態に係る照明装置を例示する模式図であり、（ａ）は平面図、（ｂ）は（ａ）のＡ−Ａ線断面図、（ｃ）は（ａ）のＢ−Ｂ線断面図である。
図２は、第１の実施形態に係る照明装置を例示する斜視図である。
本実施形態の照明装置１は、直管形の照明装置であり、天井や壁などに設けられた図示しない照明器具に取付けて用いられる。照明装置１は、筐体２と、筐体２に接して設けられた複数の発光モジュール３と、隣接する発光モジュール３を電気的に接続する導電体４、５と、ランプ外郭５１と、口金５２、５３と、を備える。なお、図１においては、図を見やすくするためにランプ外郭５１、口金５２、５３などの記載を省略し、簡略化している。 (First embodiment)
First, the first embodiment will be described.
1A and 1B are schematic views illustrating the lighting device according to the first embodiment, where FIG. 1A is a plan view, FIG. 1B is a cross-sectional view taken along line AA in FIG. 1A, and FIG. It is a BB sectional view taken on the line.
FIG. 2 is a perspective view illustrating the lighting device according to the first embodiment.
The illuminating device 1 of this embodiment is a straight tube illuminating device, and is used by being attached to a lighting fixture (not shown) provided on a ceiling or a wall. The lighting device 1 includes a housing 2, a plurality of light emitting modules 3 provided in contact with the housing 2, conductors 4 and 5 that electrically connect adjacent light emitting modules 3, a lamp shell 51, and a base 52, 53. In FIG. 1, the description of the lamp shell 51, the caps 52 and 53, etc. is omitted for the sake of clarity.

筐体２は、照明装置１における取付け面側の外観を構成するとともに、発光モジュール３を実装する支持体として機能する。筐体２は、例えば絶縁性を有し、断面が半円状に形成される。また、筐体２を金属などの熱伝導性の高い材料で形成すると、発光モジュール３の放熱体として機能させることができる。   The housing 2 functions as a support for mounting the light emitting module 3 as well as constituting the appearance of the mounting surface side of the lighting device 1. The housing 2 has, for example, an insulating property and has a semicircular cross section. Further, when the housing 2 is formed of a material having high thermal conductivity such as metal, it can function as a heat radiating body of the light emitting module 3.

ランプ外郭５１は、照明装置１における光取出面側の外観を構成するとともに、発光モジュール３を保護する枠として機能する。ランプ外郭５１は、例えば光透過性を有する樹脂などで、断面が半円状に形成される。なお、ランプ外郭５１は、筐体２及び発光モジュール３を覆うように断面が円状に形成されてもよい。   The lamp shell 51 constitutes an appearance on the light extraction surface side in the lighting device 1 and functions as a frame for protecting the light emitting module 3. The lamp envelope 51 is made of, for example, a resin having optical transparency, and has a semicircular cross section. The lamp shell 51 may have a circular cross section so as to cover the housing 2 and the light emitting module 3.

複数の発光モジュール３は、筐体２上に長手方向に沿って設けられる。発光モジュール３のそれぞれは、実装基板８と、実装基板８上に実装された発光素子９と、を有し、ねじ１２、１３により筐体２に実装される。   The plurality of light emitting modules 3 are provided on the housing 2 along the longitudinal direction. Each of the light emitting modules 3 includes a mounting substrate 8 and a light emitting element 9 mounted on the mounting substrate 8, and is mounted on the housing 2 by screws 12 and 13.

実装基板８は、例えば、ガラス布ガラス不織布基材エポキシ樹脂銅張積層板（ＣＥＭ−３）、ガラス布基材エポキシ樹脂銅張積層板（ＦＲ−４）などで厚さ１〜１．６ｍｍ程度に構成され、表面から裏面まで達する貫通孔１０、１１を有する。実装基板８は、筐体２にほぼ全面が接触して実装される。   The mounting substrate 8 is, for example, a glass cloth glass nonwoven fabric base epoxy resin copper clad laminate (CEM-3), a glass cloth base epoxy resin copper clad laminate (FR-4), and the like, having a thickness of about 1 to 1.6 mm. And has through holes 10 and 11 extending from the front surface to the back surface. The mounting substrate 8 is mounted with almost the entire surface in contact with the housing 2.

貫通孔１０、１１は、例えば内面が、例えば銅などの導電性材料で被覆されたいわゆるスルーホールであり、口金５２、５３、及び導電体４、５を介して電源が供給される。隣接する発光モジュール３における貫通孔１０、１１の距離が短くなるように、貫通孔１０、１１は、実装基板８の短辺側に設けられる。   The through holes 10 and 11 are so-called through holes whose inner surfaces are covered with a conductive material such as copper, for example, and power is supplied through the caps 52 and 53 and the conductors 4 and 5. The through holes 10 and 11 are provided on the short side of the mounting substrate 8 so that the distance between the through holes 10 and 11 in the adjacent light emitting modules 3 is shortened.

なお、本具体例においては、貫通孔１０、１１における導電性材料による被覆部２２、２３と筐体２とが接触しないように、筐体２に裏側まで達しない凹部２４、２５を設けた構成を例示している。凹部２４、２５は、筐体２の実装基板８と接触する側から、例えば削り加工することにより、形成される。また、筐体２が金属などの導電性の高い材料で形成されている場合でも筐体２に凹部２４、２５を設けずに、例えば貫通孔１０、１１と筐体２との間に絶縁材料を介在させて貫通孔１０、１１の被覆部２２、２３と筐体２とを離間させて、絶縁性を確保してもよい。   In this specific example, the casing 2 is provided with recesses 24 and 25 that do not reach the back side so that the cover portions 22 and 23 made of the conductive material in the through holes 10 and 11 do not contact the casing 2. Is illustrated. The recesses 24 and 25 are formed by, for example, shaving from the side of the housing 2 that contacts the mounting substrate 8. Further, even when the housing 2 is made of a highly conductive material such as metal, the housing 2 is not provided with the recesses 24 and 25, and for example, an insulating material is provided between the through holes 10 and 11 and the housing 2. Insulating properties may be ensured by interposing the cover portions 22 and 23 of the through holes 10 and 11 and the housing 2.

発光素子９は、例えばＬＥＤであり、貫通孔１０、１１から電源を供給されて、ランプ外郭５１に向けて発光する。発光素子９は、ほぼ等間隔に設けられている。なお、発光素子９の数は、電源電圧や光出力などに応じて任意数とすることができる。   The light emitting element 9 is, for example, an LED, and is supplied with power from the through holes 10 and 11 to emit light toward the lamp envelope 51. The light emitting elements 9 are provided at substantially equal intervals. The number of the light emitting elements 9 can be set to an arbitrary number according to the power supply voltage, the light output, and the like.

導電体４、５は、複数の発光モジュールにおける隣接する発光モジュール３を電気的に接続する。導電体４の一部は、隣接する発光モジュール３の貫通孔１０に挿入され、例えば半田などの導電性を有する接合部６により貫通孔１０に接続される。   The conductors 4 and 5 electrically connect adjacent light emitting modules 3 in the plurality of light emitting modules. A part of the conductor 4 is inserted into the through hole 10 of the adjacent light emitting module 3 and connected to the through hole 10 by a conductive joint 6 such as solder.

また、導電体４の一部は、実装基板８上に露出し、貫通孔１０を電気的に接続する。導電体５の一部は、隣接する発光モジュール３の貫通孔１１に挿入され、例えば半田などの導電性を有する接合部７により貫通孔１１に接続される。また、導電体５の一部は、実装基板８上に露出し、貫通孔１１を電気的に接続する。   A part of the conductor 4 is exposed on the mounting substrate 8 and electrically connects the through hole 10. A part of the conductor 5 is inserted into the through hole 11 of the adjacent light emitting module 3 and connected to the through hole 11 by a conductive joint 7 such as solder. A part of the conductor 5 is exposed on the mounting substrate 8 and electrically connects the through hole 11.

なお、導電体４、５は、それぞれ貫通孔１０、１１に挿入された部分（挿入部）を接合部６、７により接合できればよく、例えば銅を含む金属などの導電材料で一体として形成されてもよく、複数の異なる導電材料で形成されてもよく、また絶縁材料の表面を導電性材料で被覆して形成されてもよい。また、導電体４、５の、挿入部以外の部分、例えば実装基板８上に露出した部分（露出部）、例えば挿入部と露出部の境界部分の形状は、任意である。   The conductors 4 and 5 only need to be able to join the portions (insertion portions) inserted into the through holes 10 and 11 by the joining portions 6 and 7, respectively. For example, the conductors 4 and 5 are integrally formed of a conductive material such as a metal containing copper. Alternatively, it may be formed of a plurality of different conductive materials, or may be formed by covering the surface of the insulating material with a conductive material. Further, the shape of the conductors 4 and 5 other than the insertion portion, for example, the portion exposed on the mounting substrate 8 (exposed portion), for example, the boundary portion between the insertion portion and the exposed portion is arbitrary.

照明装置１においては、導電体４、５の挿入部と露出部とは、それぞれほぼ直線形状に形成され、挿入部と露出部との境界部分においてほぼ直角に屈曲した、いわゆるＵ字形状に形成された導電体４、５の構成を例示している。上記構成以外にも、挿入部及び露出部は、例えば曲線的に湾曲してもよく、角度を持って屈曲してもよい。また、挿入部と露出部との境界部分は、曲線的に湾曲してもよい。   In the lighting device 1, the insertion portions and the exposed portions of the conductors 4 and 5 are each formed in a substantially linear shape, and are formed in a so-called U-shape that is bent at a substantially right angle at the boundary portion between the insertion portion and the exposed portion. The structure of the made conductors 4 and 5 is illustrated. In addition to the above configuration, the insertion portion and the exposed portion may be curved, for example, in a curved line or bent with an angle. Further, the boundary portion between the insertion portion and the exposed portion may be curved in a curved manner.

また、導電体４、５は、同一形状でなくてもよい。なお、導電体４、５の貫通孔１０、１１に挿入されている部分（挿入部）の長さは実装基板８の厚さよりも短く、導電体４、５は、筐体２に接触していない。導電体４、５の挿入部の端部は、例えば０．５ｍｍ程度筐体２から離間している。   Further, the conductors 4 and 5 do not have to have the same shape. In addition, the length of the portion (insertion portion) inserted into the through holes 10 and 11 of the conductors 4 and 5 is shorter than the thickness of the mounting substrate 8, and the conductors 4 and 5 are in contact with the housing 2. Absent. The ends of the insertion portions of the conductors 4 and 5 are separated from the housing 2 by, for example, about 0.5 mm.

複数の発光モジュール３を電気的に接続するためには、導電体４、５の替わりに、例えば表面実装コネクタを用いることもできる。しかし、コネクタを用いた場合は、勘合手作業が必要となるため自動化が困難であり供給能力を上げることができない。またコネクタや手作業による半田付けのコストがかかる。また、コネクタの低背化には限界があるため発光素子からの光出力が遮蔽されコネクタが影になる可能性がある。また、コネクタを配置したために発光素子を等間隔に配置することができず、光出力が不均一になる可能性もある。   In order to electrically connect the plurality of light emitting modules 3, for example, surface mount connectors can be used instead of the conductors 4 and 5. However, when a connector is used, it is difficult to automate because the fitting work is required, and the supply capacity cannot be increased. In addition, there is a cost for connectors and manual soldering. Further, since there is a limit to the reduction in the height of the connector, there is a possibility that the light output from the light emitting element is shielded and the connector becomes a shadow. Further, since the connectors are arranged, the light emitting elements cannot be arranged at equal intervals, and there is a possibility that the light output becomes non-uniform.

また、実装基板８の表面にランドを設けて電源リードを半田付けする場合は、電源リードの位置決めが困難であり、自動化には特殊な半田付け装置が必要になるなど自動化が容易ではない。   Further, when a land is provided on the surface of the mounting substrate 8 and the power supply lead is soldered, it is difficult to position the power supply lead, and automation is not easy because a special soldering device is required for automation.

これに対して、本実施形態においては、導電体４、５は、例えばジャンパ線を用いることができるため、自動化により生産性向上が可能である。また、導電体４、５は、低背化可能で配置面積も小さいため、発光素子９からの光出力の影になることはなく、また発光素子９を等間隔に配置する際の邪魔にならない。その結果、均一な光出力を得ることができる。   On the other hand, in this embodiment, since the conductors 4 and 5 can use a jumper wire, for example, productivity can be improved by automation. Further, since the conductors 4 and 5 can be reduced in height and have a small arrangement area, the conductors 4 and 5 do not become a shadow of light output from the light emitting element 9 and do not interfere with the arrangement of the light emitting elements 9 at equal intervals. . As a result, uniform light output can be obtained.

また、筐体２として、例えば金属などの熱伝導性の高い材料を含めて、発光モジュール３の放熱性を高めることができる。   Moreover, as the housing | casing 2, the heat dissipation of the light emitting module 3 can be improved including a material with high heat conductivity, such as a metal, for example.

（第２の実施形態）
次に、第２の実施形態について説明する。
図３は、第２の実施形態に係る照明装置を例示する模式図であり、（ａ）は平面図、（ｂ）は（ａ）のＣ−Ｃ線断面図、（ｃ）は（ａ）のＤ−Ｄ線断面図である。
本実施形態の照明装置１ａは、第１の実施形態の照明装置と比較して、筐体２及び発光モジュール３の構成が異なっている。すなわち、本実施形態の照明装置１ａは、筐体２に凹部２４、２５が設けられておらず、また発光モジュール３の替わりに発光モジュール３ａを備えている。なお、図３においては、図を見やすくするためにランプ外郭５１、口金５２、５３などの記載を省略し、簡略化している。また、以下の他の実施形態においても、同様にランプ外郭５１、口金５２、５３などの記載を省略する。 (Second Embodiment)
Next, a second embodiment will be described.
3A and 3B are schematic views illustrating the lighting device according to the second embodiment, where FIG. 3A is a plan view, FIG. 3B is a cross-sectional view taken along the line CC in FIG. 3A, and FIG. It is the DD sectional view taken on the line.
The illuminating device 1a of this embodiment differs in the structure of the housing | casing 2 and the light emitting module 3 compared with the illuminating device of 1st Embodiment. That is, the illumination device 1 a according to the present embodiment is not provided with the recesses 24 and 25 in the housing 2, and includes the light emitting module 3 a instead of the light emitting module 3. In FIG. 3, the description of the lamp shell 51, the caps 52, 53, and the like is omitted and simplified for easy understanding of the drawing. In the following other embodiments as well, description of the lamp shell 51, the caps 52, 53, and the like is omitted.

発光モジュール３ａは、発光モジュール３と比較して、実装基板８にさらに凹部１４、１５が設けられた実装基板８ａを有している。上記以外の構成は、第１の実施形態の構成と同様である。
凹部１４、１５は、貫通孔１０、１１を囲み、筐体２に臨んで筐体２との接触面よりもくぼんでいる。凹部１４、１５は、実装基板８ａの筐体２と接触する側から、例えばドリル加工して貫通孔１０、１１を機械的に除去することにより形成される。 Compared with the light emitting module 3, the light emitting module 3 a has a mounting substrate 8 a in which the recesses 14 and 15 are further provided in the mounting substrate 8. The configuration other than the above is the same as the configuration of the first embodiment.
The recesses 14 and 15 surround the through holes 10 and 11 and face the housing 2, and are recessed from the contact surface with the housing 2. The recesses 14 and 15 are formed by mechanically removing the through holes 10 and 11 by, for example, drilling from the side of the mounting substrate 8a that contacts the housing 2.

本実施形態においては、貫通孔１０、１１と筐体２との間に凹部１４、１５が設けられているため、筐体２が導電性を有する場合、例えば金属などで構成されている場合でも、凹部２４、２５を設けずに筐体２と導電体４、５との絶縁性を確保することができる。その結果、導電体４、５は短絡せずに発光モジュール３ａに電源を供給することができる。   In the present embodiment, since the recesses 14 and 15 are provided between the through holes 10 and 11 and the housing 2, even when the housing 2 has conductivity, for example, when it is made of metal or the like. Insulation between the housing 2 and the conductors 4 and 5 can be ensured without providing the recesses 24 and 25. As a result, the conductors 4 and 5 can supply power to the light emitting module 3a without short-circuiting.

また、筐体２として、例えば金属などの熱伝導性の高い材料を含めた場合でも、凹部１４、１５を加工の容易な実装基板８ａに設けるため、作業効率が改善される。
上記以外の本実施形態の効果については、第１の実施形態と同様である。 Further, even when the housing 2 includes a material having high thermal conductivity such as metal, the recesses 14 and 15 are provided on the mounting substrate 8a that can be easily processed, so that the working efficiency is improved.
About the effect of this embodiment other than the above, it is the same as that of 1st Embodiment.

（第３の実施形態）
図４は、第３の実施形態に係る照明装置を例示する模式図であり、（ａ）は平面図、（ｂ）は（ａ）のＥ−Ｅ線断面図、（ｃ）は（ａ）のＦ−Ｆ線断面図である。
本実施形態の照明装置１ｂは、第２の実施形態の照明装置１ａと比較して、発光モジュール３ａの構成が異なっている。すなわち、本実施形態の照明装置１ｂは、発光モジュール３ａの替わりに発光モジュール３ｂを備えている。 (Third embodiment)
4A and 4B are schematic views illustrating the lighting device according to the third embodiment, where FIG. 4A is a plan view, FIG. 4B is a cross-sectional view taken along line EE of FIG. 4A, and FIG. It is the FF sectional view taken on the line.
The illuminating device 1b of this embodiment differs in the structure of the light emitting module 3a compared with the illuminating device 1a of 2nd Embodiment. That is, the illuminating device 1b of this embodiment is provided with the light emitting module 3b instead of the light emitting module 3a.

発光モジュール３ｂは、発光モジュール３ａと比較して、実装基板８ａにおける凹部１４、１５の構成が異なっている。すなわち、発光モジュール３ｂは、実装基板８ａにおける凹部１４、１５を凹部１４ａに置き換えた実装基板８ｂを有している。上記以外の構成は、第２の実施形態の照明装置１ａの構成と同様である。   The light emitting module 3b differs in the structure of the recessed parts 14 and 15 in the mounting substrate 8a compared with the light emitting module 3a. That is, the light emitting module 3b includes a mounting substrate 8b in which the recesses 14 and 15 in the mounting substrate 8a are replaced with the recesses 14a. The configuration other than the above is the same as the configuration of the illumination device 1a of the second embodiment.

凹部１４ａは、貫通孔１０、１１を囲み、実装基板８ｂの短手方向に沿って、筐体２に臨んで筐体２との接触面よりもくぼんでいる。
凹部１４ａは、実装基板８ｂの筐体２と接触する側から、例えば貫通孔１０、１１を囲んで実装基板８ｂの一部を座ぐり、厚さ方向に途中まで削り取ることにより形成される。 The recess 14a surrounds the through holes 10 and 11 and faces the housing 2 along the short direction of the mounting substrate 8b, and is recessed from the contact surface with the housing 2.
The concave portion 14a is formed by, for example, surrounding part of the through-holes 10 and 11 from the side of the mounting substrate 8b that contacts the housing 2 and scavenging a part of the mounting substrate 8b and scraping it halfway in the thickness direction.

本実施形態においても、貫通孔１０、１１と筐体２との間に凹部１４、１５が設けられているため、筐体２が導電性を有する場合、例えば金属などで構成されている場合でも、筐体２と導電体４、５との絶縁性を確保することができる。その結果、発光モジュール３ｂに電源を供給することができる。
上記以外の本実施形態の効果については、第２の実施形態と同様である。 Also in this embodiment, since the recesses 14 and 15 are provided between the through holes 10 and 11 and the housing 2, even when the housing 2 has conductivity, for example, when it is made of metal or the like. Insulation between the housing 2 and the conductors 4 and 5 can be ensured. As a result, power can be supplied to the light emitting module 3b.
About the effect of this embodiment other than the above, it is the same as that of 2nd Embodiment.

（第４の実施形態）
図５は、第４の実施形態に係る照明装置を例示する模式図であり、（ａ）は平面図、（ｂ）は（ａ）のＧ−Ｇ線断面図、（ｃ）は（ａ）のＨ−Ｈ線断面図である。
本実施形態の照明装置１ｃは、第３の実施形態の照明装置１ｂと比較して、筐体２の構成が異なっている。すなわち、本実施形態の照明装置１ｃは、筐体２の替わりに筐体２ａを備えている。 (Fourth embodiment)
5A and 5B are schematic views illustrating the lighting device according to the fourth embodiment. FIG. 5A is a plan view, FIG. 5B is a cross-sectional view taken along line GG in FIG. 5A, and FIG. It is a HH sectional view taken on the line.
The illuminating device 1c of this embodiment differs in the structure of the housing | casing 2 compared with the illuminating device 1b of 3rd Embodiment. In other words, the lighting device 1 c according to the present embodiment includes a housing 2 a instead of the housing 2.

筐体２ａは、筐体２と比較して、貫通孔１０、１１の周辺で実装基板８に接触し、貫通孔１０、１１に臨んで実装基板８との接触面よりもくぼんだ溝部１６、１７を有する点が異なる。さらにまた、筐体２ａは、実装基板８よりも熱伝導性が高く、例えば金属などを含む材料で、例えば押し出し成形などにより形成することができる点が異なる。この場合、図５（ｃ）に表したように、断面形状が同一で、貫通孔１０、１１に臨んで実装基板８との接触面よりもくぼんだ構成になる。また、筐体２ａにおけるくぼんだ溝部１６、１７は、実装基板８をねじ止めする位置に合わせてねじ溝と共用してもよい。なお、筐体２ａは、貫通孔１０、１１に臨んだ部分が実装基板８との接触面よりもくぼんでいればよく、長手方向の全体に渡ってくぼんだ溝部１６、１７を設けなくてもよい。   The housing 2a is in contact with the mounting substrate 8 around the through holes 10 and 11 as compared to the housing 2, and faces the through holes 10 and 11 and has a groove 16 that is recessed from the contact surface with the mounting substrate 8. The difference is that it has 17. Furthermore, the housing 2a is higher in thermal conductivity than the mounting substrate 8, and is different in that it can be formed by, for example, extrusion molding using a material containing metal or the like. In this case, as illustrated in FIG. 5C, the cross-sectional shape is the same, and the configuration facing the through holes 10 and 11 is recessed from the contact surface with the mounting substrate 8. Further, the recessed grooves 16 and 17 in the housing 2a may be shared with the screw grooves in accordance with the position where the mounting substrate 8 is screwed. Note that the housing 2a only needs to be recessed from the contact surface with the mounting substrate 8 at the portions facing the through holes 10 and 11, and it is not necessary to provide the grooves 16 and 17 that are recessed in the entire longitudinal direction. Good.

本実施形態においては、筐体２ａにくぼんだ溝部１６、１７が設けられているため、筐体２ａが導電性を有する場合、例えば金属などで構成されている場合でも、筐体２ａと導電体４、５との絶縁性を確保することができ、導電体４、５は短絡せずに発光モジュール３に電源を供給することができる。また、筐体２ａにくぼんだ溝部１６、１７が設けられているため、筐体に接触しないようにすれば、導電体４、５の貫通孔に挿入される長さは実装基板の厚さよりも長くても良い。その結果、導電体４、５の加工及び組み立てに要する精度が低減されるため、さらに生産性向上が可能である。
上記以外の本実施形態の効果については、第３の実施形態と同様である。 In the present embodiment, since the recessed grooves 16 and 17 are provided in the housing 2a, the housing 2a and the conductor are formed even when the housing 2a has conductivity, for example, when it is made of metal or the like. 4 and 5 can be ensured, and the conductors 4 and 5 can supply power to the light emitting module 3 without being short-circuited. Further, since the recessed grooves 16 and 17 are provided in the housing 2a, the length inserted into the through holes of the conductors 4 and 5 is larger than the thickness of the mounting substrate so as not to contact the housing. It may be long. As a result, the accuracy required for processing and assembling the conductors 4 and 5 is reduced, so that productivity can be further improved.
About the effect of this embodiment other than the above, it is the same as that of 3rd Embodiment.

（第５の実施形態）
図６は、第５の実施形態に係る照明装置を例示する模式図であり、（ａ）は平面図、（ｂ）は（ａ）のＩ−Ｉ線断面図、（ｃ）は（ａ）のＪ−Ｊ線断面図である。
本実施形態の照明装置１ｄは、第４の実施形態の照明装置１ｃと比較して、発光モジュール３の構成が異なっている。すなわち、本実施形態の照明装置１ｄは、発光モジュール３の替わりに発光モジュール３ａを備えている。 (Fifth embodiment)
6A and 6B are schematic views illustrating the lighting device according to the fifth embodiment, in which FIG. 6A is a plan view, FIG. 6B is a cross-sectional view taken along the line II in FIG. 6A, and FIG. It is the JJ sectional view taken on the line.
The illuminating device 1d of this embodiment differs in the structure of the light emitting module 3 compared with the illuminating device 1c of 4th Embodiment. That is, the illuminating device 1 d of the present embodiment includes a light emitting module 3 a instead of the light emitting module 3.

発光モジュール３ａは、第２の実施形態の照明装置１ａにおける発光モジュール３ａと同様である。すなわち、第４の実施形態の照明装置１ｃにおける実装基板８にさらに凹部１４、１５が設けられた実装基板８ａを有している。上記以外の構成は、第４の実施形態の構成と同様である。
上記のとおり、凹部１４、１５は、貫通孔１０、１１を囲み、筐体２に臨んで筐体２との接触面よりもくぼんでいる。凹部１４、１５は、実装基板８ａの筐体２と接触する側から、例えばドリル加工して、貫通孔１０、１１を機械的に除去することにより形成される。 The light emitting module 3a is the same as the light emitting module 3a in the illumination device 1a of the second embodiment. In other words, the mounting substrate 8 in the lighting device 1c of the fourth embodiment has the mounting substrate 8a in which the recesses 14 and 15 are further provided. The configuration other than the above is the same as the configuration of the fourth embodiment.
As described above, the recesses 14 and 15 surround the through holes 10 and 11, face the housing 2, and are recessed from the contact surface with the housing 2. The recesses 14 and 15 are formed by mechanically removing the through holes 10 and 11, for example, by drilling from the side of the mounting substrate 8 a that contacts the housing 2.

本実施形態においては、貫通孔１０、１１と筐体２との間に凹部１４、１５が設けられているため、筐体２が導電性を有する場合、例えば金属などで構成されている場合でも、筐体２と導電体４、５との絶縁性を確保することが容易であり、発光モジュール３ａに電源を供給することができる。また、筐体２ａにくぼんだ溝部１６、１７が設けられているため、筐体に接触しないようにすれば、導電体４、５の貫通孔に挿入される長さは実装基板の厚さよりも長くても良い。その結果、導電体４、５の加工及び組み立てに要する精度が低減されるため、さらに生産性向上が可能である。
上記以外の本実施形態の効果については、第４の実施形態と同様である。 In the present embodiment, since the recesses 14 and 15 are provided between the through holes 10 and 11 and the housing 2, even when the housing 2 has conductivity, for example, when it is made of metal or the like. It is easy to ensure insulation between the housing 2 and the conductors 4 and 5, and power can be supplied to the light emitting module 3a. Further, since the recessed grooves 16 and 17 are provided in the housing 2a, the length inserted into the through holes of the conductors 4 and 5 is larger than the thickness of the mounting substrate so as not to contact the housing. It may be long. As a result, the accuracy required for processing and assembling the conductors 4 and 5 is reduced, so that productivity can be further improved.
About the effect of this embodiment other than the above, it is the same as that of 4th Embodiment.

（第６の実施形態）
図７は、第６の実施形態に係る照明装置を例示する模式図であり、（ａ）は平面図、（ｂ）は（ａ）のＫ−Ｋ線断面図、（ｃ）は（ａ）のＬ−Ｌ線断面図である。
本実施形態の照明装置１ｅは、第４の実施形態の照明装置１ｃと比較して、発光モジュール３ａ及び導電体４、５の構成が異なっている。すなわち、本実施形態の照明装置１ｅは、発光モジュール３ａ及び導電体４、５の替わりにそれぞれ発光モジュール３ｂ、３ｃ、導電体４ａを備えている。 (Sixth embodiment)
FIG. 7: is a schematic diagram which illustrates the illuminating device which concerns on 6th Embodiment, (a) is a top view, (b) is the KK sectional view taken on the line (a), (c) is (a). It is the LL sectional view taken on the line.
The illuminating device 1e of this embodiment differs in the structure of the light emitting module 3a and the conductors 4 and 5 compared with the illuminating device 1c of 4th Embodiment. That is, the illuminating device 1e of this embodiment is provided with the light emitting modules 3b and 3c and the conductor 4a instead of the light emitting module 3a and the conductors 4 and 5, respectively.

発光モジュール３ｂは、第３の実施形態における発光モジュール３ｂと同様であり、発光モジュール３ａの実装基板８ａにおける凹部１４、１５を凹部１４ａに置き換えた実装基板８ｂを有している。   The light emitting module 3b is the same as the light emitting module 3b in the third embodiment, and has a mounting substrate 8b in which the recesses 14 and 15 in the mounting substrate 8a of the light emitting module 3a are replaced with the recesses 14a.

発光モジュール３ｃは、発光モジュール３ｂと比較して、凹部１４ａの構成及び貫通孔１８、１９、配線２０、２１が追加されている点が異なる。すなわち、発光モジュール３ｃは、発光モジュール３ｂの実装基板８ｂにおける凹部１４ａの替わりに凹部１４ｃが設けられている。上記以外の構成は、第４の実施形態の照明装置１ｃの構成と同様である。   The light emitting module 3c is different from the light emitting module 3b in that the configuration of the recess 14a and through holes 18, 19 and wirings 20, 21 are added. That is, the light emitting module 3c is provided with a recess 14c instead of the recess 14a in the mounting substrate 8b of the light emitting module 3b. The configuration other than the above is the same as the configuration of the illumination device 1c of the fourth embodiment.

凹部１４ｃは、貫通孔１０、１１を囲み、実装基板８ｃの短手方向に沿って、筐体２と反対側に設けられている。発光モジュール３ｂの凹部１４ａと、発光モジュール３ｃの凹部１４ｂとは互いに重なり、発光モジュール３ｂの貫通孔１０、１１と発光モジュール３ｃの貫通孔１０、１１とは、直線上に配置される。凹部１４ｂは、実装基板８ｃの筐体２と反対側から、例えば貫通孔１０、１１を囲んで実装基板８ｃの一部を座ぐり、厚さ方向に途中まで削り取ることにより形成される。   The recess 14c surrounds the through holes 10 and 11, and is provided on the opposite side of the housing 2 along the short direction of the mounting substrate 8c. The recess 14a of the light emitting module 3b and the recess 14b of the light emitting module 3c overlap each other, and the through holes 10 and 11 of the light emitting module 3b and the through holes 10 and 11 of the light emitting module 3c are arranged on a straight line. The recess 14b is formed by, for example, surrounding part of the through-holes 10 and 11 from the side opposite to the housing 2 of the mounting substrate 8c, scavenging a part of the mounting substrate 8c, and scraping halfway in the thickness direction.

貫通孔１８、１９は、貫通孔１０、１１と同様に、例えば内面が、例えば銅などの導電性材料で被覆されたいわゆるスルーホールである。貫通孔１０と貫通孔１８とは、それぞれの導電性の被覆部が配線２０で接続される。貫通孔１１と貫通孔１９とは、それぞれの導電性の被覆部が配線２１で接続される。実装基板８ｃ上の発光素子９は、貫通孔１８、１９を介して電源が供給される。なお、配線２０、２１は、筐体２ａのくぼんだ溝部１６、１７とほぼ並行に設けられ、筐体２ａとの絶縁性が確保されている。   The through holes 18 and 19 are so-called through holes in which, for example, the inner surface is covered with a conductive material such as copper, for example, like the through holes 10 and 11. The through-hole 10 and the through-hole 18 are connected to each other by a conductive wire 20. The through-hole 11 and the through-hole 19 are connected to each other by a conductive wire covering portion 21. The light emitting element 9 on the mounting substrate 8 c is supplied with power through the through holes 18 and 19. Note that the wirings 20 and 21 are provided substantially in parallel with the recessed grooves 16 and 17 of the housing 2a to ensure insulation from the housing 2a.

導電体４ａ、５ａは、複数の発光モジュールにおける隣接する発光モジュール３ｂ、３ｃを電気的に接続する。導電体４ａの一部は、隣接する発光モジュール３ｂ、３ｃの貫通孔１０に挿入され、例えば半田などの導電性を有する接合部６ａにより貫通孔１０に接続される。   The conductors 4a and 5a electrically connect adjacent light emitting modules 3b and 3c in the plurality of light emitting modules. A part of the conductor 4a is inserted into the through hole 10 of the adjacent light emitting modules 3b and 3c, and is connected to the through hole 10 by a joint 6a having conductivity such as solder.

また、導電体４ａの一部は、実装基板８ｂ上に露出している。導電体５ａの一部は、隣接する発光モジュール３ｂ、３ｃの貫通孔１１に挿入され、例えば半田などの導電性を有する接合部７ａにより貫通孔１１に接続される。また、導電体５ａの一部は、実装基板８ｂ上に露出している。   A part of the conductor 4a is exposed on the mounting substrate 8b. A part of the conductor 5a is inserted into the through hole 11 of the adjacent light emitting modules 3b and 3c, and is connected to the through hole 11 by a joint 7a having conductivity such as solder. Further, a part of the conductor 5a is exposed on the mounting substrate 8b.

なお、導電体４ａ、５ａは、それぞれ貫通孔１０、１１に挿入された部分（挿入部）を接合部６ａ、７ａにより接合できればよく、例えば銅を含む金属などの導電材料で一体として形成されてもよく、複数の導電材料で形成されてもよく、また、絶縁材料の表面を導電性材料で被覆して形成されてもよい。また、導電体４ａ、５ａにおける挿入部以外の部分、例えば実装基板８ｂ上に露出した部分（露出部）の形状は任意である。例えば、照明装置１ｅにおいては、導電体４ａ，５ａの挿入部及び露出部は、それぞれほぼ直線形状に形成された構成を例示している。   The conductors 4a and 5a only need to be able to join portions (insertion portions) inserted into the through holes 10 and 11 by the joining portions 6a and 7a, respectively. For example, the conductors 4a and 5a are integrally formed of a conductive material such as a metal containing copper. Alternatively, it may be formed of a plurality of conductive materials, or may be formed by covering the surface of the insulating material with a conductive material. Further, the shape of the conductors 4a and 5a other than the insertion portion, for example, the portion exposed on the mounting substrate 8b (exposed portion) is arbitrary. For example, in the illuminating device 1e, the insertion part and exposed part of the conductors 4a and 5a have illustrated the structure formed in the substantially linear shape, respectively.

上記構成以外にも、挿入部及び露出部は、例えば曲線的に湾曲してもよく、角度を持って屈曲してもよい。また、導電体４ａ、５ａは、同一形状でなくてもよい。なお、導電体４ａ、５ａの貫通孔１０、１１に挿入されている部分（挿入部）の長さは実装基板８ｂ、８ｃの厚さよりも短くてもよく、また筐体２ａに達しなければ実装基板８ｂ、８ｃの厚さよりも長くてもよい。   In addition to the above configuration, the insertion portion and the exposed portion may be curved, for example, in a curved line or bent with an angle. Further, the conductors 4a and 5a need not have the same shape. The lengths of the portions (insertion portions) inserted into the through holes 10 and 11 of the conductors 4a and 5a may be shorter than the thickness of the mounting boards 8b and 8c. It may be longer than the thickness of the substrates 8b and 8c.

本実施形態においては、隣接する発光モジュール３ｂ、３ｃの貫通孔１０、１１が直線状に配置されるため、導電体４ａ、５ａは、例えばＴ字状のピンを用いることができ、例えばジャンパ線を用いる場合よりも部材が簡易である。
上記以外の本実施形態の効果については、第４の実施形態と同様である。 In the present embodiment, since the through holes 10 and 11 of the adjacent light emitting modules 3b and 3c are linearly arranged, the conductors 4a and 5a can use, for example, T-shaped pins, for example, jumper wires The member is simpler than the case where is used.
About the effect of this embodiment other than the above, it is the same as that of 4th Embodiment.

（第７の実施形態）
図８は、第７の実施形態に係る照明装置の製造方法を例示するフローチャートである。
図８においては、複数の発光モジュールを接続して照明装置を製造する方法を表している。以下、主に第１の実施形態の照明装置１を製造する場合を例として、照明装置の製造方法について説明するが、適宜他の実施形態の照明装置の製造方法についても説明する。 (Seventh embodiment)
FIG. 8 is a flowchart illustrating the method for manufacturing the lighting device according to the seventh embodiment.
FIG. 8 shows a method of manufacturing a lighting device by connecting a plurality of light emitting modules. Hereinafter, although the manufacturing method of an illuminating device is mainly demonstrated to the case where the illuminating device 1 of 1st Embodiment is manufactured as an example, the manufacturing method of the illuminating device of other embodiment is also demonstrated suitably.

まず、発光モジュール３の実装基板８を必要に応じて加工する（ステップＳ１）。例えば、実装基板８の筐体２と接触する側からドリル加工などにより貫通孔１０、１１を機械的に除去して凹部１４、１５を形成する。また、例えば、実装基板８の筐体２と接触する側から、貫通孔１０、１１を囲んで実装基板８の一部を座ぐり、厚さ方向に途中まで削り取って凹部１４ａを形成してもよい。さらにまた、例えば、実装基板８の筐体２と反対側から、貫通孔１０、１１を囲んで実装基板８の一部を座ぐり、厚さ方向に途中まで削り取って凹部１４ｂを形成してもよい。   First, the mounting substrate 8 of the light emitting module 3 is processed as necessary (step S1). For example, the through holes 10 and 11 are mechanically removed from the side of the mounting substrate 8 in contact with the housing 2 by drilling or the like to form the recesses 14 and 15. Further, for example, from the side of the mounting substrate 8 that contacts the housing 2, a part of the mounting substrate 8 is surrounded by surrounding the through holes 10 and 11, and the concave portion 14 a is formed by scraping halfway in the thickness direction. Good. Furthermore, for example, from the opposite side of the housing 2 of the mounting substrate 8, a part of the mounting substrate 8 is surrounded by surrounding the through holes 10 and 11, and the recess 14 b is formed by scraping halfway in the thickness direction. Good.

筐体２、発光モジュール３などを用意する（ステップＳ２）。
筐体２は、例えば断面が半円状に形成される。また、筐体２には、発光モジュール３を実装するためのねじ溝を形成しておいてもよい。発光モジュール３には、貫通孔１０、１１を有する実装基板８上に発光素子９が設けられている。 The housing 2, the light emitting module 3 and the like are prepared (step S2).
For example, the housing 2 has a semicircular cross section. Further, the housing 2 may be formed with a thread groove for mounting the light emitting module 3. In the light emitting module 3, a light emitting element 9 is provided on a mounting substrate 8 having through holes 10 and 11.

次に、発光モジュール３などを筐体２に実装する（ステップＳ３）。例えば、ねじ１２、１３を用いて、発光モジュール３の実装基板８を筐体２にねじ止めする。実装基板８は、筐体２に接触して実装される。
次に、隣接する発光モジュール３の貫通孔１０、１１間に導電体４、５を挿入する（ステップＳ４）。 Next, the light emitting module 3 and the like are mounted on the housing 2 (step S3). For example, the mounting substrate 8 of the light emitting module 3 is screwed to the housing 2 using screws 12 and 13. The mounting substrate 8 is mounted in contact with the housing 2.
Next, the conductors 4 and 5 are inserted between the through holes 10 and 11 of the adjacent light emitting modules 3 (step S4).

次に、導電体４、５を貫通孔１０、１１に半田付けする（ステップＳ５）。これにより、発光モジュール３の発光素子９に貫通孔１０、１１を介して電源を供給することができる。   Next, the conductors 4 and 5 are soldered to the through holes 10 and 11 (step S5). Thereby, power can be supplied to the light emitting element 9 of the light emitting module 3 through the through holes 10 and 11.

本実施形態においては、導電体４、５として、例えばジャンパ線やピンを用いることができるため、挿入や半田付けする際の位置決めが容易であり、自動化による生産性向上が可能である。   In the present embodiment, for example, jumper wires or pins can be used as the conductors 4 and 5, so that positioning during insertion or soldering is easy, and productivity can be improved by automation.

以上、具体例を参照しつつ実施形態について説明したが、それらに限定されるものではなく、種々の変形が可能である。
例えば、第１の実施形態の具体例として構成を例示した照明装置１においては、筐体２の替わりに、第４の実施形態の具体例として構成を例示した照明装置１ｃにおける筐体２ａが設けられてもよい。また、照明装置１ｃにおていは、筐体２ａの替わりに、凹部２４、２５が設けられた筐体２で構成することもできる。 As described above, the embodiments have been described with reference to specific examples. However, the embodiments are not limited thereto, and various modifications are possible.
For example, in the lighting device 1 whose configuration is illustrated as a specific example of the first embodiment, a housing 2a in the lighting device 1c whose configuration is illustrated as a specific example of the fourth embodiment is provided instead of the housing 2. May be. Moreover, in the illuminating device 1c, it can also be comprised with the housing | casing 2 in which the recessed parts 24 and 25 were provided instead of the housing | casing 2a.

本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。   Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

１、１ａ、１ｂ、１ｃ、１ｄ、１ｅ…照明装置、 ２、２ａ…筐体、 ３、３ａ、３ｂ、３ｃ…発光モジュール、 ４、４ａ、５、５ａ…導電体、 ６、６ａ、７、７ａ…半田、 ８、８ａ、８ｂ、８ｃ…実装基板、 ９…発光素子、 １０、１１、１８、１９…貫通孔、 １４、１４ａ、１４ｂ、１４ｃ…凹部（実装基板の凹部）、 １６、１７…溝部、 ２０、２１…配線、 ２２、２３…被覆部、 ２４、２５…凹部（筐体の凹部）、 ５１…ランプ外郭、 ５２…口金   DESCRIPTION OF SYMBOLS 1, 1a, 1b, 1c, 1d, 1e ... Lighting apparatus, 2, 2a ... Housing | casing, 3, 3a, 3b, 3c ... Light emitting module, 4, 4a, 5, 5a ... Conductor, 6, 6a, 7, 7a ... solder, 8, 8a, 8b, 8c ... mounting substrate, 9 ... light emitting element, 10, 11, 18, 19 ... through hole, 14, 14a, 14b, 14c ... recessed portion (recessed portion of the mounting substrate), 16, 17 ... groove part, 20, 21 ... wiring, 22, 23 ... covering part, 24, 25 ... recessed part (recessed part of casing), 51 ... lamp outer shell, 52 ... base

Claims (5)

筐体と、
前記筐体上に設けられた複数の発光モジュールと、
前記複数の発光モジュールにおける隣接する発光モジュールを電気的に接続する導電体と、
を備え、
前記複数の発光モジュールのそれぞれは、
表面から裏面まで達し前記筐体から離間した貫通孔を有し、前記筐体と接触した実装基板と、
前記実装基板上に設けられ、前記貫通孔を介して電源を供給される発光素子と、
を有し、
前記導電体の一部は、前記隣接する発光モジュールの前記貫通孔のそれぞれに挿入されて接続されている照明装置。 A housing,
A plurality of light emitting modules provided on the housing;
A conductor for electrically connecting adjacent light emitting modules in the plurality of light emitting modules;
With
Each of the plurality of light emitting modules is
A through-hole that reaches from the front surface to the back surface and is spaced apart from the housing; and a mounting substrate that contacts the housing;
A light emitting element provided on the mounting substrate and supplied with power through the through hole;
Have
The lighting device in which a part of the conductor is inserted and connected to each of the through holes of the adjacent light emitting modules. 前記実装基板は、前記貫通孔を囲み、前記筐体に臨んで前記筐体との接触面よりもくぼんだ凹部を有する請求項１記載の照明装置。   The lighting device according to claim 1, wherein the mounting substrate has a recess that surrounds the through hole and that faces the housing and is recessed from a contact surface with the housing. 前記筐体は、前記実装基板よりも熱伝導性が高く、前記貫通孔の周辺で前記実装基板に接触し、前記貫通孔に臨んで前記実装基板との接触面よりもくぼんでいる請求項１または２に記載の照明装置。   The case has a higher thermal conductivity than the mounting substrate, contacts the mounting substrate around the through hole, and is recessed from a contact surface with the mounting substrate facing the through hole. Or the illuminating device of 2. 前記隣接する発光モジュールの前記貫通孔は、直線上に配置されている請求項３記載の照明装置。   The lighting device according to claim 3, wherein the through holes of the adjacent light emitting modules are arranged on a straight line. 表面から裏面まで達する貫通孔を有する実装基板と、前記実装基板上に設けられ前記貫通孔を介して電源を供給される発光素子と、をそれぞれ有する複数の発光モジュールを有する照明装置の製造方法であって、
前記複数の発光モジュールを筐体上にそれぞれ実装し、
前記複数の発光モジュールにおける隣接する発光モジュールの前記貫通孔に導電体を挿入し、
前記導電体における前記貫通孔に挿入された部分を前記貫通孔に半田付けして、前記隣接する発光モジュールの前記貫通孔を電気的に接続する照明装置の製造方法。 A method of manufacturing a lighting device having a plurality of light emitting modules each having a mounting substrate having a through hole extending from the front surface to the back surface, and a light emitting element provided on the mounting substrate and supplied with power through the through hole. There,
Mounting each of the plurality of light emitting modules on a housing;
Inserting a conductor into the through hole of the adjacent light emitting module in the plurality of light emitting modules;
The manufacturing method of the illuminating device which solders the part inserted in the said through-hole in the said conductor to the said through-hole, and electrically connects the said through-hole of the said adjacent light emitting module.
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