TWM575183U - Protective component and insulated conductive heating module thereof - Google Patents

Protective component and insulated conductive heating module thereof Download PDF

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Publication number
TWM575183U
TWM575183U TW107210148U TW107210148U TWM575183U TW M575183 U TWM575183 U TW M575183U TW 107210148 U TW107210148 U TW 107210148U TW 107210148 U TW107210148 U TW 107210148U TW M575183 U TWM575183 U TW M575183U
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Taiwan
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insulating substrate
electrode
insulating
disposed
heat generating
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TW107210148U
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Chinese (zh)
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何昌緯
陳憶
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大陸商江門市鈞崴電子科技有限公司
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Priority to TW107210148U priority Critical patent/TWM575183U/en
Publication of TWM575183U publication Critical patent/TWM575183U/en

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Abstract

本創作之保護元件,包括:一絕緣導電發熱模組、一第一電極、一第二電極、一第三電極,以及一可熔導體;其絕緣導電發熱模組係設有一絕緣基板,於絕緣基板設有至少一發熱導體,各發熱導體係於絕緣基板上、下表面分別形成一外露端;第一電極及第二電極係呈未與發熱導體接觸的型態設於絕緣基板上;第三電極係呈絕緣基板下表面之發熱導體外露端電氣連接的型態設於絕緣基板之下表面;可熔導體係呈與第一電極、第二電極及絕緣基板上表面之發熱導體外露端電氣連接的型態設於絕緣基板上。俾,獲致一結構相對簡單、可靠的保護元件,不但可降低保護功能之啟動功率,更有助於整體保護元件朝薄型化方向發展。The protective component of the present invention comprises: an insulated conductive heating module, a first electrode, a second electrode, a third electrode, and a fusible conductor; and the insulated conductive heating module is provided with an insulating substrate for insulation The substrate is provided with at least one heat-generating conductor, and each of the heat-dissipating conductors respectively forms an exposed end on the upper surface and the lower surface of the insulating substrate; the first electrode and the second electrode are disposed on the insulating substrate in a form not in contact with the heat-generating conductor; The electrode system is electrically connected to the exposed end of the heating conductor on the lower surface of the insulating substrate, and is disposed on the lower surface of the insulating substrate; the fusible guiding system is electrically connected to the exposed ends of the first electrode, the second electrode and the upper surface of the insulating substrate The type is set on the insulating substrate.俾, obtaining a relatively simple and reliable protection component, not only can reduce the starting power of the protection function, but also contribute to the development of the overall protection component in the direction of thinning.

Description

保護元件及其絕緣導電發熱模組Protective component and insulated conductive heating module thereof

本創作係與電路保護元件有關,主要提供一種結構相對簡單、可靠,有助於朝薄型化方向發展的保護元件,以及與其相關的絕緣導電發熱模組。This creation is related to circuit protection components, and mainly provides a protection element that is relatively simple and reliable in structure, contributes to the development toward thinning, and an insulated conductive heating module associated therewith.

一般電氣用品在運作狀態下難免因為短路毀損、或被施加雷電突波等瞬間大電流、或因電池單元輸出電壓異常等情形而損壞電路中的某些重要器件或貴重器件,甚而燒燬電路引起火災。In general, electrical equipment is inevitably damaged by short-circuit damage, or a large current such as a lightning surge, or an abnormality in the output voltage of the battery unit, etc., or damage some important components or valuable components in the circuit, even burning the circuit to cause a fire. .

為了防止電氣用品受到瞬間超額的電流或過高的電壓而對精密電子設備造成損壞,通常會在電路中加入保護元件,其保護元件主要設有可在瞬間過大之電流所產生之熱量而被高溫熔融的可熔導體,當瞬間電流超過預定值時,其可熔導體因瞬間過大之電流所產生之熱量而被燒熔進而形成斷路,使過大之電流不再流入電路中,保護電路及電器用品免於損壞。In order to prevent damage to precision electronic equipment caused by instantaneous excess current or excessive voltage, electrical components are usually added to the circuit. The protection components are mainly provided with heat generated by an excessively large current. The molten fusible conductor, when the instantaneous current exceeds a predetermined value, the fusible conductor is melted by the heat generated by the instantaneous excessive current to form an open circuit, so that the excessive current does not flow into the circuit, the protection circuit and the electrical appliance Free of damage.

為避免瞬間過大之電流所產生之熱量被保護元件之電極吸收而使得可熔導體之熔斷時機發生延遲,坊間出現一種透過發熱體使可熔導體得以迅速熔斷的保護元件;如第1圖所示,類似設有發熱體15的保護元件,係在一外框18內設有一絕緣基板16,在該絕緣基板16上設有第一、第二電極11、12,在該絕緣基板16表面設有多個發熱體15、一分別與該些發熱體15側面端電氣連接的發熱體引出電極13、以及一由該發熱體引出電極13支撐的可熔導體14,由該可熔導體14構成該第一、第二電極11、12相通。In order to prevent the heat generated by the excessively large current from being absorbed by the electrodes of the protective element and causing the melting timing of the fusible conductor to be delayed, a protective element for rapidly melting the fusible conductor through the heating element appears as shown in Fig. 1; Similar to the protective element provided with the heating element 15, an insulating substrate 16 is disposed in an outer frame 18, and first and second electrodes 11, 12 are disposed on the insulating substrate 16, and a surface of the insulating substrate 16 is disposed on the surface of the insulating substrate 16. a plurality of heating elements 15, a heating element extraction electrode 13 electrically connected to the side ends of the heating elements 15, and a fusible conductor 14 supported by the heating element extraction electrode 13, and the soluble conductor 14 constitutes the first 1. The second electrodes 11, 12 are in communication.

類似設有發熱體15的保護元件,由第一電極11和第二電極12連接於外部電路,由可熔導體14構成了從第一電極11經由可熔導體14至第二電極12的電流路徑,同時由發熱體引出電極13構成該些發熱體15的供電路徑。Similar to the protective element provided with the heating element 15, the first electrode 11 and the second electrode 12 are connected to an external circuit, and the current path from the first electrode 11 to the second electrode 12 via the fusible conductor 14 is formed by the fusible conductor 14. At the same time, the heating element extraction electrode 13 constitutes a power supply path of the heating elements 15.

基本上,可熔導體14流過超過額定的過電流時,其可熔導體14會因為自身發熱作用而熔融,因此可將外部電路阻斷。再者,該些發熱體15因為通電發熱,達到避免瞬間過大之電流所產生之熱量被保護元件之第一、第二電極11、12吸收而造成可熔導體14熔斷延遲之目的。Basically, when the fusible conductor 14 flows over a rated overcurrent, the fusible conductor 14 is melted by its own heat generation, so that the external circuit can be blocked. Further, the heat generating bodies 15 are heated by electric current, and the heat generated by avoiding an excessively large current is absorbed by the first and second electrodes 11 and 12 of the protective element, thereby causing the meltable conductor 14 to be melted and delayed.

惟,上揭習知保護元件,係透過一絕緣部件17將該些發熱體15封裝在該絕緣基板16的表面,再於該絕緣部件17上方設置與該些發熱體15側面端電氣連接的發熱體引出電極13,不但整體構造極為複雜,不利於朝薄型化方向發展,且普遍存在發熱體15之熱源無法直接傳導至可熔導體14的現象,必須由較大功率的電流啟動防護功能,甚至可能因為發熱體15先於可熔導體14失效而無法達到預期的防護功能。However, the conventional protective element is provided by encapsulating the heat generating bodies 15 on the surface of the insulating substrate 16 through an insulating member 17, and then providing heat generating electrical connection with the side ends of the heat generating bodies 15 above the insulating member 17. The body lead electrode 13 not only has an extremely complicated overall structure, but is not conducive to the development toward the thinning direction, and the heat source of the heat generating body 15 cannot be directly conducted to the fusible conductor 14, and the protective function must be started by a relatively high current. It may be that the heating element 15 fails to achieve the desired protective function prior to the failure of the fusible conductor 14.

有鑑於此,本創作即在提供一種結構相對簡單、可靠,有助於朝薄型化方向發展的保護元件,以及與其相關的絕緣導電發熱模組。In view of this, the present invention provides a protective element which is relatively simple and reliable in structure and contributes to the development of thinning, and an insulated conductive heating module associated therewith.

本創作之保護元件,基本上包括有:一絕緣導電發熱模組、一第一電極、一第二電極、一第三電極,以及一可熔導體;該絕緣導電發熱模組係設有一絕緣基板,於該絕緣基板設有至少一發熱導體,各該發熱導體係於該絕緣基板上、下表面分別形成一外露端;該第一電極及該第二電極係呈未與該些發熱導體接觸的型態設於該絕緣基板上;該第三電極係呈與該絕緣基板下表面之該些發熱導體外露端電氣連接的型態設於該絕緣基板之下表面;該可熔導體係呈與該第一電極、該第二電極及該絕緣基板上表面之該些發熱導體外露端電氣連接的型態設於該絕緣基板上。The protective component of the present invention basically comprises: an insulated conductive heating module, a first electrode, a second electrode, a third electrode, and a fusible conductor; the insulated conductive heating module is provided with an insulating substrate Providing at least one heat generating conductor on the insulating substrate, each of the heat conducting guiding systems forming an exposed end on the upper surface and the lower surface of the insulating substrate; the first electrode and the second electrode are not in contact with the heat generating conductors The type is disposed on the insulating substrate; the third electrode is electrically connected to the exposed ends of the heat-generating conductors on the lower surface of the insulating substrate, and is disposed on the lower surface of the insulating substrate; the fusible guiding system is The first electrode, the second electrode, and the exposed ends of the heat-generating conductors on the upper surface of the insulating substrate are electrically connected to the insulating substrate.

利用上述技術特徵,本創作之保護元件,具備從第一電極經由可熔導體至第二電極的主電流路徑,以及與主電流路徑並聯從可熔導體經由各發熱導體至第三電極的發熱導體供電路徑;當遇有過電流瞬間進入主電流路徑時,可熔導體會因自身發熱熔融而將外部電路阻斷之外,同時利用發熱導體通電所產生之熱源,避免瞬間過大之電流所產生之熱量被保護元件之第一、第二電極吸收而造成可熔導體熔斷延遲;尤其,可熔導體與發熱導體之間無絕緣材料阻隔,有效提高熱傳導效率,降低啟動防護功能之功率,不但整體結構相對簡單、可靠,更有助於朝薄型化方向發展。With the above technical features, the protective element of the present invention has a main current path from the first electrode to the second electrode via the soluble conductor, and a heat conductor from the soluble conductor to the third electrode via the respective heat conductors in parallel with the main current path. The power supply path; when an overcurrent is instantaneously entered into the main current path, the fusible conductor will block the external circuit due to self-heating and melting, and at the same time, the heat source generated by the heating conductor is used to avoid the instantaneous excessive current generated. The heat is absorbed by the first and second electrodes of the protection element to cause a fusible conductor fusing delay; in particular, there is no insulation material barrier between the fusible conductor and the heating conductor, which effectively improves the heat conduction efficiency and reduces the power of the startup protection function, not only the overall structure Relatively simple and reliable, it is more conducive to the development of thinning.

依據上述技術特徵,該保護元件係進一步包括一絕緣上蓋;該絕緣上蓋係設於絕緣基板之上表面處,至少將該可熔導體、該第一電極之位於該絕緣基板之上表面的區域及該第二電極位於該絕緣基板之上表面的區域遮蔽。According to the above technical feature, the protective component further includes an insulating upper cover; the insulating upper cover is disposed on the upper surface of the insulating substrate, at least the soluble conductor, the first electrode is located on an upper surface of the insulating substrate, and The second electrode is shielded in a region of the upper surface of the insulating substrate.

依據上述技術特徵,該保護元件係進一步包括一絕緣墊片;該絕緣墊片係設於該絕緣基板之下表面處,至少將該第三電極之與各該發熱導體對應的區域遮蔽。According to the above technical feature, the protective component further includes an insulating spacer; the insulating spacer is disposed at a lower surface of the insulating substrate, and at least shields an area of the third electrode corresponding to each of the heat generating conductors.

依據上述技術特徵,該保護元件係進一步包括:一絕緣上蓋,以及一絕緣墊片;該絕緣上蓋係設於絕緣基板之上表面處,至少將該可熔導體、該第一電極之位於該絕緣基板之上表面的區域及該第二電極位於該絕緣基板之上表面的區域遮蔽;該絕緣墊片係設於該絕緣基板之下表面處,至少將該第三電極之與各該發熱導體對應的區域遮蔽。According to the above technical feature, the protection component further includes: an insulating upper cover, and an insulating spacer; the insulating upper cover is disposed at an upper surface of the insulating substrate, at least the soluble conductor and the first electrode are located at the insulating a region of the upper surface of the substrate and a region where the second electrode is located on the upper surface of the insulating substrate; the insulating spacer is disposed at a lower surface of the insulating substrate, and at least the third electrode corresponds to each of the heat generating conductors The area is covered.

依據上述技術特徵,該保護元件係進一步包括一導熱電極片;該導熱電極片係設於該絕緣基板之上表面,供襯設於各該發熱導體與該可熔導體之間。According to the above technical feature, the protective component further includes a thermally conductive electrode sheet; the thermally conductive electrode sheet is disposed on an upper surface of the insulating substrate for lining between each of the heat generating conductor and the fusible conductor.

依據上述技術特徵,該保護元件係進一步包括:一絕緣上蓋以及一導熱電極片;該絕緣上蓋係設於絕緣基板之上表面處,至少將該可熔導體、該第一電極之位於該絕緣基板之上表面的區域及該第二電極位於該絕緣基板之上表面的區域遮蔽;該導熱電極片係設於該絕緣基板之上表面,供襯設於各該發熱導體與該可熔導體之間。According to the above technical feature, the protection component further includes: an insulating upper cover and a thermal conductive electrode; the insulating upper cover is disposed on the upper surface of the insulating substrate, and at least the soluble conductor and the first electrode are located on the insulating substrate The region of the upper surface and the region of the second electrode located on the upper surface of the insulating substrate are shielded; the thermally conductive electrode sheet is disposed on the upper surface of the insulating substrate for lining between each of the heat generating conductor and the fusible conductor .

依據上述技術特徵,該保護元件係進一步包括:一絕緣墊片,以及一導熱電極片;該絕緣墊片係設於該絕緣基板之下表面處,至少將該第三電極之與各該發熱導體對應的區域遮蔽;該導熱電極片係設於該絕緣基板之上表面,供襯設於各該發熱導體與該可熔導體之間。According to the above technical feature, the protection component further includes: an insulating spacer, and a thermal conductive electrode; the insulating spacer is disposed on the lower surface of the insulating substrate, at least the third electrode and each of the heating conductors The corresponding conductive region is disposed on the upper surface of the insulating substrate, and is disposed between the heat-generating conductor and the fusible conductor.

依據上述技術特徵,該保護元件係進一步包括:一絕緣上蓋、一絕緣墊片,以及一導熱電極片;該絕緣上蓋係設於絕緣基板之上表面處,至少將該可熔導體、該第一電極之位於該絕緣基板之上表面的區域及該第二電極位於該絕緣基板之上表面的區域遮蔽;該絕緣墊片係設於該絕緣基板之下表面處,至少將該第三電極之與各該發熱導體對應的區域遮蔽;該導熱電極片係設於該絕緣基板之上表面,供襯設於各該發熱導體與該可熔導體之間。According to the above technical feature, the protection component further includes: an insulating upper cover, an insulating spacer, and a thermal conductive electrode; the insulating upper cover is disposed on the upper surface of the insulating substrate, at least the fusible conductor, the first The region of the electrode on the upper surface of the insulating substrate and the region of the second electrode on the upper surface of the insulating substrate are shielded; the insulating spacer is disposed on the lower surface of the insulating substrate, at least the third electrode Each of the heat-generating conductors is shielded from a region corresponding to the heat-generating conductor; the heat-conductive electrode sheet is disposed on an upper surface of the insulating substrate and is disposed between the heat-generating conductor and the fusible conductor.

依據上述技術特徵,該第一電極及該第二電極係各別設有一位於該絕緣基板上表面供用以與該可熔導體電氣連接的上連接部,以及一位於該絕緣基板下表面供用以連接外部電路的下連接部。According to the above technical feature, the first electrode and the second electrode are respectively provided with an upper connecting portion on the upper surface of the insulating substrate for electrically connecting to the soluble conductor, and a lower surface of the insulating substrate for connecting The lower connection of the external circuit.

依據上述技術特徵,該第一電極及該第二電極係各別設有一位於該絕緣基板上表面供用以與該可熔導體電氣連接的上連接部,以及一位於該絕緣基板下表面供用以連接外部電路的下連接部;該第一電極及該第二電極之上連接部處分別設有一焊料通孔,該絕緣導電發熱模組係於該絕緣基板上,設有複數與各該焊料通孔對應且貫穿該絕緣基板上、下表面的焊料通道。According to the above technical feature, the first electrode and the second electrode are respectively provided with an upper connecting portion on the upper surface of the insulating substrate for electrically connecting to the soluble conductor, and a lower surface of the insulating substrate for connecting a lower connecting portion of the external circuit; a solder through hole is respectively disposed at the connecting portion of the first electrode and the second electrode; the insulating conductive heating module is disposed on the insulating substrate, and the plurality of solder vias are provided Corresponding to and extending through the solder channels on the upper and lower surfaces of the insulating substrate.

依據上述技術特徵,該保護元件係進一步包括一絕緣上蓋;該絕緣上蓋係設於絕緣基板之上表面處,至少將該可熔導體、該第一電極之位於該絕緣基板之上表面的區域及該第二電極位於該絕緣基板之上表面的區域遮蔽;該第一電極及該第二電極係各別設有一位於該絕緣基板上表面供用以與該可熔導體電氣連接的上連接部,以及一位於該絕緣基板下表面供用以連接外部電路的下連接部。According to the above technical feature, the protective component further includes an insulating upper cover; the insulating upper cover is disposed on the upper surface of the insulating substrate, at least the soluble conductor, the first electrode is located on an upper surface of the insulating substrate, and The second electrode is shielded in a region of the upper surface of the insulating substrate; the first electrode and the second electrode are respectively provided with an upper connecting portion on the upper surface of the insulating substrate for electrically connecting to the soluble conductor, and A lower surface of the insulating substrate is provided for connecting a lower connection portion of the external circuit.

依據上述技術特徵,該保護元件係進一步包括一絕緣墊片;該絕緣墊片係設於該絕緣基板之下表面處,至少將該第三電極之與各該發熱導體對應的區域遮蔽;該第一電極及該第二電極係各別設有一位於該絕緣基板上表面供用以與該可熔導體電氣連接的上連接部,以及一位於該絕緣基板下表面供用以連接外部電路的下連接部。According to the above technical feature, the protective component further includes an insulating spacer; the insulating spacer is disposed at a lower surface of the insulating substrate, at least shielding a region of the third electrode corresponding to each of the heat generating conductors; An electrode and the second electrode are respectively provided with an upper connecting portion on an upper surface of the insulating substrate for electrically connecting to the soluble conductor, and a lower connecting portion on a lower surface of the insulating substrate for connecting an external circuit.

依據上述技術特徵,該保護元件係進一步包括:一絕緣上蓋,以及一絕緣墊片;該絕緣上蓋係設於絕緣基板之上表面處,至少將該可熔導體、該第一電極之位於該絕緣基板之上表面的區域及該第二電極位於該絕緣基板之上表面的區域遮蔽;該絕緣墊片係設於該絕緣基板之下表面處,至少將該第三電極之與各該發熱導體對應的區域遮蔽;該第一電極及該第二電極係各別設有一位於該絕緣基板上表面供用以與該可熔導體電氣連接的上連接部,以及一位於該絕緣基板下表面供用以連接外部電路的下連接部。According to the above technical feature, the protection component further includes: an insulating upper cover, and an insulating spacer; the insulating upper cover is disposed at an upper surface of the insulating substrate, at least the soluble conductor and the first electrode are located at the insulating a region of the upper surface of the substrate and a region where the second electrode is located on the upper surface of the insulating substrate; the insulating spacer is disposed at a lower surface of the insulating substrate, and at least the third electrode corresponds to each of the heat generating conductors The first electrode and the second electrode are respectively provided with an upper connecting portion on the upper surface of the insulating substrate for electrically connecting with the fusible conductor, and a lower surface of the insulating substrate for connecting the external portion. The lower connection of the circuit.

依據上述技術特徵,該保護元件係進一步包括一導熱電極片;該導熱電極片係設於該絕緣基板之上表面,供襯設於各該發熱導體與該可熔導體之間;該第一電極及該第二電極係各別設有一位於該絕緣基板上表面供用以與該可熔導體電氣連接的上連接部,以及一位於該絕緣基板下表面供用以連接外部電路的下連接部。According to the above technical feature, the protective element further includes a thermally conductive electrode sheet; the thermally conductive electrode sheet is disposed on an upper surface of the insulating substrate for lining between each of the heat generating conductor and the fusible conductor; the first electrode And the second electrode system is respectively provided with an upper connecting portion on the upper surface of the insulating substrate for electrically connecting to the soluble conductor, and a lower connecting portion on the lower surface of the insulating substrate for connecting an external circuit.

依據上述技術特徵,該保護元件係進一步包括:一絕緣上蓋以及一導熱電極片;該絕緣上蓋係設於絕緣基板之上表面處,至少將該可熔導體、該第一電極之位於該絕緣基板之上表面的區域及該第二電極位於該絕緣基板之上表面的區域遮蔽;該導熱電極片係設於該絕緣基板之上表面,供襯設於各該發熱導體與該可熔導體之間;該第一電極及該第二電極係各別設有一位於該絕緣基板上表面供用以與該可熔導體電氣連接的上連接部,以及一位於該絕緣基板下表面供用以連接外部電路的下連接部。According to the above technical feature, the protection component further includes: an insulating upper cover and a thermal conductive electrode; the insulating upper cover is disposed on the upper surface of the insulating substrate, and at least the soluble conductor and the first electrode are located on the insulating substrate The region of the upper surface and the region of the second electrode located on the upper surface of the insulating substrate are shielded; the thermally conductive electrode sheet is disposed on the upper surface of the insulating substrate for lining between each of the heat generating conductor and the fusible conductor The first electrode and the second electrode are respectively provided with an upper connecting portion on an upper surface of the insulating substrate for electrically connecting to the soluble conductor, and a lower surface on the lower surface of the insulating substrate for connecting an external circuit. Connection.

依據上述技術特徵,該保護元件係進一步包括:一絕緣墊片,以及一導熱電極片;該絕緣墊片係設於該絕緣基板之下表面處,至少將該第三電極之與各該發熱導體對應的區域遮蔽;該導熱電極片係設於該絕緣基板之上表面,供襯設於各該發熱導體與該可熔導體之間;該第一電極及該第二電極係各別設有一位於該絕緣基板上表面供用以與該可熔導體電氣連接的上連接部,以及一位於該絕緣基板下表面供用以連接外部電路的下連接部。According to the above technical feature, the protection component further includes: an insulating spacer, and a thermal conductive electrode; the insulating spacer is disposed on the lower surface of the insulating substrate, at least the third electrode and each of the heating conductors The conductive electrode is disposed on the upper surface of the insulating substrate, and is disposed between the heat-generating conductor and the fusible conductor; the first electrode and the second electrode are respectively disposed at a position The upper surface of the insulating substrate is provided with an upper connecting portion for electrically connecting to the fusible conductor, and a lower connecting portion for connecting the external circuit on the lower surface of the insulating substrate.

依據上述技術特徵,該保護元件係進一步包括:一絕緣上蓋、一絕緣墊片,以及一導熱電極片;該絕緣上蓋係設於絕緣基板之上表面處,至少將該可熔導體、該第一電極之位於該絕緣基板之上表面的區域及該第二電極位於該絕緣基板之上表面的區域遮蔽;該絕緣墊片係設於該絕緣基板之下表面處,至少將該第三電極之與各該發熱導體對應的區域遮蔽;該導熱電極片係設於該絕緣基板之上表面,供襯設於各該發熱導體與該可熔導體之間;該第一電極及該第二電極係各別設有一位於該絕緣基板上表面供用以與該可熔導體電氣連接的上連接部,以及一位於該絕緣基板下表面供用以連接外部電路的下連接部。According to the above technical feature, the protection component further includes: an insulating upper cover, an insulating spacer, and a thermal conductive electrode; the insulating upper cover is disposed on the upper surface of the insulating substrate, at least the fusible conductor, the first The region of the electrode on the upper surface of the insulating substrate and the region of the second electrode on the upper surface of the insulating substrate are shielded; the insulating spacer is disposed on the lower surface of the insulating substrate, at least the third electrode The heat conducting electrode sheets are disposed on the upper surface of the insulating substrate, and are disposed between the heat generating conductors and the soluble conductor; the first electrode and the second electrode are respectively An upper connection portion on the upper surface of the insulating substrate for electrically connecting to the fusible conductor, and a lower connection portion on the lower surface of the insulating substrate for connecting an external circuit are disposed.

依據上述技術特徵,該保護元件係進一步包括一絕緣上蓋;該絕緣上蓋係設於絕緣基板之上表面處,至少將該可熔導體、該第一電極之位於該絕緣基板之上表面的區域及該第二電極位於該絕緣基板之上表面的區域遮蔽;該第一電極及該第二電極係各別設有一位於該絕緣基板上表面供用以與該可熔導體電氣連接的上連接部,以及一位於該絕緣基板下表面供用以連接外部電路的下連接部;該第一電極及該第二電極之上連接部處分別設有一焊料通孔,該絕緣導電發熱模組係於該絕緣基板上,設有複數與各該焊料通孔對應且貫穿該絕緣基板上、下表面的焊料通道。According to the above technical feature, the protective component further includes an insulating upper cover; the insulating upper cover is disposed on the upper surface of the insulating substrate, at least the soluble conductor, the first electrode is located on an upper surface of the insulating substrate, and The second electrode is shielded in a region of the upper surface of the insulating substrate; the first electrode and the second electrode are respectively provided with an upper connecting portion on the upper surface of the insulating substrate for electrically connecting to the soluble conductor, and a lower connecting portion on the lower surface of the insulating substrate for connecting an external circuit; a solder through hole is respectively disposed on the connecting portion of the first electrode and the second electrode, and the insulating conductive heating module is attached to the insulating substrate And a plurality of solder passages corresponding to the solder through holes and penetrating through the upper and lower surfaces of the insulating substrate.

依據上述技術特徵,該保護元件係進一步包括一絕緣墊片;該絕緣墊片係設於該絕緣基板之下表面處,至少將該第三電極之與各該發熱導體對應的區域遮蔽;該第一電極及該第二電極係各別設有一位於該絕緣基板上表面供用以與該可熔導體電氣連接的上連接部,以及一位於該絕緣基板下表面供用以連接外部電路的下連接部;該第一電極及該第二電極之上連接部處分別設有一焊料通孔,該絕緣導電發熱模組係於該絕緣基板上,設有複數與各該焊料通孔對應且貫穿該絕緣基板上、下表面的焊料通道。According to the above technical feature, the protective component further includes an insulating spacer; the insulating spacer is disposed at a lower surface of the insulating substrate, at least shielding a region of the third electrode corresponding to each of the heat generating conductors; An electrode and the second electrode are respectively provided with an upper connecting portion on an upper surface of the insulating substrate for electrically connecting to the soluble conductor, and a lower connecting portion on a lower surface of the insulating substrate for connecting an external circuit; A soldering through hole is respectively disposed on the connecting portion of the first electrode and the second electrode, and the insulating conductive heating module is disposed on the insulating substrate, and is provided with a plurality of soldering through holes and penetrating the insulating substrate. , the solder channel on the lower surface.

依據上述技術特徵,該保護元件係進一步包括:一絕緣上蓋,以及一絕緣墊片;該絕緣上蓋係設於絕緣基板之上表面處,至少將該可熔導體、該第一電極之位於該絕緣基板之上表面的區域及該第二電極位於該絕緣基板之上表面的區域遮蔽;該絕緣墊片係設於該絕緣基板之下表面處,至少將該第三電極之與各該發熱導體對應的區域遮蔽;該第一電極及該第二電極係各別設有一位於該絕緣基板上表面供用以與該可熔導體電氣連接的上連接部,以及一位於該絕緣基板下表面供用以連接外部電路的下連接部;該第一電極及該第二電極之上連接部處分別設有一焊料通孔,該絕緣導電發熱模組係於該絕緣基板上,設有複數與各該焊料通孔對應且貫穿該絕緣基板上、下表面的焊料通道。According to the above technical feature, the protection component further includes: an insulating upper cover, and an insulating spacer; the insulating upper cover is disposed at an upper surface of the insulating substrate, at least the soluble conductor and the first electrode are located at the insulating a region of the upper surface of the substrate and a region where the second electrode is located on the upper surface of the insulating substrate; the insulating spacer is disposed at a lower surface of the insulating substrate, and at least the third electrode corresponds to each of the heat generating conductors The first electrode and the second electrode are respectively provided with an upper connecting portion on the upper surface of the insulating substrate for electrically connecting with the fusible conductor, and a lower surface of the insulating substrate for connecting the external portion. a lower connecting portion of the circuit; a solder through hole is respectively disposed at the connecting portion of the first electrode and the second electrode; the insulating conductive heating module is disposed on the insulating substrate, and the plurality of soldering holes are respectively provided corresponding to the solder through holes And a solder passage penetrating the upper and lower surfaces of the insulating substrate.

依據上述技術特徵,該保護元件係進一步包括一導熱電極片;該導熱電極片係設於該絕緣基板之上表面,供襯設於各該發熱導體與該可熔導體之間;該第一電極及該第二電極係各別設有一位於該絕緣基板上表面供用以與該可熔導體電氣連接的上連接部,以及一位於該絕緣基板下表面供用以連接外部電路的下連接部;該第一電極及該第二電極之上連接部處分別設有一焊料通孔,該絕緣導電發熱模組係於該絕緣基板上,設有複數與各該焊料通孔對應且貫穿該絕緣基板上、下表面的焊料通道。According to the above technical feature, the protective element further includes a thermally conductive electrode sheet; the thermally conductive electrode sheet is disposed on an upper surface of the insulating substrate for lining between each of the heat generating conductor and the fusible conductor; the first electrode And the second electrode system is respectively provided with an upper connecting portion on the upper surface of the insulating substrate for electrically connecting to the soluble conductor, and a lower connecting portion on the lower surface of the insulating substrate for connecting an external circuit; A soldering through hole is respectively disposed at a connecting portion of the first electrode and the second electrode, and the insulating conductive heat generating module is disposed on the insulating substrate, and is provided with a plurality of solder through holes corresponding to the through holes and extending through the insulating substrate Solder channel on the surface.

依據上述技術特徵,該保護元件係進一步包括:一絕緣上蓋以及一導熱電極片;該絕緣上蓋係設於絕緣基板之上表面處,至少將該可熔導體、該第一電極之位於該絕緣基板之上表面的區域及該第二電極位於該絕緣基板之上表面的區域遮蔽;該導熱電極片係設於該絕緣基板之上表面,供襯設於各該發熱導體與該可熔導體之間;該第一電極及該第二電極係各別設有一位於該絕緣基板上表面供用以與該可熔導體電氣連接的上連接部,以及一位於該絕緣基板下表面供用以連接外部電路的下連接部;該第一電極及該第二電極之上連接部處分別設有一焊料通孔,該絕緣導電發熱模組係於該絕緣基板上,設有複數與各該焊料通孔對應且貫穿該絕緣基板上、下表面的焊料通道。According to the above technical feature, the protection component further includes: an insulating upper cover and a thermal conductive electrode; the insulating upper cover is disposed on the upper surface of the insulating substrate, and at least the soluble conductor and the first electrode are located on the insulating substrate The region of the upper surface and the region of the second electrode located on the upper surface of the insulating substrate are shielded; the thermally conductive electrode sheet is disposed on the upper surface of the insulating substrate for lining between each of the heat generating conductor and the fusible conductor The first electrode and the second electrode are respectively provided with an upper connecting portion on an upper surface of the insulating substrate for electrically connecting to the soluble conductor, and a lower surface on the lower surface of the insulating substrate for connecting an external circuit. a connecting portion; a solder through hole is respectively disposed on the connecting portion of the first electrode and the second electrode; the insulating conductive heating module is disposed on the insulating substrate, and a plurality of the soldering through holes are corresponding to the through holes A solder channel that insulates the upper and lower surfaces of the substrate.

依據上述技術特徵,該保護元件係進一步包括:一絕緣墊片,以及一導熱電極片;該絕緣墊片係設於該絕緣基板之下表面處,至少將該第三電極之與各該發熱導體對應的區域遮蔽;該導熱電極片係設於該絕緣基板之上表面,供襯設於各該發熱導體與該可熔導體之間;該第一電極及該第二電極係各別設有一位於該絕緣基板上表面供用以與該可熔導體電氣連接的上連接部,以及一位於該絕緣基板下表面供用以連接外部電路的下連接部;該第一電極及該第二電極之上連接部處分別設有一焊料通孔,該絕緣導電發熱模組係於該絕緣基板上,設有複數與各該焊料通孔對應且貫穿該絕緣基板上、下表面的焊料通道。According to the above technical feature, the protection component further includes: an insulating spacer, and a thermal conductive electrode; the insulating spacer is disposed on the lower surface of the insulating substrate, at least the third electrode and each of the heating conductors The conductive electrode is disposed on the upper surface of the insulating substrate, and is disposed between the heat-generating conductor and the fusible conductor; the first electrode and the second electrode are respectively disposed at a position The upper surface of the insulating substrate is provided with an upper connecting portion for electrically connecting to the fusible conductor, and a lower connecting portion for connecting the external circuit on the lower surface of the insulating substrate; the first electrode and the second electrode upper connecting portion Each of the insulating conductive heating modules is disposed on the insulating substrate, and is provided with a plurality of solder passages corresponding to the solder through holes and extending through the upper and lower surfaces of the insulating substrate.

依據上述技術特徵,該保護元件係進一步包括:一絕緣上蓋、一絕緣墊片,以及一導熱電極片;該絕緣上蓋係設於絕緣基板之上表面處,至少將該可熔導體、該第一電極之位於該絕緣基板之上表面的區域及該第二電極位於該絕緣基板之上表面的區域遮蔽;該絕緣墊片係設於該絕緣基板之下表面處,至少將該第三電極之與各該發熱導體對應的區域遮蔽;該導熱電極片係設於該絕緣基板之上表面,供襯設於各該發熱導體與該可熔導體之間;該第一電極及該第二電極係各別設有一位於該絕緣基板上表面供用以與該可熔導體電氣連接的上連接部,以及一位於該絕緣基板下表面供用以連接外部電路的下連接部;該第一電極及該第二電極之上連接部處分別設有一焊料通孔,該絕緣導電發熱模組係於該絕緣基板上,設有複數與各該焊料通孔對應且貫穿該絕緣基板上、下表面的焊料通道。According to the above technical feature, the protection component further includes: an insulating upper cover, an insulating spacer, and a thermal conductive electrode; the insulating upper cover is disposed on the upper surface of the insulating substrate, at least the fusible conductor, the first The region of the electrode on the upper surface of the insulating substrate and the region of the second electrode on the upper surface of the insulating substrate are shielded; the insulating spacer is disposed on the lower surface of the insulating substrate, at least the third electrode The heat conducting electrode sheets are disposed on the upper surface of the insulating substrate, and are disposed between the heat generating conductors and the soluble conductor; the first electrode and the second electrode are respectively An upper connection portion on the upper surface of the insulating substrate for electrically connecting to the soluble conductor, and a lower connection portion on the lower surface of the insulating substrate for connecting an external circuit; the first electrode and the second electrode Each of the upper connecting portions is provided with a solder through hole, and the insulated conductive heating module is disposed on the insulating substrate, and is provided with a plurality of solder through holes corresponding to the through holes and penetrates the insulating substrate , The lower surface of the solder channels.

依據上述技術特徵,該絕緣導電發熱模組係設有複數呈直線排列配置的發熱導體。According to the above technical feature, the insulated conductive heating module is provided with a plurality of heat generating conductors arranged in a line.

依據上述技術特徵,該絕緣導電發熱模組係設有複數呈矩陣排列配置的發熱導體。According to the above technical feature, the insulated conductive heat generating module is provided with a plurality of heat generating conductors arranged in a matrix arrangement.

依據上述技術特徵,各該發熱導體之斷面係呈長條形。According to the above technical feature, the cross section of each of the heat generating conductors is elongated.

依據上述技術特徵,各該發熱導體之斷面係呈方形。According to the above technical features, the cross section of each of the heat generating conductors is square.

依據上述技術特徵,各該發熱導體之斷面係呈圓形。According to the above technical feature, each of the heat generating conductors has a circular cross section.

依據上述技術特徵,該絕緣基板係由陶瓷材料燒結而成。According to the above technical features, the insulating substrate is sintered from a ceramic material.

本創作同時揭露一種保護元件之絕緣導電發熱模組,該絕緣導電發熱模組係設有一絕緣基板,於該絕緣基板設有至少一發熱導體;其中:各該發熱導體係於該絕緣基板上、下表面分別形成一外露端。The present invention also discloses an insulating conductive heating module of a protective component, wherein the insulating conductive heating module is provided with an insulating substrate, and the insulating substrate is provided with at least one heat generating conductor; wherein: each of the heat conducting guiding systems is on the insulating substrate, The lower surface forms an exposed end, respectively.

依據上述結構特徵,該絕緣導電發熱模組係於絕緣基板上,設有至少兩個貫穿該絕緣基板上、下表面的焊料通道。According to the above structural feature, the insulated conductive heating module is mounted on the insulating substrate, and is provided with at least two solder passages penetrating the upper and lower surfaces of the insulating substrate.

依據上述結構特徵,該絕緣導電發熱模組係設有複數呈直線排列配置的發熱導體。According to the above structural feature, the insulated conductive heating module is provided with a plurality of heat generating conductors arranged in a line.

依據上述結構特徵,該絕緣導電發熱模組係設有複數呈矩陣排列配置的發熱導體。According to the above structural feature, the insulated conductive heat generating module is provided with a plurality of heat generating conductors arranged in a matrix.

依據上述結構特徵,各該發熱導體之斷面係呈長條形。According to the above structural features, the cross section of each of the heat generating conductors is elongated.

依據上述結構特徵,各該發熱導體之斷面係呈方形。According to the above structural features, the cross section of each of the heat generating conductors is square.

依據上述結構特徵,各該發熱導體之斷面係呈圓形。According to the above structural features, each of the heat generating conductors has a circular cross section.

依據上述結構特徵,該絕緣基板係由陶瓷材料燒結而成。According to the above structural features, the insulating substrate is sintered from a ceramic material.

本創作主要利用絕緣導電發熱模組、第一電極、第二電極、第三電極,以及可熔導體之結構配置,獲致一結構相對簡單、可靠的保護元件,不但可降低保護功能之啟動功率,更有助於整體保護元件朝薄型化方向發展;以及,尚可利用於於絕緣導電發熱模組之絕緣基板並聯複數個發熱導體之設計,避免因為部分發熱導體失效而導致對可熔導體之熱傳功能完全失效,以相對更為積極、可靠之手段,維護使用對象之電路安全。The present invention mainly utilizes the structural arrangement of the insulated conductive heating module, the first electrode, the second electrode, the third electrode, and the fusible conductor to obtain a relatively simple and reliable protection component, which can reduce the starting power of the protection function. It is more conducive to the development of the overall protection element in the direction of thinning; and, the insulating substrate of the insulated conductive heating module can be used in parallel to design a plurality of heat-generating conductors to avoid heat of the fusible conductor due to failure of part of the heating conductor. The transmission function is completely ineffective, and the circuit safety of the object to be used is maintained in a relatively more active and reliable manner.

本創作主要提供一種結構相對簡單、可靠,有助於朝薄型化方向發展的保護元件,以及與其相關的絕緣導電發熱模組,如第2圖至第6圖所示,本創作之保護元件,基本上包括有:一絕緣導電發熱模組20、一第一電極31、一第二電極32、一第三電極33,以及一可熔導體40;其中:The present invention mainly provides a protective element which is relatively simple and reliable in structure and contributes to the development of thinning, and an insulated conductive heating module associated therewith, as shown in Figures 2 to 6, the protective element of the present invention, The method basically includes: an insulated conductive heating module 20, a first electrode 31, a second electrode 32, a third electrode 33, and a fusible conductor 40; wherein:

該絕緣導電發熱模組20係設有一絕緣基板21,於該絕緣基板21設有至少一發熱導體22,各該發熱導體22係於該絕緣基板21上、下表面分別形成一外露端;於實施時,該絕緣基板21係可以由陶瓷材料燒結而成,且於該絕緣基材21設有至少一發熱導體填充孔23,該至少一發熱導體22係填設於該至少一發熱導體填充孔23中;以及,各該發熱導體22係可於該絕緣基板21加工成型後,透過組裝方式設於該發熱導體填充孔23中,或者透過燒結方式與該絕緣基板21一體成型。The insulating conductive heating module 20 is provided with an insulating substrate 21, and at least one heat generating conductor 22 is disposed on the insulating substrate 21. Each of the heat generating conductors 22 is formed on the insulating substrate 21 and has an exposed end on the lower surface. The insulating substrate 21 can be sintered from a ceramic material, and the insulating substrate 21 is provided with at least one heat-generating conductor filling hole 23, and the at least one heat-generating conductor 22 is filled in the at least one heat-generating conductor filling hole 23 And the heat-generating conductor 22 can be formed in the heat-insulating conductor filling hole 23 by means of assembly after the insulating substrate 21 is formed, or can be integrally molded with the insulating substrate 21 by means of sintering.

該第一電極31及該第二電極32係呈未與該些發熱導體22接觸的型態設於該絕緣基板21上;在本實施例中,該第一電極31及該第二電極32係各別設有一位於該絕緣基板21上表面供用以與該可熔導體40電氣連接的上連接部311、321,以及一位於該絕緣基板21下表面供用以連接外部電路的下連接部312、322。The first electrode 31 and the second electrode 32 are disposed on the insulating substrate 21 in a state that is not in contact with the heat generating conductors 22; in the embodiment, the first electrode 31 and the second electrode 32 are An upper connection portion 311, 321 on the upper surface of the insulating substrate 21 for electrically connecting to the soluble conductor 40, and a lower connection portion 312, 322 on the lower surface of the insulating substrate 21 for connecting external circuits are respectively provided. .

該第三電極33係呈與該絕緣基板21下表面之該些發熱導體22外露端電氣連接的型態設於該絕緣基板21之下表面。The third electrode 33 is electrically connected to the exposed ends of the heat generating conductors 22 on the lower surface of the insulating substrate 21, and is disposed on the lower surface of the insulating substrate 21.

該可熔導體40係呈與該第一電極31、該第二電極32及該絕緣基板21上表面之該些發熱導體22外露端電氣連接的型態設於該絕緣基板21上。The soluble conductor 40 is disposed on the insulating substrate 21 in a form electrically connected to the exposed ends of the first electrode 31, the second electrode 32, and the heat generating conductors 22 on the upper surface of the insulating substrate 21.

原則上,本創作之保護元件,係可由該絕緣導電發熱模組20、第一電極31、第二電極32、第三電極33與可熔導體40構成一從第一電極31經由可熔導體40至第二電極32的主電流路徑,以及一與主電流路徑並聯從可熔導體40經由各發熱導體22至第三電極33的發熱導體22供電路徑。In principle, the protective element of the present invention can be formed by the insulated conductive heating module 20, the first electrode 31, the second electrode 32, the third electrode 33 and the fusible conductor 40 from the first electrode 31 via the fusible conductor 40. The main current path to the second electrode 32, and a heat supply conductor 22 from the fusible conductor 40 to the third electrode 33 in parallel with the main current path.

亦即,當遇有過電流瞬間進入主電流路徑時,可熔導體40會因自身發熱熔融而將外部電路阻斷之外,同時利用發熱導體22通電所產生之熱源傳遞至可熔導體40,避免瞬間過大之電流所產生之熱量第一、第二電極31、32吸收而造成可熔導體40熔斷延遲。That is, when an overcurrent is instantaneously entered into the main current path, the fusible conductor 40 is blocked by the external heat circuit due to self-heating melting, and the heat source generated by energization of the heat generating conductor 22 is transmitted to the fusible conductor 40, The heat generated by the excessively large current is prevented from being absorbed by the first and second electrodes 31, 32 to cause the fusible conductor 40 to be blown delayed.

尤其,可熔導體40與發熱導體22之間無須額外的絕緣材料,有效提高熱傳導效率,降低啟動防護功能之功率;再者,將發熱導體22貫穿該絕緣基板21,以及將所有的電極(第一、第二、第三電極)設於該絕緣基板21表面,並且將各電極(第一、第二、第三電極)位於該絕緣基板21表面的區域平面化之設計,不但可有效利用該絕緣基板21之高度空間,並且可以大幅降低發熱導體22之尺寸及配置數量限制,不但整體結構相對簡單、可靠,更有助於朝薄型化方向發展。In particular, no additional insulating material is required between the fusible conductor 40 and the heat generating conductor 22, which effectively improves the heat transfer efficiency and reduces the power for starting the protective function. Further, the heat generating conductor 22 is penetrated through the insulating substrate 21, and all the electrodes are used. The first, second, and third electrodes are provided on the surface of the insulating substrate 21, and the regions in which the electrodes (the first, second, and third electrodes) are located on the surface of the insulating substrate 21 are planarized, and the utility model can be effectively utilized. The height of the insulating substrate 21 is large, and the size and arrangement limit of the heat-generating conductor 22 can be greatly reduced. The overall structure is relatively simple and reliable, and contributes to the development toward thinning.

本創作之保護元件,係可如第7圖及第9圖所示,進一步包括一絕緣上蓋50;該絕緣上蓋50係設於該絕緣基板21之上表面處,至少將該可熔導體40、該第一電極31之位於該絕緣基板21之上表面的區域及該第二電極32位於該絕緣基板21之上表面的區域遮蔽;於實施時,該絕緣上蓋50係可透過一黏著材料70封裝於該絕緣基板21之上表面,供用以至少對該可熔導體40、該第一電極31之位於該絕緣基板21之上表面的區域及該第二電極32位於該絕緣基板21之上表面的區域構成屏蔽防護效果。The protection element of the present invention may further include an insulating upper cover 50 as shown in FIGS. 7 and 9; the insulating upper cover 50 is disposed on the upper surface of the insulating substrate 21, at least the fusible conductor 40, The region of the first electrode 31 on the upper surface of the insulating substrate 21 and the region of the second electrode 32 on the upper surface of the insulating substrate 21 are shielded; in practice, the insulating cover 50 is encapsulated by an adhesive material 70. On the upper surface of the insulating substrate 21, at least the region of the soluble conductor 40, the first electrode 31 on the upper surface of the insulating substrate 21, and the second electrode 32 on the upper surface of the insulating substrate 21 are provided. The area constitutes a shielding effect.

本創作之保護元件,亦可進一步包括一絕緣墊片60;該絕緣墊片60係設於該絕緣基板21之下表面處,至少將該第三電極33之與各該發熱導體22對應的區域遮蔽,可利用絕緣墊片60防止發熱導體22所產生之熱源影響使用對象之電路板或元件,同時可使發熱導體22所產生之熱源具有朝向可熔導體40傳遞的指向性。The protective component of the present invention may further include an insulating spacer 60; the insulating spacer 60 is disposed on the lower surface of the insulating substrate 21, and at least the region of the third electrode 33 corresponding to each of the heat generating conductors 22 The insulating spacer 60 can be used to prevent the heat source generated by the heat generating conductor 22 from affecting the circuit board or component of the object to be used, and the heat source generated by the heat generating conductor 22 can have directivity transmitted toward the soluble conductor 40.

當然,本創作之保護元件能夠以進一步包括:一絕緣上蓋50,以及一絕緣墊片60;該絕緣上蓋50係設於該絕緣基板21之上表面處,至少將該可熔導體40、該第一電極31之位於該絕緣基板21之上表面的區域及該第二電極32位於該絕緣基板21之上表面的區域遮蔽;該絕緣墊片60係設於該絕緣基板21之下表面處,至少將該第三電極33之與各該發熱導體22對應的區域遮蔽之實施樣態呈現。Of course, the protective component of the present invention can further include: an insulating upper cover 50, and an insulating spacer 60; the insulating upper cover 50 is disposed on the upper surface of the insulating substrate 21, at least the soluble conductor 40, the first An area of the electrode 31 on the upper surface of the insulating substrate 21 and a region of the second electrode 32 on the upper surface of the insulating substrate 21 are shielded; the insulating spacer 60 is disposed on the lower surface of the insulating substrate 21, at least The implementation of the region of the third electrode 33 corresponding to each of the heat generating conductors 22 is presented.

再者,本創作之保護元件係可進一步包括一導熱電極片34;該導熱電極片34係設於該絕緣基板21之上表面,供襯設於各該發熱導體22與該可熔導體40之間,供用以使該些導熱電極片34所產生之熱源得以均勻的傳遞至其與可熔導體40對應的區域。Furthermore, the protective element of the present invention may further include a thermally conductive electrode sheet 34; the thermally conductive electrode sheet 34 is disposed on the upper surface of the insulating substrate 21 for lining the heat generating conductors 22 and the fusible conductor 40. The heat source generated by the thermally conductive electrode sheets 34 is uniformly transmitted to a region corresponding to the fusible conductor 40.

本創作之保護元件,亦能夠以進一步包括:一絕緣上蓋50以及一導熱電極片34;該絕緣上蓋50係設於該絕緣基板21之上表面處,至少將該可熔導體40、該第一電極31之位於該絕緣基板21之上表面的區域及該第二電極32位於該絕緣基板21之上表面的區域遮蔽;該導熱電極片34係設於該絕緣基板21之上表面,供襯設於各該發熱導體22與該可熔導體40之間的實施樣態呈現。The protection component of the present invention can further include: an insulating upper cover 50 and a thermal conductive electrode 34; the insulating upper cover 50 is disposed on the upper surface of the insulating substrate 21, at least the fusible conductor 40, the first The region of the electrode 31 on the upper surface of the insulating substrate 21 and the region of the second electrode 32 on the upper surface of the insulating substrate 21 are shielded; the thermally conductive electrode sheet 34 is disposed on the upper surface of the insulating substrate 21 for lining The implementation between each of the heat-generating conductors 22 and the fusible conductor 40 is presented.

本創作之保護元件,亦能夠以進一步包括:一絕緣墊片60,以及一導熱電極片34;該絕緣墊片60係設於該絕緣基板21之下表面處,至少將該第三電極33之與各該發熱導體22對應的區域遮蔽;該導熱電極片34係設於該絕緣基板21之上表面,供襯設於各該發熱導體22與該可熔導體40之間的實施樣態呈現。The protective component of the present invention can further include: an insulating spacer 60 and a thermal conductive electrode 34; the insulating spacer 60 is disposed at a lower surface of the insulating substrate 21, at least the third electrode 33 The area corresponding to each of the heat-generating conductors 22 is shielded; the heat-conductive electrode sheets 34 are disposed on the upper surface of the insulating substrate 21, and are disposed to be disposed between the heat-generating conductors 22 and the fusible conductors 40.

本創作之保護元件,亦能夠以進一步包括:一絕緣上蓋50、一絕緣墊片60,以及一導熱電極片34;該絕緣上蓋50係設於該絕緣基板21之上表面處,至少將該可熔導體40、該第一電極31之位於該絕緣基板21之上表面的區域及該第二電極32位於該絕緣基板21之上表面的區域遮蔽;該絕緣墊片60係設於該絕緣基板21之下表面處,至少將該第三電極33之與各該發熱導體22對應的區域遮蔽;該導熱電極片34係設於該絕緣基板21之上表面,供襯設於各該發熱導體22與該可熔導體40之間的實施樣態呈現。The protective component of the present invention can further include: an insulating upper cover 50, an insulating spacer 60, and a thermal conductive electrode 34; the insulating upper cover 50 is disposed on the upper surface of the insulating substrate 21, at least a portion of the first electrode 31 on the upper surface of the insulating substrate 21 and a region where the second electrode 32 is located on the upper surface of the insulating substrate 21; the insulating spacer 60 is disposed on the insulating substrate 21 At least a portion of the third electrode 33 corresponding to each of the heat-generating conductors 22 is shielded from the lower surface; the heat-conductive electrode sheet 34 is disposed on the upper surface of the insulating substrate 21 for lining the heat-generating conductors 22 and The implementation between the fusible conductors 40 is presented.

再者,如第10圖所示,本創作之保護元件,在該第一電極31及該第二電極32係各別設有一位於該絕緣基板21上表面供用以與該可熔導體40電氣連接的上連接部311、321,以及一位於該絕緣基板21下表面供用以連接外部電路的下連接部312、322之實施樣態下,該第一電極31及該第二電極32之上連接部311、321處分別設有一焊料通孔313、323,該絕緣導電發熱模組20係於該絕緣基板21上,設有複數與各該焊料通孔313、323對應且貫穿該絕緣基板21上、下表面的焊料通道24,可透過焊料(圖略)填入焊料通孔313、323及焊料通道24加強第一、第二電極之固定效果。Furthermore, as shown in FIG. 10, the first protection element and the second electrode 32 are respectively disposed on the upper surface of the insulating substrate 21 for electrically connecting to the soluble conductor 40. The upper connecting portion 311, 321 and a lower connecting portion 312, 322 on the lower surface of the insulating substrate 21 for connecting an external circuit, the first electrode 31 and the second electrode 32 upper connecting portion Each of the 311 and 321 is provided with a solder through hole 313, 323. The insulated conductive heat generating module 20 is disposed on the insulating substrate 21, and is provided with a plurality of solder vias 313 and 323 corresponding to the insulating substrate 21, The solder channel 24 on the lower surface can fill the solder vias 313, 323 and the solder channel 24 through the solder (not shown) to enhance the fixing effect of the first and second electrodes.

本創作之保護元件不論是否進一步包括有:該絕緣上蓋50、該絕緣墊片60或該導熱電極片34;整體保護元件係能夠以該第一電極31及該第二電極32係各別設有一位於該絕緣基板21上表面供用以與該可熔導體40電氣連接的上連接部311、321,以及一位於該絕緣基板21下表面供用以連接外部電路的下連接部312、322之實施樣態呈現。The protection element of the present invention includes: the insulating cover 50, the insulating spacer 60 or the thermally conductive electrode sheet 34; the integral protection element can be respectively provided with the first electrode 31 and the second electrode 32. The upper surface of the insulating substrate 21 is provided with upper connecting portions 311 and 321 for electrically connecting to the soluble conductor 40, and an upper connecting portion 312, 322 for connecting the external circuit to the lower surface of the insulating substrate 21 is implemented. Presented.

同樣的,本創作之保護元件不論是否進一步包括有:該絕緣上蓋50、該絕緣墊片60或該導熱電極片34;整體保護元件係亦能夠以該第一電極31及該第二電極32係各別設有一位於該絕緣基板21上表面供用以與該可熔導體40電氣連接的上連接部311、321,以及一位於該絕緣基板21下表面供用以連接外部電路的下連接部312、322;該第一電極31及該第二電極32之上連接部311、321處分別設有一焊料通孔313、323,該絕緣導電發熱模組20係於該絕緣基板21上,設有複數與各該焊料通孔313、323對應且貫穿該絕緣基板21上、下表面的焊料通道24之實施樣態呈現。Similarly, the protective component of the present invention further includes: the insulating upper cover 50, the insulating spacer 60 or the thermally conductive electrode sheet 34; the integral protective element can also be the first electrode 31 and the second electrode 32 An upper connection portion 311, 321 on the upper surface of the insulating substrate 21 for electrically connecting to the soluble conductor 40, and a lower connection portion 312, 322 on the lower surface of the insulating substrate 21 for connecting external circuits are respectively provided. The soldering holes 313 and 323 are respectively disposed on the connecting portions 311 and 321 of the first electrode 31 and the second electrode 32. The insulating conductive heating module 20 is mounted on the insulating substrate 21, and is provided with a plurality of The solder vias 313, 323 are corresponding to the embodiment of the solder vias 24 extending through the upper and lower surfaces of the insulating substrate 21.

本創作之保護元件,在上揭各種可能實施之樣態下,該絕緣導電發熱模組20係可以如第11圖及第12圖所示,設有複數呈直線排列配置的發熱導體22;或者,如第13圖所示,設有複數呈矩陣排列配置的發熱導體22;且該絕緣導電發熱模組20不論設有單一發熱導體或複數發熱導體,各該發熱導體22之斷面係可以呈如第10圖及第11圖所示之長條形,或是如第12圖所示之方形,或是如第13圖所示之圓形。In the protective element of the present invention, the insulated conductive heating module 20 can be provided with a plurality of heat-generating conductors 22 arranged in a straight line as shown in FIGS. 11 and 12; or As shown in FIG. 13, a plurality of heat-generating conductors 22 arranged in a matrix are arranged; and the insulated conductive heat-generating module 20 is provided with a single heat-generating conductor or a plurality of heat-generating conductors, and the cross-section of each of the heat-generating conductors 22 can be The strip shape as shown in Figs. 10 and 11 or the square as shown in Fig. 12 or the circle as shown in Fig. 13.

換言之,本創作同時揭露一種保護元件之絕緣導電發熱模組20,該絕緣導電發熱模組20係設有一絕緣基板21,於該絕緣基板21設有至少一發熱導體22;其中:各該發熱導體22係於該絕緣基板21上、下表面分別形成一外露端;於實施時,該絕緣基板21係可以由陶瓷材料燒結而成。以及,該絕緣導電發熱模組20係可進一步於該絕緣基板21上,設有至少兩個貫穿該絕緣基板21上、下表面的焊料通道24。In other words, the present invention also discloses an insulating conductive heating module 20 for protecting a component. The insulating conductive heating module 20 is provided with an insulating substrate 21, and the insulating substrate 21 is provided with at least one heat generating conductor 22; wherein: each of the heat generating conductors 22 is formed on the insulating substrate 21 with an exposed end on the lower surface. In the implementation, the insulating substrate 21 can be sintered from a ceramic material. The insulated conductive heat generating module 20 can further include at least two solder passages 24 extending through the upper and lower surfaces of the insulating substrate 21 on the insulating substrate 21.

同樣的,本創作之絕緣導電發熱模組,不論是否於該絕緣基板21上設有焊料通道24,該絕緣導電發熱模組20係可以如第11圖及第12圖所示,設有複數呈直線排列配置的發熱導體22;或者,如第13圖所示,設有複數呈矩陣排列配置的發熱導體22;且該絕緣導電發熱模組20不論設有單一發熱導體或複數發熱導體,各該發熱導體22之斷面係可以呈如第10圖及第11圖所示之長條形,或是如第12圖所示之方形,或是如第13圖所示之圓形。Similarly, in the insulated conductive module of the present invention, whether or not the solder channel 24 is provided on the insulating substrate 21, the insulated conductive heating module 20 can be provided as shown in FIG. 11 and FIG. The heat-generating conductors 22 arranged in a line are arranged; or, as shown in FIG. 13, a plurality of heat-generating conductors 22 arranged in a matrix are arranged; and the insulated conductive heat-generating module 20 is provided with a single heat-generating conductor or a plurality of heat-generating conductors, respectively. The cross section of the heat generating conductor 22 may be an elongated strip as shown in Figs. 10 and 11, or a square as shown in Fig. 12, or a circular shape as shown in Fig. 13.

值得一提的是,本創作另外揭露一種保護元件之絕緣導電發熱模組製造方法,如第13至第15圖所示,該絕緣導電發熱模組20係設有一絕緣基板21,於該絕緣基板21設有至少一發熱導體22;該絕緣導電發熱模組製造方法,係包括列步驟:It is worth mentioning that the present invention further discloses a method for manufacturing an insulated conductive heating module of a protective component. As shown in FIGS. 13 to 15, the insulated conductive heating module 20 is provided with an insulating substrate 21 on the insulating substrate. 21 is provided with at least one heat-generating conductor 22; the method for manufacturing the insulated conductive heat-generating module comprises the steps of:

(a)步驟S1:提供一絕緣基板21,該絕緣基板21係由陶瓷原料加工成型,該絕緣基板21上且設有至少一貫穿該絕緣基板21上、下表面的發熱導體填充孔23。(a) Step S1: An insulating substrate 21 is provided which is formed by processing a ceramic material, and the insulating substrate 21 is provided with at least one heat-generating conductor filling hole 23 penetrating the upper and lower surfaces of the insulating substrate 21.

(b) 步驟S2:填料入發熱導體材料22A,將用以成型發熱導體22的發熱導體材料22A(金屬原料)填充於該絕緣基板21之各該發熱導體填充孔23中。(b) Step S2: Filling the heat-generating conductor material 22A, and filling the heat-generating conductor material 22A (metal material) for molding the heat-generating conductor 22 into each of the heat-generating conductor filling holes 23 of the insulating substrate 21.

(c) 步驟S3:發熱導體22燒結定型,對該已填充完成發熱導體材料22A的該絕緣基板21施以高溫燒結,使各該發熱導體填充孔23中的發熱導體材料22A與該絕緣基板21結合,成為於該絕緣基板21設有至少一發熱導體22的絕緣導電發熱模組20。(c) Step S3: The heat generating conductor 22 is sintered and shaped, and the insulating substrate 21 filled with the heat-generating conductor material 22A is subjected to high-temperature sintering so that the heat-generating conductor material 22A and the insulating substrate 21 in each of the heat-generating conductor filling holes 23 are filled. In combination, an insulating conductive heat generating module 20 having at least one heat generating conductor 22 is provided on the insulating substrate 21.

本創作之絕緣導電發熱模組製造方法,於實施時,該絕緣基板21在尚未填料入發熱導體材料之前,係可以為尚未燒結定型的生瓷狀態。In the manufacturing method of the insulated conductive heating module of the present invention, the insulating substrate 21 may be in a green state that has not been sintered and set before being filled into the heat conductive conductor material.

本創作之絕緣導電發熱模組製造方法,於實施時,該絕緣基板21在尚未填料入發熱導體材料之前,係可以已預先經過燒結定型。In the manufacturing method of the insulated conductive heating module of the present invention, the insulating substrate 21 may have been previously set by sintering before being filled into the heating conductor material.

本創作之絕緣導電發熱模組製造方法,於實施時,該絕緣基板21,係可以進一步設有至少兩個貫穿該絕緣基板21上、下表面的焊料通道24。In the implementation of the present invention, the insulating substrate 21 can be further provided with at least two solder passages 24 extending through the upper and lower surfaces of the insulating substrate 21.

本創作之絕緣導電發熱模組製造方法,於實施時,該絕緣基板在21尚未填料入發熱導體材料之前,係可以為尚未燒結定型的生瓷狀態,且進一步設有至少兩個貫穿該絕緣基板21上、下表面的焊料通道24。The manufacturing method of the insulated conductive heating module of the present invention, in the implementation, before the insulating substrate is not filled into the heating conductor material, the insulating substrate may be in a raw porcelain state that has not been sintered and shaped, and further provided at least two through the insulating substrate. 21 solder channels 24 on the upper and lower surfaces.

本創作之絕緣導電發熱模組製造方法,於實施時,該絕緣基板21在尚未填料入發熱導體材料之前,係可以已預先經過燒結定型,且進一步設有至少兩個貫穿該絕緣基板21上、下表面的焊料通道24。In the implementation of the present invention, the insulating substrate 21 can be pre-sintered and shaped, and further provided with at least two through the insulating substrate 21, before being inserted into the heat-generating conductor material. Solder channel 24 on the lower surface.

同樣的,該絕緣基板21不論是否設有焊料通道24,該絕緣基板21係可以如第11圖及第12圖所示,設有複數呈直線排列配置的發熱導體22;或者,如第13圖所示,設有複數呈矩陣排列配置的發熱導體22;且該絕緣基板21不論設有單一發熱導體或複數發熱導體,各該發熱導體填充孔23之斷面係可以呈如第10圖及第11圖所示之長條形,或是如第12圖所示之方形,或是如第13圖所示之圓形。Similarly, the insulating substrate 21 may be provided with a plurality of solder conductors 22 arranged in a line as shown in FIGS. 11 and 12, irrespective of whether or not the solder channel 24 is provided; or, as shown in FIG. As shown, a plurality of heat generating conductors 22 arranged in a matrix are provided; and the insulating substrate 21 is provided with a single heat generating conductor or a plurality of heat generating conductors, and the cross section of each of the heat generating conductor filling holes 23 can be as shown in FIG. 10 and The long strip shown in Fig. 11 is either a square as shown in Fig. 12 or a circle as shown in Fig. 13.

具體而言,本創作主要利用絕緣導電發熱模組、第一電極、第二電極、第三電極,以及可熔導體之結構配置,獲致一結構相對簡單、可靠的保護元件,不但可降低保護功能之啟動功率,更有助於整體保護元件朝薄型化方向發展;以及,尚可利用於於絕緣導電發熱模組之絕緣基板並聯複數個發熱導體之設計,避免因為部分發熱導體失效而導致對可熔導體之熱傳功能完全失效,以相對更為積極、可靠之手段,維護使用對象之電路安全。Specifically, the present invention mainly utilizes the structural arrangement of the insulated conductive heating module, the first electrode, the second electrode, the third electrode, and the fusible conductor, thereby obtaining a relatively simple and reliable protection component, which not only reduces the protection function. The starting power is more conducive to the development of the overall protection component in the direction of thinning; and, the insulating substrate of the insulated conductive heating module can be used in parallel to design a plurality of heating conductors to avoid the failure of some of the heating conductors. The heat transfer function of the fuse conductor is completely ineffective, and the circuit safety of the object to be used is maintained in a relatively more active and reliable manner.

以上所述之實施例僅係為說明本創作之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本創作之內容並據以實施,當不能以之限定本創作之專利範圍,即大凡依本創作所揭示之精神所作之均等變化或修飾,仍應涵蓋在本創作之專利範圍內。The embodiments described above are only for explaining the technical idea and characteristics of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement them according to the scope of the patent. That is, the equivalent changes or modifications made by the people in accordance with the spirit revealed by this creation should still be covered by the scope of the patent of this creation.

[先前技術][Prior technology]

11‧‧‧第一電極 11‧‧‧First electrode

12‧‧‧第二電極 12‧‧‧Second electrode

13‧‧‧發熱體引出電極 13‧‧‧heating body extraction electrode

14‧‧‧可熔導體 14‧‧‧fusible conductor

15‧‧‧發熱體 15‧‧‧heating body

16‧‧‧絕緣基板 16‧‧‧Insert substrate

17‧‧‧絕緣部件 17‧‧‧Insulation parts

18‧‧‧外框 18‧‧‧Front frame

[本創作] [This creation]

20‧‧‧絕緣導電發熱模組 20‧‧‧Insulated Conductive Heating Module

21‧‧‧絕緣基板 21‧‧‧Insert substrate

22‧‧‧發熱導體 22‧‧‧heating conductor

22A‧‧‧發熱導體材料 22A‧‧‧Feed conductor material

23‧‧‧發熱導體填充孔 23‧‧‧Feed conductor filling hole

24‧‧‧焊料通道 24‧‧‧ solder channel

31‧‧‧第一電極 31‧‧‧First electrode

311‧‧‧上連接部 311‧‧‧Upper connection

312‧‧‧下連接部 312‧‧‧ Lower connection

313‧‧‧焊料通孔 313‧‧‧ solder through hole

32‧‧‧第二電極 32‧‧‧second electrode

321‧‧‧上連接部 321‧‧‧Upper connection

322‧‧‧下連接部 322‧‧‧Under the connection department

323‧‧‧焊料通孔 323‧‧‧ solder through hole

33‧‧‧第三電極 33‧‧‧ third electrode

34‧‧‧導熱電極片 34‧‧‧thermal electrode sheet

40‧‧‧可熔導體 40‧‧‧fusible conductor

50‧‧‧絕緣上蓋 50‧‧‧Insulation cover

60‧‧‧絕緣墊片 60‧‧‧Insulation gasket

70‧‧‧黏著材料 70‧‧‧Adhesive materials

S1‧‧‧(a)步驟 S1‧‧‧(a) steps

S2‧‧‧(b)步驟 S2‧‧‧(b) steps

S3‧‧‧(c)步驟 S3‧‧‧(c) steps

第1圖係為一習知設有發熱體的保護元件結構剖視圖。 第2圖係為本創作第一實施例之保護元件外觀立體圖。 第3圖係為本創作第一實施例之保護元件結構分解圖。 第4圖係為本創作第一實施例當中之絕緣導電發熱模組立體剖視圖。 第5圖係為本創作第一實施例之保護元件立體剖視圖。 第6圖係為本創作第一實施例之保護元件平面剖視圖。 第7圖係為本創作第二實施例之保護元件外觀立體圖。 第8圖係為本創作第二實施例當中之絕緣上蓋及絕緣墊片之安裝示意圖。 第9圖係為本創作第二實施例之保護元件平面剖視圖。 第10圖係為本創作第三實施例之保護元件結構分解圖。 第11圖係為本創作第四實施例之絕緣導電發熱模組外觀立體圖。 第12圖係為本創作第五實施例之絕緣導電發熱模組外觀立體圖。 第13圖係為本創作第六實施例之絕緣導電發熱模組外觀立體圖。 第14圖係為本創作當中之絕緣導電發熱模組之基本製作流程圖。 第15圖係為本創作當中之絕緣導電發熱模組於各流程步驟之狀態示意圖。Fig. 1 is a cross-sectional view showing the structure of a protective element having a heat generating body. Fig. 2 is a perspective view showing the appearance of the protective member of the first embodiment of the present invention. Fig. 3 is an exploded view showing the structure of the protective element of the first embodiment of the present invention. Figure 4 is a perspective cross-sectional view showing the insulated conductive heat-generating module of the first embodiment of the present invention. Figure 5 is a perspective cross-sectional view showing the protective member of the first embodiment of the present invention. Figure 6 is a plan sectional view showing the protective member of the first embodiment of the present invention. Fig. 7 is a perspective view showing the appearance of the protective member of the second embodiment of the present invention. Figure 8 is a schematic view showing the installation of the insulating upper cover and the insulating spacer in the second embodiment of the present invention. Figure 9 is a plan sectional view showing the protective member of the second embodiment of the present invention. Fig. 10 is an exploded perspective view showing the structure of the protective member of the third embodiment of the present invention. Figure 11 is a perspective view showing the appearance of the insulated conductive heat-generating module of the fourth embodiment of the present invention. Figure 12 is a perspective view showing the appearance of the insulated conductive heat-generating module of the fifth embodiment of the present invention. Figure 13 is a perspective view showing the appearance of the insulated conductive heat-generating module of the sixth embodiment of the present invention. Figure 14 is the basic production flow chart of the insulated conductive heating module in this creation. Figure 15 is a schematic diagram showing the state of the insulated conductive heating module in each process step.

Claims (38)

一種保護元件,包括:一絕緣導電發熱模組(20)、一第一電極(31)、一第二電極(32)、一第三電極(33),以及一可熔導體(40);其中: 該絕緣導電發熱模組(20)係設有一絕緣基板(21),於該絕緣基板(21)設有至少一發熱導體(22),各該發熱導體(22)係於該絕緣基板(21)上、下表面分別形成一外露端; 該第一電極(31)及該第二電極(32)係呈未與該些發熱導體(22)接觸的型態設於該絕緣基板(21)上; 該第三電極(33)係呈與該絕緣基板(21)下表面之該些發熱導體(22)外露端電氣連接的型態設於該絕緣基板(21)之下表面; 該可熔導體(40)係呈與該第一電極(31)、該第二電極(32)及該絕緣基板(21)上表面之該些發熱導體(22)外露端電氣連接的型態設於該絕緣基板(21)上。A protective component comprising: an insulated conductive heat generating module (20), a first electrode (31), a second electrode (32), a third electrode (33), and a fusible conductor (40); The insulating conductive heating module (20) is provided with an insulating substrate (21), and the insulating substrate (21) is provided with at least one heat generating conductor (22), and the heat generating conductors (22) are attached to the insulating substrate (21). The upper and lower surfaces respectively form an exposed end; the first electrode (31) and the second electrode (32) are disposed on the insulating substrate (21) in a state not in contact with the heat generating conductors (22). The third electrode (33) is electrically connected to the exposed ends of the heat generating conductors (22) on the lower surface of the insulating substrate (21), and is disposed on a lower surface of the insulating substrate (21); the fusible conductor (40) is disposed on the insulating substrate in a pattern electrically connected to the exposed ends of the first electrodes (31), the second electrodes (32), and the heat generating conductors (22) on the upper surface of the insulating substrate (21) (21) Upper. 如請求項1所述之保護元件,其中,該保護元件,係進一步包括一絕緣上蓋(50);該絕緣上蓋(50)係設於該絕緣基板(21)之上表面處,至少將該可熔導體(40)、該第一電極(31)之位於該絕緣基板(21)之上表面的區域及該第二電極(32)位於該絕緣基板(21)之上表面的區域遮蔽。The protection element of claim 1, wherein the protection element further comprises an insulating upper cover (50); the insulating upper cover (50) is disposed at an upper surface of the insulating substrate (21), at least The molten conductor (40), the region of the first electrode (31) on the upper surface of the insulating substrate (21), and the region of the second electrode (32) located on the upper surface of the insulating substrate (21) are shielded. 如請求項1所述之保護元件,其中,該保護元件係進一步包括一絕緣墊片(60);該絕緣墊片(60)係設於該絕緣基板(21)之下表面處,至少將該第三電極(33)之與各該發熱導體(22)對應的區域遮蔽。The protection element of claim 1, wherein the protection element further comprises an insulating spacer (60); the insulating spacer (60) is disposed at a lower surface of the insulating substrate (21), at least The area of the third electrode (33) corresponding to each of the heat generating conductors (22) is shielded. 如請求項1所述之保護元件,其中,該保護元件係進一步包括:一絕緣上蓋(50),以及一絕緣墊片(60);該絕緣上蓋(50)係設於該絕緣基板(21)之上表面處,至少將該可熔導體(40)、該第一電極(31)之位於該絕緣基板(21)之上表面的區域及該第二電極(32)位於該絕緣基板(21)之上表面的區域遮蔽;該絕緣墊片(60)係設於該絕緣基板(21)之下表面處,至少將該第三電極(33)之與各該發熱導體(22)對應的區域遮蔽。The protection component of claim 1, wherein the protection component further comprises: an insulating upper cover (50), and an insulating spacer (60); the insulating upper cover (50) is disposed on the insulating substrate (21) At the upper surface, at least the soluble conductor (40), the region of the first electrode (31) on the upper surface of the insulating substrate (21), and the second electrode (32) are located on the insulating substrate (21) The area of the upper surface is shielded; the insulating spacer (60) is disposed at a lower surface of the insulating substrate (21), and at least shields an area of the third electrode (33) corresponding to each of the heat generating conductors (22) . 如請求項1所述之保護元件,其中,該保護元件係進一步包括一導熱電極片(34);該導熱電極片(34)係設於該絕緣基板(21)之上表面,供襯設於各該發熱導體(22)與該可熔導體(40)之間。The protective element of claim 1, wherein the protective element further comprises a thermally conductive electrode sheet (34); the thermally conductive electrode sheet (34) is disposed on an upper surface of the insulating substrate (21) for lining Between each of the heat generating conductors (22) and the fusible conductor (40). 如請求項1所述之保護元件,其中,該保護元件係進一步包括:一絕緣上蓋(50)以及一導熱電極片(34);該絕緣上蓋(50)係設於該絕緣基板(21)之上表面處,至少將該可熔導體(40)、該第一電極(31)之位於該絕緣基板(21)之上表面的區域及該第二電極(32)位於該絕緣基板(21)之上表面的區域遮蔽;該導熱電極片(34)係設於該絕緣基板(21)之上表面,供襯設於各該發熱導體(22)與該可熔導體(40)之間。The protection component of claim 1, wherein the protection component further comprises: an insulating upper cover (50) and a thermal conductive electrode (34); the insulating upper cover (50) is disposed on the insulating substrate (21) At the upper surface, at least the soluble conductor (40), the region of the first electrode (31) on the upper surface of the insulating substrate (21), and the second electrode (32) are located on the insulating substrate (21) The area of the upper surface is shielded; the heat conducting electrode sheet (34) is disposed on the upper surface of the insulating substrate (21) for lining between each of the heat generating conductors (22) and the fusible conductor (40). 如請求項1所述之保護元件,其中,該保護元件係進一步包括:一絕緣墊片(60),以及一導熱電極片(34);該絕緣墊片(60)係設於該絕緣基板(21)之下表面處,至少將該第三電極(33)之與各該發熱導體(22)對應的區域遮蔽;該導熱電極片(34)係設於該絕緣基板(21)之上表面,供襯設於各該發熱導體(22)與該可熔導體(40)之間。The protection component of claim 1, wherein the protection component further comprises: an insulating spacer (60), and a thermal conductive electrode sheet (34); the insulating spacer (60) is disposed on the insulating substrate ( 21) at least a surface of the third electrode (33) corresponding to each of the heat-generating conductors (22); the heat-conductive electrode sheet (34) is disposed on an upper surface of the insulating substrate (21), A lining is provided between each of the heat generating conductors (22) and the fusible conductor (40). 如請求項1所述之保護元件,其中,該保護元件係進一步包括:一絕緣上蓋(50)、一絕緣墊片(60),以及一導熱電極片(34);該絕緣上蓋(50)係設於該絕緣基板(21)之上表面處,至少將該可熔導體(40)、該第一電極(31)之位於該絕緣基板(21)之上表面的區域及該第二電極(32)位於該絕緣基板(21)之上表面的區域遮蔽;該絕緣墊片(60)係設於該絕緣基板(21)之下表面處,至少將該第三電極(33)之與各該發熱導體(22)對應的區域遮蔽;該導熱電極片(34)係設於該絕緣基板(21)之上表面,供襯設於各該發熱導體(22)與該可熔導體(40)之間。The protective component of claim 1, wherein the protective component further comprises: an insulating upper cover (50), an insulating spacer (60), and a thermally conductive electrode tab (34); the insulating upper cover (50) is Provided on the upper surface of the insulating substrate (21), at least the soluble conductor (40), the region of the first electrode (31) on the upper surface of the insulating substrate (21), and the second electrode (32) a region located on the upper surface of the insulating substrate (21); the insulating spacer (60) is disposed on a lower surface of the insulating substrate (21), at least the third electrode (33) and each of the heat The corresponding area of the conductor (22) is shielded; the heat conducting electrode sheet (34) is disposed on the upper surface of the insulating substrate (21) for lining between each of the heat generating conductors (22) and the fusible conductor (40) . 如請求項1所述之保護元件,其中,該第一電極(31)及該第二電極(32)係各別設有一位於該絕緣基板(21)上表面供用以與該可熔導體(40)電氣連接的上連接部(311)、(321),以及一位於該絕緣基板(21)下表面供用以連接外部電路的下連接部(312)、(322)。The protection element of claim 1, wherein the first electrode (31) and the second electrode (32) are respectively provided on an upper surface of the insulating substrate (21) for being used with the soluble conductor (40). The upper connection portions (311), (321) of the electrical connection, and the lower connection portions (312), (322) on the lower surface of the insulating substrate (21) for connecting external circuits. 如請求項1所述之保護元件,其中,該第一電極(31)及該第二電極(32)係各別設有一位於該絕緣基板(21)上表面供用以與該可熔導體(40)電氣連接的上連接部(311)、(321),以及一位於該絕緣基板(21)下表面供用以連接外部電路的下連接部(312)、(322);該第一電極(31)及該第二電極(32)之上連接部(311)、(321)處分別設有一焊料通孔(313)、(323),該絕緣導電發熱模組(20)係於該絕緣基板(21)上,設有複數與各該焊料通孔(313)、(323)對應且貫穿該絕緣基板(21)上、下表面的焊料通道(24)。The protection element of claim 1, wherein the first electrode (31) and the second electrode (32) are respectively provided on an upper surface of the insulating substrate (21) for being used with the soluble conductor (40). An upper connection portion (311), (321) electrically connected, and a lower connection portion (312), (322) on a lower surface of the insulating substrate (21) for connecting an external circuit; the first electrode (31) And a soldering via hole (313) and (323) are respectively disposed at the connecting portions (311) and (321) of the second electrode (32), and the insulating conductive heat generating module (20) is attached to the insulating substrate (21) The solder channel (24) corresponding to each of the solder vias (313) and (323) and extending through the upper and lower surfaces of the insulating substrate (21) is provided. 如請求項1所述之保護元件,其中,該保護元件,係進一步包括一絕緣上蓋(50);該絕緣上蓋(50)係設於該絕緣基板(21)之上表面處,至少將該可熔導體(40)、該第一電極(31)之位於該絕緣基板(21)之上表面的區域及該第二電極(32)位於該絕緣基板(21)之上表面的區域遮蔽;該第一電極(31)及該第二電極(32)係各別設有一位於該絕緣基板(21)上表面供用以與該可熔導體(40)電氣連接的上連接部(311)、(321),以及一位於該絕緣基板(21)下表面供用以連接外部電路的下連接部(312)、(322)。The protection element of claim 1, wherein the protection element further comprises an insulating upper cover (50); the insulating upper cover (50) is disposed at an upper surface of the insulating substrate (21), at least a fuse conductor (40), a region of the first electrode (31) on an upper surface of the insulating substrate (21), and a region of the second electrode (32) located on an upper surface of the insulating substrate (21); An electrode (31) and the second electrode (32) are respectively provided with an upper connecting portion (311), (321) on an upper surface of the insulating substrate (21) for electrically connecting to the soluble conductor (40). And a lower connection portion (312), (322) on a lower surface of the insulating substrate (21) for connecting an external circuit. 如請求項1所述之保護元件,其中,該保護元件係進一步包括一絕緣墊片(60);該絕緣墊片(60)係設於該絕緣基板(21)之下表面處,至少將該第三電極(33)之與各該發熱導體(22)對應的區域遮蔽;該第一電極(31)及該第二電極(32)係各別設有一位於該絕緣基板(21)上表面供用以與該可熔導體(40)電氣連接的上連接部(311)、(321),以及一位於該絕緣基板(21)下表面供用以連接外部電路的下連接部(312)、(322)。The protection element of claim 1, wherein the protection element further comprises an insulating spacer (60); the insulating spacer (60) is disposed at a lower surface of the insulating substrate (21), at least The third electrode (33) is shielded from a region corresponding to each of the heat-generating conductors (22); the first electrode (31) and the second electrode (32) are respectively provided on an upper surface of the insulating substrate (21) for use. An upper connection portion (311), (321) electrically connected to the fusible conductor (40), and a lower connection portion (312), (322) on a lower surface of the insulating substrate (21) for connecting an external circuit . 如請求項1所述之保護元件,其中,該保護元件係進一步包括:一絕緣上蓋(50),以及一絕緣墊片(60);該絕緣上蓋(50)係設於該絕緣基板(21)之上表面處,至少將該可熔導體(40)、該第一電極31之位於該絕緣基板(21)之上表面的區域及該第二電極(32)位於該絕緣基板(21)之上表面的區域遮蔽;該絕緣墊片(60)係設於該絕緣基板(21)之下表面處,至少將該第三電極(33)之與各該發熱導體(22)對應的區域遮蔽;該第一電極(31)及該第二電極(32)係各別設有一位於該絕緣基板(21)上表面供用以與該可熔導體(40)電氣連接的上連接部(311)、(321),以及一位於該絕緣基板21下表面供用以連接外部電路的下連接部(312)、(322)。The protection component of claim 1, wherein the protection component further comprises: an insulating upper cover (50), and an insulating spacer (60); the insulating upper cover (50) is disposed on the insulating substrate (21) At the upper surface, at least the soluble conductor (40), the region of the first electrode 31 on the upper surface of the insulating substrate (21), and the second electrode (32) are located above the insulating substrate (21) The area of the surface is shielded; the insulating spacer (60) is disposed at a lower surface of the insulating substrate (21), at least shielding a region of the third electrode (33) corresponding to each of the heat generating conductors (22); The first electrode (31) and the second electrode (32) are respectively provided with an upper connecting portion (311), (321) on an upper surface of the insulating substrate (21) for electrically connecting to the soluble conductor (40). And a lower connection portion (312), (322) on the lower surface of the insulating substrate 21 for connecting an external circuit. 如請求項1所述之保護元件,其中,該保護元件係進一步包括一導熱電極片(34);該導熱電極片(34)係設於該絕緣基板(21)之上表面,供襯設於各該發熱導體(22)與該可熔導體(40)之間;該第一電極(31)及該第二電極(32)係各別設有一位於該絕緣基板(21)上表面供用以與該可熔導體(40)電氣連接的上連接部(311)、(321),以及一位於該絕緣基板(21)下表面供用以連接外部電路的下連接部(312)、(322)。The protective element of claim 1, wherein the protective element further comprises a thermally conductive electrode sheet (34); the thermally conductive electrode sheet (34) is disposed on an upper surface of the insulating substrate (21) for lining Between each of the heat-generating conductors (22) and the fusible conductor (40); the first electrode (31) and the second electrode (32) are respectively provided on an upper surface of the insulating substrate (21) for The soluble conductor (40) is electrically connected to the upper connecting portions (311), (321), and a lower connecting portion (312), (322) on the lower surface of the insulating substrate (21) for connecting external circuits. 如請求項1所述之保護元件,其中,該保護元件係進一步包括:一絕緣上蓋(50)以及一導熱電極片(34);該絕緣上蓋(50)係設於該絕緣基板(21)之上表面處,至少將該可熔導體(40)、該第一電極(31)之位於該絕緣基板(21)之上表面的區域及該第二電極(32)位於該絕緣基板(21)之上表面的區域遮蔽;該導熱電極片(34)係設於該絕緣基板(21)之上表面,供襯設於各該發熱導體(22)與該可熔導體(40)之間;該第一電極(31)及該第二電極(32)係各別設有一位於該絕緣基板(21)上表面供用以與該可熔導體(40)電氣連接的上連接部(311)、(321),以及一位於該絕緣基板(21)下表面供用以連接外部電路的下連接部(312)、(322)。The protection component of claim 1, wherein the protection component further comprises: an insulating upper cover (50) and a thermal conductive electrode (34); the insulating upper cover (50) is disposed on the insulating substrate (21) At the upper surface, at least the soluble conductor (40), the region of the first electrode (31) on the upper surface of the insulating substrate (21), and the second electrode (32) are located on the insulating substrate (21) The surface of the upper surface is shielded; the heat conducting electrode sheet (34) is disposed on the upper surface of the insulating substrate (21) for lining between each of the heat generating conductors (22) and the fusible conductor (40); An electrode (31) and the second electrode (32) are respectively provided with an upper connecting portion (311), (321) on an upper surface of the insulating substrate (21) for electrically connecting to the soluble conductor (40). And a lower connection portion (312), (322) on a lower surface of the insulating substrate (21) for connecting an external circuit. 如請求項1所述之保護元件,其中,該保護元件係進一步包括:一絕緣墊片(60),以及一導熱電極片(34);該絕緣墊片(60)係設於該絕緣基板(21)之下表面處,至少將該第三電極(33)之與各該發熱導體(22)對應的區域遮蔽;該導熱電極片(34)係設於該絕緣基板(21)之上表面,供襯設於各該發熱導體(22)與該可熔導體(40)之間;該第一電極(31)及該第二電極(32)係各別設有一位於該絕緣基板(21)上表面供用以與該可熔導體(40)電氣連接的上連接部(311)、(321),以及一位於該絕緣基板(21)下表面供用以連接外部電路的下連接部(312)、(322)。The protection component of claim 1, wherein the protection component further comprises: an insulating spacer (60), and a thermal conductive electrode sheet (34); the insulating spacer (60) is disposed on the insulating substrate ( 21) at least a surface of the third electrode (33) corresponding to each of the heat-generating conductors (22); the heat-conductive electrode sheet (34) is disposed on an upper surface of the insulating substrate (21), The first electrode (31) and the second electrode (32) are respectively disposed on the insulating substrate (21). The surface is provided with upper connecting portions (311), (321) electrically connected to the fusible conductor (40), and a lower connecting portion (312) on the lower surface of the insulating substrate (21) for connecting an external circuit, ( 322). 如請求項1所述之保護元件,其中,該保護元件係進一步包括:一絕緣上蓋(50)、一絕緣墊片(60),以及一導熱電極片(34);該絕緣上蓋(50)係設於該絕緣基板(21)之上表面處,至少將該可熔導體(40)、該第一電極(31)之位於該絕緣基板(21)之上表面的區域及該第二電極(32)位於該絕緣基板(21)之上表面的區域遮蔽;該絕緣墊片(60)係設於該絕緣基板(21)之下表面處,至少將該第三電極(33)之與各該發熱導體(22)對應的區域遮蔽;該導熱電極片(34)係設於該絕緣基板(21)之上表面,供襯設於各該發熱導體(22)與該可熔導體(40)之間;該第一電極(31)及該第二電極(32)係各別設有一位於該絕緣基板(21)上表面供用以與該可熔導體(40)電氣連接的上連接部(311)、(321),以及一位於該絕緣基板(21)下表面供用以連接外部電路的下連接部(312)、(322)。The protective component of claim 1, wherein the protective component further comprises: an insulating upper cover (50), an insulating spacer (60), and a thermally conductive electrode tab (34); the insulating upper cover (50) is Provided on the upper surface of the insulating substrate (21), at least the soluble conductor (40), the region of the first electrode (31) on the upper surface of the insulating substrate (21), and the second electrode (32) a region located on the upper surface of the insulating substrate (21); the insulating spacer (60) is disposed on a lower surface of the insulating substrate (21), at least the third electrode (33) and each of the heat The corresponding area of the conductor (22) is shielded; the heat conducting electrode sheet (34) is disposed on the upper surface of the insulating substrate (21) for lining between each of the heat generating conductors (22) and the fusible conductor (40) The first electrode (31) and the second electrode (32) are respectively provided with an upper connecting portion (311) on an upper surface of the insulating substrate (21) for electrically connecting to the soluble conductor (40), (321), and a lower connecting portion (312), (322) on the lower surface of the insulating substrate (21) for connecting an external circuit. 如請求項1所述之保護元件,其中,該保護元件,係進一步包括一絕緣上蓋(50);該絕緣上蓋(50)係設於該絕緣基板(21)之上表面處,至少將該可熔導體(40)、該第一電極(31)之位於該絕緣基板(21)之上表面的區域及該第二電極(32)位於該絕緣基板(21)之上表面的區域遮蔽;該第一電極(31)及該第二電極(32)係各別設有一位於該絕緣基板(21)上表面供用以與該可熔導體(40)電氣連接的上連接部(311)、(321),以及一位於該絕緣基板(21)下表面供用以連接外部電路的下連接部(312)、(322);該第一電極(31)及該第二電極(32)之上連接部(311)、(321)處分別設有一焊料通孔(313)、(323),該絕緣導電發熱模組(20)係於該絕緣基板(21)上,設有複數與各該焊料通孔(313)、(323)對應且貫穿該絕緣基板(21)上、下表面的焊料通道(24)。The protection element of claim 1, wherein the protection element further comprises an insulating upper cover (50); the insulating upper cover (50) is disposed at an upper surface of the insulating substrate (21), at least a fuse conductor (40), a region of the first electrode (31) on an upper surface of the insulating substrate (21), and a region of the second electrode (32) located on an upper surface of the insulating substrate (21); An electrode (31) and the second electrode (32) are respectively provided with an upper connecting portion (311), (321) on an upper surface of the insulating substrate (21) for electrically connecting to the soluble conductor (40). And a lower connection portion (312), (322) on the lower surface of the insulating substrate (21) for connecting an external circuit; a connection portion (311) on the first electrode (31) and the second electrode (32) And (321) are respectively provided with a solder through hole (313), (323), the insulated conductive heating module (20) is attached to the insulating substrate (21), and a plurality of the solder through holes (313) are provided. And (323) corresponding to and extending through the solder channel (24) on the upper and lower surfaces of the insulating substrate (21). 如請求項1所述之保護元件,其中,該保護元件係進一步包括一絕緣墊片(60);該絕緣墊片(60)係設於該絕緣基板(21)之下表面處,至少將該第三電極(33)之與各該發熱導體(22)對應的區域遮蔽;該第一電極(31)及該第二電極(32)係各別設有一位於該絕緣基板(21)上表面供用以與該可熔導體(40)電氣連接的上連接部(311)、(321),以及一位於該絕緣基板(21)下表面供用以連接外部電路的下連接部(312)、(322);該第一電極(31)及該第二電極(32)之上連接部(311)、(321)處分別設有一焊料通孔(313)、(323),該絕緣導電發熱模組(20)係於該絕緣基板(21)上,設有複數與各該焊料通孔(313)、(323)對應且貫穿該絕緣基板(21)上、下表面的焊料通道(24)。The protection element of claim 1, wherein the protection element further comprises an insulating spacer (60); the insulating spacer (60) is disposed at a lower surface of the insulating substrate (21), at least The third electrode (33) is shielded from a region corresponding to each of the heat-generating conductors (22); the first electrode (31) and the second electrode (32) are respectively provided on an upper surface of the insulating substrate (21) for use. An upper connection portion (311), (321) electrically connected to the fusible conductor (40), and a lower connection portion (312), (322) on a lower surface of the insulating substrate (21) for connecting an external circuit The soldering holes (313) and (323) are respectively disposed at the connecting portions (311) and (321) of the first electrode (31) and the second electrode (32), and the insulating conductive heating module (20) The insulating substrate (21) is provided with a plurality of solder channels (24) corresponding to the solder vias (313) and (323) and extending through the upper and lower surfaces of the insulating substrate (21). 如請求項1所述之保護元件,其中,該保護元件係進一步包括:一絕緣上蓋(50),以及一絕緣墊片(60);該絕緣上蓋(50)係設於該絕緣基板(21)之上表面處,至少將該可熔導體(40)、該第一電極(31)之位於該絕緣基板(21)之上表面的區域及該第二電極(32)位於該絕緣基板(21)之上表面的區域遮蔽;該絕緣墊片(60)係設於該絕緣基板(21)表面處,至少將該第三電極(33)之與各該發熱導體(22)對應的區域遮蔽;該第一電極(31)及該第二電極(32)係各別設有一位於該絕緣基板(21)上表面供用以與該可熔導體40電氣連接的上連接部(311)、(321),以及一位於該絕緣基板(21)下表面供用以連接外部電路的下連接部(312)、(322);該第一電極(31)及該第二電極(32)之上連接部(311)、(321)處分別設有一焊料通孔(313)、(323),該絕緣導電發熱模組20係於該絕緣基板(21)上,設有複數與各該焊料通孔(313)、(323)對應且貫穿該絕緣基板(21)上、下表面的焊料通道(24)。The protection component of claim 1, wherein the protection component further comprises: an insulating upper cover (50), and an insulating spacer (60); the insulating upper cover (50) is disposed on the insulating substrate (21) At the upper surface, at least the soluble conductor (40), the region of the first electrode (31) on the upper surface of the insulating substrate (21), and the second electrode (32) are located on the insulating substrate (21) The area of the upper surface is shielded; the insulating spacer (60) is disposed on the surface of the insulating substrate (21) to shield at least the area of the third electrode (33) corresponding to each of the heat generating conductors (22); The first electrode (31) and the second electrode (32) are respectively provided with upper connecting portions (311) and (321) on the upper surface of the insulating substrate (21) for electrically connecting with the soluble conductor 40. And a lower connecting portion (312), (322) on the lower surface of the insulating substrate (21) for connecting an external circuit; a connecting portion (311) above the first electrode (31) and the second electrode (32) And (321) respectively provided with a solder through hole (313), (323), the insulated conductive heating module 20 is attached to the insulating substrate (21), and a plurality of the solder through holes (313) are provided, 323) And it should penetrate the insulating substrate (21), the lower surface of the solder passage (24). 如請求項1所述之保護元件,其中,該保護元件係進一步包括一導熱電極片(34);該導熱電極片(34)係設於該絕緣基板(21)之上表面,供襯設於各該發熱導體(22)與該可熔導體(40)間;該第一電極(31)及該第二電極(32)係各別設有一位於該絕緣基板(21)上表面供用以與該可熔導體(40)電氣連接的上連接部(311)、(321),以及一位於該絕緣基板(21)下表面供用以連接外部電路的下連接部(312)、(322);該第一電極31及該第二電極(32)之上連接部(311)、(321)處分別設有一焊料通孔(313)、(323),該絕緣導電發熱模組(20)係於該絕緣基板(21)上,設有複數與各該焊料通孔(313)、(323)對應且貫穿該絕緣基板(21)上、下表面的焊料通道(24)。The protective element of claim 1, wherein the protective element further comprises a thermally conductive electrode sheet (34); the thermally conductive electrode sheet (34) is disposed on an upper surface of the insulating substrate (21) for lining Between each of the heat-generating conductors (22) and the fusible conductor (40); the first electrode (31) and the second electrode (32) are respectively provided on an upper surface of the insulating substrate (21) for An upper connection portion (311), (321) electrically connected to the fusible conductor (40), and a lower connection portion (312), (322) on a lower surface of the insulating substrate (21) for connecting an external circuit; A soldering via (313), (323) is respectively disposed at the connecting portions (311) and (321) of the upper electrode 31 and the second electrode (32), and the insulating conductive heating module (20) is connected to the insulating The substrate (21) is provided with a plurality of solder channels (24) corresponding to the solder vias (313) and (323) and extending through the upper and lower surfaces of the insulating substrate (21). 如請求項1所述之保護元件,其中,該保護元件係進一步包括:一絕緣上蓋(50)以及一導熱電極片(34);該絕緣上蓋(50)係設於該絕緣基板(21)之上表面處,至少將該可熔導體(40)、該第一電極(31)之位於該絕緣基板(21)之上表面的區域及該第二電極(32)位於該絕緣基板(21)之上表面的區域遮蔽;該導熱電極片(34)係設於該絕緣基板(21)之上表面,供襯設於各該發熱導體(22)與該可熔導體(40)之間;該第一電極(31)及該第二電極(32)係各別設有一位於該絕緣基板(21)上表面供用以與該可熔導體(40)電氣連接的上連接部(311)、(321),以及一位於該絕緣基板(21)下表面供用以連接外部電路的下連接部(312)、(322);該第一電極(31)及該第二電極(32)之上連接部(311)、(321)處分別設有一焊料通孔(313)、(323),該絕緣導電發熱模組(20)係於該絕緣基板(21)上,設有複數與各該焊料通孔(313)、(323)對應且貫穿該絕緣基板(21)上、下表面的焊料通道(24)。The protection component of claim 1, wherein the protection component further comprises: an insulating upper cover (50) and a thermal conductive electrode (34); the insulating upper cover (50) is disposed on the insulating substrate (21) At the upper surface, at least the soluble conductor (40), the region of the first electrode (31) on the upper surface of the insulating substrate (21), and the second electrode (32) are located on the insulating substrate (21) The surface of the upper surface is shielded; the heat conducting electrode sheet (34) is disposed on the upper surface of the insulating substrate (21) for lining between each of the heat generating conductors (22) and the fusible conductor (40); An electrode (31) and the second electrode (32) are respectively provided with an upper connecting portion (311), (321) on an upper surface of the insulating substrate (21) for electrically connecting to the soluble conductor (40). And a lower connection portion (312), (322) on the lower surface of the insulating substrate (21) for connecting an external circuit; a connection portion (311) on the first electrode (31) and the second electrode (32) And (321) are respectively provided with a solder through hole (313), (323), the insulated conductive heating module (20) is attached to the insulating substrate (21), and a plurality of the solder through holes (313) are provided. ), (323) correspondence And a solder passage (24) penetrating the upper and lower surfaces of the insulating substrate (21). 如請求項1所述之保護元件,其中,該保護元件係進一步包括:一絕緣墊片(60),以及一導熱電極片(34);該絕緣墊片(60)係設於該絕緣基板(21)之下表面處,至少將該第三電極(33)之與各該發熱導體(22)對應的區域遮蔽;該導熱電極片(34)係設於該絕緣基板(21)之上表面,供襯設於各該發熱導體(22)與該可熔導體(40)之間;該第一電極(31)及該第二電極(32)係各別設有一位於該絕緣基板(21)上表面供用以與該可熔導體(40)電氣連接的上連接部(311)、(321),以及一位於該絕緣基板(21)下表面供用以連接外部電路的下連接部(312)、(322);該第一電極(31)及該第二電極(32)之上連接部(311)、(321)處分別設有一焊料通孔(313)、(323),該絕緣導電發熱模組(20)係於該絕緣基板(21)上,設有複數與各該焊料通孔(313)、(323)對應且貫穿該絕緣基板(21)上、下表面的焊料通道(24)。The protection component of claim 1, wherein the protection component further comprises: an insulating spacer (60), and a thermal conductive electrode sheet (34); the insulating spacer (60) is disposed on the insulating substrate ( 21) at least a surface of the third electrode (33) corresponding to each of the heat-generating conductors (22); the heat-conductive electrode sheet (34) is disposed on an upper surface of the insulating substrate (21), The first electrode (31) and the second electrode (32) are respectively disposed on the insulating substrate (21). The surface is provided with upper connecting portions (311), (321) electrically connected to the fusible conductor (40), and a lower connecting portion (312) on the lower surface of the insulating substrate (21) for connecting an external circuit, ( 322); a solder through hole (313), (323) is respectively disposed at the connecting portions (311) and (321) of the first electrode (31) and the second electrode (32), and the insulated conductive heating module (20) A solder channel (24) corresponding to each of the solder vias (313) and (323) and extending through the upper and lower surfaces of the insulating substrate (21) is provided on the insulating substrate (21). 如請求項1所述之保護元件,其中,該保護元件係進一步包括:一絕緣上蓋(50)、一絕緣墊片(60),以及一導熱電極片(34);該絕緣上蓋(50)係設於該絕緣基板(21)之上表面處,至少將該可熔導體(40)、該第一電極(31)之位於該絕緣基板(21)之上表面的區域及該第二電極(32)位於該絕緣基板(21)之上表面的區域遮蔽;該絕緣墊片(60)係設於該絕緣基板(21)之下表面處,至少將該第三電極(33)之與各該發熱導體(22)對應的區域遮蔽;該導熱電極片(34)係設於該絕緣基板(21)之上表面,供襯設於各該發熱導體(22)與該可熔導體(40)之間;該第一電極(31)及該第二電極(32)係各別設有一位於該絕緣基板(21)上表面供用以與該可熔導體(40)電氣連接的上連接部(311)、(321),以及一位於該絕緣基板(21)下表面供用以連接外部電路的下連接部(312)、(322);該第一電極(31)及該第二電極(32)之上連接部(311)、(321)處分別設有一焊料通孔(313)、(323),該絕緣導電發熱模組(20)係於該絕緣基板(21)上,設有複數與各該焊料通孔(313)、(323)對應且貫穿該絕緣基板(21)上、下表面的焊料通道(24)。The protective component of claim 1, wherein the protective component further comprises: an insulating upper cover (50), an insulating spacer (60), and a thermally conductive electrode tab (34); the insulating upper cover (50) is Provided on the upper surface of the insulating substrate (21), at least the soluble conductor (40), the region of the first electrode (31) on the upper surface of the insulating substrate (21), and the second electrode (32) a region located on the upper surface of the insulating substrate (21); the insulating spacer (60) is disposed on a lower surface of the insulating substrate (21), at least the third electrode (33) and each of the heat The corresponding area of the conductor (22) is shielded; the heat conducting electrode sheet (34) is disposed on the upper surface of the insulating substrate (21) for lining between each of the heat generating conductors (22) and the fusible conductor (40) The first electrode (31) and the second electrode (32) are respectively provided with an upper connecting portion (311) on an upper surface of the insulating substrate (21) for electrically connecting to the soluble conductor (40), (321), and a lower connecting portion (312), (322) on the lower surface of the insulating substrate (21) for connecting an external circuit; the first electrode (31) and the second electrode (32) are connected Department (31 1), (321) are respectively provided with a solder through hole (313), (323), the insulated conductive heating module (20) is attached to the insulating substrate (21), and a plurality of the solder through holes are provided 313), (323) corresponding to and through the solder channel (24) on the upper and lower surfaces of the insulating substrate (21). 如請求項1至24其中任一項所述之保護元件,其中,該絕緣導電發熱模組(20)係設有複數呈直線排列配置的發熱導體(22)。The protective element according to any one of claims 1 to 24, wherein the insulated conductive heat generating module (20) is provided with a plurality of heat generating conductors (22) arranged in a line. 如請求項1至24其中任一項所述之保護元件,其中,該絕緣導電發熱模組(20)係設有複數呈矩陣排列配置的發熱導體(22)。The protective element according to any one of claims 1 to 24, wherein the insulated conductive heat generating module (20) is provided with a plurality of heat generating conductors (22) arranged in a matrix arrangement. 如請求項1至24其中任一項所述之保護元件,其中,各該發熱導體(22) 之斷面係呈長條形。The protective element according to any one of claims 1 to 24, wherein each of the heat generating conductors (22) has an elongated cross section. 如請求項1至24其中任一項所述之保護元件,其中,各該發熱導體(22)之斷面係呈方形。The protective element according to any one of claims 1 to 24, wherein each of the heat generating conductors (22) has a square shape. 如請求項1至24其中任一項所述之保護元件,其中,各該發熱導體(22)之斷面係呈圓形。The protective element according to any one of claims 1 to 24, wherein each of the heat generating conductors (22) has a circular cross section. 如請求項1至24其中任一項所述之保護元件,其中,該絕緣基板(21)係由陶瓷材料燒結而成。The protective element according to any one of claims 1 to 24, wherein the insulating substrate (21) is sintered from a ceramic material. 一種保護元件之絕緣導電發熱模組,該絕緣導電發熱模組(20)係設有一絕緣基板(21),於該絕緣基板(21)設有至少一發熱導體(22);其中: 各該發熱導體(22)係於該絕緣基板(21)上、下表面分別形成一外露端。An insulated conductive heat generating module (20) is provided with an insulating substrate (21), and the insulating substrate (21) is provided with at least one heat generating conductor (22); wherein: each of the heat is generated The conductor (22) is formed on the insulating substrate (21) and has an exposed end on the lower surface. 如請求項31所述之保護元件之絕緣導電發熱模組,其中,該絕緣導電發熱模組(20)係於該絕緣基板(21)上,設有至少兩個貫穿該絕緣基板(21)上、下表面的焊料通道(24)。The insulated conductive heat generating module of the protective component of claim 31, wherein the insulated conductive heat generating module (20) is attached to the insulating substrate (21), and at least two are disposed through the insulating substrate (21) , the solder channel (24) on the lower surface. 如請求項31或32所述之保護元件之絕緣導電發熱模組,其中,該絕緣導電發熱模組(20)係設有複數呈直線排列配置的發熱導體(22)。The insulated conductive heat generating module of the protective element according to claim 31 or 32, wherein the insulated conductive heat generating module (20) is provided with a plurality of heat generating conductors (22) arranged in a line. 如請求項31或32所述之保護元件之絕緣導電發熱模組,其中,該絕緣導電發熱模組(20)係設有複數呈矩陣排列配置的發熱導體(22)。The insulated conductive heat generating module of the protective element according to claim 31 or 32, wherein the insulated conductive heat generating module (20) is provided with a plurality of heat generating conductors (22) arranged in a matrix. 如請求項31或32所述之保護元件之絕緣導電發熱模組,其中,各該發熱導體(22)之斷面係呈長條形。The insulated conductive heat generating module of the protective element according to claim 31 or 32, wherein each of the heat generating conductors (22) has an elongated cross section. 如請求項31或32所述之保護元件之絕緣導電發熱模組,其中,各該發熱導體(22)之斷面係呈方形。The insulated conductive heat generating module of the protective element according to claim 31 or 32, wherein each of the heat generating conductors (22) has a square shape. 如請求項31或32所述之保護元件之絕緣導電發熱模組,其中,各該發熱導體(22)之斷面係呈圓形。The insulated conductive heat generating module of the protective element according to claim 31 or 32, wherein each of the heat generating conductors (22) has a circular cross section. 如請求項31或32所述之保護元件之絕緣導電發熱模組,其中,該絕緣基板(21)係由陶瓷材料燒結而成。The insulated conductive heat generating module of the protective element according to claim 31 or 32, wherein the insulating substrate (21) is sintered from a ceramic material.
TW107210148U 2018-07-25 2018-07-25 Protective component and insulated conductive heating module thereof TWM575183U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI691995B (en) * 2018-07-25 2020-04-21 大陸商江門市鈞崴電子科技有限公司 Protection element and insulated conductive heating module and method for manufacturing insulated conductive heating module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI691995B (en) * 2018-07-25 2020-04-21 大陸商江門市鈞崴電子科技有限公司 Protection element and insulated conductive heating module and method for manufacturing insulated conductive heating module

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