TWM579723U - Miniature electronic component surface inspection mechanism - Google Patents
Miniature electronic component surface inspection mechanism Download PDFInfo
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Abstract
一種小型電子元件表面檢查機構,其包括基座,以及設置於基座上的輸送帶裝置、影像擷取裝置、靜電產生裝置、吸附裝置與不良品去除裝置,其中,輸送帶結合靜電產生裝置摩擦產生之靜電能導入的小型電子元件吸附定位於輸送帶上,由輸送帶快速載送至影像擷取裝置進影像判斷,另利用吸附裝置對輸送帶提供吸附作用,使輸送帶能平穩地載送小型電子元件移動,且判斷為良品的小型電子元件能被輸送帶載送至出料品,判斷為不良品的小型電子元件能於出料區之前為不良品去除裝置推離輸送帶,為一高效能的小型電子元件表面檢查機構。A small electronic component surface inspection mechanism includes a base, a conveyor belt device disposed on the base, an image capturing device, an electrostatic generating device, an adsorption device, and a defective product removing device, wherein the conveyor belt is combined with the static electricity generating device to rub The generated small electronic components introduced by the electrostatic energy are adsorbed and positioned on the conveyor belt, and are quickly carried by the conveyor belt to the image capturing device for image determination, and the adsorption device is used to adsorb the conveyor belt, so that the conveyor belt can be smoothly carried. A small electronic component that is moved by a small electronic component and can be transported to a discharge by a conveyor belt, and a small electronic component that is determined to be defective can be pushed away from the conveyor belt by the defective product removal device before the discharge zone. High-performance small electronic component surface inspection mechanism.
Description
本新型係關於一種適用於如小尺寸被動電子元件等產品進行表面檢查作業的小型電子元件表面檢查機構。The present invention relates to a small electronic component surface inspection mechanism suitable for surface inspection operations such as small-sized passive electronic components.
為了確保如電容、電阻等小尺寸的小型電子元件等產品的品質,前述小型電子元件除於構裝流程中進行功能性檢測外,於完成構裝後,通常須經過表面檢查機構執行小型電子元件的表面形狀的檢查作業。In order to ensure the quality of products such as small electronic components such as capacitors and resistors, the aforementioned small electronic components are subjected to functional inspection in addition to the assembly process, and after completion of the assembly, it is usually necessary to perform small electronic components through a surface inspection mechanism. The surface shape of the inspection job.
基於小型電子元件的體積小、重量輕,目前小型電子元件的表面形狀的檢查作業皆係將多個小型電子元件放置於一承載盤上,藉由承載盤輸送至電子元件表面檢查機構中進行檢查作業。因小型電子元件位於承載盤中若直接進行取像,易於承載盤阻擋而難以進行全面性影像擷取,故須搭配取置裝置自承載盤上吸取被檢查的電子元件移至攝影鏡頭擷取其表面影像,並由控制系統判斷是否為良品後,再移回承載盤中,若判斷為不良品時,由控制系統記錄不良品位於承載盤中之位置,待承載盤中之每一電子元件完成表面檢查後,移送至表面檢查機構的暫置區,接續執行不良品的去除作業後再送出。The small-sized electronic components are small in size and light in weight. At present, the surface shape inspection of small electronic components is performed by placing a plurality of small electronic components on a carrier tray and transporting them to the surface inspection mechanism of the electronic component through the carrier tray for inspection. operation. Since the small electronic component is directly imaged in the carrier tray, it is easy to carry the disk barrier and it is difficult to perform comprehensive image capturing. Therefore, the electronic component to be inspected is taken from the carrier disk by the taking device and moved to the photographic lens to capture it. The surface image is judged by the control system as a good product and then returned to the carrier. If it is judged to be defective, the control system records that the defective product is located in the carrier, and each electronic component in the carrier is completed. After the surface inspection, it is transferred to the temporary area of the surface inspection mechanism, and then the removal of the defective product is performed and then sent out.
惟前述現有小型電子元件表面檢查機構之使用,因需藉由承載盤載送小型電子元件,並搭配取置裝置執行小型電子元件自承載盤移置攝鏡頭取像後,再送回承載盤之動作,以及後續再去除不良品動作等,造成小型電子元件執行表面檢查作業之效率不佳之問題。However, the use of the existing small electronic component surface inspection mechanism requires a small electronic component to be carried by the carrier tray, and the small electronic component is taken along with the taking device to take the image from the carrier, and then returned to the carrier. And the subsequent removal of defective products, etc., causing poor efficiency in performing surface inspection operations on small electronic components.
本新型之目的在於提供一種小型電子元件表面檢查機構,解決現有小型電子元件須藉由承載盤承載進行電子元件表面檢查作業之作業效率不佳之問題。The purpose of the present invention is to provide a small electronic component surface inspection mechanism, which solves the problem that the existing small electronic components are required to carry out an electronic component surface inspection operation by the carrier disk.
為了達成前述目的,本新型提出了一種小型電子元件表面檢查機構,其包括: 一基座,其界定有沿著橫向依序排列的一入料區、一檢查區、一不良品移除區以及一出料區; 一輸送帶裝置,其裝設於該基座上,並能載運多個電子元件自該入料區朝該出料區方向移動,該輸送帶裝置包括一環圈形的輸送帶以及能驅動該輸送帶的驅動機組,該輸送帶通過該基座的入料區、檢查區、不良品移除區及出料區,該輸送帶具有位置在上的一元件輸送區段以及位置在下的一回程區段,該元件輸送區段與該回程區段皆為橫向且平直的區段; 一影像擷取裝置,其裝設於該基座之檢查區,該影像擷取裝置包括一攝影鏡頭以及至少一發光組件,該攝影鏡頭及所述發光組件皆位於該輸送帶之元件輸送區段的上方,該攝影鏡頭朝向下方的該輸送帶; 一靜電產生裝置,其裝設於基座上且位於該環圈形的輸送帶的內側空間中,該靜電產生裝置包括一上載板、一下載板以及複數壓抵滾輪,該上載板位於該輸送帶的元件輸送區段的底面,該下載板位於該輸送帶的回程區段頂面,該上載板與該下載板皆與該輸送帶摩擦接觸而能產生吸附電子元件的靜電,所述壓抵滾輪係設置於該基座上且分別位於該攝影鏡頭的兩側,所述壓抵滾輪壓抵於該輸送帶的元件輸送區段的頂面; 一吸附裝置,其裝設於基座上且連接該上載板,該吸附裝置用以連接外部的一氣壓源,並能對位於該上載板上方的該輸送帶產生吸附作用;以及 一不良品去除裝置,其裝設於基座的不良品移除區,並能將被判斷為不良品的電子元件推離該輸送帶。 In order to achieve the foregoing objects, the present invention proposes a small electronic component surface inspection mechanism comprising: a pedestal defining a feed zone, an inspection zone, a defective removal zone and a discharge zone arranged in sequence along the lateral direction; a conveyor belt device mounted on the base and capable of carrying a plurality of electronic components moving from the feeding zone toward the discharge zone, the conveyor belt device comprising a loop-shaped conveyor belt and capable of driving the conveyor a drive unit of the belt, the conveyor belt passes through a feeding zone, an inspection zone, a defective product removal zone and a discharge zone of the base, the conveyor belt has a component conveying section located above and a return zone located below a segment, the component conveying section and the return section are both lateral and straight sections; An image capturing device is disposed in the inspection area of the base, the image capturing device includes a photographic lens and at least one illuminating component, wherein the photographic lens and the illuminating component are located in a component conveying section of the conveyor belt Above the photographic lens facing downwards of the conveyor belt; An electrostatic generating device is disposed on the base and located in an inner space of the loop-shaped conveyor belt, the static electricity generating device includes an loading plate, a downloading plate and a plurality of pressing rollers, wherein the loading plate is located at the conveying a bottom surface of the component conveying section of the belt, the downloading plate is located at a top surface of the returning section of the conveyor belt, and the loading plate and the downloading plate are in frictional contact with the conveyor belt to generate static electricity for adsorbing electronic components, and the pressing force is Rollers are disposed on the base and are respectively located at two sides of the photographic lens, and the pressing roller is pressed against the top surface of the component conveying section of the conveyor belt; An adsorption device is disposed on the base and connected to the loading plate, the adsorption device is configured to connect an external air pressure source, and can adsorb the conveyor belt located above the loading plate; A defective product removing device is installed in the defective product removing area of the susceptor, and can push the electronic component determined to be defective into the conveyor belt.
藉由前述小型電子元件表面檢查機構的新型創作,使其執行小型電子元件的表面檢查怍業中,至少具備以功效: 1、提升作業效率:本新型小型電子元件表面檢查機構利用輸送帶結合靜電產生裝置,藉由輸送帶與靜電產生裝置的上載板、下載板摩擦產生靜電,使其能夠將重量輕的小型電子元件藉由靜電吸附而定位於輸送帶,經由輸送帶以直線運動方式快速載送電子元件通過影像擷取裝置的攝影鏡頭下方執行表面檢查作業,提昇小型電子元件表面檢查作業之效率。 2、能平穩地載送電子元件快速移動:承上所述,本新型小型電子元件表面檢查機構利用輸送帶結合靜電產生裝置,使其能夠將重量輕的小型電子元件以靜電吸附手段定位於輸送帶,經由輸送帶以直線運動方式快速載送電子元件,且進一步結合吸附裝置對位於上載板上方的輸送帶產生吸附作用,維持輸送帶與上載板的摩擦接觸狀態,並使輸送帶的運動具備良好的穩定性,減少輸送帶運轉時的晃動現象,進而能平穩地載送電子元件快速移動,確保電子元件表面檢查作業誤差。 3、被判斷為不良品的電子元件能於輸送路徑中直接去除:本新型小型電子元件表面檢查機構利用輸送帶結合靜電產生裝置與吸附置裝置平穩而快速載送小型電子元件完成取像與判斷是否為良品後,於輸送至出料區的過程中,被判斷為不良品的小型電子元件於到達出料區之前,即能由不良品去除裝置直接推離輸送帶,僅使良品的小型電子元件到達出料區,使其有效率地執行小型電子元件表面檢查作業。 With the novel creation of the aforementioned small-scale electronic component surface inspection mechanism, it is necessary to perform surface inspection of small electronic components at least: 1. Improve work efficiency: The new small electronic component surface inspection mechanism uses a conveyor belt combined with an electrostatic generation device to generate static electricity by friction between the conveyor belt and the loading plate and the download plate of the static electricity generating device, so that it can be light-weight small electronic components. The device is positioned on the conveyor belt by electrostatic adsorption, and the electronic component is quickly transported by the conveyor belt in a linear motion. The surface inspection operation is performed under the photographic lens of the image capturing device to improve the efficiency of the surface inspection operation of the small electronic component. 2, can smoothly carry electronic components to move quickly: As mentioned above, the new small electronic component surface inspection mechanism uses a conveyor belt combined with an electrostatic generation device, enabling it to position small lightweight electronic components with electrostatic adsorption means for transport. The belt rapidly transports the electronic component through the conveyor belt in a linear motion manner, and further combines the adsorption device to adsorb the conveyor belt located above the loading plate, maintains the frictional contact state between the conveyor belt and the loading plate, and enables the movement of the conveyor belt Good stability, reduce the sloshing phenomenon when the conveyor belt is running, and thus can smoothly carry the electronic components to move quickly, and ensure the inspection error of the surface of the electronic components. 3. The electronic component judged to be a defective product can be directly removed in the conveying path: the surface inspection mechanism of the novel small electronic component utilizes a conveyor belt combined with an electrostatic generating device and an adsorption device to smoothly and quickly carry small electronic components to complete image capturing and judgment. After being a good product, in the process of transporting to the discharge area, small electronic components that are judged to be defective products can be directly pushed away from the conveyor belt by the defective product removal device before reaching the discharge area, and only small electronic products of good quality are obtained. The component reaches the discharge area, enabling it to efficiently perform small electronic component surface inspection operations.
本新型小型電子元件表面檢查機構中,還可於該上載板中設有對應於該輸送帶的元件輸送區段底面的複數個穿孔,該吸附裝置包括複數吸附單元,每一吸附單元包括一接頭、一文氏管接頭以及一導管,所述接頭裝設於該上載板的穿孔中,所述文氏管接頭中具有一形成孔徑大小變化的主氣流通道以及連接該主氣流通道中的孔徑較小區段的一氣流支道,所述主氣流通道能導入所述氣壓源輸出之加壓氣流,所述氣流支道經由所述導管連接該接頭,係以利用氣壓源輸出的加壓氣流通過所述文氏管接頭的主氣流通道時產生對氣流支道的吸引作用,進而經由導管、接頭及上載板的穿孔對輸送帶產生向下的吸附力量,藉此間接式吸附力量作用,維持輸送帶與上載板的摩擦接觸狀態,並達到輸送帶更佳的平坦性與穩定性,有效地減少輸送帶運轉時的晃動現象。In the novel small electronic component surface inspection mechanism, a plurality of perforations corresponding to the bottom surface of the component conveying section of the conveyor belt may be disposed in the loading plate, the adsorption device includes a plurality of adsorption units, and each adsorption unit includes a joint. a venturi pipe joint and a pipe, the joint being mounted in a perforation of the loading plate, the venturi pipe joint having a main air flow passage forming a change in the size of the aperture and a small aperture connecting the main air flow passage An airflow branch of the section, the main airflow passage being capable of introducing a pressurized airflow outputted by the air pressure source, the airflow branch connecting the joint via the conduit, and passing the pressurized airflow output by the air pressure source When the main airflow passage of the venturi joint is used, the suction of the airflow branch is generated, and the downward suction force is generated on the conveyor belt through the perforation of the conduit, the joint and the loading plate, thereby indirectly absorbing the force and maintaining the conveyor belt. The frictional contact with the loading plate achieves better flatness and stability of the conveyor belt, and effectively reduces the sway during the operation of the conveyor belt.
本新型小型電子元件表面檢查機構中,該不良品去除裝置可以選用受控的氣流式去除裝置,該不良品去除裝置包括至少一個氣流噴頭,每一所述氣流噴頭以管件連接所述氣壓源,用以受控經由所述氣流噴頭朝向該輸送帶噴出高壓氣流,使其能快速地將被判斷為不良品的電子元件推離該輸送帶。In the novel small electronic component surface inspection mechanism, the defective product removing device may be a controlled airflow removing device, and the defective product removing device includes at least one airflow nozzle, and each of the airflow nozzles is connected to the air pressure source by a pipe. The high-pressure airflow is controlled to be ejected toward the conveyor belt via the airflow nozzle, so that the electronic component determined to be defective is quickly pushed away from the conveyor belt.
如圖1至圖3所示,揭示本新型小型電子元件表面檢查機構之一較佳實施例,其包括一基座10、一輸送帶裝置20、一影像擷取裝置30、一靜電產生裝置40、一吸附裝置50以及一不良品去除裝置60。As shown in FIG. 1 to FIG. 3, a preferred embodiment of the novel small electronic component surface inspection mechanism includes a base 10, a conveyor device 20, an image capture device 30, and an electrostatic generation device 40. An adsorption device 50 and a defective product removal device 60.
如圖1及圖3所示,該基座10界定有沿著橫向依序排列的一入料區11、一檢查區12、一不良品移除區13以及一出料區14。As shown in FIG. 1 and FIG. 3, the susceptor 10 defines a feeding zone 11, an inspection zone 12, a defective product removal zone 13, and a discharge zone 14 which are sequentially arranged along the lateral direction.
如圖1、圖2及圖4所示,該輸送帶裝置20係裝設於該基座10上,且該輸送帶裝置20包括一輸送帶21以及一驅動機組22,該輸送帶21係環圈型帶體,且該輸送帶21通過該基座10的入料區11、檢查區12、不良品移除區13及出料區14,該驅動機組22設於基座10上且連接該輸送帶21,該驅動機組22能驅動該輸送帶21運轉,且該環圈形的輸送帶21具有位置在上的一元件輸送區段211以及位置在下的一回程區段212,該輸送帶21的元件輸送區段211與回程區段212皆為橫向且平直的區段,被驅動運轉的輸送帶21能自入料區11承載小型電子元件通過檢查區12、不良品移除區13,再至出料區14送出小型電子元件。As shown in FIG. 1 , FIG. 2 and FIG. 4 , the conveyor belt device 20 is mounted on the base 10 , and the conveyor belt device 20 includes a conveyor belt 21 and a driving unit 22 , and the conveyor belt 21 is looped. a belt-shaped belt, and the conveyor belt 21 passes through the feeding zone 11, the inspection zone 12, the defective product removal zone 13 and the discharge zone 14 of the base 10, and the driving unit 22 is disposed on the base 10 and connected to the Conveyor belt 21, the drive unit 22 can drive the conveyor belt 21 to operate, and the loop-shaped conveyor belt 21 has a component conveying section 211 positioned above and a return section 212 positioned below, the conveyor belt 21 The component transporting section 211 and the returning section 212 are both lateral and straight sections, and the driven conveyor belt 21 can carry small electronic components from the feeding zone 11 through the inspection zone 12 and the defective product removal zone 13. The small electronic components are then sent out to the discharge zone 14.
於本較佳實施例中,該驅動機組22包括一主動輪221、一從動輪222以及一馬達223,該輸送帶21繞設連接該主動輪221與該從動輪222,該馬達223連接該主動輪221。In the preferred embodiment, the driving unit 22 includes a driving wheel 221, a driven wheel 222 and a motor 223. The conveyor belt 21 is connected to the driving wheel 221 and the driven wheel 222. The motor 223 is connected to the driving unit. Wheel 221.
如圖1至圖4所示,該影像擷取裝置30係裝設於該基座10上且對應於該檢查區12,該影像擷取裝置30包括一攝影鏡頭31以及至少一發光組件32,該攝影鏡頭31及所述發光組件32皆係裝設於該基座10的檢查區12且位於該輸送帶21之元件輸送區段211的上方,該攝影鏡頭31的影像擷取端朝向下方的輸送帶21,所述發光組件32能朝向輸送帶提供照明,所述攝影鏡頭31電性連接外部的控制系統或電腦,執行電子元件表面檢查作業。所述影像擷取裝置30還可結合一位置調整組件33組設於該基座10上,該位置調整組件能改變該攝影鏡頭31及發光組件32的三度空間(X軸向、Y軸向及Z軸向)位置。As shown in FIG. 1 to FIG. 4 , the image capturing device 30 is mounted on the base 10 and corresponds to the inspection area 12 . The image capturing device 30 includes a photographic lens 31 and at least one illuminating component 32 . The photographic lens 31 and the illuminating unit 32 are mounted on the inspection area 12 of the susceptor 10 and above the component conveying section 211 of the conveyor belt 21, and the image capturing end of the photographic lens 31 faces downward. The conveyor belt 21 can provide illumination to the conveyor belt, and the photographic lens 31 is electrically connected to an external control system or computer to perform an electronic component surface inspection operation. The image capturing device 30 can also be combined with a position adjusting component 33 on the base 10, and the position adjusting component can change the three-dimensional space (X-axis, Y-axis) of the photographic lens 31 and the illuminating component 32. And Z axis) position.
如圖1至圖4所示,該影像擷取裝置30還包括一偵測組件34,該偵測組件34裝設該基座10的檢查區12且位於輸送帶21之元件輸送區段211側邊,且連接外部的控制系統或電腦,用以偵測輸送帶21載運電子元件通過時,發出信號至控制系統或電腦,再由控制系統或電腦啟動攝影鏡頭31擷取輸送帶21載運的電子元件影像。所述偵測組件34可選用紅外線偵測組件或其他無接觸式偵測組件,於本較佳實施例係選用紅外線偵測組件。As shown in FIG. 1 to FIG. 4, the image capturing device 30 further includes a detecting component 34. The detecting component 34 is provided with the inspection area 12 of the base 10 and is located on the component conveying section 211 side of the conveyor belt 21. And connecting an external control system or a computer to detect when the conveyor belt 21 carries the electronic component, and sends a signal to the control system or the computer, and then the control system or the computer activates the photographic lens 31 to capture the electrons carried by the conveyor belt 21. Component image. The detecting component 34 can select an infrared detecting component or other non-contact detecting component. In the preferred embodiment, an infrared detecting component is selected.
如圖4至圖6所示,該靜電產生裝置40係裝設於該基座10上且位於該環圈形的輸送帶21的內側空間中,該靜電產生裝置40包括一上載板41、一下載板42以及複數壓抵滾輪43,該上載板41係能與輸送帶21摩擦接觸地設置於該輸送帶21的元件輸送區段211底面,且該上載板41自該基座10的入料區11延伸檢查區12,該下載板42係能與輸送帶摩擦接觸地設置於該輸送帶21的回程區段212頂面,且該下載板42自該基座10的入料區11延伸檢查區12,該上載板41與該下載板42能分別與輸送帶21摩擦接觸而產生具有吸附力的靜電作用。該上載板41位於檢查區12的區段設有複數個穿孔411,每一穿孔411皆對應於該輸送帶21的元件輸送區段211底面。複數所述壓抵滾輪43係設置於該基座10的檢查區12,複數所述壓抵滾輪43係分布設置於該攝影鏡頭31沿輸送帶21長度方向(橫向)的兩側,每一所述壓抵滾輪43壓抵於該輸送帶21的元件輸送區段211頂面,使該輸送帶21與上載板41之間維持摩擦接觸狀態。As shown in FIG. 4 to FIG. 6 , the static electricity generating device 40 is mounted on the base 10 and located in the inner space of the loop-shaped conveyor belt 21 . The static electricity generating device 40 includes an loading plate 41 and a loading device. The downloading plate 42 and the plurality of pressing rollers 43 are disposed in frictional contact with the conveyor belt 21 on the bottom surface of the component conveying section 211 of the conveyor belt 21, and the loading plate 41 is fed from the base 10. The area 11 extends the inspection area 12, the downloading plate 42 is disposed in frictional contact with the conveyor belt on the top surface of the return section 212 of the conveyor belt 21, and the downloading plate 42 extends from the feeding area 11 of the base 10 to inspect In the zone 12, the loading plate 41 and the downloading plate 42 can be in frictional contact with the conveyor belt 21, respectively, to generate an electrostatic action having an adsorption force. The section of the loading plate 41 located in the inspection zone 12 is provided with a plurality of perforations 411, each of which corresponds to the bottom surface of the component conveying section 211 of the conveyor belt 21. The plurality of pressing rollers 43 are disposed on the inspection area 12 of the susceptor 10, and the plurality of pressing rollers 43 are disposed on the two sides of the photographic lens 31 along the longitudinal direction (lateral direction) of the conveyor belt 21. The pressing roller 43 is pressed against the top surface of the component conveying section 211 of the conveyor belt 21 to maintain a frictional contact state between the conveyor belt 21 and the loading plate 41.
如圖4至圖6所示,於本較佳實施例中,其係揭示使用兩個壓抵滾輪43,所述壓抵滾輪43可依據實際使用的需求增加其數量。該靜電產生裝置40還可進一步包括一外蓋板44,用以將上載板41及下載板42罩蓋於內。As shown in FIGS. 4-6, in the preferred embodiment, it is disclosed that two pressing rollers 43 are used, which can increase the number according to the actual use requirements. The static electricity generating device 40 may further include an outer cover 44 for covering the loading plate 41 and the downloading plate 42 therein.
於本較佳實施例,所述壓抵滾輪43的中段與軸向兩端形成直徑差,即壓抵滾輪43的中段直徑小於壓抵滾輪43的軸向兩端的直徑,即壓抵滾輪43的軸向兩端壓抵於輸送帶21頂面,壓抵滾輪43的中段則與輸送帶21頂面之間具有足以提供小型電子元件通過的間距。In the preferred embodiment, the middle portion of the pressing roller 43 and the axial ends form a diameter difference, that is, the diameter of the middle portion of the pressing roller 43 is smaller than the diameter of the axial ends of the pressing roller 43 , that is, the roller 43 is pressed against the roller 43 . The axial ends are pressed against the top surface of the conveyor belt 21, and the middle portion of the pressing roller 43 and the top surface of the conveyor belt 21 have a spacing sufficient to provide passage of small electronic components.
如圖2、圖4及圖6所示,該吸附裝置50係裝設於基座10上且連接該上載板41的穿孔411,該吸附裝置50用以連接外部的一氣壓源,而能對位於上載板41上的輸送帶21部分區段產生適度吸附作用,使輸送帶21於運轉時,維持輸送帶21與上載板41摩擦接觸的狀態,以及輸送帶21的平坦性與穩定性,減少輸送帶21運轉時的晃動現象。於本較佳實施例中,該吸附裝置50係連接一能輸出加壓氣流的氣壓源,並能對位於上載板41上的輸送帶的局部區段產生適度的吸附力量,使輸送帶21維持能於上載板41上運動及摩擦接觸之狀態,且使輸送帶21平坦展開與穩定地直線運動。As shown in FIG. 2, FIG. 4 and FIG. 6, the adsorption device 50 is mounted on the base 10 and connected to the through hole 411 of the loading plate 41. The adsorption device 50 is used to connect an external air pressure source. A portion of the conveyor belt 21 located on the loading plate 41 generates a moderate adsorption function to maintain the state in which the conveyor belt 21 is in frictional contact with the loading plate 41 during operation, and the flatness and stability of the conveyor belt 21 are reduced. The sway phenomenon when the conveyor belt 21 is in operation. In the preferred embodiment, the adsorption device 50 is connected to a gas pressure source capable of outputting a pressurized gas flow, and can generate a moderate adsorption force to a partial section of the conveyor belt on the loading plate 41 to maintain the conveyor belt 21 The state in which the loading plate 41 is moved and frictionally contacted, and the conveyor belt 21 is flatly deployed and stably linearly moved.
如圖2、圖4及圖6所示,於本較佳實例中,該吸附裝置50包括複數吸附單元,每一吸附單元包括一接頭51、一文氏管接頭52以及一導管53,所述接頭51裝設於上載板41的穿孔411中,所述文氏管接頭52係裝設於基座10上且連接氣壓源的氣流輸出端,所述文氏管接頭52中具有一形成孔徑大小變化的主氣流通道以及連接該主氣流通道中的孔徑較小區段的一氣流支道,所述主氣流通道/的一端為連接氣壓源的氣流輸出端的進氣端,所述主氣流通道的另一端為出氣端,所述氣流支道經由所述導管53連接該接頭51。所述文氏管接頭係為已知產品,其具體構造以及氣流作動原理等係屬現有技術,於此不再贅述。於本較佳實施例中,係藉由氣壓源輸出的加壓氣流通過所述文氏管接頭52的主氣流通道時產生對氣流支道的吸引作用,進而經由導管53、接頭51及上載板41的穿孔411對輸送帶21產生向下的吸附力量,藉此間接式吸附力量作用,維持輸送帶21與上載板41的摩擦接觸狀態,以及輸送帶21的平坦性與穩定性,減少輸送帶21運轉時的晃動現象。As shown in FIG. 2, FIG. 4 and FIG. 6, in the preferred embodiment, the adsorption device 50 comprises a plurality of adsorption units, each adsorption unit comprising a joint 51, a venturi joint 52 and a conduit 53, the joint The venturi connector is mounted on the pedestal 41 of the loading plate 41. The venturi connector 52 is mounted on the susceptor 10 and connected to the airflow output end of the air pressure source. The venturi connector 52 has a change in the size of the aperture. a main air flow passage and an air flow branch connecting the smaller diameter section of the main air flow passage, one end of the main air flow passage / is an intake end of the air flow output end connected to the air pressure source, and the other main air flow passage One end is an air outlet end, and the air flow branch is connected to the joint 51 via the duct 53. The venturi pipe joint is a known product, and its specific configuration and air flow actuation principle are prior art, and will not be described herein. In the preferred embodiment, the pressurized airflow outputted by the air pressure source passes through the main airflow passage of the venturi connector 52 to generate an attraction to the airflow branch, and then via the conduit 53, the joint 51, and the loading plate. The perforation 411 of the 41 exerts a downward absorbing force on the conveyor belt 21, thereby indirectly absorbing the force, maintaining the frictional contact state of the conveyor belt 21 with the loading plate 41, and the flatness and stability of the conveyor belt 21, reducing the conveyor belt. 21 shaking phenomenon during operation.
如圖1至圖5所示,所述不良品去除裝置60係裝設於基座10的不良品移除區13,且鄰近輸送帶21的元件輸送區段211,用以將位於輸送帶21上之被判斷為不良品的小型電子元件推離輸送帶21。As shown in FIGS. 1 to 5, the defective product removing device 60 is mounted on the defective product removing portion 13 of the susceptor 10, and adjacent to the component conveying portion 211 of the conveying belt 21 for positioning on the conveying belt 21 The small electronic component that is judged to be defective is pushed away from the conveyor belt 21.
於本較佳實施例中,所述不良品去除裝置60係選用受控於外部的控制系統或電腦的氣流式去除裝置,並連接氣壓源,使所述不良品去除裝置60能受到外部的控制系統或電腦的控制,執行將判斷為不良品的小型電子元件推離輸送帶21之動作。於本較佳實施例中,所述不良品去除裝置60包括至少一個氣流噴頭61,每一所述氣流噴頭61以管件連接氣壓源,用以受控經由氣流噴頭61朝向輸送帶21噴出高壓氣流。In the preferred embodiment, the defective product removing device 60 is an airflow removing device controlled by an external control system or a computer, and is connected to a pneumatic source, so that the defective product removing device 60 can be externally controlled. The control of the system or the computer performs an action of pushing the small electronic component determined to be defective to the conveyor belt 21. In the preferred embodiment, the defective product removing device 60 includes at least one airflow head 61, and each of the airflow nozzles 61 is connected to a pneumatic source by a pipe member for controlling the high-pressure airflow to be discharged toward the conveyor belt 21 via the airflow nozzle 61. .
如圖1至圖5所示的較佳實施例中,所述不良品去除裝置60還可進一步包括至少一不良品收集容器62以及一遮罩63,所述不良品收集容器62設置於基座10的不良品移除區13中,並能集中收納判斷為不良品的小型電子元件,該遮罩63係罩蓋於所述氣流噴頭61與輸送帶21的外側,使推離輸送帶21的小型電子元件90確實落在所述不良品收集容器62中。In the preferred embodiment shown in FIG. 1 to FIG. 5, the defective product removing device 60 may further include at least one defective product collecting container 62 and a mask 63, and the defective product collecting container 62 is disposed on the base. In the defective product removal area 13 of 10, a small electronic component that is determined to be defective is collectively housed, and the mask 63 is attached to the outside of the airflow head 61 and the conveyor belt 21 so as to be pushed away from the conveyor belt 21. The small electronic component 90 does fall into the defective product collection container 62.
關於本新型小型電子元件表面檢查機構應用於如電阻、電容等小型電子元件的表面檢查作業的使用情形,如圖7及圖8所示,該小型電子元件表面檢查機構可以該輸送帶21位於入料區11的一端連接一振動式電子元件整列輸送機構70,或其他電子元件輸送機構,藉此,多個小型電子元件90整列後依序導入輸送帶21,另於輸送帶21位於出料區14的一端裝設一良品收集容器80或連接一良品輸送機構。With regard to the use case of the surface inspection mechanism for the small electronic component of the present invention applied to small electronic components such as resistors and capacitors, as shown in FIGS. 7 and 8, the small electronic component surface inspection mechanism can be placed in the conveyor belt 21 One end of the material area 11 is connected to a vibrating electronic component array transport mechanism 70, or other electronic component transport mechanism, whereby a plurality of small electronic components 90 are sequentially arranged and then introduced into the conveyor belt 21, and the conveyor belt 21 is located in the discharge zone. One end of the 14 is provided with a good collection container 80 or a good delivery mechanism.
於使用時,經整列後的多個小型電子元件90依序導入輸送帶21後,藉由輸送帶21與結合靜電產生裝置40,使其能夠將重量輕的小型電子元件以靜電吸附手段定位於輸送帶21,經由輸送帶21以直線運動方式快速載送小型電子元件90自入料區11依序朝檢查區12方向移動。於此過程中,該小型電子元件表面檢查機構利用靜電產生裝置40的上載板41、下載板42與輸送帶21的摩擦而產生靜電,重量輕的小型電子元件90藉由靜電吸附而定位於該輸送帶21,經由該輸送帶21以直線運動方式快速載送電子元件/移向影像擷取裝置30的攝影鏡頭31,當偵測組件34偵測到小型電子元件90進入位於檢查區12之攝影鏡頭31下方時,外部的控制系統或電腦立即啟動攝影鏡頭31擷取輸送帶21載運的小型電子元件90的影像,並判斷該小型電子元件90是否為良品。In use, after the plurality of small electronic components 90 arranged in series are sequentially introduced into the conveyor belt 21, the conveyor belt 21 and the combined static electricity generating device 40 enable the small electronic components that are light in weight to be positioned by electrostatic adsorption. The conveyor belt 21 rapidly transports the small electronic components 90 in a linear motion via the conveyor belt 21 from the feeding zone 11 in the direction of the inspection zone 12 in sequence. In this process, the small electronic component surface inspection mechanism generates static electricity by the friction of the loading plate 41 of the static electricity generating device 40, the downloading plate 42 and the conveying belt 21, and the small lightweight electronic component 90 is positioned by electrostatic adsorption. The conveyor belt 21 rapidly transports the electronic component/moving lens photographic lens 31 to the image capturing device 30 via the conveyor belt 21, and the detecting component 34 detects that the small electronic component 90 enters the shooting at the inspection area 12. When the lens 31 is below, the external control system or computer immediately activates the photographic lens 31 to capture the image of the small electronic component 90 carried by the conveyor belt 21, and determines whether the small electronic component 90 is a good one.
前述中,判斷為良品的小型電子元件90持續在輸送帶21載送下通過不良品去除區/至出料區14集中於良品收集容器80中,或是由另一良品輸送機構輸出。判斷為不良品的小型電子元件90則在輸送帶21載送下進入不良品去除區/時,即為受控的不良品去除裝置60直接推離輸送帶21,掉落至不良品收集容器62中。In the above, the small electronic component 90 judged to be good is continuously concentrated in the good product collection container 80 through the defective product removal area/to the discharge area 14 under the conveyance of the conveyance belt 21, or is outputted by another good conveyance mechanism. When the small electronic component 90 judged to be defective is carried into the defective product removal area by the conveyance belt 21, the controlled defective product removal device 60 is directly pushed away from the conveyance belt 21 and dropped to the defective product collection container 62. in.
綜上所述,本新型小型電子元件表面檢查機構利用輸送帶結合靜電產生裝置與吸附裝置,使小尺寸的小型電子元件能在輸送帶的直線運動方式的快速載送下執行表面檢查作業,並能將不良品直接去除,使其具備高效能小型電子元件表面檢查作業的性能。In summary, the novel small electronic component surface inspection mechanism utilizes a conveyor belt in combination with an electrostatic generating device and an adsorption device to enable small-sized small electronic components to perform surface inspection operations under the rapid transport of the conveyor belt in a linear motion mode, and The defective product can be directly removed, so that it can perform the surface inspection work of high-performance small electronic components.
10‧‧‧基座 11‧‧‧入料區10‧‧‧ Pedestal 11‧‧‧Feeding area
12‧‧‧檢查區 13‧‧‧不良品移除區 12‧‧‧ inspection area 13‧‧‧Don't remove the area
14‧‧‧出料區 20‧‧‧輸送帶裝置 21‧‧‧輸送帶 14‧‧‧Drawing area 20‧‧‧Conveyor belt device 21‧‧‧ conveyor belt
211‧‧‧元件輸送區段 212‧‧‧回程區段 22‧‧‧驅動機組 211‧‧‧Component conveying section 212‧‧‧Return section 22‧‧‧ drive unit
221‧‧‧主動輪 222‧‧‧從動輪 221‧‧‧Drive wheel 222‧‧‧ driven wheel
223‧‧‧馬達 30‧‧‧影像擷取裝置 31‧‧‧攝影鏡頭 223‧‧ ‧motor 30‧‧‧Image capture device 31‧‧‧Photographic lens
32‧‧‧發光組件 33‧‧‧位置調整組件 32‧‧‧Lighting components 33‧‧‧ Position adjustment components
34‧‧‧偵測組件 40‧‧‧靜電產生裝置 41‧‧‧上載板 34‧‧‧Detection components 40‧‧‧Electrostatic generating device 41‧‧‧ Upload board
411‧‧‧穿孔 42‧‧‧下載板 411‧‧‧Perforation 42‧‧‧ download board
43‧‧‧壓抵滾輪 44‧‧‧外蓋板 50‧‧‧吸附裝置 43‧‧‧Pressure roller 44‧‧‧Outer cover 50‧‧‧Adsorption device
500‧‧‧吸附單元 51‧‧‧接頭 500‧‧‧Adsorption unit 51‧‧‧Connectors
52‧‧‧文氏管接頭 53‧‧‧導管 60‧‧‧不良品去除裝置 61‧‧‧氣流噴頭 52‧‧‧ wen's pipe joint 53‧‧‧ catheter 60‧‧‧Don't remove the device 61‧‧‧Air jet nozzle
62‧‧‧不良品收集容器 63‧‧‧遮罩 70‧‧‧振動式電子元件整列輸送機構 80‧‧‧良品收集容器 90‧‧‧小型電子元件 62‧‧‧Drug collection container 63‧‧‧ mask 70‧‧‧Vibrating electronic components 80‧‧‧good collection container 90‧‧‧Small electronic components
圖1係本新型小型電子元件表面檢查機構之一較佳實施例的立體示意圖。 圖2係圖1所示小型電子元件表面檢查機構較佳實施例的局部放大示意圖。 圖3係圖1所示小型電子元件表面檢查機構較佳實施例另一觀視角度的立體示意圖。 圖4係圖1所示小型電子元件表面檢查機構較佳實施例的局部立體分解示意圖。 圖5係圖1所示小型電子元件表面檢查機構較佳實施例的局部立體剖面示意圖。 圖6係圖4所示小型電子元件表面檢查機構較佳實施例移除部分部件後的前視平面示意圖。 圖7係圖1所示小型電子元件表面檢查機構較佳實施例結合振動式電子元件整列輸送機構之使用狀態參考圖。 圖8係圖1所示小型電子元件表面檢查機構較佳實施例應用於小型電子元件表面檢查作業之實施狀態俯視參考圖。 1 is a perspective view of a preferred embodiment of the novel small electronic component surface inspection mechanism. Fig. 2 is a partially enlarged schematic view showing a preferred embodiment of the surface inspection mechanism for a small electronic component shown in Fig. 1. 3 is a perspective view showing another viewing angle of the preferred embodiment of the small electronic component surface inspection mechanism shown in FIG. 1. 4 is a partially exploded perspective view showing a preferred embodiment of the surface inspection mechanism for a small electronic component shown in FIG. 1. Figure 5 is a partial perspective cross-sectional view showing a preferred embodiment of the surface inspection mechanism for a small electronic component shown in Figure 1. Figure 6 is a front plan view showing the preferred embodiment of the small electronic component surface inspection mechanism shown in Figure 4 with a portion removed. Fig. 7 is a view showing a state of use of a preferred embodiment of the small electronic component surface inspection mechanism shown in Fig. 1 in combination with a vibrating electronic component alignment transport mechanism. Fig. 8 is a top plan view showing an embodiment of a small electronic component surface inspection mechanism shown in Fig. 1 applied to a surface inspection operation of a small electronic component.
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW108202533U TWM579723U (en) | 2019-02-27 | 2019-02-27 | Miniature electronic component surface inspection mechanism |
Applications Claiming Priority (1)
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TW108202533U TWM579723U (en) | 2019-02-27 | 2019-02-27 | Miniature electronic component surface inspection mechanism |
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TWM579723U true TWM579723U (en) | 2019-06-21 |
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TW108202533U TWM579723U (en) | 2019-02-27 | 2019-02-27 | Miniature electronic component surface inspection mechanism |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI754412B (en) * | 2019-10-15 | 2022-02-01 | 日商松下知識產權經營股份有限公司 | Connection device |
-
2019
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI754412B (en) * | 2019-10-15 | 2022-02-01 | 日商松下知識產權經營股份有限公司 | Connection device |
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Legal Events
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MM4K | Annulment or lapse of a utility model due to non-payment of fees |