TWM569278U - Hybrid plate material - Google Patents

Hybrid plate material Download PDF

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Publication number
TWM569278U
TWM569278U TW107207908U TW107207908U TWM569278U TW M569278 U TWM569278 U TW M569278U TW 107207908 U TW107207908 U TW 107207908U TW 107207908 U TW107207908 U TW 107207908U TW M569278 U TWM569278 U TW M569278U
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Taiwan
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layer
bakelite
layers
filled
split sheet
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TW107207908U
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Chinese (zh)
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王金助
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欣岱實業股份有限公司
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Priority to TW107207908U priority Critical patent/TWM569278U/en
Publication of TWM569278U publication Critical patent/TWM569278U/en

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Abstract

一種拼合板材,包含至少一層電木層,以及至少一層膠層。該至少一層電木層包括數塊形成有數凹陷區域的電木板、數個填充於該等凹陷區域的第一膠體,以及一個填充於該等電木板間的第二膠體。每一電木板具有一個粗糙的第一面、一個相反於該第一面的第二面,以及一個環繞連接於該第一面與該第二面間的側表面。該等電木板相配合界定出一個位於該等側表面間的間隙。該第二膠體填充於該間隙中。該至少一層膠層結合於該至少一層電木層的該第一面。該拼合板材以作為墊板使用過而廢棄的該等電木板製成,具有成本低廉及環保的優點。 A split sheet comprising at least one layer of bakelite and at least one layer of glue. The at least one layer of bakelite comprises a plurality of bakelite forming a plurality of recessed regions, a plurality of first colloids filled in the recessed regions, and a second colloid filled between the bakelites. Each of the electric boards has a rough first side, a second side opposite the first side, and a side surface circumferentially connected between the first side and the second side. The bakelites cooperate to define a gap between the side surfaces. The second gel is filled in the gap. The at least one adhesive layer is bonded to the first side of the at least one layer of bakelite. The split sheet is made of the electric boards which have been used as a backing plate and is discarded, and has the advantages of low cost and environmental protection.

Description

拼合板材 Flat plate

本新型是有關於一種酚醛樹脂產品,特別是指一種由電木板製成的拼合板材。The present invention relates to a phenolic resin product, and more particularly to a split sheet made of electric wood.

現有普遍使用的電木板是一種酚醛樹脂製品,主要是將酚醛樹脂與如紙、織物或玻璃等支撐材料加壓結合製得,並具有良好的電性及機械加工性質,亦即絕緣、耐磨、耐熱、耐燃等性質佳,因而被廣泛用於電器或交通工具中作為絕緣部件,或者作為墊設於銅箔基板或印刷電路板下之墊板,以利銅箔基板或印刷電路板被裁切或鑽孔。The commonly used electric wood board is a phenolic resin product, which is mainly obtained by press-bonding a phenolic resin with a supporting material such as paper, fabric or glass, and has good electrical and mechanical processing properties, that is, insulation and wear resistance. It is widely used in electrical appliances or vehicles as an insulating component, or as a pad placed under a copper foil substrate or a printed circuit board, so that the copper foil substrate or printed circuit board is cut. Cut or drill.

當電木板作為墊板而於裁切或鑽孔被破壞時,由於未被破壞處及被破壞處能提供的支撐力不平均,將無法再次被作為墊板使用,而需被拋棄,此一問題有待解決。When the bakelite is used as a backing plate and the cutting or drilling is broken, the supporting force that can be provided in the undestroyed and damaged places will not be used again as a backing plate, but will be discarded. The problem remains to be resolved.

本新型的第一目的,在於提供一種能夠克服先前技術至少一個缺點的拼合板材。A first object of the present invention is to provide a split panel that overcomes at least one of the disadvantages of the prior art.

該拼合板材,包含至少一層電木層,以及至少一層膠層。The split sheet comprises at least one layer of bakelite and at least one layer of glue.

該至少一層電木層包括數塊形成有數凹陷區域的電木板、數個填充於該等凹陷區域的第一膠體,以及數個填充於該等電木板間的第二膠體。每一電木板具有一個粗糙的第一面、一個相反於該第一面的第二面,以及一個環繞連接於該第一面與該第二面間的側表面。該等電木板相配合界定出數個位於該等側表面間的間隙。該等第二膠體分別填充於該等間隙中。該至少一層膠層結合於該至少一層電木層的該第一面。The at least one layer of bakelite comprises a plurality of bakelite forming a plurality of recessed regions, a plurality of first colloids filled in the recessed regions, and a plurality of second colloids filled between the bakelites. Each of the electric boards has a rough first side, a second side opposite the first side, and a side surface circumferentially connected between the first side and the second side. The bakelites cooperate to define a plurality of gaps between the side surfaces. The second colloids are filled in the gaps, respectively. The at least one adhesive layer is bonded to the first side of the at least one layer of bakelite.

該拼合板材的功效在於:該拼合板材包含作為墊板使用過而形成有所述凹陷空間而廢棄的該等電木板,由於能以廢棄的該等電木板製成,因此該拼合板材具有成本低廉及環保的優點。The effect of the split sheet is that the split sheet comprises the electric board which has been used as a backing plate to form the recessed space and is discarded. Since the board can be made of discarded electric boards, the split board has low cost. And the advantages of environmental protection.

本新型的第二目的,在於提供一種能夠克服先前技術至少一個缺點的拼合板材。A second object of the present invention is to provide a split panel that overcomes at least one of the disadvantages of the prior art.

該拼合板材,包含至少一層電木層,以及至少一層膠層。The split sheet comprises at least one layer of bakelite and at least one layer of glue.

該至少一層電木層包括數塊形成有數凹陷區域的電木板、數個填充於該等凹陷區域的第一膠體,以及一個填充於該等電木板間的第二膠體。每一電木板具有一個粗糙的第一面、一個相反於該第一面的第二面,以及一個環繞連接於該第一面與該第二面間的側表面。該等電木板相配合界定出一個位於該等側表面間的間隙。該第二膠體填充於該間隙中。該至少一層膠層結合於該至少一層電木層的該第一面。The at least one layer of bakelite comprises a plurality of bakelite forming a plurality of recessed regions, a plurality of first colloids filled in the recessed regions, and a second colloid filled between the bakelites. Each of the electric boards has a rough first side, a second side opposite the first side, and a side surface circumferentially connected between the first side and the second side. The bakelites cooperate to define a gap between the side surfaces. The second gel is filled in the gap. The at least one adhesive layer is bonded to the first side of the at least one layer of bakelite.

該拼合板材的功效在於:該拼合板材包含作為墊板使用過而形成有所述凹陷空間而廢棄的該等電木板,由於能以廢棄的該等電木板製成,因此該拼合板材具有成本低廉及環保的優點。The effect of the split sheet is that the split sheet comprises the electric board which has been used as a backing plate to form the recessed space and is discarded. Since the board can be made of discarded electric boards, the split board has low cost. And the advantages of environmental protection.

在以下的說明內容中,類似或相同的元件將以相同的編號來表示。In the following description, similar or identical elements will be denoted by the same reference numerals.

參閱圖1及圖2,本新型拼合板材的一個第一實施例,包含一層厚度T1為0.2mm的電木層1,以及一層厚度T2為0.2mm且膠黏結合於該電木層1上的膠層2。(圖中僅為示意,不代表實際厚度比例)Referring to Figures 1 and 2, a first embodiment of the split sheet of the present invention comprises a bakelite layer 1 having a thickness T1 of 0.2 mm and a layer of thickness T2 of 0.2 mm bonded to the bakelite layer 1 . Adhesive layer 2. (The figure is only for illustration, does not represent the actual thickness ratio)

該電木層1包括兩塊一概呈方型且共形成有兩凹陷區域111的電木板11、數個填充於該等凹陷區域111的第一膠體12,以及一個填充於該等電木板11間的第二膠體13。The bakelite layer 1 includes two electric boards 11 which are generally square and have two recessed areas 111 formed therein, a plurality of first colloids 12 filled in the recessed areas 111, and one filled in the electric boards 11 The second colloid 13.

每一電木板11具有一個粗糙且供該膠層2結合的第一面112、一個相反於該第一面112的第二面113,以及一個環繞連接於該第一面112與該第二面113間的側表面114。Each of the electric boards 11 has a first face 112 which is rough and is joined by the glue layer 2, a second face 113 opposite to the first face 112, and a surrounding surface connected to the first face 112 and the second face 113 side surfaces 114.

每一電木板11形成有一個凹陷區域111。每一凹陷區域111為對應的電木板11作為鑽孔墊板使用時所形成,並由對應的該第一面112延伸至對應的該第二面113而上下貫通。該等電木板11相配合界定出一個位於該等側表面114間的間隙14。該等第一膠體12與該第二膠體13,同體連接該膠層2,並由該膠層2往下延伸而填滿於該等凹陷區域111與該間隙14中。Each of the electric boards 11 is formed with a recessed area 111. Each recessed area 111 is formed when the corresponding bakelite 11 is used as a drilled backing plate, and extends from the corresponding first surface 112 to the corresponding second surface 113 to penetrate vertically. The electrical planks 11 cooperate to define a gap 14 between the side surfaces 114. The first colloid 12 and the second colloid 13 are connected to the adhesive layer 2 in the same manner, and are extended downward from the adhesive layer 2 to fill the recessed regions 111 and the gap 14.

本第一實施例是透過如下所述的製法製成:取兩片作為鑽孔墊板使用過而廢棄的該等電木板11,以200mesh的砂紙打磨每一電木板11的其中一面以去除對應的該電木板11的表面離型劑並加以磨粗而形成對應的該第一面112,再將該等電木板11以該等側表面114相向地併排拼接在一起,並於該等第一面112貼上一膠片後,於環境溫度150℃~180℃且真空度為400mmHg~700mmHg的條件下,以50 kg/cm 2~80kg/cm 2的壓力將該膠片壓合於該等電木板11上。其中,該膠片的含膠率為50%~60%。本第一實施例於製造上,也可採用大於200mesh,但在400mesh以下的砂紙打磨。 The first embodiment is produced by the following method: taking two pieces of the electric board 11 which have been used as a drilling pad and discarding, and grinding one side of each of the electric boards 11 with 200 mesh sandpaper to remove the corresponding The surface release agent of the electric board 11 is ground and formed to form the corresponding first surface 112, and the electric boards 11 are then side-by-side spliced together with the side surfaces 114, and the first after pasting a film surface 112, at ambient temperature and 150 ℃ ~ 180 ℃ under the conditions of vacuum degree of 400mmHg ~ 700mmHg, at a pressure of 50 kg / cm 2 ~ 80kg / cm 2 of the film at the nip such Bakelite 11 on. Among them, the film has a gel content of 50% to 60%. In the first embodiment, in the manufacturing, sandpaper of more than 200 mesh but less than 400 mesh may be used.

該膠片於壓合的過程中,會軟化而填充進該等凹陷區域111與該間隙14中,並形成該膠層2、該等第一膠體12與該第二膠體13。於真空度為400mmHg~700mmHg之條件下壓合,則能抽出該等凹陷區域111與該間隙14中的空氣,並有助於軟化後的該膠片填入該等凹陷區域111與該間隙14中。要注意的是,在製造本新型的其他實施態樣上,能依填充凹陷空間的不同需求,改變溫度壓力等參數條件,使該等第一膠體12部分地填充於該等凹陷空間中,也能使該第二膠體13部分地填充於該間隙14中。During the pressing process, the film is softened and filled into the recessed regions 111 and the gaps 14, and the adhesive layer 2, the first colloid 12 and the second colloid 13 are formed. Pressing under the condition of a vacuum of 400 mmHg to 700 mmHg can extract the air in the recessed region 111 and the gap 14 and help the softened film to fill the recessed area 111 and the gap 14. . It should be noted that in the other embodiments of the present invention, the parameter conditions such as temperature and pressure can be changed according to the different requirements of filling the recessed space, so that the first colloids 12 are partially filled in the recessed spaces, The second colloid 13 can be partially filled in the gap 14.

本第一實施例由於能以廢棄的該等電木板11製成,因此具有成本低廉及環保的優點。在本新型的其他實施態樣中,依產品用途的不同需求,該電木層1的厚度T1也能為0.2mm~1mm,該膠層2的厚度T2也能為0.2mm~2.5mm。Since the first embodiment can be made of the discarded electric boards 11, it has the advantages of low cost and environmental protection. In other embodiments of the present invention, the thickness T1 of the bakelite layer 1 can also be 0.2 mm to 1 mm depending on the needs of the product, and the thickness T2 of the bakelite layer 2 can also be 0.2 mm to 2.5 mm.

參閱圖3及圖4,本新型的一個第二實施例與該第一實施例類似,不同的地方在於本第二實施例是包含兩層的所述膠層2。該電木層1包括九塊並排拼接的所述電木板11,以及數個所述的第二膠體13。Referring to Figures 3 and 4, a second embodiment of the present invention is similar to the first embodiment except that the second embodiment is a two-layered layer of glue 2. The bakelite layer 1 comprises nine bakelites 11 joined side by side, and a plurality of said second colloids 13.

該等電木板11的每一個具有粗糙度實質上相同且分別供該等膠層2結合的該第一面112與該第二面113,且該等電木板11相配合界定出數個所述間隙14,且該等電木板11的其中幾個形成有因鑽孔而上下貫通的所述凹陷區域111,另外幾個則形成有因切割形成但未貫通的該等凹陷區域111。Each of the electric boards 11 has the first surface 112 and the second surface 113 having substantially the same roughness and respectively bonded to the glue layers 2, and the electric boards 11 cooperate to define a plurality of the The gap 14 and the plurality of the electric boards 11 are formed with the recessed regions 111 penetrating up and down by the drilling, and the other portions are formed with the recessed regions 111 formed by the cutting but not penetrating.

該等第一膠體12的其中幾個上下延伸同體連接於該等膠層2間,另外幾個則僅同體連接其中一層膠層2,再另外幾個的每一個則具有兩個分別同體連接該等膠層2且彼此上下間隔的膠體部121。該等第二膠體13填充於該等間隙14中。A plurality of upper and lower extensions of the first colloids 12 are connected to the rubber layer 2, and the other ones are only connected to the rubber layer 2, and each of the other two has the same The body portion 21 is connected to the rubber layer 2 and spaced apart from each other. The second colloids 13 are filled in the gaps 14.

由於本第二實施例的同樣是利用廢棄的該等電木板11製成,因此同樣也具有成本低廉及環保的優點。Since the second embodiment is also made of the discarded electric boards 11, it also has the advantages of low cost and environmental protection.

參閱圖5,本新型的一個第三實施例與該第一實施例類似,不同的地方在於本第三實施例包含數個所述的電木層1,以及數個所述的膠層2。每一電木層1的該等電木板11的每一個,具有實質上粗糙度相同的該第一面112與該第二面113,且每一電木板11以各別的該第一面112與該第二面113結合於間隔相鄰的該等膠層2間。由於本第三實施例同樣是以廢棄的該等電木板11製成,因此同樣也具有成本低廉及環保的優點。Referring to Figure 5, a third embodiment of the present invention is similar to the first embodiment, except that the third embodiment includes a plurality of said bakelite layers 1, and a plurality of said subbing layers 2. Each of the electric boards 11 of each of the bakelite layers 1 has the first face 112 and the second face 113 having substantially the same roughness, and each of the bakelite boards 11 has a respective first face 112. The second surface 113 is bonded between the adjacent adhesive layers 2 adjacent to each other. Since the third embodiment is also made of the discarded electric boards 11, it also has the advantages of low cost and environmental protection.

綜上所述,本新型拼合板材的功效在於:該拼合板材包含作為墊板使用過而形成有所述凹陷空間而廢棄的該等電木板11,由於能以廢棄的該等電木板11製成,因此該拼合板材具有成本低廉及環保的優點。In summary, the effect of the split sheet of the present invention is that the split sheet comprises the electric board 11 which is used as a backing plate and is formed by the recessed space, and can be made of the discarded electric board 11 Therefore, the split sheet has the advantages of low cost and environmental protection.

以上所述,僅為本新型的實施例,不能以此限定本新型的申請專利範圍。凡依本新型申請專利範圍及新型說明書所作的等效變化與修飾,均仍屬本新型專利的涵蓋範圍中。The above description is only an embodiment of the present invention, and the scope of the patent application of the present invention cannot be limited thereto. Equivalent changes and modifications made in accordance with the scope of this new patent application and the new specification are still covered by this new patent.

1‧‧‧電木層1‧‧‧Electrical wood layer

11‧‧‧電木板 11‧‧‧Electrical wood

111‧‧‧凹陷區域 111‧‧‧ recessed area

112‧‧‧第一面 112‧‧‧ first side

113‧‧‧第二面 113‧‧‧ second side

114‧‧‧側表面 114‧‧‧ side surface

12‧‧‧第一膠體 12‧‧‧First colloid

121‧‧‧膠體部 121‧‧‧Colloid

13‧‧‧第二膠體 13‧‧‧Second colloid

14‧‧‧間隙 14‧‧‧ gap

2‧‧‧膠層 2‧‧‧ glue layer

T1‧‧‧厚度 T1‧‧‧ thickness

T2‧‧‧厚度 T2‧‧‧ thickness

本新型其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中: 圖1是一個立體圖,說明本新型拼合板材的一個第一實施例; 圖2是一個剖視圖,說明該第一實施例; 圖3是一個立體圖,說明本新型拼合板材的一個第二實施例; 圖4是一個剖視圖,說明該第二實施例;及 圖5是一個剖視圖,說明本新型拼合板材的一個第三實施例。Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: Figure 1 is a perspective view illustrating a first embodiment of the present composite panel; Figure 2 is a cross-sectional view illustrating the Figure 3 is a perspective view showing a second embodiment of the split sheet of the present invention; Figure 4 is a cross-sectional view showing the second embodiment; and Figure 5 is a cross-sectional view showing a first embodiment of the split sheet of the present invention Three embodiments.

Claims (10)

一種拼合板材,包含:至少一層電木層,包括數塊形成有數凹陷區域的電木板、數個填充於該等凹陷區域的第一膠體,以及數個填充於該等電木板間的第二膠體,每一電木板具有一個粗糙的第一面、一個相反於該第一面的第二面,以及一個環繞連接於該第一面與該第二面間的側表面,該等電木板相配合界定出數個位於該等側表面間的間隙,該等第二膠體分別填充於該等間隙中;及至少一層膠層,結合於該至少一層電木層的該第一面。 A split sheet comprising: at least one layer of bakelite comprising a plurality of bakelite forming a plurality of recessed regions, a plurality of first colloids filled in the recessed regions, and a plurality of second colloids filled between the bakelites Each of the electric boards has a rough first side, a second side opposite to the first side, and a side surface circumferentially connected between the first side and the second side, the electric boards cooperate Defining a plurality of gaps between the side surfaces, the second colloids are respectively filled in the gaps; and at least one adhesive layer is bonded to the first side of the at least one electric wood layer. 如請求項1所述的拼合板材,包含一層的所述電木層,以及兩層的所述膠層,該電木層的該第二面呈粗糙,該等膠層的其中一層結合於該第一面,該等膠層的另外一層結合於該第二面。 The split sheet according to claim 1, comprising a layer of the bakelite layer and two layers of the glue layer, wherein the second side of the bakelite layer is rough, and one of the layers of the glue layer is bonded to the layer On the first side, another layer of the glue layers is bonded to the second side. 如請求項1所述的拼合板材,包含數層的所述電木層,以及數層的所述膠層,每一電木層的該第二面呈粗糙,且每一電木層以各別的該第一面與該第二面接合於間隔相鄰的該等膠層間。 The split sheet according to claim 1, comprising a plurality of layers of the bakelite layer, and a plurality of layers of the glue layer, the second side of each bakelite layer being rough, and each bakelite layer being each The other first surface and the second surface are joined between the adjacent adhesive layers. 如請求項1所述的拼合板材,其中,該至少一電木層的厚度為0.2mm~2.5mm,該至少一膠層的厚度為0.2mm~1.0mm。 The split sheet according to claim 1, wherein the at least one bakelite layer has a thickness of 0.2 mm to 2.5 mm, and the at least one ply layer has a thickness of 0.2 mm to 1.0 mm. 如請求項1所述的拼合板材,其中,每一電木板形成有數凹陷區域。 The split sheet according to claim 1, wherein each of the electric boards is formed with a plurality of recessed areas. 一種拼合板材,包含:至少一層電木層,包括數塊形成有數凹陷區域的電木板、數個填充於該等凹陷區域的第一膠體,以及一個填充於該等電木板間的第二膠體,每一電木板具有一個粗糙的第一面、一個相反於該第一面的第二面,以及一個環繞連接於該第一面與該第二面間的側表面,該等電木板相配合界定出一個位於該等側表面間的間隙,該第二膠體填充於該間隙中;及至少一層膠層,結合於該至少一層電木層的該第一面。 A split sheet comprising: at least one layer of bakelite comprising a plurality of bakelite forming a plurality of recessed regions, a plurality of first colloids filled in the recessed regions, and a second colloid filled between the bakelites, Each of the electric boards has a rough first side, a second side opposite to the first side, and a side surface circumferentially connected between the first side and the second side, the electric boards are cooperatively defined a gap between the side surfaces, the second colloid is filled in the gap; and at least one adhesive layer is bonded to the first side of the at least one electric wood layer. 如請求項6所述的拼合板材,包含一層的所述電木層,以及兩層的所述膠層,該電木層的該第二面呈粗糙,該等膠層的其中一層結合於該第一面,該等膠層的另外一層結合於該第二面。 The split sheet according to claim 6, comprising a layer of the bakelite layer, and two layers of the glue layer, wherein the second side of the bakelite layer is rough, and one of the layers of the glue layer is bonded to the layer On the first side, another layer of the glue layers is bonded to the second side. 如請求項6所述的拼合板材,包含數層的所述電木層,以及數層的所述膠層,每一電木層的該等電木板的每一個的該第二面呈粗糙,且每一電木板以各別的該第一面與該第二面結合於間隔相鄰的該等膠層間。 The split sheet of claim 6, comprising a plurality of layers of the bakelite layer, and a plurality of layers of the glue layer, the second side of each of the electric boards of each bakelite layer being rough, And each of the electric boards is combined with the first surface and the second surface between the adjacent adhesive layers. 如請求項6所述的拼合板材,其中,該至少一電木層的厚度為0.2mm~2.5mm,該至少一膠層的厚度為0.2mm~1.0mm。 The split sheet according to claim 6, wherein the at least one bakelite layer has a thickness of 0.2 mm to 2.5 mm, and the at least one ply layer has a thickness of 0.2 mm to 1.0 mm. 如請求項6所述的拼合板材,其中,每一電木板形成有數凹陷區域。 The split sheet according to claim 6, wherein each of the electric boards is formed with a plurality of recessed areas.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114619078A (en) * 2022-04-01 2022-06-14 江苏迪飞达电子有限公司 Electric wood board structure for fixing product and using method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114619078A (en) * 2022-04-01 2022-06-14 江苏迪飞达电子有限公司 Electric wood board structure for fixing product and using method thereof

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