CN208335148U - Touch sensing and its touch panel - Google Patents

Abstract

A kind of touch sensing and its touch panel, flexible touch-control sensing element is formed on release layer by the supporting role of first substrate, it is acted on again by the reprinting of the second substrate, flexible touch-control sensing element can be attached on any non-planar and curved surface cover board, the touch panel being thusly-formed is lighter, thin, and cost of manufacture is lower.In addition, flexible touch-control sensing element uses the thin film sensor comprising nanometer metal conducting layer, since nanometer silver wire itself has a good flexible resistance, touch sensing provided by the utility model, touch panel can be used for flexible touch-control and curved surface touch-control.

Description

Touch sensing and its touch panel

Technical field

The utility model relates to technical field of touch control more particularly to a kind of touch sensings and its touch panel.

Background technique

In consumer electrical product market now, touch panel (touchpanel) has been applied to a variety of electronic products, example Such as smart phone, mobile phone, tablet computer and notebook computer.Since user can directly pass through the object shown on screen It carries out operation and assigns instruction, therefore touch panel provides the hommization operation interface between user and electronic product.

The manufacture craft of existing touch panel is sputter and to be lithographically formed a touch-control sensing component in base under the high temperature conditions Touch sensing is formed on plate.It generally need to be using sufficiently solid and flat glass or other transparent substrates as the carrying touch-control The substrate of sensing component is not easy to fit to touch sensing into flexible cover board or song since such substrate is relatively thick On surface cover.However, with to smaller, thinner, flexible and curved surface touch panel increasingly increased needs, using existing work Skill manufactures touch-control sensing component directly on flexible base plate or the substrate of non-flat forms or senses the biggish touch-control of substrate thickness It is extremely difficult and expensive that device, which fits on flexible cover board or curved surface cover board, thus at present it is existing it is touch panel structure provided and Manufacture craft remains to be further improved.

Utility model content

The utility model embodiment provides a kind of touch sensing and its touch panel, the structure for meeting touch panel more Add light, thin, cost of manufacture lower demand while realizes flexible touch-control and curved surface touch-control.

The utility model embodiment provides a kind of for being transferred to nonplanar touch sensing, comprising: a bearing substrate； One flexible touch-control sensing element has a release layer between the flexible touch-control sensing element and the bearing substrate.

Preferably, the flexible touch-control sensing component is a thin film sensor (film sensor).

Preferably, the thin film sensor is formed in the nanometer metal conducting layer on the film with a film and one.

Preferably, further including: a flexible electrode assembly, wherein the nanometer metal conducting layer is located at the one first of the film Surface, the pliability electrode assembly are located at a second surface of the film.

Preferably, the nanometer metal conducting layer includes a nanometer silver wire layer and a coating layer (OC).

Preferably, further including a barrier layer (passivation) or protective layer (Primer) on the nanometer metal conducting layer.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is located at the nanometer metallic conduction On layer, which is electrically insulated from the nanometer metal conducting layer.

Preferably, the thin film sensor has a film and is formed in the one first nanometer gold on opposite two surfaces of the film Belong to conductive layer and one second nanometer metal conducting layer.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is located at the first nanometer metal On conductive layer, which is electrically insulated from the first nanometer metal conducting layer.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is located at the second nanometer metal On conductive layer, which is electrically insulated from the first nanometer metal conducting layer, the pliability electrode assembly Between the second nanometer metal conducting layer and the release layer.

Preferably, the first nanometer metal conducting layer and the second nanometer metal conducting layer respectively include a nanometer silver wire layer An and coating layer (OC).

Preferably, the nanometer silver wire layer is electrically connected a periphery circuit.

Preferably, a hard conating (HC) is further included on the first nanometer metal conducting layer, the second nanometer metal conducting layer On further include a barrier layer (passivation).

Preferably, further including a protective layer on the first nanometer metal conducting layer or on the second nanometer metal conducting layer (Primer)。

Preferably, the thin film sensor has a first film；One is formed in the first nanometer metal on the first film Conductive layer；One second film；One is formed in the second nanometer metal conducting layer on second film, the first film and this second Film is bonded to each other, and the first nanometer metal conducting layer and the second nanometer metal conducting layer face opposite direction.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is located at the first nanometer metal On conductive layer, which is electrically insulated from the first nanometer metal conducting layer.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is located at the flexible touch-control sense It surveys between component and the release layer, the pliability electrode assembly and the second nanometer metal conducting layer are located at second film Opposite two surfaces and be electrically insulated from.

Preferably, the thin film sensor further includes a periphery circuit, which is electrically connected the first nanometer metal Conductive layer and the second nanometer metal conducting layer.

Preferably, a hard conating (HC) is further included on the first nanometer metal conducting layer, the second nanometer metal conducting layer On further include a barrier layer (passivation).

Preferably, further including a protective layer on the first nanometer metal conducting layer or on the second nanometer metal conducting layer (Primer)。

Preferably, the thin film sensor include a film and one be attached at the film transfer transparent conductive film.

Preferably, further including a bonding layer, wherein the bonding layer is set on the flexible touch-control sensing component.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is located at the bonding layer and this can Between flexible touch-control sensing component.

Preferably, further including a residual release layer being set on the flexible touch-control sensing component.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is located at the flexible touch-control sense It surveys on component or the pliability electrode assembly is located between the flexible touch-control sensing component and the release layer.

Preferably, the pliability electrode assembly is formed in the nanometer metal conducting layer on the film with a film and one.

Preferably, the nanometer metal conducting layer includes a nanometer silver wire layer and a coating layer (OC).

Preferably, further included on the nanometer metal conducting layer barrier layer (passivation), protective layer (Primer) or Hard conating (HC).

The utility model embodiment provides a flexible cover board；One flexible touch-control sensing element, the flexible touch-control sense Surveying has a bonding layer between element and the pliability cover board；And a shielding layer, the shielding layer are at least covered in the pliability A part of touch sensor.

Preferably, it includes that a film layer and one are set to the masking of the film layer that this, which has the flexible cover board of decoration functions, Layer.

Preferably, the flexible touch-control sensing component is a thin film sensor (film sensor).

Preferably, the thin film sensor is formed in the nanometer metal conducting layer on the film with a film and one.

Preferably, further including: a flexible electrode assembly, wherein the nanometer metal conducting layer is located at the one first of the film Surface, the pliability electrode assembly are located at a second surface of the film.

Preferably, the nanometer metal conducting layer includes a nanometer silver wire layer and a coating layer (OC).

Preferably, further including a barrier layer (passivation) or protective layer (Primer) on the nanometer metal conducting layer.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is located at the nanometer metallic conduction On layer, which is electrically insulated from the nanometer metal conducting layer.

Preferably, the thin film sensor has a film and is formed in the one first nanometer gold on opposite two surfaces of the film Belong to conductive layer and one second nanometer metal conducting layer.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is located at the first nanometer metal On conductive layer, which is electrically insulated from the first nanometer metal conducting layer, the pliability electrode assembly Between the first nanometer metal conducting layer and the bonding layer.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is located at the second nanometer metal On conductive layer, which is electrically insulated from the first nanometer metal conducting layer.

Preferably, the first nanometer metal conducting layer and the second nanometer metal conducting layer respectively include a nanometer silver wire layer An and coating layer (OC).

Preferably, the nanometer silver wire layer is electrically connected a periphery circuit, which covers the periphery circuit.

Preferably, a hard conating (HC) is further included on the first nanometer metal conducting layer, the second nanometer metal conducting layer On further include a barrier layer (passivation).

Preferably, further including a protective layer on the first nanometer metal conducting layer or on the second nanometer metal conducting layer (Primer)。

Preferably, the thin film sensor has a first film；One is formed in the first nanometer metal on the first film Conductive layer；One second film and one be formed in the second nanometer metal conducting layer on second film, the first film and this Two films are bonded to each other, and the first nanometer metal conducting layer and the second nanometer metal conducting layer face opposite direction.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is located at the first nanometer metal On conductive layer, which is electrically insulated from the first nanometer metal conducting layer, the pliability electrode assembly Between the first nanometer metal conducting layer and the bonding layer.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is led with the second nanometer metal Electric layer is located at opposite two surfaces of second film and is electrically insulated from.

Preferably, the thin film sensor further includes a periphery circuit, which is electrically connected the first nanometer metal Conductive layer and the second nanometer metal conducting layer, the shielding layer cover the periphery circuit.

Preferably, a hard conating (HC) is further included on the first nanometer metal conducting layer, the second nanometer metal conducting layer On further include a barrier layer (passivation).

Preferably, further including a protective layer on the first nanometer metal conducting layer or on the second nanometer metal conducting layer (Primer)。

Preferably, the thin film sensor include a film and one be attached at the film transfer transparent conductive film.

Preferably, further include first release layer remained on the flexible touch-control sensing component, wherein this first from Type layer is located between the flexible touch-control sensing component and the bonding layer.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly be located at first release layer and Between the flexible touch-control sensing component.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is located at the flexible touch-control sense It surveys on component or the pliability electrode assembly is located between the flexible touch-control sensing component and the bonding layer.

Preferably, the pliability electrode assembly is formed in the nanometer metal conducting layer on the film with a film and one.

Preferably, the nanometer metal conducting layer includes a nanometer silver wire layer and a coating layer (OC).

Preferably, further included on the nanometer metal conducting layer barrier layer (passivation), protective layer (Primer) or Hard conating (HC).

The utility model embodiment provides a kind of for being transferred to nonplanar touch panel, comprising: one has decoration function The flexible cover board of energy；One flexible touch-control sensing element, the flexible touch-control sensing element with this there are decoration functions can Flexible cover board is directly to contact.

Preferably, it includes that a film layer and one are set to the masking of the film layer that this, which has the flexible cover board of decoration functions, Layer.

Preferably, the flexible touch-control sensing component is a thin film sensor (film sensor).

Preferably, the thin film sensor is formed in the nanometer metal conducting layer on the film with a film and one, this is thin Film with this there is the film layer of the flexible cover board of decoration functions to directly fit.

Preferably, further including: a flexible electrode assembly, wherein the nanometer metal conducting layer is located at the one first of the film Surface, the second surface that there is the film layer of the flexible cover board of decoration functions to be located at the film, the pliability electrode Component is located on the nanometer metal conducting layer, which is electrically insulated from the nanometer metal conducting layer.

Preferably, the nanometer metal conducting layer includes a nanometer silver wire layer and a coating layer (OC).

Preferably, further including a barrier layer (passivation) or protective layer (Primer) on the nanometer metal conducting layer.

Preferably, the thin film sensor has a film and is formed in the one first nanometer gold on opposite two surfaces of the film Belong to conductive layer and one second nanometer metal conducting layer.

Preferably, further including: a flexible electrode assembly, wherein the first nanometer metal conducting layer has decoration function with this The film layer of the flexible cover board of energy directly fits, which is located on the second nanometer metal conducting layer, The pliability electrode assembly is electrically insulated from the second nanometer metal conducting layer.

Preferably, the first nanometer metal conducting layer and the second nanometer metal conducting layer respectively include a nanometer silver wire layer An and coating layer (OC).

Preferably, the nanometer silver wire layer is electrically connected a periphery circuit, which covers the periphery circuit.

Preferably, a hard conating (HC) is further included on the first nanometer metal conducting layer, the second nanometer metal conducting layer On further include a barrier layer (passivation).

Preferably, further including a protective layer on the first nanometer metal conducting layer or on the second nanometer metal conducting layer (Primer)。

Preferably, the thin film sensor has a first film；One is formed in the first nanometer metal on the first film Conductive layer；One second film and one be formed in the second nanometer metal conducting layer on second film, the first film and this Two films are bonded to each other, and the first nanometer metal conducting layer and the second nanometer metal conducting layer face opposite direction.

Preferably, further including: a flexible electrode assembly, wherein the first nanometer metal conducting layer has decoration function with this The film layer of the flexible cover board of energy directly fits, which is located on the second nanometer metal conducting layer, The pliability electrode assembly is electrically insulated from the second nanometer metal conducting layer.

Preferably, the thin film sensor further includes a periphery circuit, which is electrically connected the first nanometer metal Conductive layer and the second nanometer metal conducting layer, the shielding layer cover the periphery circuit.

Preferably, a hard conating (HC) is further included on the first nanometer metal conducting layer, the second nanometer metal conducting layer On further include a barrier layer (passivation).

Preferably, further including a protective layer on the first nanometer metal conducting layer or on the second nanometer metal conducting layer (Primer)。

Preferably, the thin film sensor include a film and one be attached at the film transfer transparent conductive film.

Preferably, further including: a flexible electrode assembly, wherein the flexible touch-control sensing component, which is located at this, has decoration Between the flexible cover board of function and the pliability electrode assembly.

Preferably, the pliability electrode assembly is formed in the nanometer metal conducting layer on the film with a film and one.

Preferably, the nanometer metal conducting layer includes a nanometer silver wire layer and a coating layer (OC).

Preferably, further included on the nanometer metal conducting layer barrier layer (passivation), protective layer (Primer) or Hard conating (HC).

The utility model embodiment provides a kind of for being transferred to nonplanar touch panel, comprising: one has decoration function The flexible cover board of energy；One flexible touch-control sensing element, the flexible touch-control sensing element with this there are decoration functions can There is a bonding layer between flexible cover board.

Preferably, it includes that a film layer and one are set to the masking of the film layer that this, which has the flexible cover board of decoration functions, Layer.

Preferably, the flexible touch-control sensing component is a thin film sensor (film sensor).

Preferably, the thin film sensor is formed in the nanometer metal conducting layer on the film with a film and one.

Preferably, further including: a flexible electrode assembly, wherein the nanometer metal conducting layer is located at the one first of the film Surface, the pliability electrode assembly are located at a second surface of the film.

Preferably, the nanometer metal conducting layer includes a nanometer silver wire layer and a coating layer (OC).

Preferably, further including a barrier layer (passivation) or protective layer (Primer) on the nanometer metal conducting layer.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is located at the nanometer metallic conduction On layer, which is electrically insulated from the nanometer metal conducting layer.

Preferably, the thin film sensor has a film and is formed in the one first nanometer gold on opposite two surfaces of the film Belong to conductive layer and one second nanometer metal conducting layer.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is located at the first nanometer metal On conductive layer, which is electrically insulated from the first nanometer metal conducting layer, the pliability electrode assembly Between the first nanometer metal conducting layer and the bonding layer.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is located at the second nanometer metal On conductive layer, which is electrically insulated from the first nanometer metal conducting layer.

Preferably, the first nanometer metal conducting layer and the second nanometer metal conducting layer respectively include a nanometer silver wire layer An and coating layer (OC).

Preferably, the nanometer silver wire layer is electrically connected a periphery circuit, which covers the periphery circuit.

Preferably, a hard conating (HC) is further included on the first nanometer metal conducting layer, the second nanometer metal conducting layer On further include a barrier layer (passivation).

Preferably, further including a protective layer on the first nanometer metal conducting layer or on the second nanometer metal conducting layer (Primer)。

Preferably, the thin film sensor has a first film；One is formed in the first nanometer metal on the first film Conductive layer；One second film and one be formed in the second nanometer metal conducting layer on second film, the first film and this Two films are bonded to each other, and the first nanometer metal conducting layer and the second nanometer metal conducting layer face opposite direction.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is located at the first nanometer metal On conductive layer, which is electrically insulated from the first nanometer metal conducting layer, the pliability electrode assembly Between the first nanometer metal conducting layer and the bonding layer.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is led with the second nanometer metal Electric layer is located at opposite two surfaces of second film and is electrically insulated from.

Preferably, the thin film sensor further includes a periphery circuit, which is electrically connected the first nanometer metal Conductive layer and the second nanometer metal conducting layer, the shielding layer cover the periphery circuit.

Preferably, a hard conating (HC) is further included on the first nanometer metal conducting layer, the second nanometer metal conducting layer On further include a barrier layer (passivation).

Preferably, further including a protective layer on the first nanometer metal conducting layer or on the second nanometer metal conducting layer (Primer)。

Preferably, the thin film sensor include a film and one be attached at the film transfer transparent conductive film.

Preferably, further include first release layer remained on the flexible touch-control sensing component, wherein this first from Type layer is located between the flexible touch-control sensing component and the bonding layer.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly be located at first release layer and Between the flexible touch-control sensing component.

Preferably, further including: a flexible electrode assembly, wherein the pliability electrode assembly is located at the flexible touch-control sense It surveys on component or the pliability electrode assembly is located between the flexible touch-control sensing component and the bonding layer.

Preferably, the pliability electrode assembly is formed in the nanometer metal conducting layer on the film with a film and one.

Preferably, the nanometer metal conducting layer includes a nanometer silver wire layer and a coating layer (OC).

Preferably, further included on the nanometer metal conducting layer barrier layer (passivation), protective layer (Primer) or Hard conating (HC).

The utility model embodiment provides a kind of production method of touch sensing, comprising: S1: forming one first release layer In on a first substrate；S2: a flexible touch-control sensing element is formed on first release layer；S3: a second substrate is formed Have on the flexible touch-control sensing element, and between the flexible touch-control sensing element and the second substrate one second release Layer；S4: the first substrate is removed using first release layer.

The utility model embodiment provides a kind of production method of touch panel, comprising: S1: formed one first release layer in On one first substrate；S2: a flexible touch-control sensing element is formed on first release layer；S3: formed a second substrate in On the flexible touch-control sensing element, and it is release with one second between the flexible touch-control sensing element and the second substrate Layer；S4: the first substrate is removed using first release layer；S5: it is flexible with decoration functions that one is attached using a bonding layer Property cover board on the flexible touch-control sensing element, and the bonding layer is located at the flexible cover board with decoration functions and this can Between flexible touch sensor；And S6: the second substrate is removed using second release layer.

The utility model embodiment provides a kind of production method of touch panel, comprising: S1: formed one first release layer in On one first substrate；S2: a shielding layer and a flexible touch-control sensing element are formed on first release layer, the shielding layer is extremely It is covered in a part of the flexible touch-control sensing element less；S3: a second substrate is formed in the flexible touch-control sensing element On, and there is one second release layer between the flexible touch-control sensing element and the second substrate；S4: first release layer is utilized Remove the first substrate；S5: a flexible cover board is attached on the flexible touch-control sensing element using a bonding layer, and this connects Layer is closed to be located between the pliability cover board and the flexible touch-control sensing element；And S6: using second release layer remove this Two substrates.

The utility model embodiment provides a kind of production method of touch panel, comprising: S1: formed one first release layer in On one first substrate；S2: a flexible cover board with decoration functions is formed on first release layer；S3: it is flexible to form one Property touch sensor is on the flexible cover board with decoration functions；S4: a second substrate is formed in the flexible touch-control On sensing element, and there is one second release layer between the flexible touch-control sensing element and the second substrate；S5: using this One release layer removes the first substrate；S6: the second substrate is removed using second release layer.

Touch sensing and its touch panel provided by the utility model, will be flexible by the supporting role of first substrate Touch sensor is formed on release layer, then is acted on by the reprinting of the second substrate, can be by flexible touch-control sensing element It is attached on any non-planar and curved surface cover board, the touch panel being thusly-formed is lighter, thin, and cost of manufacture is lower.In addition, Flexible touch-control sensing element uses the thin film sensor comprising nanometer metal conducting layer, since nanometer silver wire itself has well Flexible resistance, therefore touch sensing provided by the utility model, touch panel can be used for flexible touch-control and curved surface touch-control. In addition, the material due to bonding layer can be the active ink layer (Reactive ink) with viscosity, there is no need to increase one newly Layer optical adhesive layer or gelatine layer can directly will be release after touch panel attach in any nonplanar target base plate, can So that having good optical characteristics, such as high-penetration rate and low haze while touch panel is more frivolous.

Touch sensing provided by the utility model, touch panel and preparation method thereof, by the flexible electrode of setting one Component makes touch sensing provided by the utility model and touch panel have the electrode group of multilayer (two layers, three layers or more) Part makes touch sensing provided by the utility model, touch surface to realize more diverse sensing function or electro-magnetic screen function Plate is under conditions of lighter and thinner, with more the competitive advantage of product.

Detailed description of the invention

Figure 1A~Fig. 1 D is the flow chart of the production method of an embodiment of the present invention touch sensing.

Fig. 1 E is another concrete structure schematic diagram for the touch sensing that an embodiment of the present invention production method is formed.

Fig. 1 F is the another concrete structure schematic diagram for the touch sensing that an embodiment of the present invention production method is formed.

Fig. 1 G is the another concrete structure schematic diagram for the touch sensing that an embodiment of the present invention production method is formed.

Fig. 2A~Fig. 2 F is the concrete structure schematic diagram of the film sensor of an embodiment of the present invention.

Fig. 3 A~Fig. 3 F is the flow chart of the production method of another embodiment of the utility model touch panel.

Fig. 3 G is another concrete structure schematic diagram of the touch panel of an embodiment of the present invention.

Fig. 3 H is the another concrete structure schematic diagram of the touch panel of an embodiment of the present invention.

Fig. 4 A~Fig. 4 F is the flow chart of the production method of another embodiment of the utility model touch panel.

Fig. 4 G is another concrete structure schematic diagram of the touch panel of an embodiment of the present invention.

Fig. 4 H is the another concrete structure schematic diagram of the touch panel of an embodiment of the present invention.

Fig. 5 A~Fig. 5 F is the flow chart of the production method of another embodiment of the utility model touch panel.

Fig. 5 G is another concrete structure schematic diagram of the touch panel of an embodiment of the present invention.

Specific embodiment

The utility model is described in further detail with specific embodiment with reference to the accompanying drawing.

The utility model is described in further detail with specific embodiment with reference to the accompanying drawing.

The utility model disclosure may use duplicate component symbol in different embodiments, not represent difference There is association between embodiment or schema.In addition, it may include that two components directly connect that a component, which is formed in "above" or "below" another component, The embodiment of touching, or also may include the embodiment that other additional assemblies are folded between two components.Various assemblies may be with any Different proportion is shown so that illustrative clarity is succinct.Note that the utility model disclosure " the first ", " the second " etc. be only Facilitate and illustrate manufacture craft, with quantity or put in order it is unrelated, such as " the first release layer " or " the second release layer " can be managed Solution is release layer.

Figure 1A~Fig. 1 D is the flow chart of the production method of an embodiment of the present invention touch sensing.Wherein Fig. 1 D is also For the concrete structure schematic diagram for the touch sensing that an embodiment of the present invention production method is formed.

Please also refer to Figure 1A, firstly, providing first substrate 100, and the first release layer 110 is formed on first substrate 100. First substrate 100 can be used as the mechanical support of structure formed in subsequent step, can be as manufacture touch sensing 10 temporary platform and subsequent touch sensing 10 can be removed from the first substrate 100.First substrate 100 can be for one thoroughly Bright or opaque insulating materials, such as a glass substrate or flexible base plate.Due to first substrate 100 do not constitute it is finally formed A part of touch panel product, so the material of advantage of lower cost can be used in first substrate 100, as long as it can provide necessity Mechanical support.For example, element glass can be used rather than chemically reinforced glass in first substrate 100, to reduce touch panel Cost of manufacture, can also be formed using the flexible materials such as plastics or resin, such as polycarbonate (PC), polymethyl methacrylate (PMMA), the polyester materials such as polyethylene terephthalate (PET) and polyether sulfone (PES), polyimide (PI), fiber The materials such as plain ester, benzocyclobutene (BCB), polyvinyl chloride (PVC) and acrylic resin.In addition, first substrate 100 it is subsequent from After removing on touch sensing 10, recycling can also be repeated, in this way, cost of manufacture can be further decreased.It is worth noting , first substrate 100 is not limited to the flexible base boards such as glass, plastics or resin, and can be other any can provide machinery The suitable material of support.The film layer that first release layer 110 is made of the material with release ability.Institute here and below That states release refers to first substrate 100 from the other layers to fit together with its script not on (such as first release layer 110) It removes, or first substrate is other from the other layers to fit together with 110 script of the first release layer together with the first release layer 110 Upper removal.The material of first release layer 110 can be organic material, such as polyimides (PI), polypropylene (PP), polystyrene (PS), acrylonitrile-butadiene-styrene (ABS) (ABS), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polycarbonate (PC), polyethylene (PE), polymethyl methacrylate (PMMA), polytetrafluoroethylene (PTFE) (PTFE), cyclic olefine copolymer (COP, ) or aforementioned combination Arton.First release layer 110 solution coating can be used to reheat baking method and be formed in first substrate 100 On, the suitable method of vapour deposition process, RTR or other also can be used and form or directly adopt the pressing of 110 dry film of the first release layer In on first substrate 100.In implementing one, the first release layer 110 can be adhered to first substrate by removable adhesive On 100.The removable adhesive may include water-insoluble glue or can be dissolved together and then two layers of temporary adhesive attachment Or any other suitable material being otherwise removed to.It can be by the way that removable adhesive be dissolved, to realize the One substrate 100 is removed completely from the first release layer 110 or part removes.Preferably, the first release layer 110 is also possible to by upper Layer has the material of release ability and lower layer does not have the film layer that the material of release ability is constituted.Here the first release layer 110 upper layer refers to be referred to and close first base with the surface far from the first substrate 100, the lower layer of the first release layer 110 The surface of plate 100.Therefore when the first release layer 110 is that there is the material of release ability and lower layer not to have release ability on upper layer When material, so that it may which first substrate 100 fits together from 110 script of the first release layer together with the first release layer 110 Other layers Shang not remove.If first substrate 100 and the first release layer 110 are removed simultaneously, touch sensing 10 can be made There is good optical characteristics, such as high-penetration rate and low haze while more frivolous.

Then, it please refers to Figure 1B, forms flexible touch-control sensing component 120 on the first release layer 110, and first is release Layer 110 is between first substrate 100 and flexible touch-control sensing component 120.The flexible touch-control sensing component 120 is one thin Film sensors (film sensor), may include a film and one be attached at the film transfer transparent conductive film.Film Sensor (film sensor) be it is flexible or deformable, i.e., thin film sensor (film sensor) is dynamically or permanently Ground is formed as curved shape.

Then, it please refers to Fig. 1 C, forms a second substrate 150 on the flexible touch-control sensing component 120, and this is flexible Property touch-control sensing component 120 and the second substrate 150 between there is one second release layer 140.Second release layer 140 and first from The material of type layer 110 is the film layer that there is the material of release ability to be constituted, but the chemical constituent of the two can be identical or not Together.The material of the second substrate 150 and first substrate 100 can be identical or different, and the second substrate 150 can pass through the second release layer 140 remove the second substrate 150 from the other layers to fit together with its script not (such as first release layer 110), or will The second substrate 150 does not move up from the other layers to fit together with 140 script of the second release layer together with the second release layer 140 It removes.In this embodiment, the second substrate 150 as carrying is used, therefore can the second substrate 150 be referred to as bearing substrate, in material Selection on the preferable film material of support strength, therefore also referred to as carrier film (carrier film) can be selected.

Then, Fig. 1 D is please referred to, removes the first substrate 100 using first release layer 110.Remove first substrate 100 Think that the touch sensing 10, which is transferred to any nonplanar target base plate, prepares, which can be pliability Cover board or curved surface cover board, the curved surface cover board can be rigid, semi-rigid, flexible or deformable.The curved rigid surfaces substrate can be forever Be formed as curved surface long.It is that semi-rigid, the flexible and deformable surface substrate is dynamically formed as curved surface and do not formed For curved surface.The chemicals of such as hydrogen fluoride can be used and removed first substrate 100 by means of chemical etching.Alternatively, can be by First substrate 100 is removed in mechanical means or combinatorial chemistry-mechanical means.Preferably, can be by first substrate 100 and first Release layer 110 removes simultaneously, has good optical characteristics while touch sensing 10 can be made more frivolous, such as high Penetrance and low haze.In the step of removing first substrate 100 using first release layer 110, first release layer 110 It can remain on flexible touch-control sensing component 120.

Fig. 1 E is another specific structure signal for the touch sensing 10 that an embodiment of the present invention production method is formed Figure.In one embodiment, C referring to Fig.1 please be cooperate, also comprising a flexible electrode assembly 124 in the touch sensing 10, wherein Flexible electrode assembly 124 may be disposed between the flexible touch-control sensing component 120 and first release layer 110.Work as utilization When first release layer 110 removes first substrate 100, flexible electrode assembly 124 is exposed to outer (or flexible electrode assembly Remain the first release layer 110 on 124), it is any the touch sensing 10 of an embodiment of the present invention can be transferred to one Nonplanar target base plate is prepared.Alternatively, flexible electrode assembly 124 also may be disposed at flexible touch-control sensing component 120 The (not shown) between second release layer 140.It will be appreciated that flexible electrode assembly 124 and flexible touch-control sensing group Part 120 is electrically insulated from, and flexible electrode assembly 124 is illustrated see in hereinafter.

Fig. 1 F is another specific structure signal for the touch sensing 10 that an embodiment of the present invention production method is formed Figure.In one embodiment, C referring to Fig.1 please be cooperate, also include a bonding layer 160 in the touch sensing 10, wherein the bonding layer 160 are set between the flexible touch-control sensing component 120 and first release layer 110.When by first substrate 100 and first from When type layer 110 removes simultaneously, the bonding layer 160 be exposed to it is outer, since bonding layer 160 has viscosity, can directly by The touch sensing 10 attaches in any nonplanar target base plate after release.The material of the bonding layer 160 can for The active ink layer (Reactive ink) of viscosity, can't shadow due to removing the first release layer 110 from active ink layer The viscosity for ringing active ink layer, there is no need to newly-increased one layer of optical adhesive layer or gelatine layer can directly will release after touch-control biography Sensor 10 attaches in any nonplanar target base plate.The target base plate can be flexible cover board or curved surface cover board, the song Surface cover can be rigid, semi-rigid, flexible or deformable.The curved rigid surfaces substrate can be permanently formed as curved surface.It should Semi-rigid, flexible and deformable surface substrate is dynamically formed as curved surface and being not formed as curved surface.

Fig. 1 G is another specific structure signal for the touch sensing 10 that an embodiment of the present invention production method is formed Figure.In one embodiment, C referring to Fig.1 please be cooperate, also comprising bonding layer 160 and flexible electrode group in the touch sensing 10 Part 124, wherein bonding layer 160 and flexible electrode assembly 124 may be disposed at the flexible touch-control sensing component 120 and this first Between release layer 110, flexible electrode assembly 124 may be disposed at the flexible touch-control sensing component 120 and the bonding layer 160 it Between, bonding layer 160 is set between flexible electrode assembly 124 and first release layer 110, flexible electrode assembly 124 with Flexible touch-control sensing component 120 is mutually to be electrically insulated.When being removed first substrate 100 using the first release layer 110, connect The touch sensing 10 of an embodiment of the present invention is transferred to one using above description outside being exposed to by conjunction layer 160 What nonplanar target base plate.Alternatively, bonding layer 160 is set to flexible touch-control sensing component 120 and first release layer 110 Between, and flexible electrode assembly 124 then may be disposed between flexible touch-control sensing component 120 and second release layer 140 (not shown).

The touch sensing 10 as shown in Fig. 1 D to Fig. 1 G is ultimately formed via above-mentioned steps.Such as Fig. 1 D, to illustrate top After being assembled into touch control display for touch sensing 10, user touch and observe place, touch sensing 10 include by The flexible touch-control sensing component 120 of upper and lower stacking, the second release layer 140 (note that herein " the second " only for convenience of saying Bright above-mentioned manufacture craft, with quantity or put in order it is unrelated, therefore can referred to as and be interpreted as release layer) and the second substrate 150 is (i.e. Bearing substrate).Such as Fig. 1 E, be after touch sensing 10 is assembled into touch control display with diagram top, user touch and Observation place, touch sensing 10 include flexible electrode assembly 124, the flexible touch-control sensing component from top to bottom stacked 120, the second release layer 140 (with above-mentioned, can referred to as and be interpreted as release layer) and the second substrate 150 (i.e. bearing substrate).Such as Fig. 1 F is after touch sensing 10 is assembled into touch control display with diagram top, and user touches and observe place, touch-control Sensor 10 include the bonding layer 160 from top to bottom stacked, flexible touch-control sensing component 120, the second release layer 140 (i.e. from Type layer) and the second substrate 150 (i.e. bearing substrate).Such as Fig. 1 G, touch-control is assembled into for touch sensing 10 with diagram top and is shown After showing device, user touches and observes place, and touch sensing 10 includes the bonding layer 160, flexible from top to bottom stacked Property electrode assembly 124, flexible touch-control sensing component 120, the second release layer 140 (i.e. release layer) and the second substrate 150 are (i.e. Bearing substrate).Detailed construction, material, the production method of former components have been described above, therefore details are not described herein.Touch-control It is electric, wearable that sensor 10 can be applied to computer system, mobile phone, digital media player, tablet computer, ultra-thin pen In the touch control display apparatus such as touch device, vehicle-mounted touch-control system.In the touch sensing 10 shown in Fig. 1 D to Fig. 1 G, further include One be set on the flexible touch-control sensing component 120 residual release layer (it is i.e. above-mentioned using the first release layer 110 remove this Remaining first release layer 110 of institute in the step of one substrate 100), residual release layer can be used in processing procedure transfer process protecting Flexible touch-control sensing component 120.

A referring to figure 2., Fig. 2A are the concrete structure schematic diagrams of the film sensor of an embodiment of the present invention.One In embodiment, thin film sensor has a film 121 and one is formed in nanometer metal conducting layer 122 on the film 121.This how Rice metal conducting layer 122 includes an a nanometer silver wire layer 122a and coating layer (OC, overcoat) 122b, coating layer (OC) 122b The durability of nanometer silver wire layer 122a can be improved.The forming method of the thin film sensor can for using the coating of such as strip, Net coating, printing, lamination or RTR (roll to roll) the more nanometer metals of deposition distribution in a fluid on film 121 Nanometer wire screen network layers are formed on the substrate and making the fluid drying in line, then by nanometer wire grill pattern layers Form nanometer metal conducting layer 122.In addition surface preparation first can also be carried out to film 121, then sunk to preferably receive Long-pending nanometer metal wire.The surface preparation of film 121 is capable of providing multiple functions.For example, it can make nanometer metal wire equal Even deposition is to more preferably be fixed on film 121.Coating layer (OC) can be by optically transparent polymeric matrices (matrix) material Material is formed, and polymer substrate includes but is not limited to: such as polymethacrylates (such as polymethyl methacrylate), polypropylene The polyacrylics of acid esters and polyacrylonitrile, polyvinyl alcohol, polyester are (for example, polyethylene terephthalate (PET), poly- naphthalene Dicarboxylic acid esters and polycarbonate), the polymer with high-aromaticity of such as phenoplasts or cresol/formaldehyde, polystyrene, Polyvinyl-toluene, polyvinyl dimethylbenzene, polyimides, polyamide, polyamide-imides, polyetherimide, polysulfide Object, polysulfones, polyphenylene, polyphenylene oxide, polyurethane (PU), epoxy, polyolefin (such as polypropylene, polymethylpentene and cyclenes Hydrocarbon), acrylonitrile-butadiene-styrene copolymer (ABS), cellulose, silicone and other siliceous polymer (such as poly- sesquialter Siloxanes and polysilane), polyvinyl chloride (PVC), poly- acetic acid esters, polynorbornene, synthetic rubber (such as EPR, SBR, EPDM), Fluoropolymer (such as polyvinylidene fluoride, polytetrafluoroethylene (PTFE) (TFE) or polyhexafluoropropylene), fluoroolefins and hydrocarbon alkene are (for example) Copolymer and amorphous fluorocarbon polymer or copolymer.

In one embodiment, a barrier layer (passivation) or protective layer are further included on the nanometer metal conducting layer 122 (Primer) 130, i.e., barrier layer (passivation) or protective layer (Primer) 130 be located at nanometer metal conducting layer 122 with Between first release layer 110.Nanometer metal conducting layer 122 can also be formed directly into barrier layer (passivation) or protection On layer (Primer) 130.The barrier layer (passivation) or protective layer (Primer) 130 are generally flexible, including but not It is limited to: polyester, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polymethyl methacrylate (PMMA), acrylic resin, polycarbonate (PC), polystyrene, triacetate (TAG), polyvinyl alcohol, polyvinyl chloride, poly- inclined Dichloroethylene, polyethylene, ethylene-vinyl acetate copolymer, polyvinylbutyral, metal ion-cross-linked ethylene-methacrylic acid Copolymer, polyurethane, glassine paper, polyolefin etc.；It is particularly preferred that intensity higher PET, PC, PMMA or TAC.

B referring to figure 2., Fig. 2 B are another concrete structure schematic diagrams of the film sensor of an embodiment of the present invention. In one embodiment, the thin film sensor have a film 121 and one be formed in the film 121 opposite two surfaces one first Nanometer metal conducting layer 122 and one second nanometer metal conducting layer 123.The first nanometer metal conducting layer 122 includes a nanometer A silver wire layer 122a and coating layer (OC) 122b, the second nanometer metal conducting layer 123 comprising a nanometer silver wire layer 123a and Nanometer silver wire layer 122a and nanometer silver can be improved in one coating layer (OC) 123b, coating layer (OC) 122b and coating layer (OC) 123b The durability of line layer 123a.A periphery circuit can be electrically connected in nanometer silver wire layer 122a and nanometer silver wire layer 123a (not indicated in figure), thin film sensor to be connect by FPC (flexible circuit board) with external circuit, the nanometer silver wire layer 122a is electrically insulated from nanometer silver wire layer 123a, can be respectively used to receive the control signal of external circuit and transmission sensing Signal returns external circuit, to provide the function of touch-control sensing.The forming method of the thin film sensor can be to utilize such as strip Coating, net coating, printing, lamination or the RTR more nanometer metals of deposition distribution in a fluid on the upper surface of film 121 Nanometer wire screen network layers are formed on the substrate and making the fluid drying in line, then by nanometer wire grill pattern layers Form the first nanometer metal conducting layer 122.Then the more nanometer gold of deposition distribution in a fluid on the lower surface of film 121 Belong to line, nanometer wire screen network layers are formed on the substrate and making the fluid drying, then by nanometer wire grill layer pattern Change and forms the second nanometer metal conducting layer 123.In addition surface preparation first can also be carried out to film 121, to preferably receive The nanometer metal wire then deposited.The surface preparation of film 121 is capable of providing multiple functions.For example, it can make nanometer golden Belong to line uniformly to deposit more preferably to be fixed on film 121.Coating layer (OC) can be by optically transparent polymer matrix material It is formed, polymer substrate includes but is not limited to: such as polymethacrylates (such as polymethyl methacrylate), polyacrylic acid The polyacrylics of ester and polyacrylonitrile, polyvinyl alcohol, polyester are (for example, polyethylene terephthalate (PET), poly- naphthalene two Formic acid esters and polycarbonate), it is the polymer with high-aromaticity of such as phenoplasts or cresol/formaldehyde, polystyrene, poly- Vinyltoluene, polyvinyl dimethylbenzene, polyimides, polyamide, polyamide-imides, polyetherimide, polysulfide, Polysulfones, polyphenylene, polyphenylene oxide, polyurethane (PU), epoxy, polyolefin (such as polypropylene, polymethylpentene and cycloolefin), third Alkene nitrile-butadiene-styrene copolymer (ABS), cellulose, silicone and other siliceous polymer (such as polysilsesquioxane And polysilane), it is polyvinyl chloride (PVC), poly- acetic acid esters, polynorbornene, synthetic rubber (such as EPR, SBR, EPDM), fluorine-containing poly- Close object (such as polyvinylidene fluoride, polytetrafluoroethylene (PTFE) (TFE) or polyhexafluoropropylene), the copolymerization of fluoroolefins and hydrocarbon alkene (for example) Object and amorphous fluorocarbon polymer or copolymer.

It in one embodiment, include a hard conating (HC, hardcoat) 170 on the first nanometer metal conducting layer 122, this A barrier layer (passivation) or protective layer (Primer) 130 are further included on two nanometer metal conducting layers 123.Hard conating (HC) refer to that offer prevents the coating scraped and the additional surface of abrasion is protected, including but not limited to: polyacrylate, asphalt mixtures modified by epoxy resin The synthetic polymer of rouge, polyurethane, polysilane, silicone, poly- (Si acrylate) etc..Preferably, hard conating (HC) also includes glue Body silica.The thickness of hard conating (HC) is about 1 to 50 μm.The barrier layer (passivation) is generally flexible, including but not It is limited to: polyester, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polymethyl methacrylate (PMMA), acrylic resin, polycarbonate (PC), polystyrene, triacetate (TAG), polyvinyl alcohol, polyvinyl chloride, poly- inclined Dichloroethylene, polyethylene, ethylene-vinyl acetate copolymer, polyvinylbutyral, metal ion-cross-linked ethylene-methacrylic acid Copolymer, polyurethane, glassine paper, polyolefin etc.；It is particularly preferred that intensity higher PET, PC, PMMA or TAC.Implement one It can also include a protective layer on the first nanometer metal conducting layer 122 or the second nanometer metal conducting layer 123 in example (Primer) 130, i.e. barrier layer (passivation) and the hard conating (HC) 170 could alternatively be protective layer (Primer) 130 or merge use, formed to the surface to the first nanometer metal conducting layer 122 or the second nanometer metal conducting layer 123 Protection, prevents its oxidation by air, protects it from standby scraping and abrasion.

In one embodiment, C, Fig. 2 C are another tools of the film sensor of an embodiment of the present invention referring to figure 2. Body structural schematic diagram.The thin film sensor has the first film 121 and the first nanometer being formed on 121 on the first film gold Belong to conductive layer 122 and the second film 121 ' and the second nanometer metal conducting layer 123 being formed on second film 121 '.This One film 121 is bonded to each other with second film 121 ', the first nanometer metal conducting layer 122 and the second nanometer metallic conduction Layer 123 faces opposite direction or the first nanometer metal conducting layer 122 and faces phase with the second nanometer metal conducting layer 123 It is equidirectional to be bonded.Alternatively, can be by the first film 121 and first on nanometer metal conducting layer 122 and the second film 121 ' It is bonded in the same direction with the second nanometer metal conducting layer 123, in other words, the first nanometer metal conducting layer 122 is formed from 121 first surface (such as upper surface) on the first film, the second nanometer metal conducting layer 123 form in the of the second film 121 ' One surface (such as upper surface), and the second surface that the second nanometer metal conducting layer 123 is fitted on the first film 121 is (as follows Surface) to constitute the thin film sensor.The forming method of the thin film sensor can apply to be coated, being netted using such as strip It covers, print, being laminated or the RTR more nanometer metal wires of deposition distribution in a fluid on the first film 121, by making the fluid It dries and nanometer wire screen network layers is formed on the substrate, then nanometer wire grill pattern layers are formed into the first nanometer metal Conductive layer 122.Then the more nanometer metal wires of deposition distribution in a fluid on the second film 121 ', by keeping the fluid dry It is dry and nanometer wire screen network layers are formed on the substrate, then nanometer wire grill pattern layers are formed into the second nanometer metal and are led Electric layer 123.The first film 121 is bonded with second film 121 ' by an adhesion layer 180 later, adhesion layer 180 It can be transparent optical cement either glue.In addition it is pre- surface first can also to be carried out to the first film 121 and the second film 121 ' Processing, to preferably receive the nanometer metal wire then deposited.The surface of the first film 121 and the second film 121 ' is located in advance Reason is capable of providing multiple functions.For example, it can be such that nanometer metal wire uniformly deposits to more preferably be fixed on the first film 121 And second on film 121 '.The thin film sensor further includes a periphery circuit (not indicating in figure), which electrically connects Connect the first nanometer metal conducting layer 122 and the second nanometer metal conducting layer 123.The periphery circuit can be (flexible by FPC Circuit board) it is connect with external circuit, to realize the connection of the thin film sensor and external circuit.

It in one embodiment, include a hard conating (HC) 170, second nanometer gold on the first nanometer metal conducting layer 122 Belong to and further includes a barrier layer (passivation) or protective layer (Primer) 130 on conductive layer 123.Hard conating (HC), which refers to, to be mentioned For prevent scrape and wear additional surface protection coating, including but not limited to: polyacrylate, epoxy resin, polyurethane, The synthetic polymer of polysilane, silicone, poly- (Si acrylate) etc..Preferably, hard conating (HC) also includes colloidal silica.It is hard to apply The thickness of layer (HC) is about 1 to 50 μm.The barrier layer (passivation) is generally flexible, including but not limited to: polyester, Polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polymethyl methacrylate (PMMA), acrylic acid tree Rouge, polycarbonate (PC), polystyrene, triacetate (TAG), polyvinyl alcohol, polyvinyl chloride, polyvinylidene chloride, polyethylene, Ethylene-vinyl acetate copolymer, polyvinylbutyral, metal ion-cross-linked ethylene-methacrylic acid copolymer, polyurethane, glass Glass paper, polyolefin etc.；It is particularly preferred that intensity higher PET, PC, PMMA or TAC.In one embodiment, first nanometer It can also include one or protective layer (Primer) on metal conducting layer 122 or the second nanometer metal conducting layer 123, i.e., this is blocked Layer (passivation) or protective layer (Primer) 130 with the hard conating (HC) 170 can be replaced or merge use, use Protection is formed with the surface to the first nanometer metal conducting layer 122 or the second nanometer metal conducting layer 123, prevents it by air Oxidation protects it from standby scraping and abrasion.

Also comprising flexible electrode assembly 124, the pliability electrode in the touch sensing of an embodiment of the present invention Component 124 can be located on the flexible touch-control sensing component 120 or the pliability electrode assembly 124 can be located at the pliability Between touch-control sensing component 120 and the second release layer 140, the particular content of touch sensing will be detailed below.

D referring to figure 2., Fig. 2 D are the concrete structure schematic diagrams of the film sensor of an embodiment of the present invention, with The difference of Fig. 2A is, also comprising a flexible electrode assembly 124.Please arrange in pairs or groups Fig. 1 E, in one embodiment, flexible electrode group Part 124 may be disposed on the flexible touch-control sensing component 120.Specifically, flexible electrode assembly 124 forms in pliability On the nanometer metal conducting layer 122 of touch-control sensing component 120, preferably, flexible electrode assembly 124 is sensed with flexible touch-control The nanometer metal conducting layer 122 of component 120 is electrically insulated from, for example, flexible electrode assembly 124 is sensed with flexible touch-control The two is set to be electrically insulated using coating layer (OC) 122b between the nanometer metal conducting layer 122 of component 120, it specifically, can The thickness for increasing coating layer (OC) 122b, makes the nanometer silver wire layer 122a of nanometer metal conducting layer 122 be embedded in coating layer (OC) In 122b and along in-plane (i.e. perpendicular to thickness direction) extend, make nanometer metal conducting layer 122 have plane (i.e. perpendicular to Thickness direction) electric conductivity, without generate with the electric conductivity of thickness parallel direction, therefore will not be set to nanometer metallic conduction Pliability electrode assembly 124 on layer 122 forms the circuit of conducting；Or flexible electrode assembly 124 and flexible touch-control sense Survey between the nanometer metal conducting layer 122 of component 120 both makes to be electrically insulated using protective layer 130, and protective layer 130 can be with Hard conating (HC) or barrier layer (passivation) or other insulating layers are replaced or are applied in combination.

Flexible electrode assembly 124 be it is flexible or deformable, can dangler component 124 dynamically or permanently Ground is formed as curved shape.The detailed content of flexible electrode assembly 124 can refer to flexible touch-control sensing component 120, change Yan Zhi, flexible electrode assembly 124 can equally have a film 121 and one is formed in nanometer metal conducting layer on film 121 122, nanometer metal conducting layer 122 includes an a nanometer silver wire layer 122a and coating layer (OC) 122b.Preferably, the nanometer metal A barrier layer (passivation), protective layer (Primer) 130 or hard conating (HC) are further included on conductive layer 122.However, can The nanometer metal conducting layer 122 of dangler component 124 can not patterned (such as etching step), therefore flexible electrode assembly 124 nanometer metal conducting layer 122 can comprehensively flood be coated with, and make flexible electrode assembly 124 as a shielding electric signal Electrode layer to reach the protection of electromagnetism interference (EMI), and then promotes the effect of antinoise.Alternatively, flexible electrode assembly 124 Nanometer metal conducting layer 122 also can by patterning (such as etching step) and have sensing function, such as sense capacitance become Change, sense pressure, the convex-concave surface for sensing object etc..In addition, in one embodiment, can refer to above-mentioned production thin film sensor Forming method make flexible electrode assembly 124, be initially formed film 121 on protective layer 130, re-forming nanometer silver wire layer 122a and coating layer (OC) 122b, to constitute flexible electrode assembly 124.Or referring to above-mentioned side directly on protective layer 130 Method forms nanometer silver wire layer 122a and coating layer (OC) 122b, to constitute flexible electrode assembly 124.Or directly in pliability Coating layer (OC) 122b of touch-control sensing component 120 it is upper referring to the above method sequentially form film 121, nanometer silver wire layer 122a and Coating layer (OC) 122b, to constitute flexible electrode assembly 124.Or directly in the coating of flexible touch-control sensing component 120 (OC) 122b is upper sequentially forms nanometer silver wire layer 122a and coating layer (OC) 122b referring to the above method for layer, electric to constitute pliability Pole component 124.

Flexible electrode assembly 124 also can be a membrane-electrode assemblies, may include a film and one to be attached at this thin Film transfers transparent conductive film.In one embodiment, film can be initially formed on protective layer 130, then electrically conducting transparent can be transferred Film is attached on the film.Or attaching can transfer transparent conductive film directly on protective layer 130, to constitute flexible electrode Component 124.

Alternatively, flexible electrode assembly 124 also may be disposed at flexible touch-control sensing component 120 and second release layer Between 140.For example, flexible electrode assembly 124 forms on the film 121 of flexible touch-control sensing component 120, it is specific and Speech.The first surface (such as upper surface) of the film 121 of flexible touch-control sensing component 120 is formed with flexible touch-control sensing group The nanometer metal conducting layer 122 of part 120, and the second surface of the film 121 of flexible touch-control sensing component 120 (such as following table Face) it is formed with flexible electrode assembly 124, flexible electrode assembly 124 is located at the film of flexible touch-control sensing component 120 Between 121 and second release layer 140.In one embodiment, it can refer to the forming method of above-mentioned production thin film sensor to make Make flexible electrode assembly 124, be initially formed film 121 on the lower surface of the film 121 of flexible touch-control sensing component 120, Nanometer silver wire layer 122a and coating layer (OC) 122b is re-formed, to constitute flexible electrode assembly 124.Or directly in pliability Nanometer silver wire layer 122a and coating layer (OC) are formed referring to the above method on the lower surface of the film 121 of touch-control sensing component 120 122b, to constitute flexible electrode assembly 124.

E referring to figure 2., Fig. 2 E are the concrete structure schematic diagrams of the film sensor of an embodiment of the present invention, with The difference of Fig. 2 B is, also comprising a flexible electrode assembly 124.Please arrange in pairs or groups Fig. 1 E, in one embodiment, flexible electrode group Part 124 may be disposed on the flexible touch-control sensing component 120.Specifically, flexible electrode assembly 124 form in first how On rice metal conducting layer 122, using hard conating between flexible electrode assembly 124 and the first nanometer metal conducting layer 122 (HC) 170 both make to be electrically insulated, and hard conating (HC) 170 can with barrier layer or protective layer (Primer) 130 or other absolutely Edge layer is replaced or is applied in combination.

Alternatively, flexible electrode assembly 124 also may be disposed at flexible touch-control sensing component 120 and second release layer Between 140.For example, flexible electrode assembly 124 form in the second nanometer metal conducting layer 123 and second release layer 140 it Between, preferably, making the two electricity using protective layer 130 between flexible electrode assembly 124 and the second nanometer metal conducting layer 123 Property insulation, and protective layer 130 can be replaced or be applied in combination with hard conating (HC) or barrier layer or other insulating layers.Fig. 2 E it Embodiment can refer to above-mentioned way, not repeat in this.

F referring to figure 2., Fig. 2 F are the concrete structure schematic diagrams of the film sensor of an embodiment of the present invention, with The difference of Fig. 2 C is, also comprising a flexible electrode assembly 124.Please arrange in pairs or groups Fig. 1 E, in one embodiment, flexible electrode group Part 124 may be disposed on the flexible touch-control sensing component 120.Specifically, to form in first thin for flexible electrode assembly 124 On the first nanometer metal conducting layer 122 on film 121 and be electrically insulated from, for example, flexible electrode assembly 124 and first how The two is set to be electrically insulated using hard conating (HC) 170 between rice metal conducting layer 122, and hard conating (HC) 170 can use resistance Exhausted layer or protective layer (Primer) or other insulating layers are replaced or are applied in combination.

Alternatively, flexible electrode assembly 124 also may be disposed at flexible touch-control sensing component 120 and second release layer Between 140.For example, the upper surface that flexible electrode assembly 124 forms in the second film 121 ' (forms the second nanometer metal to lead The apparent surface of electric layer 123), in other words, flexible electrode assembly 124 is located at the second nanometer metal conducting layer 123 Opposite two surfaces of second film 121 '；Alternatively, flexible electrode assembly 124 also can shape in the second nanometer metal conducting layer On 123.Preferably, using protective layer (Primer) between flexible electrode assembly 124 and the second nanometer metal conducting layer 123 130 make the two be electrically insulated, and protective layer (Primer) 130 can be taken with hard conating (HC) or barrier layer or other insulating layers In generation, is applied in combination.The embodiment of Fig. 2 F can refer to above-mentioned way, not repeat in this.

It in one embodiment, also include a bonding layer 260 in touch sensing please also refer to Fig. 3 G, wherein flexible electricity Pole component 224 may be disposed between the flexible touch-control sensing component 220 and bonding layer 260, in other words, bonding layer 260 with can Dangler component 224 can carry out reasonably combining and arranging in the touch sensing of the utility model, and the specific practice can Reference is explained later.

Fig. 3 A~Fig. 3 F is the flow chart of the production method of another embodiment touch panel of the utility model.Wherein Fig. 3 F is also For the concrete structure schematic diagram for the touch panel that another embodiment production method of the utility model is formed.

Please also refer to Fig. 3 A, firstly, providing first substrate 200, and the first release layer 210 is formed on first substrate 200. First substrate 200 can be used as the mechanical support of structure formed in subsequent step, can be as manufacture touch panel 20 Temporary platform and subsequent touch panel 20 can be removed from the first substrate 200.First substrate 200 can for one it is transparent or Opaque insulating materials, such as a glass substrate or flexible base plate.Since first substrate 200 does not constitute finally formed touch-control A part of 20 product of panel, so the material of advantage of lower cost can be used in first substrate 200, as long as its can provide it is necessary Mechanical support.For example, element glass can be used rather than chemically reinforced glass in first substrate 200, to reduce touch panel 20 Cost of manufacture, can also be formed using the flexible materials such as plastics or resin, such as polycarbonate (PC), polymethyl methacrylate (PMMA), the polyester materials such as polyethylene terephthalate (PET) and polyether sulfone (PES), polyimide (PI), fiber The materials such as plain ester, benzocyclobutene (BCB), polyvinyl chloride (PVC) and acrylic resin.In addition, first substrate 200 it is subsequent from After removing on touch panel 20, recycling can also be repeated, in this way, cost of manufacture can be further decreased.It is noticeable It is that first substrate 200 is not limited to the flexible base boards such as glass, plastics or resin, can be other any can provide mechanical branch The suitable material of support.The film layer that first release layer 210 is made of the material with release ability.It is described here and below It is release refer to first substrate 200 is moved up from the other layers to fit together with its script not (such as first release layer 210) Remove, or by first substrate and the first release layer 210 together from the other layers to fit together with 210 script of the first release layer not on It removes.The material of first release layer 210 can be organic material, such as polyimides (PI), polypropylene (PP), polystyrene (PS), acrylonitrile-butadiene-styrene (ABS) (ABS), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polycarbonate (PC), polyethylene (PE), polymethyl methacrylate (PMMA), polytetrafluoroethylene (PTFE) (PTFE), cyclic olefine copolymer (COP, ) or aforementioned combination Arton.First release layer 210 solution coating can be used to reheat baking method and be formed in first substrate 200 On, the suitable method of vapour deposition process, RTR or other also can be used and form or directly adopt the pressing of 210 dry film of the first release layer In on first substrate 200.In implementing one, the first release layer 210 can be adhered to first substrate by removable adhesive On 200.The removable adhesive may include water-insoluble glue or can be dissolved together and then two layers of temporary adhesive attachment Or any other suitable material being otherwise removed to.It can be by the way that removable adhesive be dissolved, to realize the One substrate 200 is removed completely from the first release layer 210 or part removes.Preferably, the first release layer 210 is also possible to by upper Layer has the material of release ability and lower layer does not have the film layer that the material of release ability is constituted.Here the first release layer 210 upper layer refers to the surface far from the first substrate 200, and the lower layer of the first release layer 210 refers to close to the first substrate 200 Surface.Therefore when the first release layer 210 is the material that there is the material of release ability and lower layer not to have release ability on upper layer When, so that it may by first substrate 200 and the first release layer 210 together from fit together with 210 script of the first release layer its Its layer Shang not remove.If first substrate 200 and the first release layer 210 are removed simultaneously, touch panel 20 can be made more light There is good optical characteristics, such as high-penetration rate and low haze while thin.

Then, B referring to figure 3. forms flexible touch-control sensing component 220 on the first release layer 210, and first is release Layer 210 is between first substrate 200 and flexible touch-control sensing component 220.The flexible touch-control sensing component 220 is one thin Film sensors (film sensor), may include a film and one be attached at the film transfer transparent conductive film.Film Sensor (film sensor) be it is flexible or deformable, i.e., thin film sensor (film sensor) is dynamically or permanently Ground is formed as curved shape.Film sensor in the present embodiment is also possible to the film sensor described with previous embodiment Structure having the same, i.e., the film sensor disclosed in aforementioned implementation can operate in the present embodiment, thus no longer into Row repeats.

Then, C referring to figure 3. forms a second substrate 250 on the flexible touch-control sensing component 220, and this is flexible Property touch-control sensing component 220 and the second substrate 250 between there is one second release layer 240.Second release layer 240 and first from The material of type layer 210 is the film layer that there is the material of release ability to be constituted, but the chemical constituent of the two can be identical or not Together.The material of the second substrate 250 and first substrate 200 can be identical or different, and the second substrate 250 can pass through the second release layer 240 remove the second substrate 250 from the other layers (such as first release layer 240) to fit together with its script, or by Two substrates 250 and the second release layer 240 Shang not removed from the other layers to fit together with 240 script of the second release layer together.

Then, D referring to figure 3. utilizes first release layer 210 to remove the first substrate 200.Remove first substrate 200 Think that the touch panel 20, which is transferred to any nonplanar target base plate, prepares, which can be flexible lid Plate or curved surface cover board, the curved surface cover board can be rigid, semi-rigid, flexible or deformable.The curved rigid surfaces substrate can be permanent Ground is formed as curved surface.It is that semi-rigid, the flexible and deformable surface substrate is dynamically formed as curved surface and be not formed as Curved surface.The chemicals of such as hydrogen fluoride can be used and removed first substrate 200 by means of chemical etching.Alternatively, can be by means of Mechanical means or combinatorial chemistry-mechanical means remove first substrate 200.Preferably, can by first substrate 200 and first from Type layer 210 removes simultaneously, has good optical characteristics, such as high-penetration while touch panel 20 can be made more frivolous Rate and low haze.

Then, E referring to figure 3. attaches a flexible cover board 270 with decoration functions in this using a bonding layer 260 On flexible touch-control sensing component 220, and the bonding layer 260 is located at the pliability cover board 270 and the flexible touch-control sensing group Between part 220.It regard flexible cover board 270 as target base plate, after removing first substrate 200, which is shifted To the flexible cover board 270 as target base plate.Between the pliability cover board 270 and the flexible touch-control sensing component 220 Fitting can be by the way that the bonding layer 260 to be attached on the flexible cover board 270 with decoration functions, then will be pasted with this There is this of bonding layer 260 flexible cover board 270 of decoration functions to be attached on the flexible touch-control sensing component 220, this connects Close layer 260 material can for viscosity active ink layer (Reactive ink), be also possible to ordinary optical glue-line or Gelatine layer.Being bonded between the pliability cover board 270 and the flexible touch-control sensing component 220 is also possible to be formed the bonding layer 260 between the flexible touch-control sensing component 220 and first release layer 210.When by first substrate 200 and the first release layer 210 when removing simultaneously, the bonding layer 260 be exposed to it is outer, can directly will be release since bonding layer 260 has viscosity The touch panel 20 attaches on the flexible cover board 270 with decoration functions afterwards.The material of the bonding layer 260 can be tool Sticking active ink layer (Reactive ink), can't due to removing the first release layer 210 from active ink layer The viscosity for influencing active ink layer, there is no need to newly-increased one layer of optical adhesive layer or gelatine layer can directly will be release after the touch-control Panel 20 attaches in any nonplanar target base plate, has while touch panel 20 can be made more frivolous good Optical characteristics, such as high-penetration rate and low haze.Flexible cover board 270 with decoration functions includes a film layer 271 and one It is set to the shielding layer 272 of the film layer 271.Shielding layer 272 is located at at least side of film layer 271, to cover object-line Road, so that signal conductor is not easy to be easily seen by the user from the side of flexible 270 upper surface of cover board.In one embodiment, it hides The lower surface that layer 272 is located at film layer 271 is covered, namely positioned at film layer 271 adjacent to the one of flexible touch-control sensing component 220 Face.In another embodiment, shielding layer 272 can be located at the upper surface of film layer 271, namely be located at film layer 271 relative to can The another side of flexible touch-control sensing component 220.Or in other embodiments, shielding layer 272 can also be a decoration coating (Deco-film), which includes specifically a transparent membrane, and the neighboring area of the transparent membrane is provided with masking The decoration coating, can be directly arranged at the upper surface of flexible cover board 270 by layer.The material of shielding layer 272 can be coloured oil The combination of black, coloured photoresist or aforementioned the two.Shielding layer 272 can be single layer structure or composite lamainated structure, and single layer structure is for example Black ink layer；The stacked structure of composite lamainated structure such as ink layer and photoresist layer, white ink layer and black ink layer Stacked structure, white ink layer, black ink layer and stacked structure of photoresist layer etc..The pliability cover board 270 can be curved surface Or it is deformable.The pliability cover board 270 can be permanently formed as curved surface be also dynamically formed as curved surface and do not formed For curved surface.The pliability cover board 270 can be formed using flexible materials such as plastics or resins, such as polycarbonate (PC), poly- first The polyester materials such as base methyl acrylate (PMMA), polyethylene terephthalate (PET) and polyether sulfone (PES), poly- sub- acyl The materials such as amine (PI), cellulose esters, benzocyclobutene (BCB), polyvinyl chloride (PVC) and acrylic resin.

Then, F referring to figure 3. utilizes second release layer 240 to remove the second substrate 250.Such as hydrogen fluoride can be used Chemicals the second substrate 250 is removed by means of chemical etching.Alternatively, can be by means of mechanical means or combinatorial chemistry-machinery Method removes the second substrate 250.Preferably, the second substrate 250 and the second release layer 240 can be removed simultaneously, can make Touch panel 20 it is more frivolous while there is good optical characteristics, such as high-penetration rate and low haze.

Touch panel 20 as illustrated in Figure 3 F is ultimately formed via above-mentioned steps.It is that user touches and sees with diagram top Survey face, touch panel 20 include the flexible cover board 270 with decoration functions from top to bottom stacked, bonding layer 260 and can Flexible touch-control sensing component 220.Detailed construction, material, the production method of former components have been described above, therefore herein no longer It repeats.Touch panel 20 can be applied to computer system, mobile phone, digital media player, tablet computer, ultra-thin pen In the touch control display apparatus such as electric, wearable touch device, vehicle-mounted touch-control system.

Also comprising flexible electrode assembly 224, the pliability electrode in the touch panel 20 of an embodiment of the present invention Component 224 can be located on the flexible touch-control sensing component 220 or the pliability electrode assembly 224 can be located at the pliability Between touch-control sensing component 220 and bonding layer 260, the particular content of touch panel 20 will be detailed below.

Fig. 3 G is another concrete structure schematic diagram for the touch panel 20 that the utility model production method is formed.Implement one In example, also comprising a flexible electrode assembly 224 in the touch panel 20, wherein flexible electrode assembly 224 may be disposed at this Between flexible touch-control sensing component 220 and bonding layer 260, flexible electrode assembly 224 and flexible touch-control sensing component 220 It is electrically insulated from.The specific practice and structure of flexible electrode assembly 224 can refer to above, and details are not described herein.Flexible Property electrode assembly 224 as shielding electric signal electrode layer when, since the touch panel 20 of one of the utility model embodiment exists After being assembled with display module (not shown), flexible cover board 270 is the interface of user's touching, therefore flexible electrode group Part 224 can prevent the noise of external environment from bringing touching between flexible touch-control sensing component 220 and external environment Control the electromagnetic interference of induction module.

Fig. 3 H is another concrete structure schematic diagram for the touch panel 20 that the utility model production method is formed.Implement one In example, also comprising a flexible electrode assembly 224 in the touch panel 20, wherein flexible electrode assembly 224 may be disposed at this On flexible touch-control sensing component 220, in other words, flexible touch-control sensing component 220 is located at flexible electrode assembly 224 and connects It closes between layer 260.In electrode layer of the flexible electrode assembly 224 as shielding electric signal, since one of the utility model is real The touch panel 20 of example is applied after being assembled with display module (not shown), flexible electrode assembly 224 can be between display Between module and flexible touch-control sensing component 220, therefore the electromagnetic interference between two modules can be prevented.

In another embodiment, also respectively in the top of flexible touch-control sensing component 220 under in the touch panel 20 Side's setting flexible electrode assembly 224, therefore in flexible electrode assembly 224 as the shape of the electrode layer of shielding electric signal Under condition, the electromagnetic interference of the brought touch-control sensing module of the noise of external environment can be prevented, display module and touch-control can be also prevented Electromagnetic interference between induction module.

Fig. 4 A~Fig. 4 F is the flow chart of the production method of another embodiment touch panel of the utility model.Wherein Fig. 4 F is also For the concrete structure schematic diagram for the touch panel that another embodiment production method of the utility model is formed.

Please also refer to Fig. 4 A, firstly, providing first substrate 300, and the first release layer 310 is formed on first substrate 300. First substrate 300 can be used as the mechanical support of structure formed in subsequent step, can be as manufacture touch panel 30 Temporary platform and subsequent touch panel 30 can be removed from the first substrate 300.First substrate 300 can for one it is transparent or Opaque insulating materials, such as a glass substrate or flexible base plate.Since first substrate 300 does not constitute finally formed touch-control A part of 30 product of panel, so the material of advantage of lower cost can be used in first substrate 300, as long as its can provide it is necessary Mechanical support.For example, element glass can be used rather than chemically reinforced glass in first substrate 300, to reduce touch panel 30 Cost of manufacture, can also be formed using the flexible materials such as plastics or resin, such as polycarbonate (PC), polymethyl methacrylate (PMMA), the polyester materials such as polyethylene terephthalate (PET) and polyether sulfone (PES), polyimide (PI), fiber The materials such as plain ester, benzocyclobutene (BCB), polyvinyl chloride (PVC) and acrylic resin.In addition, first substrate 300 it is subsequent from After removing on touch panel 30, recycling can also be repeated, in this way, cost of manufacture can be further decreased.It is noticeable It is that first substrate 300 is not limited to the flexible base boards such as glass, plastics or resin, can be other any can provide mechanical branch The suitable material of support.The film layer that first release layer 310 is made of the material with release ability.It is described here and below It is release refer to first substrate 300 is moved up from the other layers to fit together with its script not (such as first release layer 310) Remove, or by first substrate and the first release layer 310 together from the other layers to fit together with 310 script of the first release layer not on It removes.The material of first release layer 310 can be organic material, such as polyimides (PI), polypropylene (PP), polystyrene (PS), acrylonitrile-butadiene-styrene (ABS) (ABS), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polycarbonate (PC), polyethylene (PE), polymethyl methacrylate (PMMA), polytetrafluoroethylene (PTFE) (PTFE), cyclic olefine copolymer (COP, ) or aforementioned combination Arton.First release layer 310 solution coating can be used to reheat baking method and be formed in first substrate 300 On, the suitable method of vapour deposition process, RTR or other also can be used and form or directly adopt the pressing of 310 dry film of the first release layer In on first substrate 300.In implementing one, the first release layer 310 can be adhered to first substrate by removable adhesive On 300.The removable adhesive may include water-insoluble glue or can be dissolved together and then two layers of temporary adhesive attachment Or any other suitable material being otherwise removed to.It can be by the way that removable adhesive be dissolved, to realize the One substrate 300 is removed completely from the first release layer 310 or part removes.Preferably, the first release layer 310 is also possible to by upper Layer has the material of release ability and lower layer does not have the film layer that the material of release ability is constituted.Here the first release layer 310 upper layer refers to be referred to and close first base with the surface far from the first substrate 300, the lower layer of the first release layer 310 The surface of plate 300.Therefore when the first release layer 310 is that there is the material of release ability and lower layer not to have release ability on upper layer When material, so that it may which first substrate 300 fits together from 310 script of the first release layer together with the first release layer 310 Other layers Shang not remove.If first substrate 300 and the first release layer 310 are removed simultaneously, touch panel 30 can be made more There is good optical characteristics, such as high-penetration rate and low haze while adding frivolous.

Then, B referring to figure 4., one forms flexible touch-control sensing component 320 and a shielding layer 330 in the first release layer On 310, which is at least covered in a part of the flexible touch-control sensing component 320, to cover periphery circuit, So that signal conductor is not easy to be easily seen by the user.In one embodiment, which is by being printed in the flexible touch-control The colored materials of sensing component 220 are formed.The material of shielding layer 330 can be the group of colored ink, coloured photoresist or aforementioned the two It closes.Shielding layer 330 is one to be printed in chromonic layer on the flexible touch-control sensing component 220, can for single layer structure or Composite lamainated structure, single layer structure such as black ink layer；The stacked structure of composite lamainated structure such as ink layer and photoresist layer, White ink layer and the stacked structure of black ink layer, white ink layer, black ink layer and the stacked structure of photoresist layer etc..Or In other embodiments, shielding layer 330 can also be a decoration coating (Deco-film) to person, which is specifically to include One transparent membrane is provided with shielding layer in the neighboring area of the transparent membrane, which can be directly arranged at flexible The upper surface of property touch-control sensing component 320.The flexible touch-control sensing component 320 is a thin film sensor (film sensor), Its may include a film and one be attached at the film transfer transparent conductive film.Thin film sensor (film sensor) is Flexible or deformable, i.e. thin film sensor (film sensor) dynamically or is permanently formed as curved shape.This Film sensor in embodiment is also possible to the film sensor structure having the same described with previous embodiment, i.e., aforementioned Film sensor disclosed in implementation can operate in the present embodiment, therefore no longer be repeated.

Then, C referring to figure 4. forms a second substrate 350 on the flexible touch-control sensing component 320, and this is flexible Property touch-control sensing component 320 and the second substrate 350 between there is one second release layer 340.Second release layer 340 and first from The material of type layer 310 is the film layer that there is the material of release ability to be constituted, but the chemical constituent of the two can be identical or not Together.The material of the second substrate 350 and first substrate 300 can be identical or different, and the second substrate 350 can pass through the second release layer 340 remove the second substrate 350 from the other layers to fit together with its script not (such as first release layer 310), or will The second substrate 350 does not move up from the other layers to fit together with 340 script of the second release layer together with the second release layer 340 It removes.

Then, D referring to figure 4. utilizes first release layer 310 to remove the first substrate 300.Remove first substrate 300 Think that the touch panel 30, which is transferred to any nonplanar target base plate, prepares, which can be flexible lid Plate or curved surface cover board, the curved surface cover board can be rigid, semi-rigid, flexible or deformable.The curved rigid surfaces substrate can be permanent Ground is formed as curved surface.It is that semi-rigid, the flexible and deformable surface substrate is dynamically formed as curved surface and be not formed as Curved surface.The chemicals of such as hydrogen fluoride can be used and removed first substrate 300 by means of chemical etching.Alternatively, can be by means of Mechanical means or combinatorial chemistry-mechanical means remove first substrate 300.Preferably, can by first substrate 300 and first from Type layer 310 removes simultaneously, has good optical characteristics, such as high-penetration while touch panel 30 can be made more frivolous Rate and low haze.

Then, E referring to figure 4. attaches a flexible cover board 370 using a bonding layer 360 and senses in the flexible touch-control On component 320, and the bonding layer 360 is located between the pliability cover board 370 and the flexible touch-control sensing component 320.It will Flexible cover board 370 is used as target base plate, and after removing first substrate 300, which is transferred to as target base plate Flexible cover board 370.Being bonded can be between the pliability cover board 370 and the flexible touch-control sensing component 320 passes through The bonding layer 360 is attached on the pliability cover board 370, then the pliability cover board 370 of the bonding layer 30 will be pasted with and pasted It invests on the flexible touch-control sensing component 320 and the shielding layer 330, the material of the bonding layer 360 can be for viscosity Active ink layer (Reactive ink), is also possible to ordinary optical glue-line or gelatine layer.The pliability cover board 370 is flexible with this Property touch-control sensing component 320 between fitting be also possible to be formed the bonding layer 360 in the flexible touch-control sensing component 320 with Between first release layer 310.When removing first substrate 300 and the first release layer 310 simultaneously, the bonding layer 360 is exposed In outer, since bonding layer 360 has viscosity, can directly will be release after touch panel 30 attach to pliability and cover On plate 370.The material of the bonding layer 360 can be the active ink layer (Reactive ink) with viscosity, due to by first Release layer 310 removes the viscosity that can't influence active ink layer from active ink layer, and there is no need to increase one layer of optical cement newly Layer or gelatine layer can directly will be release after touch panel 30 attach in any nonplanar target base plate, can make There is good optical characteristics, such as high-penetration rate and low haze while touch panel 30 is more frivolous.The pliability cover board 370 can be curved surface or deformable.What the pliability cover board 370 can be permanently formed as curved surface is also dynamically formed as bent It is face and being not formed as curved surface.The pliability cover board 370 can be formed using flexible materials such as plastics or resins, such as poly- carbonic acid Polyester materials and the polyether sulfones such as ester (PC), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET) (PES), the materials such as polyimide (PI), cellulose esters, benzocyclobutene (BCB), polyvinyl chloride (PVC) and acrylic resin.

Then, F referring to figure 4. utilizes second release layer 340 to remove the second substrate 350.Such as hydrogen fluoride can be used Chemicals the second substrate 350 is removed by means of chemical etching.Alternatively, can be by means of mechanical means or combinatorial chemistry-machinery Method removes the second substrate 350.Preferably, the second substrate 450 and the second release layer 340 can be removed simultaneously, can make Touch panel 30 it is more frivolous while there is good optical characteristics, such as high-penetration rate and low haze.

Touch panel 30 as illustrated in figure 4f is ultimately formed via above-mentioned steps.It is that user touches and sees with diagram top Survey face, touch panel 30 include the flexible cover board 370, bonding layer 360 and the shielding layer 330 that from top to bottom stack and flexible Property touch-control sensing component 320, which is at least covered in a part of the flexible touch-control sensing component 320, and flexible Property touch-control sensing component 320 be exposed to outer, can be assembled with display module (not shown).The detailed construction of former components, Material, production method have been described above, therefore details are not described herein.Touch panel 30 can be applied to computer system, mobile electricity The touch-controls display dresses such as words, digital media player, tablet computer, ultra-thin pen electricity, wearable touch device, vehicle-mounted touch-control system In setting.

Also comprising flexible electrode assembly 324, the pliability electrode in the touch panel 30 of an embodiment of the present invention Component 324 can be located on the flexible touch-control sensing component 320 or the pliability electrode assembly 224 can be located at the pliability Between touch-control sensing component 320 and bonding layer 360, the particular content of touch panel 30 will be detailed below.

Fig. 4 G is another concrete structure schematic diagram for the touch panel 30 that the utility model production method is formed.Implement one In example, also comprising a flexible electrode assembly 324 in the touch panel 30, wherein flexible electrode assembly 324 may be disposed at this Between flexible touch-control sensing component 320 and bonding layer 360, in the present embodiment, which is to be printed in flexible electricity The chromonic layer of pole component 324, then the pliability electrode assembly 324 and flexible touch-control sensing of shielding layer 330 will be printed with Component 320 is bonded.Illustrating for shielding layer 330 can refer to above.Or shielding layer 330 is to be printed in flexible touch-control The chromonic layer of sensing component 320, then the flexible touch-control sensing component 320 and pliability electricity of shielding layer 330 will be printed with Pole component 324 is bonded.The above method makes shielding layer 330 form in flexible touch-control sensing component 320 and flexible electrode Between component 324.Next, bonding layer 360 can first be attached at the pliability cover board 370, then will be pasted with the bonding layer 360 it Flexible cover board 370 is attached on the pliability electrode assembly 324；Alternatively, the bonding layer 360 is set to flexible touch-control sensing Between component 320 and first release layer 310, more specifically, bonding layer 360 be first set to flexible electrode assembly 324 it Above and it is located at 310 lower section of the first release layer, then the first release layer 310 is removed, to expose bonding layer 360, and then will be flexible Cover board 370 is attached at bonding layer 360, to complete touch panel 30 shown in Fig. 4 G.

In one embodiment, shielding layer 330 is the upper surface for being printed in flexible electrode assembly 324, then pliability is touched Control sensing component 320 fits in the lower surface for being printed with the pliability electrode assembly 324 of shielding layer 330, accordingly, bonding layer 360 It can be first attached at the pliability cover board 370, then the pliability cover board 370 of the bonding layer 360 will be pasted with and be attached at the pliability On electrode assembly 324 and the shielding layer 330；Alternatively, the bonding layer 360 be set to flexible touch-control sensing component 320 and this Between one release layer 310, more specifically, bonding layer 360 be first set to flexible electrode assembly 324 and the shielding layer 330 it Above and it is located at 310 lower section of the first release layer, then the first release layer 310 is removed, to expose bonding layer 360, and then will be flexible Cover board 370 is attached at bonding layer 360, to complete touch panel 30.

In electrode layer of the flexible electrode assembly 324 as shielding electric signal, due to one of the utility model embodiment Touch panel 30 after being assembled with display module (not shown), flexible cover board 370 be user touching interface, Therefore flexible electrode assembly 324 can prevent external environment between flexible touch-control sensing component 320 and external environment The brought touch-control sensing module of noise electromagnetic interference.

Fig. 4 H is another concrete structure schematic diagram for the touch panel 30 that the utility model production method is formed.Implement one In example, also comprising a flexible electrode assembly 324 in the touch panel 30, wherein flexible electrode assembly 324 may be disposed at this On flexible touch-control sensing component 320, in other words, flexible touch-control sensing component 320 is located at flexible electrode assembly 324 and connects It closes between layer 360.Specific practice can be, formed flexible electrode assembly 324 in the flexible touch-control sensing component 320 and this Between two release layers 340, after removing the second release layer 340 with the second substrate 350, flexible electrode assembly 324 is just exposed In outer, flexible electrode assembly 324 can be assembled with display module (not shown) later.

In electrode layer of the flexible electrode assembly 324 as shielding electric signal, due to one of the utility model embodiment Touch panel 30 after being assembled with display module (not shown), flexible electrode assembly 324 can be between display module Between flexible touch-control sensing component 320, therefore the electromagnetic interference between two modules can be prevented.

In another embodiment, also respectively in the top of flexible touch-control sensing component 320 under in the touch panel 30 Side's setting flexible electrode assembly 324, therefore in flexible electrode assembly 324 as the shape of the electrode layer of shielding electric signal Under condition, the electromagnetic interference of the brought touch-control sensing module of the noise of external environment can be prevented, display module and touch-control can be also prevented Electromagnetic interference between induction module.

It will be appreciated that the touch panel 30 of embodiment shown in Fig. 4 F to Fig. 4 H, flexible touch-control sensing component 320 Structure can refer to foregoing teachings with specific method and be implemented.For example, flexible touch-control sensing group shown in cooperation Fig. 2 D The structure of part 120 cooperates the content of the present embodiment, that is, can be regarded as shielding layer 330 can be to form in nanometer metal conducting layer 122 Surface, the nanometer metal that flexible electrode assembly 124 (324) fits in flexible touch-control sensing component 120 is led again later Electric layer 122.

Fig. 5 A~Fig. 5 F is the flow chart of the production method of another embodiment touch panel of the utility model.Wherein Fig. 5 F is also For the concrete structure schematic diagram for the touch panel that another embodiment production method of the utility model is formed.

Please also refer to Fig. 5 A, firstly, providing first substrate 400, and the first release layer 410 is formed on first substrate 400. First substrate 400 can be used as the mechanical support of structure formed in subsequent step, can be as manufacture touch panel Temporary platform and subsequent touch panel can be removed from the first substrate 400.First substrate 400 can be transparent or impermeable for one Bright insulating materials, such as a glass substrate or flexible base plate.Since first substrate 400 does not constitute finally formed touch panel A part of product, so the material of advantage of lower cost can be used in first substrate 400, as long as it can provide necessary mechanicalness Support.For example, element glass can be used rather than chemically reinforced glass in first substrate 400, to reduce being fabricated to for touch panel This, can also be formed using the flexible materials such as plastics or resin, as polycarbonate (PC), polymethyl methacrylate (PMMA), The polyester materials such as polyethylene terephthalate (PET) and polyether sulfone (PES), polyimide (PI), cellulose esters, benzene And the materials such as cyclobutane (BCB), polyvinyl chloride (PVC) and acrylic resin.In addition, first substrate 400 is subsequent from touch surface After removing on plate, recycling can also be repeated, in this way, cost of manufacture can be further decreased.It is worth noting that, the first base Plate 400 is not limited to the flexible base boards such as glass, plastics or resin, can be other any suitable materials that can provide mechanical support Material.The film layer that first release layer 410 is made of the material with release ability.It is described here and below release to refer to First substrate 400 is not removed on (such as first release layer 410) from the other layers to fit together with its script, or by first Substrate and the first release layer 410 Shang not removed from the other layers to fit together with 410 script of the first release layer together.First from The material of type layer 410 can be organic material, such as polyimides (PI), polypropylene (PP), polystyrene (PS), acrylic nitrile-butadiene Styrene (ABS), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polycarbonate (PC), polyethylene (PE), polymethyl methacrylate (PMMA), polytetrafluoroethylene (PTFE) (PTFE), cyclic olefine copolymer (COP, Arton) or it is aforementioned it Combination.First release layer 410 solution coating can be used to reheat baking method and be formed on first substrate 400, and gas also can be used Phase sedimentation, RTR or other suitable method, which forms or directlys adopt 410 dry film of the first release layer, is pressed on first substrate 400 On.In implementing one, the first release layer 410 can be adhered on first substrate 400 by removable adhesive.This can be removed Formula adhesive may include water-insoluble glue or can together and then be dissolved two layers of temporary adhesive attachment or move in other ways Any other suitable material removed.It can be by the way that removable adhesive be dissolved, to realize first substrate 400 from first It is removed completely on release layer 410 or part removes.Preferably, the first release layer 410 is also possible to have release ability by upper layer Material and lower layer do not have the film layer that is constituted of material of release ability.Here the upper layer of the first release layer 410 refer to Surface far from the first substrate 400, the lower layer of the first release layer 410 refer to the surface with the close first substrate 400.Therefore When the first release layer 410 is that there is the material of release ability and lower layer not to have the material of release ability on upper layer, so that it may will First substrate 400 does not move up from the other layers to fit together with 410 script of the first release layer together with the first release layer 410 It removes.If first substrate 400 and the first release layer 410 are removed simultaneously, can to have while touch panel is more frivolous Good optical characteristics, such as high-penetration rate and low haze.

Then, B, formation one have the flexible cover board 430 of decoration functions on first release layer 410 referring to figure 5.. Flexible cover board 430 with decoration functions includes that a film layer 431 and one are set to the shielding layer 432 of the film layer 431.It hides At least side that layer 432 is located at film layer 431 is covered, to cover periphery circuit, so that signal conductor is from flexible cover board 430 The side on surface is not easy to be easily seen by the user.In one embodiment, shielding layer 432 is located at the lower surface of film layer 431, namely Positioned at film layer 431 adjacent to the one side of flexible touch-control sensing component 420.In another embodiment, shielding layer 432 can be located at thin The upper surface of film layer 431, namely the another side positioned at film layer 431 relative to flexible touch-control sensing component 420.Or at it In its embodiment, shielding layer 432 can also be a decoration coating (Deco-film), which includes specifically one transparent Film is provided with shielding layer in the neighboring area of the transparent membrane, which can be directly arranged to flexible cover board 430 upper surface.The material of shielding layer 432 can be the combination of colored ink, coloured photoresist or aforementioned the two.Shielding layer 432 can For single layer structure or composite lamainated structure, single layer structure such as black ink layer；Composite lamainated structure such as ink layer and photoresist The stacked structure of layer, the stacked structure of white ink layer and black ink layer, white ink layer, black ink layer and photoresist layer Stacked structure etc..The pliability cover board 430 can be curved surface or deformable.The pliability cover board 430 can be permanently formed as Curved surface is also dynamically formed as curved surface and being not formed as curved surface.The pliability cover board 430 can use plastics or tree The flexible materials such as rouge are formed, such as polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET) polyester materials and polyether sulfone (PES), polyimide (PI), cellulose esters, the benzocyclobutene (BCB), polychlorostyrene second such as The materials such as alkene (PVC) and acrylic resin.

Then, C referring to figure 5. forms flexible touch-control sensing component 420 in the flexible cover board with decoration functions On 430.Compared with the previous embodiments, there is due to the flexible touch-control sensing component 420 with this pliability of decoration functions Cover board 430 be directly contact, so when by first substrate 400 and the first release layer 410 removal when, due to flexible touch-control sense There is a flexible cover board 430 with decoration functions on component 420, therefore not needing again additionally will using one layer of bonding layer Flexible cover board 430 is bonded with flexible touch-control sensing component 420.It can make touch-control while saving one of processing procedure in this way Panel is more frivolous, and has good optical characteristics, such as high-penetration rate and low haze.The flexible touch-control sensing component 420 be a thin film sensor (film sensor), may include a film and one be attached at the film transfer transparent lead Electrolemma.Thin film sensor (film sensor) is pliability or deformable, i.e. thin film sensor (film sensor) is movable State or be permanently formed as curved shape, and the mode that can attach of thin film sensor directly with flexible cover board 430 into Row fitting, such as the film of thin film sensor can be directly fitted with the film layer 431 of flexible cover board 430.In the present embodiment Film sensor is also possible to the film sensor structure having the same described with previous embodiment, i.e., institute is public in aforementioned implementation The film sensor opened can operate in the present embodiment, therefore no longer be repeated.

Then, D referring to figure 5. forms a second substrate 550 on the flexible touch-control sensing component 520, and this is flexible Property touch-control sensing component 520 and the second substrate 550 between there is one second release layer 540.Second release layer 540 and first from The material of type layer 510 is the film layer that there is the material of release ability to be constituted, but the chemical constituent of the two can be identical or not Together.The material of the second substrate 550 and first substrate 500 can be identical or different, and the second substrate 550 can pass through the second release layer 540 remove the second substrate 550 from the other layers to fit together with its script not (such as first release layer 510), or will The second substrate 550 does not move up from the other layers to fit together with 540 script of the second release layer together with the second release layer 540 It removes.

Then, E referring to figure 5. utilizes first release layer 510 to remove the first substrate 500.Such as hydrogen fluoride can be used Chemicals first substrate 500 is removed by means of chemical etching.Alternatively, can be by means of mechanical means or combinatorial chemistry-machinery Method removes first substrate 200.Preferably, first substrate 200 and the first release layer 210 can be removed simultaneously, can make Touch panel it is more frivolous while there is good optical characteristics, such as high-penetration rate and low haze.

Then, F referring to figure 5. utilizes second release layer 540 to remove the second substrate 550.Such as hydrogen fluoride can be used Chemicals the second substrate 550 is removed by means of chemical etching.Alternatively, can be by means of mechanical means or combinatorial chemistry-machinery Method removes the second substrate 550.Preferably, the second substrate 550 and the second release layer 540 can be removed simultaneously, can make Touch panel it is more frivolous while there is good optical characteristics, such as high-penetration rate and low haze.

Touch panel 40 as illustrated in figure 5f is ultimately formed via above-mentioned steps.It is that user touches and sees with diagram top Survey face, touch panel 40 include the flexible cover board 430 from top to bottom stacked with decoration functions and flexible touch-control sensing Component 420, it is directly to contact which, which has the flexible cover board 430 of decoration functions with this,.It is aforementioned Detailed construction, material, the production method of each component have been described above, therefore details are not described herein.Touch panel 20 can be applied to Computer system, mobile phone, digital media player, tablet computer, ultra-thin pen electricity, wearable touch device, vehicle-mounted touching In the touch control display apparatus such as control system.

Also comprising flexible electrode assembly 424, the flexible touch-control in the touch panel 40 of an embodiment of the present invention Sensing component 420 can below will positioned at the pliability electrode assembly 424 between the flexible cover board 430 with decoration functions The particular content of touch panel 40 is described in detail.

Fig. 5 G is another concrete structure schematic diagram for the touch panel 40 that the utility model production method is formed.Implement one In example, also comprising a flexible electrode assembly 424 in the touch panel 40, wherein flexible electrode assembly 424 may be disposed at this On flexible touch-control sensing component 420, in other words, flexible touch-control sensing component 420 be located at flexible electrode assembly 424 with it is thin Between film layer 431.The specific practice can for formed flexible electrode assembly 424 in the flexible touch-control sensing component 420 and this Between two release layers 540, after removing the second release layer 540 with the second substrate 550, flexible electrode assembly 424 is just exposed In outer, flexible electrode assembly 424 can be assembled with display module (not shown) later.

A referring to figure 2., thin film sensor has a film 121 and one is formed in nanometer metallic conduction on the film 121 Layer 122, therefore in the present embodiment, which can be with the film layer 431 of the flexible cover board 430 with decoration functions It directly fits, and the preferable overlay masking layer 432 of film 121.In other words, which is located at the film 121 A first surface (such as lower surface), there is the film layer 431 of the flexible cover board 430 of decoration functions to be located at the film for this 212 second surface (such as upper surface), the pliability electrode assembly 424 are located on the nanometer metal conducting layer 122, this is flexible Property electrode assembly 424 is electrically insulated from the nanometer metal conducting layer 122.

B referring to figure 2., the first nanometer metal conducting layer 122 and this of the present embodiment have the flexible lid of decoration functions The film layer 431 of plate 430 directly fits, which is then located at the second nanometer metal conducting layer 123 On, which is electrically insulated from the second nanometer metal conducting layer 123.Preferably, the first nanometer is golden Belong to 122 overlay masking layer 432 of conductive layer.

C referring to figure 2., the first nanometer metal conducting layer 122 and this of the present embodiment have the flexible lid of decoration functions The film layer 431 of plate 430 directly fits, which is then located at the second nanometer metal conducting layer 123 On, which is electrically insulated from the second nanometer metal conducting layer 123.Preferably, the first nanometer is golden Belong to 122 overlay masking layer 432 of conductive layer.

In electrode layer of the flexible electrode assembly 424 as shielding electric signal, due to one of the utility model embodiment Touch panel 40 after being assembled with display module (not shown), flexible electrode assembly 424 can be between display module Between flexible touch-control sensing component 420, therefore the electromagnetic interference between two modules can be prevented.

Touch sensing provided by the utility model, touch panel and preparation method thereof are made by the support of first substrate It is formed on release layer with by flexible touch-control sensing component, then is acted on by the reprinting of the second substrate, pliability can touched Control sensing component is attached on any non-planar and curved surface cover board, and the touch panel being thusly-formed is lighter, thin, and cost of manufacture It is lower.In addition, flexible touch-control sensing component uses the thin film sensor comprising nanometer metal conducting layer, due to nanometer silver wire sheet Body has good flexible resistance, therefore touch sensing provided by the utility model, touch panel can be used for flexible touch-control And curved surface touch-control.In addition, the material due to bonding layer can be the active ink layer (Reactive ink) with viscosity, Without increase newly one layer of optical adhesive layer or gelatine layer can directly will be release after touch panel attach to any nonplanar mesh It marks on substrate, there is good optical characteristics, such as high-penetration rate and ground fog while touch panel can be made more frivolous Degree.

Touch sensing provided by the utility model and touch panel have the electrode group of multilayer (two layers, three layers or more) Part, the electrode assembly all have pliability, therefore are applicable to the attaching of plane or non-planar (such as surface with curvature) Surface, and the electrode assembly can should adjust its function because of different demands, to realize more diverse sensing function or electromagnetism Function of shielding, make touch sensing and touch panel provided by the utility model it is flexible, tool ductility under conditions of, have more The competitive advantage of product.In addition, touch sensing provided by the utility model and touch panel are because of the spy with flexible tool extension Property, therefore more it is applicable to bendable (bendable) display, folding (foldable) display or roll-type (rollable) display.

The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this Within the spirit and principle of invention, any modification, equivalent substitution, improvement and etc. done should be included in the model that the present invention protects Within enclosing.

Claims (106)

1. a kind of touch sensing characterized by comprising

One bearing substrate；

One flexible touch-control sensing element has a release layer between the flexible touch-control sensing element and the bearing substrate, should Touch sensing is non-planar for being transferred to.

2. touch sensing as described in claim 1, which is characterized in that the flexible touch-control sensing element is a film-sensing Device (film sensor).

3. touch sensing as claimed in claim 2, which is characterized in that the thin film sensor is formed in a film and one Nanometer metal conducting layer on the film.

4. touch sensing as claimed in claim 3, which is characterized in that further include: a flexible electrode assembly, wherein this how Rice metal conducting layer is located at a first surface of the film, which is located at a second surface of the film.

5. touch sensing as claimed in claim 3, which is characterized in that the nanometer metal conducting layer includes a nanometer silver wire layer An and coating layer (OC).

6. touch sensing as claimed in claim 3, which is characterized in that further include a barrier layer on the nanometer metal conducting layer (passivation) or protective layer (Primer).

7. touch sensing as claimed in claim 3, which is characterized in that further include: a flexible electrode assembly, wherein this can Dangler component is located on the nanometer metal conducting layer, and the pliability electrode assembly and the nanometer metal conducting layer are electrical each other Insulation.

8. touch sensing as claimed in claim 2, which is characterized in that the thin film sensor has a film and is formed in this The one first nanometer metal conducting layer and one second nanometer metal conducting layer on opposite two surfaces of film.

9. touch sensing as claimed in claim 8, which is characterized in that further include: a flexible electrode assembly, wherein this can Dangler component is located on the first nanometer metal conducting layer, the pliability electrode assembly and the first nanometer metal conducting layer It is electrically insulated from.

10. touch sensing as claimed in claim 8, which is characterized in that further include: a flexible electrode assembly wherein should Flexible electrode assembly is located on the second nanometer metal conducting layer, the pliability electrode assembly and the first nanometer metallic conduction Layer is electrically insulated from, which is located between the second nanometer metal conducting layer and the release layer.

11. touch sensing as claimed in claim 8, which is characterized in that the first nanometer metal conducting layer and this second how Rice metal conducting layer respectively includes a nanometer silver wire layer and a coating layer (OC).

12. touch sensing as claimed in claim 11, which is characterized in that the nanometer silver wire layer is electrically connected an object-line Road.

13. touch sensing as claimed in claim 8, which is characterized in that further include one on the first nanometer metal conducting layer Hard conating (HC) further includes a barrier layer (passivation) on the second nanometer metal conducting layer.

14. touch sensing as claimed in claim 8, which is characterized in that on the first nanometer metal conducting layer or this second A protective layer (Primer) is further included on nanometer metal conducting layer.

15. touch sensing as claimed in claim 2, which is characterized in that the thin film sensor has a first film；One shape At in the first nanometer metal conducting layer on the first film；One second film；One be formed on second film second how Rice metal conducting layer, the first film are bonded to each other with second film, the first nanometer metal conducting layer and second nanometer Metal conducting layer faces opposite direction.

16. touch sensing as claimed in claim 15, which is characterized in that further include: a flexible electrode assembly wherein should Flexible electrode assembly is located on the first nanometer metal conducting layer, the pliability electrode assembly and the first nanometer metallic conduction Layer is electrically insulated from.

17. touch sensing as claimed in claim 15, which is characterized in that further include: a flexible electrode assembly wherein should Flexible electrode assembly is located between the flexible touch-control sensing component and the release layer, the pliability electrode assembly and this second Nanometer metal conducting layer is located at opposite two surfaces of second film and is electrically insulated from.

18. touch sensing as claimed in claim 15, which is characterized in that the thin film sensor further includes a periphery circuit, The periphery circuit is electrically connected the first nanometer metal conducting layer and the second nanometer metal conducting layer.

19. touch sensing as claimed in claim 15, which is characterized in that further include one on the first nanometer metal conducting layer Hard conating (HC) further includes a barrier layer (passivation) on the second nanometer metal conducting layer.

20. touch sensing as claimed in claim 15, which is characterized in that on the first nanometer metal conducting layer or this second A protective layer (Primer) is further included on nanometer metal conducting layer.

21. touch sensing as claimed in claim 15, which is characterized in that the thin film sensor includes that a film and one attach Transparent conductive film is transferred in the film.

22. touch sensing as described in claim 1, which is characterized in that further include a bonding layer, wherein the bonding layer is arranged In on the flexible touch-control sensing element.

23. touch sensing as claimed in claim 22, which is characterized in that further include: a flexible electrode assembly wherein should Flexible electrode assembly is located between the bonding layer and the flexible touch-control sensing component.

24. touch sensing as described in claim 1, which is characterized in that further include one and be set to flexible touch-control sensing Residual release layer on element.

25. touch sensing as claimed in claim 24, which is characterized in that further include: a flexible electrode assembly wherein should Flexible electrode assembly is located on the flexible touch-control sensing component or the pliability electrode assembly is located at the flexible touch-control Between sensing component and the residual release layer.

26. touch sensing as claimed in claim 25, which is characterized in that the pliability electrode assembly has a film and one The nanometer metal conducting layer being formed on the film.

27. touch sensing as claimed in claim 26, which is characterized in that the nanometer metal conducting layer includes a nanometer silver wire Layer and a coating layer (OC).

28. touch sensing as claimed in claim 26, which is characterized in that further include one on the nanometer metal conducting layer and block Layer (passivation), protective layer (Primer) or hard conating (HC).

29. a kind of touch panel characterized by comprising

The one flexible cover board with decoration functions；

One flexible touch-control sensing element, the flexible touch-control sensing element and this have between the flexible cover board of decoration functions With a bonding layer, wherein the touch panel is non-planar for being transferred to.

30. touch panel as claimed in claim 29, which is characterized in that it includes one that this, which has the flexible cover board of decoration functions, Film layer and one be set to the film layer shielding layer.

31. touch panel as claimed in claim 30, which is characterized in that the flexible touch-control sensing element is a film-sensing Device (film sensor).

32. touch panel as claimed in claim 31, which is characterized in that the thin film sensor is formed in a film and one Nanometer metal conducting layer on the film.

33. touch panel as claimed in claim 32, which is characterized in that further include: a flexible electrode assembly, wherein this how Rice metal conducting layer is located at a first surface of the film, which is located at a second surface of the film.

34. touch panel as claimed in claim 32, which is characterized in that the nanometer metal conducting layer includes a nanometer silver wire layer An and coating layer (OC).

35. touch panel as claimed in claim 32, which is characterized in that further include a barrier layer on the nanometer metal conducting layer (passivation) or protective layer (Primer).

36. touch panel as claimed in claim 32, which is characterized in that further include: a flexible electrode assembly, wherein this can Dangler component is located on the nanometer metal conducting layer, and the pliability electrode assembly and the nanometer metal conducting layer are electrical each other Insulation.

37. touch panel as claimed in claim 31, which is characterized in that the thin film sensor has a film and is formed in this The one first nanometer metal conducting layer and one second nanometer metal conducting layer on opposite two surfaces of film.

38. touch panel as claimed in claim 37, which is characterized in that further include: a flexible electrode assembly, wherein this can Dangler component is located on the first nanometer metal conducting layer, the pliability electrode assembly and the first nanometer metal conducting layer It is electrically insulated from, which is located between the first nanometer metal conducting layer and the bonding layer.

39. touch panel as claimed in claim 37, which is characterized in that further include: a flexible electrode assembly, wherein this can Dangler component is located on the second nanometer metal conducting layer, the pliability electrode assembly and the first nanometer metal conducting layer It is electrically insulated from.

40. touch panel as claimed in claim 37, which is characterized in that the first nanometer metal conducting layer and second nanometer Metal conducting layer respectively includes a nanometer silver wire layer and a coating layer (OC).

41. touch panel as claimed in claim 40, which is characterized in that the nanometer silver wire layer is electrically connected a periphery circuit, The shielding layer covers the periphery circuit.

42. touch panel as claimed in claim 37, which is characterized in that it is hard to further include one on the first nanometer metal conducting layer Coating (HC) further includes a barrier layer (passivation) on the second nanometer metal conducting layer.

43. touch panel as claimed in claim 37, which is characterized in that on the first nanometer metal conducting layer or this second how A protective layer (Primer) is further included on rice metal conducting layer.

44. touch panel as claimed in claim 31, which is characterized in that the thin film sensor has a first film；One shape At in the first nanometer metal conducting layer on the first film；One second film and one be formed on second film second how Rice metal conducting layer, the first film are bonded to each other with second film, the first nanometer metal conducting layer and second nanometer Metal conducting layer faces opposite direction.

45. touch panel as claimed in claim 44, which is characterized in that further include: a flexible electrode assembly, wherein this can Dangler component is located on the first nanometer metal conducting layer, the pliability electrode assembly and the first nanometer metal conducting layer It is electrically insulated from, which is located between the first nanometer metal conducting layer and the bonding layer.

46. touch panel as claimed in claim 44, which is characterized in that further include: a flexible electrode assembly, wherein this can Dangler component and the second nanometer metal conducting layer are located at the with respect to two surfaces and electrically exhausted each other of second film Edge.

47. touch panel as claimed in claim 44, which is characterized in that the thin film sensor further includes a periphery circuit, should Periphery circuit is electrically connected the first nanometer metal conducting layer and the second nanometer metal conducting layer, which covers the periphery Route.

48. touch panel as claimed in claim 44, which is characterized in that it is hard to further include one on the first nanometer metal conducting layer Coating (HC) further includes a barrier layer (passivation) on the second nanometer metal conducting layer.

49. touch panel as claimed in claim 44, which is characterized in that on the first nanometer metal conducting layer or this second how A protective layer (Primer) is further included on rice metal conducting layer.

50. touch panel as claimed in claim 31, which is characterized in that the thin film sensor includes that a film and one are attached at The film transfers transparent conductive film.

51. touch panel as claimed in claim 29, which is characterized in that further include one and remain on the flexible touch-control sensing The first release layer on part, wherein first release layer is located between the flexible touch-control sensing element and the bonding layer.

52. touch panel as claimed in claim 51, which is characterized in that further include: a flexible electrode assembly, wherein this can Dangler component is located between first release layer and the flexible touch-control sensing component.

53. touch panel as claimed in claim 29, which is characterized in that further include: a flexible electrode assembly, wherein this can Dangler component is located on the flexible touch-control sensing component or the pliability electrode assembly is located at the flexible touch-control sense It surveys between component and the bonding layer.

54. touch panel as claimed in claim 53, which is characterized in that the pliability electrode assembly has a film and a shape At in the nanometer metal conducting layer on the film.

55. touch panel as claimed in claim 54, which is characterized in that the nanometer metal conducting layer includes a nanometer silver wire layer An and coating layer (OC).

56. touch panel as claimed in claim 54, which is characterized in that further include a barrier layer on the nanometer metal conducting layer (passivation), protective layer (Primer) or hard conating (HC).

57. a kind of touch panel characterized by comprising

One flexible cover board；

One flexible touch-control sensing element has a bonding layer between the flexible touch-control sensing element and the pliability cover board； And

One shielding layer, the shielding layer are at least covered in a part of the flexible touch-control sensing element, and wherein the touch panel is used It is non-planar in being transferred to.

58. touch panel as claimed in claim 57, which is characterized in that the shielding layer is printed in the flexible touch-control sense for one Survey the chromonic layer on element.

59. touch panel as claimed in claim 58, which is characterized in that the flexible touch-control sensing element is a film-sensing Device (film sensor).

60. touch panel as claimed in claim 59, which is characterized in that the thin film sensor is formed in a film and one Nanometer metal conducting layer on the film.

61. touch panel as claimed in claim 60, which is characterized in that further include: a flexible electrode assembly, wherein this how Rice metal conducting layer is located at a first surface of the film, which is located at a second surface of the film.

62. touch panel as claimed in claim 60, which is characterized in that further include a barrier layer on the nanometer metal conducting layer (passivation) or protective layer (Primer).

63. touch panel as claimed in claim 60, which is characterized in that further include: a flexible electrode assembly, wherein this can Dangler component is located on the nanometer metal conducting layer, and the pliability electrode assembly and the nanometer metal conducting layer are electrical each other Insulation.

64. touch panel as claimed in claim 59, which is characterized in that the thin film sensor has a film and is formed in this The one first nanometer metal conducting layer and one second nanometer metal conducting layer on opposite two surfaces of film.

65. the touch panel as described in claim 64, which is characterized in that further include: a flexible electrode assembly, wherein this can Dangler component is located on the first nanometer metal conducting layer, the pliability electrode assembly and the first nanometer metal conducting layer It is electrically insulated from, which is located between the first nanometer metal conducting layer and the bonding layer.

66. the touch panel as described in claim 64, which is characterized in that further include: a flexible electrode assembly, wherein this can Dangler component is located on the second nanometer metal conducting layer, the pliability electrode assembly and the first nanometer metal conducting layer It is electrically insulated from.

67. the touch panel as described in claim 64, which is characterized in that the first nanometer metal conducting layer and second nanometer Metal conducting layer respectively includes a nanometer silver wire layer and a coating layer (OC).

68. the touch panel as described in claim 67, which is characterized in that the nanometer silver wire layer is electrically connected a periphery circuit, The shielding layer covers the periphery circuit.

69. the touch panel as described in claim 64, which is characterized in that it is hard to further include one on the first nanometer metal conducting layer Coating (HC) further includes a barrier layer (passivation) on the second nanometer metal conducting layer.

70. the touch panel as described in claim 64, which is characterized in that on the first nanometer metal conducting layer or this second how A protective layer (Primer) is further included on rice metal conducting layer.

71. touch panel as claimed in claim 59, which is characterized in that the thin film sensor has a first film；One shape At in the first nanometer metal conducting layer on the first film；One second film and one be formed on second film second how Rice metal conducting layer, the first film are bonded to each other with second film, the first nanometer metal conducting layer and second nanometer Metal conducting layer faces opposite direction.

72. the touch panel as described in claim 71, which is characterized in that further include: a flexible electrode assembly, wherein this can Dangler component is located on the first nanometer metal conducting layer, the pliability electrode assembly and the first nanometer metal conducting layer It is electrically insulated from, which is located between the first nanometer metal conducting layer and the bonding layer.

73. the touch panel as described in claim 71, which is characterized in that further include: a flexible electrode assembly, wherein this can Dangler component and the second nanometer metal conducting layer are located at the with respect to two surfaces and electrically exhausted each other of second film Edge.

74. the touch panel as described in claim 71, which is characterized in that the thin film sensor further includes a periphery circuit, should Periphery circuit is electrically connected the first nanometer metal conducting layer and the second nanometer metal conducting layer, which covers the periphery Route.

75. the touch panel as described in claim 71, which is characterized in that it is hard to further include one on the first nanometer metal conducting layer Coating (HC) further includes a barrier layer (passivation) on the second nanometer metal conducting layer.

76. the touch panel as described in claim 71, which is characterized in that on the first nanometer metal conducting layer or this second how A protective layer (Primer) is further included on rice metal conducting layer.

77. touch panel as claimed in claim 59, which is characterized in that the thin film sensor includes that a film and one are attached at The film transfers transparent conductive film.

78. touch panel as claimed in claim 57, which is characterized in that further include one and remain on the flexible touch-control sensing The first release layer on part and the shielding layer, wherein first release layer is located at the flexible touch-control sensing element and the bonding layer Between.

79. the touch panel as described in claim 78, which is characterized in that further include: a flexible electrode assembly, wherein this can Dangler component is located between first release layer and the flexible touch-control sensing component.

80. touch panel as claimed in claim 57, which is characterized in that further include: a flexible electrode assembly, wherein this can Dangler component is located between the flexible touch-control sensing component and the bonding layer or the pliability electrode assembly is located at this On flexible touch-control sensing component, wherein the shielding layer is a chromonic layer being printed on the pliability electrode assembly.

81. the touch panel as described in claim 80, which is characterized in that the pliability electrode assembly has a film and a shape At in the nanometer metal conducting layer on the film.

82. the touch panel as described in claim 81, which is characterized in that the nanometer metal conducting layer includes a nanometer silver wire layer An and coating layer (OC).

83. the touch panel as described in claim 81, which is characterized in that further include a barrier layer on the nanometer metal conducting layer (passivation), protective layer (Primer) or hard conating (HC).

84. a kind of touch panel characterized by comprising

The one flexible cover board with decoration functions；

One flexible touch-control sensing element, it is straight which, which has the flexible cover board of decoration functions with this, Contact, wherein the touch panel is non-planar for being transferred to.

85. the touch panel as described in claim 84, which is characterized in that it includes one that this, which has the flexible cover board of decoration functions, Film layer and one be set to the film layer shielding layer.

86. the touch panel as described in claim 85, which is characterized in that the flexible touch-control sensing element is a film-sensing Device (film sensor).

87. the touch panel as described in claim 86, which is characterized in that the thin film sensor is formed in a film and one Nanometer metal conducting layer on the film, the film with this there is the film layer of the flexible cover board of decoration functions directly to paste It closes.

88. the touch panel as described in claim 87, which is characterized in that further include: a flexible electrode assembly, wherein this how Rice metal conducting layer is located at a first surface of the film, and there is the film layer of the flexible cover board of decoration functions to be located at for this should One second surface of film, the pliability electrode assembly are located on the nanometer metal conducting layer, the pliability electrode assembly with should Nanometer metal conducting layer is electrically insulated from.

89. the touch panel as described in claim 87, which is characterized in that the nanometer metal conducting layer includes a nanometer silver wire layer An and coating layer (OC).

90. the touch panel as described in claim 87, which is characterized in that further include a barrier layer on the nanometer metal conducting layer (passivation) or protective layer (Primer).

91. the touch panel as described in claim 86, which is characterized in that the thin film sensor has a film and is formed in this The one first nanometer metal conducting layer and one second nanometer metal conducting layer on opposite two surfaces of film.

92. the touch panel as described in claim 91, which is characterized in that further include: a flexible electrode assembly, wherein this One nanometer metal conducting layer with this there is the film layer of the flexible cover board of decoration functions to directly fit, the pliability electrode group Part is located on the second nanometer metal conducting layer, and the pliability electrode assembly and the second nanometer metal conducting layer are electrically exhausted each other Edge.

93. the touch panel as described in claim 91, which is characterized in that the first nanometer metal conducting layer and second nanometer Metal conducting layer respectively includes a nanometer silver wire layer and a coating layer (OC).

94. the touch panel as described in claim 93, which is characterized in that the nanometer silver wire layer is electrically connected a periphery circuit, The shielding layer covers the periphery circuit.

95. the touch panel as described in claim 93, which is characterized in that it is hard to further include one on the first nanometer metal conducting layer Coating (HC) further includes a barrier layer (passivation) on the second nanometer metal conducting layer.

96. the touch panel as described in claim 93, which is characterized in that on the first nanometer metal conducting layer or this second how A protective layer (Primer) is further included on rice metal conducting layer.

97. the touch panel as described in claim 86, which is characterized in that the thin film sensor has a first film；One shape At in the first nanometer metal conducting layer on the first film；One second film and one be formed on second film second how Rice metal conducting layer, the first film are bonded to each other with second film, the first nanometer metal conducting layer and second nanometer Metal conducting layer faces opposite direction.

98. the touch panel as described in claim 97, which is characterized in that further include: a flexible electrode assembly, wherein this One nanometer metal conducting layer with this there is the film layer of the flexible cover board of decoration functions to directly fit, the pliability electrode group Part is located on the second nanometer metal conducting layer, and the pliability electrode assembly and the second nanometer metal conducting layer are electrically exhausted each other Edge.

99. the touch panel as described in claim 97, which is characterized in that the thin film sensor further includes a periphery circuit, should Periphery circuit is electrically connected the first nanometer metal conducting layer and the second nanometer metal conducting layer, which covers the periphery Route.

100. the touch panel as described in claim 97, which is characterized in that further include one on the first nanometer metal conducting layer Hard conating (HC) further includes a barrier layer (passivation) on the second nanometer metal conducting layer.

101. the touch panel as described in claim 97, which is characterized in that on the first nanometer metal conducting layer or this second A protective layer (Primer) is further included on nanometer metal conducting layer.

102. the touch panel as described in claim 86, which is characterized in that the thin film sensor includes that a film and one attach Transparent conductive film is transferred in the film.

103. the touch panel as described in claim 84, which is characterized in that further include: a flexible electrode assembly wherein should Flexible touch-control sensing component is located between the flexible cover board and the pliability electrode assembly with decoration functions.

104. the touch panel as described in claim 103, which is characterized in that the pliability electrode assembly has a film and one The nanometer metal conducting layer being formed on the film.

105. the touch panel as described in claim 104, which is characterized in that the nanometer metal conducting layer includes a nanometer silver wire Layer and a coating layer (OC).

106. the touch panel as described in claim 104, which is characterized in that further include one on the nanometer metal conducting layer and block Layer (passivation), protective layer (Primer) or hard conating (HC).