TWM585429U - SIM card package structure and lead frame therefor - Google Patents

Abstract

A SIM card packaging structure includes a plurality of connection pads. A connection wire area is located between the plurality of connection pads. The connection wire area includes a plurality of first connection wires and a plurality of second connection wires. Corresponding pads are extended, and a plurality of second connection wires are extended from the corresponding first connection wires; at least one chip is located in the connection wire area and is received by the first connection wires and the second connection wires; The chip is electrically connected to at least one of the pad, the first connection wire and the second connection wire by a lead wire; the sealing compound covers all the components so that only a part of the pad is exposed; in addition, the lead frame used includes A plurality of pads and a connection wire area. The plurality of pads are located on both sides of the connection wire area. The connection wire area includes a plurality of first connection wires and a plurality of second connection wires. The first connection wires are corresponding pads. Extending, a plurality of second connection wires extend from two sides of the corresponding first connection wire.

Description

SIM card packaging structure and used lead frame

This creation is a technical field of a SIM card packaging structure, and in particular refers to designing a set of lead frames to carry a chip and forming a SIM card packaging structure.

Known Subscriber Identity Module (SIM), usually called a "SIM card", is a smart chip card that is mainly used to store user identification data, text messages, and phone numbers. As shown in FIG. 1, the conventional SIM card packaging structure adopts a packaging substrate method, and a plurality of wafers 12 and a plurality of electronic components 14 are disposed on a printed circuit board 11. The number and functions of the chip 12 and the electronic component 14 depend on their specifications. In addition, a plurality of leads 15 are used to electrically connect the metal pad 111 on the printed circuit 11 and the chip 12. Finally, the printed circuit board 11 is covered by the sealing compound, so that only the metal electrical contacts at the bottom are exposed. However, the manufacturing process of the packaging substrate is more complicated and expensive.

In order to solve the above problems, the main purpose of this creation is to provide a SIM card packaging structure and the lead frame used. The main purpose is to provide a lead frame to carry the chip and electronic components, simplify the subsequent packaging process, and shorten the SIM card packaging structure. Development schedule and reduced development costs.

In order to achieve the above purpose, the present invention is a SIM card packaging structure including a plurality of pads; a connection wire area is located between the plurality of pads, and the connection wire area includes a plurality of first connection wires and a plurality of second connections Wires; the first connection wires are extended from the corresponding pads, and a plurality of second connection wires are extended from the corresponding first connection wires; at least one chip is located in the connection wire area and is formed by the first connection wires and the second A plurality of leads are received by the connecting wires; the chip is electrically connected to at least one of the pad, the first connecting wire and the second connecting wire by the leads; the sealing compound is covered by the pad, the lead, the first connecting wire, the first Two connecting wires and the chip and exposing a part of the pad.

Furthermore, the lead frame used in the creation of the packaging structure of the SIM card includes a plurality of pads and a connection lead area. The plurality of pads are located on both sides of the connection lead area. The connection lead area includes a plurality of first connection leads and a plurality of connection leads. A second connection wire; the first connection wire extends from the corresponding pad, and the second connection wire extends from both sides of the corresponding first connection wire.

In the embodiment of the present invention, it further includes a substrate, the wafer is located on the substrate, the substrate is located in the connection wire area and is carried by the first connection wire and the second connection wire, the substrate has related lines and a plurality of substrate pads, and the substrate The lead wire is electrically connected to at least one of the chip, the pad, the first connection wire, and the second connection wire.

In the embodiment of the present invention, the chip is located on the pad, and the chip is electrically connected to at least one of the substrate, the pad, the first connection wire, and the second connection wire by a lead.

In the embodiment of the present invention, the pad has at least one of at least one upper concave region, at least one lower concave region, and the like.

The following is a more detailed description of the implementation of this creation with drawings and component symbols, so that those skilled in the art can implement it after studying this manual.

As shown in FIG. 2 and FIG. 3, it is a perspective view of the lead frame 2 used in the creation of the SIM card packaging structure. The lead frame 2 includes a plurality of pads 21 and a connecting lead area 22 (the area shown by an imaginary line in the figure). A plurality of pads 21 are located on both sides of the connection lead region 22. The connection wire area 22 includes a plurality of first connection wires 221 and a plurality of second connection wires 222. The first connection wires 221 extend from the corresponding pads 21. The plurality of second connection wires 222 extend from both sides of the corresponding first connection wires 221. In other words, each pad 21 is connected to at least one first connection wire 221, and a plurality of second connection wires 222 are connected outward from both sides of the first connection wire 221, and two adjacent pads 21 will not contact each other. .

In this embodiment, the connection wire region 22 is used to carry a chip, and is composed of a first connection wire 221 and a second connection wire 222. The large-area load is more stable. The chip is electrically connected to the contact pad 21 and the first connection wire 221 and the second connection wire 222 to which the chip 21 is located. In this creation, the extended first connection wire 221 and the second connection wire 222 are used, so that the length of the lead wire can be shortened and the location is easier to connect. In addition, the second connection wire 222 is located on both sides of the first connection wire 221, which can ensure that the subsequent sealing compound flows in the same direction from the pad 21 to the first connection wire 221 and the second connection wire 222 during the packaging process, so that the flow velocity is not even, Holes are generated in the sealing gel after encapsulation.

In addition, the pad 21 has at least one upper concave region 211 and at least one lower concave region 212. The upper recessed region 211 and the lower recessed region 212 are formed into a desired shape in a half-etching manner during processing. The shape of the recessed area 212 will make the area of the pad 21 exposed after packaging (shown in FIG. 6). This method is to meet the standard specifications of the SIM card. In addition, the first connection wires 221 and the second connection wires 222 can also be formed into a desired shape by half-etching.

Next, a description will be given of the SIM card packaging structure formed by using this creative lead frame:

As shown in FIG. 4, it is a plan view of the first embodiment of the creative SIM card packaging structure without a sealing compound filled therein. As shown in FIG. 5, it is a cross-sectional view after filling the sealant (a cross-sectional view in the AA direction in FIG. 4). The creative SIM card packaging structure includes a plurality of pads 21. A connecting wire region 22 is located between the plurality of pads 21. The connection wire region 22 includes a plurality of first connection wires 221 and a plurality of second connection wires 222. The first connecting wire 221 extends from the corresponding pad 21. The plurality of second connection wires 222 extend from the corresponding first connection wires 221. The at least one chip 30 is located in the connection wire region 22 and is received by the first connection wire 221 and the second connection wire 222. The plurality of leads 40 and the chip 30 are electrically connected to at least one of the pad 21, the first connection lead 221 and the second connection lead 222 by the lead 40. The sealing compound 50 covers the contact pad 21, the lead 40, the first connection lead 221, the second connection lead 222, and the chip 30, and a part of the contact pad 21 is exposed, as shown in FIG. The exposed area of the pad 21 must meet the standard specifications of the SIM card.

As shown in FIG. 7, it is a plan view of the second embodiment of the creative SIM card packaging structure without a sealing compound filled therein. The lead frame used in this embodiment is the same as the embodiment in FIG. 4, except that a substrate 60 is added. The substrate 60 is a circuit board and has related circuits and a plurality of substrate pads 61. The wafer 30 is disposed on a substrate 60. The substrate 60 is disposed in the connection wire region 22 and is received by the first connection wire 221 and the second connection wire 222. The plurality of leads 40 are electrically connected to the wafer 30 and the substrate pad 61 on the substrate 60, or are electrically connected to the first connection wire 221 by the substrate pad 61, or are electrically connected to the second connection by the substrate pad 61. The lead 222 is electrically connected to the pad 21 by the substrate pad 61. As a result, the length of the lead 40 can be shortened, or the lead 40 can be connected in an optimal position or a convenient processing position.

As shown in FIG. 8, it is a plan view of the third embodiment of the creative SIM card packaging structure without filling the sealing compound. The lead frame used in this embodiment is the same as the embodiment in FIG. 7, except that a chip 31 is additionally provided on the pad 21. The chip 31 may also be electrically connected to the pad 21, the first connection wire 221, the second connection wire 222, and the substrate pad 61 via a plurality of leads 40. This method is also beneficial for shortening the length of the lead 40.

Compared with the existing technology, this creation has the following specific effects:
1. Compared with the conventional technology using the material of the substrate, the packaging structure of the SIM card and the lead frame used in this creation can reduce the cost.
2. In the creative SIM card packaging structure and the lead frame used, the second connection wire is divided on both sides of the first connection wire to form an area for receiving a wafer or a substrate to stably carry the wafer or the substrate.
3. In this creative SIM card packaging structure and the lead frame used, the second connection lead is located on both sides of the first connection lead. During the plastic packaging process, the sealing compound flows from each pad to the first connection lead and the second connection lead It can be consistent at all times to avoid uneven flow velocity, which will cause holes in the sealant of the SIM card packaging structure.
4. In this creative SIM card packaging structure and the lead frame used, the second connection wire is located on both sides of the first connection wire, which can shorten the length of the lead wire connecting the chip or the substrate to the pad. The second connection wire is passed to the pad.

To sum up, the packaging structure of the SIM card and the lead frame used in this creation are made of the special design of the lead frame, which can be easily manufactured and shaped, reducing the development cost. And can provide another packaging method for customers to choose, save processing costs, meet the requirements of patent applications.

The above are merely preferred embodiments of the present invention, and are not intended to limit the scope of the present embodiment. That is, all equal changes and modifications made in accordance with the scope of the patent application for this creation are covered by the scope of patent for this creation.

11‧‧‧printed circuit board

111‧‧‧metal pads

12‧‧‧Chip

14‧‧‧Electronic components

15‧‧‧ Lead

2‧‧‧ lead frame

21‧‧‧ pad

211‧‧‧concave area

212‧‧‧ recessed area

22‧‧‧Connecting lead area

221‧‧‧First connecting wire

222‧‧‧Second connection wire

30‧‧‧Chip

31‧‧‧Chip

40‧‧‧ Lead

50‧‧‧ seal colloid

60‧‧‧ substrate

61‧‧‧Substrate pad

FIG. 1 is a plan view of a conventional SIM card packaging structure without filling a sealing gel;
Figure 2 is a perspective view of the top angle of the creative lead frame;
FIG. 3 is a perspective view of a bottom view of the creative lead frame;
FIG. 4 is a plan view of a first embodiment of a creative SIM card packaging structure without filling a sealing compound; FIG.
5 is an enlarged sectional view of the AA plane of FIG. 4;
6 is a perspective view of a first embodiment of a creative SIM card packaging structure;
FIG. 7 is a plan view of a second embodiment of a creative SIM card packaging structure without filling a sealing compound; FIG.
FIG. 8 is a plan view of a third embodiment of a creative SIM card packaging structure without filling a sealing compound; FIG.

Claims (7)

A SIM card packaging structure includes: at least one pad; at least one first connection wire and at least one second connection wire, the first connection wire is extended from the corresponding pad, and the second connection The wire extends from the corresponding first connection wire; at least one chip is carried by the first connection wire and the second connection wire; at least one lead is electrically connected to the chip by the lead At least one of the pad, the first connection wire, and the second connection wire; a sealing compound covering the pad, the lead, the first connection wire, and the second connection The wires and the chip, and a part of the pad is exposed. According to the SIM card packaging structure described in the first item of the patent application scope, a plurality of the second connection wires are extended from both sides of the first connection wire. The SIM card packaging structure according to item 1 of the scope of patent application, further comprising a substrate on which the wafer is located, and the substrate is carried by the first connection wire and the second connection wire. The substrate has a circuit and at least one substrate pad, and the substrate pad is electrically connected to at least one of the wafer, the pad, the first connection wire, and the second connection wire by the leads. One. The SIM card packaging structure according to item 3 of the patent application scope, further comprising another chip located on the pad, and the other chip is electrically connected to the substrate, the pad, and the pad by the leads. At least one of a first connection wire and the second connection wire. According to the SIM card packaging structure described in item 1 of the scope of patent application, the pad has at least one of an upper recessed area and at least one lower recessed area. A lead frame used in a SIM card packaging structure includes: a plurality of pads and a connection lead area, the plurality of pads are located on both sides of the connection lead area, and the connection lead area includes a plurality of first A plurality of the first connection wires and a plurality of the second connection wires; the plurality of the first connection wires are extended from the corresponding plurality of the pads; Extended sideways. According to the lead frame used in the SIM card packaging structure described in item 6 of the patent application scope, the pad has at least one of an upper recessed area and at least one lower recessed area.