TWM556944U - Board to board connector - Google Patents
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- TWM556944U TWM556944U TW106213555U TW106213555U TWM556944U TW M556944 U TWM556944 U TW M556944U TW 106213555 U TW106213555 U TW 106213555U TW 106213555 U TW106213555 U TW 106213555U TW M556944 U TWM556944 U TW M556944U
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Abstract
Description
本創作是有關一種連接器,尤指一種符合USB Type-C介面規範的板對板連接器。 This creation is about a connector, especially a board-to-board connector that conforms to the USB Type-C interface specification.
由於目前最新開發出來的USB Type-C連接器,具有介面尺寸最小、傳輸速度最快、能正插和反插且向下相容、適用性高等優點,因此USB Type-C連接器已逐漸被現今各式3C電子產品所採用。此外,以大屏幕的智慧型手機而言,在應用上述USB Type-C連接器時,不但會增加整體高度/體積,也無法真正實現在現有的手機大小不改變的情況下,設計出/塞入更大的螢幕。因此,如何在現有大屏幕手機的機構設計下,達到應用USB Type-C連接器並實現更大螢幕或結構緊湊的功效,乃為本案創作人所亟欲解決的一大課題。 Due to the newly developed USB Type-C connector, it has the advantages of the smallest interface size, the fastest transmission speed, the ability to be positively inserted and reverse inserted, and the backward compatibility and high applicability. Therefore, the USB Type-C connector has been gradually adopted. Nowadays, various 3C electronic products are used. In addition, in the case of a large-screen smart phone, when the above USB Type-C connector is applied, not only the overall height/volume will be increased, but also the actual size of the existing mobile phone will not be designed. Into the bigger screen. Therefore, how to achieve the application of the USB Type-C connector and achieve a larger screen or compact function under the design of the existing large-screen mobile phone is a major problem that the creator of the present invention wants to solve.
本創作目的之一,在於提供一種降低第一電路板與第二電路板之間的高度,以適用於趨於輕薄的電子裝置的板對板連接器。 One of the objects of the present invention is to provide a board-to-board connector that reduces the height between the first circuit board and the second circuit board to be suitable for a thin and light electronic device.
為達上述目的,本創作提供一種板對板連接器,包括一第一電路板及一第二電路板。第一電路板開設有至少一缺口。第二電路板包括對應缺口配置的一舌片部、設置於舌片部兩相對應表面的複數導接部及電性連接第一電路板的複數導電部。 To achieve the above object, the present invention provides a board-to-board connector including a first circuit board and a second circuit board. The first circuit board is provided with at least one notch. The second circuit board includes a tongue portion corresponding to the notch, a plurality of guiding portions disposed on the corresponding surfaces of the tongue portion, and a plurality of conductive portions electrically connected to the first circuit board.
本創作還具有以下功效,在一具體實施例中,第二電路板為符合USB Type-C介面規範的電路板,亦即舌片部及各導接部的定義皆符合USB Type-C介面規範,且舌片部的寬度小於缺口的寬度,以便與對接連接器插接。 The present invention also has the following effects. In one embodiment, the second circuit board is a circuit board conforming to the USB Type-C interface specification, that is, the definition of the tongue portion and each of the guiding portions conforms to the USB Type-C interface specification. And the width of the tongue portion is smaller than the width of the notch so as to be inserted into the mating connector.
當第一電路板與第二電路板電性連接時,第二電路板的各導電部為一導電端子,且例如以DIP或SMT的方式與第一電路板貼接。然而另一具體實施例中,各導電部亦可為一導電墊,且以SMT的方式與第一電路板貼接,如此降低二電路板間的高度,進而達到緊湊機構設計或空出更多機構設計(ME)的空間。 When the first circuit board is electrically connected to the second circuit board, each conductive portion of the second circuit board is a conductive terminal, and is attached to the first circuit board, for example, in a DIP or SMT manner. In another embodiment, each conductive portion may also be a conductive pad and attached to the first circuit board in an SMT manner, thereby reducing the height between the two circuit boards, thereby achieving a compact mechanism design or vacating more Institutional design (ME) space.
在另一具體實施例中,還包含套接舌片部的一金屬殼體。金屬殼體符合USB Type-C介面規範且具有一殼本體、設置於殼本體的至少一彈片、鄰近彈片設置的一定位凸部及設置於殼本體兩側的一定位片。透過金屬殼體的各定位片,能夠有效增加舌片部在第一電路板的缺口中晃動或震動的程度,以提升與對接連接器插接的穩定性。 In another embodiment, a metal housing for the socket portion is further included. The metal casing conforms to the USB Type-C interface specification and has a shell body, at least one elastic piece disposed on the shell body, a positioning convex portion disposed adjacent to the elastic piece, and a positioning piece disposed on two sides of the shell body. Through the positioning pieces of the metal casing, the degree of shaking or vibration of the tongue portion in the notch of the first circuit board can be effectively increased to improve the stability of the plug connector.
1‧‧‧第一電路板 1‧‧‧First board
11‧‧‧缺口 11‧‧‧ gap
12、14‧‧‧定位部 12, 14‧‧ ‧ Positioning Department
13‧‧‧插接口 13‧‧‧ Plug interface
2‧‧‧第二電路板 2‧‧‧Second circuit board
21‧‧‧舌片部 21‧‧‧ tongue section
211‧‧‧表面 211‧‧‧ surface
212‧‧‧導接部 212‧‧‧Guidance
213‧‧‧側緣部 213‧‧‧lateral edge
22‧‧‧導電部 22‧‧‧Electrical Department
23‧‧‧本體部 23‧‧‧ Body Department
231‧‧‧限位導槽 231‧‧‧Limited guide
24‧‧‧電子元件 24‧‧‧Electronic components
3‧‧‧前置線 3‧‧‧ Frontline
4‧‧‧前置面板 4‧‧‧Front panel
41‧‧‧插接口 41‧‧‧Interface
42‧‧‧開口 42‧‧‧ openings
5‧‧‧金屬殼體 5‧‧‧Metal housing
51‧‧‧殼本體 51‧‧‧Shell body
52‧‧‧彈片 52‧‧‧Shrap
53‧‧‧定位凸部 53‧‧‧ positioning convex
54‧‧‧定位片 54‧‧‧ Positioning film
55‧‧‧定位溝槽 55‧‧‧Positioning groove
56‧‧‧插槽 56‧‧‧Slots
7‧‧‧智慧型手機 7‧‧‧Smart mobile phone
71‧‧‧開口 71‧‧‧ openings
100‧‧‧對接連接器 100‧‧‧Dock connector
101‧‧‧插頭 101‧‧‧ plug
圖1為繪示本創作第一較佳具體實施例的部分立體圖。 1 is a partial perspective view showing a first preferred embodiment of the present creation.
圖2為繪示本創作板對板連接器的分解圖。 2 is an exploded view showing the board of the present board to the board.
圖3為繪示本創作板對板連接器的立體圖。 FIG. 3 is a perspective view showing the board of the present invention.
圖4A為繪示本創作板對板連接器的剖視圖。 4A is a cross-sectional view showing the present board to board connector.
圖4B為繪示本創作板對板連接器的另一剖視圖。 4B is another cross-sectional view showing the present board to board connector.
圖4C為繪示本創作板對板連接器的又一剖視圖。 4C is a cross-sectional view showing the present board-to-board connector.
圖5為繪示本創作板對板連接器與對接連接器插接的示意圖。 FIG. 5 is a schematic view showing the board of the present board being inserted into the board connector and the docking connector.
圖6為繪示本創作第二較佳具體實施例的示意圖。 FIG. 6 is a schematic view showing a second preferred embodiment of the present creation.
圖7為繪示本創作第三較佳具體實施例的示意圖。 FIG. 7 is a schematic diagram showing a third preferred embodiment of the present creation.
圖8為繪示本創作第四較佳具體實施例的示意圖。 FIG. 8 is a schematic view showing a fourth preferred embodiment of the present creation.
圖9為圖8的組合圖。 Figure 9 is a combination diagram of Figure 8.
圖10為圖8的另一組合圖。 FIG. 10 is another combination diagram of FIG. 8.
有關本創作之詳細說明及技術內容,配合圖式說明如下,然而所附圖式僅提供參考與說明用,並非用來對本創作加以限制者。 The detailed description and technical content of the present invention are described below with reference to the drawings, but the drawings are only for reference and explanation, and are not intended to limit the creation.
請參閱圖1至圖5所示,本創作提供一種板對板連接器,包括一第一電路板1及一第二電路板2。如圖1所示的第一具體實施例中,第一電路板1較佳為安裝於一電腦主機(圖略)的一主機板(Mother Board),第二電路板2則為符合USB Type-C介面規範的一印刷電路板,例如硬式印刷電路板或軟式印刷電路板。因此第一電路板1還設置有與第一電路板1並列設置的多個插接口13,例如HDMI、USB2.0或其他適合的連接器,並不限定。 Referring to FIG. 1 to FIG. 5 , the present invention provides a board-to-board connector including a first circuit board 1 and a second circuit board 2 . In the first embodiment shown in FIG. 1, the first circuit board 1 is preferably mounted on a motherboard of a computer mainframe (not shown), and the second circuit board 2 is compatible with the USB Type- A printed circuit board of the C interface specification, such as a hard printed circuit board or a flexible printed circuit board. Therefore, the first circuit board 1 is further provided with a plurality of plug interfaces 13 arranged in parallel with the first circuit board 1, such as HDMI, USB2.0 or other suitable connectors, and is not limited.
在本實施例中,第一電路板1開設有至少一缺口11及複數定位部12。第二電路板2包括對應缺口11配置的一舌片部21、設置於舌片部21兩相對應表面211的複數導接部212及電性連接第一電路板1的複數導電部22。如圖2至圖5所示,舌片部21及各導接部212的定義皆符合USB Type-C介面規範,且舌片部21的寬度小於缺口11的寬度,以使同樣符合USB Type-C介面規範的對接連接器100的插頭101插接。 In this embodiment, the first circuit board 1 is provided with at least one notch 11 and a plurality of positioning portions 12 . The second circuit board 2 includes a tongue portion 21 corresponding to the notch 11 , a plurality of guiding portions 212 disposed on the corresponding surfaces 211 of the tongue portion 21 , and a plurality of conductive portions 22 electrically connected to the first circuit board 1 . As shown in FIG. 2 to FIG. 5, the definition of the tongue portion 21 and each of the guiding portions 212 conforms to the USB Type-C interface specification, and the width of the tongue portion 21 is smaller than the width of the notch 11 so as to conform to the USB Type-. The plug 101 of the docking connector 100 of the C interface specification is plugged.
具體而言,每一導接部212分別暴露於舌片部21的兩相對應表面211為一金手指,且數量為24個。此外,舌片部21的長度能夠凸出於缺口11的長度或與缺口11齊平,甚至是短於缺口11的長度,視需要而調整,並不限定。 Specifically, each of the guiding portions 212 is exposed to the two corresponding surfaces 211 of the tongue portion 21 as a gold finger, and the number is 24. Further, the length of the tongue portion 21 can protrude from the length of the notch 11 or be flush with the notch 11, or even shorter than the length of the notch 11, and is adjusted as needed, and is not limited.
如圖4A、圖4B及圖4C所示,第二電路板2的各導電部22能夠以雙列式封裝零件安裝製程(DIP;Dual In Line Package)或表面黏著技術(SMT;Surface Mount Technology)的方式與第一電路板1貼接。換言之,以如圖4A所示的DIP製程而言,各導電部22較佳為一導電端子,各定位部12則為穿孔,以利各導電端子穿設後焊固。以如圖4B或圖4C所示的SMT製程而言,各導電部22可為導電端子並彎折的與第一電路板1的各定位部12焊固,或是各導電部22為一導電墊,而與同為導電墊的各定位部12焊固,使各導電部22水平的貼接各定位部12,以將第二電路板2焊固於第一電路板1上。因此有效降低第一電路板1與第二電路板2之間的高度/整體體積,進而空出更多機構設計(ME)的空間,以適用於趨於輕薄或其他目的使用的電子裝置中。 As shown in FIG. 4A, FIG. 4B and FIG. 4C, each conductive portion 22 of the second circuit board 2 can be a DIP (Dual In Line Package) or a surface mount technology (SMT; Surface Mount Technology). The way is attached to the first circuit board 1. In other words, in the DIP process as shown in FIG. 4A, each of the conductive portions 22 is preferably a conductive terminal, and each of the positioning portions 12 is a through hole, so that the conductive terminals are pierced and soldered. In the SMT process as shown in FIG. 4B or FIG. 4C, each of the conductive portions 22 may be a conductive terminal and bent to be soldered to each positioning portion 12 of the first circuit board 1, or each conductive portion 22 is electrically conductive. The pads are soldered to the positioning portions 12 which are the same as the conductive pads, and the conductive portions 22 are horizontally attached to the positioning portions 12 to solder the second circuit board 2 to the first circuit board 1. Therefore, the height/overall volume between the first circuit board 1 and the second circuit board 2 is effectively reduced, thereby freeing up more space for the mechanism design (ME) for use in an electronic device that tends to be thin or thin or used for other purposes.
此外,第二電路板2還包含貼接第一電路板1的一本體部23,本體部23焊接有至少一電子元件24。在如圖2至圖5的實施例中,電子元件24配置有例如轉換IC、保護IC、突波保護IC、電感、電阻或各式可行的IC等電子元件,以進行USB Type-C介面規範的訊號傳輸、供電或其他目的。 In addition, the second circuit board 2 further includes a body portion 23 attached to the first circuit board 1, and the body portion 23 is soldered with at least one electronic component 24. In the embodiment of FIGS. 2 to 5, the electronic component 24 is configured with electronic components such as a conversion IC, a protection IC, a surge protection IC, an inductor, a resistor, or various feasible ICs for performing USB Type-C interface specifications. Signal transmission, power supply or other purposes.
如圖5所示的實施例中,舌片部21二側還設有一側緣部213,各側緣部213為金屬材製成且間隔的與各導接部212設置,以不影響鄰近的導接部212的訊號功能。當對接連接器100的插頭101與第二電路板2的舌片部21插接時,金屬材質製成的二側緣部213能夠增加抗磨耗度,進而增加舌片部21的使用壽命。 In the embodiment shown in FIG. 5, the side of the tongue portion 21 is further provided with a side edge portion 213, and each of the side edge portions 213 is made of a metal material and is spaced apart from each of the guiding portions 212 so as not to affect the adjacent portions. The signal function of the guiding unit 212. When the plug 101 of the mating connector 100 is inserted into the tongue portion 21 of the second circuit board 2, the two side edge portions 213 made of a metal material can increase the wear resistance, thereby increasing the service life of the tongue portion 21.
請一併參考圖6所示,在本第二具體實施例中,還包含與第一電路板1電性連接的一前置線3及焊接於第一電路板1上的複數插接口41。在此所指的各插接口41例如為音源插口、USB2.0或其他適合的連接器插口,並不限定。如圖6所示,第一電路板1較佳為安裝於電腦主機(圖略)的前面板(圖略)的一前置面板4,以擴充電腦主機的各式連接器插接。前置面板4對應第二電路板2的舌板部21還開設有一開口42,以供對接連接器100的插頭101穿過開口42與舌片部21電性連接。然而在如圖7所示的第三具體實施例中,電子裝置亦可為智慧型手機7或其他適合的可攜式電子裝置。所述的智慧型手機7開設有一開口71供與對接連接器(圖略)插接,第二電路板2則為符合USB Type-C介面規範的一印刷電路板。 Referring to FIG. 6 , in the second embodiment, a pre-wire 3 electrically connected to the first circuit board 1 and a plurality of plug connectors 41 soldered to the first circuit board 1 are further included. The plug connectors 41 referred to herein are, for example, audio source jacks, USB 2.0 or other suitable connector jacks, and are not limited. As shown in FIG. 6, the first circuit board 1 is preferably mounted on a front panel 4 of the front panel (not shown) of the computer mainframe (not shown) to expand the connector of the computer mainframe. The front panel 4 further defines an opening 42 corresponding to the tongue portion 21 of the second circuit board 2 for electrically connecting the plug 101 of the mating connector 100 to the tongue portion 21 through the opening 42. However, in the third embodiment shown in FIG. 7, the electronic device can also be a smart phone 7 or other suitable portable electronic device. The smart phone 7 has an opening 71 for docking with a docking connector (not shown), and the second circuit board 2 is a printed circuit board conforming to the USB Type-C interface specification.
由於上述第一至第三具體實施例的第二電路板2的舌片部21均未安裝有金屬殼體(圖略),而直接焊接於例如電腦主機或智慧型手機的主機板(即第一電路板1)上,因此在不改變現有前置面板4或智慧型手機7尺寸的情況下,能夠有效達到緊湊機構設計或擴大螢幕尺寸的功效。 Since the tongue portions 21 of the second circuit board 2 of the first to third embodiments are not mounted with a metal case (not shown), they are directly soldered to a motherboard such as a computer main body or a smart phone (ie, A circuit board 1) can effectively achieve the compact mechanism design or expand the screen size without changing the size of the existing front panel 4 or the smart phone 7.
請一併參考圖8及圖9所示,為本創作第四具體實施例的示意圖及立體圖。在不考慮需要空出更多空間或達到緊湊結構設計的情況下,可使用具有金屬殼體5的具體實施例。在本實施例中,還包含套接舌片部21的一金屬殼體5,以降低舌片部21在缺口11中的晃動、震動的機率。 Please refer to FIG. 8 and FIG. 9 together for a schematic view and a perspective view of a fourth embodiment of the present invention. A specific embodiment with a metal housing 5 can be used without considering the need to free up more space or to achieve a compact structural design. In the present embodiment, a metal casing 5 of the sleeve tongue portion 21 is further included to reduce the probability of the tongue portion 21 swaying and vibrating in the notch 11.
金屬殼體5係符合USB Type-C介面規範且具有一殼本體51、設置於殼本體51的至少一彈片52、鄰近彈片52設置的一定位凸部53、設置於殼本體51兩側的一定位片54及設置於殼本體51的尾端的二定位溝槽55。當金屬殼體5套接舌片部21後,即形成可供對接連接器的插頭(圖略)穩定插接的一插槽56。 The metal shell 5 conforms to the USB Type-C interface specification and has a shell body 51, at least one elastic piece 52 disposed on the shell body 51, a positioning convex portion 53 disposed adjacent to the elastic piece 52, and one disposed on both sides of the shell body 51. The positioning piece 54 and the two positioning grooves 55 are disposed at the tail end of the shell body 51. When the metal casing 5 is sleeved into the tongue portion 21, a socket 56 for stably plugging the plug (not shown) of the mating connector is formed.
第二電路板2相對各定位溝槽55還設置有二限位導槽231,使金屬殼體5能夠利用各定位溝槽55夾固各限位導槽231,以固定於第一電路板1上。第一電路板1相對各定位片54則設有二定位部14,如圖8及圖9所示的各定位部14較佳為穿孔,以利片狀的各定位片54穿入的焊固於各定位部14上。然而如圖10所示的各定位片54亦可與成平面墊的各定位部14平貼的焊接固定,視需要而改變。因此透過金屬殼體5的各定位片54,能夠有效增加舌片部21在第一電路板1的缺口11中晃動或震動的程度,以提升與對接連接器100插接的穩定性。 The second circuit board 2 is further provided with two limiting guiding slots 231 opposite to the positioning grooves 55, so that the metal housing 5 can clamp the limiting guiding slots 231 by using the positioning grooves 55 to be fixed to the first circuit board 1 on. The first circuit board 1 is provided with two positioning portions 14 relative to the positioning pieces 54. The positioning portions 14 as shown in FIG. 8 and FIG. 9 are preferably perforated so as to facilitate the penetration of the sheet-like positioning pieces 54. It is placed on each positioning unit 14. However, each of the positioning pieces 54 as shown in FIG. 10 can also be fixedly welded to the positioning portions 14 of the planar pad, and can be changed as needed. Therefore, the degree of sway or vibration of the tongue portion 21 in the notch 11 of the first circuit board 1 can be effectively increased by the positioning pieces 54 of the metal casing 5 to improve the stability of the mating connector 100.
此外,在如圖8至圖10所示的實施例中,每一彈片52的彈片接觸部(未標示)及定位凸部53分別係朝舌片部21的方向凸設,以增加對接連接器100的插頭101的夾持力與定位效果。有關彈片52與定位凸部53的數量較佳為4個且彼此相鄰設置,但不以本實施例為限。 In addition, in the embodiment shown in FIG. 8 to FIG. 10, the elastic piece contact portion (not shown) and the positioning convex portion 53 of each elastic piece 52 are respectively protruded toward the tongue piece portion 21 to increase the mating connector. The clamping force and positioning effect of the plug 101 of 100. The number of the elastic pieces 52 and the positioning convex portions 53 is preferably four and disposed adjacent to each other, but is not limited to the embodiment.
綜上所述,本文於此所揭示的實施例應被視為用以說明本創作,而非用以限制本創作。本創作的範圍應由後附申請專利範圍所界定,並涵蓋其合法均等物,並不限於先前的描述。 In summary, the embodiments disclosed herein are to be considered as illustrative of the present invention and are not intended to limit the present invention. The scope of this creation is defined by the scope of the appended patent application and covers its legal equivalents and is not limited to the foregoing description.
Claims (12)
Priority Applications (1)
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TW106213555U TWM556944U (en) | 2017-09-12 | 2017-09-12 | Board to board connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW106213555U TWM556944U (en) | 2017-09-12 | 2017-09-12 | Board to board connector |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM556944U true TWM556944U (en) | 2018-03-11 |
Family
ID=62191656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106213555U TWM556944U (en) | 2017-09-12 | 2017-09-12 | Board to board connector |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM556944U (en) |
-
2017
- 2017-09-12 TW TW106213555U patent/TWM556944U/en unknown
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