TWM573847U - Distributed photoelectric separation module device - Google Patents

Distributed photoelectric separation module device Download PDF

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Publication number
TWM573847U
TWM573847U TW107212482U TW107212482U TWM573847U TW M573847 U TWM573847 U TW M573847U TW 107212482 U TW107212482 U TW 107212482U TW 107212482 U TW107212482 U TW 107212482U TW M573847 U TWM573847 U TW M573847U
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module
light source
power
circuit
sensing component
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TW107212482U
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Chinese (zh)
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謝秉均
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晟美光電有限公司
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Abstract

一種分佈式光電分離模組裝置,係將一感測元件分佈在一光源模組及一電源模組上,可將該光電模組的光源模組與該電源模組分離應用,即該光源模組是在一印刷電路板上設置多組LED光源及感測元件,LED光源可由表面黏著LED光源或COB(Chip on Board)光源呈現;該電源模組則是線性電源及感測元件所組成;其中:該光源模組及電源模組至少設一感測元件,該感測元件偵測該光源模組或電源模組;當該感測元件偵測到該光電模組或電源模組電壓、電流、溫度異常時,訊號經該線性電源模組調整光源模組的電流值或電壓,即能降低該光源模組及該電源模組上的溫度,而使散熱器維持在適當的溫度,以提升光源模組及電源模組的壽命,不僅降低故障更換率,更能降低散熱結構重量及體積。 A distributed photoelectric separation module device distributes a sensing component on a light source module and a power module, and the light source module of the photovoltaic module can be separated from the power module, that is, the light source module The group is provided with a plurality of sets of LED light sources and sensing components on a printed circuit board, and the LED light source can be represented by a surface-adhered LED light source or a COB (Chip on Board) light source; the power module is composed of a linear power source and a sensing component; Wherein: the light source module and the power module have at least one sensing component, the sensing component detects the light source module or the power module; when the sensing component detects the voltage of the photoelectric module or the power module, When the current and temperature are abnormal, the signal is adjusted by the linear power module to adjust the current value or voltage of the light source module, thereby reducing the temperature of the light source module and the power module, and maintaining the heat sink at an appropriate temperature. Improve the life of the light source module and the power module, not only reduce the fault replacement rate, but also reduce the weight and volume of the heat dissipation structure.

Description

分佈式光電分離模組裝置 Distributed photoelectric separation module device

本創作係有關一種分佈式光電分離模組裝置,尤指一種感測元件設在光電模組或電源模組上,以偵測該光電模組或電源模組電壓、電流、溫度的異常,並降低輸出光電模組或光源模組的電流值或電壓補償的技術領域。 The present invention relates to a distributed photoelectric separation module device, in particular to a sensing component disposed on a photoelectric module or a power module to detect abnormalities in voltage, current, and temperature of the photovoltaic module or power module, and The technical field of reducing the current value or voltage compensation of an output photovoltaic module or a light source module.

按,目前大部分的燈具大多是利用印刷電路板以表面黏著技術(SMD)將LED光源、電源電路焊接在一起,但是將LED光源及電源電路焊接在同一塊印刷電路板時會造成下列問題:(1)光源的熱量與電源電路的電子零件產生的熱量會互相影響,例如積體電路過熱的問題,由於共同產生熱影響,需要較大的散熱器散熱;(2)當積體電路過熱時容易縮短LED光源及電源電路的使用壽命;(3)若電源電路集成配置,在直流的架構下,傳輸距離電壓損耗及大電流輸出線徑配置問題實有待克服;(4)若以積體電路與LED光源分離,其LED光源在電路板上亦會發熱,或遠離的積體電路發熱,其縮短元件壽命還是存在。 According to the fact, most of the current lamps use the printed circuit board to solder the LED light source and the power supply circuit with surface adhesion technology (SMD). However, when the LED light source and the power supply circuit are soldered on the same printed circuit board, the following problems are caused: (1) The heat of the light source and the heat generated by the electronic components of the power supply circuit may affect each other. For example, the problem of overheating of the integrated circuit, due to the common heat effect, requires a large heat sink to dissipate heat; (2) When the integrated circuit is overheated It is easy to shorten the service life of the LED light source and the power supply circuit; (3) If the power supply circuit is integrated, the transmission distance voltage loss and the large current output wire diameter configuration problem need to be overcome under the DC architecture; (4) If the integrated circuit is used Separated from the LED light source, the LED light source also generates heat on the circuit board, or the integrated circuit heats away, which shortens the life of the component.

本創作之主要目的係提供一種分佈式光電分離模組裝置,係將一感測元件分佈在一光電模組及一電源模組上,可將該光電模組的光源 模組與該電源模組分離應用,即該光源模組是在一印刷電路板上設置多組LED光源及感測元件;其中:該光源模組及電源模組至少設一感測元件,該感測元件偵測該光電模組或電源模組的溫度或電源電壓;當該感測元件偵測到該光電模組或電源模組電壓、電流、溫度異常時,訊號經該光電模組或電源模組降低輸出至該組光源模組的電流值或電壓補償,即能降低光源模組及電源模組上的溫度,而使散熱器維持在適當的溫度,以提升光源模組及電源模組的壽命,不僅降低故障更換,更能降低散熱結構重量及體積。 The main purpose of the present invention is to provide a distributed photoelectric separation module device, which is to distribute a sensing component on a photoelectric module and a power module, and the light source of the photovoltaic module The module is separated from the power module, that is, the light source module is provided with a plurality of sets of LED light sources and sensing components on a printed circuit board; wherein: the light source module and the power module are provided with at least one sensing component, The sensing component detects the temperature or the power supply voltage of the photoelectric module or the power module; when the sensing component detects that the voltage, current, or temperature of the photovoltaic module or the power module is abnormal, the signal passes through the photoelectric module or The power module reduces the current value or voltage compensation output to the group of light source modules, thereby reducing the temperature on the light source module and the power module, and maintaining the heat sink at an appropriate temperature to enhance the light source module and the power module. The life of the group not only reduces the fault replacement, but also reduces the weight and volume of the heat dissipation structure.

在某些實施例中,該電源模組係由一線性電源及一感測元件所組成,可設在光電模組內或獨立遠離於該光電模組,以分別偵測該光源模組的溫度及電流、電壓值,以控制該電源模組或光電模組的溫度,避免過熱損害光電模組或電源模組。 In some embodiments, the power module is composed of a linear power supply and a sensing component, and can be disposed in the optical module or independently away from the photoelectric module to detect the temperature of the light source module. And the current and voltage values to control the temperature of the power module or the photoelectric module to prevent overheating from damaging the photovoltaic module or the power module.

在某些實施例中,該光電模組係由一LED光源、一線性電源電路、及一感測元件所組成,並設在該印刷電路板上,該感測元件偵測該LED光源的溫度、電流、電壓值,以做為該線性電源電路輸出限電流、穩壓、電壓補償訊號至該光源模組的LED光源。 In some embodiments, the optoelectronic module is composed of an LED light source, a linear power supply circuit, and a sensing component, and is disposed on the printed circuit board, and the sensing component detects the temperature of the LED light source. , current, voltage value, as the linear power supply circuit output current limit, voltage regulation, voltage compensation signal to the LED light source of the light source module.

在某些實施例中,該電源模組可遠離並與該光電模組分離,藉該溫度感測元件作遠端偵測光源模組的LED光源的電流值、電壓值,以做為控制LED光源的限電流、穩壓、電壓補償的輸出,藉以保護光源模組。 In some embodiments, the power module can be remote from and separated from the optoelectronic module, and the temperature sensing component is used as a remote detection source and a voltage value of the LED light source of the light source module to control the LED. The current limit, voltage regulation, and voltage compensation output of the light source protect the light source module.

在某些實施例中,該電源模組包含有一邏輯電路、一溫度保護電路、一短路保護電路、一比較電路,該溫度保護電路與該短路保護電路電性連接至該比較電路,該邏輯電路與該比較電路相連接,又該比較電路連接至一放大器,該放大器經一功率電晶體與該光源模組電性連接;當該溫度 保護電路透過該感測元件偵測印刷電路板溫度異常時,調整電流設定參考電壓使電流輸出改變或,經該放大器將該訊號透過該功率電晶體調降該光源模組的LED光源的電流值,相對降低光源模組、光電模組或電源模組的溫度,電壓迴路則偵測電壓並對電流進行調整使功率維持。 In some embodiments, the power module includes a logic circuit, a temperature protection circuit, a short circuit protection circuit, and a comparison circuit. The temperature protection circuit and the short circuit protection circuit are electrically connected to the comparison circuit. Connected to the comparison circuit, the comparison circuit is connected to an amplifier, and the amplifier is electrically connected to the light source module via a power transistor; when the temperature The protection circuit detects the abnormal temperature of the printed circuit board through the sensing component, adjusts the current setting reference voltage to change the current output, and the amplifier transmits the signal through the power transistor to lower the current value of the LED light source of the light source module. Relatively reducing the temperature of the light source module, the photoelectric module or the power module, the voltage circuit detects the voltage and adjusts the current to maintain the power.

該感測元件設有一通訊模組,該電源模組設一傳輸模組,該通訊模組與該傳輸模組透過無線信號電性連接,藉此,該感應電路與該電源模組透過如藍芽、WIFI、Zigbee等傳輸技術無線連接,使該溫感測元件與該電源模組或光電模組之間的訊號傳輸不需使用有線遠端的電性連接。 The sensing component is provided with a communication module, and the power module is provided with a transmission module, and the communication module is electrically connected to the transmission module via a wireless signal, whereby the sensing circuit and the power module pass through, for example, blue The transmission technology of the bud, WIFI, Zigbee and the like is wirelessly connected, so that the signal transmission between the temperature sensing component and the power module or the photoelectric module does not need to be electrically connected by the wired remote end.

1‧‧‧印刷電路板 1‧‧‧Printed circuit board

2、2a‧‧‧光電模組 2, 2a‧‧‧ photoelectric module

21‧‧‧光源模組 21‧‧‧Light source module

211‧‧‧LED光源 211‧‧‧LED light source

3、3a‧‧‧電源模組 3, 3a‧‧‧ power module

30‧‧‧線性電源電路 30‧‧‧Linear power circuit

31‧‧‧邏輯電路 31‧‧‧Logical circuits

32‧‧‧溫度保護電路 32‧‧‧ Temperature protection circuit

33‧‧‧短路保護電路 33‧‧‧Short circuit protection circuit

34‧‧‧比對電路 34‧‧‧ alignment circuit

35‧‧‧放大器 35‧‧‧Amplifier

36‧‧‧功率電晶體 36‧‧‧Power transistor

5‧‧‧感測元件 5‧‧‧Sensor components

51‧‧‧通訊模組 51‧‧‧Communication Module

52‧‧‧傳輸模組 52‧‧‧Transmission module

第1圖係本創作之第一實施例架構示意圖。 Figure 1 is a schematic diagram showing the architecture of the first embodiment of the present invention.

第2圖係本創作之第二實施例架構示意圖。 Figure 2 is a schematic diagram showing the architecture of the second embodiment of the present invention.

的3圖係本創作之第三實施例架構示意圖 3 is a schematic diagram of the third embodiment of the present creation

第4圖係本創作之溫度感測器與電源線性模組元件配置圖。 Figure 4 is a configuration diagram of the temperature sensor and power supply linear module components of the present invention.

第5圖係本創作之電源線性模組架構示意圖。 Figure 5 is a schematic diagram of the power linear module architecture of the present invention.

第6圖係本創作之溫控訊號無線傳輸架構示意圖。 Figure 6 is a schematic diagram of the wireless transmission architecture of the temperature control signal of the present creation.

為使 貴審查委員能對本案之特徵與其特點有更進一步之了解,茲列舉以下較佳之實施例並配合圖式說明如下:請參閱第1~4圖所示,係將一感測元件5分佈在一光電模組2或一電源模組3內;請參閱第1圖,係將該光電模組2的光源模組21與該電源模組3遠離應用,即該光源模組21是在一印刷電路板1上設置多組LED光源211 及感測元件5;其中:該數光源模組21至少設一感測元件5,該感測元件5偵測該光電模組2的溫度、電流、電壓;當該感測元件5偵測到該光電模組2的電流、電壓、溫度異常時,訊號經該光電模組2降低輸出至該組光源模組21的電流值或穩壓,即能降低光源模組21的溫度,而使散熱器維持在適當的溫度,以提升光源模組21的壽命,不僅降低故障更換,更能降低散熱結構重量及體積。 In order to enable your review committee to have a better understanding of the characteristics and characteristics of the case, the following preferred embodiments are listed below with reference to the following figures: Please refer to Figures 1~4 to distribute a sensing element 5 In a photovoltaic module 2 or a power module 3; please refer to FIG. 1 , the light source module 21 of the photovoltaic module 2 and the power module 3 are away from the application, that is, the light source module 21 is in a A plurality of sets of LED light sources 211 are disposed on the printed circuit board 1 And the sensing component 5; wherein: the digital light source module 21 is provided with at least one sensing component 5, the sensing component 5 detects the temperature, current, and voltage of the photovoltaic module 2; when the sensing component 5 detects When the current, voltage, and temperature of the photoelectric module 2 are abnormal, the signal is reduced by the photoelectric module 2 to the current value or the voltage of the light source module 21, thereby reducing the temperature of the light source module 21 and allowing heat dissipation. The device is maintained at an appropriate temperature to improve the life of the light source module 21, which not only reduces fault replacement, but also reduces the weight and volume of the heat dissipation structure.

請參閱第1、2、4圖所示,該電源模組3係由一線性電源電路30及一感測元件5所組成,該電源模組3可設在光電模組2內(如第2、3圖)或獨立遠離於該光源模組21(如第1圖)外,以分別偵測一光源模組2的溫度、電流、電壓值,以控制該電源模組3或光電模組2的溫度、電流值及穩壓,避免光電模組2或光源模組21或電源模組3過熱損毀。 Please refer to the first, second, and fourth figures. The power module 3 is composed of a linear power supply circuit 30 and a sensing component 5. The power module 3 can be disposed in the photovoltaic module 2 (eg, the second (3) or independently from the light source module 21 (as shown in FIG. 1), to detect the temperature, current, and voltage values of a light source module 2, respectively, to control the power module 3 or the photovoltaic module 2 The temperature, current value and voltage regulation prevent the photoelectric module 2 or the light source module 21 or the power module 3 from being damaged by overheating.

如第3圖所示,在某些實施例中,該光電模組2a係由一LED光源、一線性電源電路31、及一感測元件5所組成,並設在該印刷電路板1上,其中,該感測元件5係設在該一光源模組21內偵測該光源模組21的LED光源211的溫度、電流、電壓值,以做為該線性電源電路31輸出限電流、穩壓訊號至該光源模組21。 As shown in FIG. 3, in some embodiments, the optoelectronic module 2a is composed of an LED light source, a linear power supply circuit 31, and a sensing component 5, and is disposed on the printed circuit board 1. The sensing component 5 is disposed in the light source module 21 to detect the temperature, current, and voltage values of the LED light source 211 of the light source module 21, so as to output current limiting and voltage regulation of the linear power circuit 31. The signal is sent to the light source module 21.

進一步說明,如第3圖所示,該電源模組3可遠離並與該光電模組2a的光源模組21分離,但同設於一印刷電路板1上,而一感測元件設於該光源模組21內,藉該感測元件5偵測該光源模組21的LED光源211的電流值、電壓值、溫度,以做為控制該電源模組32輸出至該LED光源211的限電流、穩壓,藉以保護光源模組21。 Further, as shown in FIG. 3, the power module 3 can be separated from and separated from the light source module 21 of the photoelectric module 2a, but is disposed on a printed circuit board 1, and a sensing component is disposed on the In the light source module 21, the current value, the voltage value and the temperature of the LED light source 211 of the light source module 21 are detected by the sensing component 5 as a current limit for controlling the output of the power module 32 to the LED light source 211. And voltage regulation, thereby protecting the light source module 21.

請參閱第5圖所示,該電源模組3係由一線性電源電路30及一 感測元件5所組成;其中,該線性電源電路包含有一邏輯電路31、一溫度保護電路32、一短路保護電路33、一比較電路34,該溫度保護電路32與該短路保護電路33電性連接至該比較電路34,該邏輯電路31與該比較電路34相連接,又該比較電路34連接至一放大器35,該放大器35經一功率電晶體36與該光源模組21電性連接;當該溫度保護電路32透過該感測元件5偵測印刷電路板1上的光源模組21溫度異常時,該比對電路34用以正常溫度的電流與溫度異常的電流相互比對,比對後透過該放大器35與該邏輯電路31再次計算,使該比較電路34輸出一調降電流值的訊號,經該放大器35將該訊號透過該功率電晶體36調降該光源模組21的LED光源211的電流值,相對降低光源模組21、光電模組2或電源模組3的溫度。 Referring to FIG. 5, the power module 3 is composed of a linear power circuit 30 and a The sensing component 5 is composed of a logic circuit 31, a temperature protection circuit 32, a short circuit protection circuit 33, and a comparison circuit 34. The temperature protection circuit 32 is electrically connected to the short circuit protection circuit 33. To the comparison circuit 34, the logic circuit 31 is connected to the comparison circuit 34, and the comparison circuit 34 is connected to an amplifier 35. The amplifier 35 is electrically connected to the light source module 21 via a power transistor 36; When the temperature protection circuit 32 detects the temperature abnormality of the light source module 21 on the printed circuit board 1 through the sensing component 5, the comparison circuit 34 compares the current of the normal temperature with the abnormal current of the temperature, and compares and transmits the current. The amplifier 35 and the logic circuit 31 are again calculated, so that the comparison circuit 34 outputs a signal for adjusting the current value, and the signal is transmitted through the power transistor 36 to the LED light source 211 of the light source module 21 via the amplifier 35. The current value relatively reduces the temperature of the light source module 21, the photovoltaic module 2, or the power module 3.

請參閱第6圖所示,該感測元件5設有一通訊模組51,該電源模 組3設一傳輸模組52,該通訊模組51與該傳輸模組52透過無線信號電性連接,藉此,該感測元件5與該電源模組3透過如藍芽、WIFI、Zigbee等傳輸技術無線連接,使該感測元件5與該電源模組3或光電模組2之間的訊號傳輸不需使用有線遠端的電性連接。 Referring to FIG. 6 , the sensing component 5 is provided with a communication module 51 , and the power module The group 3 is provided with a transmission module 52. The communication module 51 is electrically connected to the transmission module 52 via a wireless signal, whereby the sensing component 5 and the power module 3 are transmitted through, for example, Bluetooth, WIFI, Zigbee, etc. The transmission technology wirelessly connects the signal transmission between the sensing component 5 and the power module 3 or the optoelectronic module 2 without using an electrical connection of the wired remote end.

綜上所述,本創作均未曾見於諸書刊或公開使用,誠符合新型專利申請要件,懇請 鈞局明鑒,早日准予專利,實感德便。 In summary, this creation has not been seen in various books or publicly used, and it is in line with the requirements of new patent applications, so please ask the Bureau to identify the patent, and grant the patent as soon as possible.

Claims (8)

一種分佈式光電分離模組裝置,主要係包括:一印刷電路板,其上設一光電模組;一感測元件,係設於該光電模組內,且與一電源模組結合或分離;以及該光電模組,係由一電源模組及一光源模組所組成,且能分別與該感測元件結合;以及該光源模組,係於該印刷電路板上設置至少設一LED光源;以及該電源模組,係能結合或遠離於該印刷電路板,且能結合一感測元件;因此,當該感測元件偵測到該光電模組或電源模組的電流、電壓、溫度異常時,訊號經該光電模組或電源模組降低輸出至該組光源模組的電流值或穩壓,即能降低該光源模組及該電源模組的溫度。 A distributed photoelectric separation module device mainly includes: a printed circuit board having a photoelectric module disposed thereon; a sensing component disposed in the photovoltaic module and coupled or separated from a power module; And the photoelectric module is composed of a power module and a light source module, and can be respectively combined with the sensing component; and the light source module is disposed on the printed circuit board with at least one LED light source; And the power module can be combined with or away from the printed circuit board, and can be combined with a sensing component; therefore, when the sensing component detects abnormal current, voltage, and temperature of the photovoltaic module or the power module When the signal is reduced by the photoelectric module or the power module to the current value or voltage output of the light source module, the temperature of the light source module and the power module can be reduced. 如申請專利範圍第1項所述之分佈式光電分離模組裝置,其中,該電源模組係由一線性電源電路及一感測元件所組成,該電源模組可設在光電模組內或獨立遠離於該光電模組外,以分別偵測該光源模組的溫度及電流、電壓值。 The distributed photoelectric separation module device of claim 1, wherein the power module is composed of a linear power circuit and a sensing component, and the power module can be disposed in the photoelectric module or Independently away from the photoelectric module, the temperature, current and voltage values of the light source module are respectively detected. 如申請專利範圍第1項所述之分佈式光電分離模組裝置,其中,該電源模組可遠離該光電模組。 The distributed optoelectronic separation module device of claim 1, wherein the power module is remote from the optoelectronic module. 如申請專利範圍第1項所述之分佈式光電分離模組裝置,其中,該感測元件還能直接設於該電源模組內,並直接設於該印刷電路板上。 The distributed photoelectric separation module device of claim 1, wherein the sensing component can be directly disposed in the power module and directly disposed on the printed circuit board. 如申請專利範圍第1項所述之分佈式光電分離模組裝置,其中,電源模組係由一線性電源電路及一感測元件所組成。 The distributed optoelectronic separation module device of claim 1, wherein the power module is composed of a linear power circuit and a sensing component. 如申請專利範圍第5項所述之分佈式光電分離模組裝置,其中,該線性電源電路包含有一邏輯電路、一溫度保護電路、一短路保護電路、一比較電路、一放大器、一功率電晶體,該溫度保護電路與該短路保護電路電 性連接至該比較電路,該邏輯電路與該比較電路相連接,又該比較電路連接至一放大器,該放大器經一功率電晶體與該光源模組電性連接。 The distributed photoelectric separation module device of claim 5, wherein the linear power supply circuit comprises a logic circuit, a temperature protection circuit, a short circuit protection circuit, a comparison circuit, an amplifier, and a power transistor. The temperature protection circuit and the short circuit protection circuit The logic circuit is connected to the comparison circuit, and the logic circuit is connected to the comparison circuit. The comparison circuit is connected to an amplifier. The amplifier is electrically connected to the light source module via a power transistor. 如申請專利範圍第1項所述之分佈式光電分離模組裝置,其中,該感測元件還能設一通訊模組,該電源線性電路設一傳輸模組,該通訊模組與該傳輸模組透過無線信號電性連接。 The distributed photoelectric separation module device of claim 1, wherein the sensing component can further comprise a communication module, wherein the power supply linear circuit is provided with a transmission module, the communication module and the transmission module The group is electrically connected through wireless signals. 如申請專利範圍第7項所述之分佈式光電分離模組裝置,其中該感測元件與該電源線性電路的無線傳輸技術,係包括藍芽、WIFI、Zigbee者。 The distributed photoelectric separation module device of claim 7, wherein the sensing element and the wireless transmission technology of the power supply linear circuit include Bluetooth, WIFI, and Zigbee.
TW107212482U 2018-06-26 2018-09-11 Distributed photoelectric separation module device TWM573847U (en)

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