TWM573079U - Calibration apparatus - Google Patents
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- TWM573079U TWM573079U TW107209500U TW107209500U TWM573079U TW M573079 U TWM573079 U TW M573079U TW 107209500 U TW107209500 U TW 107209500U TW 107209500 U TW107209500 U TW 107209500U TW M573079 U TWM573079 U TW M573079U
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0092—Treatment of the terminal leads as a separate operation
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Abstract
本創作揭露了一種校正裝置,其包括主體模組與腳位調整模組。主體模組包括本體單元以及位於本體單元且相對於本體單元能活動地進行往復位移的取放單元。腳位調整模組包括至少一驅動單元以及與至少一驅動單元連接的多個腳位調整單元。其中,取放單元受控制而取得待校物件,並且,至少一驅動單元受控制而驅使多個腳位調整單元對待校物件的多個導電引腳進行腳位校正。 This creation discloses a correction device, which includes a main body module and a foot position adjustment module. The main body module includes a main body unit and a pick-and-place unit that is located on the main body unit and can move back and forth with respect to the main body unit movably. The foot position adjustment module includes at least one drive unit and a plurality of foot position adjustment units connected to the at least one drive unit. Wherein, the pick-and-place unit is controlled to obtain the object to be calibrated, and at least one driving unit is controlled to drive the multiple pin position adjustment units to perform pin position correction on the multiple conductive pins of the object to be calibrated.
Description
本創作關於一種校正裝置,特別是關於一種以自動化對電子元件的接腳進行整理的校正裝置。 This creation relates to a correction device, in particular to a correction device that automatically organizes the pins of electronic components.
一般而言,各種常用電子元件係將其接腳焊接於電路板上的連接點,以達成該電子元件與該電路板間之裝設與電連接。常用的電子元件可為電阻、電容、電晶體、傳輸模組元件、接收模組元件或收發模組元件等,藉由伸出於電子元件的本體外的接腳焊接並電連接於該電路板上的連接點上。而為避免在裝配、焊接時發生問題,需事先對電子元件逐一進行檢測。 Generally speaking, various commonly used electronic components have their pins soldered to connection points on the circuit board to achieve installation and electrical connection between the electronic component and the circuit board. Commonly used electronic components can be resistors, capacitors, transistors, transmission module components, receiver module components or transceiver module components, etc., which are soldered and electrically connected to the circuit board by pins protruding from the body of the electronic component Connection point. In order to avoid problems during assembly and welding, the electronic components must be tested one by one in advance.
有些電子元件可能包含三個以上的接腳,例如雷射二極體,該些接腳分布於電子元件一側上的位置空間地交錯排列時,可能造成與電路板上的連接點對位困難,因此,在目前檢測的習知技術中,係以人工手動進行整理接腳,逐一修正彎斜的長接腳,再插設於檢測機上進行檢測。然而,此方式不但相當耗時,也可能會產生人為毀損的問題。 Some electronic components may include more than three pins, such as laser diodes. When these pins are distributed in a spatially staggered arrangement on the side of the electronic component, it may cause difficulty in aligning with the connection points on the circuit board Therefore, in the current testing conventional technology, the pins are manually arranged manually, the long pins that are bent are corrected one by one, and then inserted into the testing machine for testing. However, this method is not only time-consuming, but may also cause human damage.
本創作所要解決的技術問題在於,針對現有技術的不足提供一種校正裝置。 The technical problem to be solved in this creation is to provide a correction device for the deficiencies of the prior art.
為了解決上述的技術問題,本創作所採用的技術方案是,提供一種校正裝置,其包括主體模組與腳位調整模組。主體模組包括本體單元以及位於本體單元且相對於本體單元能活動地進行往復位移的取放單元。腳位調整模組包括位於本體單元的至少一驅動單元以及與至少一驅動單元連接的多個腳位調整單元。其中, 取放單元受控制而取得待校物件,並且,至少一驅動單元受控制而驅使多個腳位調整單元對待校物件的多個導電引腳進行腳位校正。 In order to solve the above technical problems, the technical solution adopted in this creation is to provide a correction device, which includes a main body module and a foot position adjustment module. The main body module includes a main body unit and a pick-and-place unit that is located on the main body unit and can move back and forth with respect to the main body unit movably. The foot adjustment module includes at least one driving unit located on the body unit and a plurality of foot adjustment units connected to the at least one driving unit. among them, The pick-and-place unit is controlled to obtain the object to be calibrated, and at least one driving unit is controlled to drive the multiple pin position adjustment units to perform pin position correction on the multiple conductive pins of the object to be calibrated.
本創作的其中一有益效果在於,本創作所提供的校正裝置,其能通過“主體模組包括本體單元以及位於本體單元且相對於本體單元能活動地進行往復位移的取放單元”、“腳位調整模組包括位於本體單元的至少一驅動單元以及與至少一驅動單元連接的多個腳位調整單元”以及“取放單元受控制而取得待校物件,並且,至少一驅動單元受控制而驅使多個腳位調整單元對待校物件的多個導電引腳進行腳位校正”的技術方案,達到以自動化對電子元件的接腳進行整理的技術功效。 One of the beneficial effects of this creation is that the correction device provided by this creation can pass the “body module including the body unit and the pick-and-place unit located on the body unit and capable of movably resetting relative to the body unit”, “foot The position adjustment module includes at least one drive unit located on the body unit and a plurality of foot position adjustment units connected to the at least one drive unit" and "the pick-and-place unit is controlled to obtain the object to be calibrated, and at least one drive unit is controlled to The technical solution of “driving multiple pin position adjustment units to perform pin position correction on multiple conductive pins of the object to be calibrated” achieves the technical effect of automatically sorting the pins of electronic components.
為使能更進一步瞭解本創作的特徵及技術內容,請參閱以下有關本創作的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本創作加以限制。 In order to further understand the characteristics and technical content of this creation, please refer to the following detailed description and drawings of this creation. However, the drawings provided are for reference and explanation only, and are not intended to limit this creation.
1‧‧‧校正裝置 1‧‧‧ Calibration device
10‧‧‧主體模組 10‧‧‧Main module
100‧‧‧本體單元 100‧‧‧Body unit
101‧‧‧取放單元 101‧‧‧ pick and place unit
102‧‧‧旋轉單元 102‧‧‧rotating unit
11‧‧‧腳位調整模組 11‧‧‧Position adjustment module
110‧‧‧驅動單元 110‧‧‧Drive unit
111‧‧‧腳位調整單元 111‧‧‧Pin adjustment unit
1110‧‧‧單元本體 1110‧‧‧ Unit body
1110A‧‧‧凹槽 1110A‧‧‧Groove
1111‧‧‧區隔件 1111‧‧‧Partition
12‧‧‧控制模組 12‧‧‧Control module
13‧‧‧影像擷取模組 13‧‧‧Image capture module
14‧‧‧移動模組 14‧‧‧Mobile Module
15‧‧‧腳位擴大模組 15‧‧‧pin expansion module
150‧‧‧擴展部 150‧‧‧Expansion Department
2‧‧‧待校物件 2‧‧‧ Objects to be checked
20‧‧‧導電引腳 20‧‧‧conductive pin
A‧‧‧容納槽 A‧‧‧Accommodation slot
圖1為本創作第一實施例的校正裝置的側視示意圖。 FIG. 1 is a schematic side view of the correction device of the first embodiment of the author.
圖2為本創作第一實施例的校正裝置的第一立體示意圖。 FIG. 2 is a first schematic perspective view of the calibration device of the first embodiment of the invention.
圖3為本創作第一實施例的校正裝置的第二立體示意圖。 FIG. 3 is a second schematic perspective view of the calibration device of the first embodiment.
圖4為本創作第一實施例的校正裝置的第三立體示意圖。 FIG. 4 is a third schematic perspective view of the calibration device of the first embodiment of the invention.
圖5為本創作第一實施例的校正裝置的第一仰視示意圖。 FIG. 5 is a first schematic bottom view of the correction device of the first embodiment of the author.
圖6為本創作第一實施例的校正裝置的第二仰視示意圖。 FIG. 6 is a second bottom view schematic diagram of the calibration device of the first embodiment.
圖7為本創作第二實施例的校正裝置的側視示意圖。 FIG. 7 is a schematic side view of the correction device of the second embodiment.
圖8為本創作第二實施例的校正裝置的立體示意圖。 FIG. 8 is a schematic perspective view of the calibration device of the second embodiment of the invention.
圖9為圖8中IX部分的局部放大示意圖。 FIG. 9 is a partially enlarged schematic view of part IX in FIG. 8.
圖10為本創作第二實施例的校正裝置的第一仰視示意圖。 FIG. 10 is a first schematic bottom view of the calibration device of the second embodiment.
圖11為本創作第二實施例的校正裝置的第二仰視示意圖。 FIG. 11 is a second schematic bottom view of the correction device of the second embodiment of the author.
圖12為本創作第三實施例的校正裝置的側視示意圖。 FIG. 12 is a schematic side view of the correction device of the third embodiment.
圖13為本創作第三實施例的校正裝置的裝置方塊圖。 FIG. 13 is a block diagram of a device for creating a correction device according to a third embodiment.
圖14為本創作第三實施例的校正裝置的前視示意圖。 FIG. 14 is a schematic front view of the correction device of the third embodiment.
圖15為本創作第四實施例的校正裝置的側視示意圖。 FIG. 15 is a schematic side view of the correction device of the fourth embodiment.
圖16為本創作的校正方法的第一流程圖。 FIG. 16 is a first flowchart of the correction method of the creation.
圖17為本創作的校正方法的第二流程圖。 FIG. 17 is a second flowchart of the correction method of the creation.
以下是通過特定的具體實施例來說明本創作所揭露有關“校正裝置及其方法”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本創作的優點與效果。本創作可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本創作的構思下進行各種修改與變更。另外,本創作的圖式僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本創作的相關技術內容,但所公開的內容並非用以限制本創作的保護範圍。 The following is a description of the implementation of the “correction device and method” disclosed in this creation by specific specific examples. Those skilled in the art can understand the advantages and effects of this creation by the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments. The details in this specification can also be based on different views and applications, and various modifications and changes can be made without departing from the concept of this creation. In addition, the drawings created in this article are only a schematic illustration, not based on actual size, and are declared in advance. The following embodiments will further describe the relevant technical content of the creation, but the disclosed content is not intended to limit the protection scope of the creation.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。 It should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" as used herein may include any combination of any one or more of the associated listed items, depending on the actual situation.
[第一實施例] [First embodiment]
請參閱圖1至圖6,其分別為本創作第一實施例的校正裝置的側視示意圖、第一立體示意圖、第二立體示意圖、第三立體示意圖、第一仰視示意圖及第二仰視示意圖。如圖所示,本創作第一實施例提供一種校正裝置1,其包括主體模組10與腳位調整模組11。主體模組10包括本體單元100以及位於本體單元100且相對於本體單元100能活動地進行往復位移的取放單元101。腳位調整模組11包括位於本體單元100的至少一驅動單元110以及與至少 一驅動單元110連接的多個腳位調整單元111。其中,取放單元101受控制而取得待校物件2,並且,至少一驅動單元110受控制而驅使多個腳位調整單元111對待校物件2的多個導電引腳20進行腳位校正。 Please refer to FIG. 1 to FIG. 6, which are respectively a side view schematic diagram, a first three-dimensional schematic diagram, a second three-dimensional schematic diagram, a third three-dimensional schematic diagram, a first upward schematic diagram, and a second upward schematic diagram of the calibration device of the first embodiment. As shown in the figure, the first embodiment of the present invention provides a calibration device 1, which includes a main body module 10 and a foot position adjustment module 11. The main body module 10 includes a main body unit 100 and a pick-and-place unit 101 located on the main body unit 100 and capable of movably resetting relative to the main body unit 100. The foot position adjustment module 11 includes at least one driving unit 110 located on the body unit 100 and at least one A plurality of pin adjustment units 111 connected to a driving unit 110. The pick-and-place unit 101 is controlled to obtain the object 2 to be corrected, and at least one driving unit 110 is controlled to drive the plurality of foot position adjustment units 111 to perform foot position correction on the plurality of conductive pins 20 of the object 2 to be corrected.
具體而言,本創作的校正裝置1包括了主體模組10與腳位調整模組11。主體模組10可包括本體單元100與取放單元101,取放單元101可活動地與本體單元100連接,並相對於本體單元100進行往復式的位移作動,取放單元101可為具有夾爪的組件。腳位調整模組11可包括至少一驅動單元110與多個腳位調整單元111,至少一驅動單元110可與本體單元100連接或設置於本體單元100上,驅動單元110可為氣動式、電磁式或機械式等動力組件;每一個腳位調整單元111與至少一驅動單元110連接。 Specifically, the calibration device 1 of the present invention includes a main body module 10 and a foot position adjustment module 11. The main body module 10 may include a body unit 100 and a pick-and-place unit 101. The pick-and-place unit 101 may be movably connected to the body unit 100 and perform a reciprocating displacement operation relative to the body unit 100. The pick-and-place unit 101 may have a gripper s component. The foot adjustment module 11 may include at least one drive unit 110 and a plurality of foot adjustment units 111. The at least one drive unit 110 may be connected to or disposed on the body unit 100. The drive unit 110 may be pneumatic or electromagnetic. Type or mechanical type dynamic components; each foot position adjusting unit 111 is connected to at least one driving unit 110.
因此,本創作的校正裝置1在進行檢測或者安裝待校物件2(可為任何具有引腳的電子元件,例如雷射二極體,但不以此為限)時,本體單元100可受控制而驅使取放單元101相對於本體單元100進行位移,以趨近承載待校物件2的平台(圖中未繪示),且取放單元101可受控制地取得待校物件2;或者,取放單元101可受控制地相對於本體單元100進行位移,以趨近承載待校物件2的平台,並取得待校物件2。接著,驅動單元110(於本實施例中係以兩個作為示例,但不以此為限)可受控制地驅使多個腳位調整單元111作動,以對待校物件2的多個導電引腳20進行腳位校正。 Therefore, when the calibration device 1 of the present invention performs inspection or installs the object to be calibrated 2 (which can be any electronic component with pins, such as a laser diode, but not limited to this), the body unit 100 can be controlled The pick-and-place unit 101 is driven to be displaced relative to the body unit 100 to approach the platform (not shown in the figure) carrying the object 2 to be checked, and the pick-and-place unit 101 can controlly obtain the object 2 to be checked; or, take The placing unit 101 can be controlledly displaced relative to the body unit 100 to approach the platform carrying the object 2 to be corrected and obtain the object 2 to be corrected. Next, the driving unit 110 (in this embodiment, two are taken as examples, but not limited to this) can be controlled to drive the plurality of pin adjustment units 111 to operate to treat the plurality of conductive pins of the object 2 20 Perform foot position correction.
藉此,本創作的校正裝置1通過上述的結構設計,可達到以自動化方式對電子元件的接腳進行整理的技術功效。 Therefore, through the above structural design, the calibration device 1 of the present invention can achieve the technical effect of arranging the pins of electronic components in an automated manner.
在其中一個較佳的實施態樣中,每一個腳位調整單元111包括與至少一驅動單元110連接且側邊具有一凹陷部的一單元本體1110,以及與單元本體1110連接且將凹陷部區分成多個凹槽1110A的一區隔件1111,每一個單元本體1110通過至少一驅動單 元110的驅使而朝多個導電引腳20位移,以使每一個區隔件111對多個導電引腳20進行區分,並使被區分的每一個導電引腳20容置到相對應的凹槽1110A中。 In one of the preferred embodiments, each foot adjustment unit 111 includes a unit body 1110 connected to at least one driving unit 110 and having a recess on the side, and a unit body 1110 connected to the unit body 1110 and connecting the recess A partition 1111 divided into a plurality of grooves 1110A, each unit body 1110 passes through at least one driving unit The element 110 is driven to move toward the plurality of conductive pins 20, so that each partition 111 distinguishes the plurality of conductive pins 20, and allows each of the differentiated conductive pins 20 to be accommodated in the corresponding recess Slot 1110A.
舉例而言,如圖5及圖6所示,本創作的每一個腳位調整單元111進一步可包括單元本體1110與區隔件1111,單元本體1110一端具有凹陷部,而區隔件1111位於凹陷部中,並與單元本體1110連接,以將凹陷部區分成多個凹槽1110A,類似呈叉子狀,但不以此為限。然而,本創作的每一個腳位調整單元111並不限於只有一個區隔件1111,也可依使用者或製造商需求而設置多個。 For example, as shown in FIGS. 5 and 6, each foot adjustment unit 111 of the present invention may further include a unit body 1110 and a partition 1111. The unit body 1110 has a recess at one end, and the partition 1111 is located in the recess And connected to the unit body 1110 to divide the recess into a plurality of grooves 1110A, similar to a fork, but not limited to this. However, each foot position adjustment unit 111 of the present invention is not limited to only one partition 1111, and may be provided in accordance with the needs of users or manufacturers.
因此,本創作的校正裝置1在進行檢測或者安裝待校物件2時,在待取放單元101取得待校物件2後,驅動單元110可分別驅使單元本體1110朝多個導電引腳20位移,並使區隔件1111穿插於多個導電引腳20中,而讓多個導電引腳20(於本實施例中係以四個導電引腳20作為示例,但不以此為限)被區分且容置到相對應的凹槽1110A中,進而調整導電引腳20的姿勢,進行腳位校正。 Therefore, when the calibration device 1 of the present invention detects or installs the object 2 to be checked, after the object to be checked 2 is obtained by the pick-and-place unit 101, the driving unit 110 can respectively drive the unit body 1110 to move toward the plurality of conductive pins 20, The partition 1111 is inserted into the plurality of conductive pins 20, and the plurality of conductive pins 20 (in this embodiment, four conductive pins 20 are used as examples, but not limited thereto) And it is accommodated in the corresponding groove 1110A, and then the posture of the conductive pin 20 is adjusted to perform foot position correction.
值得一提的是,通過上述內容雖可瞭解本創作的優點與效果,然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本創作。 It is worth mentioning that although the advantages and effects of this creation can be understood through the above content, the examples given above are only one of the feasible embodiments and are not intended to limit this creation.
[第二實施例] [Second Embodiment]
參閱圖7至圖11所示,其分別為本創作第二實施例的校正裝置的側視示意圖、本創作第二實施例的校正裝置的立體示意圖、圖8中IX部分的局部放大示意圖、本創作第二實施例的校正裝置第一仰視示意圖及本創作第二實施例的校正裝置第二仰視示意圖,並請一併參閱圖1至圖6。如圖所示,本創作第二實施例提供一種校正裝置1,其包括主體模組10與腳位調整模組11。主體模組10包括本體單元100以及位於本體單元100且相對於本體單元 100能活動地進行往復位移的取放單元101。腳位調整模組11包括至少一驅動單元110以及與至少一驅動單元110連接的多個腳位調整單元111。其中,取放單元101受控制而取得待校物件2,並且,至少一驅動單元110受控制而驅使多個腳位調整單元111對待校物件2的多個導電引腳20進行腳位校正。 7 to FIG. 11, which are respectively a schematic side view of the calibration device of the second embodiment of the author, a perspective schematic view of the calibration device of the second embodiment of the author, a partially enlarged schematic view of part IX in FIG. 8, Please refer to FIGS. 1 to 6 for the first looking-up schematic diagram of the calibration device of the second embodiment and the second looking-up schematic diagram of the calibration device of the second embodiment of the present invention. As shown in the figure, the second embodiment of the present invention provides a correction device 1, which includes a main body module 10 and a foot position adjustment module 11. The main body module 10 includes a main body unit 100 and is located on the main body unit 100 relative to the main body unit 100 is a pick-and-place unit 101 that can move to the reset position movably. The foot adjustment module 11 includes at least one driving unit 110 and a plurality of foot adjustment units 111 connected to the at least one driving unit 110. The pick-and-place unit 101 is controlled to obtain the object 2 to be corrected, and at least one driving unit 110 is controlled to drive the plurality of foot position adjustment units 111 to perform foot position correction on the plurality of conductive pins 20 of the object 2 to be corrected.
並且,每一個腳位調整單元111包括與至少一驅動單元110連接的一單元本體1110以及與單元本體1110連接的一區隔件1111,每一個單元本體1110通過至少一驅動單元110的驅使而朝多個導電引腳20位移,以使每一個區隔件1111對部分導電引腳20進行區分,並使相鄰的兩個區隔件1111形成一容納槽A,以容置相對應的其中一導電引腳20。 In addition, each of the foot position adjusting units 111 includes a unit body 1110 connected to at least one driving unit 110 and a partition 1111 connected to the unit body 1110. Each unit body 1110 is driven by at least one driving unit 110 toward The plurality of conductive pins 20 are displaced so that each partition 1111 distinguishes part of the conductive pins 20, and the two adjacent partitions 1111 form a receiving groove A to accommodate one of the corresponding Conductive pin 20.
具體而言,本創作第二實施例的校正裝置1與前述第一實施例的校正裝置1差異在於,在本實施例中,每一個腳位調整單元111包括了單元本體1110以及區隔件1111,單元本體1110可與至少一驅動單元110連接,區隔件1111位於單元本體1110的一端,區隔件1111可略呈三角狀,但不以此為限。其中,本創作第二實施例的校正裝置1可設有多個驅動單元110,每一個驅動單元110分別與一個單元本體1110連接,也可以僅設置一個驅動單元110,而驅動全部的腳位調整單元111,並不以本創作所提供的實施說明為限。 Specifically, the difference between the calibration device 1 of the second embodiment of the present invention and the calibration device 1 of the foregoing first embodiment is that in this embodiment, each foot position adjustment unit 111 includes a unit body 1110 and a partition 1111 The unit body 1110 can be connected to at least one driving unit 110. The partition 1111 is located at one end of the unit body 1110. The partition 1111 can be slightly triangular, but not limited to this. The correction device 1 of the second embodiment of the present invention may be provided with a plurality of driving units 110, and each driving unit 110 is connected to a unit body 1110, or only one driving unit 110 may be provided to drive all foot adjustments. Unit 111 is not limited to the implementation instructions provided in this creation.
因此,本創作的校正裝置1在進行檢測或者安裝待校物件2的過程中,在待取放單元101取得待校物件2後,驅動單元110可驅使多個單元本體1110朝多個導電引腳20位移,以使區隔件1111穿插於多個導電引腳20中;並且,相鄰的兩個區隔件1111會形成一容納槽A,因此,多個導電引腳20(於本實施例中係以五個導電引腳20作為示例,但不以此為限)被區分且容置到相對應的容納槽A中,進而調整導電引腳20的姿勢,進行腳位校正。 Therefore, in the calibration device 1 of the present invention, during the process of detecting or installing the to-be-calibrated object 2, after the to-be-released unit 101 acquires the to-be-calibrated object 2, the driving unit 110 can drive the plurality of unit bodies 1110 toward the plurality of conductive pins 20 displacement, so that the partition 1111 is inserted into the plurality of conductive pins 20; and, two adjacent partitions 1111 will form a receiving slot A, therefore, a plurality of conductive pins 20 (in this embodiment In the middle system, five conductive pins 20 are taken as examples, but not limited to this) are distinguished and accommodated in the corresponding accommodating grooves A, and then the posture of the conductive pins 20 is adjusted to perform foot position correction.
值得一提的是,通過上述內容雖可瞭解本創作的優點與效 果,然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本創作。 It is worth mentioning that although the above content can understand the advantages and effects of this creation As a result, however, the examples given above are only one of the feasible embodiments and are not intended to limit the creation.
[第三實施例] [Third Embodiment]
參閱圖12至圖14所示,其分別為本創作第三實施例的校正裝置的側視示意圖、裝置方塊圖及前視示意圖,並請一併參閱圖1至圖11。如圖所示,本實施例的校正裝置與前述各實施例相同的元件的作動相似,在此不再贅述,然而,在本實施例中,取放單元101受控制而由一第一位置位移至一第二位置,以取得待校物件2;並且,取放單元101受控制而由第二位置位移至第一位置,且至少一驅動單元110受控制而驅使多個腳位調整單元111對多個導電引腳20進行腳位校正。 Refer to FIGS. 12 to 14, which are a schematic side view, a block diagram, and a schematic front view of the calibration device according to the third embodiment, and refer to FIGS. 1 to 11 together. As shown in the figure, the calibration device of this embodiment is similar to the operation of the same elements in the foregoing embodiments, and will not be repeated here. However, in this embodiment, the pick-and-place unit 101 is controlled to be displaced from a first position To a second position to obtain the object 2 to be corrected; and, the pick-and-place unit 101 is controlled to be displaced from the second position to the first position, and at least one driving unit 110 is controlled to drive a plurality of pairs of foot adjustment units 111 A plurality of conductive pins 20 perform foot position correction.
舉例而言,本創作第三實施例的校正裝置1在進行取得待校物件2的過程中,取放單元101可受控制地而由第一位置位(如圖1所示)移至第二位置(如圖12所示);接著,取放單元101由承載待校物件2的平台(圖中未繪示)上取得待校物件2,其中取得方式可為夾取、吸取或其他任何形式的方式。在取放單元101取得待校物件2後,再由第二位置位移至第一位置,並且,驅動單元110受控制而驅使多個腳位調整單元111對多個導電引腳20腳位的姿勢、位置進行調整。 For example, in the calibration device 1 of the third embodiment of the present invention, in the process of acquiring the object 2 to be corrected, the pick-and-place unit 101 can be controlled to move from the first position (as shown in FIG. 1) to the second Position (as shown in FIG. 12); Then, the pick-and-place unit 101 obtains the object 2 from the platform (not shown in the figure) carrying the object 2 to be corrected, wherein the obtaining method may be clamping, suction or any other form The way. After the pick-and-place unit 101 obtains the object 2 to be calibrated, it is then shifted from the second position to the first position, and the driving unit 110 is controlled to drive the postures of the plurality of foot adjustment units 111 to the positions of the plurality of conductive pins 20 , Position adjustment.
在其中一個較佳的實施態樣中,校正裝置1進一步更包括控制模組12,其電性連接取放單元101與驅動單元110,控制模組12根據一執行命令而控制取放單元101取得待校物件2,且控制模組12根據執行命令而控制取放單元101由第二位置位移至第一位置,並控制驅動單元110驅使多個腳位調整單元111進行腳位校正。 In one of the preferred embodiments, the calibration device 1 further includes a control module 12, which is electrically connected to the pick-and-place unit 101 and the driving unit 110, and the control module 12 controls the pick-and-place unit 101 to obtain according to an execution command The object 2 to be corrected, and the control module 12 controls the pick-and-place unit 101 to move from the second position to the first position according to the execution command, and controls the driving unit 110 to drive the plurality of foot position adjustment units 111 to perform foot position correction.
具體而言,本創作的校正裝置1進一步還可包括控制模組12,其可為中央處理器或可為具控制及處理功能的控制設備。控 制模組12能與取放單元101及驅動單元110電性連接。因此,操作人員可透過鍵盤或觸控螢幕而對控制模組12提供執行命令。接著,控制模組12可根據執行命令而控制取放單元101進行取得待校物件2,並且,在取放單元101取得待校物件2後,控制模組12可控制驅動單元110驅使多個腳位調整單元111對多個導電引腳20腳位的姿勢、位置進行調整。 Specifically, the calibration device 1 of the present invention may further include a control module 12, which may be a central processing unit or a control device with control and processing functions. control The control module 12 can be electrically connected to the pick-and-place unit 101 and the driving unit 110. Therefore, the operator can provide execution commands to the control module 12 through the keyboard or the touch screen. Then, the control module 12 can control the pick-and-place unit 101 to obtain the object 2 to be checked according to the execution command, and after the pick-and-place unit 101 obtains the object 2 to be checked, the control module 12 can control the driving unit 110 to drive a plurality of feet The position adjusting unit 111 adjusts the posture and position of the positions of the plurality of conductive pins 20.
在另一個較佳的實施態樣中,校正裝置1進一步還可包括影像擷取模組13,其電性連接控制模組12,影像擷取模組13根據控制模組12的控制而擷取取放單元101上的待校物件2的影像,以產生至少一物件影像訊息。 In another preferred embodiment, the calibration device 1 may further include an image capture module 13, which is electrically connected to the control module 12, and the image capture module 13 captures according to the control of the control module 12 Pick and place the image of the object 2 to be corrected on the unit 101 to generate at least one object image message.
舉例而言,本創作的校正裝置1進一步還包括了影像擷取模組13,其可為微型攝影裝置,但不以此為限。影像擷取模組13可電性連接控制模組12,並可位於取放單元101的下方且對應於取放單元101。因此,在取放單元101取得待校物件2,且驅動單元110驅使多個腳位調整單元111對多個導電引腳20腳位的姿勢、位置進行調整後,控制模組12還可根據執行命令控制影像擷取模組13朝取放單元101進行攝像,以取得待校物件2的腳位影像,並對應產生至少一物件影像訊息。其中,控制模組12可具有儲存組件(圖中未繪示),例如硬碟或記憶體,可用於儲存物件影像訊息以及預設影像訊息(比對基礎的影像)。 For example, the calibration device 1 of the present invention further includes an image capture module 13, which may be a miniature photography device, but not limited to this. The image capturing module 13 can be electrically connected to the control module 12 and can be located below the pick-and-place unit 101 and corresponds to the pick-and-place unit 101. Therefore, after the pick-and-place unit 101 obtains the object 2 to be corrected, and the driving unit 110 drives the plurality of foot position adjustment units 111 to adjust the posture and position of the foot positions of the plurality of conductive pins 20, the control module 12 may also perform The command controls the image capturing module 13 to take a picture toward the pick-and-place unit 101 to obtain the foot image of the object 2 to be corrected, and correspondingly generate at least one object image message. The control module 12 can have a storage component (not shown in the figure), such as a hard disk or a memory, which can be used to store object image information and preset image information (comparison-based images).
在又一個較佳的實施態樣中,主體模組10進一步更還包括能轉動地套設於取放單元101且驅使取放單元101進行旋轉的旋轉單元102,旋轉單元102電性連接控制模組12;其中,控制模組12根據至少一物件影像訊息未符合一預設影像訊息,以控制旋轉單元102驅使取放單元101旋轉一預定角度。 In yet another preferred embodiment, the main body module 10 further includes a rotating unit 102 rotatably sleeved on the pick-and-place unit 101 and driving the pick-and-place unit 101 to rotate. The rotating unit 102 is electrically connected to the control mode Group 12; wherein, the control module 12 controls the rotation unit 102 to drive the pick-and-place unit 101 to rotate by a predetermined angle according to at least one object image message that does not match a preset image message.
進一步而言,本創作的主體模組10進一步更還包括旋轉單元102,旋轉單元102能轉動地套設於取放單元101,並電性連接控制模組12。因此,在影像擷取模組13產生物件影像訊息後,控制 模組12會將物件影像訊息與預設影像訊息進行比對,判斷位於取放單元101上的待校物件2的腳位經過調整後,腳位的位置是否與系統預設的腳位位置相同;倘若偏離、沒有相符,控制模組12則根據待校物件2的腳位位置偏離預設的腳位位置的多少角度,而控制旋轉單元102驅使取放單元101旋轉相應的角度,進而使待校物件2旋轉後的腳位位置與系統預設的腳位位置相同。 Furthermore, the main body module 10 of the present invention further includes a rotating unit 102 that is rotatably sleeved on the pick-and-place unit 101 and electrically connected to the control module 12. Therefore, after the image capturing module 13 generates object image information, control The module 12 compares the object image information with the preset image information, and determines whether the position of the foot position of the object 2 to be corrected on the pick-and-place unit 101 is adjusted to be the same as the system's default position If there is a deviation and there is no match, the control module 12 controls the rotation unit 102 to drive the pick-and-place unit 101 to rotate the corresponding angle according to how much the position of the foot position of the object 2 to be corrected deviates from the preset foot position. The foot position of the calibration object 2 after rotation is the same as the preset foot position of the system.
其中,在旋轉單元102驅使取放單元101旋轉後,控制模組12還可控制影像擷取模組13再次擷取待校物件2的腳位影像,並進行二次比對,以判斷旋轉後的待校物件2的腳位位置與系統預設的腳位位置是否相同;倘若不同,則再次重複上述步驟,直到判斷待校物件2的腳位位置與系統預設的腳位位置相同。 After the rotation unit 102 drives the pick-and-place unit 101 to rotate, the control module 12 can also control the image capture module 13 to capture the foot image of the object 2 to be corrected again, and perform a second comparison to determine the rotation Whether the foot position of the object 2 to be corrected is the same as the preset foot position of the system; if different, repeat the above steps again until it is determined that the foot position of the object 2 to be corrected is the same as the default foot position of the system.
此外,旋轉單元102的結構與作動,以及控制模組12比對物件影像訊息與預設影像訊息的比對技術,皆為習知技術,在此不再特別說明。 In addition, the structure and operation of the rotating unit 102 and the comparison technology of the control module 12 to compare the object image information with the preset image information are conventional technologies, and will not be specifically described here.
值得一提的是,通過上述內容雖可瞭解本創作的優點與效果,然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本創作。 It is worth mentioning that although the advantages and effects of this creation can be understood through the above content, the examples given above are only one of the feasible embodiments and are not intended to limit this creation.
[第四實施例] [Fourth embodiment]
參閱圖15所示,其分別為本創作第四實施例的校正裝置的側視示意圖,並請一併參閱圖1至圖14。如圖所示,本實施例的校正裝置與前述各實施例相同的元件的作動相似,在此不再贅述,然而,在本實施例中,校正裝置1進一步更包括移動模組14及腳位擴大模組15。移動模組14能活動地連接於本體單元100。腳位擴大模組15具有擴展部150,並鄰近於主體模組10。其中,移動模組14受控制而帶動本體單元100位移至一預定位置,且取放單元101受控制而由第一位置位移至一第三位置,以朝擴展部150位移,並使待校物件2抵觸擴展部150。 Please refer to FIG. 15, which is a schematic side view of a calibration device according to the fourth embodiment, and please refer to FIGS. 1 to 14 together. As shown in the figure, the correction device of this embodiment is similar to the operation of the same elements in the previous embodiments, and will not be described here again. However, in this embodiment, the correction device 1 further includes a mobile module 14 and a pin Enlarge module 15. The mobile module 14 can be movably connected to the body unit 100. The foot expansion module 15 has an expansion portion 150 and is adjacent to the main body module 10. Among them, the mobile module 14 is controlled to drive the body unit 100 to a predetermined position, and the pick-and-place unit 101 is controlled to move from the first position to a third position to move toward the expansion portion 150 and make the object to be calibrated 2 Resistance to the extension 150.
具體而言,本創作的校正裝置1進一步更包括移動模組14及腳位擴大模組15,移動模組14可為導軌組件,腳位擴大模組15可為圓椎狀或角錐狀的元件,但不以此為限。因此,在控制模組12判斷待校物件2的腳位位置與系統預設的腳位位置相同後,控制模組12可控制移動模組14帶動主體模組10位移至一預定位置,以使取放單元101對應於腳位擴大模組15。接著,控制模組12可控制取放單元101朝腳位擴大模組15的擴展部150趨近,由第一位置位移至第三位置(如圖15所示),使得待校物件2抵觸擴展部150,而將多個導電引腳20朝外撐開,以方便後續的檢測或安裝程序。 Specifically, the calibration device 1 of the present invention further includes a mobile module 14 and a foot expansion module 15, the mobile module 14 may be a rail assembly, and the foot expansion module 15 may be a conical or pyramidal element , But not limited to this. Therefore, after the control module 12 determines that the foot position of the object to be corrected 2 is the same as the preset foot position of the system, the control module 12 can control the moving module 14 to drive the main body module 10 to a predetermined position, so that The pick-and-place unit 101 corresponds to the foot expansion module 15. Then, the control module 12 can control the pick-and-place unit 101 to approach the expansion portion 150 of the foot expansion module 15, and move from the first position to the third position (as shown in FIG. 15 ), so that the object 2 to be adjusted resists expansion Part 150, and spread the plurality of conductive pins 20 outwards to facilitate subsequent testing or installation procedures.
其中,影像擷取模組13與腳位擴大模組15可位於不同位置(即位於不同的工作區域),且鄰近於主體模組10,主體模組10可通過移動模組14的帶動而位移至影像擷取模組13或腳位擴大模組15的上方。 Among them, the image capturing module 13 and the foot expansion module 15 can be located at different positions (that is, located in different working areas), and adjacent to the main body module 10, and the main body module 10 can be displaced by the movement of the moving module 14 To the top of the image capture module 13 or the pin expansion module 15.
值得一提的是,通過上述內容雖可瞭解本創作的優點與效果,然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本創作。 It is worth mentioning that although the advantages and effects of this creation can be understood through the above content, the examples given above are only one of the feasible embodiments and are not intended to limit this creation.
此外,上述各實施例在說明本創作的校正裝置1的整體作動的同時,雖然也同時說明了本創作的校正方法,然而,為使本創作的校正方法的步驟能更明確清楚,進一步說明如後。 In addition, the above embodiments not only explain the overall operation of the calibration device 1 of the present creation, but also explain the calibration method of the present creation. However, in order to make the steps of the calibration method of the present creation more clear and clear, further Rear.
請參閱圖15及圖16,其為本創作的校正方法的第一流程圖及第二流程圖。如圖所示,本創作的校正方法包括下列步驟:步驟S30:通過控制取放單元取得待校物件;以及步驟S31:利用至少一驅動單元驅使多個腳位調整單元對待校物件的多個導電引腳進行腳位校正。 Please refer to FIG. 15 and FIG. 16, which are the first flowchart and the second flowchart of the authored calibration method. As shown in the figure, the calibration method of the present creation includes the following steps: Step S30: Obtain the object to be calibrated by controlling the pick-and-place unit; and Step S31: Use at least one driving unit to drive the plurality of foot adjustment units to conduct multiple electrical conductions of the object to be calibrated Pin correction.
其中,在取得待校物件之步驟S30中,進一步更包括下列步驟:步驟S300:通過控制取放單元由第一位置位移至第二位置, 以取得待校物件;以及步驟S301:控制取放單元由第二位置位移至第一位置。 Among them, in the step S30 of obtaining the object to be corrected, the method further includes the following steps: Step S300: Displace the first position to the second position by controlling the pick-and-place unit, To obtain the object to be corrected; and step S301: controlling the pick-and-place unit to move from the second position to the first position.
其中,本創作的校正方法進一步更包括下列步驟:步驟S40:通過控制模組根據執行命令而控制取放單元取得待校物件;步驟S41:利用控制模組根據執行命令而控制取放單元由第二位置位移至第一位置,並控制至少一驅動單元驅使多個腳位調整單元進行腳位校正。 The calibration method of the present invention further includes the following steps: Step S40: the control module controls the pick-and-place unit to obtain the object to be calibrated according to the execution command; step S41: the control module controls the pick-and-place unit according to the execution command The two positions are displaced to the first position, and at least one driving unit is controlled to drive a plurality of foot position adjustment units to perform foot position correction.
其中,在控制至少一驅動單元驅使多個腳位調整單元進行腳位校正之步驟S41後,進一步更包括下列步驟:步驟S42:通過控制模組控制影像擷取模組擷取取放單元上的待校物件的影像,以產生至少一物件影像訊息。 After the step S41 of controlling at least one driving unit to drive a plurality of pin adjustment units to perform pin correction, the method further includes the following steps: Step S42: controlling the image capture module to capture The image of the object to be corrected to generate at least one object image message.
其中,在產生至少一物件影像訊息之步驟S42後,進一步更包括下列步驟:步驟S43:通過控制模組判斷至少一物件影像訊息未符合預設影像訊息時,則控制旋轉單元驅使取放單元旋轉預定角度。 After the step S42 of generating at least one object image message, the method further includes the following steps: Step S43: when the control module determines that the at least one object image message does not match the preset image message, the rotation unit is controlled to drive the pick-and-place unit to rotate Predetermined angle.
值得一提的是,通過上述內容雖可瞭解本創作的校正方法的實施過程,然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本創作。 It is worth mentioning that although the implementation process of the correction method of this creation can be understood through the above content, however, the examples given above are only one of the feasible embodiments and are not intended to limit this creation.
[實施例的有益效果] [Beneficial effect of embodiment]
本創作的其中一有益效果在於,本創作所提供的校正裝置,其能通過“主體模組10包括本體單元100以及位於本體單元100且相對於本體單元100能活動地進行往復位移的取放單元101”、“腳位調整模組11包括位於本體單元100的至少一驅動單元110以及與至少一驅動單元110連接的多個腳位調整單元111”以及“取放單元101受控制而取得待校物件2,並且,至少一驅動單元110受控制而驅使多個腳位調整單元111對待校物件2 的多個導電引腳20進行腳位校正”的技術方案,達到以自動化對電子元件的接腳進行整理的技術功效。 One of the beneficial effects of this creation is that the correction device provided by this creation can pass the “main module 10 including the body unit 100 and the pick-and-place unit located on the body unit 100 and movably moving back and forth relative to the body unit 100 101", "Foot adjustment module 11 includes at least one driving unit 110 located in the body unit 100 and a plurality of foot adjustment units 111 connected to the at least one driving unit 110" and "The pick-and-place unit 101 is controlled to obtain a pending calibration Object 2, and at least one driving unit 110 is controlled to drive a plurality of foot adjustment units 111 to treat the object 2 The technical solution of "correcting the position of multiple conductive pins 20" achieves the technical effect of automatically sorting the pins of electronic components.
更進一步來說,本創作的校正裝置1及校正方法可通過主體模組10與腳位調整模組11的配合,以自動化的方式對待校物件2不同數量的導電引腳20進行校正、調整。並且,校正裝置1進一步還可配合影像擷取模組13、移動模組14與腳位擴大模組15,對腳位校正好的待校物件2進行導電引腳20外擴的流程,以便於待校物件2後續的檢測或安裝的製程。 Furthermore, the calibration device 1 and the calibration method of the present invention can calibrate and adjust different numbers of conductive pins 20 of the school object 2 through the cooperation of the main body module 10 and the foot position adjustment module 11 in an automated manner. In addition, the calibration device 1 can further cooperate with the image capturing module 13, the mobile module 14 and the foot expansion module 15 to perform the process of expanding the conductive pins 20 on the object 2 to be corrected whose feet are corrected, in order to facilitate The process of subsequent inspection or installation of the object 2 to be corrected.
以上所公開的內容僅為本創作的優選可行實施例,並非因此侷限本創作的申請專利範圍,所以凡是運用本創作說明書及圖式內容所做的等效技術變化,均包含於本創作的申請專利範圍內。 The content disclosed above is only a preferred and feasible embodiment of this creation, and does not limit the scope of the patent application for this creation, so any equivalent technical changes made by using this creation specification and graphic content are included in this creation application Within the scope of the patent.
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CN110170598A (en) * | 2019-05-31 | 2019-08-27 | 东莞华贝电子科技有限公司 | The shaping device and shaping deviation-rectifying system of pin for plug-in unit |
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CN114082866B (en) * | 2021-12-02 | 2024-07-23 | 武汉新辰科技有限公司 | TO pin separating structure |
CN114919956B (en) * | 2022-05-20 | 2023-10-20 | 武汉锐科光纤激光技术股份有限公司 | Material turnover device |
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US3106945A (en) * | 1959-10-28 | 1963-10-15 | Texas Instruments Inc | Lead straightener device |
US3520336A (en) * | 1968-08-26 | 1970-07-14 | Universal Instruments Corp | Straightener assembly including integrated pre-straightener for electronic component leads |
CH668882A5 (en) * | 1986-02-28 | 1989-01-31 | Profiform Ag | METHOD FOR ALIGNING BENT CONNECTING WIRES OF MULTIPOLE ELECTRONIC COMPONENTS AND SYSTEM FOR EXERCISING THIS METHOD. |
JPH07116984A (en) * | 1993-08-30 | 1995-05-09 | Sanyo Electric Co Ltd | Robot hand and part supplier using this robot hand |
WO2014038087A1 (en) * | 2012-09-10 | 2014-03-13 | 富士機械製造株式会社 | Lead correction method and lead correction device |
CN105934144B (en) * | 2016-05-25 | 2019-03-08 | 威海东兴电子有限公司 | A kind of inductor pin Correction Die |
CN205982452U (en) * | 2016-07-18 | 2017-02-22 | 苏州史托格自动化设备制造有限公司 | Automatic plug detection mechanism of diode |
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