TWM584999U - 電連接器之接地結構 - Google Patents

電連接器之接地結構 Download PDF

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Publication number
TWM584999U
TWM584999U TW108208660U TW108208660U TWM584999U TW M584999 U TWM584999 U TW M584999U TW 108208660 U TW108208660 U TW 108208660U TW 108208660 U TW108208660 U TW 108208660U TW M584999 U TWM584999 U TW M584999U
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Taiwan
Prior art keywords
base
contact
docking
grounding
electrical connector
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TW108208660U
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English (en)
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陳俊元
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宏致電子股份有限公司
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Priority to TW108208660U priority Critical patent/TWM584999U/zh
Publication of TWM584999U publication Critical patent/TWM584999U/zh
Priority to US16/896,692 priority patent/US11171453B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6596—Specific features or arrangements of connection of shield to conductive members the conductive member being a metal grounding panel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7082—Coupling device supported only by cooperation with PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/6485—Electrostatic discharge protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6582—Shield structure with resilient means for engaging mating connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6592—Specific features or arrangements of connection of shield to conductive members the conductive member being a shielded cable
    • H01R13/6593—Specific features or arrangements of connection of shield to conductive members the conductive member being a shielded cable the shield being composed of different pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H01R13/6595—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members with separate members fixing the shield to the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2107/00—Four or more poles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement

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  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

本創作為有關一種電連接器之接地結構，該座體之基座表面上設有對接部，並於對接部周圍處設有固定部，再於基座上定位有複數端子，且複數端子一端分別設有延伸至對接部處之接觸端，而另端則分別設有延伸出座體外且供連接於電路板上之連接端，再於座體上定位有接地件，且接地件至少一側壁面設有第一接觸部，而第一接觸部另側設有供定位於固定部上之定位部，且接地件底部設有供連接於電路板上之焊接部，又於座體上罩設有屏蔽殼體，且屏蔽殼體至少一側壁面設有與第一接觸部接觸之第二接觸部，其因接地件為與屏蔽殼體接觸形成共同接地迴路，所以當複數端子傳輸高頻訊號時，可透過接地件來將雜訊導出至電路板，以有效抑制或濾除電磁波及串音干擾，藉此提升訊號傳輸之穩定性。

Description

電連接器之接地結構
本創作係提供一種電連接器之接地結構，尤指電連接器上之接地件為與屏蔽殼體接觸形成接地迴路，當複數端子傳輸高頻訊號時，即可透過接地件來將雜訊導出至電路板，以有效抑制或濾除訊號傳輸時產生之電磁波干擾及串音干擾，藉此提升整體訊號傳輸之穩定性。
按，現今科技發展快速，各式各樣的電子裝置不斷發展，其中，在各種電子裝置的內部多係為各種相互電性連接之電子元件，進而可透過電子訊號於各電子元件傳輸、運算或處理等，藉以完成該電子裝置之各種功能。
在前述電子裝置中，用以傳輸二電路板間電子訊號之板對板連接器技術則是被廣泛應用，前述板對板連接器之母座連接器或公頭連接器大多具有一絕緣座體，且該絕緣座體表面設有對接部(如：母座連接器為插接槽，而公頭連接器為舌板)，再於對接部內穿設有貫通至絕緣座體底部之複數傳輸端子，並於實際應用時將絕緣座體底部之複數傳輸端子焊接於電路板上，使得電路板上之電路佈局電性連接於各傳輸端子，進而依此方式於二電路板上分別安裝有相對應型式之板對板連接器，以藉由二板對板連接器之相互插接來使得二電路板上之電路佈局相互電性連接，以 供電子裝置於使用時進行電子訊號之傳輸。
然而，隨著現今各式電子裝置內部之電子訊號傳輸速度上升，進而造成板對板連接器內各傳輸端子於傳輸電子訊號時之高頻傳輸阻抗也隨之升高，以致於傳輸電子訊號時會產電磁波干擾(EMI)及串音干擾，導致電子訊號傳輸品質不穩定、異常，藉此無法正常執行功能。
是以，如何降低板對板連接器於傳輸電子訊號之高頻傳輸阻抗、電磁波及串音干擾，即為從事此行業之相關廠商所亟欲研究改善之方向所在者。
故，創作人有鑑於上述之問題與缺失，乃蒐集相關資料，經由多方評估及考量，並以從事於此行業累積之多年經驗，經由不斷試作及修改，始設計出此種電連接器之接地結構之新型誕生。
本創作之主要目的乃在於該座體之基座表面上設有對接部，而基座表面上且位於對接部周圍處設有固定部，並於座體之基座上定位有複數端子，且複數端子一端分別設有延伸至對接部處之接觸端，而複數端子另端分別設有延伸出座體外且供電性連接於預設電路板上之連接端，再於座體上定位有接地件，並於接地件至少一側壁面上設有第一接觸部，而接地件相對於第一接觸部另側處設有供定位於固定部上之定位部，且接地件底部設有供電性連接於預設電路板上之焊接部，又於座體上罩設有屏蔽殼體，並於屏蔽殼體之收納空間縱向設有供對接部露出之開口，再於屏蔽殼體至少一側壁面上設有與第一接觸部相互接觸之第二接觸部，其因接地件為與屏蔽殼體接觸形成共同接地迴路，所以當複數端子傳輸高頻訊號 時，其屏蔽殼體即會形成良好的屏蔽作用，並透過接地件之焊接部來將雜訊濾除導出至預設電路板，以提升整體接地性，進而有效抑制或濾除訊號傳輸時產生之電磁波干擾及串音干擾，藉此達到使整體訊號傳輸的品質更為穩定且可靠之目的。
本創作之次要目的乃在於該接地件為可透過第一接觸部之複數凸點來與屏蔽殼體第二接觸部之複數凹槽扣持定位，以提升接觸時的穩定性，進而達到增加接地品質穩定性之目的。
本創作之另一目的乃在於該屏蔽殼體內部包括有內殼體，並於內殼體底部前、後二側處分別朝外彎折有間隔設置之複數接觸片，當屏蔽殼體組裝於座體時，其內殼體即可透過複數接觸片來接觸屏蔽殼體形成共同接地迴路，以提升接地傳導的路徑與密度，且確實將訊號傳輸時所產生之電磁波及串音干擾向外導出，進而達到使整體訊號傳輸的品質更為穩定且可靠之目的。
本創作之再一目的乃在於該母座連接器與公頭連接器對接時，其母座連接器屏蔽殼體之內殼體為與公頭連接器屏蔽殼體之複數接觸件相互接觸形成接地迴路，以提升接地傳導的路徑與密度，進而確實將電磁波及串音干擾向外導出，藉此達到使整體訊號傳輸的品質更佳穩定之目的。
本創作之又一目的乃在於該屏蔽殼體為可將複數端子之連接端完全罩覆住，以形成良好的屏蔽作用，進而有效抑制或濾除訊號傳輸時產生之電磁波干擾及串音干擾，藉此達到提升整體訊號傳輸時穩定性之目的。
1‧‧‧座體
11‧‧‧基座
12‧‧‧對接部
120‧‧‧對接槽
121‧‧‧對接塊
122‧‧‧舌板
13‧‧‧固定部
131‧‧‧穿孔
132‧‧‧扣槽
14‧‧‧扣塊
141‧‧‧導斜面
15‧‧‧卡槽
16‧‧‧限位槽
2‧‧‧端子
21‧‧‧接觸端
22‧‧‧連接端
3‧‧‧接地件
30‧‧‧容置空間
31‧‧‧第一接觸部
311‧‧‧凸點
32‧‧‧定位部
321‧‧‧板體
322‧‧‧卡持片
33‧‧‧焊接部
331‧‧‧焊接片
4‧‧‧屏蔽殼體
40‧‧‧收納空間
401‧‧‧開口
41‧‧‧第二接觸部
411‧‧‧凹槽
42‧‧‧扣片
43‧‧‧內殼體
430‧‧‧收納槽
431‧‧‧缺口
432‧‧‧接觸片
4321‧‧‧接觸臂
44‧‧‧接觸件
第一圖 係為本創作母座連接器之立體外觀圖。
第二圖 係為本創作母座連接器之立體分解圖。
第三圖 係為本創作母座連接器另一視角之立體分解圖。
第四圖 係為本創作公頭連接器之立體外觀圖。
第五圖 係為本創作公頭連接器之立體分解圖。
第六圖 係為本創作公頭連接器另一視角之立體分解圖。
第七圖 係為本創作母座連接器與公頭連接器對接後之側視剖面圖。
第八圖 係為本創作母座連接器與公頭連接器對接後另一視角之側視剖面圖。
為達成上述目的及功效，本創作所採用之技術手段及其構造，茲繪圖就本創作之較佳實施例詳加說明其特徵與功能如下，俾利完全瞭解。
請參閱第一、二、三、四、五、六、七、八圖所示，係為本創作母座連接器之立體外觀圖、母座連接器之立體分解圖、母座連接器另一視角之立體分解圖、公頭連接器之立體外觀圖、公頭連接器之立體分解圖、公頭連接器另一視角之立體分解圖、母座連接器與公頭連接器對接後之側視剖面圖及母座連接器與公頭連接器對接後另一視角之側視剖面圖，由圖中可清楚看出，本創作係包括座體1、複數端子2、接地件3及屏蔽殼體4，其中： 該座體1為具有呈矩形之基座11，並於基座11表面上設有對接部12，而基座11表面上且位於對接部12周圍處設有固定部13，且固定部13位於對接部12左、右二側處分別設有上、下貫穿之穿孔131，再於穿孔131至少一側壁面上設有扣槽132，而座體1前、後二側處形成有複數扣塊14，且各扣塊14頂面處形成有傾斜狀之導斜面141。
該複數端子2一端為分別延伸有接觸端21，而複數端子2另端分別形成有連接端22。
該接地件3內部為形成有容置空間30，並於接地件3至少一側壁面上設有第一接觸部31，且第一接觸部31位於容置空間30相對二內側面設有間隔設置之複數凸點311，而接地件3相對於第一接觸部31另側處設有定位部32，且定位部32位於接地件3左、右二側處分別設有朝上延伸之板體321，再於板體321上設有卡持片322，又於接地件3底部設有焊接部33，而焊接部33具有至少一個朝下延伸之焊接片331。
該屏蔽殼體4內部為形成有收納空間40，並於收納空間40縱向設有貫穿之開口401，而屏蔽殼體4至少一側壁面上設有第二接觸部41，且第二接觸部41位於屏蔽殼體4相對二外側面設有間隔設置之複數凹槽411，再於收納空間40前、後二側面形成有複數扣片42。
上述之電連接器為母座連接器型式時，該座體1之對接部12為可位於基座11內部凸設有對接塊121，並於對接塊121內部 形成有對接槽120，且基座11表面位於對接部12前、後二側處分別設有間隔設置之複數卡槽15，而該屏蔽殼體4內部進一步包括有內殼體43，並於內殼體43內部形成有收納槽430，且收納槽430縱向設有貫穿之缺口431，再於內殼體43底部前、後二側處分別朝外彎折有間隔設置之複數接觸片432，而接觸片432內部形成有朝上延伸之接觸臂4321。
當本創作母座連接器型式之電連接器於組裝時，為可先將複數端子2利用塑料以鑲嵌射出(Insert Molding)的方式一體成型出座體1，該複數端子2一端之接觸端21為向上延伸至座體1的對接部12之對接槽120內部，而複數端子2另端之連接端22則向下延伸出座體1外部呈一外露，並將接地件3從座體1下方處向上裝設，其接地件3定位部32之二板體321即會插入於座體1固定部13之二穿孔131中，且該板體321上之卡持片322便會扣持於對接部12之扣槽132內呈一定位，以使接地件3穩固組裝於座體1上，再將內殼體43罩設於對接部12之對接塊121上，其對接塊121即會位於內殼體43之收納槽430內，而該內殼體43之缺口431便與對接部12之對接槽120形成對正，即可再將屏蔽殼體4罩設於座體1之基座11上，進而使基座11位於屏蔽殼體4之收納空間40內，並使座體1之對接部12及內殼體43穿出至收納空間40之開口401外側，此時，該屏蔽殼體4之複數扣片42即會抵持於座體1複數扣塊14之導斜面141上，便可將複數端子2之連接端22及接地件3的焊接部33之焊接片331焊設於預設電路板(圖中未示出)的複數接點上，再向下按壓 屏蔽殼體4，以使複數扣片42沿著導斜面141導引位移，藉此扣持固定在複數扣塊14上，進而使屏蔽殼體4完全將複數端子2之連接端22完全遮覆住，同時，該接地件3的第一接觸部31之複數凸點311便會扣入於屏蔽殼體4的第二接觸部41之複數凹槽411中，且該收納空間40頂面便會與內殼體43之複數接觸片432的接觸臂4321接觸，從而完成母座連接器型式之電連接器組裝。
再者，上述之電連接器為公頭連接器型式時，該座體1之對接部12為可位於基座11內部凸設有舌板122，且該座體1之基座11位於對接部12前、後二側處分別設有間隔設置之複數限位槽16，而該屏蔽殼體4收納空間40之開口401前、後二側處分別設有間隔設置之複數接觸件44。
當本創作公頭連接器型式之電連接器於組裝時，為可先將複數端子2利用塑料以鑲嵌射出的方式一體成型出座體1，該複數端子2一端之接觸端21為向上延伸至座體1的對接部12之舌板122二側面，而複數端子2另端之連接端22則向下延伸出座體1外部呈一外露，並將接地件3從座體1下方處向上裝設，其接地件3定位部32之二板體321即會插入於座體1固定部13之二穿孔131中，且該板體321上之卡持片322便會扣持於對接部12之扣槽132內呈一定位，以使接地件3穩固組裝於座體1上，再將屏蔽殼體4罩設於座體1之基座11上，進而使基座11位於屏蔽殼體4之收納空間40內，此時，該屏蔽殼體4之複數扣片42即會抵持於座體1複數扣塊14之導斜面141上，便可將複數端子2之連接端22及接地件3的焊接部33之焊接片331焊 設於另一預設電路板(圖中未示出)的複數接點上，即可再向下按壓屏蔽殼體4，以使複數扣片42沿著導斜面141導引位移，藉此扣持固定在複數扣塊14上，進而使屏蔽殼體4完全將複數端子2之連接端22完全遮覆住，同時，該接地件3的第一接觸部31之複數凸點311便會扣入於屏蔽殼體4的第二接觸部41之複數凹槽411中，且該屏蔽殼體4之複數接觸件44插入至座體1之複數限位槽16內，即可完成公頭連接器型式之電連接器組裝。
上述母座連接器或公頭連接器的複數端子2較佳實施為利用塑料以鑲嵌射出的方式分別共同包覆射出成型出座體1，但於實際應用時，並非是以此作為侷限，其亦可依實際需求或結構設計不同採用鑲嵌射出一體成型或組裝的方式與絕緣座體1結合定位。
再者，上述母座連接器與公頭連接器的複數端子2之連接端22及焊接部33之焊接片331為分於焊設於預設電路板(圖中未示出)上，且複數端子2之連接端22及焊接部33之焊接片331與預設電路板之間的焊接方式為可利用表面黏著技術(SMT)或是穿出預設電路板之穿孔式(Through Hole)進行焊接。
而當本創作之母座連接器與公頭連接器相互對接時，該公頭連接器之座體1為可透過對接部12之舌板122來插入於母座連接器對接部12之對接槽120中，以使母座連接器複數端子2之接觸端21與公頭連接器複數端子2之接觸端21相互接觸形成電性導通狀態，同時，該母座連接器與公頭連接器的屏蔽殼體4即會相互接觸，且該公頭連接器屏蔽殼體4之複數接觸件44便會接觸母座連接器屏蔽殼體4之內殼體 43表面上形成接地迴路，即可提升接地傳導的路徑與密度，並分別利用接地件3來確實將訊號傳輸時所產生之電磁波及串音干擾向外導出。
本創作為具有下列之優點：
(一)該電連接器之座體1上為裝設有接地件3，且該接地件3為與屏蔽殼體4接觸形成共同接地迴路，當複數端子2傳輸高頻訊號時，其屏蔽殼體4即會形成良好的屏蔽作用，並透過接地件3之焊接部33來將雜訊濾除導出至預設電路板，以提升整體接地性，進而有效抑制或濾除訊號傳輸時產生之電磁波干擾(EMI)及串音干擾，藉此使整體訊號傳輸的品質更為穩定且可靠。
(二)該接地件3之第一接觸部31位於容置空間30相對二內側面為設有間隔設置之複數凸點311，而該屏蔽殼體4之第二接觸部41位於屏蔽殼體4相對二外側面設有間隔設置且供複數凸點311扣入之複數凹槽411，其因接地件3為可透過第一接觸部31之複數凸點311來與第二接觸部41之複數凹槽411扣持定位，以提升接觸時的穩定性，進而達到增加接地品質穩定性之效果。
(三)該母座連接器型式之電連接器的屏蔽殼體4內部包括有內殼體43，並於內殼體43底部前、後二側處分別朝外彎折有間隔設置之複數接觸片432，當屏蔽殼體4組裝於座體1時，其內殼體43即可透過複數接觸片432來接觸屏蔽殼體4形成共同接地迴路，以提升接地傳導的路徑與密度，以確實將訊號傳輸時所產生之電磁波及串音干擾向外導出，進而使整體訊號傳輸的品質更為穩定且可靠。
(四)該母座連接器與公頭連接器對接時，其母座連接器 屏蔽殼體4之內殼體43為與公頭連接器屏蔽殼體4之複數接觸件44相互接觸形成接地迴路，即可提升接地傳導的路徑與密度，以確實將訊號傳輸時所產生之電磁波及串音干擾向外導出，進而使整體訊號傳輸的品質更佳穩定。
(五)該屏蔽殼體4為可將複數端子2之連接端22完全罩覆住，以具有良好的屏蔽作用，進而有效抑制或濾除訊號傳輸時產生之電磁波干擾及串音干擾，藉此提升整體訊號傳輸時之穩定性。
上所述僅為本創作之較佳實施例而已，非因此即侷限本創作之專利範圍，故舉凡運用本創作說明書及圖式內容所為之簡易修飾及等效結構變化，均應同理包含於本創作之專利範圍內，合予陳明。
綜上所述，本創作之電連接器之接地結構於使用時，為確實能達到其功效及目的，故本創作誠為一實用性優異之新型，為符合新型專利之申請要件，爰依法提出申請，盼 審委早日賜准本案，以保障創作人之辛苦新型，倘若 鈞局審委有任何稽疑，請不吝來函指示，創作人定當竭力配合，實感德便。

Claims (9)

  1. 一種電連接器之接地結構，係包括座體、複數端子、接地件及屏蔽殼體，其中：該座體為具有基座，並於基座表面上設有對接部，而基座表面上且位於對接部周圍處設有固定部；該複數端子為定位於座體之基座上，且複數端子一端分別設有延伸至對接部處之接觸端，而複數端子另端分別設有延伸出座體外且供電性連接於預設電路板上之連接端；該接地件為定位於座體上，並於接地件至少一側壁面上設有第一接觸部，而接地件相對於第一接觸部另側處設有供定位於固定部上之定位部，再於接地件底部設有供電性連接於預設電路板上之焊接部；該屏蔽殼體內部為形成有供座體置入之收納空間，並於收納空間縱向設有供對接部露出之開口，而屏蔽殼體至少一側壁面上設有與第一接觸部相互接觸之第二接觸部。
  2. 如申請專利範圍第1項所述電連接器之接地結構，其中該座體之對接部為位於基座內部凸設有對接塊，並於對接塊內部形成有供複數端子的接觸端露出之對接槽。
  3. 如申請專利範圍第2項所述電連接器之接地結構，其中該基座表面位於對接部前、後二側處為分別設有間隔設置之複數卡槽，而該屏蔽殼體內部包括有內殼體，並於內殼體內部形成有供罩設於對接塊上之收納槽，且收納槽縱向設有對正於對接槽處之缺口，再於內殼體底部前、後二側處分別朝外彎折有間隔設置且供定位於複數卡槽內之複數接 觸片，而接觸片內部形成有朝上延伸且與屏蔽殼體接觸之接觸臂。
  4. 如申請專利範圍第1項所述電連接器之接地結構，其中該座體之對接部為位於基座內部凸設有供複數端子的接觸端露出之舌板。
  5. 如申請專利範圍第1項所述電連接器之接地結構，其中該座體之基座位於對接部前、後二側處為分別設有間隔設置之複數限位槽，而該屏蔽殼體收納空間之開口前、後二側處分別設有間隔設置供定位於複數限位槽內之複數接觸件。
  6. 如申請專利範圍第1項所述電連接器之接地結構，其中該座體之固定部位於對接部左、右二側處分別為設有上、下貫穿之穿孔，並於穿孔至少一側壁面上設有扣槽，而該定位部位於接地件左、右二側處分別設有供伸入於穿孔內之板體，再於板體上設有供扣持於扣槽中之卡持片。
  7. 如申請專利範圍第1項所述電連接器之接地結構，其中該座體前、後二側處為形成有複數扣塊，且各扣塊頂面處形成有傾斜狀之導斜面，而該收納空間前、後二側面形成有供扣持於複數扣塊上之複數扣片。
  8. 如申請專利範圍第1項所述電連接器之接地結構，其中該接地件內部為形成有供座體置入之容置空間，且接地件之第一接觸部位於容置空間相對二內側面設有間隔設置之複數凸點，而該第二接觸部位於屏蔽殼體相對二外側面設有間隔設置且供複數凸點扣入之複數凹槽。
  9. 如申請專利範圍第1項所述電連接器之接地結構，其中該接地件之焊接部為具有至少一個朝下延伸之焊接片。
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Publication number Priority date Publication date Assignee Title
TWI774017B (zh) * 2020-07-08 2022-08-11 啓碁科技股份有限公司 具有連接器結構之電子裝置
US11839027B2 (en) 2020-07-08 2023-12-05 Wistron Neweb Corp. Electronic device with connector structure

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