TWM583554U - Panel unit with two bonding pads - Google Patents

Abstract

A panel unit with two bonding pads has deployment of two bonding pads at two opposite edges near the same side of the panel cell, which renders the panel unit adaptive for all types of configuration of system components of a panel device as the panel unit can be assembled with the system components via a flexible printed circuit with an orientation of 180 degree rotation if necessary. The ground pins at each bonding pad are also electrically connected directly, forming a closed ESD shielding loop for better protection and noise shielding.

Description

Panel unit with double pad structure

This creation relates to a panel device, especially a panel unit with a double pad structure.

In the conventional structural design of a touch panel or a display panel, all signal traces are concentrated in one corner of the panel, and then a flexible printed circuit board (FPC) is electrically connected through a bonding pad to communicate with the panel device. System-side engagement.

In addition to the majority of customized designs of current touch panels, there are still a few products that use the public version design due to the lower output. These panels use a common version of the panel signal wiring to concentrate and the position of the solder pads for the outgoing line is fixed, for example, on the lower left side or the lower right side of the panel unit. Because the position of the solder pads at the outlet must be avoided from other system components of the panel device to avoid interference, the design of the solder pad outlet depends on the system design of the panel device, and because the system of the panel device cannot be known in advance Design often causes difficulties in the design of public version panels.

For example, suppose a common design is to place the pads of signal wiring on the lower left side of the panel unit. When the lower left side also has system components of the panel device and component interference occurs, the panel unit can be rotated 180 In this way, the solder pad exit line is located on the upper right side. If there are no other system components on the upper right side, the interference problem can be solved smoothly. However, if the system design of the panel device includes both system components on the lower left side and upper right side, such a panel unit with solder pads on the lower left side cannot be used, and the mask or screen must be redesigned.

In order to solve the above problems, a panel unit with a double pad structure is provided in the embodiment of the present invention to meet the design requirements of various panel devices.

In the embodiment of the present invention, a panel unit with a double pad structure includes a face plate unit, a first pad and a second pad. The panel element is surrounded by a first side and a second side opposite to each other and a third side and a fourth side opposite to each other to define the panel element. The panel element has a first signal trace and a second The signal is routed. The first pad is disposed on the first side and adjacent to the third side, and the first signal trace is electrically connected to the first pad. The second solder pad is disposed on the second side, adjacent to the third side and opposite to the first solder pad, and the second signal trace is electrically connected to the second solder pad. The panel component is electrically connected to a flexible circuit board through the first solder pad or the second solder pad to be connected to a system end of the panel device.

According to the embodiment of the present invention, the first signal trace is electrically connected to the first pad by the first edge extension, and the second signal trace is electrically connected to the second pad by the second edge extension.

According to the embodiment of the present invention, the first signal trace is further electrically connected to the first pad by the fourth side extension, and the second signal trace is electrically connected to the second pad by the third side extension. pad.

According to the embodiment of the present invention, the first signal trace is electrically connected to the first solder pad by the third side extension, and the second signal trace is electrically connected to the second solder by the fourth side extension. pad.

According to the embodiment of the present invention, the panel unit further includes an ESD protection trace, which forms a closed loop along the first side, the third side, the second side, and the fourth side in order.

According to the embodiment of the present invention, wherein the first solder pad includes two ground pins, when the first solder pad is electrically connected to the flexible circuit board, the two ground pins are grounded to a system end of the panel device, and the static electricity The protective trace has a first segment, and the first segment is electrically connected to the two ground pins on the first solder pad.

According to the embodiment of the present invention, wherein the second solder pad includes two ground pins, when the second solder pad is electrically connected to the flexible circuit board, the two ground pins are grounded to a system end of the panel device, and the static electricity The protective trace has a second segment, and the second segment is electrically connected to the two ground pins on the second solder pad.

According to the embodiment of the present invention, wherein the panel unit is a touch panel, the first signal wiring and the second signal wiring are touch sensing signal wiring.

According to the embodiment of the present invention, wherein the panel unit is a display panel, the first signal wiring and the second signal wiring are driving and data signal wiring.

The panel unit with double pad structure provided by this creation can make the flexible circuit board at the system end connect with the panel unit in one of the four upper right, lower right, upper left, and lower left positions of the panel unit, breaking the restrictions of the traditional public version design. At the same time, closed electrostatic protection loops are formed on the four sides of the panel components, which can provide better ESD protection and noise isolation.

Certain terms are used in the description and the scope of subsequent patent applications to refer to specific elements. Those with ordinary knowledge in the field should understand that manufacturers may use different terms to refer to the same component. The scope of this specification and subsequent patent applications does not take the difference in names as a way to distinguish components, but rather uses the difference in functions of components as a criterion for distinguishing components. "Inclusion" mentioned throughout the specification and subsequent claims is an open-ended term and should be interpreted as "including but not limited to." In addition, the term "coupled / connected" includes any direct and indirect means of electrical or mechanical connection. Therefore, if a first device is described as being coupled / connected to a second device, it means that the first device can be electrically / mechanically connected to the second device, or indirectly electrically / mechanically through other devices or connection means. To the second device.

Please refer to FIG. 1. FIG. 1 is a schematic diagram of an embodiment of a panel unit with a dual-pad structure. The panel unit 1 includes a panel element 10, a first bonding pad 20 and a second bonding pad 30. The panel unit 10 has a first side 11 and a second side 12 that are opposite and parallel to each other, and a third side 13 and a fourth side 14 that are opposite and parallel to each other, and includes a first side 11, a second side 12, and a third side. 13 and the fourth side 14 collectively surround the outline of the panel unit 10. The panel element 10 is provided with two sets of first signal traces 15 and second signal traces 16 having the same function. In one embodiment, the panel unit 1 may be a touch panel, and the first signal trace 15 and the second signal trace 16 are touch sensing signal lines of a touch panel. In another embodiment, the panel unit 1 can also be a display panel, and the first signal trace 15 and the second signal trace 16 are the driving and data signal lines of the display panel.

In the embodiment of FIG. 1, the first pad 20 is disposed on the first side 11 and is adjacent to the third side 13, and the second pad 30 is disposed on the second side 12 and is also adjacent to the third side 13, in other words , The panel unit 1 of this creation is on the same side of the panel element 10 (here, the side near the third side 13 but also the side near the fourth side 14), that is, the first side 11 The second pad 12 and the second side 12 are provided with opposite pads. The first signal trace 15 is electrically connected to the first pad 20, and the second signal trace 16 is electrically connected to the second pad 30. When the panel unit 1 is connected to a system end of the panel device through a flexible circuit board 50 (as shown in FIG. 2), the flexible circuit board 50 needs to be selectively electrically connected to the first bonding pad depending on the configuration state of the system components. 20 or the second bonding pad 30 can connect the panel unit 1 to the system end.

Please refer to FIG. 1 and FIG. 2, where FIG. 2 is a schematic diagram of the flexible circuit board connected to the first pad or the second pad. The panel unit 1 of the present invention further includes an ESD protection wire 17, which forms a closed loop along the first side 11, the second side 12, the third side 13, and the fourth side 14 in order. The electrostatic protection wiring 17 is connected to the system end of the panel unit 1 through a flexible circuit board 50 to the ground end of the system end to provide electrostatic discharge (ESD) shielding. The specific method is as follows: each of the first pad 20 and the second pad 30 has a plurality of signal pins, and in the embodiment of the present invention, the two outermost signal pins of the first pad 20 are ground pins 21 and 22 The two outermost signal pins of the second bonding pad 30 are ground pins 31 and 32. The ground pins 21, 22, 31, and 32 are connected to the system through the flexible circuit board 50 except when one of the bonding pads is connected to the flexible circuit board 50. In addition to grounding, the ground pins 21 and 22 of the first bonding pad 20 are also connected to the outgoing end of the first bonding pad 20, specifically, the first section 171 of the electrostatic protection wiring 17 is connected to the first bonding pad 20 The outgoing end of the wire is electrically connected to the ground pins 21 and 22; similarly, the ground pins 31 and 32 of the second solder pad 30 are also connected to the outgoing end of the second solder pad 30, that is, the second of the electrostatic protection wiring 17 The segment 172 is electrically connected to the ground pins 31 and 32 at the outgoing end of the second bonding pad 30.

For example, when the panel unit 1 is connected to the system end by connecting the flexible circuit board 50 to the first bonding pad 20, the panel unit 1 performs input or output of control signals through the first signal trace 15, and the electrostatic protection The wire 17 is connected to the system ground through the ground pins 21 and 22 of the first bonding pad 20. Since the electrostatic protection wiring 17 includes a second section 172 at the second pad 30, the ground pins 31 and 32 connected to the second pad 30, and a first section 171 at the first pad 20 also connects to the first The ground pins 21 and 22 of the bonding pad 20 thus form a completely closed loop, which can provide better ESD protection and noise isolation, especially at the bonding pad. Similarly, the embodiment in which the panel unit 1 is connected to the system end by connecting the flexible circuit board 50 to the second solder pad 30 is also the same, and is not repeated here.

Please continue to refer to Figure 1. In the embodiment of FIG. 1, the signal wiring of the panel unit 1 may be: a part of the first signal wiring 15 extends from the first side 11 and is electrically connected to the first bonding pad 20, and the second signal wiring 16 A portion of the first signal trace 15 extends from the second side 12 and is electrically connected to the second pad 30, and another portion of the first signal trace 15 extends from the fourth side 14 to electrically connect to the first pad 20. The other part of the two signal traces 16 extends from the third side 13 and is electrically connected to the second pad 30. However, this creation is not limited to this. Another part of the first signal trace 15 can also be extended from the third side 13 to be electrically connected to the first pad 20, and the other part of the second signal trace 16 is also The fourth side 14 can be extended to be electrically connected to the second pad 30.

Please refer to FIG. 3 to FIG. 6, which are assembly schematic diagrams for the creation of a panel unit with a double pad structure and a system design of various panel devices. Since the panel unit 1 of this creation is provided with solder pad structures on the upper and lower sides of the same side, after the panel unit 1 is rotated 180 degrees, it can cover four positions of upper right, lower right, upper left, and lower left that may be used to connect the flexible circuit board 50 . For example, if the system element 60 of a panel device is configured so that the panel unit 1 must be provided with a pin on the lower right side, the flexible circuit board 50 can be connected to the first solder pad 20 on the lower right side to complete the panel unit 1 and the system end. The connection is as shown in FIG. 3; if the system component 60 of a panel device is configured so that the panel unit 1 must be provided with a pin on the upper right side, the flexible circuit board 50 can be connected to the second solder pad 30 on the upper right side to complete The connection between the panel unit 1 and the system end is shown in Figure 4. If the system element 60 of a panel device is configured so that the panel unit 1 must be provided with a pin on the lower left side, the panel unit 1 can be rotated 180 degrees. Connect the flexible circuit board 50 to the second left pad 30 on the lower left side to complete the connection between the panel unit 1 and the system end, as shown in FIG. 5. Finally, if the system component 60 of a panel device is configured, the panel unit 1 must The upper left side is provided with a needle, and after the panel unit 1 is also rotated 180 degrees, the flexible circuit board 50 is connected to the first left pad 20 at the upper left side to complete the connection between the panel unit 1 and the system end, as shown in FIG. 6. In this way, the panel unit 1 of this creation can meet the system component configuration of the four needle-out positions.

In the panel unit of the dual-pad structure provided in the embodiment of the present invention, a set of pin-out pad structures are provided on the same side of the panel element, and the two pad structures are opposite to each other. The panel unit can be installed by rotating 180 degrees depending on the configuration of the system components of the panel device, so that the flexible circuit board at the system end can be connected to the panel unit at one of the upper right, lower right, upper left, and lower left positions of the panel unit. The version design can only be applied to the problem of half the system configuration. The grounding pins of the pads of the panel unit are electrically connected to each other, and closed electrostatic protection loops are formed on the four sides of the panel element, which can provide better ESD protection and noise isolation.

1‧‧‧ panel unit

10‧‧‧ Panel Components

11‧‧‧ the first side

12‧‧‧ second side

13‧‧‧ Third side

14‧‧‧ Fourth side

15‧‧‧ the first signal line

16‧‧‧Second signal routing

17‧‧‧Static protection wiring

171‧‧‧first paragraph

172‧‧‧paragraph 2

20‧‧‧The first pad

21, 22, 31, 32‧‧‧ ground pins

30‧‧‧Second solder pad

50‧‧‧ flexible circuit board

60‧‧‧System components

FIG. 1 is a schematic diagram of an embodiment of a panel unit with a dual-pad structure.
FIG. 2 is a schematic diagram of the flexible circuit board connected to the first solder pad or the second solder pad.
3 to 6 are assembly schematic diagrams of a panel unit having a dual pad structure and a system design of various panel devices.

Claims (9)

A panel unit with a double solder pad structure includes:
A panel element is surrounded by a first side and a second side opposite to each other and a third side and a fourth side opposite to each other to define the panel element. The panel element has a first signal trace and a first Two signal routing;
A first pad is disposed on the first side and adjacent to the third side, and the first signal trace is electrically connected to the first pad; and a second pad is disposed on the second side and adjacent to the third pad. The third side is opposite to the first pad, and the second signal trace is electrically connected to the second pad;
The panel component is electrically connected to a flexible circuit board through the first solder pad or the second solder pad to be connected to a system end of the panel device. The panel unit according to claim 1, wherein the first signal trace is electrically connected to the first pad by the first edge extension, and the second signal trace is electrically connected to the second electrode by the second edge extension. Pads. The panel unit according to claim 2, wherein the first signal trace is electrically connected to the first pad by the fourth side extension, and the second signal trace is electrically connected to the first pad by the third side extension. Second pad. The panel unit according to claim 2, wherein the first signal trace is further electrically connected to the first pad by the third side extension, and the second signal trace is further electrically connected by the fourth side extension. Second pad. The panel unit according to claim 1, further comprising an ESD protection trace, forming a closed loop along the first side, the third side, the second side, and the fourth side in order. The panel unit according to claim 5, wherein the first solder pad includes two ground pins, and when the first solder pad is electrically connected to the flexible circuit board, the two ground pins are grounded to a system end of the panel device, In addition, the ESD protection trace has a first segment, and the first segment is electrically connected to the two ground pins on the first solder pad. The panel unit according to claim 5, wherein the second pad includes two ground pins, and when the second pad is electrically connected to the flexible circuit board, the two ground pins are grounded to a system end of the panel device, In addition, the ESD protection trace has a second segment, and the second segment is electrically connected to the two ground pins on the second solder pad. The panel unit according to claim 1, wherein the panel unit is a touch panel, the first signal wiring and the second signal wiring are touch-sensitive signal wiring. The panel unit according to claim 1, wherein the panel unit is a display panel, the first signal line and the second signal line are drive and data signal lines.