TWM558378U - Detachable lens - Google Patents

Abstract

The present invention is a detachable lens comprising a positive protective shell, a back protective shell, a front cover shell, a back cover shell, a lens and a photosensitive package module, and the positive protective shell and the back protective shell are detachably joined to each other to form an accommodation. The space accommodates the front cover, the back cover, the lens and the photosensitive package module, the first opening of the positive cover is aligned with one end of the lens, and the other end of the lens is aligned with the second opening of the front cover, and the second opening is simultaneously Aligning the photosensitive element of the photosensitive package module, the third opening of the back cover shell is aligned with the connection hole slot of the photosensitive package module, and the front cover case and the back cover case are detachably engaged and expose part of the connection hole slot, and the connection line plug Align the connection holes to connect this creation to an external device. It has the effect of increasing the elasticity of use and reducing the cost.

Description

Disassembled lens

The present invention relates to a detachable lens, in particular, the positive protective shell and the back protective shell are detachably joined to each other to form a accommodating space, and the front cover shell, the back cover shell, the lens and the photosensitive package module are accommodated, and the photosensitive package module is assembled. The package components of the group are system-level packaging technology that integrates multiple electronic components or electronic modules.

At present, in the prior art, a general-purpose lens product adopts a conventional Printed Circuit Board Assembly (PCBA) process, and first performs pattern transfer, plating, etching, etc. on the circuit board to form a circuit pattern, and then multiple electronic parts. Or the electronic module is soldered on the circuit board, and the photosensitive element is also soldered on the circuit board. In addition, the lens is drilled at a position corresponding to the photosensitive element on the circuit board to fix the lens, and finally the lens is soldered to the photosensitive element. The relative position of the board is shown in the prior art diagram of Figure 1.

The number of traditional PCBA process parts is large, the process and test process steps are complicated, and there are many variations in image process yield during the process, such as: acidity, humidity, temperature, oxidation, and circuit board. The factors such as the strength of the connection between the solder to be soldered and the solder, etc., will affect the quality of the panel and the aging time. At the same time, if the number of electronic components or electronic modules increases, the size of the circuit board also increases, resulting in subsequent assembly of parts. The difficulty of the above also increases the limitations in practical applications.

Therefore, there is a need for a modular lens in which a package component is a system in package (SiP) technology, which integrates and packages a plurality of electronic components or electronic molds, reduces process steps, improves integrated design efficiency, and Reduces and simplifies board complexity and area while reducing board power consumption.

In addition, the modular lens can be freely disassembled, replaced and assembled, which solves the inconvenience and cost of the prior art that the lens and the circuit board need to be replaced at the same time.

The main purpose of the present invention is to provide a detachable lens comprising a positive protective shell, a back protective shell, a front cover shell, a back cover shell, a lens and a photosensitive package module, wherein the positive protective shell and the back protective shell are detachable Intersecting and forming a accommodating space, the front cover case, the back cover case, the lens and the photosensitive package module are located in the accommodating space, and the front cover case and the back cover case are also detachably coupled to each other and sensitized The package module is located in the front cover and the back cover.

Further, the positive protective casing has a first opening, and the back protective casing has a through hole for inserting the interconnecting connecting wire and the connecting wire plug, the connecting wire plug is located in the accommodating space, and the front cover shell has the second opening, The back cover case has a third opening, and the photosensitive package module comprises a circuit board, a circuit, a package component, a connection hole slot and a photosensitive element, wherein the package component and the connection hole slot are located on the same side of the circuit board, and the photosensitive element is located on the circuit board On the other side, the package components, the connection apertures, and the photosensitive elements are all electrically connected to the circuitry of the board.

The first opening of the positive protective casing is aligned with one end of the lens and located at an intermediate portion of the positive protective casing, and the other end of the lens is aligned and engaged with the second opening of the front cover, and the second opening of the front cover is simultaneously The photosensitive element of the quasi-photosensitive package module is located in the middle area of the front cover shell and protrudes outwardly. The third opening of the back cover case is aligned with the connection hole slot of the photosensitive package module, and a part of the connection hole groove is exposed. The connector plug of the back protective case is aligned with the exposed connecting hole slot.

Specifically, the package component is a system in package (SiP) technology, and at least one of the plurality of electronic components and the plurality of electronic components is integrated and packaged, and the package component and the connection hole are embedded in the circuit board. On the same side, the photosensitive element is mounted on the other side of the board, in the middle of the board.

The photosensitive element may be a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor sensor (CMOS).

In particular, the positive protective casing further includes a first waterproof ring and a second waterproof ring, and has a first groove and a second groove, the first groove is located around the positive protective case, and the second groove is located around the first opening. The first groove is placed with the first waterproof ring, so that the positive protective shell and the back protective shell are tightly joined, and the second recess is placed with the second waterproof ring, so that the first opening and the lens are tightly engaged, thereby achieving double waterproofing effect.

The light source is received by the photosensitive element via the lens, and the photosensitive element converts the optical image into an electronic signal, which is transmitted to the package component through a circuit on the circuit board, and the package component processes the electronic signal to form a digital image signal, and then transmits the circuit through the circuit on the circuit board. To the connection hole slot.

The main feature of this creation is that the package components of the photosensitive package module are packaged into a single component module by SiP technology, which achieves process technology and time-simplification.

Another feature of this creation is that the package components of the photosensitive package module use SiP technology to form a single component module, which achieves protection against dust, scratch, and rust.

Another feature of the present invention is that, compared with the prior art, the lens is not locked on the circuit board, but can be freely disassembled and assembled with different lenses, and can also be replaced separately for maintenance, increasing flexibility and reducing cost. .

The implementation of the present invention will be described in more detail below with reference to the drawings and component symbols, so that those skilled in the art can implement the present specification after studying the present specification.

As shown in FIG. 2, the detachable lens of the present invention comprises a positive protective shell 10, a back protective shell 20, a front cover shell 30, a back cover shell 40, a lens 50 and a photosensitive package module 60, wherein the positive protective shell 10 and the back cover The protective cover 20 is detachably coupled to each other and forms an accommodating space. The front cover 30, the back cover 40, the lens 50 and the photosensitive package module 60 are located in the accommodating space, and the photosensitive package module 60 is It is located in another accommodating space formed by the front cover 30 and the back cover 40.

Further, the positive protective casing 10 has a first opening 11, and the back protective casing 20 has a through hole 21 for penetrating the interconnecting connecting wire 22 and the connecting wire plug 23, and the connecting wire plug 23 is located in the accommodating space. . The front cover case 30 has a second opening 31, and the back cover case 40 has a third opening 41, and the front cover case 30 and the back cover case 40 are detachably engaged with each other.

The photo-sensing module 60 includes a circuit board 61, a circuit 62, a package component 63, a connection hole 64, and a photosensitive element 65. The package component 63 and the connection hole 64 are located. On the same side of the circuit board 61, and the photosensitive member 65 is located on the other side of the circuit board 41, the package member 63, the connection hole 64, and the photosensitive member 65 are electrically connected to the circuit 62 of the circuit board 61.

Continuing to refer to FIG. 2, the second opening 31 on the front cover 30 is aligned with the photosensitive element 65 of the photosensitive package module 60, and is located in the middle area of the front cover 30 and protrudes outward to facilitate the front cover 30 and the lens. One end of the 50 is joined, and the third opening 41 on the back cover 40 is aligned with the connecting hole groove 64 of the photosensitive package module 60, so that a part of the connecting hole groove 64 is exposed for inserting the connecting wire plug 23.

The first opening 11 of the positive protective casing 10 is the other end of the alignment lens 50, and is located at an intermediate portion of the positive protective casing 10 and extends outward so that the lens 50 can receive the light source, and the connecting wire plug 23 of the back protective casing 20 is The exposed connection hole groove 64 is inserted into the connection hole groove 64, and the creation is connected to the external device through the connection line 22.

In particular, as shown in FIG. 4, the positive protective casing 10 further includes a first waterproof ring 12 and a second waterproof ring 13, and has a first groove 14 and a second groove 15, and the first groove 14 is located in positive protection. Around the shell 10, the second groove 15 is located around the first opening 11, the first waterproof ring 12 is placed in the first groove 14, so that the positive protective shell 10 and the back protective shell 20 are tightly joined, and the second waterproof ring 13 is placed in the first The two grooves 15 enable the first opening 11 and the lens 50 to be tightly joined, thereby achieving double waterproofing effect.

In addition, the package component 63 of the photosensitive package module 60 is a system in package (SiP) technology, and integrates at least one of the plurality of electronic components and the plurality of electronic components, and the package component 63 is The connection hole groove 64 is mounted on the same side of the circuit board 61, and the photosensitive member 65 is mounted on the other side of the circuit board 61 and is located in the intermediate portion of the circuit board 61.

The photosensitive element 65 may be a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor sensor (CMOS).

In the practical application example of the present application, after the light source enters through the lens 50, it is received by the photosensitive element 65, and the photosensitive element 65 converts the optical image into an electronic signal, and transmits it to the package component 63 via the circuit 62 on the circuit board 61, and the package component 63 is paired. The electronic signal is processed and formed into a digital image signal, and then transmitted to the connection hole 64 via the circuit 62 on the circuit board 61. The connection hole 64 transmits the digital image signal to the external device through the connection line 22.

The main feature of this creation is that the package components of the photosensitive package module are packaged into a single component by SiP technology. Compared with the conventional technology, the printed circuit board assembly (PCBA) process is used, and the number of PCBA process parts is Due to the complexity of the process and test procedures, this creation can achieve streamlined process technology and timelines, and improve integrated design efficiency and reduce process costs.

Another feature of this creation is that SiP technology is used to integrate the electronic components and electronic modules of the detachable lens into one package component, which reduces and simplifies the complexity and area of the circuit board, and reduces the operating power consumption of the circuit board. In the prior art, the electronic component or the electronic module is directly soldered on the circuit board, and the creation can achieve protection against dust, scratch, rust and the like.

Another feature of this creation is that the lens can be detached freely, so as to combine various lenses, and can be easily and easily replaced according to the needs of the user. It can also be replaced separately during maintenance, which is different from the photosensitive elements and other modes in the prior art. The group circuit is printed on the circuit board, and the lens is aligned with the photosensitive element and locked on the corresponding circuit board. When the lens needs to be replaced or the lens is damaged, the entire set of circuit boards and lenses must be replaced, so this creation has been added. Use flexibility while reducing the cost of use.

Another feature of this creation is that the inside of the protective casing contains two waterproof rings, one is located around the inner side of the positive protective casing, and the other is located inside the first opening to enhance the waterproof effect of the detachable lens.

The above description is only for the purpose of explaining the preferred embodiment of the present invention, and is not intended to impose any form of limitation on the creation, so that any modification or alteration of the creation made in the same creative spirit is provided. , should still be included in the scope of protection of this creative intent.

10‧‧‧ Positive protective shell
11‧‧‧ first opening
12‧‧‧First waterproof ring
13‧‧‧Second waterproof ring
14‧‧‧First groove
15‧‧‧second groove
20‧‧‧Back protective case
21‧‧‧Perforation
22‧‧‧Connecting line
23‧‧‧Connector plug
30‧‧‧ Covering
31‧‧‧ second opening
40‧‧‧back shell
41‧‧‧ third opening
50‧‧‧ lens
60‧‧‧Photosensitive package module
61‧‧‧ boards
62‧‧‧ Circuitry
63‧‧‧Package components
64‧‧‧Connecting slot
65‧‧‧Photosensitive elements

Figure 1 shows a schematic diagram of a prior art lens module. Fig. 2 is a perspective exploded view showing the detachable lens of the present invention. Figure 3 shows a schematic diagram of the photosensitive package module of the detachable lens of the present invention. Figure 4 shows the inside of the positive protective case of the detachable lens of the present invention.

Claims (3)

A detachable lens comprising: a positive protective casing having a first opening, the first opening being located at an intermediate portion of the positive protective casing and extending outward; a back protective casing having a back protective casing a perforation for inserting a connecting wire and a connecting wire plug; a front cover shell having a second opening, the second opening being located at an intermediate portion of the front cover shell and protruding outward; a back cover, the back cover has a third opening; a lens; and a photosensitive package module, the photosensitive package module comprises a circuit board, a circuit, a package component, a connection hole and a photosensitive component The package component, the connection hole and the photosensitive element are electrically connected to the circuit, and the package component and the connection hole are embedded on the same side of the circuit board, and the photosensitive element is embedded in the circuit board The side is located at an intermediate portion of the circuit board, and the package component is integrated with at least one of the plurality of electronic components and the plurality of electronic modules by system-level packaging technology; wherein the positive protective case and the back protective case The detachable manner is connected to each other, and an accommodating space is formed. The front cover case, the back cover case, the lens and the photosensitive package module are located in the accommodating space, and the photosensitive package component is located in the front cover case. And the second opening is aligned with the photosensitive element of the photosensitive package module, and the third opening is aligned with the connection hole of the photosensitive package module, the front cover and the back The cover shells are detachably coupled to each other such that a portion of the connecting hole slots are exposed to the third opening, and one end of the lens and the second opening are detachably coupled to each other, and the other end of the lens is coupled Aligning the first opening, the connecting wire plug is located in the accommodating space and is aligned with the exposed connecting hole slot, the lens receiving light source is transmitted to the photosensitive element of the photosensitive package module, and the photosensitive element is optically imaged Converting to an electronic signal, the circuit is transmitted to the package component through the circuit board, and the package component processes the electronic signal to generate a digital image signal, which is transmitted to the connection hole through the circuit of the circuit board, and is transparent The connection line is further passed to an external device. The detachable lens of claim 1 further includes a first waterproof ring and a second waterproof ring, wherein the positive protective case has a first groove and a second groove, the first groove Located around the positive protective cover, the second recess is located around the first opening, the first recess is placed on the first waterproof ring, so that the positive protective shell and the back protective shell are tightly engaged, and the second recess is placed The second waterproof ring is such that the first opening and the lens are tightly coupled. The detachable lens of claim 1, wherein the photosensitive element is a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS).