TWM572495U - Touch sensor and touch panel thereof - Google Patents

Abstract

The present disclosure provides a touch sensor and a touch panel thereof. By utilizing the supporting effect of a first substrate, a flexible touch sensing component can be formed on the release layer. And by utilizing the transfer effect of a second substrate, the flexible touch sensing component can be attached on non-planar or curved cover substrates. Therefore, the touch panel can be lighter, thinner, and has low production cost. In addition, the flexible touch sensing component uses a thin film sensor containing a nano-sized metal conductive layer which is flexible and deformable. Therefore, the touch sensor and the touch panel of the present invention can be used for flexible touch-sensing or curved touch-sensing applications.

Description

Touch sensor and touch panel thereof

The present invention relates to the field of touch technologies, and in particular, to a touch sensor and a touch panel thereof.

In today's consumer electronics market, touch panels have been used in a variety of electronic products, such as smart phones, mobile phones, tablets and notebooks. Since the user can directly operate and release commands through the objects displayed on the screen, the touch panel provides a user-friendly operation interface between the user and the electronic product.

The existing touch panel is formed by sputtering and lithography under high temperature conditions to form a touch sensing component to form a touch sensor on the substrate. Generally, a sufficiently strong and flat glass or other transparent substrate is used as the substrate for carrying the touch sensing component. Since such a substrate is relatively thick, it is difficult to fit the touch sensor to the flexible cover or the curved surface. On the cover. However, with the ever-increasing need for smaller, thinner, flexible, and curved touch panels, existing touch-sensitive sensing assemblies or substrate thicknesses can be fabricated directly on flexible substrates or non-planar substrates using existing processes. It is very difficult and expensive to fit a large touch sensor to a flexible cover or a curved cover. Therefore, the existing touch panel structure and manufacturing process are still to be further improved.

The present invention provides a touch sensor and a touch panel thereof, which realize flexible touch and curved touch while satisfying the requirements of a lighter, thinner and lower manufacturing cost of the touch panel.

The present creative embodiment provides a touch sensor for transferring to a non-planar package The invention comprises a carrier substrate and a flexible touch sensing component, and the flexible touch sensing component and the carrier substrate have a release layer.

Preferably, the flexible touch sensing component is a film sensor.

Preferably, the film sensor has a film and a nano metal conductive layer formed on the film.

Preferably, the method further comprises: a flexible electrode assembly, wherein the nano metal conductive layer is located on a first surface of the film, and the flexible electrode assembly is located on a second surface of the film.

Preferably, the nano metal conductive layer comprises a nano silver wire layer and a coating layer (OC).

Preferably, the nano metal conductive layer further comprises a passivation or a protective layer.

Preferably, the method further comprises: a flexible electrode assembly, wherein the flexible electrode assembly is located on the nano metal conductive layer, and the flexible electrode assembly and the nano metal conductive layer are electrically insulated from each other.

Preferably, the film sensor has a film and a first nano metal conductive layer and a second nano metal conductive layer formed on opposite surfaces of the film.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible electrode assembly is located on the first nano metal conductive layer, and the flexible electrode assembly and the first nano metal conductive layer are electrically connected to each other insulation.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible electrode assembly is located on the second nano metal conductive layer, and the flexible electrode assembly and the first nano metal conductive layer are electrically connected to each other Insulating, the flexible electrode assembly is located between the second nano metal conductive layer and the release layer.

Preferably, the first nano metal conductive layer and the second nano metal conductive layer respectively comprise a nano silver wire layer and a coating layer (OC).

Preferably, the nano silver wire layer is electrically connected to a peripheral circuit.

Preferably, the first nano metal conductive layer further comprises a hard coat layer (HC), The second nano metal conductive layer further includes a passivation.

Preferably, the first nano metal conductive layer or the second nano metal conductive layer further comprises a protective layer.

Preferably, the film sensor has a first film, a first nano metal conductive layer formed on the first film, a second film, and a second nano metal formed on the second film. The conductive layer, the first film and the second film are bonded to each other, and the first nano metal conductive layer and the second nano metal conductive layer face in opposite directions.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible electrode assembly is located on the first nano metal conductive layer, and the flexible electrode assembly and the first nano metal conductive layer are electrically connected to each other insulation.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible electrode assembly is located between the flexible touch sensing component and the release layer, the flexible electrode assembly and the second nano The metal metal conductive layers are respectively located on opposite surfaces of the second film and are electrically insulated from each other.

Preferably, the thin film sensor further comprises a peripheral circuit electrically connected to the first nano metal conductive layer and the second nano metal conductive layer.

Preferably, the first nano metal conductive layer further comprises a hard coat layer (HC), and the second nano metal conductive layer further comprises a passivation.

Preferably, the first nano metal conductive layer or the second nano metal conductive layer further comprises a protective layer.

Preferably, the film sensor comprises a film and a transferable transparent conductive film attached to the film.

Preferably, the method further includes a bonding layer, wherein the bonding layer is disposed on the flexible touch sensing component.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible electrode assembly is located between the bonding layer and the flexible touch sensing component.

Preferably, the method further includes a residual release layer disposed on the flexible touch sensing component.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible electrode assembly is located on the flexible touch sensing component, or the flexible electrode assembly is located in the flexible touch sensing component Between the release layer and the release layer.

Preferably, the flexible electrode assembly has a film and a nano metal conductive layer formed on the film.

Preferably, the nano metal conductive layer comprises a nano silver wire layer and a coating layer (OC).

Preferably, the nano metal conductive layer further comprises a passivation, a protective layer or a hard coat layer (HC).

The present invention provides a flexible cover; a flexible touch sensing component having a bonding layer between the flexible touch sensing component and the flexible cover; and a shielding layer. The shielding layer covers at least a portion of the flexible touch sensing element.

Preferably, the decorative cover panel comprises a film layer and a shielding layer disposed on the film layer.

Preferably, the method further comprises: a flexible electrode assembly, wherein the nano metal conductive layer is located on a first surface of the film, and the flexible electrode assembly is located on a second surface of the film.

Preferably, the method further comprises: a flexible electrode assembly, wherein the flexible electrode assembly is located on the nano metal conductive layer, and the flexible electrode assembly and the nano metal conductive layer are electrically insulated from each other.

Preferably, the film sensor has a film and a first nano metal conductive layer and a second nano metal conductive layer formed on opposite surfaces of the film.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible electrode assembly is located on the first nano metal conductive layer, and the flexible electrode assembly and the first nano metal conductive layer are electrically connected to each other Insulating, the flexible electrode assembly is located between the first nano metal conductive layer and the bonding layer.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible electrode assembly is located on the second nano metal conductive layer, the flexible electrode assembly and the first nano The metal metal conductive layers are electrically insulated from each other.

Preferably, the nano silver wire layer is electrically connected to a peripheral circuit, and the shielding layer shields the peripheral circuit.

Preferably, the film sensor has a first film, a first nano metal conductive layer formed on the first film, a second film, and a second nano metal formed on the second film. The conductive layer, the first film and the second film are bonded to each other, and the first nano metal conductive layer and the second nano metal conductive layer face in opposite directions.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible electrode assembly is located on the first nano metal conductive layer, and the flexible electrode assembly and the first nano metal conductive layer are electrically connected to each other Insulating, the flexible electrode assembly is located between the first nano metal conductive layer and the bonding layer.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible electrode assembly and the second nano-metal conductive layer are respectively located on opposite surfaces of the second film and electrically insulated from each other.

Preferably, the thin film sensor further comprises a peripheral circuit electrically connected to the first nano metal conductive layer and the second nano metal conductive layer, the shielding layer shielding the peripheral circuit.

Preferably, the first nano metal conductive layer further comprises a hard coat layer (HC), and the second nano metal conductive layer further comprises a passivation.

Preferably, the first nano metal conductive layer or the second nano metal conductive layer further comprises a protective layer.

Preferably, the first release layer is disposed on the flexible touch sensing component, wherein the first release layer is located between the flexible touch sensing component and the bonding layer.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible electrode assembly is located between the first release layer and the flexible touch sensing component.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible electrode assembly is located on the flexible touch sensing component, or the flexible electrode assembly is located thereon Between the flexible touch sensing component and the bonding layer.

The present invention provides a touch panel for transferring to a non-planar surface, comprising: a flexible cover having a decorative function (decoration portion); and a flexible touch sensing element, the flexible touch The sensing element is in direct contact with the decorative cover having a decorative function.

Preferably, the decorative cover panel comprises a film layer and a shielding layer disposed on the film layer, and the shielding layer forms a decorative function (decoration portion).

Preferably, the film sensor has a film and a nano metal conductive layer formed on the film, and the film directly adheres to the film layer of the flexible cover plate having a decorative function.

Preferably, the method further includes: a flexible electrode assembly, wherein the nano metal conductive layer is located on a first surface of the film, and the film layer of the decorative flexible cover sheet is located at a first portion of the film And a second surface, the flexible electrode assembly is located on the nano metal conductive layer, and the flexible electrode assembly and the nano metal conductive layer are electrically insulated from each other.

Preferably, the film sensor has a film and a first nano metal conductive layer and a second nano metal conductive layer formed on opposite surfaces of the film.

Preferably, the method further includes: a flexible electrode assembly, wherein the first nano-metal conductive layer directly adheres to the film layer of the decorative cover having a decorative function, wherein the flexible electrode assembly is located The flexible electrode assembly and the second nano metal conductive layer are electrically insulated from each other on the second nano metal conductive layer.

Preferably, the film sensor has a first film, a first nano metal conductive layer formed on the first film, a second film, and a second nano metal formed on the second film. The conductive layer, the first film and the second film are bonded to each other, and the first nano metal conductive layer and the second nano metal conductive layer face in opposite directions.

Preferably, the method further includes: a flexible electrode assembly, wherein the first nano-metal conductive layer directly adheres to the film layer of the decorative cover having a decorative function, wherein the flexible electrode assembly is located The flexible electrode group on the second nano metal conductive layer The piece and the second nano metal conductive layer are electrically insulated from each other.

Preferably, the thin film sensor further comprises a peripheral circuit electrically connected to the first nano metal conductive layer and the second nano metal conductive layer, the shielding layer shielding the peripheral circuit.

Preferably, the film sensor comprises a film and a transferable transparent conductive film attached to the film.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible touch sensing component is located between the flexible cover plate having the decorative function and the flexible electrode assembly.

The present invention provides a touch panel for transferring to a non-planar surface, comprising: a flexible cover having a decorative function (decoration portion); and a flexible touch sensing element, the flexible touch The control sensing element has a bonding layer between the decorative cover and the flexible cover.

Preferably, the decorative cover panel comprises a film layer and a shielding layer disposed on the film layer, and the shielding layer forms a decorative function (decoration portion).

Preferably, the method further comprises: a flexible electrode assembly, wherein the nano metal conductive layer is located on a first surface of the film, and the flexible electrode assembly is located on a second surface of the film.

Preferably, the method further comprises: a flexible electrode assembly, wherein the flexible electrode assembly is located on the nano metal conductive layer, and the flexible electrode assembly and the nano metal conductive layer are electrically insulated from each other.

Preferably, the film sensor has a film and a first nano metal conductive layer and a second nano metal conductive layer formed on opposite surfaces of the film.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible electrode assembly is located on the first nano metal conductive layer, and the flexible electrode assembly and the first nano metal conductive layer are electrically connected to each other Insulating, the flexible electrode assembly is located between the first nano metal conductive layer and the bonding layer.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible electrode group The component is located on the second nano metal conductive layer, and the flexible electrode assembly and the first nano metal conductive layer are electrically insulated from each other.

Preferably, the first nano metal conductive layer and the second nano metal conductive layer respectively comprise a nano silver wire layer and a coating layer (OC).

Preferably, the nano silver wire layer is electrically connected to a peripheral circuit, and the shielding layer shields the peripheral circuit.

Preferably, the film sensor has a first film, a first nano metal conductive layer formed on the first film, a second film, and a second nano metal formed on the second film. The conductive layer, the first film and the second film are bonded to each other, and the first nano metal conductive layer and the second nano metal conductive layer face in opposite directions.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible electrode assembly is located on the first nano metal conductive layer, and the flexible electrode assembly and the first nano metal conductive layer are electrically connected to each other Insulating, the flexible electrode assembly is located between the first nano metal conductive layer and the bonding layer.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible electrode assembly and the second nano-metal conductive layer are respectively located on opposite surfaces of the second film and electrically insulated from each other.

Preferably, the thin film sensor further comprises a peripheral circuit electrically connected to the first nano metal conductive layer and the second nano metal conductive layer, the shielding layer shielding the peripheral circuit.

Preferably, the film sensor comprises a film and a transferable transparent conductive film attached to the film.

Preferably, the first release layer is disposed on the flexible touch sensing component, wherein the first release layer is located between the flexible touch sensing component and the bonding layer.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible electrode assembly is located between the first release layer and the flexible touch sensing component.

Preferably, the method further includes: a flexible electrode assembly, wherein the flexible electrode group The component is located on the flexible touch sensing component, or the flexible electrode component is located between the flexible touch sensing component and the bonding layer.

The touch sensor and the touch panel provided by the present invention form a flexible touch sensing component on the release layer by the support of the first substrate, and then can be transferred by the second substrate. The flexible touch sensing component is attached to any non-planar and curved cover plate, and the touch panel thus formed is lighter, thinner and less expensive to manufacture. In addition, the flexible touch sensing component uses a thin film sensor including a nano metal conductive layer. Since the nano silver wire itself has good flex resistance, the touch sensor and the touch provided by the present invention are provided. The panel can be used for flexible touch and curved touch. In addition, since the material of the bonding layer can be a reactive ink layer (Reactive ink), the removable touch panel can be directly attached to any non-planar surface without adding an optical adhesive layer or a water-repellent layer. On the target substrate, the touch panel can be made lighter and thinner with good optical characteristics such as high transmittance and low haze.

The touch sensor and the touch panel provided by the present invention have multiple layers (two layers, three layers or more) of the touch sensor and the touch panel provided by the present invention by providing a flexible electrode assembly. The electrode assembly is used to realize more sensing functions or electromagnetic shielding functions, so that the touch sensor and the touch panel provided by the present invention have a competitive advantage in lighter and thinner conditions.

10‧‧‧Touch sensor

100‧‧‧First substrate

110‧‧‧First release layer

120‧‧‧Flexible touch sensing components

121‧‧‧film

121‧‧‧First film

121’‧‧‧Second film

122‧‧‧Nano metal conductive layer

122‧‧‧First nano metal conductive layer

122a‧‧Nee silver layer

122b‧‧‧coating layer

123‧‧‧Second nano metal conductive layer

123a‧‧Nee silver layer

123b‧‧‧coating layer

124‧‧‧Flexible electrode assembly

130‧‧‧Protective layer

140‧‧‧Second release layer

150‧‧‧second substrate

160‧‧‧ joint layer

170‧‧‧hard coating

180‧‧‧Adhesive layer

20‧‧‧Touch panel

200‧‧‧First substrate

210‧‧‧First release layer

220‧‧‧Flexible touch sensing components

224‧‧‧Flexible electrode assembly

240‧‧‧Second release layer

250‧‧‧second substrate

260‧‧‧ joint layer

270‧‧‧Flexible cover

271‧‧‧film layer

272‧‧‧shading layer

30‧‧‧Touch panel

300‧‧‧First substrate

310‧‧‧First release layer

320‧‧‧Flexible touch sensing components

324‧‧‧Flexible electrode assembly

330‧‧‧Shielding layer

340‧‧‧Second release layer

350‧‧‧second substrate

360‧‧‧ joint layer

370‧‧‧Flexible cover

40‧‧‧ touch panel

400‧‧‧First substrate

410‧‧‧First release layer

420‧‧‧Flexible touch sensing components

424‧‧‧Flexible electrode assembly

430‧‧‧Flexible cover

431‧‧‧film layer

432‧‧‧shading layer

540‧‧‧Second release layer

550‧‧‧second substrate

1A-1D are flowcharts of a method for fabricating a touch sensor according to an embodiment of the present invention.

FIG. 1E is another schematic structural diagram of a touch sensor formed by the method for fabricating an embodiment of the present invention.

FIG. 1F is still another schematic structural diagram of a touch sensor formed by the method for fabricating an embodiment.

FIG. 1G is a schematic diagram of still another specific structure of the touch sensor formed by the method for fabricating an embodiment.

2A to 2F are diagrams showing the specific structure of a thin film sensor according to an embodiment of the present invention. intention.

3A-3F are flowcharts of a method for fabricating a touch panel according to still another embodiment of the present invention.

FIG. 3G is another schematic structural diagram of a touch panel according to an embodiment of the present invention.

FIG. 3H is another schematic structural diagram of a touch panel according to an embodiment of the present invention.

4A-4F are flowcharts of a method for fabricating a touch panel according to still another embodiment of the present invention.

FIG. 4G is another schematic structural diagram of a touch panel according to an embodiment of the present invention.

FIG. 4H is another schematic structural diagram of a touch panel according to an embodiment of the present invention.

5A-5F are flowcharts of a method for fabricating a touch panel according to still another embodiment of the present invention.

FIG. 5G is another schematic structural diagram of a touch panel according to an embodiment of the present invention.

The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

The disclosure of the present disclosure may use repeated component symbols in different embodiments and does not represent an association between different embodiments or drawings. Further, an embodiment in which one component is "on" or "under" another component may include embodiments in which the two components are in direct contact, or may include embodiments in which other additional components are interposed between the two components. The various components may be displayed at any different scale to make the drawings clear and concise. Please note that the “first”, “second” and the like of the content disclosed in this creation are only for convenience of explaining the production process, regardless of the quantity or the order of arrangement, such as “first release layer” or “second release layer”. It can be understood as a release layer. In addition, the term "release", "peeling", "peeling" and the like as used in the present invention can be understood as the bonding of two or more layers/substrates by using a viscous material/substance, and then Bonded film/substrate separation technology.

1A-1D are flowcharts of a method for fabricating a touch sensor according to an embodiment of the present invention. FIG. 1D is a schematic diagram of a specific structure of a touch sensor formed by the method for fabricating an embodiment.

Referring first to FIG. 1A, first, a first substrate 100 is provided and a first release type is formed. The layer 110 is on the first substrate 100. The first substrate 100 can serve as a mechanical support for the structure formed in the subsequent step, which can serve as a temporary platform for manufacturing the touch sensor 10 and can subsequently remove the touch sensor 10 from the first substrate 100. . The first substrate 100 can be a transparent or opaque insulating material such as a glass substrate or a flexible substrate. Since the first substrate 100 does not form part of the finally formed touch panel product, the first substrate 100 can be made of a relatively low cost material as long as it provides the necessary mechanical support. For example, the first substrate 100 may be made of plain glass instead of chemically strengthened glass to reduce the manufacturing cost of the touch panel, and may also be formed of a flexible material such as plastic or resin, such as polycarbonate (PC) or polymethyl methacrylate. (PMMA), polyester materials such as polyethylene terephthalate (PET), and polyether oxime (PES), polyimine (PI), cellulose ester, Benzocyclobutene (BCB) , polyvinyl chloride (PVC) and acrylic materials. In addition, after the first substrate 100 is removed from the touch sensor 10, the recycling can be repeated. Thus, the manufacturing cost can be further reduced. It is to be noted that the first substrate 100 is not limited to a flexible substrate such as glass, plastic or resin, and may be any other suitable material that can provide mechanical support. The first release layer 110 is a film layer composed of a material having a release ability. The release described herein and hereinafter refers to removing the first substrate 100 from other layers (eg, the first release layer 110) to which it is originally attached, or the first substrate 100 and the first substrate 100 The release layer 110 is removed together from other layers that were originally bonded to the first release layer 110. The material of the first release layer 110 may be an organic material such as polyimine (PI), polypropylene (PP), polystyrene (PS), acrylonitrile butadiene styrene (ABS), poly pair Ethylene phthalate (PET), polyvinyl chloride (PVC), polycarbonate (PC), polyethylene (PE), polymethyl methacrylate (PMMA), polytetrafluoroethylene (PTFE), cyclic olefin Copolymer (COP, Arton) or a combination of the foregoing. The first release layer 110 may be formed on the first substrate 100 by a solution coating reheat baking method, or may be a vapor deposition method, a roll-to-roll (RTR) method, or other suitable method. The dry film of the first release layer 110 is formed or directly pressed onto the first substrate 100. In one implementation, the first release layer 110 can be adhered to the first layer by a removable adhesive. On a substrate 100. The removable adhesive may comprise a water insoluble glue or any other suitable material that is capable of temporarily adhering the two layers together and then being dissolved or otherwise removed. The first substrate 100 can be completely removed or partially removed from the first release layer 110 by dissolving the removable adhesive. Preferably, the first release layer 110 may also be a film layer composed of a material having a release property of the upper layer and a material having no release property of the lower layer. Here, the upper layer of the first release layer 110 refers to a surface away from the first substrate 100, and the lower layer of the first release layer 110 refers to a surface close to the first substrate 100. Therefore, when the first release layer 110 is a material having a release property of the upper layer and a material having no release property of the lower layer, the first substrate 100 and the first release layer 110 may be removed from the first release layer 110 together with the first release layer 110. Removed from other layers that were originally attached together. If the first substrate 100 and the first release layer 110 are simultaneously removed, the touch sensor 10 can be made lighter and thinner while having good optical characteristics, such as high transmittance and low haze.

Next, the flexible touch sensing component 120 is formed on the first release layer 110 , and the first release layer 110 is located between the first substrate 100 and the flexible touch sensing component 120 . . The flexible touch sensing component 120 is a film sensor that can include a film and a transferable transparent conductive film attached to the film. A film sensor is flexible or deformable, that is, a film sensor can be dynamically or permanently formed into a curved shape.

Then, a second substrate 150 is formed on the flexible touch sensing component 120, and a second distance between the flexible touch sensing component 120 and the second substrate 150 is formed. Type layer 140. The material of the second release layer 140 and the first release layer 110 is a film layer composed of a material having a release ability, but the chemical components of the two may be the same or different. The material of the second substrate 150 and the first substrate 100 may be the same or different, and the second substrate 150 may pass the second substrate 150 from the other layer to which the original substrate 150 is attached by the second release layer 140 (for example, the first release type) The layer 110) is removed, or the second substrate 150 is removed from the second release layer 140 together with other layers that were originally bonded to the second release layer 140. In this embodiment, the second substrate 150 As the carrier, the second substrate 150 can be referred to as a carrier substrate, and a film material having a better supporting strength can be selected for the material selection, and thus can also be referred to as a carrier film.

Next, referring to FIG. 1D, the first substrate 100 is removed by the first release layer 110. Removing the first substrate 100 in preparation for transferring the touch sensor 10 to any non-planar target substrate, which may be a flexible cover or a curved cover, the curved cover may be rigid, Semi-rigid, flexible or deformable. The rigid curved substrate can be permanently formed into a curved surface. The semi-rigid, flexible, and deformable curved substrate can be dynamically formed into a curved surface and not formed into a curved surface. The first substrate 100 may be removed by chemical etching using a chemical such as hydrogen fluoride. Alternatively, the first substrate 100 may be removed by mechanical means or a combination of chemical-mechanical methods. Preferably, the first substrate 100 and the first release layer 110 can be removed at the same time, which can make the touch sensor 10 more light and thin while having good optical characteristics, such as high transmittance and low haze. In the step of removing or stripping the first substrate 100 by using the first release layer 110 , the first release layer 110 may remain on the flexible touch sensing component 120 .

FIG. 1E is another schematic structural diagram of the touch sensor 10 formed by the method for fabricating an embodiment of the present invention. In an embodiment, the touch sensor 10 further includes a flexible electrode assembly 124. The flexible electrode assembly 124 can be disposed on the flexible touch sensing component 120. Between the first release layer 110 and the first release layer 110. When the first substrate 100 is removed by the first release layer 110, the flexible electrode assembly 124 is exposed to the outside (or the first release layer 110 remains on the flexible electrode assembly 124), and the creation can be performed. The touch sensor 10 of an embodiment is transferred to a non-planar target substrate in preparation. Alternatively, the flexible electrode assembly 124 can also be disposed between the flexible touch sensing component 120 and the second release layer 140 (not shown). It can be understood that the flexible electrode assembly 124 and the flexible touch sensing component 120 are electrically insulated from each other, and a detailed description of the flexible electrode assembly 124 will be described later.

FIG. 1F is another schematic structural diagram of the touch sensor 10 formed by the method for fabricating an embodiment. In an embodiment, please refer to FIG. 1C, the touch sense The bonding layer 160 further includes a bonding layer 160 disposed between the flexible touch sensing component 120 and the first release layer 110. When the first substrate 100 and the first release layer 110 are simultaneously removed, the bonding layer 160 is exposed, and since the bonding layer 160 has adhesiveness, the touch sensor 10 can be directly removed. Attach to any non-planar target substrate. The material of the bonding layer 160 may be a reactive ink layer (Reactive ink). Since removing the first release layer 110 from the active ink layer does not affect the viscosity of the active ink layer, there is no need to add An optical adhesive layer or a water-repellent layer can directly attach the released touch sensor 10 to any non-planar or planar target substrate. In an embodiment, as described above, the first release layer 110 may be partially removed and partially retained; and the remaining first release layer 110 may be used in combination with the bonding layer 160 to provide a sense of touch after being released. The detector 10 is attached to the target substrate. The target substrate can be a flexible cover or a curved cover that can be rigid, semi-rigid, flexible or deformable. The rigid curved substrate can be permanently formed into a curved surface. The semi-rigid, flexible, and deformable curved substrate can be dynamically formed into a curved surface and not formed into a curved surface. The flexible electrode assembly 124 can also be incorporated into this embodiment as previously described, with particular reference to the foregoing.

FIG. 1G is another schematic structural diagram of the touch sensor 10 formed by the method for fabricating an embodiment. In an embodiment, please refer to FIG. 1C , the touch sensor 10 further includes a bonding layer 160 and a flexible electrode assembly 124 , wherein the bonding layer 160 and the flexible electrode assembly 124 can be disposed on the flexible Between the touch sensing component 120 and the first release layer 110, the flexible electrode assembly 124 can be disposed between the flexible touch sensing component 120 and the bonding layer 160, and the bonding layer 160 is disposed on the bonding layer 160. Between the flexible electrode assembly 124 and the first release layer 110, the flexible electrode assembly 124 and the flexible touch sensing component 120 are electrically insulated from each other. When the first substrate 100 is removed by the first release layer 110, the bonding layer 160 is exposed, and the touch sensor 10 of the present embodiment can be transferred to any non-planar or planar surface by using the above description. Target substrate. In an embodiment, as before, the first release layer 110 may be partially removed and partially retained; and the remaining first release layer 110 may be shared with the bonding layer 160. The same is used in combination to attach the released touch sensor 10 to the target substrate. Alternatively, the bonding layer 160 is disposed between the flexible touch sensing component 120 and the first release layer 110, and the flexible electrode assembly 124 is disposed on the flexible touch sensing component 120 and the first Between the two release layers 140 (not shown).

The touch sensor 10 as shown in FIGS. 1D to 1G is finally formed through the above steps. As shown in FIG. 1D, after the touch sensor 10 is assembled as a touch display, the touch sensor 10 includes a flexible touch stacked from top to bottom after being touched and observed by the user. The sensing component 120 and the second release layer 140 (please note that the "second" here is merely for convenience of explaining the above manufacturing process, and is independent of the number or arrangement order, so it can be abbreviated and understood as a release layer) and the second Substrate 150 (ie, carrier substrate). As shown in FIG. 1E , the touch sensor 10 includes a flexible electrode assembly stacked from top to bottom after the touch sensor 10 is assembled as a touch display and the user touches and observes. 124. The flexible touch sensing component 120, the second release layer 140 (the same as above, may be referred to as a release layer) and the second substrate 150 (ie, the carrier substrate). As shown in FIG. 1F , after the touch sensor 10 is assembled as a touch display on the top of the figure, the touch sensor 10 includes a bonding layer 160 stacked from top to bottom after being touched and observed by the user. The flexible touch sensing component 120, the second release layer 140 (ie, the release layer) and the second substrate 150 (ie, the carrier substrate). As shown in FIG. 1G , the touch sensor 10 includes a bonding layer 160 stacked from top to bottom after the touch sensor 10 is assembled as a touch display. The flexible electrode assembly 124, the flexible touch sensing component 120, the second release layer 140 (ie, the release layer), and the second substrate 150 (ie, the carrier substrate). The detailed structure, material, and manufacturing method of each of the above components have been described above, and thus will not be described herein. The touch sensor 10 can be applied to a touch display device such as a computer system, a mobile phone, a digital media player, a tablet computer, an ultra-thin notebook, a wearable touch device, and a car touch system. The touch sensor 10 shown in FIG. 1D to FIG. 1G further includes a residual release layer disposed on the flexible touch sensing component 120 (ie, the first release layer 110 is removed as described above). The first release layer 110) remaining in the step of the first substrate 100, the residual release layer can be used in the process transfer The flexible touch sensing component 120 is protected during the shifting process.

Please refer to FIG. 2A. FIG. 2A is a schematic diagram of a specific structure of a thin film sensor according to an embodiment of the present invention. In one embodiment, the thin film sensor has a thin film 121 and a nano metal conductive layer 122 formed on the thin film 121. The nano metal conductive layer 122 includes a nano silver wire layer 122a and an overcoat layer (OC) 122b. The coating layer (OC) 122b can improve the durability of the nano silver wire layer 122a. The film sensor can be formed by depositing a distribution in a fluid or solvent on the film 121 by, for example, strip coating, web coating, printing, lamination or roll to roll (RTR). The nanowire metal wire forms a nanowire network layer on the substrate (such as the film 121) by drying the fluid, and then patterning the nanowire network layer to form the nanometal conductive layer 122. . Alternatively, the film 121 may be surface pretreated to better receive subsequently deposited nanowires. Surface pretreatment of film 121 can provide multiple functions. For example, it enables uniform deposition of the nanowires to be better attached to the film 121. The coating layer (OC) may be formed from an optically transparent polymeric matrix material including, but not limited to, such as polymethacrylates (eg, polymethyl methacrylate), polyacrylates, and polyacrylonitriles. Polyacrylate, polyvinyl alcohol, polyester (for example, polyethylene terephthalate (PET), polyphthalate and polycarbonate), such as phenolic plastic or cresol-formaldehyde, highly aromatic Polymer, polystyrene, polyvinyltoluene, polyvinyl xylene, polyimine, polyamine, polyamido-imine, polyetherimide, polysulfide, polyfluorene, Polyphenylene, polyphenylene ether, polyurethane (PU), epoxy, polyolefin (such as polypropylene, polymethylpentene and cyclic olefin), acrylonitrile-butadiene-styrene copolymer (ABS), fiber , anthrone and other ruthenium containing polymers (such as polysesquioxanes and polydecane), polyvinyl chloride (PVC), polyacetate, polynorbornene, synthetic rubber (eg EPR, SBR, EPDM) ), fluoropolymers (such as polyvinylidene fluoride, polytetrafluoroethylene (TFE) or polyhexafluoropropylene), fluoroolefins and hydrocarbon olefins (for example) Copolymers as well as amorphous fluorocarbon polymers or copolymers.

In an embodiment, the nano metal conductive layer 122 further includes a passivation layer, a hard coat layer (HC) or a protective layer. A coating such as Primer 130, that is, a hard coat layer, a passivation layer or a protective layer (Primer) 130 is located between the nano metal conductive layer 122 and the first release layer 110. The nano metal conductive layer 122 may also be formed directly on the passivation or protective layer (Primer) 130. The passivation or protective layer 130 is generally flexible, including but not limited to: polyester, polyethylene terephthalate (PET), polybutylene terephthalate, polymethyl Methyl acrylate (PMMA), acrylic resin, polycarbonate (PC), polystyrene, triacetate cellulose (TAC), polyvinyl alcohol, polyvinyl chloride, polyvinylidene chloride, polyethylene, Ethylene-vinyl acetate copolymer, polyvinyl butyral, metal ion-crosslinked ethylene-methacrylic acid copolymer, polyurethane, cellophane, polyolefin, etc.; particularly preferred is PET, PC, PMMA or TAC having higher strength.

Please refer to FIG. 2B. FIG. 2B is another schematic structural diagram of a thin film sensor according to an embodiment of the present invention. In one embodiment, the thin film sensor has a thin film 121 and a first nano metal conductive layer 122 and a second nano metal conductive layer 123 respectively formed on opposite surfaces of the thin film 121. The first nano metal conductive layer 122 comprises a composite structure of a nano silver wire layer 122a or a nano silver wire layer 122a and a coating layer (OC) 122b, and the second nano metal conductive layer 123 comprises a The composite structure of the rice silver wire layer 123a or the nano silver wire layer 123a and a coating layer (OC) 123b, the coating layer (OC) 122b and the coating layer (OC) 123b can improve the nano silver wire layer 122a and the nai Durability of the silver wire layer 123a. The nano silver wire layer 122a and the nano silver wire layer 123a can be electrically connected to a peripheral circuit (not shown) for connecting the thin film sensor to an external circuit through a flexible circuit board (FPC). The nano silver wire layer 122a and the nano silver wire layer 123a are electrically insulated from each other, and can be respectively used for receiving a control signal of an external circuit and transmitting a sensing signal back to an external circuit to provide a function of touch sensing. The film sensor may be formed by depositing a plurality of nanowires distributed in a solvent on the upper surface of the film 121 by, for example, a strip coating, a web coating, a printing, a lamination or a roll-to-roll process. The solvent is dried/evaporated to form a nanowire network layer on the substrate, and the nanowire network layer is patterned to form the first nanometal conductive layer 122. then Depositing a plurality of nanowires distributed in the fluid on the lower surface of the film 121, drying the solvent to form a nanowire network layer on the substrate, and patterning the nanowire network layer to form a first Two nanometer metal conductive layer 123. Alternatively, the film 121 may be surface pretreated to better receive subsequently deposited nanowires. Surface pretreatment of film 121 can provide multiple functions. For example, it enables uniform deposition of the nanowires to be better attached to the film 121. The coating layer (OC) may be formed from an optically clear polymeric matrix material including, but not limited to, polyacrylic acid such as polymethacrylate (eg, polymethyl methacrylate), polyacrylate, and polyacrylonitrile. Highly aromatic polymerization of polyvinyl alcohols, polyesters (for example, polyethylene terephthalate (PET), polyphthalic acid esters and polycarbonates), such as phenolic plastics or cresol-formaldehyde , polystyrene, polyvinyl toluene, polyvinyl xylene, polyimide, polyamine, polyamine-imide, polyether phthalimide, polysulfide, polyfluorene, polyphenylene Base, polyphenylene ether, polyurethane (PU), epoxy, polyolefin (such as polypropylene, polymethylpentene and cyclic olefin), acrylonitrile-butadiene-styrene copolymer (ABS), cellulose, hydrazine Ketones and other ruthenium containing polymers (such as polysesquioxanes and polydecane), polyvinyl chloride (PVC), polyacetates, polynorbornenes, synthetic rubbers (eg EPR, SBR, EPDM), including a total of fluoropolymers such as polyvinylidene fluoride, polytetrafluoroethylene (TFE) or polyhexafluoropropylene, fluoroolefins and hydrocarbon olefins (for example) Polymers or copolymers thereof and fluorine amorphous carbon.

In one embodiment, the first nano-metal conductive layer 122 includes a hard coat (HC) 170, and the second nano-metal conductive layer 123 further includes a passivation or protective layer (Primer). ) 130. Hardcoat (HC) refers to a coating that provides additional surface protection against scratches and abrasion, including but not limited to: polyacrylates, epoxies, polyurethanes, polydecanes, fluorenones, ytterbium-containing copolyacrylate resins. And other synthetic polymers. Preferably, the hard coat layer (HC) also includes colloidal vermiculite. The hard coat layer (HC) has a thickness of about 1 to 50 μm. The passivation is generally flexible, including but not limited to: polyester, polyethylene terephthalate (PET), polybutylene terephthalate, polymethyl methacrylate (PMMA). , acrylic resin, polycarbonate (PC), Polystyrene, cellulose triacetate (TAC), polyvinyl alcohol, polyvinyl chloride, polyvinylidene chloride, polyethylene, ethylene-vinyl acetate copolymer, polyvinyl butyral, metal ion-crosslinked ethylene-A Acrylic acid copolymer, polyurethane, cellophane, polyolefin, etc.; particularly preferred is PET, PC, PMMA or TAC having higher strength. In an embodiment, the first nano metal conductive layer 122 or the second nano metal conductive layer 123 may further include a protective layer 130, that is, the passivation and the hard coat layer ( The HC) 170 may be replaced by a protective layer 130 or used in combination to protect the surface of the first nano-metal conductive layer 122 or the second nano-metal conductive layer 123 from being oxidized by air to protect it. No scratches and abrasions.

In an embodiment, please refer to FIG. 2C. FIG. 2C is another schematic structural diagram of a thin film sensor according to an embodiment of the present invention. The film sensor has a first film 121, a first nano metal conductive layer 122 and a second film 121' formed on the first film 121, and a second nano metal formed on the second film 121'. Conductive layer 123. The first film 121 and the second film 121 ′ are bonded to each other, and the first nano metal conductive layer 122 faces the second nano metal conductive layer 123 in opposite directions, for example, the first film 121 and the second film. 121' is adhered to each other such that the first nano metal conductive layer 122 and the second nano metal conductive layer 123 face different directions, respectively, or the first nano metal conductive layer 122 and the second nano metal conductive layer 123 are attached to each other. The first film 121 and the second film 121 ′ are sandwiched between the first nano metal conductive layer 122 and the second nano metal conductive layer 123 . Or the first nano metal conductive layer 122 and the second nano metal conductive layer 123 are faced in the same direction, for example, the first nano metal conductive layer 122 and the second nano metal conductive layer 123 are facing each other. The direction of the person is fitted. Alternatively, the first nano metal conductive layer 122 and the second nano metal conductive layer 123 may be bonded in the same direction, for example, the first nano metal conductive layer 122 and the second nano metal conductive layer 123 are backed. Fit the user's direction. For example, the first nano metal conductive layer 122 is formed on the first surface (the upper surface) of the first film 121, and the second nano metal conductive layer 123 is formed on the first surface of the second film 121' (as above Surface), and bonding the second nano metal conductive layer 123 to A second surface (the following surface) of the first film 121 is formed to constitute the film sensor. The film sensor may be formed by depositing a plurality of nanowires distributed in a solvent on the first film 121 by, for example, a strip coating, a web coating, a printing, a lamination or a roll-to-roll process. The solvent is dried to form a nanowire network layer on the substrate, and the nanowire network layer is patterned to form the first nanometal conductive layer 122. Then, a plurality of nanowires distributed in a solvent are deposited on the second film 121', the solvent is dried to form a nanowire network layer on the substrate, and the nanowire network layer is patterned. The second nano metal conductive layer 123. The first film 121 is then bonded to the second film 121' by an adhesive layer 180. The adhesive layer 180 may be a transparent optical adhesive or a water gel. Alternatively, the first film 121 and the second film 121' may be surface-pretreated to better receive the subsequently deposited nanowire. The surface pretreatment of the first film 121 and the second film 121' can provide a plurality of functions. For example, it enables uniform deposition of the nanowires to be better fixed to the first film 121 and the second film 121'. The thin film sensor further includes a peripheral line (not shown) electrically connected to the first nano metal conductive layer 122 and the second nano metal conductive layer 123. The peripheral circuit can be connected to an external circuit through a flexible circuit board (FPC) to realize connection of the thin film sensor to an external circuit.

In one embodiment, the first nano metal conductive layer 122 includes a hard coat layer (HC) 170, and the second nano metal conductive layer 123 further includes a passivation or protective layer (Primer) 130. . Hardcoat (HC) refers to a coating that provides additional surface protection against scratches and abrasion, including but not limited to: polyacrylates, epoxies, polyurethanes, polydecanes, fluorenones, ytterbium-containing copolyacrylate resins. And other synthetic polymers. Preferably, the hard coat layer (HC) also includes colloidal vermiculite. The hard coat layer (HC) has a thickness of about 1 to 50 μm. The passivation is generally flexible, including but not limited to: polyester, polyethylene terephthalate (PET), polybutylene terephthalate, polymethyl methacrylate (PMMA). , acrylic resin, polycarbonate (PC), polystyrene, cellulose triacetate (TAC), polyvinyl alcohol, polyvinyl chloride, polyvinylidene chloride Ethylene, polyethylene, ethylene-vinyl acetate copolymer, polyvinyl butyral, metal ion-crosslinked ethylene-methacrylic acid copolymer, polyurethane, cellophane, polyolefin, etc.; particularly preferably high strength PET, PC , PMMA or TAC. In an embodiment, the first nano metal conductive layer 122 or the second nano metal conductive layer 123 may further include a protective layer (Primer), that is, a passivation layer or a protective layer (Primer). 130 and the hard coat layer (HC) 170 may be used alternatively or in combination to protect the surface of the first nano metal conductive layer 122 or the second nano metal conductive layer 123 from being oxidized by air, or Protect it from scratches and abrasions.

The touch sensor of the embodiment of the present invention further includes a flexible electrode assembly 124. The flexible electrode assembly 124 can be located on the flexible touch sensing component 120, or the flexible electrode assembly 124 The flexible touch sensing component 120 and the second release layer 140 can be located. The specific content of the touch sensor will be described in detail below.

Please refer to FIG. 2D. FIG. 2D is a schematic structural diagram of a thin film sensor according to an embodiment of the present invention. The difference from FIG. 2A is that a flexible electrode assembly 124 is further included. 1E, in an embodiment, the flexible electrode assembly 124 can be disposed on the flexible touch sensing component 120. Specifically, the flexible electrode assembly 124 is formed on the nano metal conductive layer 122 of the flexible touch sensing component 120. Preferably, the flexible electrode assembly 124 and the flexible touch sensing component 120 are The nano metal conductive layers 122 are electrically insulated from each other. For example, between the flexible electrode assembly 124 and the nano metal conductive layer 122 of the flexible touch sensing component 120, the coating layer (OC) 122b can be used to make two Electrically insulating, in particular, the thickness of the coating layer (OC) 122b can be increased, and the nano-silver layer 122a of the nano-metal conductive layer 122 is embedded in the lower portion of the coating layer (OC) 122b. And extending the nano silver wire in a planar direction (ie, perpendicular to the thickness direction), so that the nano metal conductive layer 122 has a planar (ie, perpendicular to the thickness direction) conductivity, and the upper portion of the coating layer (OC) 122b is helpless. The distribution of the silver silver does not cause the conductivity in the thickness direction, so the nano silver wire layer 122a of the flexible touch sensing component 120 does not overlap with the flexible electrode assembly 124 disposed on the nano metal conductive layer 122. Forming a conductive circuit; or flexible electrode assembly 124 and flexible touch sensing The protective layer 130 may be electrically insulated between the nano metal conductive layers 122 of the component 120, and the protective layer 130 may be replaced or used in combination with a hard coat layer (HC) or a passivation or other insulating layer. Specifically, for example, the flexible electrode assembly 124 is formed on the flexible touch sensing component 120, and the thin film 121 of the flexible touch sensing component 120 is electrically conductive with the nano metal of the flexible electrode assembly 124. The layer 122 and the nano metal conductive layer 122 of the flexible touch sensing component 120 are electrically insulated from each other. In addition, the above-mentioned coating layer (OC) 122b, protective layer 130 (or passivation, hard coat layer (HC) 170) or other insulating layer may also be combined with the above-mentioned coating layer (OC) 122b or used alone. In order to achieve electrical insulation between the flexible electrode assembly 124 and the flexible touch sensing component 120.

The flexible electrode assembly 124 is flexible or deformable, that is, the flexible electrode assembly 124 can be dynamically or permanently formed into a curved shape. For details of the flexible electrode assembly 124, reference may be made to the flexible touch sensing component 120. In other words, the flexible electrode assembly 124 may also have a film 121 and a nano metal conductive layer 122 formed on the film 121. The nano metal conductive layer 122 includes a nano silver wire layer 122a and a coating layer (OC) 122b. Preferably, the nano metal conductive layer 122 further includes a passivation, a primer 130 or a hard coat layer (HC). However, the nano-metal conductive layer 122 of the flexible electrode assembly 124 can be unpatterned (for example, an etching step), so that the nano-metal conductive layer 122 of the flexible electrode assembly 124 can be completely coated in a whole layer to make it flexible. The electrode assembly 124 acts as an electrode layer for shielding the electrical signal to protect against electromagnetic interference (EMI), thereby improving the anti-noise effect. Alternatively, the nano-metal conductive layer 122 of the flexible electrode assembly 124 may also have a sensing function, such as sensing a change in capacitance, sensing a pressure, a concave-convex surface of a sensing object, and the like, by patterning (eg, an etching step). In addition, in an embodiment, the flexible electrode assembly 124 can be fabricated by referring to the method for forming a thin film sensor, and the thin film 121 is formed on the protective layer 130 to form a nano silver wire layer 122a and a coating layer. (OC) 122b to constitute the flexible electrode assembly 124. Alternatively, the nano silver wire layer 122a and the coating layer (OC) 122b are formed directly on the protective layer 130 by referring to the above method to constitute the flexible electrode assembly 124. Alternatively, the film 121, the nano silver wire layer 122a and the coating layer (OC) 122b are sequentially formed on the coating layer (OC) 122b of the flexible touch sensing component 120 by referring to the above method to form flexibility. Electrode assembly 124. Alternatively, the nano silver wire layer 122a and the coating layer (OC) 122b are sequentially formed on the coating layer (OC) 122b of the flexible touch sensing component 120 by referring to the above method to form the flexible electrode assembly 124. .

The flexible electrode assembly 124 can also be a thin film electrode assembly that can include a film and a transferable transparent conductive film attached to the film. In one embodiment, a film may be formed on the protective layer 130, and a transparent conductive film may be transferred onto the film. Alternatively, a transferable transparent conductive film may be attached directly to the protective layer 130 to constitute the flexible electrode assembly 124.

Alternatively, the flexible electrode assembly 124 can also be disposed between the flexible touch sensing component 120 and the second release layer 140. For example, the flexible electrode assembly 124 is formed on the film 121 of the flexible touch sensing assembly 120, specifically. The first surface (eg, the upper surface) of the film 121 of the flexible touch sensing component 120 is formed with the nano metal conductive layer 122 of the flexible touch sensing component 120, and the flexible touch sensing component 120 The second surface (for example, the lower surface) of the film 121 is formed with a flexible electrode assembly 124 between the film 121 of the flexible touch sensing component 120 and the second release layer 140. . In one embodiment, the flexible electrode assembly 124 can be fabricated by referring to the method for forming a thin film sensor, and the thin film 121 is formed on the lower surface of the thin film 121 of the flexible touch sensing assembly 120. The nano silver wire layer 122a and the coating layer (OC) 122b constitute the flexible electrode assembly 124. Alternatively, the nano silver wire layer 122a and the coating layer (OC) 122b are formed directly on the lower surface of the film 121 of the flexible touch sensing component 120 by referring to the above method to constitute the flexible electrode assembly 124.

Please refer to FIG. 2E. FIG. 2E is a schematic structural diagram of a thin film sensor according to an embodiment of the present invention. The difference from FIG. 2B is that a flexible electrode assembly 124 is further included. 1E, in an embodiment, the flexible electrode assembly 124 can be disposed on the flexible touch sensing component 120. Specifically, the flexible electrode assembly 124 Formed on the first nano metal conductive layer 122, the hard electrode layer (HC) 170 can be electrically insulated between the flexible electrode assembly 124 and the first nano metal conductive layer 122, and the hard coat layer ( The HC) 170 may be replaced or used in combination with a barrier layer or a protective layer 130 or other insulating layer.

Alternatively, the flexible electrode assembly 124 can also be disposed between the flexible touch sensing component 120 and the second release layer 140. For example, the flexible electrode assembly 124 is formed between the second nano metal conductive layer 123 and the second release layer 140, preferably between the flexible electrode assembly 124 and the second nano metal conductive layer 123. The protective layer 130 may be used to electrically insulate the two, and the protective layer 130 may be replaced by a hard coat layer (HC) or a barrier layer or other insulating layer or used in combination. The embodiment of FIG. 2E can refer to the above method, and details are not described herein.

Please refer to FIG. 2F. FIG. 2F is a schematic structural diagram of a thin film sensor according to an embodiment of the present invention. The difference from FIG. 2C is that a flexible electrode assembly 124 is further included. 1E, in an embodiment, the flexible electrode assembly 124 can be disposed on the flexible touch sensing component 120. Specifically, the flexible electrode assembly 124 is formed on the first nano metal conductive layer 122 on the first film 121 and electrically insulated from each other, for example, the flexible electrode assembly 124 and the first nano metal conductive layer 122 The hard coat layer (HC) 170 may be electrically insulated between the two, and the hard coat layer (HC) 170 may be replaced by a barrier layer or a protective layer or other insulating layer or used in combination.

Alternatively, the flexible electrode assembly 124 can also be disposed between the flexible touch sensing component 120 and the second release layer 140. For example, the flexible electrode assembly 124 is formed on the upper surface of the second film 121' (ie, forms the opposite surface of the second nano-metal conductive layer 123), in other words, the flexible electrode assembly 124 is electrically conductive with the second nano-metal The layers 123 are respectively located on opposite surfaces of the second film 121'; or the flexible electrode assembly 124 may be formed on the second nano metal conductive layer 123. Preferably, the protective electrode layer (Primer) 130 can be electrically insulated between the flexible electrode assembly 124 and the second nano metal conductive layer 123, and the protective layer (Primer) 130 can be hard coated (HC). Or a barrier layer or other insulating layer is used instead or in combination. Example of Figure 2F Please refer to the above practices, and I will not repeat them here.

In an embodiment, referring to FIG. 3G, the touch sensor further includes a bonding layer 260. The flexible electrode assembly 224 can be disposed on the flexible touch sensing component 220 and the bonding layer 260. In other words, the bonding layer 260 and the flexible electrode assembly 224 can be reasonably combined and arranged in the touch sensor of the present invention. For details, refer to the following description.

3A-3F are flowcharts of a method for fabricating a touch panel according to another embodiment of the present invention. FIG. 3F is a schematic diagram of a specific structure of the touch panel formed by the method for fabricating another embodiment of the present invention.

Referring first to FIG. 3A, first, a first substrate 200 is provided, and a first release layer 210 is formed on the first substrate 200. The first substrate 200 can serve as a mechanical support for the structure formed in the subsequent steps, which can serve as a temporary platform for manufacturing the touch panel 20 and can subsequently remove the touch panel 20 from the first substrate 200. The first substrate 200 can be a transparent or opaque insulating material such as a glass substrate or a flexible substrate. Since the first substrate 200 does not form part of the final formed touch panel 20 product, the first substrate 200 can be made of a relatively low cost material as long as it provides the necessary mechanical support. For example, the first substrate 200 may be made of plain glass instead of chemically strengthened glass to reduce the manufacturing cost of the touch panel 20. It may also be formed of a flexible material such as plastic or resin, such as polycarbonate (PC) or polymethyl methacrylate. Polyester materials such as ester (PMMA) and polyethylene terephthalate (PET), and polyether oxime (PES), polyimine (PI), cellulose ester, benzocyclobutene (BCB), Materials such as polyvinyl chloride (PVC) and acrylic resin. In addition, after the first substrate 200 is removed from the touch panel 20, the recycling can be repeated. Thus, the manufacturing cost can be further reduced. It is to be noted that the first substrate 200 is not limited to a flexible substrate such as glass, plastic or resin, and may be any other suitable material that can provide mechanical support. The first release layer 210 is a film layer composed of a material having a release ability. The release described herein and hereinafter refers to removing the first substrate 200 from other layers (eg, the first release layer 210) to which it is originally attached, or the first substrate 200 and the first substrate 200 Release The layers 210 are removed together from other layers that were originally bonded to the first release layer 210. The material of the first release layer 210 may be an organic material such as polyimine (PI), polypropylene (PP), polystyrene (PS), acrylonitrile butadiene styrene (ABS), poly pair Ethylene phthalate (PET), polyvinyl chloride (PVC), polycarbonate (PC), polyethylene (PE), polymethyl methacrylate (PMMA), polytetrafluoroethylene (PTFE), cyclic olefin Copolymer (COP, Arton) or a combination of the foregoing. The first release layer 210 may be formed on the first substrate 200 by a solution coating reheat baking method, or may be formed by a vapor deposition method, a roll-to-roll process or other suitable methods or directly adopting the first release layer. The 210 dry film is pressed onto the first substrate 200. In one implementation, the first release layer 210 can be adhered to the first substrate 200 by a removable adhesive. The removable adhesive may comprise a water insoluble glue or any other suitable material that is capable of temporarily adhering the two layers together and then being dissolved or otherwise removed. The first substrate 200 can be completely removed or partially removed from the first release layer 210 by dissolving the removable adhesive. Preferably, the first release layer 210 may also be a film layer composed of a material having a release property of the upper layer and a material having no release property of the lower layer. Here, the upper layer of the first release layer 210 refers to a surface away from the first substrate 200, and the lower layer of the first release layer 210 refers to a surface close to the first substrate 200. Therefore, when the first release layer 210 is a material having a release property of the upper layer and a material having no release property of the lower layer, the first substrate 200 and the first release layer 210 may be removed from the first release layer 210 together with the first release layer 210. Removed from other layers that were originally attached together. If the first substrate 200 and the first release layer 210 are simultaneously removed, the touch panel 20 can be made lighter and thinner while having good optical characteristics, such as high transmittance and low haze.

Then, the flexible touch sensing component 220 is formed on the first release layer 210 , and the first release layer 210 is located between the first substrate 200 and the flexible touch sensing component 220 . That is, the flexible touch sensing component 220 is removably attached to the first substrate 200 by the first release layer 210, and vice versa. The flexible touch sensing component 220 is a film sensor, which may include a film and a transferable transparent conductive film attached to the film. Thin film sensor A film sensor is flexible or deformable, that is, a film sensor can be dynamically or permanently formed into a curved shape. The thin film sensor in this embodiment may also have the same structure as the thin film sensor described in the foregoing embodiment, that is, the thin film sensor disclosed in the foregoing embodiment may be used in the embodiment, and thus is no longer used. Repeat them.

Then, a second substrate 250 is formed on the flexible touch sensing component 220, and a second distance between the flexible touch sensing component 220 and the second substrate 250 is formed. The layer 240; that is, the second substrate 250 is removably attached to the flexible touch sensing component 220 by the second release layer 240, and vice versa. The material of the second release layer 240 and the first release layer 210 is a film layer composed of a material having a release ability, but the chemical components of the two may be the same or different. The material of the second substrate 250 and the first substrate 200 may be the same or different, and the second substrate 250 may be used to bond the second substrate 250 to another layer (for example, the first release type) by the second release layer 240. The layer 240) is removed/stripped, or the second substrate 250 is removed/stripped together with the second release layer 240 from other layers that were originally bonded to the second release layer 240.

Next, referring to FIG. 3D, the first substrate 200 is removed/stripped by the first release layer 210. Removing the first substrate 200 in preparation for transferring the touch panel 20 to any non-planar target substrate, the target substrate may be a hard cover/flexible cover or a curved cover, and the curved cover may be Rigid, semi-rigid, flexible or deformable. The rigid curved substrate can be permanently formed into a curved surface. The semi-rigid, flexible, and deformable curved substrate can be dynamically formed into a curved surface and not formed into a curved surface. The first substrate 200 may be removed by chemical etching using a chemical such as hydrogen fluoride. Alternatively, the first substrate 200 may be removed by mechanical means or a combination of chemical-mechanical methods. Preferably, the first substrate 200 and the first release layer 210 can be removed at the same time, which can make the touch panel 20 more light and thin while having good optical characteristics, such as high transmittance and low haze.

Next, referring to FIG. 3E, a bonding layer 260 is attached to have a decorative function. The flexible cover 270 is disposed on the flexible touch sensing component 220. For example, the flexible cover 270 has a decorative portion to provide the decorative function, and the bonding layer 260 is located on the flexible cover 270. Between the flexible touch sensing component 220 and the flexible touch sensing component 220. After the flexible cover 270 is used as the target substrate, the first substrate 200 is removed, and the touch panel 20 is transferred to the flexible cover 270 as a target substrate. The bonding between the flexible cover 270 and the flexible touch sensing component 220 may be performed by attaching the bonding layer 260 to the flexible cover 270 having the decorative portion. The flexible cover 270 with the bonding layer 260 is attached to the flexible touch sensing component 220. The bonding layer 260 may be made of a reactive ink layer (Reactive ink). It is a common optical adhesive layer or a water-based adhesive layer. The bonding between the flexible cover 270 and the flexible touch sensing component 220 may also form the bonding layer 260 on the flexible touch sensing component 220 and the first release layer 210. between. When the first substrate 200 and the first release layer 210 are simultaneously removed, the bonding layer 260 is exposed. Since the bonding layer 260 has adhesiveness, the touch panel 20 can be directly attached to the touch panel 20 after being released. The decorative cover is provided on the flexible cover 270. The material of the bonding layer 260 may be a reactive ink layer (Reactive ink). Since removing the first release layer 210 from the active ink layer does not affect the viscosity of the active ink layer, there is no need to add An optical adhesive layer or a water-repellent layer can directly attach the touch panel 20 to any non-planar target substrate after being released, which can make the touch panel 20 more light and thin while having good optical characteristics, such as high wear. Transmittance and low haze. The flexible cover 270 having a decorative function includes a film layer 271 and a shielding layer 272 disposed on the film layer 271. The shielding layer 272 is located on at least one side of the film layer 271 to form a decorative portion for shielding a peripheral line or/and a part of the touch electrode (ie, the flexible touch sensing component 220), so that the signal wire is flexible One side of the upper surface of the cover plate 270 is not easily seen by the user. In one embodiment, the shielding layer 272 is located on the lower surface of the film layer 271, that is, on the side of the film layer 271 adjacent to the flexible touch sensing component 220. In another embodiment, the shielding layer 272 can be located on the upper surface of the film layer 271, that is, in the film layer 271 relative to the flexible touch sensing component 220. The other side. Or in other embodiments, the shielding layer 272 may also be a decorative film layer (Deco-film), the decorative film layer specifically includes a transparent film, and a shielding layer is disposed in a peripheral region of the transparent film, and the decorative layer may be The film layer is directly disposed on the upper surface of the flexible cover 270. The masking layer 272 is a frame-shaped layer of colored material, which may be a colored ink, a colored photoresist, or a combination of the two. The shielding layer 272 may be a single layer structure or a composite laminated structure, a single layer structure such as a black ink layer; a composite laminated structure such as a stack structure of an ink layer and a photoresist layer, a stack structure of a white ink layer and a black ink layer, and a white ink Stack, black ink layer and photoresist layer stack structure. The flexible cover 270 can be curved or deformable. The flexible cover 270 can be permanently formed into a curved surface or dynamically formed into a curved surface and not formed into a curved surface. The flexible cover plate 270 can be formed of a flexible material such as plastic or resin, such as polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), and the like. Materials, and materials such as polyether oxime (PES), polyimine (PI), cellulose ester, benzocyclobutene (BCB), polyvinyl chloride (PVC) and acrylic resin.

Next, referring to FIG. 3F, the second substrate 250 is removed by the second release layer 240. The second substrate 250 may be removed by chemical etching using a chemical such as hydrogen fluoride. Alternatively, the second substrate 250 can be removed by mechanical means or a combination of chemical-mechanical methods. Preferably, the second substrate 250 and the second release layer 240 can be removed at the same time, which can make the touch panel 20 more light and thin while having good optical characteristics, such as high transmittance and low haze.

Through the above steps, the touch panel 20 as shown in FIG. 3F is finally formed. The touch panel 20 includes a decorative cover flexible cover 270, a bonding layer 260, and a flexible touch sensing component 220, which are stacked from top to bottom. The detailed structure, material, and manufacturing method of each of the above components have been described above, and thus will not be described herein. The touch panel 20 can be applied to touch display devices such as computer systems, mobile phones, digital media players, tablet computers, ultra-thin notebooks, wearable touch devices, and car touch systems.

The touch panel 20 of the embodiment of the present invention further includes a flexible electrode assembly 224, the flexible electrode assembly 224 can be located on the flexible touch sensing component 220, or the flexible electrode assembly 224 can be located between the flexible touch sensing component 220 and the bonding layer 260. The specific content of the touch panel 20 will be described in detail below.

FIG. 3G is another schematic structural diagram of the touch panel 20 formed by the creative manufacturing method. In one embodiment, the touch panel 20 further includes a flexible electrode assembly 224. The flexible electrode assembly 224 can be disposed between the flexible touch sensing component 220 and the bonding layer 260. The flexible electrode assembly 224 and the flexible touch sensing component 220 are electrically insulated from each other. For the specific implementation and structure of the flexible electrode assembly 224, reference may be made to the foregoing, and details are not described herein again. When the flexible electrode assembly 224 is used as an electrode layer for shielding electrical signals, since the touch panel 20 of one embodiment of the present invention is assembled with a display module (not shown), the flexible cover 270 is For the user to touch the interface, the flexible electrode assembly 224 is interposed between the flexible touch sensing component 220 and the external environment, so that the external environment noise can be prevented from being brought to the electromagnetic of the touch sensing module. interference.

FIG. 3H is another schematic structural diagram of the touch panel 20 formed by the creative manufacturing method. In one embodiment, the touch panel 20 further includes a flexible electrode assembly 224, wherein the flexible electrode assembly 224 can be disposed on the flexible touch sensing component 220, in other words, the flexible touch The control sensing component 220 is located between the flexible electrode assembly 224 and the bonding layer 260. When the flexible electrode assembly 224 is used as the electrode layer for shielding the electrical signal, since the touch panel 20 of one embodiment of the present invention is assembled with the display module (not shown), the flexible electrode assembly 224 Between the display module and the flexible touch sensing component 220, electromagnetic interference between the two modules can be prevented.

In another embodiment, the flexible electrode assembly 224 is disposed above and below the flexible touch sensing component 220 in the touch panel 20, so that the flexible electrode assembly 224 is used as the flexible electrode assembly 224. In the state of shielding the electrode layer of the electrical signal, electromagnetic interference caused by the noise of the external environment is prevented, and electromagnetic interference between the display module and the touch sensing module is also prevented.

4A-4F are flows of a method for fabricating a touch panel according to another embodiment of the present invention. Cheng Tu. FIG. 4F is a schematic diagram of a specific structure of the touch panel formed by the method for fabricating another embodiment of the present invention.

Referring first to FIG. 4A, first, a first substrate 300 is provided, and a first release layer 310 is formed on the first substrate 300. The first substrate 300 can serve as a mechanical support for the structure formed in the subsequent step, which can serve as a temporary platform for manufacturing the touch panel 30 and can subsequently remove the touch panel 30 from the first substrate 300. The first substrate 300 can be a transparent or opaque insulating material such as a glass substrate or a flexible substrate. Since the first substrate 300 does not constitute a part of the finally formed touch panel 30 product, the first substrate 300 can be made of a relatively low cost material as long as it provides the necessary mechanical support. For example, the first substrate 300 may be made of plain glass instead of chemically strengthened glass to reduce the manufacturing cost of the touch panel 30, and may also be formed of a flexible material such as plastic or resin, such as polycarbonate (PC) or polymethyl methacrylate. Polyester materials such as ester (PMMA) and polyethylene terephthalate (PET), and polyether oxime (PES), polyimine (PI), cellulose ester, benzocyclobutene (BCB), Materials such as polyvinyl chloride (PVC) and acrylic resin. In addition, after the first substrate 300 is removed from the touch panel 30, the recycling can be repeated. This can further reduce the manufacturing cost. It is to be noted that the first substrate 300 is not limited to a flexible substrate such as glass, plastic or resin, and may be any other suitable material that can provide mechanical support. The first release layer 310 is a film layer composed of a material having a release ability. The release described herein and hereinafter refers to removing the first substrate 300 from other layers (eg, the first release layer 310) to which it is originally attached, or the first substrate 300 and the first substrate 300 The release layer 310 is removed together from other layers that were originally bonded to the first release layer 310. The material of the first release layer 310 may be an organic material such as polyimine (PI), polypropylene (PP), polystyrene (PS), acrylonitrile butadiene styrene (ABS), poly pair Ethylene phthalate (PET), polyvinyl chloride (PVC), polycarbonate (PC), polyethylene (PE), polymethyl methacrylate (PMMA), polytetrafluoroethylene (PTFE), cyclic olefin Copolymer (COP, Arton) or a combination of the foregoing. The first release layer 310 may be formed on the first substrate 300 by a solution coating reheat baking method, and may also be formed by vapor deposition, volume The dry film of the first release layer 310 is formed or directly bonded to the first substrate 300 by a roll process or other suitable method. In one implementation, the first release layer 310 can be adhered to the first substrate 300 by a removable adhesive. The removable adhesive may comprise a water insoluble glue or any other suitable material that is capable of temporarily adhering the two layers together and then being dissolved or otherwise removed. The first substrate 300 can be completely removed or partially removed from the first release layer 310 by dissolving the removable adhesive. Preferably, the first release layer 310 may also be a film layer composed of a material having a release property of the upper layer and a material having no release property of the lower layer. Here, the upper layer of the first release layer 310 refers to a surface away from the first substrate 300, and the lower layer of the first release layer 310 refers to a surface close to the first substrate 300. Therefore, when the first release layer 310 is a material having a release property of the upper layer and a material having no release property of the lower layer, the first substrate 300 and the first release layer 310 may be removed from the first release layer 310 together with the first release layer 310. Removed from other layers that were originally attached together. If the first substrate 300 and the first release layer 310 are simultaneously removed, the touch panel 30 can be made lighter and thinner while having good optical characteristics, such as high transmittance and low haze.

Then, a flexible touch sensing component 320 and a shielding layer 330 are formed on the first release layer 310. The shielding layer 330 covers at least the flexible touch sensing component 320. Part of it is used to shield the surrounding lines so that the signal wires are not easily seen by the user. In one embodiment, the shielding layer 330 is formed of a colored material printed on the flexible touch sensing component 220. In other words, the shielding layer 330 and the flexible touch sensing component 320 are integrated with each other to form the same bonding. member. The material of the masking layer 330 can be a colored ink, a colored photoresist, or a combination of the two. The shielding layer 330 is a layer of colored material printed on the flexible touch sensing component 220, which may be a single layer structure or a composite laminated structure, a single layer structure such as a black ink layer, and a composite laminated structure such as an ink layer. a stacked structure with a photoresist layer, a stacked structure of a white ink layer and a black ink layer, a white ink layer, a black ink layer, and a stacked structure of a photoresist layer. Specifically, the shielding layer 330 is a layer of colored material printed on the film 121 of the flexible touch sensing component 220. Or in other embodiments, the masking layer 330 The decorative film layer may further comprise a transparent film, and a shielding layer is disposed in a peripheral region of the transparent film, and the decorative film layer may be directly disposed on the flexible touch layer. The upper surface of the component 320 is sensed. The flexible touch sensing component 320 is a film sensor that can include a film and a transferable transparent conductive film attached to the film. A film sensor is flexible or deformable, that is, a film sensor can be dynamically or permanently formed into a curved shape. The thin film sensor in this embodiment may also have the same structure as the thin film sensor described in the foregoing embodiment, that is, the thin film sensor disclosed in the foregoing embodiment may be used in the embodiment, and thus is no longer used. Repeat them.

Then, a second substrate 350 is formed on the flexible touch sensing component 320, and a second distance between the flexible touch sensing component 320 and the second substrate 350 is formed. Type layer 340. The material of the second release layer 340 and the first release layer 310 is a film layer composed of a material having a release ability, but the chemical components of the two may be the same or different. The material of the second substrate 350 and the first substrate 300 may be the same or different, and the second substrate 350 may pass the second substrate 350 from the other layer to which it is originally bonded by the second release layer 340 (for example, the first release type) The layer 310) is removed or the second substrate 350 is removed together with the second release layer 340 from other layers that were originally bonded to the second release layer 340.

Next, referring to FIG. 4D, the first substrate 300 is removed by the first release layer 310. Removing the first substrate 300 to prepare for transferring the touch panel 30 to any non-planar target substrate, which may be a flexible cover or a curved cover, which may be rigid or semi-rigid Flexible or deformable. The rigid curved substrate can be permanently formed into a curved surface. The semi-rigid, flexible, and deformable curved substrate can be dynamically formed into a curved surface and not formed into a curved surface. The first substrate 300 may be removed by chemical etching using a chemical such as hydrogen fluoride. Alternatively, the first substrate 300 may be removed by mechanical means or a combination of chemical-mechanical methods. Preferably, the first substrate 300 and the first release layer 310 can be removed at the same time, which can make the touch panel 30 more light and thin while having good optical characteristics, such as high transmittance and low. Haze.

Next, referring to FIG. 4E , a flexible cover 370 is attached to the flexible touch sensing component 320 by using a bonding layer 360 , and the bonding layer 360 is located on the flexible cover 370 and the Between the flexible touch sensing components 320, the flexible cover 370 is a single-function cover, that is, the flexible cover 370 is a transparent cover that is transparent to the whole, and has no decorative function. After the flexible cover 370 is used as the target substrate, the first substrate 300 is removed, and the touch panel 30 is transferred to the flexible cover 370 as a target substrate. The bonding between the flexible cover 370 and the flexible touch sensing component 320 may be by attaching the bonding layer 360 to the flexible cover 370, and attaching the bonding The flexible cover 370 of the layer 30 is attached to the flexible touch sensing component 320 and the shielding layer 330. The material of the bonding layer 360 may be a reactive ink layer (Reactive ink). It can also be a common optical adhesive layer or a water-based adhesive layer. The bonding between the flexible cover 370 and the flexible touch sensing component 320 may also form the bonding layer 360 on the flexible touch sensing component 320 and the first release layer 310. between. When the first substrate 300 and the first release layer 310 are simultaneously removed, the bonding layer 360 is exposed, and since the bonding layer 360 has adhesiveness, the released touch panel 30 can be directly attached to The flexible cover 370 is on the cover. The material of the bonding layer 360 may be a reactive ink layer (Reactive ink). Since removing the first release layer 310 from the active ink layer does not affect the viscosity of the active ink layer, there is no need to add An optical adhesive layer or a water-repellent layer can directly attach the released touch panel 30 to any non-planar target substrate, which can make the touch panel 30 more light and thin while having good optical characteristics, such as high wear. Transmittance and low haze. The flexible cover 370 can be curved or deformable. The flexible cover 370 can be permanently formed into a curved surface or dynamically formed into a curved surface and not formed into a curved surface. The flexible cover plate 370 can be formed of a flexible material such as plastic or resin, such as polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET) and the like. Materials, and materials such as polyether oxime (PES), polyimine (PI), cellulose ester, benzocyclobutene (BCB), polyvinyl chloride (PVC) and acrylic resin.

Next, referring to FIG. 4F, the second substrate 350 is removed by the second release layer 340. The second substrate 350 can be removed by chemical etching using a chemical such as hydrogen fluoride. Alternatively, the second substrate 350 can be removed by mechanical means or a combination of chemical-mechanical methods. Preferably, the second substrate 450 and the second release layer 340 can be removed at the same time, which can make the touch panel 30 more light and thin while having good optical characteristics, such as high transmittance and low haze.

Through the above steps, the touch panel 30 as shown in FIG. 4F is finally formed. The touch panel 30 includes a flexible cover 370 stacked from top to bottom, a bonding layer 360, a shielding layer 330, and a flexible touch sensing component 320. The shielding layer 330 is integrated into the flexible touch sensing component 320 to form the same bonding component. Preferably, the shielding layer 330 can cover at least a portion of the flexible touch sensing component 320. The flexible touch sensing component 320 is exposed to the outside and can be assembled with a display module (not shown). The detailed structure, material, and manufacturing method of each of the above components have been described above, and thus will not be described herein. The touch panel 30 can be applied to a touch display device such as a computer system, a mobile phone, a digital media player, a tablet computer, an ultra-thin notebook, a wearable touch device, and a car touch system. Specifically, the shielding layer 330 is a layer of colored material formed by a colored material (such as ink) printed on the flexible touch sensing component 320, so that the shielding layer 330 and the flexible touch sensing component 320 are attached. In the process of the process, it is regarded as a composite member of the composite type; more specifically, the shielding layer 330 can print the colored ink on the film 121 of the flexible touch sensing component 320. In other variant embodiments, the shielding layer 330 can be located on the barrier layer, the protective layer 130 or the hard coating layer of the flexible touch sensing component 320. For the specific manufacturing method of this embodiment, reference may be made to the description of the above embodiment, for example, by using a printing method. In a variant embodiment, the colored ink can be formed in the same printing step as the above-mentioned various film layers, so that the shielding layer 330 is embedded in the flexible touch sensing component 320, for example, the shielding layer 330 is embedded in the film 121, and is blocked. Among the layers, the protective layer 130 or the hard coat layer.

The touch panel 30 of the present embodiment further includes a flexible electrode assembly 324, and the flexible electrode assembly 324 can be located at the flexible touch sensing component 320. The flexible electrode assembly 224 can be located between the flexible touch sensing component 320 and the bonding layer 360. The specific content of the touch panel 30 will be described in detail below.

FIG. 4G is another schematic structural diagram of the touch panel 30 formed by the creative manufacturing method. In one embodiment, the touch panel 30 further includes a flexible electrode assembly 324, wherein the flexible electrode assembly 324 can be disposed between the flexible touch sensing component 320 and the bonding layer 360. In this embodiment, the shielding layer 330 is printed on the colored material layer of the flexible electrode assembly 324, and the flexible electrode assembly 324 printed with the shielding layer 330 is attached to the flexible touch sensing component 320. In other words, the shielding layer 330 is integrated into the flexible electrode assembly 324 to form the same bonding member. For a detailed description of the shielding layer 330, reference may be made to the foregoing. Or the shielding layer 330 is printed on the colored material layer of the flexible touch sensing component 320, and then the flexible touch sensing component 320 printed with the shielding layer 330 is attached to the flexible electrode assembly 324, in other words, The shielding layer 330 is integrated into the flexible touch sensing component 320 to form the same bonding member. The above method forms the shielding layer 330 between the flexible touch sensing component 320 and the flexible electrode assembly 324. Next, the bonding layer 360 may be attached to the flexible cover 370, and then the flexible cover 370 to which the bonding layer 360 is attached is attached to the flexible electrode assembly 324; The bonding layer 360 is disposed between the flexible touch sensing component 320 and the first release layer 310. More specifically, the bonding layer 360 is first disposed on the flexible electrode assembly 324 and located at the first release type. Below the layer 310, the first release layer 310 is removed to expose the bonding layer 360, and the flexible cover 370 is attached to the bonding layer 360 to complete the touch panel 30 shown in FIG. 4G.

In one embodiment, the shielding layer 330 is printed on the upper surface of the flexible electrode assembly 324, and the flexible touch sensing component 320 is attached to the flexible electrode assembly 324 printed with the shielding layer 330. a surface, according to which the bonding layer 360 can be attached to the flexible cover 370, and then the flexible cover 370 to which the bonding layer 360 is attached is attached to the flexible electrode assembly 324 and the shielding The bonding layer 360 is disposed between the flexible touch sensing component 320 and the first release layer 310. More specifically, the bonding layer 360 is first disposed on the flexible electrode assembly 324. The shadow Above the layer 330 and under the first release layer 310, the first release layer 310 is removed to expose the bonding layer 360, thereby attaching the flexible cover 370 to the bonding layer 360 to complete the touch. Panel 30.

When the flexible electrode assembly 324 is used as an electrode layer for shielding electrical signals, since the touch panel 30 of one embodiment of the present invention is assembled with a display module (not shown), the flexible cover 370 is For the user to touch the interface, the flexible electrode assembly 324 is interposed between the flexible touch sensing component 320 and the external environment, so that the external environment noise can be prevented from being brought to the electromagnetic of the touch sensing module. interference.

FIG. 4H is another schematic structural diagram of the touch panel 30 formed by the creative manufacturing method. In one embodiment, the touch panel 30 further includes a flexible electrode assembly 324, wherein the flexible electrode assembly 324 can be disposed on the flexible touch sensing component 320, in other words, the flexible touch The control sensing component 320 is located between the flexible electrode assembly 324 and the bonding layer 360. Specifically, the flexible electrode assembly 324 is formed between the flexible touch sensing component 320 and the second release layer 340. After the second release layer 340 and the second substrate 350 are removed, The flexible electrode assembly 324 is exposed, and then the flexible electrode assembly 324 can be assembled with a display module (not shown).

When the flexible electrode assembly 324 is used as the electrode layer for shielding the electrical signal, since the touch panel 30 of one embodiment of the present invention is assembled with the display module (not shown), the flexible electrode assembly 324 Between the display module and the flexible touch sensing component 320, electromagnetic interference between the two modules can be prevented.

In another embodiment, the flexible electrode assembly 324 is disposed above and below the flexible touch sensing component 320 in the touch panel 30, so that the flexible electrode assembly 324 is used as the flexible electrode assembly 324. In the state of shielding the electrode layer of the electrical signal, electromagnetic interference caused by the noise of the external environment is prevented, and electromagnetic interference between the display module and the touch sensing module is also prevented.

It can be understood that the structure and specific method of the flexible touch sensing component 320 of the touch panel 30 of the embodiment shown in FIG. 4F to FIG. To implement. For example, with the structure of the flexible touch sensing component 120 shown in FIG. 2D, it can be understood that the shielding layer 330 can be formed on the surface of the nano metal conductive layer 122, and then The flexible electrode assembly 124 (324) is attached to the nano metal conductive layer 122 of the flexible touch sensing component 120.

5A-5F are flowcharts of a method for fabricating a touch panel according to another embodiment of the present invention. FIG. 5F is a schematic diagram of a specific structure of the touch panel formed by the method for fabricating another embodiment of the present invention.

Referring first to FIG. 5A, first, a first substrate 400 is provided, and a first release layer 410 is formed on the first substrate 400. The first substrate 400 can serve as a mechanical support for the structure formed in the subsequent steps, which can serve as a temporary platform for manufacturing the touch panel and can subsequently remove the touch panel from the first substrate 400. The first substrate 400 can be a transparent or opaque insulating material such as a glass substrate or a flexible substrate. Since the first substrate 400 does not form part of the finally formed touch panel product, the first substrate 400 can be made of a relatively low cost material as long as it provides the necessary mechanical support. For example, the first substrate 400 may be made of plain glass instead of chemically strengthened glass to reduce the manufacturing cost of the touch panel, and may also be formed of a flexible material such as plastic or resin, such as polycarbonate (PC) or polymethyl methacrylate. Polyester materials such as (PMMA), polyethylene terephthalate (PET), and polyether oxime (PES), polyimine (PI), cellulose ester, benzocyclobutene (BCB), poly Materials such as vinyl chloride (PVC) and acrylic resin. In addition, after the first substrate 400 is removed from the touch panel, the recycling can be repeated. Therefore, the manufacturing cost can be further reduced. It is to be noted that the first substrate 400 is not limited to a flexible substrate such as glass, plastic or resin, and may be any other suitable material that can provide mechanical support. The first release layer 410 is a film layer composed of a material having a release ability. The release described herein and hereinafter refers to removing the first substrate 400 from other layers (eg, the first release layer 410) to which it is originally attached, or the first substrate 400 and the first substrate 400 The release layer 410 is removed together from other layers that were originally bonded to the first release layer 410. The material of the first release layer 410 may be an organic material such as polyimine (PI), polypropylene (PP), Polystyrene (PS), Acrylonitrile Butadiene Styrene (ABS), Polyethylene terephthalate (PET), Polyvinyl Chloride (PVC), Polycarbonate (PC), Polyethylene (PE) ), polymethyl methacrylate (PMMA), polytetrafluoroethylene (PTFE), cyclic olefin copolymer (COP, Arton) or a combination of the foregoing. The first release layer 410 may be formed on the first substrate 400 by a solution coating reheat baking method, or may be formed by a vapor deposition method, a roll-to-roll process or other suitable method or directly adopting the first release layer. The 410 dry film is pressed onto the first substrate 400. In one implementation, the first release layer 410 can be adhered to the first substrate 400 by a removable adhesive. The removable adhesive may comprise a water insoluble glue or any other suitable material that is capable of temporarily adhering the two layers together and then being dissolved or otherwise removed. The first substrate 400 can be completely removed or partially removed from the first release layer 410 by dissolving the removable adhesive. Preferably, the first release layer 410 may also be a film layer composed of a material having a release property of the upper layer and a material having no release property of the lower layer. Here, the upper layer of the first release layer 410 refers to a surface away from the first substrate 400, and the lower layer of the first release layer 410 refers to a surface close to the first substrate 400. Therefore, when the first release layer 410 is a material having a release property of the upper layer and a material having no release property of the lower layer, the first substrate 400 and the first release layer 410 may be removed from the first release layer 410 together with the first release layer 410. Removed from other layers that were originally attached together. If the first substrate 400 and the first release layer 410 are simultaneously removed, the touch panel can be made lighter and thinner while having good optical characteristics, such as high transmittance and low haze.

Next, referring to FIG. 5B, a flexible cover plate 430 having a decorative portion is formed on the first release layer 410. The flexible cover 430 having a decorative function includes a film layer 431 and a shielding layer 432 disposed on the film layer 431. The shielding layer 432 forms a decorative portion. The shielding layer 432 is located on at least one side of the film layer 431 for shielding a peripheral line and/or a portion of the flexible touch sensing component 420 (eg, between the peripheral line and the flexible touch sensing component 420) The lap joint makes the signal wire from the side of the upper surface of the flexible cover 430 not easily visible to the user. In an embodiment, the shielding layer 432 is located on the lower surface of the film layer 431, that is, adjacent to the film layer 431. One side of the touch sensing component 420. In another embodiment, the shielding layer 432 can be located on the upper surface of the film layer 431, that is, on the other side of the film layer 431 relative to the flexible touch sensing component 420. Or in other embodiments, the shielding layer 432 may also be a decorative film layer (Deco-film), the decorative film layer specifically includes a transparent film, and a shielding layer is disposed in a peripheral region of the transparent film, and the decorative layer may be The film layer is directly disposed on the upper surface of the flexible cover 430. The material of the masking layer 432 can be a colored ink, a colored photoresist, or a combination of the two. The shielding layer 432 may be a single layer structure or a composite laminated structure, a single layer structure such as a black ink layer; a composite laminated structure such as a stack structure of an ink layer and a photoresist layer, a stack structure of a white ink layer and a black ink layer, and a white ink Stack, black ink layer and photoresist layer stack structure. The flexible cover 430 can be curved or deformable. The flexible cover 430 can be permanently formed into a curved surface or dynamically formed into a curved surface and not formed into a curved surface. The flexible cover 430 may be formed of a flexible material such as plastic or resin, such as polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), etc. Materials, and materials such as polyether oxime (PES), polyimine (PI), cellulose ester, benzocyclobutene (BCB), polyvinyl chloride (PVC) and acrylic resin.

Next, referring to FIG. 5C, a flexible touch sensing component 420 is formed on the flexible cover 430 having a decorative function. Compared with the previous embodiment, since the flexible touch sensing component 420 is in direct contact with the decorative cover 430, the first substrate 400 and the first release layer 410 are moved. In addition, since the flexible touch sensing component 420 already has a flexible cover 430 with a decorative function, there is no need to additionally use a bonding layer to expose the flexible cover 430 and the flexible touch. The test assembly 420 is bonded. This can make the touch panel thinner and lighter while saving a process, and has good optical characteristics such as high transmittance and low haze. The flexible touch sensing component 420 is a film sensor that can include a film and a transferable transparent conductive film attached to the film. The film sensor is flexible or deformable, that is, the film sensor can be dynamically or permanently formed into a curved shape, and the film sensor can The attached method is directly attached to the flexible cover 430. For example, the film of the film sensor can be directly bonded to the film layer 431 of the flexible cover 430. The thin film sensor in this embodiment may also have the same structure as the thin film sensor described in the foregoing embodiment, that is, the thin film sensor disclosed in the foregoing embodiment may be used in the embodiment, and thus is no longer used. Repeat them.

Then, a second substrate 550 is formed on the flexible touch sensing component 520, and a second distance between the flexible touch sensing component 520 and the second substrate 550 is formed. Type layer 540. The material of the second release layer 540 and the first release layer 410 is a film layer composed of a material having a release ability, but the chemical components of the two may be the same or different. The material of the second substrate 550 and the first substrate 400 may be the same or different, and the second substrate 550 may pass the second substrate 550 from the other layer to which it is originally attached by the second release layer 540 (for example, the first release type) The layer 410) is removed or the second substrate 550 is removed from the other layers that were originally bonded to the second release layer 540 together with the second release layer 540.

Next, referring to FIG. 5E, the first substrate 400 is removed by the first release layer 410. The first substrate 400 may be removed by chemical etching using a chemical such as hydrogen fluoride. Alternatively, the first substrate 400 can be removed by mechanical means or a combination of chemical-mechanical methods. Preferably, the first substrate 400 and the first release layer 410 can be removed at the same time, which can make the touch panel more light and thin while having good optical characteristics, such as high transmittance and low haze.

Next, referring to FIG. 5F, the second substrate 550 is removed by the second release layer 540. The second substrate 550 can be removed by chemical etching using a chemical such as hydrogen fluoride. Alternatively, the second substrate 550 can be removed by mechanical means or a combination of chemical-mechanical methods. Preferably, the second substrate 550 and the second release layer 540 can be removed at the same time, which can make the touch panel more light and thin while having good optical characteristics, such as high transmittance and low haze.

Through the above steps, the touch panel 40 as shown in FIG. 5F is finally formed. The touch panel 40 is stacked from top to bottom with the user touching and viewing the surface above the figure. The flexible cover 430 and the flexible touch sensing component 420 of the decorative function (ie, the decorative part) are in direct contact with the decorative cover 430 . The detailed structure, material, and manufacturing method of each of the above components have been described above, and thus will not be described herein. The touch panel 20 can be applied to touch display devices such as computer systems, mobile phones, digital media players, tablet computers, ultra-thin notebooks, wearable touch devices, and car touch systems.

The touch panel 40 of the present embodiment further includes a flexible electrode assembly 424. The flexible touch sensing component 420 can be located on the flexible electrode assembly 424 and the flexible cover 430 having a decorative function. Between, the specific content of the touch panel 40 will be described in detail below.

FIG. 5G is another schematic structural diagram of the touch panel 40 formed by the creative manufacturing method. In one embodiment, the touch panel 40 further includes a flexible electrode assembly 424, wherein the flexible electrode assembly 424 can be disposed on the flexible touch sensing component 420, in other words, the flexible touch The control sensing component 420 is located between the flexible electrode assembly 424 and the film layer 431. The specific method may be that the flexible electrode assembly 424 is formed between the flexible touch sensing component 420 and the second release layer 540. After the second release layer 540 and the second substrate 550 are removed, the second release layer 540 and the second substrate 550 may be removed. The flexible electrode assembly 424 is exposed, and then the flexible electrode assembly 424 can be assembled with a display module (not shown).

As shown in FIG. 2A , the flexible touch sensing component 420 can also be a thin film sensor having a thin film 121 and a nano metal conductive layer 122 formed on the thin film 121 , so in this embodiment. The film 121 of the flexible touch sensing component 420 can be directly bonded to the film layer 431 of the decorative cover 430, and the film 121 is preferably attached to the shielding layer 432 and cover. In other words, the nano-metal conductive layer 122 of the flexible touch sensing component 420 is located on a first surface (the surface of the film) 121, and the film layer 431 of the decorative cover 430 is located. A second surface (such as the surface) of the film 212, the decorative portion formed by the shielding layer 432 is also located on the second surface (the upper surface) of the film 212 to shield A trace (such as a lap portion of the nano silver layer 122a that is in contact with the peripheral line) that is not visible to the user, the flexible electrode assembly 424 being located on the nano metal conductive layer 122, the flexible electrode The component 424 and the nano-metal conductive layer 122 are electrically insulated from each other.

Referring to FIG. 2B , the flexible touch sensing component 420 of the present embodiment has a similar structure, and the first nano metal conductive layer 122 of the flexible touch sensing component 420 and the flexible function with the decorative function. The film layer 431 of the cover plate 430 is directly attached, and the second nano metal conductive layer 123 is away from the flexible cover plate 430, and the flexible electrode assembly 424 is located on the second nano metal conductive layer 123, and The second nano metal conductive layer 123 is electrically insulated from each other. Preferably, the first nano-metal conductive layer 122 is formed on the shielding layer 432 (in the positional relationship of the pattern, the shielding layer 432 is located between the first nano-metal conductive layer 122 and the thin film layer 431), from the perspective of the user. In view, the decorative portion formed by the shielding layer 432 can shield the traces that are not visible to the user (for example, the nano silver wire layer 122a and/or the second nano metal conductive layer 123 of the first nano metal conductive layer 122). Preferably, the decorative portion formed by the shielding layer 432 can also shield a portion of the structure of the flexible electrode assembly 424 (such as a flexible electrode). A portion of the nanowire layer of component 424).

Referring to FIG. 2C , the flexible touch sensing component 420 of the present embodiment has a similar structure, and the first nano metal conductive layer 122 of the flexible touch sensing component 420 and the flexible function with the decorative function. The film layer 431 of the cover plate 430 is directly bonded. The first nano metal conductive layer 122 and the second nano metal conductive layer 123 have a film 121, 121 ′, and the flexible electrode assembly 424 is located at the second On the nano metal conductive layer 123, the flexible electrode assembly 424 and the second nano metal conductive layer 123 are electrically insulated from each other. Preferably, the first nano-metal conductive layer 122 is formed on the shielding layer 432 (in the positional relationship of the pattern, the shielding layer 432 is located between the first nano-metal conductive layer 122 and the thin film layer 431), from the perspective of the user. In view, the decorative portion formed by the shielding layer 432 can shield the traces that are not visible to the user (for example, the nano silver wire layer 122a and/or the second nano metal conductive layer 123 of the first nano metal conductive layer 122). Nano silver wire Preferably, the decorative portion formed by the shielding layer 432 can also shield a portion of the structure of the flexible electrode assembly 424 (such as the nanometer of the flexible electrode assembly 424). Part of the silver wire layer).

The flexible touch sensing component 420 of the present embodiment may have various configurations of the foregoing components 120, and details are not described herein again.

When the flexible electrode assembly 424 is used as the electrode layer for shielding the electrical signal, since the touch panel 40 of one embodiment of the present invention is assembled with the display module (not shown), the flexible electrode assembly 424 Between the display module and the flexible touch sensing component 420, electromagnetic interference between the two modules can be prevented.

The touch sensor and the touch panel provided by the present invention form a flexible touch sensing component on the release layer by the support of the first substrate, and then can be transferred by the second substrate. The flexible touch sensing component is attached to any non-planar and curved cover plate, and the touch panel thus formed is lighter, thinner and less expensive to manufacture. In addition, the flexible touch sensing component uses a thin film sensor including a nano metal conductive layer. Since the nano silver wire itself has good flex resistance, the touch sensor and touch provided by the present invention are provided. The panel can be used for flexible touch and curved touch. In addition, since the material of the bonding layer can be a reactive ink layer (Reactive ink), the removable touch panel can be directly attached to any non-planar surface without adding an optical adhesive layer or a water-repellent layer. On the target substrate, the touch panel can be made lighter and thinner with good optical characteristics such as high transmittance and low haze.

The touch sensor and the touch panel provided by the present invention have multiple (two, three or more) electrode assemblies, and the electrode assemblies are all flexible, so that they can be applied to planar or non-planar (for example, The surface of the curvature), and the electrode assembly can be adjusted according to different needs to achieve more sensing functions or electromagnetic shielding functions, so that the touch sensor provided by the present invention The touch panel has a competitive advantage in products under flexible and malleable conditions. In addition, the touch sensor and the touch panel provided by the present invention are more flexible, extendable, and therefore more suitable for a bendable display, a foldable display or a rollable type. (rollable) display.

The above description is only for the preferred embodiment of the present invention and is not intended to limit the creation. Any modification, equivalent replacement, improvement, etc., which are made within the spirit and principles of the present creation, should be included in the creation. Within the scope of protection.

Claims (107)

A touch sensor for transferring to a non-planar surface, comprising: a carrier substrate; and a flexible touch sensing component, the flexible touch sensing component and the carrier substrate have a release pattern Floor. The touch sensor of claim 1, wherein the flexible touch sensing component is a film sensor. The touch sensor of claim 2, wherein the thin film sensor has a film and a nano metal conductive layer formed on the film. The touch sensor of claim 3, further comprising: a flexible electrode assembly, wherein the nano metal conductive layer is located on a first surface of the film, and the flexible electrode assembly is located at the film The second surface. The touch sensor of claim 3, wherein the nano metal conductive layer comprises a nano silver wire layer and a coating layer (OC). The touch sensor of claim 3, wherein the nano metal conductive layer further comprises a passivation or a protective layer. The touch sensor of claim 3, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located on the nano metal conductive layer, the flexible electrode assembly and the nano metal The conductive layers are electrically insulated from each other. The touch sensor of claim 2, wherein the film sensor has a film and a first nano metal conductive layer and a second nano metal conductive layer formed on opposite surfaces of the film. The touch sensor of claim 8, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located on the first nano metal conductive layer, the flexible electrode assembly and the first One nanometer metal conductive layer is electrically insulated from each other. The touch sensor of claim 8, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located on the second nano metal conductive layer, the flexible The first electrode metal conductive layer is electrically insulated from the first nano metal conductive layer, and the flexible electrode assembly is located between the second nano metal conductive layer and the release layer. The touch sensor of claim 8, wherein the first nano metal conductive layer and the second nano metal conductive layer respectively comprise a nano silver wire layer and a coating layer (OC). The touch sensor of claim 11, wherein the nano silver wire layer is electrically connected to a peripheral circuit. The touch sensor of claim 8, wherein the first nano metal conductive layer further comprises a hard coat layer (HC), and the second nano metal conductive layer further comprises a passivation layer. . The touch sensor of claim 8, wherein the first nano metal conductive layer or the second nano metal conductive layer further comprises a protective layer. The touch sensor of claim 2, wherein the film sensor has a first film, a first nano metal conductive layer formed on the first film, a second film, and a film formed thereon a second nano-metal conductive layer on the second film, the first film and the second film are bonded to each other, and the first nano-metal conductive layer and the second nano-metal conductive layer face in opposite directions. The touch sensor of claim 15, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located on the first nano metal conductive layer, the flexible electrode assembly and the first One nanometer metal conductive layer is electrically insulated from each other. The touch sensor of claim 15 further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located between the flexible touch sensing component and the release layer, The flexible electrode assembly and the second nano-metal conductive layer are respectively located on opposite surfaces of the second film and electrically insulated from each other. The touch sensor of claim 15, wherein the thin film sensor further comprises a peripheral line electrically connected to the first nano metal conductive layer and the second nano metal conductive layer. The touch sensor of claim 15, wherein the first nano metal conductive layer Further comprising a hard coat layer (HC), the second nano metal conductive layer further comprising a passivation. The touch sensor of claim 15, wherein the first nano metal conductive layer or the second nano metal conductive layer further comprises a protective layer. The touch sensor of claim 15, wherein the film sensor comprises a film and a transferable transparent conductive film attached to the film. The touch sensor of claim 1, further comprising a bonding layer, wherein the bonding layer is disposed on the flexible touch sensing component. The touch sensor of claim 22, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located between the bonding layer and the flexible touch sensing component. The touch sensor of claim 1 further comprising a residual release layer disposed on the flexible touch sensing component. The touch sensor of claim 24, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located on the flexible touch sensing component, or the flexible electrode assembly is located The flexible touch sensing component is between the residual release layer. The touch sensor of claim 25, wherein the flexible electrode assembly has a film and a nano metal conductive layer formed on the film. The touch sensor of claim 26, wherein the nano metal conductive layer comprises a nano silver wire layer and a coating layer (OC). The touch sensor of claim 26, wherein the nano metal conductive layer further comprises a passivation, a primer or a hard coat layer (HC). A touch panel for transferring to a non-planar surface, comprising: a flexible cover having a decorative portion; and a flexible touch sensing component, the flexible touch sensing component and the flexible There is a bonding layer between the cover plates. The touch panel of claim 29, wherein the flexible cover comprises a film And a shielding layer disposed on the film layer, the shielding layer forming the decorative portion. The touch panel of claim 30, wherein the flexible touch sensing component is a film sensor. The touch panel of claim 31, wherein the film sensor has a film and a nano metal conductive layer formed on the film. The touch panel of claim 32, further comprising: a flexible electrode assembly, wherein the nano metal conductive layer is located on a first surface of the film, and the flexible electrode assembly is located at a second portion of the film surface. The touch panel of claim 32, wherein the nano metal conductive layer comprises a nano silver wire layer and a coating layer (OC). The touch panel of claim 32, wherein the nano metal conductive layer further comprises a passivation or a protective layer. The touch panel of claim 32, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located on the nano metal conductive layer, the flexible electrode assembly and the nano metal conductive layer Electrically insulated from each other. The touch panel of claim 31, wherein the film sensor has a film and a first nano metal conductive layer and a second nano metal conductive layer formed on opposite surfaces of the film. The touch panel of claim 37, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located on the first nano metal conductive layer, the flexible electrode assembly and the first nano The metal metal conductive layers are electrically insulated from each other, and the flexible electrode assembly is located between the first nano metal conductive layer and the bonding layer. The touch panel of claim 37, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located on the second nano metal conductive layer, the flexible electrode assembly and the first nano The metal metal conductive layers are electrically insulated from each other. The touch panel of claim 37, wherein the first nano metal conductive layer and the second nano metal conductive layer respectively comprise a nano silver wire layer and a coating layer (OC). The touch panel of claim 40, wherein the nano silver wire layer is electrically connected to a peripheral circuit, and the shielding layer shields the peripheral circuit. The touch panel of claim 37, wherein the first nano metal conductive layer further comprises a hard coat layer (HC), and the second nano metal conductive layer further comprises a passivation layer. The touch panel of claim 37, wherein the first nano metal conductive layer or the second nano metal conductive layer further comprises a protective layer. The touch panel of claim 31, wherein the film sensor has a first film, a first nano metal conductive layer formed on the first film, a second film, and a second film a second nano metal conductive layer on the film, the first film and the second film being bonded to each other, the first nano metal conductive layer and the second nano metal conductive layer facing in opposite directions. The touch panel of claim 44, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located on the first nano metal conductive layer, the flexible electrode assembly and the first nano The metal metal conductive layers are electrically insulated from each other, and the flexible electrode assembly is located between the first nano metal conductive layer and the bonding layer. The touch panel of claim 44, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly and the second nano-metal conductive layer are respectively located on opposite surfaces of the second film and electrically connected to each other Sexual insulation. The touch panel of claim 44, wherein the thin film sensor further comprises a peripheral line electrically connected to the first nano metal conductive layer and the second nano metal conductive layer, the shielding layer Mask the surrounding lines. The touch panel of claim 44, wherein the first nano metal conductive layer further comprises a hard coat layer (HC), and the second nano metal conductive layer further comprises a passivation layer. The touch panel of claim 44, wherein the first nano metal conductive layer or the second nano metal conductive layer further comprises a protective layer. The touch panel of claim 31, wherein the film sensor comprises a film And a transferable transparent conductive film attached to the film. The touch panel of claim 29, further comprising a first release layer remaining on the flexible touch sensing component, wherein the first release layer is located on the flexible touch sensing component Between this bonding layer. The touch panel of claim 51, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located between the first release layer and the flexible touch sensing component. The touch panel of claim 29, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located on the flexible touch sensing component, or the flexible electrode assembly is located Between the flexible touch sensing component and the bonding layer. The touch panel of claim 53, wherein the flexible electrode assembly has a film and a nano metal conductive layer formed on the film. The touch panel of claim 54, wherein the nano metal conductive layer comprises a nano silver wire layer and a coating layer (OC). The touch panel of claim 54, wherein the nano metal conductive layer further comprises a passivation, a primer or a hard coat layer (HC). A touch panel for transferring to a non-planar surface includes: a flexible cover; a flexible touch sensing component having a flexible touch sensing component and the flexible cover a bonding layer; and a shielding layer covering at least a portion of the flexible touch sensing element. The touch panel of claim 57, wherein the shielding layer is a layer of colored material printed on the flexible touch sensing component, and the shielding layer and the flexible touch sensing component are integrated with each other. The same fitting member. The touch panel of claim 58, wherein the flexible touch sensing component is a film sensor. The touch panel of claim 59, wherein the film sensor has a film And a nano metal conductive layer formed on the film. The touch panel of claim 60, further comprising: a flexible electrode assembly, wherein the nano metal conductive layer is located on a first surface of the film, and the flexible electrode assembly is located at a second portion of the film surface. The touch panel of claim 60, wherein the nano metal conductive layer comprises a nano silver wire layer and a coating layer (OC). The touch panel of claim 60, wherein the nano metal conductive layer further comprises a passivation or a protective layer. The touch panel of claim 60, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located on the nano metal conductive layer, the flexible electrode assembly and the nano metal conductive layer Electrically insulated from each other. The touch panel of claim 59, wherein the film sensor has a film and a first nano metal conductive layer and a second nano metal conductive layer formed on opposite surfaces of the film. The touch panel of claim 65, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located on the first nano metal conductive layer, the flexible electrode assembly and the first nano The metal metal conductive layers are electrically insulated from each other, and the flexible electrode assembly is located between the first nano metal conductive layer and the bonding layer. The touch panel of claim 65, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located on the second nano metal conductive layer, the flexible electrode assembly and the first nano The metal metal conductive layers are electrically insulated from each other. The touch panel of claim 65, wherein the first nano metal conductive layer and the second nano metal conductive layer respectively comprise a nano silver wire layer and a coating layer (OC). The touch panel of claim 68, wherein the nano silver wire layer is electrically connected to a peripheral circuit, and the shielding layer shields the peripheral circuit. The touch panel of claim 65, wherein the first nano metal conductive layer further comprises a hard coat layer (HC), and the second nano metal conductive layer further comprises a resistive layer Passage. The touch panel of claim 65, wherein the first nano metal conductive layer or the second nano metal conductive layer further comprises a protective layer. The touch panel of claim 59, wherein the film sensor has a first film, a first nano metal conductive layer formed on the first film, a second film, and a second film a second nano metal conductive layer on the film, the first film and the second film being bonded to each other, the first nano metal conductive layer and the second nano metal conductive layer facing in opposite directions. The touch panel of claim 72, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located on the first nano metal conductive layer, the flexible electrode assembly and the first nano The metal metal conductive layers are electrically insulated from each other, and the flexible electrode assembly is located between the first nano metal conductive layer and the bonding layer. The touch panel of claim 72, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly and the second nano-metal conductive layer are respectively located on opposite surfaces of the second film and electrically connected to each other Sexual insulation. The touch panel of claim 72, wherein the thin film sensor further comprises a peripheral line electrically connected to the first nano metal conductive layer and the second nano metal conductive layer, the shielding layer Mask the surrounding lines. The touch panel of claim 72, wherein the first nano metal conductive layer further comprises a hard coat layer (HC), and the second nano metal conductive layer further comprises a passivation layer. The touch panel of claim 72, wherein the first nano metal conductive layer or the second nano metal conductive layer further comprises a protective layer. The touch panel of claim 59, wherein the film sensor comprises a film and a transferable transparent conductive film attached to the film. The touch panel of claim 57, further comprising a first release layer remaining on the flexible touch sensing element and the shielding layer, wherein the first release layer is located in the flexible contact The sensing element is controlled between the bonding layer. The touch panel of claim 79, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located between the first release layer and the flexible touch sensing component. The touch panel of claim 57, further comprising: a flexible electrode assembly, wherein the flexible electrode assembly is located between the flexible touch sensing component and the bonding layer, or the flexible The electrode assembly is located on the flexible touch sensing component, wherein the shielding layer is a layer of colored material printed on the flexible electrode assembly. The touch panel of claim 81, wherein the flexible electrode assembly has a film and a nano metal conductive layer formed on the film. The touch panel of claim 82, wherein the nano metal conductive layer comprises a nano silver wire layer and a coating layer (OC). The touch panel of claim 82, wherein the nano metal conductive layer further comprises a passivation, a primer or a hard coat layer (HC). A touch panel for transferring to a non-planar surface, comprising: a flexible cover having a decorative portion; and a flexible touch sensing component, the flexible touch sensing component and the flexible The sexual cover is in direct contact. The touch panel of claim 85, wherein the flexible cover comprises a film layer and a shielding layer disposed on the film layer, the shielding layer forming the decorative portion. The touch panel of claim 86, wherein the flexible touch sensing component is a film sensor. The touch panel of claim 87, wherein the film sensor has a film and a nano-metal conductive layer formed on the film, the film directly bonding to the film layer of the flexible cover. The touch panel of claim 88, further comprising: a flexible electrode assembly, wherein the nano metal conductive layer is located on a first surface of the film, and the film layer of the flexible cover is located on the film a second surface of the flexible electrode assembly The flexible electrode assembly and the nano metal conductive layer are electrically insulated from each other on the nano metal conductive layer. The touch panel of claim 88, wherein the nano metal conductive layer comprises a nano silver wire layer and a coating layer (OC). The touch panel of claim 88, wherein the nano metal conductive layer further comprises a passivation or a protective layer. The touch panel of claim 87, wherein the film sensor has a film and a first nano metal conductive layer and a second nano metal conductive layer formed on opposite surfaces of the film. The touch panel of claim 92, further comprising: a flexible electrode assembly, wherein the first nano-metal conductive layer directly adheres to the film layer of the decorative cover having a decorative function, The flexible electrode assembly is located on the second nano metal conductive layer, and the flexible electrode assembly and the second nano metal conductive layer are electrically insulated from each other. The touch panel of claim 92, wherein the first nano metal conductive layer and the second nano metal conductive layer respectively comprise a nano silver wire layer and a coating layer (OC). The touch panel of claim 94, wherein the nano silver wire layer is electrically connected to a peripheral circuit, and the shielding layer shields the peripheral circuit. The touch panel of claim 94, wherein the first nano-metal conductive layer further comprises a hard coat layer (HC), and the second nano metal conductive layer further comprises a passivation. The touch panel of claim 94, wherein the first nano metal conductive layer or the second nano metal conductive layer further comprises a protective layer. The touch panel of claim 87, wherein the film sensor has a first film, a first nano metal conductive layer formed on the first film, a second film, and a second film formed on the second a second nano metal conductive layer on the film, the first film and the second film are bonded to each other, the first nano metal conductive layer and the second The conductive layer of the nano metal is in the opposite direction. The touch panel of claim 98, further comprising: a flexible electrode assembly, wherein the first nano metal conductive layer directly adheres to the thin film layer of the flexible cover, the flexible electrode The component is on the second nano metal conductive layer, and the flexible electrode assembly and the second nano metal conductive layer are electrically insulated from each other. The touch panel of claim 98, wherein the thin film sensor further comprises a peripheral line electrically connected to the first nano metal conductive layer and the second nano metal conductive layer, the shielding layer Mask the surrounding lines. The touch panel of claim 98, wherein the first nano-metal conductive layer further comprises a hard coat layer (HC), and the second nano metal conductive layer further comprises a passivation. The touch panel of claim 98, wherein the first nano metal conductive layer or the second nano metal conductive layer further comprises a protective layer. The touch panel of claim 87, wherein the film sensor comprises a film and a transferable transparent conductive film attached to the film. The touch panel of claim 85, further comprising: a flexible electrode assembly, wherein the flexible touch sensing component is located between the flexible cover and the flexible electrode assembly. The touch panel of claim 104, wherein the flexible electrode assembly has a film and a nano metal conductive layer formed on the film. The touch panel of claim 105, wherein the nano metal conductive layer comprises a nano silver wire layer and a coating layer (OC). The touch panel of claim 106, wherein the nano metal conductive layer further comprises a passivation, a primer or a hard coat layer (HC).