TWM561928U - Five-feed three-stacked antenna structure - Google Patents

Five-feed three-stacked antenna structure Download PDF

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Publication number
TWM561928U
TWM561928U TW107201546U TW107201546U TWM561928U TW M561928 U TWM561928 U TW M561928U TW 107201546 U TW107201546 U TW 107201546U TW 107201546 U TW107201546 U TW 107201546U TW M561928 U TWM561928 U TW M561928U
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Taiwan
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hole
substrate
metal layer
feeding
electrically connected
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TW107201546U
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Chinese (zh)
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Quinlan Ronan
Tsai-Yi Yang
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Taoglas Group Holdings Ltd
Taoglas Ltd
Taoglas Tech Corporation
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Priority to TW107201546U priority Critical patent/TWM561928U/en
Publication of TWM561928U publication Critical patent/TWM561928U/en

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Abstract

一種五饋入之三堆疊天線結構,包括:一第一天線、一第二天線及一第三天線。第一天線具有二第一饋入元件,二第一饋入元件穿過第一天線的第一基體與第一輻射金屬層電性連結,不與接地金屬層電性連結。第二天線的第二基體堆疊於第一基體上,以二第二饋入元件穿過第二基體及第一基體的與第二輻射金屬層電性連結,不與接地金屬層電性連結。該第三天線的第三基體堆疊於第二基體上,以第三饋入元件穿過第三基體、第二基體及第一基體的與第三輻射金屬層電性連結,不與接地金屬層電性連結,以形成具有接收各種無線通訊系統的五饋入之三堆疊天線結構。A five-input three-stack antenna structure includes: a first antenna, a second antenna, and a third antenna. The first antenna has two first feeding elements, and the first feeding element of the first feeding element is electrically connected to the first radiating metal layer through the first base of the first antenna, and is not electrically connected to the grounding metal layer. The second substrate of the second antenna is stacked on the first substrate, and the second feeding element is electrically connected to the second substrate and the first substrate and electrically connected to the ground metal layer. . The third base body of the third antenna is stacked on the second base body, and the third feed element passes through the third base body, the second base body and the first base body and is electrically connected to the third radiating metal layer, and is not connected to the ground metal layer. Electrically coupled to form a three-stack antenna structure having five feeds for receiving various wireless communication systems.

Description

五饋入之三堆疊天線結構Five-fed three stacked antenna structure

本創作係有關一種天線,尤指一種具有接收不同通訊系統頻率的五饋入之三堆疊天線結構。The present invention relates to an antenna, and more particularly to a three-stacked antenna structure having five feeds for receiving frequencies of different communication systems.

目前市面上所使用的無線通訊系統至少包含有:一全球導航衛星系統(GNSS)、一專用短程通信技術系統(DSRC)、一衛星數位音訊無線電業務系統(SDARS)、一長期演進技術系統(LTE)、一無線網路系統(WLAN/BT)60等。而且該全球導航衛星系統中包括全球的、區域的和增強的,例如全球定位系統(Global Positioning System,GPS)、格洛納斯(GLONASS)是俄語中的全球衛星導航系統(GLOBAL NAVIGATION SATELLITE SYSTEM)的縮寫、伽利略定位系統(Galileo)、北斗衛星導航系統,以及相關的增強系統,如WAAS(廣域增強系統)、EGNOS(歐洲靜地導航重疊系統)和MSAS(多功能運輸衛星增強系統)等無線通訊系統。這些無線通訊系統中,每一個無線通訊系統都有連結相匹配的接收天線來接收訊號。At present, the wireless communication system used in the market at least includes: a global navigation satellite system (GNSS), a dedicated short-range communication technology system (DSRC), a satellite digital audio service system (SDARS), and a long-term evolution technology system (LTE). ), a wireless network system (WLAN/BT) 60, and the like. Moreover, the global navigation satellite system includes global, regional and enhanced, such as Global Positioning System (GPS), GLONASS is the GLOBAL NAVIGATION SATELLITE SYSTEM in Russian. Abbreviations, Galileo positioning system (Galileo), Beidou satellite navigation system, and related augmentation systems such as WAAS (Wide Area Augmentation System), EGNOS (European Static Navigation Overlay System) and MSAS (Multifunctional Transportation Satellite Augmentation System) Wireless communication system. In these wireless communication systems, each wireless communication system has a matching receiving antenna to receive signals.

近年來科技不斷的進步下,將上述的各種無線通訊系統整合在一個電子設備(例如汽車的行車電腦)中,使該電子設備不管行銷到世界各地,該電子設備都不需重新設計即可啟動使用。由於電子設備整合了多種的無線通訊系統,相對地該電子設備的電路板上也需要裝多支的天線,才可接收各種無線通訊系統的訊號。In recent years, with the continuous advancement of technology, the above various wireless communication systems are integrated into an electronic device (such as a driving computer of a car), so that the electronic device can be started without redesigning regardless of marketing to the world. use. Since the electronic device integrates a plurality of wireless communication systems, relatively many antennas are required on the circuit board of the electronic device to receive signals of various wireless communication systems.

雖然,此種的整合設計讓電子設備較不受使用地方及區域的限制,但是電子設備的電路板上需整合多支天線,且每一個天線都有一特定的尺寸,且分散設立的位置都不盡相同且占空間,將會導致電路板的面積變大,也使得安裝於該電路板的外殼或空間也相對變大,因此也造成整合上的困難。Although such an integrated design makes the electronic device less restricted by the place of use and the area, the electronic device has a plurality of antennas integrated on the circuit board, and each antenna has a specific size, and the dispersed positions are not located. The same and occupying space will lead to an increase in the area of the circuit board, and also make the outer casing or space mounted on the circuit board relatively large, thus causing integration difficulties.

因此,本創作之主要目的,在於解決傳統缺失,本創作在於提供一種將三個天線堆疊在一起形成具有五饋入之三堆疊天線結構,能接收各種無線通訊系統的訊號,且使堆疊後的三堆疊天線可以輕易與電子設備做整合,使整合設計上更加簡單,也不會造成電路板的面積變大。Therefore, the main purpose of this creation is to solve the traditional deficiency. The present invention aims to provide a three-stack antenna structure with five antennas stacked to receive signals of various wireless communication systems, and to enable stacking. The three-stack antenna can be easily integrated with electronic devices, making the integrated design simpler and without causing the board area to become larger.

為達上述之目的,本創作提供一種五饋入之三堆疊天線結構,包括:一第一天線、一第二天線及一第三天線。該第一天線其上具有一第一基體,該第一基體的表面具有一第一輻射金屬層,該第一基體的底面具有一接地金屬層,於該第一天線具有二穿過該第一基體的第一饋入元件,該二第一饋入元件穿過該第一基體與該第一輻射金屬層電性連結,該二第一饋入元件穿過該第一基體底面不與該接地金屬層電性連結。該第二天線上具有一第二基體,該第二基體係以配置於該第一基體的第一輻射金屬層的表面上,於該第二基體表面上具有一第二輻射金屬層,該第二天線具有二第二饋入元件,該二第二饋入元件分別穿過該第二基體與該第一基體與該第二輻射金屬層電性連結,該二第二饋入元件在穿過該第一基體底面外部不與該接地金屬層電性連結。該第三天線上具有一第三基體,該第三基體係以配置於該第二基體的第二輻射金屬層的表面上,於該第三基體表面上具有一第三輻射金屬層,該第三天線具有一第三饋入元件,該第三饋入元件與第三輻射金屬層電性連結後,分別穿過該第三基體、該第二基體及該第一基體,在該第三饋入元件穿過該第一基體底面外部不與該接地金屬層電性連結。To achieve the above purpose, the present invention provides a five-input three-stack antenna structure, including: a first antenna, a second antenna, and a third antenna. The first antenna has a first base body thereon, the surface of the first base body has a first radiating metal layer, and the bottom surface of the first base body has a grounding metal layer, and the first antenna has two through a first feeding element of the first substrate, the two first feeding elements are electrically connected to the first radiating metal layer through the first substrate, and the two first feeding elements do not pass through the bottom surface of the first substrate The grounded metal layer is electrically connected. The second antenna has a second base body disposed on a surface of the first radiating metal layer of the first substrate, and a second radiating metal layer on the surface of the second substrate. The two antennas have two second feeding elements, and the two second feeding elements are electrically connected to the first base body and the second radiating metal layer through the second base body, and the two second feeding elements are worn. The outside of the bottom surface of the first substrate is not electrically connected to the ground metal layer. The third antenna has a third base body on the surface of the second radiating metal layer disposed on the second substrate, and a third radiating metal layer on the surface of the third substrate. The three antennas have a third feeding element, and the third feeding element is electrically connected to the third radiating metal layer, respectively, through the third base body, the second base body and the first base body, and the third feeding element The input component is electrically connected to the ground metal layer through the outside of the bottom surface of the first substrate.

在本創作之一實施例中,該第一基體上開設有一第一通孔、一第二通孔、一第三通孔、一第四通孔及一第五通孔,該第一通孔、該第二通孔、該第三通孔、該第四通孔及該第五通孔貫通該第一基體、第一輻射金屬層及該接地金屬層。In an embodiment of the present invention, a first through hole, a second through hole, a third through hole, a fourth through hole and a fifth through hole are defined in the first base. The second through hole, the third through hole, the fourth through hole and the fifth through hole penetrate the first base, the first radiating metal layer and the grounding metal layer.

在本創作之一實施例中,該第一通孔、該第二通孔、該第三通孔、該第四通孔及該第五通孔呈十字形排列。In an embodiment of the present invention, the first through hole, the second through hole, the third through hole, the fourth through hole, and the fifth through hole are arranged in a cross shape.

在本創作之一實施例中,該二第一饋入元件由該第四通孔及該第五通孔貫穿該第一基體。In an embodiment of the present invention, the two first feeding elements penetrate the first base body from the fourth through hole and the fifth through hole.

在本創作之一實施例中,該第二基體上設有貫穿該第二基體及該第二輻射金屬層的一第六通孔、一第七通孔及一第八通孔,該些第六通孔、第七通孔及該第八通孔分別對應該第一基體的該些第一通孔、第二通孔及該第三通孔。In an embodiment of the present invention, the second substrate is provided with a sixth through hole, a seventh through hole and an eighth through hole extending through the second base and the second radiating metal layer. The six through holes, the seventh through holes and the eighth through holes respectively correspond to the first through holes, the second through holes and the third through holes of the first base body.

在本創作之一實施例中,該二第二饋入元件分別穿過該第七通孔及該第八通孔的與該第二輻射金屬層電性連結後,該二第二饋入元件分別再穿過該第二通孔及該第三通孔的延伸於該第一基體底面外部不與該接地金屬層電性連結。In an embodiment of the present invention, after the second feeding element passes through the seventh through hole and the eighth through hole and is electrically connected to the second radiating metal layer, the second feeding element The second through hole and the third through hole respectively extend outside the bottom surface of the first substrate and are not electrically connected to the ground metal layer.

在本創作之一實施例中,該第三基體上設有貫穿該第三基體及該第三輻射金屬層的一第九通孔,該第九通孔對應該第二基體的第六通孔及該第一基體的第一通孔。In an embodiment of the present invention, the third substrate is provided with a ninth through hole penetrating the third base body and the third radiating metal layer, and the ninth through hole corresponds to the sixth through hole of the second base body. And a first through hole of the first substrate.

在本創作之一實施例中,該第三饋入元件的穿過該第三基體的第九通孔、該第二基體的第六通孔及該第一基體的第一通孔至該第一基體的底面外部,在該第三饋入元件穿過該第九通孔時與該第三輻射金屬層電性連結,在該第三饋入元件穿過該第一基體底面外部不與該接地金屬層電性連結。In one embodiment of the present invention, the ninth through hole of the third feeding element, the sixth through hole of the second substrate, and the first through hole of the first substrate to the first An external portion of the bottom surface of the substrate is electrically connected to the third radiating metal layer when the third feeding element passes through the ninth through hole, and the third feeding element does not pass through the outside of the bottom surface of the first substrate The grounded metal layer is electrically connected.

在本創作之一實施例中,該第三饋入元件呈T形狀,該第三饋入元件具有一頭部,該頭部延伸一桿體。In an embodiment of the present invention, the third feed element has a T shape, and the third feed element has a head that extends a rod.

在本創作之一實施例中,該第二基體的面積小於該第一輻射金屬層的面積,在該第二基體配置於該第一輻射金屬層的表面時,使該第一輻射金屬層外露。In an embodiment of the present invention, the area of the second substrate is smaller than the area of the first radiant metal layer, and the first radiant metal layer is exposed when the second substrate is disposed on the surface of the first radiant metal layer. .

在本創作之一實施例中,該第三基體的面積小於該第二輻射金屬層的面積,在該第三基體配置於該第二輻射金屬層的表面時,使該第二輻射金屬層外露。In an embodiment of the present invention, the area of the third substrate is smaller than the area of the second radiant metal layer, and the second radiant metal layer is exposed when the third substrate is disposed on the surface of the second radiant metal layer. .

在本創作之一實施例中,該第一基體、該第二基體及該第三基體為陶瓷介質材料製成的扁形的板狀體或塊狀體。In an embodiment of the present invention, the first substrate, the second substrate, and the third substrate are flat plate-shaped bodies or blocks made of a ceramic dielectric material.

茲有關本創作之技術內容及詳細說明,現在配合圖式說明如下:The technical content and detailed description of this creation are now described as follows:

請參閱圖1-4,係本創作之五饋入之三堆疊天線結構分解、組合、仰視及第一基體的背面示意圖。如圖所示:本創作之五饋入之三堆疊天線結構,包括:一第一天線1、一第二天線2、一第三天線3。其中,將該第一天線1、該第二天線2及該第三天線3堆疊呈近錐狀的三堆疊天線10,以形成可以接收不同通訊系統頻率的五饋入之三堆疊天線結構。Please refer to Figure 1-4, which is a schematic diagram of the three-input three-input stacked antenna structure, the combination, the bottom view and the back side of the first substrate. As shown in the figure: the five-input stacked antenna structure of the present invention includes: a first antenna 1, a second antenna 2, and a third antenna 3. The first antenna 1, the second antenna 2, and the third antenna 3 are stacked in a nearly pyramid-shaped three-stack antenna 10 to form a five-input three-stack antenna structure capable of receiving frequencies of different communication systems. .

該第一天線1,其上具有一第一基體11,該第一基體11的表面具有一第一輻射金屬層12,該底面具有一接地金屬層13,該第一基體11上開設有一第一通孔14、一第二通孔15、一第三通孔16、一第四通孔17及一第五通孔18,該第一通孔14、該第二通孔15、該第三通孔16、該第四通孔17及該第五通孔18貫通該第一基體11、第一輻射金屬層12及該接地金屬層13,並且呈十字形排列。另,於該第一天線1更包含有二個第一饋入元件19a、19b,該二第一饋入元件19a、19b由該第四通孔17及該第五通孔18貫穿該第一基體11並與該第一輻射金屬層12電性連結,在該二第一饋入元件19a、19b穿過該第一基體11底面外部後不與該接地金屬層13電性連結。在本圖式中,該第一基體11為陶瓷介質材料製成的扁形的板狀體或塊狀體。The first antenna 1 has a first substrate 11 having a first radiant metal layer 12 on the surface thereof. The bottom surface has a grounding metal layer 13. The first substrate 11 has a first a through hole 14 , a second through hole 15 , a third through hole 16 , a fourth through hole 17 and a fifth through hole 18 , the first through hole 14 , the second through hole 15 , the third The through hole 16, the fourth through hole 17 and the fifth through hole 18 penetrate the first base 11, the first radiating metal layer 12 and the grounding metal layer 13, and are arranged in a cross shape. In addition, the first antenna 1 further includes two first feeding elements 19a and 19b. The two first feeding elements 19a and 19b are penetrated by the fourth through hole 17 and the fifth through hole 18. A base 11 is electrically connected to the first radiating metal layer 12, and is electrically connected to the grounding metal layer 13 after the two first feeding elements 19a and 19b pass outside the bottom surface of the first substrate 11. In the present drawing, the first substrate 11 is a flat plate-like body or a block body made of a ceramic dielectric material.

該第二天線2,其上具有一第二基體21,該第二基體21係以配置於該第一基體1的第一輻射金屬層11的表面上,該第二基體21的面積小於該第一輻射金屬層12的面積,在該第二基體21配置於該第一輻射金屬層12的表面時,使該第一輻射金屬層12外露。另,於該第二基體21表面上具有一第二輻射金屬層22,該第二基體21上設有貫穿該第二基體21及該第二輻射金屬層22的一第六通孔23、一第七通孔24及一第八通孔25,該第六通孔23、該第七通孔24及該第八通孔25分別對應該第一基體11的該些第一通孔14、第二通孔15及該第三通孔16。又,該第二天線2更包含二第二饋入元件26a、26b,該二第二饋入元件26a、26b分別穿過該第七通孔24及該第八通孔25的與該第二輻射金屬層22電性連結後,該二第二饋入元件26a、26b分別再穿過該第二通孔15及該第三通孔16的延伸於該第一基體1底面外部後不與該接地金屬層13電性連結。在本圖式中,該第二基體21為陶瓷介質材料製成的扁形的板狀體或塊狀體。The second antenna 2 has a second substrate 21 disposed on a surface of the first radiating metal layer 11 of the first substrate 1. The area of the second substrate 21 is smaller than the second antenna 21 The area of the first radiating metal layer 12 is such that the first radiating metal layer 12 is exposed when the second substrate 21 is disposed on the surface of the first radiating metal layer 12. In addition, a second radiant metal layer 22 is disposed on the surface of the second substrate 21, and the second substrate 21 is provided with a sixth through hole 23 extending through the second substrate 21 and the second radiant metal layer 22. a seventh through hole 24 and an eighth through hole 25, the sixth through hole 23, the seventh through hole 24 and the eighth through hole 25 respectively corresponding to the first through holes 14 of the first base 11 The two through holes 15 and the third through holes 16. The second antenna 2 further includes two second feeding elements 26a and 26b. The second feeding elements 26a and 26b respectively pass through the seventh through hole 24 and the eighth through hole 25. After the second radiant metal layer 22 is electrically connected, the second feeding elements 26a and 26b respectively pass through the second through hole 15 and the third through hole 16 extends outside the bottom surface of the first substrate 1 The grounded metal layer 13 is electrically connected. In the present drawing, the second substrate 21 is a flat plate-like body or a block body made of a ceramic dielectric material.

該第三天線3,其上具有一第三基體31,該第三基體31係以配置於該第二基體21的第二輻射金屬層22的表面上,該第三基體31的面積小於該第二輻射金屬層22的面積,在該第三基體31配置於該第二輻射金屬層22的表面時,使該第二輻射金屬層22外露。另,於該第三基體31表面上具有一第三輻射金屬層32,該第三基體31上設有貫穿該第三基體31及該第三輻射金屬層32的一第九通孔33,該第九通孔33對應該第二基體21的第六通孔23及該第一基體11的第一通孔14。又,該第三天線3更包含有一第三饋入元件34,該第三饋入元件34呈T形狀,該第三饋入元件34具有一頭部341,該頭部341延伸一桿體342,該桿體342穿過該第三基體31的第九通孔33、該第二基體21的第六通孔23及該第一基體11的第一通孔14至該第一基體11的底面外部。在該第三饋入元件34穿過該第九通孔33時與該第三輻射金屬層32電性連結,在該第三饋入元件34穿過該第一基體11底面外部時不與該接地金屬層13電性連結。在本圖式中,該第三基體31為陶瓷介質材料製成的扁形的板狀體或塊狀體。The third antenna 3 has a third base 31 on the surface of the second radiating metal layer 22 disposed on the second base 21. The third base 31 has an area smaller than the third antenna 31. The area of the second radiant metal layer 22 is such that the second radiant metal layer 22 is exposed when the third substrate 31 is disposed on the surface of the second radiant metal layer 22. In addition, a third radiant metal layer 32 is disposed on the surface of the third substrate 31. The third substrate 31 is provided with a ninth through hole 33 extending through the third substrate 31 and the third radiant metal layer 32. The ninth through hole 33 corresponds to the sixth through hole 23 of the second base 21 and the first through hole 14 of the first base 11. Moreover, the third antenna 3 further includes a third feeding element 34 having a T shape. The third feeding element 34 has a head 341 extending from a rod 342. The rod body 342 passes through the ninth through hole 33 of the third base body 31, the sixth through hole 23 of the second base body 21, and the first through hole 14 of the first base body 11 to the bottom surface of the first base body 11. external. The third feeding element 34 is electrically connected to the third radiating metal layer 32 when the third feeding element 34 passes through the ninth through hole 33. When the third feeding element 34 passes through the outside of the bottom surface of the first substrate 11, the The ground metal layer 13 is electrically connected. In the present drawing, the third base body 31 is a flat plate-like body or a block body made of a ceramic dielectric material.

請參閱圖5,係本創作之五饋入之三堆疊天線結構側剖視示意。如圖所示:在本創作的該第一基體11、該第二基體21及該第三基體31依序的堆疊後,該二第一饋入元件19a、19b穿過該第一基體11的第四通孔17、第五通孔18,該二第二饋入元件26a、26b穿過該第二基體21的第七通孔24、該第八通孔25及該第一基體11的該第二通孔15及該第三通孔16,以及該第三饋入元件34穿過該第三基體31的第九通孔33、該第二基體21的第六通孔23及該第一基體的第一通孔14,形成具有五饋入之三堆疊天線結構。Please refer to FIG. 5 , which is a side cross-sectional view of the three-input stacked antenna structure of the present invention. As shown in the figure, after the first base body 11 , the second base body 21 and the third base body 31 of the present invention are sequentially stacked, the two first feeding elements 19 a , 19 b pass through the first base body 11 . a fourth through hole 17 , a fifth through hole 18 , the second feeding elements 26 a , 26 b passing through the seventh through hole 24 of the second base 21 , the eighth through hole 25 and the first base 11 The second through hole 15 and the third through hole 16 , and the third feeding element 34 passes through the ninth through hole 33 of the third base 31 , the sixth through hole 23 of the second base 21 , and the first The first through hole 14 of the base body forms a three-stack antenna structure having five feeds.

請參閱圖6,係本創作之五饋入之三堆疊天線結構與電子設備的電路板電性連結示意。本創作在該第一天線1、該第二天線2及該第三天線3堆疊後,將該二第一饋入元件19a、19b,二第二饋入元件26a、26b及該第三饋入元件34與該電子設備的電路板20電性連結後,該第一天線1形成可接收GPS L5/L2訊號頻率為1100MH Z-1250MH Z。該第二天線2形成可接收GPS/GNSS/Beidou訊號頻率為1500MH Z-1650MH Z。該第三天線3形成可接收SDARS/WLAN訊號頻率為2300MH Z-2500MH ZPlease refer to FIG. 6 , which is a schematic diagram of the electrical connection of the three-input stacked antenna structure of the present invention and the circuit board of the electronic device. After the first antenna 1, the second antenna 2, and the third antenna 3 are stacked, the two first feeding elements 19a, 19b, the second feeding elements 26a, 26b, and the third after the feeding element 34 and the circuit board of the electronic device 20 is electrically connected to the first antenna 1 is formed may receive GPS L5 / L2 signal frequency 1100MH Z -1250MH Z. The second antenna 2 is formed may receive GPS / GNSS / Beidou signal frequency 1500MH Z -1650MH Z. The third line 3 is formed may receive SDARS / WLAN signal frequency 2300MH Z -2500MH Z.

由於該三堆疊天線10電性連結在電子設備的電路板20上,可以接收不同無線通訊系統頻率,在整合於電子設備上使用時,也不會使電子設備的體積或面積變大。Since the three stacked antennas 10 are electrically connected to the circuit board 20 of the electronic device, different wireless communication system frequencies can be received, and when used on the electronic device, the volume or area of the electronic device is not increased.

惟以上所述僅為本創作之較佳實施例,非意欲侷限本創作的專利保護範圍,故舉凡運用本創作說明書或圖式內容所為的等效變化,均同理皆包含於本創作的權利保護範圍內,合予陳明。However, the above description is only a preferred embodiment of the present invention, and it is not intended to limit the scope of patent protection of the present creation. Therefore, the equivalent changes made by using the present specification or the content of the schema are all included in the right of the creation. Within the scope of protection, it is given to Chen Ming.

10‧‧‧三堆疊天線10‧‧‧Three stacked antennas

1‧‧‧第一天線1‧‧‧first antenna

11‧‧‧第一基體11‧‧‧ First substrate

12‧‧‧第一輻射金屬層12‧‧‧First radiant metal layer

13‧‧‧接地金屬層13‧‧‧Grounded metal layer

14‧‧‧第一通孔14‧‧‧First through hole

15‧‧‧第二通孔15‧‧‧Second through hole

16‧‧‧第三通孔16‧‧‧ third through hole

17‧‧‧第四通孔17‧‧‧4th through hole

18‧‧‧第五通孔18‧‧‧5th through hole

19a、19b‧‧‧第一饋入元件19a, 19b‧‧‧ first feed element

2‧‧‧第二天線2‧‧‧second antenna

21‧‧‧第二基體21‧‧‧Second substrate

22‧‧‧第二輻射金屬層22‧‧‧second radiant metal layer

23‧‧‧第六通孔23‧‧‧ sixth through hole

24‧‧‧第七通孔24‧‧‧ seventh through hole

25‧‧‧第八通孔25‧‧‧8th through hole

26a、26b‧‧‧第二饋入元件26a, 26b‧‧‧second feed element

3‧‧‧第三天線3‧‧‧ third antenna

31‧‧‧第三基體31‧‧‧ third matrix

32‧‧‧第三輻射金屬層32‧‧‧ Third radiant metal layer

33‧‧‧第九通孔33‧‧‧ ninth through hole

34‧‧‧第三饋入元件34‧‧‧ third feed element

341‧‧‧頭部341‧‧‧ head

342‧‧‧桿體342‧‧‧ rod body

20‧‧‧電路板20‧‧‧ boards

圖1,係本創作之五饋入之三堆疊天線結構分解示意圖;FIG. 1 is a schematic exploded view of the stacked antenna structure of the fifth feed of the present invention;

圖2,係本創作之五饋入之三堆疊天線結構組合示意圖;Figure 2 is a schematic diagram of the combination of the three stacked antenna structures of the five feeds of the present creation;

圖3,係本創作之五饋入之三堆疊天線結構仰視示意圖;Figure 3 is a bottom view of the stacked antenna structure of the fifth feed of the present invention;

圖4,係本創作之第一基體的背面示意圖;Figure 4 is a schematic rear view of the first substrate of the present invention;

圖5,係本創作之五饋入之三堆疊天線結構側剖視示意;Figure 5 is a side cross-sectional view showing the structure of the five-input stacked antenna of the present invention;

圖6,係本創作之五饋入之三堆疊天線結構與電子設備的電路板電性連結示意。FIG. 6 is a schematic diagram showing the electrical connection of the stacked antenna structure of the fifth feed of the present invention and the circuit board of the electronic device.

Claims (12)

一種五饋入之三堆疊天線結構,係電性連結於電子設備的電路板上,包括: 一第一天線,其上具有一第一基體,該第一基體的表面具有一第一輻射金屬層,該第一基體的底面具有一接地金屬層,於該第一天線具有二穿過該第一基體的第一饋入元件,該二第一饋入元件穿過該第一基體與該第一輻射金屬層電性連結,該二第一饋入元件穿過該第一基體底面不與該接地金屬層電性連結; 一第二天線,其上具有一第二基體,該第二基體係以配置於該第一基體的第一輻射金屬層的表面上,於該第二基體表面上具有一第二輻射金屬層,該第二天線具有二第二饋入元件,該二第二饋入元件分別穿過該第二基體與該第一基體與該第二輻射金屬層電性連結,該二第二饋入元件在穿過該第一基體底面外部不與該接地金屬層電性連結; 一第三天線,其上具有一第三基體,該第三基體係以配置於該第二基體的第二輻射金屬層的表面上,於該第三基體表面上具有一第三輻射金屬層,該第三天線具有一第三饋入元件,該第三饋入元件與第三輻射金屬層電性連結後,分別穿過該第三基體、該第二基體及該第一基體,在該第三饋入元件穿過該第一基體底面外部不與該接地金屬層電性連結。A five-input three-stack antenna structure electrically connected to a circuit board of an electronic device, comprising: a first antenna having a first substrate thereon, the surface of the first substrate having a first radiating metal The bottom surface of the first substrate has a grounded metal layer, and the first antenna has two first feeding elements passing through the first substrate, and the two first feeding elements pass through the first substrate and the The first radiating metal layer is electrically connected, and the two first feeding elements are not electrically connected to the grounding metal layer through the bottom surface of the first substrate; and a second antenna has a second substrate thereon, the second antenna The base system has a second radiating metal layer disposed on the surface of the first radiating metal layer of the first substrate, and the second antenna has two second feeding elements, the second The second feeding element is electrically connected to the first base body and the second radiating metal layer through the second base body, and the two second feeding elements are not electrically connected to the grounding metal layer outside the bottom surface of the first base body. Sexual connection; a third antenna having a third substrate thereon The third base system has a third radiating metal layer on a surface of the second radiating metal layer disposed on the second substrate, and the third antenna has a third feeding element. After the third feeding element is electrically connected to the third radiating metal layer, respectively, the third feeding body, the second base body and the first base body are respectively passed through the third feeding element outside the bottom surface of the first base body. Electrically coupled to the grounded metal layer. 如申請專利範圍第1項所述之五饋入之三堆疊天線結構,其中,該第一基體上開設有一第一通孔、一第二通孔、一第三通孔、一第四通孔及一第五通孔,該第一通孔、該第二通孔、該第三通孔、該第四通孔及該第五通孔貫通該第一基體、第一輻射金屬層及該接地金屬層。The fifth stacked antenna structure of the fifth feeding method described in claim 1 , wherein the first base has a first through hole, a second through hole, a third through hole and a fourth through hole. And a fifth through hole, the first through hole, the second through hole, the third through hole, the fourth through hole and the fifth through hole penetrating the first base, the first radiating metal layer and the ground Metal layer. 如申請專利範圍第2項所述之五饋入之三堆疊天線結構,其中,該第一通孔、該第二通孔、該第三通孔、該第四通孔及該第五通孔呈十字形排列。The fifth stacked antenna structure of the fifth feeding method described in claim 2, wherein the first through hole, the second through hole, the third through hole, the fourth through hole, and the fifth through hole Arranged in a cross. 如申請專利範圍第3項所述之五饋入之三堆疊天線結構,其中,該二第一饋入元件由該第四通孔及該第五通孔貫穿該第一基體。The five-input stacked antenna structure of the fifth feeding device described in claim 3, wherein the two first feeding elements extend through the first base through the fourth through hole and the fifth through hole. 如申請專利範圍第4項所述之五饋入之三堆疊天線結構,其中,該第二基體上設有貫穿該第二基體及該第二輻射金屬層的一第六通孔、一第七通孔及一第八通孔,該第六通孔、該第七通孔及該第八通孔分別對應該第一基體的該第一通孔、該第二通孔及該第三通孔。The fifth stacked antenna structure of the fifth feeding method described in claim 4, wherein the second substrate is provided with a sixth through hole and a seventh through the second base and the second radiating metal layer. a through hole and an eighth through hole, the sixth through hole, the seventh through hole and the eighth through hole respectively corresponding to the first through hole, the second through hole and the third through hole of the first base body . 如申請專利範圍第5項所述之五饋入之三堆疊天線結構,其中,該二第二饋入元件分別穿過該第七通孔及該第八通孔的與該第二輻射金屬層電性連結後,該二第二饋入元件分別再穿過該第二通孔及該第三通孔的延伸於該第一基體底面外部不與該接地金屬層電性連結。The fifth stacked antenna structure of the fifth feeding element described in claim 5, wherein the two second feeding elements respectively pass through the seventh through hole and the eighth through hole and the second radiating metal layer After being electrically connected, the two second feeding elements respectively pass through the second through holes and the third through holes extend outside the bottom surface of the first substrate without being electrically connected to the ground metal layer. 如申請專利範圍第6項所述之五饋入之三堆疊天線結構,其中,該第三基體上設有貫穿該第三基體及該第三輻射金屬層的一第九通孔,該第九通孔對應該第二基體的第六通孔及該第一基體的第一通孔。The fifth stacked antenna structure of the fifth feeding method described in claim 6 , wherein the third substrate is provided with a ninth through hole penetrating the third base body and the third radiating metal layer, the ninth The through hole corresponds to the sixth through hole of the second base and the first through hole of the first base. 如申請專利範圍第7項所述之五饋入之三堆疊天線結構,其中,該第三饋入元件的穿過該第三基體的第九通孔、該第二基體的第六通孔及該第一基體的第一通孔至該第一基體的底面外部,在該第三饋入元件穿過該第九通孔時與該第三輻射金屬層電性連結,在該第三饋入元件穿過該第一基體底面外部不與該接地金屬層電性連結。The fifth stacked antenna structure of the fifth feeding unit according to claim 7 , wherein the third feeding element of the third feeding element passes through the ninth through hole of the third substrate, and the sixth through hole of the second substrate a first through hole of the first substrate is external to a bottom surface of the first substrate, and is electrically connected to the third radiating metal layer when the third feeding element passes through the ninth through hole, and the third feeding The component is not electrically connected to the ground metal layer through the outside of the bottom surface of the first substrate. 如申請專利範圍第1項所述之五饋入之三堆疊天線結構,其中,該第三饋入元件呈T形狀,該第三饋入元件具有一頭部,該頭部延伸一桿體。A three-input stacked antenna structure as described in claim 1, wherein the third feed element has a T shape, and the third feed element has a head that extends a rod. 如申請專利範圍第1項所述之五饋入之三堆疊天線結構,其中,該第二基體的面積小於該第一輻射金屬層的面積,在該第二基體配置於該第一輻射金屬層的表面時,使該第一輻射金屬層外露。The five-input stacked antenna structure as described in claim 1, wherein the second substrate has an area smaller than an area of the first radiating metal layer, and the second substrate is disposed on the first radiating metal layer. The surface of the first radiant metal is exposed. 如申請專利範圍第1項所述之五饋入之三堆疊天線結構,其中,該第三基體的面積小於該第二輻射金屬層的面積,在該第三基體配置於該第二輻射金屬層的表面時,使該第二輻射金屬層外露。The five-input stacked antenna structure as described in claim 1, wherein the third substrate has an area smaller than an area of the second radiating metal layer, and the third substrate is disposed on the second radiating metal layer. The surface of the second radiant metal is exposed. 如申請專利範圍第1項所述之五饋入之三堆疊天線結構,其中,該第一基體、該第二基體及該第三基體為陶瓷介質材料製成的扁形的板狀體或塊狀體。The five-input stacked antenna structure as described in claim 1, wherein the first substrate, the second substrate, and the third substrate are flat plate-like bodies or blocks made of a ceramic dielectric material. body.
TW107201546U 2018-01-31 2018-01-31 Five-feed three-stacked antenna structure TWM561928U (en)

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