TWM576739U - Cold-hot exchange circulating structure for controlling temperature of semiconductor equipment - Google Patents

Abstract

A cold heat exchange cycle structure for controlling temperature of a semiconductor device, which is assembled in a semiconductor device and includes: a conductive body having a cold heat exchange space therein, and further having a plurality of partition plates a set of interfaces, a liquid inlet hole, a liquid outlet hole and a plurality of connection portions; and at least one cover body correspondingly disposed on the group interface, the cover body corresponding to the assembly portion is provided with a plurality of connection portions The connecting portions are disposed in the connecting portions, so that the cover covers the set of interfaces; wherein the partitions are protruded from the inner peripheral wall of the cold heat exchange space, and the cold heat exchange is performed The space is formed with a first-class track, and the set of interfaces, the liquid inlet hole and the liquid outlet hole are disposed on the outer side of the conductive body; in addition, the conductive system is connected to the uniform cold module; thereby, the creative system is installed in In semiconductor equipment, it can achieve the effect of precise cold and heat compensation control process and machine temperature.

Description

Cold and heat exchange cycle structure for controlling temperature of semiconductor equipment

The present invention relates to a cold heat exchange structure, and more particularly to a cold heat exchange cycle structure for controlling the temperature of a semiconductor device.

According to the semiconductor manufacturing and processing, including, for example, etching and deposition processing, the processing quality mainly depends on the substrate temperature of the semiconductor processing device, so the temperature of the substrate is generally controlled by the heat exchange device to make the processing quality of the semiconductor processing. More good.

For example, low temperature and cryogenic cooling systems are typically used to cool fluids for cryogenic separation, to capture water vapor for generating low vapor pressures in vacuum processing procedures, and to cool objects during manufacturing processes, For example, in semiconductor wafer processing, image detector and radiation detector cooling, industrial heat transfer, and biochemical pharmaceutical and biomedical applications, as well as biomedical storage, and chemical processing procedures; in general, the cooling cycle system Compressing a cooling gas, condensing the gas via heat exchange with the coolant, and possibly further heat exchange with the decompressed or expanded gas in the return for additional cooling; Typically, portions of the cooling cycle have a liquid/gas flow in a two-phase state.

In addition, certain processes for fabricating semiconductors may require complex processes to grow epitaxial layers to create multilayer semiconductor structures for use in fabricating high performance devices; in this process, epitaxial layers are known as chemical vapor deposition. (CVD) is grown by the general process. One type of CVD process is known as metal organic chemical vapor deposition (MOCVD). In MOCVD, a reactive gas is introduced into a sealed reaction chamber in a controlled environment in which a reactive gas is deposited on a substrate, commonly referred to as a wafer, to grow a thin epitaxial layer.

Furthermore, in the current semiconductor system equipment, the MOCVD system equipment is taken as an example, and in the gas handling & mixing system of the MOCVD system equipment, there is a device for regulating the temperature of the carrier gas, which is mainly through compression. The machine operates, but because the compressor is set up to form a large set of equipment, and not only can be quiet operation, the overall equipment is bulky, and is not effectively able to control the temperature required for testing in the semiconductor process.

In addition, there are three modes of heat transfer, namely conduction, convection, and radiation. The conduction system brings two objects into contact with each other, and heat is transferred from the high temperature object toward the low temperature object. Convection refers to the transfer of heat by the flow of a fluid such as a liquid or a gas, including natural convection due to changes in density or pressure due to differences in temperature inside the fluid, and forced convection forced by external forces applied to the system. Radiation is the effect of emitting energy in the form of electromagnetic waves from the temperature of the object itself, the intensity of which depends on the temperature.

Using the above heat transfer principle, the industry has developed an air-cooled heat sink that contacts a heat source with a heat-conducting seat and projects a plurality of fins from the heat-conducting seat. The heat-conducting seat directs heat generated by the heat source to the fins when the air flows through the air. When the fins are taken away, the heat can be removed by the above-mentioned heat conduction mode to reduce the temperature of the heat source; however, the heat dissipation efficiency depends on the thermal conductivity of the substance, and the thermal conductivity of the air is very small, so that the heat dissipation of the air-cooled heat sink Inefficient.

Therefore, the creators of this case have observed the above-mentioned deficiencies, but have not produced this creation.

The main purpose of this creation is to provide a cold and heat exchange cycle structure for controlling the temperature of a semiconductor device, which is installed in a semiconductor device and can achieve the purpose of precise cold and heat compensation control process and machine temperature.

To achieve the above objective, the cold heat exchange cycle structure for controlling the temperature of a semiconductor device provided by the present invention is assembled in a semiconductor device and includes: a conductive body having a cold heat exchange space therein, and The utility model has a plurality of partitions protruding from an inner peripheral wall of the cold heat exchange space, and the cold heat exchange space is formed with a first-class track; at least one set of interfaces is formed on an outer side of the conductive body, and the set of interfaces is The cold heat exchange space is connected to each other; at least one liquid inlet hole is disposed on the outer side of the conductive body and connected to one end of the flow channel; at least one liquid outlet hole is disposed on the outer side of the conductive body, and The other end of the flow channel is connected to the outer side of the conductive body, and is disposed adjacent to the group of interfaces; and the cold heat exchange cycle structure further includes at least one cover body corresponding to The cover is disposed on the set of interfaces, and the cover body is provided with a plurality of connecting portions corresponding to the connecting portions, and the connecting portions are assembled to the assembled portions, so that the cover covers the set of interfaces.

Preferably, the cooling module further includes at least a uniform cold chip, the cooling module includes at least a uniform cold chip, a power supply unit, and a control unit, the cooling chip is electrically connected to the power supply unit, and the power supply unit is Electrically connecting the control unit, and the cooling chip is connected to the conductive body, and the cooling chip has a uniform cold connection surface and a heat connection surface, and the refrigeration connection surface and the heat connection surface are selected It is one of a flat surface, a rough surface, a surface having a plurality of blind holes, and a surface having a plurality of dicing grooves.

Preferably, the conduction system is selected from one of a connection between the refrigeration connection surface and the heat connection surface.

Preferably, the conduction system of the two cold heat exchange cycle structures respectively connects the refrigeration connection surface and the heat connection surface.

Preferably, the method further includes a cooler connecting the liquid inlet hole and the liquid outlet, and the flow channel, the liquid inlet hole, the liquid outlet port and the cooler form a cold heat exchange cycle. Loop.

Preferably, the method further comprises a cooler connecting the liquid inlet hole and the liquid outlet, and the conduction system is connected to the refrigerant chip, and the flow channel, the liquid inlet hole, the outlet The liquid port and the cooler form a cold heat exchange circulation loop for thermally conducting the refrigerant connection surface or the heat connection surface.

Preferably, the components are selected from one or a combination of a screw hole, a card slot and a card block, and the connection portions are selected from one of a through hole and a snap hole or a combination thereof.

Preferably, the method further includes a plurality of connectors, the components are passed through the connecting portions, and are assembled to the connecting portions, and the cover is disposed on the set of interfaces.

Preferably, the conductive system is made of a corrosion-resistant metal material, and the conductive body is coated with a corrosion-resistant coating on the cold heat exchange space, the liquid inlet hole and the liquid outlet.

Preferably, the conductive system has two sets of interfaces, and the two cover systems are respectively disposed on the set of interfaces.

The cold heat exchange cycle structure for controlling the temperature of the semiconductor device provided by the present invention mainly uses the conduction system to connect the refrigeration connection surface or the heat connection surface of the refrigerant chip, and at the same time, the flow of the cold heat exchange space The track arrangement, and one end of the inner wall of the partition wall connecting the cold heat exchange space is curved, so that the flow path is continuously curved; more specifically, the flow path is continuously curved. The working fluid is smoothly passed through the cold heat exchange space to conduct the conduction of heat and cold; thereby, the creation achieves the effect of precise cold and heat compensation control process and machine temperature.

Please refer to FIG. 1 and FIG. 2 , together with FIG. 3 , FIG. 4 and FIG. 5 , which are perspective views, exploded perspective views, block diagrams and combined perspective views of the first embodiment of the present invention, which are disclosed for controlling a semiconductor. The device temperature cold heat exchange cycle structure 100 is assembled in a semiconductor device (not shown, for example, a chiller, a chiller, a temperature controller, etc.), and includes:

A conductive body 10 having a rectangular shape, and the interior of the conductive body 10 has a cold heat exchange space 11 . Further, the conductive body 10 further has a plurality of partitions 12 , a set of interfaces 13 , and a liquid inlet 14 . , a liquid outlet 15 and a complex array 16 , wherein:

The partitions 12 are protruded from the inner peripheral wall of the cold heat exchange space 11, and the cold heat exchange space 11 is formed with a first-class channel 111. In the embodiment, the partitions 12 are connected to the cold heat exchange space 11. One end of one end of the peripheral wall is curved, so that the flow path 111 is continuously curved.

The set of interfaces 13 is open to the outer side of the conductive body 10, and the set of interfaces 13 is connected to the cold heat exchange space 11; in this embodiment, the set of interfaces 13 is a rectangular area-shaped opening, and the set The interface 13 and the cold heat exchange space 11 are formed as an open receiving groove.

The liquid inlet hole 14 is bored on the outer peripheral side of the conductive body 10 and connected to one end of the flow path 111.

The liquid outlet hole 15 is bored on the outer peripheral side of the conductive body 10 and connected to the other end of the flow path 111.

The assembly portion 16 is disposed on the outer side of the conductive body 10 and is disposed adjacent to the group of interfaces 13; in the embodiment, the assembly portion 16 is selected from the group consisting of a screw hole 161, a card slot and a card block. One or a combination thereof, the embodiment uses the screw hole 161 as an example, but does not limit the implementation of the present invention.

A cover body 20 correspondingly disposed on the set of interfaces 13 , the cover body 20 corresponding to the assembly portion 16 is provided with a plurality of connecting portions 21 , and the connecting portions 21 are assembled to the assembled portions 16 , The cover body 20 is covered with the set of interfaces 13; in the embodiment, the connecting portions 21 are selected from one of the through holes 211 and the snap holes, or a combination thereof. In this embodiment, the through holes 211 are taken as an example. , but does not limit the implementation of this creation.

The plurality of connectors 30 are disposed through the connecting portions 21 and are disposed on the connecting portions 16 and the cover 20 is disposed on the set of interfaces 13; The components 30 are exemplified by screws, for example, but the implementation of the present invention is not limited.

The cooling module 40 includes at least a uniform cold chip 41, a power supply unit 43 and a control unit 44. The cooling chip 41 is electrically connected to the power supply unit 43, and the power supply unit 43 is electrically connected. The control unit 44 is connected, and the refrigerating wafer 41 is connected to the conductive body 10, and the refrigerating wafer 41 has a uniform cold connecting surface 4131 and a heat generating connecting surface 4132.

In this embodiment, the cooling connection surface 4131 and the heating connection surface 4132 are selected from the group consisting of a flat surface, a rough surface, a surface having a plurality of blind holes, and a surface having a plurality of dicing grooves; The plane setting is an example, but does not limit the implementation of this creation.

In the present embodiment, as shown in FIG. 3, the refrigerating wafer 41 includes a P-type semiconductor wafer 411 and an N-type semiconductor wafer 412 having a plurality of polar staggered rows, and a plurality of wires 42 electrically connected to the wires 42. The P-type semiconductor wafer 411 and the N-type semiconductor wafers 412 are connected to each other; the P-type semiconductor wafers 411 and the N-type semiconductor wafers 412 are arranged in a corresponding polarity and electrically connected to the two carriers. a conductive layer on 413, so when the control unit 44 controls the power supply unit 43 to apply a predetermined direct current, each P-type, N-type semiconductor wafer 412 of the cooled wafer 41 begins to generate a Peltier effect, A temperature difference is generated between the two carrier plates 413, so that it can be applied as a cold wafer or a heat generating wafer, and the external contact surface is selected from a cold end or a hot end.

It should be further noted that the present invention has two conductive bodies 10, which are respectively disposed on the cooling connection surface 4131 and the heating connection surface 4132, as shown in FIG. 6; in addition, the conductive body 10 can be The corrosion-resistant metal material is formed, or the conductive body 10 is coated with a corrosion-resistant coating on the cold heat exchange space 11, the liquid inlet hole 14 and the liquid outlet hole 15 (not shown, for example, a corrosion inhibitor). , anti-corrosion nano-coatings, etc.), thereby having a corrosion-resistant function; more specifically, the flow path 111 can improve its applicability for different working fluids, and extend the service life of the conductive body 10.

In order to further understand the characteristics of this creation, the use of technical means and the expected results, we will describe the use of this creation, and believe that we can have a deeper and more specific understanding of this creation, as follows:

Please refer to FIG. 2 and FIG. 3 together with FIG. 5 and FIG. 6 , which are exploded perspective view, block diagram, combined perspective view and use state diagram of the first embodiment of the present invention; Provided in a semiconductor device (for example, a chiller, a chiller, a temperature controller, etc.), the chilling connection surface 4131 or the heat generating connection surface 4132 of the chilled wafer 41 is connected by the conductive body 10 while And the flow passages 111 of the cold heat exchange space 11 are disposed, and the two ends of one end of the partition wall 12 connecting the inner and outer peripheral walls of the cold heat exchange space 11 are curved, so that the flow passage 111 is continuously curved; In other words, the flow passage 111 is in a continuous curved arrangement to provide a working fluid to smoothly pass through the cold heat exchange space 11 for conducting heat conduction.

In addition, the above description of the structure and the combination of FIG. 5 and FIG. 6 further show that the present invention is coupled to the refrigeration module 40 by the conductive body 10 so as to quickly absorb heat on the body of the refrigerant chip 41. And rapidly dissipating heat on the other side of the body of the cooling chip 41, thereby improving the applicability thereof, and the material of the conductive body 10 or the post-processing coating, thereby having corrosion resistance, in other words, the creation has a long service life and good performance. , good temperature control, convenient operation and significant cost reduction.

What is important is that this creation system allows the semiconductor device to be installed without the need for a compressor, which simplifies the overall size of the semiconductor device, as well as low cost, high heat dissipation efficiency and improved yield.

Please refer to FIG. 7 and FIG. 8 , which are block diagrams and exploded perspective views of the second embodiment of the present invention. The present embodiment is different from the first embodiment in that it further includes a cooler 50. The cooler 50 is connected to the liquid inlet hole 14 and the liquid outlet port, and the conductive body 10 is connected to the refrigerant chip 41. Further, the flow channel 111, the liquid inlet hole 14, the liquid outlet port and the cooler 50 forming a cold heat exchange circulation loop for thermally conducting the refrigerant connection surface 4131 or the heat connection surface 4132; the cooler 50 can be selected from an oil cooler, a water cooler, Fin coolers...etc. Therefore, the present embodiment is used in a semiconductor device (for example, a chiller, a chiller, a temperature controller, etc.), and the present embodiment can also achieve the efficacies and technical effects as in the first embodiment.

FIG. 9 is an exploded perspective view of the third embodiment of the present invention; the difference between this embodiment and the first embodiment is that the conductive body 10 has two sets of interfaces 13 and two covers. The body 20 is respectively disposed on the group interface 13; in other words, there is a plurality of disassembling during maintenance or cleaning; thereby, the embodiment can also be provided with a continuous bending system by the flow channel 111 to provide the working fluid. The cold heat exchange space 11 is smoothly passed to conduct the conduction of heat and cold; therefore, the embodiment can also achieve the efficacy and technical effects as the first embodiment.

It is worth mentioning that the present invention sets the carrier plate 413 (ie, the cooling connection surface 4131 and the heating connection surface 4132) as a rough surface, a surface having a plurality of blind holes, or a surface having a plurality of dicing grooves. The contact area with the cold and heat source can be increased, and the heat can be quickly extracted, thereby achieving the heat transfer efficiency of the cooling.

Hereby, the characteristics of this creation and its achievable expected effects are stated as follows:

The cold heat exchange cycle structure 100 for controlling the temperature of the semiconductor device of the present invention utilizes two conductive bodies 10, which are respectively disposed on the cooling connection surface 4131 and the heat connection surface 4132 to form a structure as shown in FIG. In the embodiment, at the same time, the flow passage 111 of the cold heat exchange space 11 is further disposed, and the two ends of one end of the partition wall 12 connecting the inner and outer walls of the cold heat exchange space 11 are curved, so that the flow passage 111 is formed. In a continuous bending arrangement; more specifically, the flow path 111 is in a continuous curved arrangement to provide a smooth flow of working fluid through the cold heat exchange space 11 for conduction of heat and cold.

In this way, the author has the following implementation effects and technical effects:

First, the creation department is installed in a semiconductor device, and can achieve the effects of precise cold and heat compensation control process and machine temperature, and the creation system can make the semiconductor device installed in this creation unnecessary to install a compressor to simplify the semiconductor. The overall size of the device, as well as low cost, high heat dissipation efficiency and improved yield.

Secondly, the conductive body 10 of the present invention is combined with the refrigeration module 40 to quickly absorb heat on the body of the refrigerant chip 41 and rapidly dissipate heat on the other side of the body of the refrigerant chip 41, thereby improving the applicability thereof. And the conductive body 10 itself or the post-processing coating, thereby having corrosion resistance function, in other words, the creation has the advantages of long service life, good performance, good temperature control, convenient operation and greatly reduced cost.

Thirdly, the present invention is to provide a rough surface, a surface having a plurality of blind holes or a surface having a plurality of dicing grooves on the cooling connection surface 4131 of the cooling wafer 41 and the heating connection surface 4132 to improve contact with the cold heat source. The area and the heat can be quickly exported to achieve the effect of cooling heat transfer efficiency.

In summary, this creation has its excellent progress and practicality in similar products. At the same time, it has investigated the technical information about such structures at home and abroad. The same structure has not been found in the literature. This creation has already possessed new types of patent requirements, and applied for it according to law.

However, the above-mentioned embodiments are merely preferred embodiments of the present invention, and the equivalent structural changes that are applied to the present specification and the scope of the patent application are intended to be included in the scope of the present patent.

100‧‧‧Cold and heat exchange cycle structure

10‧‧‧ Conducting the ontology

11‧‧‧ Cold and heat exchange space

111‧‧‧ flow path

12‧‧‧Baffle

13‧‧‧ group interface

14‧‧‧Inlet hole

15‧‧‧ liquid outlet

16‧‧‧Team

161‧‧‧ screw holes

20‧‧‧ cover

21‧‧‧Connecting Department

211‧‧‧through hole

30‧‧‧Components

40‧‧‧ Refrigeration module

41‧‧‧Chilled wafer

411‧‧‧P type semiconductor wafer

412‧‧‧N type semiconductor wafer

413‧‧‧ Carrier Board

4131‧‧‧Cool connection

4132‧‧‧Facial connection surface

42‧‧‧Wire

43‧‧‧Power unit

44‧‧‧Control unit

50‧‧‧cooler

1 is a perspective view showing a conductive body and a cover in the first embodiment of the present invention. Fig. 2 is an exploded perspective view showing the conductive body and the cover in the first embodiment of the present invention. Figure 3 is a perspective view showing the refrigerant wafer in the first embodiment of the present invention. Figure 4 is a block diagram showing the first embodiment of the present invention. Figure 5 is a combined perspective view of the first embodiment of the present creation. Fig. 6 is a schematic view showing the state of use in the first embodiment of the present creation. Figure 7 is a block diagram showing the second embodiment of the present creation. Figure 8 is an exploded perspective view of the second embodiment of the present creation. Figure 9 is an exploded perspective view of the third embodiment of the present creation.

Claims (10)

A cold heat exchange cycle structure for controlling the temperature of a semiconductor device is assembled in a semiconductor device and comprises: a conductive body having a cold heat exchange space therein and having: a plurality of spacers, which are convex The inner wall of the cold heat exchange space is disposed, and the cold heat exchange space is formed with a first-class track; at least one set of interfaces is disposed on an outer side of the conductive body, and the set of interfaces is connected to the cold heat exchange space; at least one a liquid inlet hole is disposed on an outer side of the conductive body and connected to one end of the flow channel; at least one liquid outlet hole is disposed on an outer side of the conductive body and connected to the other end of the flow channel; The assembly portion is disposed on the outer side of the conductive body and is disposed adjacent to the group of interfaces; at least one cover body is correspondingly disposed on the group interface, and the cover body is provided with a plurality of corresponding portions a connecting portion, the connecting portions are disposed in the connecting portion, so that the cover covers the set of interfaces; wherein the two sides of the inner peripheral wall of the partition connected to the cold heat exchange space are curved To make the stream Continuously curved shape is provided. The cold heat exchange cycle structure for controlling the temperature of the semiconductor device according to claim 1 of the patent application, further comprising at least a uniform cold module comprising at least a uniform cold chip, a power supply unit and a control unit The cooling chip is electrically connected to the power unit, the power unit is electrically connected to the control unit, and the cooling chip is connected to the conductive body, and the cooling chip has a uniform cold connection surface and a heat generation. The connecting surface, and the cooling connecting surface and the heating connecting surface are selected from the group consisting of a flat surface, a rough surface, a surface having a plurality of blind holes, and a surface having a plurality of dicing grooves. The cold heat exchange cycle structure for controlling the temperature of a semiconductor device according to claim 2, wherein the conduction system is selected from one of a connection of the refrigeration connection surface and the heat connection surface. The cold heat exchange cycle structure for controlling the temperature of a semiconductor device according to the second aspect of the patent application, wherein the conduction system of the two cold heat exchange cycle structure respectively connects the refrigeration connection surface and the heat connection surface. The cold heat exchange cycle structure for controlling the temperature of the semiconductor device according to claim 1, further comprising a cooler connecting the liquid inlet hole and the liquid outlet, and the flow channel, the flow channel The inlet hole, the outlet port and the cooler form a cold heat exchange circulation loop. The cold heat exchange cycle structure for controlling the temperature of the semiconductor device according to claim 2, further comprising a cooler connecting the liquid inlet hole and the liquid outlet, and the conduction system is connected to the Cooling the wafer, and further, the flow channel, the liquid inlet hole, the liquid outlet port and the cooler form a cold heat exchange circulation circuit, and the cold heat exchange circulation circuit is used for the refrigeration connection surface or the heat connection surface Conduct heat conduction. The cold heat exchange cycle structure for controlling the temperature of a semiconductor device according to claim 1, wherein the components are selected from one of a screw hole, a card slot, and a card block, or a combination thereof. The connecting portion is selected from one of a through hole and a snap hole or a combination thereof. The cold heat exchange cycle structure for controlling the temperature of the semiconductor device according to claim 7 of the patent application scope further includes a plurality of array connectors, the components are passed through the connection portions, and are assembled in the groups Connecting the cover and covering the cover to the set of interfaces. The cold heat exchange cycle structure for controlling the temperature of a semiconductor device according to claim 1, wherein the conduction system is made of a corrosion-resistant metal material, and the conduction body is in the cold heat exchange space, the liquid inlet The hole and the liquid outlet are coated with a corrosion resistant coating. The cold heat exchange cycle structure for controlling the temperature of the semiconductor device according to the first aspect of the patent application, wherein the conduction system has two sets of interfaces, and the two cover systems are respectively disposed on the group interfaces.