CN207398397U - Board-to-Board Connector - Google Patents
Board-to-Board Connector Download PDFInfo
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- CN207398397U CN207398397U CN201721184899.2U CN201721184899U CN207398397U CN 207398397 U CN207398397 U CN 207398397U CN 201721184899 U CN201721184899 U CN 201721184899U CN 207398397 U CN207398397 U CN 207398397U
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Abstract
Description
技术领域technical field
本实用新型是有关一种连接器,尤其是指一种符合USB Type-C接口规范的板对板连接器。The utility model relates to a connector, in particular to a board-to-board connector conforming to the USB Type-C interface specification.
背景技术Background technique
由于目前最新开发出来的USB Type-C连接器,具有接口尺寸最小、传输速度最快、能正插和反插且向下兼容、适用性高等优点,因此USB Type-C连接器已逐渐被现今各式3C电子产品所采用。此外,以大屏幕的智能型手机而言,在应用上述USB Type-C连接器时,不但会增加整体高度/体积,也无法真正实现在现有的手机大小不改变的情况下,设计出具有更大的屏幕。因此,如何在现有大屏幕手机的机构设计下,达到应用USB Type-C连接器并实现更大屏幕或结构紧凑的功效,乃为本实用新型所亟待解决的一大课题。Since the newly developed USB Type-C connector has the advantages of the smallest interface size, the fastest transmission speed, positive and reverse insertion, backward compatibility, and high applicability, the USB Type-C connector has gradually been adopted by today's Used in various 3C electronic products. In addition, for large-screen smart phones, when the above-mentioned USB Type-C connector is used, not only will the overall height/volume be increased, but it is also impossible to design a mobile phone with the same size as the existing mobile phone. bigger screen. Therefore, how to apply the USB Type-C connector and achieve the effect of larger screen or compact structure under the mechanism design of the existing large-screen mobile phone is a major problem to be solved urgently by the present invention.
实用新型内容Utility model content
本实用新型目的之一在于提供一种降低第一电路板与第二电路板之间的高度,以适用于趋于轻薄的电子装置的板对板连接器。One of the purposes of the present invention is to provide a board-to-board connector that reduces the height between the first circuit board and the second circuit board, so as to be suitable for electronic devices that tend to be thinner.
为达成上述目的,本实用新型提供一种板对板连接器,包括一第一电路板及一第二电路板。第一电路板开设有至少一缺口。第二电路板包括对应缺口配置的一舌片部、设置于舌片部两相对应表面的数个导接部及电性连接第一电路板的数个导电部。To achieve the above purpose, the utility model provides a board-to-board connector, which includes a first circuit board and a second circuit board. At least one notch is opened on the first circuit board. The second circuit board includes a tongue portion corresponding to the notch, several conductive portions disposed on two corresponding surfaces of the tongue portion, and several conductive portions electrically connected to the first circuit board.
在一具体实施例中,第二电路板为符合USB Type-C接口规范的电路板,即舌片部及各导接部皆符合USB Type-C接口规范,且舌片部的宽度小于缺口的宽度,以便与对接连接器插接。In a specific embodiment, the second circuit board is a circuit board conforming to the USB Type-C interface specification, that is, the tongue part and each guide part conform to the USB Type-C interface specification, and the width of the tongue part is smaller than that of the notch. width to mate with a mating connector.
当第一电路板与第二电路板电性连接时,第二电路板的各导电部为一导电端子,且例如以DIP或SMT的方式与第一电路板贴接。然而另一具体实施例中,各导电部也可为一导电垫,且以SMT的方式与第一电路板贴接,如此降低第一电路板与第二电路板间的高度,进而达到紧凑机构设计或空出更多机构设计(ME)的空间。在另一具体实施例中,还包含套接舌片部的一金属壳体。金属壳体符合USB Type-C接口规范且具有一壳本体、设置于壳本体的至少一弹片、相邻弹片设置的一定位凸部及分别设置于壳本体两侧的一定位片。When the first circuit board is electrically connected to the second circuit board, each conductive portion of the second circuit board is a conductive terminal, and is bonded to the first circuit board by, for example, DIP or SMT. However, in another specific embodiment, each conductive portion can also be a conductive pad, and is attached to the first circuit board in an SMT manner, thus reducing the height between the first circuit board and the second circuit board, thereby achieving a compact structure Design or make room for more Mechanism Design (ME). In another specific embodiment, it further includes a metal shell socketed on the tongue part. The metal shell conforms to the USB Type-C interface specification and has a shell body, at least one elastic piece disposed on the shell body, a positioning protrusion disposed adjacent to the elastic plate, and a positioning piece respectively disposed on both sides of the shell body.
在另一具体实施例中,其中弹片的至少一部分及定位凸部是朝舌片部方向凸设,且各定位片穿入或平贴的焊接于各定位部上。In another specific embodiment, at least a part of the elastic piece and the positioning protrusion protrude toward the tongue portion, and each positioning piece penetrates or is welded flatly on each positioning portion.
本实用新型的板对板连接器通过金属壳体的各定位片,能够有效降低舌片部在第一电路板的缺口中晃动或震动的程度,以提升与对接连接器插接的稳定性。The board-to-board connector of the utility model can effectively reduce the degree of shaking or vibration of the tongue part in the gap of the first circuit board through the positioning pieces of the metal shell, so as to improve the stability of plugging with the butt connector.
附图说明Description of drawings
图1为本实用新型第一较佳具体实施例的部分立体图。Fig. 1 is a partial perspective view of the first preferred embodiment of the utility model.
图2为本实用新型板对板连接器的分解图。Fig. 2 is an exploded view of the board-to-board connector of the present invention.
图3为本实用新型板对板连接器的立体图。Fig. 3 is a perspective view of the board-to-board connector of the present invention.
图4A为本实用新型板对板连接器的剖视图。FIG. 4A is a cross-sectional view of the board-to-board connector of the present invention.
图4B为本实用新型板对板连接器的另一剖视图。FIG. 4B is another cross-sectional view of the board-to-board connector of the present invention.
图4C为本实用新型板对板连接器的又一剖视图。FIG. 4C is another cross-sectional view of the board-to-board connector of the present invention.
图5为本实用新型板对板连接器与对接连接器插接的示意图。FIG. 5 is a schematic diagram of the board-to-board connector and the butt connector of the present invention being inserted.
图6为本实用新型第二较佳具体实施例的示意图。Fig. 6 is a schematic diagram of a second preferred embodiment of the present invention.
图7为本实用新型第三较佳具体实施例的示意图。Fig. 7 is a schematic diagram of a third preferred embodiment of the present invention.
图8为本实用新型第四较佳具体实施例的示意图。Fig. 8 is a schematic diagram of a fourth preferred embodiment of the present invention.
图9为图8的组合示意图。FIG. 9 is a combined schematic diagram of FIG. 8 .
图10为图8的另一组合示意图。FIG. 10 is another combined schematic diagram of FIG. 8 .
附图中的符号说明:Explanation of symbols in the accompanying drawings:
1 第一电路板;11 缺口;12、14 定位部;13 插接口;2 第二电路板;21 舌片部;211表面;212 导接部;213 侧缘部;22 导电部;23 本体部;231 限位导槽;24 电子组件;3前置线;4 前置面板;41 插接口;42 开口;5 金属壳体;51 壳本体;52 弹片;53 定位凸部;54 定位片;55 定位沟槽;56 插槽;7 智能型手机;71 开口;100 对接连接器;101 插头。1 first circuit board; 11 notch; 12, 14 positioning part; 13 socket; 2 second circuit board; 21 tongue part; 211 surface; 212 guide part; 213 side edge part; 22 conductive part; ;231 Limiting guide groove; 24 Electronic component; 3 Front line; 4 Front panel; 41 Socket; 42 Opening; 5 Metal shell; 51 Shell body; 52 Shrapnel; Locating grooves; 56 slots; 7 smartphones; 71 openings; 100 docking connectors; 101 plugs.
具体实施方式Detailed ways
有关本实用新型的详细说明及技术内容,配合图式说明如下,然而所附图式仅提供参考与说明用,并非用来对本实用新型加以限制。The detailed description and technical content of the present utility model are described below with drawings, but the attached drawings are only for reference and illustration, and are not intended to limit the present utility model.
参阅图1至图5所示,本实用新型提供一种板对板连接器,包括一第一电路板1及一第二电路板2。如图1所示的第一具体实施例中,第一电路板1较佳为安装于一计算机主机(图略)的一主板(Mother Board),第二电路板2则为符合USB Type-C接口规范的一印刷电路板,例如硬式印刷电路板或软式印刷电路板。因此第一电路板1还设置有与第二电路板2并列设置的多个插接口13,例如HDMI、USB2.0或其他适合的连接器,并不限定。Referring to FIG. 1 to FIG. 5 , the utility model provides a board-to-board connector, which includes a first circuit board 1 and a second circuit board 2 . In the first specific embodiment shown in FIG. 1, the first circuit board 1 is preferably installed on a motherboard (Mother Board) of a computer host (not shown), and the second circuit board 2 is compatible with USB Type-C A printed circuit board of the interface specification, such as a rigid printed circuit board or a flexible printed circuit board. Therefore, the first circuit board 1 is also provided with a plurality of sockets 13 arranged in parallel with the second circuit board 2 , such as HDMI, USB2.0 or other suitable connectors, which are not limited.
在本实施例中,第一电路板1开设有至少一缺口11及数个定位部12。第二电路板2包括对应缺口11配置的一舌片部21、设置于舌片部21两相对应表面211的数个导接部212及电性连接第一电路板1的数个导电部22。如图2至图5所示,舌片部21及各导接部212皆符合USB Type-C接口规范,且舌片部21的宽度小于缺口11的宽度,以使同样符合USB Type-C接口规范的对接连接器100的插头101插接。In this embodiment, the first circuit board 1 is provided with at least one notch 11 and several positioning portions 12 . The second circuit board 2 includes a tongue part 21 arranged corresponding to the notch 11, several conductive parts 212 arranged on two corresponding surfaces 211 of the tongue part 21, and several conductive parts 22 electrically connected to the first circuit board 1 . As shown in Figures 2 to 5, the tongue part 21 and each lead part 212 conform to the USB Type-C interface specification, and the width of the tongue part 21 is smaller than the width of the notch 11, so that it also conforms to the USB Type-C interface The standard mating connector 100 is mated with the plug 101 .
具体而言,数个导接部212分别暴露于舌片部21的两相对应表面211并分别形成一金手指,且数量为24个。此外,舌片部21的长度能够凸出于缺口11的长度或与缺口11齐平,甚至是短于缺口11的长度,视需要而调整,并不限定。Specifically, a plurality of conducting portions 212 are respectively exposed on two corresponding surfaces 211 of the tongue portion 21 to form a golden finger, and the number is 24. Referring to FIG. In addition, the length of the tongue portion 21 can protrude beyond the length of the notch 11 or be flush with the notch 11 , or even be shorter than the length of the notch 11 , which can be adjusted as needed and is not limited.
如图4A、图4B及图4C所示,第二电路板2的各导电部22能够以双列式封装零件安装制程(DIP;Dual In Line Package)或表面粘着技术(SMT;Surface Mount Technology)的方式与第一电路板1贴接。换言之,以如图4A所示的DIP制程而言,各导电部22较佳为一导电端子,各定位部12则为穿孔,以便各导电端子穿设后焊固。以如图4B或图4C所示的SMT制程而言,各导电部22可为导电端子并弯折的与第一电路板1的各定位部12焊固,或是各导电部22为一导电垫,而与同为导电垫的各定位部12焊固,使各导电部22水平的贴接各定位部12,以将第二电路板2焊固于第一电路板1上。因此有效降低第一电路板1与第二电路板2之间的高度/整体体积,进而空出更多机构设计(ME)的空间,以适用于趋于轻薄或其他使用目的的电子装置中。As shown in FIG. 4A, FIG. 4B and FIG. 4C, each conductive portion 22 of the second circuit board 2 can be mounted in a dual inline package (DIP; Dual In Line Package) or surface mount technology (SMT; Surface Mount Technology) The method is attached to the first circuit board 1 . In other words, in terms of the DIP process shown in FIG. 4A , each conductive portion 22 is preferably a conductive terminal, and each positioning portion 12 is a through hole, so that each conductive terminal is passed through and welded. In terms of the SMT process shown in FIG. 4B or FIG. 4C, each conductive portion 22 can be a conductive terminal and is bent and welded to each positioning portion 12 of the first circuit board 1, or each conductive portion 22 is a conductive Pad, and welded with each positioning portion 12 that is also a conductive pad, so that each conductive portion 22 is attached to each positioning portion 12 horizontally, so that the second circuit board 2 is welded on the first circuit board 1 . Therefore, the height/overall volume between the first circuit board 1 and the second circuit board 2 is effectively reduced, thereby freeing up more space for mechanical design (ME), so as to be suitable for electronic devices that tend to be thinner or used for other purposes.
此外,第二电路板2还包含贴接第一电路板1的一本体部23,本体部23焊接有至少一电子组件24。在如图2至图5所示的实施例中,电子组件24配置有例如转换IC、保护IC、突波保护IC、电感、电阻或各式可行的IC等电子组件,以进行符合USB Type-C接口规范的信号传输、供电或其他目的。In addition, the second circuit board 2 further includes a body portion 23 attached to the first circuit board 1 , and at least one electronic component 24 is soldered to the body portion 23 . In the embodiment shown in FIGS. 2 to 5, the electronic components 24 are configured with electronic components such as conversion ICs, protection ICs, surge protection ICs, inductors, resistors, or various feasible ICs to implement USB Type- C interface specification for signal transmission, power supply or other purposes.
如图5所示的实施例中,舌片部21两侧还分别设有一侧缘部213,各侧缘部213为金属材制成且与导接部212间保持有间隔,以不影响相邻的导接部212的信号功能。当对接连接器100的插头101与第二电路板2的舌片部21插接时,金属材质制成的二侧缘部213能够增加抗磨耗度,进而增加舌片部21的使用寿命。In the embodiment shown in FIG. 5 , side edge portions 213 are respectively provided on both sides of the tongue portion 21, and each side edge portion 213 is made of metal material and keeps a distance from the guide portion 212 so as not to affect the relative The signal function of the adjacent lead part 212. When the plug 101 of the mating connector 100 is mated with the tongue portion 21 of the second circuit board 2 , the two side edge portions 213 made of metal can increase wear resistance, thereby increasing the service life of the tongue portion 21 .
参考图6所示,在本第二具体实施例中,还包含与第一电路板1电性连接的一前置线3及焊接于第一电路板1上的数个插接口41。在此所指的各插接口41例如为音源插口、USB2.0或其他适合的连接器插口,并不限定。如图6所示,第一电路板1较佳为安装于计算机主机(图略)的前面板(图略)的一前置面板4,以扩充计算机主机的各式连接器插接。前置面板4对应第二电路板2的舌片部21还开设有一开口42,以供对接连接器100的插头101穿过开口42与舌片部21电性连接。然而在如图7所示的第三具体实施例中,电子装置也可为智能型手机7或其他适合的可携式电子装置。所述的智能型手机7开设有一开口71供与对接连接器(图略)插接,第二电路板2则为符合USB Type-C接口规范的一印刷电路板。Referring to FIG. 6 , in the second embodiment, a front wire 3 electrically connected to the first circuit board 1 and several sockets 41 welded on the first circuit board 1 are also included. The sockets 41 referred to here are, for example, audio sockets, USB2.0 or other suitable connector sockets, and are not limited thereto. As shown in FIG. 6 , the first circuit board 1 is preferably a front panel 4 installed on the front panel (not shown) of the computer host (not shown) to expand various connectors of the computer host. The front panel 4 further defines an opening 42 corresponding to the tongue portion 21 of the second circuit board 2 , for the plug 101 of the docking connector 100 to pass through the opening 42 and electrically connect to the tongue portion 21 . However, in the third embodiment shown in FIG. 7 , the electronic device can also be a smart phone 7 or other suitable portable electronic devices. The smart phone 7 is provided with an opening 71 for plugging with a docking connector (not shown), and the second circuit board 2 is a printed circuit board conforming to the USB Type-C interface specification.
由于上述第一至第三具体实施例的第二电路板2的舌片部21均未安装有金属壳体(图略),而直接焊接于例如计算机主机或智能型手机的主板(即第一电路板1)上,因此在不改变现有前置面板4或智能型手机7尺寸的情况下,能够有效达到紧凑机构设计或扩大屏幕尺寸的功效。Since the tongue part 21 of the second circuit board 2 of the above-mentioned first to third specific embodiments is not equipped with a metal shell (figure omitted), it is directly welded to the main board of a computer host or a smart phone (i.e. the first On the circuit board 1), therefore, without changing the size of the existing front panel 4 or the smart phone 7, it is possible to effectively achieve the effects of compact mechanism design or enlarged screen size.
参考图8及图9所示,为本实用新型第四具体实施例的示意图及立体图。在不考虑需要空出更多空间或达到紧凑结构设计的情况下,可使用具有金属壳体5的具体实施例。在本实施例中,还包含套接舌片部21的一金属壳体5,以降低舌片部21在缺口11中的晃动、震动的机率。Referring to FIG. 8 and FIG. 9 , it is a schematic diagram and a perspective view of a fourth embodiment of the present invention. Regardless of the need to free up more space or achieve a compact design, a specific embodiment with a metal housing 5 can be used. In this embodiment, a metal shell 5 is also included to socket the tongue portion 21 to reduce the probability of shaking and vibration of the tongue portion 21 in the notch 11 .
金属壳体5是符合USB Type-C接口规范且具有一壳本体51、设置于壳本体51的至少一弹片52、相邻弹片52设置的一定位凸部53、分别设置于壳本体51两侧的一定位片54及设置于壳本体51的尾端的二定位沟槽55。当金属壳体5套接舌片部21后,即形成可供对接连接器的插头(图略)稳定插接的一插槽56。The metal shell 5 conforms to the USB Type-C interface specification and has a shell body 51, at least one elastic piece 52 arranged on the shell body 51, a positioning protrusion 53 set adjacent to the elastic piece 52, and is respectively arranged on both sides of the shell body 51. A positioning piece 54 and two positioning grooves 55 are provided at the rear end of the shell body 51 . When the metal shell 5 fits over the tongue portion 21 , a slot 56 is formed into which a plug (not shown) of the mating connector can be inserted stably.
第二电路板2相对各定位沟槽55还设置有二限位导槽231,使金属壳体5能够利用各定位沟槽55夹固各限位导槽231,以固定于第一电路板1上。第一电路板1相对各定位片54则设有二定位部14,如图8及图9所示的各定位部14较佳为穿孔,以便片状的各定位片54穿入焊固于各定位部14上。然而如图10所示的各定位片54也可与成平面垫的各定位部14平贴的焊接固定,视需要而改变。因此通过金属壳体5的各定位片54,能够有效降低舌片部21在第一电路板1的缺口11中晃动或震动的程度,以提升与对接连接器100插接的稳定性。The second circuit board 2 is also provided with two position-limiting guide grooves 231 relative to each positioning groove 55, so that the metal shell 5 can use each positioning groove 55 to clamp each position-limiting guide groove 231 to be fixed on the first circuit board 1 superior. The first circuit board 1 is provided with two positioning portions 14 relative to each positioning piece 54. Each positioning portion 14 shown in FIG. 8 and FIG. on the positioning part 14. However, each positioning piece 54 as shown in FIG. 10 can also be welded and fixed with each positioning portion 14 of the planar pad, and it can be changed as required. Therefore, through the positioning pieces 54 of the metal shell 5 , the shaking or vibration of the tongue part 21 in the notch 11 of the first circuit board 1 can be effectively reduced, so as to improve the stability of mating with the mating connector 100 .
此外,在如图8至图10所示的实施例中,每一弹片52的弹片接触部(未标示)及定位凸部53分别是朝舌片部21的方向凸设,以增加对接连接器100的插头101的夹持力与定位效果。有关弹片52与定位凸部53的数量较佳为4个且彼此相邻设置,但不以本实施例为限。In addition, in the embodiment shown in FIGS. 8 to 10 , the contact portion (not marked) and the positioning protrusion 53 of each elastic piece 52 are respectively protruded toward the tongue portion 21, so as to increase the number of docking connectors. The clamping force and positioning effect of the plug 101 of 100. The number of the elastic pieces 52 and the positioning protrusions 53 is preferably four and arranged adjacent to each other, but not limited to this embodiment.
综上所述,本实用新型于此所公开的实施例应被视为用以说明本实用新型,而非用以限制本实用新型。本实用新型的范围应由所附申请专利范围所界定,并涵盖其合法均等物,并不限于先前的描述。To sum up, the embodiments of the present invention disclosed herein should be regarded as illustrating the present invention rather than limiting the present invention. The scope of the present invention shall be defined by the claims of the appended claims, and shall cover their legal equivalents, and not be limited by the foregoing description.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109510008A (en) * | 2017-09-15 | 2019-03-22 | 巧连科技股份有限公司 | Board-to-board connector |
| CN109787017A (en) * | 2018-12-27 | 2019-05-21 | 维沃移动通信有限公司 | Terminal device |
| CN110518387A (en) * | 2019-08-30 | 2019-11-29 | Oppo(重庆)智能科技有限公司 | Plug connector and preparation method thereof, electronic equipment |
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2017
- 2017-09-15 CN CN201721184899.2U patent/CN207398397U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109510008A (en) * | 2017-09-15 | 2019-03-22 | 巧连科技股份有限公司 | Board-to-board connector |
| CN109787017A (en) * | 2018-12-27 | 2019-05-21 | 维沃移动通信有限公司 | Terminal device |
| WO2020135170A1 (en) * | 2018-12-27 | 2020-07-02 | 维沃移动通信有限公司 | Terminal device |
| CN110518387A (en) * | 2019-08-30 | 2019-11-29 | Oppo(重庆)智能科技有限公司 | Plug connector and preparation method thereof, electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180522 |