TWM561925U - Four-hole type three-stacked antenna structure - Google Patents

Four-hole type three-stacked antenna structure Download PDF

Info

Publication number
TWM561925U
TWM561925U TW107201550U TW107201550U TWM561925U TW M561925 U TWM561925 U TW M561925U TW 107201550 U TW107201550 U TW 107201550U TW 107201550 U TW107201550 U TW 107201550U TW M561925 U TWM561925 U TW M561925U
Authority
TW
Taiwan
Prior art keywords
hole
substrate
metal layer
base
radiating metal
Prior art date
Application number
TW107201550U
Other languages
Chinese (zh)
Inventor
Quinlan Ronan
Tsai-Yi Yang
Original Assignee
Taoglas Group Holdings Ltd
Taoglas Ltd
Taoglas Tech Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taoglas Group Holdings Ltd, Taoglas Ltd, Taoglas Tech Corporation filed Critical Taoglas Group Holdings Ltd
Priority to TW107201550U priority Critical patent/TWM561925U/en
Publication of TWM561925U publication Critical patent/TWM561925U/en

Links

Abstract

一種四孔式之三堆疊天線結構,包括:一第一天線、一第二天線及一第三天線。第一天線具第一基體、第一輻射金屬層及接地金屬層。第二天線具第二基體及第二輻射金屬層,第二基體堆疊於第一基體上。第三天線具第三基體及第三輻射金屬層,第三基體堆疊於第二基體上,以至少一個饋入元件穿過第三基體、第二基體與第一基體並與第三輻射金屬層電性連結,或與第二基體及第三基體的第二輻射金屬層及第三輻射金屬層耦合或電性連結,饋入元件在穿過第一基體不與接地金屬層電性連結,形成具單一或多個訊號饋入可接收不同頻率的四孔式之三堆疊天線結構。A four-hole three-stack antenna structure includes: a first antenna, a second antenna, and a third antenna. The first antenna has a first substrate, a first radiant metal layer, and a grounded metal layer. The second antenna has a second substrate and a second radiant metal layer, and the second substrate is stacked on the first substrate. The third antenna has a third base body and a third radiating metal layer, and the third base body is stacked on the second base body, and the at least one feed element passes through the third base body, the second base body and the first base body, and the third radiating metal layer Electrically coupled or electrically coupled or electrically coupled to the second and third radiating metal layers of the second and third substrates, the feed element is electrically connected to the grounded metal layer through the first substrate A single-hole or multiple signal feed can receive a four-hole three-stack antenna structure with different frequencies.

Description

四孔式之三堆疊天線結構Four-hole three-stack antenna structure

本創作係有關一種天線,尤指一種具有接收不同通訊系統頻率的四孔式之三堆疊天線結構。The present invention relates to an antenna, and more particularly to a four-hole three-stack antenna structure having the frequency of receiving different communication systems.

目前市面上所使用的無線通訊系統至少包含有:一全球導航衛星系統(GNSS)、一專用短程通信技術系統(DSRC)、一衛星數位音訊無線電業務系統(SDARS)、一長期演進技術系統(LTE)、一無線網路系統(WLAN/BT)等。而且該全球導航衛星系統中包括全球的、區域的和增強的,例如全球定位系統(Global Positioning System,GPS)、格洛納斯(GLONASS)是俄語中的全球衛星導航系統(GLOBAL NAVIGATION SATELLITE SYSTEM)的縮寫、伽利略定位系統(Galileo)、北斗衛星導航系統,以及相關的增強系統,如WAAS(廣域增強系統)、EGNOS(歐洲靜地導航重疊系統)和MSAS(多功能運輸衛星增強系統)等無線通訊系統。這些無線通訊系統中,每一個無線通訊系統都有連結相匹配的接收天線來接收訊號。At present, the wireless communication system used in the market at least includes: a global navigation satellite system (GNSS), a dedicated short-range communication technology system (DSRC), a satellite digital audio service system (SDARS), and a long-term evolution technology system (LTE). ), a wireless network system (WLAN/BT), etc. Moreover, the global navigation satellite system includes global, regional and enhanced, such as Global Positioning System (GPS), GLONASS is the GLOBAL NAVIGATION SATELLITE SYSTEM in Russian. Abbreviations, Galileo positioning system (Galileo), Beidou satellite navigation system, and related augmentation systems such as WAAS (Wide Area Augmentation System), EGNOS (European Static Navigation Overlay System) and MSAS (Multifunctional Transportation Satellite Augmentation System) Wireless communication system. In these wireless communication systems, each wireless communication system has a matching receiving antenna to receive signals.

近年來科技不斷的進步下,將上述的各種無線通訊系統整合在一個電子設備(例如汽車的行車電腦)中,使該電子設備不管行銷到世界各地,該電子設備都不需重新設計即可啟動使用。由於電子設備整合了多種的無線通訊系統,相對地該電子設備的電路板上也需要裝多支的天線,才可接收各種無線通訊系統的訊號。In recent years, with the continuous advancement of technology, the above various wireless communication systems are integrated into an electronic device (such as a driving computer of a car), so that the electronic device can be started without redesigning regardless of marketing to the world. use. Since the electronic device integrates a plurality of wireless communication systems, relatively many antennas are required on the circuit board of the electronic device to receive signals of various wireless communication systems.

雖然,此種的整合設計讓電子設備較不受使用地方及區域的限制,但是電子設備的電路板上需整合多支天線,且每一個天線都有一特定的尺寸,且分散設立的位置都不盡相同且占空間,將會導致電路板的面積變大,也使得安裝於該電路板的外殼或空間也相對變大,因此也造成整合上的困難。Although such an integrated design makes the electronic device less restricted by the place of use and the area, the electronic device has a plurality of antennas integrated on the circuit board, and each antenna has a specific size, and the dispersed positions are not located. The same and occupying space will lead to an increase in the area of the circuit board, and also make the outer casing or space mounted on the circuit board relatively large, thus causing integration difficulties.

因此,本創作之主要目的,在於解決傳統缺失,本創作在於提供一種將三個天線堆疊在一起形成具有四孔式之三堆疊天線結構,能接收各種無線通訊系統的訊號,且使堆疊後的三堆疊天線可以輕易與電子設備做整合,使整合設計上更加簡單,也不會造成電路板的面積變大。Therefore, the main purpose of this creation is to solve the traditional lack. The present invention aims to provide a three-layer stacked antenna structure by stacking three antennas, which can receive signals of various wireless communication systems, and after stacking. The three-stack antenna can be easily integrated with electronic devices, making the integrated design simpler and without causing the board area to become larger.

為達上述之目的,本創作提供一種四孔式之三堆疊天線結構,包括:一第一天線、一第二天線及一第三天線。該第一天線上具有一第一基體,該第一基體的表面具有一第一輻射金屬層,該底面具有一接地金屬層,該第一基體上開設有一第一通孔、一第二通孔、一第三通孔及一第四通孔,該第一通孔、該第二通孔、該第三通孔及該第四通孔貫通該第一基體、第一輻射金屬層及該接地金屬層。該第二天線上具有一第二基體,該第二基體係以配置於該第一基體的第一輻射金屬層的表面上;另於該第二基體表面上具有一第二輻射金屬層,該第二基體上設有貫穿該第二基體及該第二輻射金屬層的一第五通孔、一第六通孔及一第七通孔,該第五通孔、該第六通孔及該第七通孔分別對應該第一基體的該第二通孔、該第三通孔及該第四通孔。該第三天線上具有一第三基體,該第三基體係以配置於該第二基體的第二輻射金屬層的表面上;另於該第三基體表面上具有一第三輻射金屬層,該第三基體上設有貫穿該第三基體及該第三輻射金屬層的一第八通孔,該第八通孔對應該第二基體的第六通孔及該第一基體的第三通孔;又,該第三天線更包含有一第一饋入元件,該第一饋入元件穿過該第三基體的第八通孔、該第二基體的第六通孔及該第一基體的第三通孔至該第一基體的底面外部。其中,在該第一饋入元件穿過該第八通孔時與該第三輻射金屬層電性連結,在該第一饋入元件穿過該第二基體時與該第二輻射金屬層形成耦合連結,在該第一饋入元件穿過該第三通孔時與該第一基體上的第一輻射金屬層形成耦合連結,在該第一饋入元件穿過第一基體底面外部時不與該接地金屬層電性連結,以形成單饋入的四孔式之三堆疊天線結構。For the above purposes, the present invention provides a four-hole three-stack antenna structure including: a first antenna, a second antenna, and a third antenna. The first antenna has a first base body, and the surface of the first base has a first radiating metal layer, the bottom surface has a grounding metal layer, and the first base has a first through hole and a second through hole. a third through hole and a fourth through hole, the first through hole, the second through hole, the third through hole and the fourth through hole penetrating the first base, the first radiating metal layer and the ground Metal layer. The second antenna has a second substrate disposed on a surface of the first radiating metal layer of the first substrate; and a second radiating metal layer on the surface of the second substrate. a second through hole, a sixth through hole and a seventh through hole extending through the second base and the second radiating metal layer, the fifth through hole, the sixth through hole and the second base The seventh through holes respectively correspond to the second through holes, the third through holes and the fourth through holes of the first substrate. The third antenna has a third base body disposed on a surface of the second radiating metal layer of the second base; and a third radiating metal layer on the surface of the third base. An eighth through hole penetrating the third base body and the third radiating metal layer is disposed on the third base body, the eighth through hole corresponding to the sixth through hole of the second base body and the third through hole of the first base body Further, the third antenna further includes a first feeding element, the first feeding element passing through the eighth through hole of the third base, the sixth through hole of the second base, and the first base The three through holes are outside the bottom surface of the first substrate. The first feeding element is electrically connected to the third radiating metal layer when the first feeding element passes through the eighth through hole, and forms with the second radiating metal layer when the first feeding element passes through the second through hole. The coupling connection forms a coupling connection with the first radiating metal layer on the first substrate when the first feeding element passes through the third through hole, when the first feeding element passes outside the first substrate bottom surface The grounding metal layer is electrically connected to form a single-fed, four-hole three-stack antenna structure.

為達上述之目的,本創作另提供一種四孔式之三堆疊天線結構,包括:一第一天線、一第二天線及一第三天線。該第一天線上具有一第一基體,該第一基體的表面具有一第一輻射金屬層,該底面具有一接地金屬層,該第一基體上開設有一第一通孔、一第二通孔、一第三通孔及一第四通孔,該第一通孔、該第二通孔、該第三通孔及該第四通孔貫通該第一基體、第一輻射金屬層及該接地金屬層。該第二天線上具有一第二基體,該第二基體係以配置於該第一基體的第一輻射金屬層的表面上;另於該第二基體表面上具有一第二輻射金屬層,該第二基體上設有貫穿該第二基體及該第二輻射金屬層的一第五通孔、一第六通孔及一第七通孔,該第五通孔、該第六通孔及該第七通孔分別對應該第一基體的該第二通孔、該第三通孔及該第四通孔;又,該第二天線包含有一第二饋入元件,該第二饋入元件穿過該第五通孔與該第二輻射金屬層電性連結,再穿過該第一基體的第二通孔。該第三天線上具有一第三基體,該第三基體係以配置於該第二基體的第二輻射金屬層的表面上;另於該第三基體表面上具有一第三輻射金屬層,該第三基體上設有貫穿該第三基體及該第三輻射金屬層的一第八通孔,該第八通孔對應該第二基體的第六通孔及該第一基體的第三通孔;又,該第三天線更包含有一第一饋入元件,該第一饋入元件穿過該第三基體的第八通孔、該第二基體的第六通孔及該第一基體的第三通孔至該第一基體的底面外部。其中,該第二饋入元件在穿過第二基體的第五通孔與該第二輻射金屬層電性連結,再穿過該第一基體的第二通孔與該第一輻射金屬層形成耦合連結,該第一饋入元件穿過該第八通孔時與該第三輻射金屬層電性連結,在該第一饋入元件穿過該第二基體時與該第二輻射金屬層形成耦合連結,在該第一饋入元件穿過該第三通孔時與該第一基體上的第一輻射金屬層形成耦合連結,在該第二饋入元件及該第一饋入元件穿過第一基體底面外部時不與該接地金屬層電性連結,以形成二饋入的四孔式之三堆疊天線結構。For the above purposes, the present invention further provides a four-hole three-stack antenna structure, including: a first antenna, a second antenna, and a third antenna. The first antenna has a first base body, and the surface of the first base has a first radiating metal layer, the bottom surface has a grounding metal layer, and the first base has a first through hole and a second through hole. a third through hole and a fourth through hole, the first through hole, the second through hole, the third through hole and the fourth through hole penetrating the first base, the first radiating metal layer and the ground Metal layer. The second antenna has a second substrate disposed on a surface of the first radiating metal layer of the first substrate; and a second radiating metal layer on the surface of the second substrate. a second through hole, a sixth through hole and a seventh through hole extending through the second base and the second radiating metal layer, the fifth through hole, the sixth through hole and the second base The seventh through hole respectively corresponds to the second through hole, the third through hole and the fourth through hole of the first base; and the second antenna comprises a second feeding element, the second feeding element The second through hole is electrically connected to the second radiating metal layer and then passes through the second through hole of the first substrate. The third antenna has a third base body disposed on a surface of the second radiating metal layer of the second base; and a third radiating metal layer on the surface of the third base. An eighth through hole penetrating the third base body and the third radiating metal layer is disposed on the third base body, the eighth through hole corresponding to the sixth through hole of the second base body and the third through hole of the first base body Further, the third antenna further includes a first feeding element, the first feeding element passing through the eighth through hole of the third base, the sixth through hole of the second base, and the first base The three through holes are outside the bottom surface of the first substrate. The second feeding element is electrically connected to the second radiating metal layer through the fifth through hole of the second substrate, and then formed through the second through hole of the first substrate and the first radiating metal layer. Coupling, the first feeding element is electrically connected to the third radiating metal layer when passing through the eighth through hole, and forms with the second radiating metal layer when the first feeding element passes through the second through hole a coupling connection, when the first feeding element passes through the third through hole, forms a coupling connection with the first radiating metal layer on the first substrate, and the second feeding element and the first feeding element pass through The outer surface of the first substrate is not electrically connected to the ground metal layer to form a two-feed three-layer stacked antenna structure.

為達上述之目的,本創作再提供一種四孔式之三堆疊天線結構,包括:一第一天線、一第二天線及一第三天線。該第一天線上具有一第一基體,該第一基體的表面具有一第一輻射金屬層,該底面具有一接地金屬層,該第一基體上開設有一第一通孔、一第二通孔、一第三通孔及一第四通孔,該第一通孔、該第二通孔、該第三通孔及該第四通孔貫通該第一基體、第一輻射金屬層及該接地金屬層;又,該第一天線包含有一第三饋入元件,該第三饋入元件穿過該第四通孔與該第一輻射金屬層電性連結。該第二天線上具有一第二基體,該第二基體係以配置於該第一基體的第一輻射金屬層的表面上;另於該第二基體表面上具有一第二輻射金屬層,該第二基體上設有貫穿該第二基體及該第二輻射金屬層的一第五通孔、一第六通孔及一第七通孔,該第五通孔、該第六通孔及該第七通孔分別對應該第一基體的該第二通孔、該第三通孔及該第四通孔;又該第二天線包含有一第二饋入元件,該第二饋入元件穿過該第五通孔與該第二輻射金屬層電性連結,再穿過該第一基體的第二通孔。該第三天線上具有一第三基體,該第三基體係以配置於該第二基體的第二輻射金屬層的表面上;另於該第三基體表面上具有一第三輻射金屬層,該第三基體上設有貫穿該第三基體及該第三輻射金屬層的一第八通孔,該第八通孔對應該第二基體的第六通孔及該第一基體的第三通孔;又,該第三天線更包含有一第一饋入元件,該第一饋入元件穿過該第三基體的第八通孔、該第二基體的第六通孔及該第一基體的第三通孔至該第一基體的底面外部。其中,該第三饋入元件在穿過第一基體的第四通孔與該第一輻射金屬層電性連結,該第二饋入元件在穿過第二基體的第五通孔與該第二輻射金屬層電性連結,再穿過該第一基體的第二通孔與該第一輻射金屬層形成耦合連結,該第一饋入元件穿過該第八通孔時與該第三輻射金屬層電性連結,在該第一饋入元件穿過該第二基體時與該第二輻射金屬層形成耦合連結,在該第一饋入元件穿過該第三通孔時與該第一基體上的第一輻射金屬層形成耦合連結,在該第三饋入元件、該第二饋入元件及該第一饋入元件穿過第一基體底面外部時不與該接地金屬層電性連結,以形成三饋入的四孔式之三堆疊天線結構。In order to achieve the above purpose, the present invention further provides a four-hole three-stack antenna structure, including: a first antenna, a second antenna, and a third antenna. The first antenna has a first base body, and the surface of the first base has a first radiating metal layer, the bottom surface has a grounding metal layer, and the first base has a first through hole and a second through hole. a third through hole and a fourth through hole, the first through hole, the second through hole, the third through hole and the fourth through hole penetrating the first base, the first radiating metal layer and the ground The first antenna includes a third feed element, and the third feed element is electrically connected to the first radiating metal layer through the fourth through hole. The second antenna has a second substrate disposed on a surface of the first radiating metal layer of the first substrate; and a second radiating metal layer on the surface of the second substrate. a second through hole, a sixth through hole and a seventh through hole extending through the second base and the second radiating metal layer, the fifth through hole, the sixth through hole and the second base The seventh through hole respectively corresponds to the second through hole, the third through hole and the fourth through hole of the first substrate; and the second antenna comprises a second feeding element, the second feeding element is worn The fifth through hole is electrically connected to the second radiating metal layer and then passes through the second through hole of the first substrate. The third antenna has a third base body disposed on a surface of the second radiating metal layer of the second base; and a third radiating metal layer on the surface of the third base. An eighth through hole penetrating the third base body and the third radiating metal layer is disposed on the third base body, the eighth through hole corresponding to the sixth through hole of the second base body and the third through hole of the first base body Further, the third antenna further includes a first feeding element, the first feeding element passing through the eighth through hole of the third base, the sixth through hole of the second base, and the first base The three through holes are outside the bottom surface of the first substrate. Wherein the third feeding element is electrically connected to the first radiating metal layer in a fourth through hole passing through the first base body, and the second feeding element is in the fifth through hole passing through the second base body and the first The second radiating metal layer is electrically connected, and the second through hole passing through the first substrate is coupled to the first radiating metal layer, and the first feeding element passes through the eighth through hole and the third radiation The metal layer is electrically connected to form a coupling connection with the second radiation metal layer when the first feeding element passes through the second substrate, and the first feeding element passes through the third through hole and the first The first radiant metal layer on the substrate forms a coupling connection, and the third feeding element, the second feeding element and the first feeding element are not electrically connected to the ground metal layer when the first feeding element passes outside the first substrate bottom surface To form a three-input four-hole three-stack antenna structure.

為達上述之目的,本創作又提供一種四孔式之三堆疊天線結構,包括:一第一天線、一第二天線及一第三天線。該第一天線上具有一第一基體,該第一基體的表面具有一第一輻射金屬層,該底面具有一接地金屬層,該第一基體上開設有一第一通孔、一第二通孔、一第三通孔及一第四通孔,該第一通孔、該第二通孔、該第三通孔及該第四通孔貫通該第一基體、第一輻射金屬層及該接地金屬層;又,該第一天線包含有二第三饋入元件,該二第三饋入元件分別穿過該第四通孔及該第一通孔與該第一輻射金屬層電性連結。該第二天線上具有一第二基體,該第二基體係以配置於該第一基體的第一輻射金屬層的表面上;另於該第二基體表面上具有一第二輻射金屬層,該第二基體上設有貫穿該第二基體及該第二輻射金屬層的一第五通孔、一第六通孔及一第七通孔,該第五通孔、該第六通孔及該第七通孔分別對應該第一基體的該第二通孔、該第三通孔及該第四通孔;又該第二天線包含有一第二饋入元件,該第二饋入元件穿過該第五通孔與該第二輻射金屬層電性連結,再穿過該第一基體的第二通孔。該第三天線,其上具有一第三基體,該第三基體係以配置於該第二基體的第二輻射金屬層的表面上;另於該第三基體表面上具有一第三輻射金屬層,該第三基體上設有貫穿該第三基體及該第三輻射金屬層的一第八通孔,該第八通孔對應該第二基體的第六通孔及該第一基體的第三通孔;又,該第三天線更包含有一第一饋入元件,該第一饋入元件穿過該第三基體的第八通孔、該第二基體的第六通孔及該第一基體的第三通孔至該第一基體的底面外部。其中,該二第三饋入元件分別在穿過第一基體的該第一通孔及該第四通孔與該第一輻射金屬層電性連結,該第二饋入元件在穿過第二基體的第五通孔與該第二輻射金屬層電性連結,再穿過該第一基體的第二通孔與該第一輻射金屬層形成耦合連結,該第一饋入元件穿過該第八通孔時與該第三輻射金屬層電性連結,在該第一饋入元件穿過該第二基體時與該第二輻射金屬層形成耦合連結,在該第一饋入元件穿過該第三通孔時與該第一基體上的第一輻射金屬層形成耦合連結,在該二第三饋入元件、該第二饋入元件及該第一饋入元件穿過第一基體底面外部時不與該接地金屬層電性連結,以形成四饋入的四孔式之三堆疊天線結構。To achieve the above purpose, the present invention further provides a four-hole three-stack antenna structure, including: a first antenna, a second antenna, and a third antenna. The first antenna has a first base body, and the surface of the first base has a first radiating metal layer, the bottom surface has a grounding metal layer, and the first base has a first through hole and a second through hole. a third through hole and a fourth through hole, the first through hole, the second through hole, the third through hole and the fourth through hole penetrating the first base, the first radiating metal layer and the ground a metal layer; the first antenna includes two third feeding elements, and the two third feeding elements respectively pass through the fourth through hole and the first through hole is electrically connected to the first radiating metal layer . The second antenna has a second substrate disposed on a surface of the first radiating metal layer of the first substrate; and a second radiating metal layer on the surface of the second substrate. a second through hole, a sixth through hole and a seventh through hole extending through the second base and the second radiating metal layer, the fifth through hole, the sixth through hole and the second base The seventh through hole respectively corresponds to the second through hole, the third through hole and the fourth through hole of the first substrate; and the second antenna comprises a second feeding element, the second feeding element is worn The fifth through hole is electrically connected to the second radiating metal layer and then passes through the second through hole of the first substrate. The third antenna has a third substrate thereon, the third base system is disposed on a surface of the second radiating metal layer of the second substrate; and a third radiating metal layer is disposed on the surface of the third substrate The third substrate is provided with an eighth through hole penetrating the third base body and the third radiating metal layer, the eighth through hole corresponding to the sixth through hole of the second base body and the third through hole of the first base body The third antenna further includes a first feeding component, the first feeding component passing through the eighth through hole of the third substrate, the sixth through hole of the second substrate, and the first substrate The third through hole is outside the bottom surface of the first substrate. The second feeding element is electrically connected to the first radiating metal layer in the first through hole and the fourth through hole respectively passing through the first base body, and the second feeding element is passing through the second The fifth through hole of the base is electrically connected to the second radiating metal layer, and the second through hole of the first base is coupled to the first radiating metal layer, and the first feeding element passes through the first through hole. The eight-via hole is electrically connected to the third radiating metal layer, and the first feeding element is coupled to the second radiating metal layer when the first feeding element passes through the second substrate, and the first feeding element passes through the The third through hole is coupled to the first radiating metal layer on the first substrate, and the second feeding element, the second feeding element and the first feeding element are disposed outside the bottom surface of the first substrate The grounding metal layer is not electrically connected to form a four-input four-hole three-stack antenna structure.

在本創作之一實施例中,該第一饋入元件呈T形狀,該第一饋入元件具有一頭部,該頭部延伸一桿體。In an embodiment of the present invention, the first feed element has a T shape, and the first feed element has a head that extends a rod.

在本創作之一實施例中,該第二基體的面積小於該第一輻射金屬層的面積,在該第二基體配置於該第一輻射金屬層的表面時,使該第一輻射金屬層外露。In an embodiment of the present invention, the area of the second substrate is smaller than the area of the first radiant metal layer, and the first radiant metal layer is exposed when the second substrate is disposed on the surface of the first radiant metal layer. .

在本創作之一實施例中,該第三基體的面積小於該第二輻射金屬層的面積,在該第三基體配置於該第二輻射金屬層的表面時,使該第二輻射金屬層外露。In an embodiment of the present invention, the area of the third substrate is smaller than the area of the second radiant metal layer, and the second radiant metal layer is exposed when the third substrate is disposed on the surface of the second radiant metal layer. .

在本創作之一實施例中,該第一基體、該第二基體及該第三基體為陶瓷介質材料製成的扁形的板狀體或塊狀體。In an embodiment of the present invention, the first substrate, the second substrate, and the third substrate are flat plate-shaped bodies or blocks made of a ceramic dielectric material.

茲有關本創作之技術內容及詳細說明,現在配合圖式說明如下:The technical content and detailed description of this creation are now described as follows:

請參閱圖1-4,係本創作之第一實施例的四孔式之三堆疊天線結構分解、組合、仰視及第一基體的背面示意圖。如圖所示:本創作之四孔式之三堆疊天線結構,包括:一第一天線1、一第二天線2、一第三天線3。其中,將該第一天線1、該第二天線2及該第三天線3堆疊呈近錐狀的三堆疊天線10,以形成可以接收不同通訊系統頻率的四孔式之三堆疊天線結構。Referring to FIG. 1-4, the four-hole three-stack antenna structure of the first embodiment of the present invention is exploded, combined, looked up, and the back view of the first substrate. As shown in the figure: the four-hole three-stack antenna structure of the present invention comprises: a first antenna 1, a second antenna 2, and a third antenna 3. The first antenna 1, the second antenna 2, and the third antenna 3 are stacked in a nearly pyramid-shaped three-stack antenna 10 to form a four-hole three-stack antenna structure capable of receiving frequencies of different communication systems. .

該第一天線1,其上具有一第一基體11,該第一基體11的表面具有一第一輻射金屬層12,該底面具有一接地金屬層13,該第一基體11上開設有一第一通孔14、一第二通孔15、一第三通孔16及一第四通孔17,該第一通孔14、該第二通孔15、該第三通孔16及該第四通孔17貫通該第一基體11、第一輻射金屬層12及該接地金屬層13。在本圖式中,該第一基體11為陶瓷介質材料製成的扁形的板狀體或塊狀體。The first antenna 1 has a first substrate 11 having a first radiant metal layer 12 on the surface thereof. The bottom surface has a grounding metal layer 13. The first substrate 11 has a first a through hole 14 , a second through hole 15 , a third through hole 16 and a fourth through hole 17 , the first through hole 14 , the second through hole 15 , the third through hole 16 and the fourth The through hole 17 penetrates the first base 11 , the first radiating metal layer 12 , and the grounded metal layer 13 . In the present drawing, the first substrate 11 is a flat plate-like body or a block body made of a ceramic dielectric material.

該第二天線2,其上具有一第二基體21,該第二基體21係以配置於該第一基體1的第一輻射金屬層11的表面上,該第二基體21的面積小於該第一輻射金屬層12的面積,在該第二基體21配置於該第一輻射金屬層12的表面時,使該第一輻射金屬層12外露。另,於該第二基體21表面上具有一第二輻射金屬層22,該第二基體21上設有貫穿該第二基體21及該第二輻射金屬層22的一第五通孔23、一第六通孔24及一第七通孔25,該第五通孔23、該第六通孔24及該第七通孔25分別對應該第一基體11的該第二通孔15、該第三通孔16及該第四通孔17。在本圖式中,該第二基體21為陶瓷介質材料製成的扁形的板狀體或塊狀體。The second antenna 2 has a second substrate 21 disposed on a surface of the first radiating metal layer 11 of the first substrate 1. The area of the second substrate 21 is smaller than the second antenna 21 The area of the first radiating metal layer 12 is such that the first radiating metal layer 12 is exposed when the second substrate 21 is disposed on the surface of the first radiating metal layer 12. In addition, a second radiating metal layer 22 is disposed on the surface of the second substrate 21, and the second substrate 21 is provided with a fifth through hole 23 extending through the second substrate 21 and the second radiating metal layer 22. a sixth through hole 24 and a seventh through hole 25, the fifth through hole 23, the sixth through hole 24 and the seventh through hole 25 respectively corresponding to the second through hole 15 of the first base 11, the first a three-way hole 16 and the fourth through hole 17. In the present drawing, the second substrate 21 is a flat plate-like body or a block body made of a ceramic dielectric material.

該第三天線3,其上具有一第三基體31,該第三基體31係以配置於該第二基體21的第二輻射金屬層22的表面上,該第三基體31的面積小於該第二輻射金屬層22的面積,在該第三基體31配置於該第二輻射金屬層22的表面時,使該第二輻射金屬層22外露。另,於該第三基體31表面上具有一第三輻射金屬層32,該第三基體31上設有貫穿該第三基體31及該第三輻射金屬層32的一第八通孔33,該第八通孔33對應該第二基體21的第六通孔23及該第一基體11的第三通孔16。又,該第三天線3更包含有一第一饋入元件34,該第一饋入元件34呈T形狀,該第一饋入元件34具有一頭部341,該頭部341延伸一桿體342,該桿體342穿過該第三基體31的第八通孔33、該第二基體21的第六通孔23及該第一基體11的第三通孔16至該第一基體11的底面外部。在該第一饋入元件34穿過該第八通孔33時與該第三輻射金屬層32電性連結,在該第一饋入元件34穿過該第二基體21時與該第二輻射金屬層22形成耦合連結,在該第一饋入元件34穿過該第三通孔16時與該第一基體11上的第一輻射金屬層12形成耦合連結,在該第一饋入元件34穿過第一基體11底面外部時不與該接地金屬層13電性連結。在本圖式中,該第三基體31為陶瓷介質材料製成的扁形的板狀體或塊狀體。The third antenna 3 has a third base 31 on the surface of the second radiating metal layer 22 disposed on the second base 21. The third base 31 has an area smaller than the third antenna 31. The area of the second radiant metal layer 22 is such that the second radiant metal layer 22 is exposed when the third substrate 31 is disposed on the surface of the second radiant metal layer 22. In addition, a third radiant metal layer 32 is disposed on the surface of the third substrate 31. The third substrate 31 is provided with an eighth through hole 33 extending through the third substrate 31 and the third radiant metal layer 32. The eighth through hole 33 corresponds to the sixth through hole 23 of the second base 21 and the third through hole 16 of the first base 11. Moreover, the third antenna 3 further includes a first feeding element 34 having a T shape. The first feeding element 34 has a head 341 extending from a rod 342. The rod body 342 passes through the eighth through hole 33 of the third base body 31, the sixth through hole 23 of the second base body 21, and the third through hole 16 of the first base body 11 to the bottom surface of the first base body 11. external. When the first feeding element 34 passes through the eighth through hole 33, it is electrically connected to the third radiating metal layer 32, and when the first feeding element 34 passes through the second substrate 21, the second radiation The metal layer 22 is coupled to form a coupling connection with the first radiating metal layer 12 on the first substrate 11 when the first feeding element 34 passes through the third through hole 16 , and the first feeding element 34 is coupled to the first feeding element 34 . When passing through the outside of the bottom surface of the first substrate 11, it is not electrically connected to the ground metal layer 13. In the present drawing, the third base body 31 is a flat plate-like body or a block body made of a ceramic dielectric material.

請參閱圖5,係本創作之第一實施例的四孔式之三堆疊天線結構側剖視示意。如圖所示:在本創作之該第一天線1、該第二天線2及該第三天線3依序的堆疊後,以該第一饋入元件34穿過該第八通孔33並與該第三輻射金屬層32形成電性連結,在該第一饋入元件34穿過該第二基體21時與該第二輻射金屬層22形成耦合連結,在該第一饋入元件34穿過該第三通孔16時與該第一基體11上的第一輻射金屬層12形成耦合連結,在該第一饋入元件34穿過第一基體11底面外部時不與該接地金屬層13電性連結,形成具有單一饋入元件的四孔式(由第一天線1底面觀之)之三堆疊天線結構。Referring to FIG. 5, a side cross-sectional view of a four-hole three-stack antenna structure of the first embodiment of the present invention is shown. As shown in the figure, after the first antenna 1, the second antenna 2, and the third antenna 3 of the present invention are sequentially stacked, the first feeding element 34 passes through the eighth through hole 33. And electrically connecting with the third radiant metal layer 32, and forming a coupling connection with the second radiant metal layer 22 when the first feeding element 34 passes through the second substrate 21, at the first feeding element 34. Passing through the third through hole 16 to form a coupling connection with the first radiating metal layer 12 on the first substrate 11, and when the first feeding element 34 passes outside the bottom surface of the first substrate 11, the grounding metal layer is not 13 electrically connected to form a three-stack antenna structure having a single feed element in a four-hole type (viewed from the bottom of the first antenna 1).

請參閱圖6,係本創作之四孔式之三堆疊天線結構與電子設備的電路板電性連結示意。本創作在該第一天線1、該第二天線2及該第三天線3堆疊後,以該第一饋入元件34與該電子設備的電路板20電性連結後,該第一天線1的第一輻射金屬層12與該第一饋入元件34形成耦合連結可以接收例如GPS L5/L2訊號頻率為1100MH Z-1250MH Z。該第二天線2的第二輻射金屬層22與該第一饋入元件34形成耦合連結形成可以接收例如GPS/GNSS/Beidou訊號頻率為1500MH Z-1650MH Z。該第三天線3的第三輻射金屬層32與第一饋入元件34電性連結形成可以接收例如SDARS/WLAN訊號頻率為2300MH Z-2500MH ZPlease refer to FIG. 6 , which is a schematic diagram of the electrical connection of the four-hole three-stack antenna structure of the present invention and the circuit board of the electronic device. After the first antenna 1, the second antenna 2, and the third antenna 3 are stacked, the first feeding element 34 is electrically connected to the circuit board 20 of the electronic device, and the first day first radiating metal wire layer 12 of the first feed member 34 is formed, for example, the coupling link may receive GPS L5 / L2 signal frequency 1100MH Z -1250MH Z. The second radiating antenna 2 into the metal layer 22 and the first feed member 34 may receive a coupling link is formed, for example, GPS / GNSS / Beidou signal frequency 1500MH Z -1650MH Z. The third radiating metal layer 32 of the third antenna 3 is electrically connected to the first feeding element 34 to form, for example, a SDARS/WLAN signal frequency of 2300 MH Z -2500 MH Z .

由於該三堆疊天線10電性連結在電子設備的電路板20上,可以接收不同無線通訊系統頻率,在整合於電子設備上使用時,也不會使電子設備的體積或面積變大。Since the three stacked antennas 10 are electrically connected to the circuit board 20 of the electronic device, different wireless communication system frequencies can be received, and when used on the electronic device, the volume or area of the electronic device is not increased.

請參閱圖7,係本創作之第二實施例的四孔式之三堆疊天線結構分解示意圖。如圖所示:本第二實施例與第一實施例大致相同,所不同處係在於增加了一第二饋入元件26,該第二饋入元件26在穿過第二基體21的第五通孔23與該第二輻射金屬層22電性連結,再穿過該第一基體11的第二通孔15與該第一輻射金屬層12形成耦合連結,以形成具有二饋入元件的四孔式之三堆疊天線結構。Please refer to FIG. 7 , which is a schematic exploded view of a four-hole three-stack antenna structure according to a second embodiment of the present invention. As shown, the second embodiment is substantially identical to the first embodiment in that a second feed element 26 is added, the second feed element 26 being fifth through the second substrate 21. The through hole 23 is electrically connected to the second radiating metal layer 22, and then penetrates through the second through hole 15 of the first substrate 11 to form a coupling connection with the first radiating metal layer 12 to form four having two feeding elements. The three-hole stacked antenna structure.

請參閱圖8,係本創作之第三實施例的四孔式之三堆疊天線結構分解示意圖。如圖所示:本第三實施例與第二實施例大致相同,所不同處係在於增加了一第三饋入元件18,該第三饋入元件18在穿過第一基體1的第四通孔17與該第一輻射金屬層12電性連結,以形成具有三饋入元件的四孔式之三堆疊天線結構。Please refer to FIG. 8 , which is a schematic exploded view of a four-hole three-stack antenna structure according to a third embodiment of the present invention. As shown, the third embodiment is substantially identical to the second embodiment in that a third feed element 18 is added, the third feed element 18 being fourth through the first substrate 1. The through hole 17 is electrically connected to the first radiating metal layer 12 to form a four-hole three-stack antenna structure having three feeding elements.

請參閱圖9,係本創作之第四實施例的四孔式之三堆疊天線結構分解示意圖。如圖所示:本第四實施例與第三實施例大致相同,所不同處係在於具有二個第三饋入元件18、18a,該第三饋入元件18、18a在穿過第一基體1的第四通孔17及第一通孔14與該第一輻射金屬層12電性連結,以形成具有四饋入元件的四孔式之三堆疊天線結構。Please refer to FIG. 9 , which is a schematic exploded view of a four-hole three-stack antenna structure according to a fourth embodiment of the present invention. As shown, the fourth embodiment is substantially identical to the third embodiment in that it has two third feed elements 18, 18a that pass through the first substrate. The fourth through hole 17 and the first through hole 14 are electrically connected to the first radiating metal layer 12 to form a four-hole three-stack antenna structure having four feeding elements.

惟以上所述僅為本創作之較佳實施例,非意欲侷限本創作的專利保護範圍,故舉凡運用本創作說明書或圖式內容所為的等效變化,均同理皆包含於本創作的權利保護範圍內,合予陳明。However, the above description is only a preferred embodiment of the present invention, and it is not intended to limit the scope of patent protection of the present creation. Therefore, the equivalent changes made by using the present specification or the content of the schema are all included in the right of the creation. Within the scope of protection, it is given to Chen Ming.

10‧‧‧三堆疊天線10‧‧‧Three stacked antennas

1‧‧‧第一天線1‧‧‧first antenna

11‧‧‧第一基體11‧‧‧ First substrate

12‧‧‧第一輻射金屬層12‧‧‧First radiant metal layer

13‧‧‧接地金屬層13‧‧‧Grounded metal layer

14‧‧‧第一通孔14‧‧‧First through hole

15‧‧‧第二通孔15‧‧‧Second through hole

16‧‧‧第三通孔16‧‧‧ third through hole

17‧‧‧第四通孔17‧‧‧4th through hole

18、18a‧‧‧第三饋入元件18, 18a‧‧‧ third feed element

2‧‧‧第二天線2‧‧‧second antenna

21‧‧‧第二基體21‧‧‧Second substrate

22‧‧‧第二輻射金屬層22‧‧‧second radiant metal layer

23‧‧‧第五通孔23‧‧‧5th through hole

24‧‧‧第六通孔24‧‧‧ sixth through hole

25‧‧‧第七通孔25‧‧‧ seventh through hole

26‧‧‧第二饋入元件26‧‧‧second feed element

3‧‧‧第三天線3‧‧‧ third antenna

31‧‧‧第三基體31‧‧‧ third matrix

32‧‧‧第三輻射金屬層32‧‧‧ Third radiant metal layer

33‧‧‧第八通孔33‧‧‧8th through hole

34‧‧‧第一饋入元件34‧‧‧First feed element

341‧‧‧頭部341‧‧‧ head

342‧‧‧桿體342‧‧‧ rod body

20‧‧‧電路板20‧‧‧ boards

圖1,係本創作之第一實施例的四孔式之三堆疊天線結構分解示意圖;1 is a schematic exploded view of a four-hole three-stack antenna structure according to a first embodiment of the present invention;

圖2,係本創作之第一實施例的四孔式之三堆疊天線結構組合示意圖;2 is a schematic diagram of a four-hole three-stack antenna structure combination according to a first embodiment of the present invention;

圖3,係本創作之第一實施例的四孔式之三堆疊天線結構仰視示意圖;3 is a bottom plan view showing a four-hole three-stack antenna structure of the first embodiment of the present invention;

圖4,係本創作之第一基體的背面示意圖;Figure 4 is a schematic rear view of the first substrate of the present invention;

圖5,係本創作之第一實施例的四孔式之三堆疊天線結構側剖視示意;Figure 5 is a side cross-sectional view showing the structure of a four-hole three-stack antenna of the first embodiment of the present invention;

圖6,係本創作之第一實施例的四孔式之三堆疊天線結構與電子設備的電路板電性連結示意;FIG. 6 is a schematic diagram showing the electrical connection of the four-hole three-stack antenna structure of the first embodiment of the present invention and the circuit board of the electronic device;

圖7,係本創作之第二實施例的四孔式之三堆疊天線結構分解示意圖;FIG. 7 is a schematic exploded view showing the structure of a four-hole three-stack antenna according to a second embodiment of the present invention; FIG.

圖8,係本創作之第三實施例的四孔式之三堆疊天線結構分解示意圖;FIG. 8 is a schematic exploded view showing the structure of a four-hole three-stack antenna according to a third embodiment of the present invention; FIG.

圖9,係本創作之第四實施例的四孔式之三堆疊天線結構分解示意圖。FIG. 9 is an exploded perspective view showing the structure of a four-hole three-stack antenna according to a fourth embodiment of the present invention.

Claims (20)

一種四孔式之三堆疊天線結構,係電性連結於電子設備的電路板上,包括: 一第一天線,其上具有一第一基體,該第一基體的表面具有一第一輻射金屬層,該底面具有一接地金屬層,該第一基體上開設有一第一通孔、一第二通孔、一第三通孔及一第四通孔,該第一通孔、該第二通孔、該第三通孔及該第四通孔貫通該第一基體、第一輻射金屬層及該接地金屬層; 一第二天線,其上具有一第二基體,該第二基體係以配置於該第一基體的第一輻射金屬層的表面上;另於該第二基體表面上具有一第二輻射金屬層,該第二基體上設有貫穿該第二基體及該第二輻射金屬層的一第五通孔、一第六通孔及一第七通孔,該第五通孔、該第六通孔及該第七通孔分別對應該第一基體的該第二通孔、該第三通孔及該第四通孔; 一第三天線,其上具有一第三基體,該第三基體係以配置於該第二基體的第二輻射金屬層的表面上;另於該第三基體表面上具有一第三輻射金屬層,該第三基體上設有貫穿該第三基體及該第三輻射金屬層的一第八通孔,該第八通孔對應該第二基體的第六通孔及該第一基體的第三通孔;又,該第三天線更包含有一第一饋入元件,該第一饋入元件穿過該第三基體的第八通孔、該第二基體的第六通孔及該第一基體的第三通孔至該第一基體的底面外部; 其中,在該第一饋入元件穿過該第八通孔時與該第三輻射金屬層電性連結,在該第一饋入元件穿過該第二基體時與該第二輻射金屬層形成耦合連結,在該第一饋入元件穿過該第三通孔時與該第一基體上的第一輻射金屬層形成耦合連結,在該第一饋入元件穿過第一基體11底面外部時不與該接地金屬層電性連結,以形成單饋入的四孔式之三堆疊天線結構。A four-hole three-stack antenna structure electrically connected to a circuit board of an electronic device, comprising: a first antenna having a first substrate thereon, the surface of the first substrate having a first radiating metal a first metal via, a first through hole, a second through hole, a third through hole and a fourth through hole, the first through hole and the second through hole a hole, the third through hole and the fourth through hole penetrating the first base body, the first radiating metal layer and the grounding metal layer; a second antenna having a second base body thereon, the second base system Disposed on a surface of the first radiant metal layer of the first substrate; further comprising a second radiant metal layer on the surface of the second substrate, the second substrate being provided with the second substrate and the second radiant metal a fifth through hole, a sixth through hole and a seventh through hole, wherein the fifth through hole, the sixth through hole and the seventh through hole respectively correspond to the second through hole of the first base, The third through hole and the fourth through hole; a third antenna having a third base body thereon, the third base And a third radiant metal layer disposed on the surface of the third substrate; the third substrate is provided with the third substrate and the third portion An eighth through hole of the radiant metal layer, the eighth through hole corresponding to the sixth through hole of the second base and the third through hole of the first base; and the third antenna further includes a first feed element The first feeding element passes through the eighth through hole of the third base body, the sixth through hole of the second base body, and the third through hole of the first base body to the outside of the bottom surface of the first base body; The first feeding element is electrically connected to the third radiating metal layer when passing through the eighth through hole, and is coupled to the second radiating metal layer when the first feeding element passes through the second base. Forming a coupling connection with the first radiating metal layer on the first substrate when the first feeding element passes through the third through hole, and not when the first feeding element passes outside the bottom surface of the first substrate 11 The grounded metal layers are electrically connected to form a single-fed, four-hole, three-stack antenna structure. 如申請專利範圍第1項所述之四孔式之三堆疊天線結構,其中,該第一饋入元件呈T形狀,該第一饋入元件具有一頭部,該頭部延伸一桿體。The four-hole three-stack antenna structure according to claim 1, wherein the first feed element has a T shape, and the first feed element has a head, and the head extends a rod. 如申請專利範圍第1項所述之四孔式之三堆疊天線結構,其中,該第二基體的面積小於該第一輻射金屬層的面積,在該第二基體配置於該第一輻射金屬層的表面時,使該第一輻射金屬層外露。The four-hole three-stack antenna structure according to claim 1, wherein the second substrate has an area smaller than an area of the first radiating metal layer, and the second substrate is disposed on the first radiating metal layer. The surface of the first radiant metal is exposed. 如申請專利範圍第1項所述之四孔式之三堆疊天線結構,其中,該第三基體的面積小於該第二輻射金屬層的面積,在該第三基體配置於該第二輻射金屬層的表面時,使該第二輻射金屬層外露。The four-hole three-stack antenna structure according to claim 1, wherein the third substrate has an area smaller than an area of the second radiating metal layer, and the third substrate is disposed on the second radiating metal layer. The surface of the second radiant metal is exposed. 如申請專利範圍第1項所述之四孔式之三堆疊天線結構,其中,該第一基體、該第二基體及該第三基體為陶瓷介質材料製成的扁形的板狀體或塊狀體。The four-hole three-stack antenna structure according to claim 1, wherein the first substrate, the second substrate, and the third substrate are flat plate-like bodies or blocks made of a ceramic dielectric material. body. 一種四孔式之三堆疊天線結構,係電性連結於電子設備的電路板上,包括: 一第一天線,其上具有一第一基體,該第一基體的表面具有一第一輻射金屬層,該底面具有一接地金屬層,該第一基體上開設有一第一通孔、一第二通孔、一第三通孔及一第四通孔,該第一通孔、該第二通孔、該第三通孔及該第四通孔貫通該第一基體、第一輻射金屬層及該接地金屬層; 一第二天線,其上具有一第二基體,該第二基體係以配置於該第一基體的第一輻射金屬層的表面上;另於該第二基體表面上具有一第二輻射金屬層,該第二基體上設有貫穿該第二基體及該第二輻射金屬層的一第五通孔、一第六通孔及一第七通孔,該第五通孔、該第六通孔及該第七通孔分別對應該第一基體的該第二通孔、該第三通孔及該第四通孔;又,該第二天線包含有一第二饋入元件,該第二饋入元件穿過該第五通孔與該第二輻射金屬層電性連結,再穿過該第一基體的第二通孔; 一第三天線,其上具有一第三基體,該第三基體係以配置於該第二基體的第二輻射金屬層的表面上;另於該第三基體表面上具有一第三輻射金屬層,該第三基體上設有貫穿該第三基體及該第三輻射金屬層的一第八通孔,該第八通孔對應該第二基體的第六通孔及該第一基體的第三通孔;又,該第三天線更包含有一第一饋入元件,該第一饋入元件穿過該第三基體的第八通孔、該第二基體的第六通孔及該第一基體的第三通孔至該第一基體的底面外部; 其中,該第二饋入元件在穿過第二基體的第五通孔與該第二輻射金屬層電性連結,再穿過該第一基體的第二通孔與該第一輻射金屬層形成耦合連結,該第一饋入元件穿過該第八通孔時與該第三輻射金屬層電性連結,在該第一饋入元件穿過該第二基體時與該第二輻射金屬層形成耦合連結,在該第一饋入元件穿過該第三通孔時與該第一基體上的第一輻射金屬層形成耦合連結,在該第二饋入元件及該第一饋入元件穿過第一基體底面外部時不與該接地金屬層電性連結,以形成二饋入的四孔式之三堆疊天線結構。A four-hole three-stack antenna structure electrically connected to a circuit board of an electronic device, comprising: a first antenna having a first substrate thereon, the surface of the first substrate having a first radiating metal a first metal via, a first through hole, a second through hole, a third through hole and a fourth through hole, the first through hole and the second through hole a hole, the third through hole and the fourth through hole penetrating the first base body, the first radiating metal layer and the grounding metal layer; a second antenna having a second base body thereon, the second base system Disposed on a surface of the first radiant metal layer of the first substrate; further comprising a second radiant metal layer on the surface of the second substrate, the second substrate being provided with the second substrate and the second radiant metal a fifth through hole, a sixth through hole and a seventh through hole, wherein the fifth through hole, the sixth through hole and the seventh through hole respectively correspond to the second through hole of the first base, The third through hole and the fourth through hole; further, the second antenna includes a second feeding element, the first The feeding element is electrically connected to the second radiating metal layer through the fifth through hole, and then passes through the second through hole of the first base; a third antenna has a third base, the third The base system is disposed on the surface of the second radiant metal layer of the second substrate; and the third substrate has a third radiant metal layer on the surface of the third substrate, the third substrate is provided with the third substrate and the third substrate An eighth through hole of the third radiating metal layer, the eighth through hole corresponding to the sixth through hole of the second base and the third through hole of the first base; and the third antenna further includes a first feed The first feeding element passes through the eighth through hole of the third substrate, the sixth through hole of the second substrate, and the third through hole of the first substrate to the outside of the bottom surface of the first substrate; The second feeding element is electrically connected to the second radiating metal layer through the fifth through hole of the second substrate, and is coupled to the first radiating metal layer through the second through hole of the first substrate. The first feeding element is electrically connected to the third radiating metal layer when passing through the eighth through hole, where Forming a coupling connection with the second radiant metal layer as the feed element passes through the second substrate, and forming a first radiant metal layer on the first substrate when the first feed element passes through the third via The coupling connection is not electrically connected to the ground metal layer when the second feed element and the first feed element pass outside the bottom surface of the first substrate to form a two-feed three-layer stacked antenna structure. 如申請專利範圍第6項所述之四孔式之三堆疊天線結構,其中,該第一饋入元件呈T形狀,該第一饋入元件具有一頭部,該頭部延伸一桿體。The four-hole three-stack antenna structure according to claim 6, wherein the first feed element has a T shape, and the first feed element has a head, and the head extends a rod. 如申請專利範圍第6項所述之四孔式之三堆疊天線結構,其中,該第二基體的面積小於該第一輻射金屬層的面積,在該第二基體配置於該第一輻射金屬層的表面時,使該第一輻射金屬層外露。The four-hole three-stack antenna structure according to claim 6, wherein the second substrate has an area smaller than an area of the first radiating metal layer, and the second substrate is disposed on the first radiating metal layer. The surface of the first radiant metal is exposed. 如申請專利範圍第6項所述之四孔式之三堆疊天線結構,其中,該第三基體的面積小於該第二輻射金屬層的面積,在該第三基體配置於該第二輻射金屬層的表面時,使該第二輻射金屬層外露。The four-hole three-stack antenna structure according to claim 6, wherein the third substrate has an area smaller than an area of the second radiating metal layer, and the third substrate is disposed on the second radiating metal layer. The surface of the second radiant metal is exposed. 如申請專利範圍第6項所述之四孔式之三堆疊天線結構,其中,該第一基體、該第二基體及該第三基體為陶瓷介質材料製成的扁形的板狀體或塊狀體。The four-hole three-stack antenna structure according to claim 6, wherein the first substrate, the second substrate, and the third substrate are flat plate-like bodies or blocks made of a ceramic dielectric material. body. 一種四孔式之三堆疊天線結構,係電性連結於電子設備的電路板上,包括: 一第一天線,其上具有一第一基體,該第一基體的表面具有一第一輻射金屬層,該底面具有一接地金屬層,該第一基體上開設有一第一通孔、一第二通孔、一第三通孔及一第四通孔,該第一通孔、該第二通孔、該第三通孔及該第四通孔貫通該第一基體、第一輻射金屬層及該接地金屬層;又,該第一天線包含有一第三饋入元件,該第三饋入元件穿過該第四通孔與該第一輻射金屬層電性連結; 一第二天線,其上具有一第二基體,該第二基體係以配置於該第一基體的第一輻射金屬層的表面上;另於該第二基體表面上具有一第二輻射金屬層,該第二基體上設有貫穿該第二基體及該第二輻射金屬層的一第五通孔、一第六通孔及一第七通孔,該第五通孔、該第六通孔及該第七通孔分別對應該第一基體的該第二通孔、該第三通孔及該第四通孔;又該第二天線包含有一第二饋入元件,該第二饋入元件穿過該第五通孔與該第二輻射金屬層電性連結,再穿過該第一基體的第二通孔; 一第三天線,其上具有一第三基體,該第三基體係以配置於該第二基體的第二輻射金屬層的表面上;另於該第三基體表面上具有一第三輻射金屬層,該第三基體上設有貫穿該第三基體及該第三輻射金屬層的一第八通孔,該第八通孔對應該第二基體的第六通孔及該第一基體的第三通孔;又,該第三天線更包含有一第一饋入元件,該第一饋入元件穿過該第三基體的第八通孔、該第二基體的第六通孔及該第一基體的第三通孔至該第一基體的底面外部; 其中,該第三饋入元件在穿過第一基體的第四通孔與該第一輻射金屬層電性連結,該第二饋入元件在穿過第二基體的第五通孔與該第二輻射金屬層電性連結,再穿過該第一基體的第二通孔與該第一輻射金屬層形成耦合連結,該第一饋入元件穿過該第八通孔時與該第三輻射金屬層電性連結,在該第一饋入元件穿過該第二基體時與該第二輻射金屬層形成耦合連結,在該第一饋入元件穿過該第三通孔時與該第一基體上的第一輻射金屬層形成耦合連結,在該第三饋入元件、該第二饋入元件及該第一饋入元件穿過第一基體底面外部時不與該接地金屬層電性連結,以形成三饋入的四孔式之三堆疊天線結構。A four-hole three-stack antenna structure electrically connected to a circuit board of an electronic device, comprising: a first antenna having a first substrate thereon, the surface of the first substrate having a first radiating metal a first metal via, a first through hole, a second through hole, a third through hole and a fourth through hole, the first through hole and the second through hole a hole, the third through hole and the fourth through hole penetrating the first base body, the first radiating metal layer and the grounding metal layer; further, the first antenna includes a third feeding element, the third feeding An element is electrically connected to the first radiating metal layer through the fourth through hole; a second antenna has a second base thereon, and the second base system has a first radiating metal disposed on the first base a second radiant metal layer on the surface of the second substrate; the second substrate is provided with a fifth through hole and a sixth through the second substrate and the second radiant metal layer a through hole and a seventh through hole, the fifth through hole, the sixth through hole and the seventh through hole respectively The second through hole, the third through hole and the fourth through hole of the first base; the second antenna further includes a second feed element, the second feed element passing through the fifth through hole And a second via hole electrically connected to the second radiating metal layer; a surface of the second radiant metal layer; and a third radiant metal layer on the surface of the third substrate, the third substrate is provided with an eighth through hole penetrating the third substrate and the third radiant metal layer The eighth through hole corresponds to the sixth through hole of the second base and the third through hole of the first base; and the third antenna further includes a first feed element, the first feed element passes through The eighth through hole of the third base body, the sixth through hole of the second base body, and the third through hole of the first base body are outside the bottom surface of the first base body; wherein the third feed element passes through the a fourth through hole of a base is electrically connected to the first radiating metal layer, and the second feeding element is passed through the second base The fifth through hole is electrically connected to the second radiating metal layer, and the second through hole passing through the first base is coupled to the first radiating metal layer, and the first feeding element passes through the eighth through hole. Electrically coupled to the third radiant metal layer, and coupled to the second radiant metal layer when the first feed element passes through the second substrate, and the third feed element passes through the third pass Forming a coupling connection with the first radiant metal layer on the first substrate, and not when the third feed element, the second feed element, and the first feed element pass outside the bottom surface of the first substrate The grounded metal layers are electrically connected to form a three-fed, four-hole, three-stack antenna structure. 如申請專利範圍第11項所述之四孔式之三堆疊天線結構,其中,該第一饋入元件呈T形狀,該第一饋入元件具有一頭部,該頭部延伸一桿體。The four-hole three-stack antenna structure according to claim 11, wherein the first feeding element has a T shape, and the first feeding element has a head, and the head extends a rod. 如申請專利範圍第11項所述之四孔式之三堆疊天線結構,其中,該第二基體的面積小於該第一輻射金屬層的面積,在該第二基體配置於該第一輻射金屬層的表面時,使該第一輻射金屬層外露。The four-hole three-stack antenna structure according to claim 11, wherein the second substrate has an area smaller than an area of the first radiating metal layer, and the second substrate is disposed on the first radiating metal layer. The surface of the first radiant metal is exposed. 如申請專利範圍第11項所述之四孔式之三堆疊天線結構,其中,該第三基體的面積小於該第二輻射金屬層的面積,在該第三基體配置於該第二輻射金屬層的表面時,使該第二輻射金屬層外露。The four-hole three-stack antenna structure according to claim 11, wherein the third substrate has an area smaller than an area of the second radiating metal layer, and the third substrate is disposed on the second radiating metal layer. The surface of the second radiant metal is exposed. 如申請專利範圍第11項所述之四孔式之三堆疊天線結構,其中,該第一基體、該第二基體及該第三基體為陶瓷介質材料製成的扁形的板狀體或塊狀體。The four-hole three-stack antenna structure according to claim 11, wherein the first base body, the second base body and the third base body are flat plate-shaped bodies or blocks made of a ceramic dielectric material. body. 一種四孔式之三堆疊天線結構,係電性連結於電子設備的電路板上,包括: 一第一天線,其上具有一第一基體,該第一基體的表面具有一第一輻射金屬層,該底面具有一接地金屬層,該第一基體上開設有一第一通孔、一第二通孔、一第三通孔及一第四通孔,該第一通孔、該第二通孔、該第三通孔及該第四通孔貫通該第一基體、第一輻射金屬層及該接地金屬層;又,該第一天線包含有二第三饋入元件,該二第三饋入元件分別穿過該第四通孔及該第一通孔與該第一輻射金屬層電性連結; 一第二天線,其上具有一第二基體,該第二基體係以配置於該第一基體的第一輻射金屬層的表面上;另於該第二基體表面上具有一第二輻射金屬層,該第二基體上設有貫穿該第二基體及該第二輻射金屬層的一第五通孔、一第六通孔及一第七通孔,該第五通孔、該第六通孔及該第七通孔分別對應該第一基體的該第二通孔、該第三通孔及該第四通孔;又該第二天線包含有一第二饋入元件,該第二饋入元件穿過該第五通孔與該第二輻射金屬層電性連結,再穿過該第一基體的第二通孔; 一第三天線,其上具有一第三基體,該第三基體係以配置於該第二基體的第二輻射金屬層的表面上;另於該第三基體表面上具有一第三輻射金屬層,該第三基體上設有貫穿該第三基體及該第三輻射金屬層的一第八通孔,該第八通孔對應該第二基體的第六通孔及該第一基體的第三通孔;又,該第三天線更包含有一第一饋入元件,該第一饋入元件穿過該第三基體的第八通孔、該第二基體的第六通孔及該第一基體的第三通孔至該第一基體的底面外部; 其中,該二第三饋入元件分別在穿過第一基體的該第一通孔及該第四通孔與該第一輻射金屬層電性連結,該第二饋入元件在穿過第二基體的第五通孔與該第二輻射金屬層電性連結,再穿過該第一基體的第二通孔與該第一輻射金屬層形成耦合連結,該第一饋入元件穿過該第八通孔時與該第三輻射金屬層電性連結,在該第一饋入元件穿過該第二基體時與該第二輻射金屬層形成耦合連結,在該第一饋入元件穿過該第三通孔時與該第一基體上的第一輻射金屬層形成耦合連結,在該二第三饋入元件、該第二饋入元件及該第一饋入元件穿過第一基體底面外部時不與該接地金屬層電性連結,以形成四饋入的四孔式之三堆疊天線結構。A four-hole three-stack antenna structure electrically connected to a circuit board of an electronic device, comprising: a first antenna having a first substrate thereon, the surface of the first substrate having a first radiating metal a first metal via, a first through hole, a second through hole, a third through hole and a fourth through hole, the first through hole and the second through hole a hole, the third through hole and the fourth through hole penetrating the first base body, the first radiating metal layer and the grounding metal layer; further, the first antenna includes two third feeding elements, the second and third through holes The feeding element is electrically connected to the first radiating metal layer through the fourth through hole and the first through hole respectively; a second antenna has a second substrate thereon, and the second base system is configured to a surface of the first radiant metal layer of the first substrate; a second radiant metal layer on the surface of the second substrate, the second substrate being provided with the second substrate and the second radiant metal layer a fifth through hole, a sixth through hole and a seventh through hole, the fifth through hole, the sixth through hole And the seventh through hole respectively corresponding to the second through hole, the third through hole and the fourth through hole of the first base; the second antenna further comprises a second feeding element, the second feeding An element is electrically connected to the second radiating metal layer through the fifth through hole, and then passes through the second through hole of the first substrate; a third antenna has a third substrate thereon, and the third base system And a third radiation metal layer disposed on the surface of the third substrate; the third substrate is provided with the third substrate and the third radiation An eighth through hole of the metal layer, the eighth through hole corresponding to the sixth through hole of the second base and the third through hole of the first base; and the third antenna further includes a first feed element The first feeding element passes through the eighth through hole of the third base body, the sixth through hole of the second base body, and the third through hole of the first base body to the outside of the bottom surface of the first base body; wherein the two The third feeding element is electrically connected to the first through hole and the fourth through hole of the first base and the first radiating metal layer Connecting, the second feeding element is electrically connected to the second radiating metal layer through the fifth through hole of the second substrate, and then formed through the second through hole of the first substrate and the first radiating metal layer Coupling, the first feeding element is electrically connected to the third radiating metal layer when passing through the eighth through hole, and forms with the second radiating metal layer when the first feeding element passes through the second through hole a coupling connection, when the first feeding element passes through the third through hole, forming a coupling connection with the first radiating metal layer on the first substrate, and the second feeding element and the second feeding element The first feed element is not electrically connected to the ground metal layer when passing through the outside of the bottom surface of the first substrate to form a four-input four-hole three-stack antenna structure. 如申請專利範圍第16項所述之四孔式之三堆疊天線結構,其中,該第一饋入元件呈T形狀,該第一饋入元件具有一頭部,該頭部延伸一桿體。The four-hole three-stack antenna structure according to claim 16, wherein the first feeding element has a T shape, and the first feeding element has a head, and the head extends a rod. 如申請專利範圍第16項所述之四孔式之三堆疊天線結構,其中,該第二基體的面積小於該第一輻射金屬層的面積,在該第二基體配置於該第一輻射金屬層的表面時,使該第一輻射金屬層外露。The four-hole three-stack antenna structure according to claim 16, wherein the second substrate has an area smaller than an area of the first radiating metal layer, and the second substrate is disposed on the first radiating metal layer. The surface of the first radiant metal is exposed. 如申請專利範圍第16項所述之四孔式之三堆疊天線結構,其中,該第三基體的面積小於該第二輻射金屬層的面積,在該第三基體配置於該第二輻射金屬層的表面時,使該第二輻射金屬層外露。The four-hole three-stack antenna structure according to claim 16, wherein the third substrate has an area smaller than an area of the second radiating metal layer, and the third substrate is disposed on the second radiating metal layer. The surface of the second radiant metal is exposed. 如申請專利範圍第16項所述之四孔式之三堆疊天線結構,其中,該第一基體、該第二基體及該第三基體為陶瓷介質材料製成的扁形的板狀體或塊狀體。The four-hole three-stack antenna structure according to claim 16, wherein the first base body, the second base body and the third base body are flat plate-shaped bodies or blocks made of ceramic dielectric material. body.
TW107201550U 2018-01-31 2018-01-31 Four-hole type three-stacked antenna structure TWM561925U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW107201550U TWM561925U (en) 2018-01-31 2018-01-31 Four-hole type three-stacked antenna structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW107201550U TWM561925U (en) 2018-01-31 2018-01-31 Four-hole type three-stacked antenna structure

Publications (1)

Publication Number Publication Date
TWM561925U true TWM561925U (en) 2018-06-11

Family

ID=63256833

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107201550U TWM561925U (en) 2018-01-31 2018-01-31 Four-hole type three-stacked antenna structure

Country Status (1)

Country Link
TW (1) TWM561925U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111934086A (en) * 2019-05-13 2020-11-13 启碁科技股份有限公司 Antenna structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111934086A (en) * 2019-05-13 2020-11-13 启碁科技股份有限公司 Antenna structure

Similar Documents

Publication Publication Date Title
CN104319467B (en) Five frequency range subscriber computer antennas of compatible Beidou and GPS function
US20160013558A1 (en) Multilayer patch antenna
US11139550B2 (en) Stack antenna structures and methods
JP2020510346A (en) Stacked patch antenna
CN104885301B (en) antenna for satellite navigation receiver
TW201434203A (en) Backside redistribution layer patch antenna
WO2014176868A1 (en) Combined antenna and handheld antenna device
KR101174739B1 (en) Dual patch antenna
EP2894712B1 (en) Broadband GNSS reference antenna
US20140210678A1 (en) Compact dual band gnss antenna design
EP2159878A1 (en) Stacked patch antenna array
CN104466382B (en) Stacked microstirp antenna based on nested recursion rotational symmetry CSRR distribution array
CN107959109A (en) The integrated high-gain aerial of silicon substrate and aerial array
CN206441870U (en) Big Dipper mutli-system integration antenna
TWM561925U (en) Four-hole type three-stacked antenna structure
US10396470B1 (en) Wireless system architecture with dependent superstrate for millimeter-wave phased-array antennas
TWM564835U (en) Five-hole triple stacking antenna structure
TWM561923U (en) Four-feed three-stacked antenna structure
CN110165384A (en) Ceramic antenna feed-in hole insulation system
TWM561928U (en) Five-feed three-stacked antenna structure
TWM561922U (en) Triple-feed three-stacked antenna structure
TW201935761A (en) Five-feed-in-and-three-stack antenna structure
TW201935756A (en) Five-hole-and-three-stack antenna structure
TW201935757A (en) Four-hole-and-three-stack antenna structure
TW201935754A (en) Four-feed-in-and-three-stack antenna structure