WO2018168352A1 - Receptacle - Google Patents

Receptacle Download PDF

Info

Publication number
WO2018168352A1
WO2018168352A1 PCT/JP2018/005941 JP2018005941W WO2018168352A1 WO 2018168352 A1 WO2018168352 A1 WO 2018168352A1 JP 2018005941 W JP2018005941 W JP 2018005941W WO 2018168352 A1 WO2018168352 A1 WO 2018168352A1
Authority
WO
WIPO (PCT)
Prior art keywords
multilayer substrate
folded
receptacle
tongue
folded portion
Prior art date
Application number
PCT/JP2018/005941
Other languages
French (fr)
Japanese (ja)
Inventor
匡彦 松本
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2018168352A1 publication Critical patent/WO2018168352A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component

Definitions

  • This invention relates to a receptacle.
  • Japanese Patent Laying-Open No. 2016-100082 discloses a connector for the purpose of improving a holding force for holding a contact at a predetermined position in the connector (Patent Document 1). .
  • the connector disclosed in Patent Document 1 includes an upper contact group, a lower contact group, a main body molded part in which the upper contact group and the lower contact group are press-fitted forward in the mating direction of the mating connector, and an upper contact And an upper contact insert part integrated by insert molding.
  • the upper contact insert part is provided so as to restrict the movement of the lower contact group when the mating connector is fitted.
  • a receptacle configured to be capable of inserting and removing a plug is known. Such a receptacle is required to exhibit high durability against repeated plug insertion and removal while having a simple configuration.
  • an object of the present invention is to solve the above-described problems, and to provide a receptacle that exhibits a high durability against plug insertion and removal while having a simple configuration.
  • the receptacle according to the present invention is a receptacle configured so that a plug can be inserted and removed.
  • the receptacle includes a multilayer substrate.
  • the multilayer substrate has a tongue portion located at the periphery when the multilayer substrate is viewed in plan.
  • the receptacle includes a group of electrodes provided on both surfaces of the multilayer substrate at the tongue, and a metal cover connected to the multilayer substrate.
  • the cover has a shell portion disposed so as to surround the tongue portion, a first folded portion configured to be elastically deformable, having a folded shape that is folded from the shell portion so as to approach one surface of the multilayer substrate, A second folded portion is provided opposite to the first folded portion, has a folded shape that is folded back from the shell portion so as to approach the other surface of the multilayer substrate, and is configured to be elastically deformable.
  • the tongue portion is disposed between the first folded portion and the second folded portion while elastically deforming the first folded portion and the second folded portion in a direction away from each other.
  • FIG. 3 is an exploded view illustrating a cover and a multilayer substrate in FIG. 2. It is a top view which shows the cover and multilayer substrate in FIG. FIG.
  • FIG. 9 is a cross-sectional view showing the cover and the multilayer substrate as seen from the direction of the arrow on the line IX-IX in FIG. It is sectional drawing which shows the connection process of the cover in FIG. 9, and a multilayer substrate.
  • FIG. 10 is a cross-sectional view showing a state in which a plug is connected to the receptacle in FIG. 9.
  • FIG. 10 is a cross-sectional view showing a step of connecting a plug to the receptacle in FIG. 9.
  • FIG. 1 is a perspective view showing a usage pattern of a receptacle according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view showing the receptacle in FIG. Referring to FIGS. 1 and 2, receptacle 10 is configured so that plug 70 can be inserted and removed.
  • the receptacle 10 and the plug 70 constitute a connector for transmitting and receiving at least one of a signal and power in an electronic device.
  • the receptacle 10 and the plug 70 constitute a USB type C connector.
  • the receptacle 10 is mounted on, for example, a mobile phone or a personal computer.
  • the receptacle 10 includes a cover 41, a case 12 (base member), and a multilayer substrate 21.
  • the cover 41 is made of metal.
  • the cover 41 forms an insertion port 14 when the plug 70 is inserted into the receptacle 10.
  • the cover 41 and the multilayer substrate 21 are accommodated in the case 12.
  • the case 12 has the appearance of a device on which the receptacle 10 is mounted.
  • the case 12 has a thin plate shape.
  • the case 12 is configured by combining an upper case 12m and a lower case 12n.
  • the combination direction of the upper case 12m and the lower case 12n is the thickness direction of the case 12.
  • the case 12 is provided with an opening 13 so as to expose the insertion opening 14 formed by the cover 41.
  • the opening 13 is provided at the boundary between the upper case 12m and the lower case 12n.
  • the cover 41 is connected to the multilayer substrate 21.
  • the multilayer substrate 21 is disposed in a plane orthogonal to the thickness direction of the case 12.
  • the multilayer substrate 21 is supported by the case 12 (more specifically, the lower case 12n).
  • the multilayer substrate 21 is fixed to the case 12 by screws 36 (fixing members) described later.
  • the multilayer substrate 21 has a first surface 21a and a second surface 21b disposed on the back side of the first surface 21a.
  • the first surface 21 a faces the upper case 12 m in the thickness direction of the case 12.
  • the second surface 21b faces the lower case 12n in the thickness direction of the case 12.
  • FIG. 3 is a plan view of the multilayer substrate in FIG. 2 viewed from the first surface side.
  • FIG. 4 is a plan view of the multilayer substrate in FIG. 2 viewed from the second surface side.
  • FIG. 5 is a block diagram of a circuit module constituted by the receptacle in FIG.
  • the receptacle 10 further includes a DC / DC converter 50 and a high-frequency signal transmission unit 60.
  • the DC / DC converter 50 and the high-frequency signal transmission unit 60 are provided on the multilayer substrate 21.
  • the DC / DC converter 50 includes a choke coil 51, a load switch 52, a capacitor (Cbus) 53, a capacitor (Cin) 54, a main switch 55, an SR 56, and an SMPS (Switched Mode Power Supply) controller 57. Have. These components constituting the DC / DC converter 50 are provided on the first surface 21a.
  • the high-frequency signal transmission unit 60 has a MUXEQ 61.
  • the MUXEQ 61 is provided on the second surface 21b.
  • the receptacle 10 further includes a USB PD (Universal Serial Bus Power Delivery) controller 62 and a connector 63.
  • the USBPD controller 62 and the connector 63 are provided on the second surface 21b.
  • the receptacle 10 satisfies the USB PD standard.
  • the USB PD standard (1) It is possible to supply power up to 100W with a USB cable, (2) the roles of power and USB data sender and receiver can be switched (roll swap), and (3) DisplayPort And HDMI (registered trademark), which have three characteristics such that a signal of a communication standard that cannot be communicated by conventional USB can be transmitted via a USB cable.
  • the USBPD controller 62 is a control circuit that takes over communication processing between devices when devices compliant with the USB PD standard are connected.
  • the receptacle 10 has terminals for transmitting and receiving signals Vin, I2C, Tx1, Tx2, Rx1, Rx2, DP, SBU, Vbus, CC, GND, Tx1, Tx2, Rx1, Rx2, SBU, D +, D- Yes.
  • the terminals are arranged symmetrically so that communication and power transmission are possible even when the plug 70 is inserted into the receptacle 10 upside down.
  • the MUXEQ 61 has a function (multiplexer) for detecting the insertion direction and connecting the terminal of the plug 70 to the internal circuit by connection according to the direction, and an equalizer function for lifting the high-frequency component of the signal on the receiving side.
  • the multilayer substrate 21 has a rectangular planar view as a whole.
  • the multilayer substrate 21 has a tongue portion 22, a first protrusion portion 25, and a second protrusion portion 28 as constituent parts thereof.
  • the tongue 22 is located at the periphery when the multilayer substrate 21 is viewed in plan.
  • the tongue 22 is located on the periphery of the first surface 21a and the second surface 21b of the multilayer substrate 21.
  • the tongue 22 is located at the end of the rectangular shape of the multilayer substrate 21 in plan view.
  • the first protrusion 25 and the second protrusion 28 are located on both sides of the tongue 22.
  • the tongue 22 and the first protrusion 25 are separated via the first notch 26.
  • the tongue 22 and the second protrusion 28 are separated via the second notch 29.
  • the tongue 22, the first protrusion 25, and the second protrusion 28 have a shape that protrudes in one direction.
  • the tongue 22 has a tongue shape between the first protrusion 25 and the second protrusion 28.
  • the first cutout portion 26 and the second cutout portion 29 have a slit shape in which the protruding direction of the tongue portion 22, the first protrusion portion 25, and the second protrusion portion 28 is the longitudinal direction.
  • the first protrusion 25, the first notch 26, the tongue 22, the second notch 29, and the second protrusion 28 are arranged along one side of the rectangular shape of the multilayer substrate 21 in plan view.
  • the DC / DC converter 50 is provided on the first surface 21 a of the multilayer substrate 21 excluding the first protrusion 25, the tongue 22, and the second protrusion 28.
  • the choke coil 51, the load switch 52 and the capacitor (Cbus) 53 are provided in a region on the first surface 21 a relatively far from the first protrusion 25, the tongue 22 and the second protrusion 28, and the capacitor (Cin) 54, the main switch 55, SR 56, and the SMPS controller 57 are provided in a region on the first surface 21 a that is relatively close to the first protrusion 25, the tongue 22, and the second protrusion 28.
  • the high-frequency signal transmission unit 60, the USBPD controller 62, and the connector 63 are provided on the second surface 21b of the multilayer substrate 21 excluding the first protrusion 25, the tongue 22, and the second protrusion 28.
  • a screw insertion hole 27 is formed in the first protrusion 25 and the second protrusion 28.
  • the screw insertion hole 27 is a through hole that penetrates the multilayer substrate 21 in the thickness direction.
  • FIG. 6 is a cross-sectional view showing the multilayer substrate in FIG. Referring to FIGS. 3 to 6, a signal pattern and a GND (ground) pattern are provided inside multilayer substrate 21.
  • the receptacle 10 further includes an electrode group 24 and a ground electrode 23.
  • the electrode group 24 and the ground electrode 23 are provided on the tongue 22.
  • the electrode group 24 and the ground electrode 23 are provided on both surfaces of the first surface 21a and the second surface 21b.
  • the electrode group 24 is connected to a signal pattern inside the multilayer substrate 21.
  • the ground electrode 23 is connected to the GND pattern inside the multilayer substrate 21.
  • the electrode group 24 includes a plurality of electrodes (more specifically, eight signal electrodes and two power electrodes) and a ground electrode provided at both ends and extending so as to surround the electrode group). It is configured.
  • the electrode group 24 is provided on the distal end side of the tongue 22.
  • the ground electrode 23 is provided on the proximal end side of the tongue 22.
  • the ground electrode 23 is provided so as to surround the electrode group 24 from three directions excluding the tip side of the tongue portion 22.
  • receptacle 10 further includes a resin portion 31 and a heat dissipation sheet 32.
  • the resin part 31 is provided on the first surface 21a.
  • the resin part 31 is provided so as to cover the DC / DC converter 50.
  • the heat radiation sheet 32 is interposed between the case 12 (more specifically, the upper case 12 m) and the resin portion 31.
  • the receptacle 10 further includes a base substrate 33.
  • the base substrate 33 is disposed between the multilayer substrate 21 and the case 12 (more specifically, the lower case 12n).
  • the base substrate 33 is disposed in parallel with the multilayer substrate 21.
  • the base substrate 33 is provided to face the second surface 21 b of the multilayer substrate 21.
  • the base substrate 33 is electrically connected to the multilayer substrate 21 via the connector 63.
  • FIG. 7 is an exploded view showing the cover and multilayer substrate in FIG.
  • FIG. 8 is a top view showing the cover and the multilayer substrate in FIG.
  • FIG. 7 shows a form in which the cover 41 and the multilayer substrate 21 in FIG. 2 are viewed from the second surface 21b side of the multilayer substrate 21.
  • the cover 41 in FIG. 2 is represented by a two-dot chain line.
  • cover 41 has shell portion 42.
  • the shell part 42 has a cylindrical shape.
  • the shell portion 42 extends in a cylindrical shape along the direction indicated by the arrow 121 in FIG.
  • the shell portion 42 has a flat shape that is perpendicular to the insertion / extraction direction of the plug 70 and has a small thickness in the direction indicated by the arrow 122 in FIG.
  • the shell part 42 forms the insertion port 14 at one end 42j extending in a cylindrical shape. Inside the shell part 42, the tongue part 22 of the multilayer substrate 21 is inserted. The tongue portion 22 is inserted from the other end 42k side of the shell portion 42 opposite to the one end 42j. The shell portion 42 is disposed so as to surround the tongue portion 22. In other words, the tongue portion 22 is disposed inside the shell portion 42.
  • the shell portion 42 is passed through the first cutout portion 26 between the tongue portion 22 and the first protrusion 25.
  • the shell portion 42 is passed through the second notch portion 29 between the tongue portion 22 and the second protrusion 28.
  • the first protrusion 25 and the second protrusion 28 are disposed outside the shell part 42.
  • FIG. 9 is a cross-sectional view showing the cover and the multilayer substrate as seen from the direction of the arrow on the line IX-IX in FIG.
  • FIG. 10 is a cross-sectional view showing a connection step between the cover and the multilayer substrate in FIG.
  • the cover 41 further includes a first folded portion 81 and a second folded portion 86.
  • the first folded portion 81 and the second folded portion 86 are provided integrally with the shell portion 42.
  • the first folded portion 81 and the second folded portion 86 are configured by bending a metal plate that constitutes the shell portion 42.
  • the first folded portion 81 is provided facing the first surface 21 a of the multilayer substrate 21.
  • the first folded portion 81 has a folded shape that is folded from the shell portion 42 so as to approach the first surface 21 a of the multilayer substrate 21. More specifically, the first folded portion 81 has a folded shape that is folded back in a substantially U shape from the end portion on the other end 42 k side of the shell portion 42 and extends toward the one end 42 j side of the shell portion 42.
  • the second folded portion 86 is provided to face the first folded portion 81 with the multilayer substrate 21 interposed therebetween.
  • the second folded portion 86 is provided facing the second surface 21 b of the multilayer substrate 21.
  • the second folded portion 86 has a folded shape that is folded from the shell portion 42 so as to approach the second surface 21 b of the multilayer substrate 21. More specifically, the second folded portion 86 has a folded shape that is folded back in a substantially U shape from the other end 42 k side end of the shell portion 42 and extends toward the one end 42 j side of the shell portion 42.
  • the second folded portion 86 has a symmetrical shape with the first folded portion 81 across the multilayer substrate 21.
  • the first folded portion 81 and the second folded portion 86 are configured to be elastically deformable. That is, the first folded portion 81 and the second folded portion 86 have spring properties. The first folded portion 81 and the second folded portion 86 are configured to be elastically deformable in directions away from each other (the direction indicated by the arrow 122 in FIG. 7).
  • the tongue portion 22 is disposed between the first folded portion 81 and the second folded portion 86 while elastically deforming the first folded portion 81 and the second folded portion 86 away from each other.
  • a biasing force that biases the first surface 21 a acts on the tongue 22 from the first folded portion 81
  • the second surface 21 b is biased on the tongue 22 from the second folded portion 86.
  • the urging force to act acts.
  • the tongue portion 22 is sandwiched between the first folded portion 81 and the second folded portion 86.
  • the assembly of the cover 41 and the multilayer substrate 21 to the case 12 can be easily performed while maintaining the state in which the tongue portion 22 is disposed inside the shell portion 42. it can.
  • the first folded portion 81 and the second folded portion 86 are provided integrally with the shell portion 42, the multilayer substrate 21 can be held on the shell portion 42 with a simple configuration.
  • the first folded portion 81 is electrically connected to the ground electrode 23 on the first surface 21a.
  • the first folded portion 81 is in contact with the ground electrode 23 on the first surface 21a.
  • the second folded portion 86 is electrically connected to the ground electrode 23 on the second surface 21b.
  • the second folded portion 86 is in contact with the ground electrode 23 on the second surface 21b.
  • the electrode group 24 on the first surface 21 a and the electrode group 24 on the second surface 21 b are surrounded by the shell portion 42.
  • the shell portion 42 is set to the ground potential.
  • the electromagnetic shield surrounding the electrode group 24 can be realized with a simple configuration.
  • the shell portion 42 alone in which the thickness between the ground electrode 23 on the first surface 21 a and the ground electrode 23 on the second surface 21 b is L1 and the tongue portion 22 is not inserted.
  • the shortest length between the first folded portion 81 and the second folded portion 86 is L2
  • the relationship of L1> L2 is satisfied.
  • the holding state of the multilayer substrate 21 by the first folded portion 81 and the second folded portion 86 can be obtained more reliably.
  • the first folded part 81 is reversed from the shell part 42 into a substantially U shape, and then is opposed to the first folded part 81 and the second folded part 86 (in the direction of the arrow 122 in FIG. 7). In the direction shown), the shell portion 42 extends toward the one end 42j side while approaching the second folded portion 86.
  • the second folded part 86 is reversed from the shell part 42 into a substantially U shape, and then is opposed to the first folded part 81 and the second folded part 86 (in the direction of the arrow 122 in FIG. 7). In the direction shown), the shell portion 42 extends toward the one end 42j while approaching the first folded portion 81.
  • first folded portion 81 and the second folded portion 86 are not limited to the shapes shown in FIGS. 9 and 10.
  • the first folded portion 81 and the second folded portion 86 may have a folded shape that is inverted while forming a corner from the end of the shell portion 42 on the other end 42k side.
  • FIG. 11 is a cross-sectional view showing a state in which a plug is connected to the receptacle in FIG. 12 is a cross-sectional view showing a step of connecting a plug to the receptacle in FIG.
  • the plug 70 includes an exterior body 71, a first contact 72, and a second contact 73.
  • the exterior body 71 has a cylindrical shape.
  • the exterior body 71 has an opening 71d that opens in one direction.
  • the first contact 72 and the second contact 73 are accommodated in the exterior body 71.
  • the 1st contact 72 is provided corresponding to a plurality of electrodes which constitute electrode group 24 on the 1st surface 21a and the 2nd surface 21b.
  • the second contact 73 is provided corresponding to the ground electrode 23 on the first surface 21a and the second surface 21b.
  • the first contact 72 is provided on the back side of the second contact 73, and the second contact 73 is provided on the near side of the first contact 72.
  • the first contact 72 and the second contact 73 are configured to be elastically deformable. When the plug 70 is connected to the receptacle 10, the first contact 72 and the second contact 73 apply a biasing force to the first surface 21 a and the second surface 21 b of the multilayer substrate 21.
  • the exterior body 71 enters the inside of the shell portion 42 through the insertion port 14, and the multilayer substrate 21 (more specifically, the tongue portion 22) passes through the opening 71 d. Enter inside 71.
  • the first contact 72 contacts the electrode group 24, the first contact 72 and the electrode group 24 are electrically connected.
  • the second contact 73 is superimposed on the ground electrode 23 via the first folded portion 81 and the second folded portion 86, whereby the second contact 73 and the ground electrode 23 are electrically connected.
  • first folded portion 81 and the second folded portion 86 of the shell portion 42 are grounded by the ground electrode 23 across the second contact 73 (ground spring portion) inside the plug 70, the plug 70 and the cable are also shielded.
  • the first folded portion 81 and the second folded portion 86 of the shell portion 42 also function as an EMC pad for shielding the plug 70 and the cable.
  • cover 41 further includes an extending portion 43.
  • the extending portion 43 is integrated with the shell portion 42, for example, by welding.
  • the extending portion 43 is provided so as to extend from the shell portion 42 to both sides thereof.
  • the extending portion 43 extends from the shell portion 42 in the direction indicated by the arrow 123 that is orthogonal to both the direction indicated by the arrow 121 and the direction indicated by the arrow 122 in FIG.
  • the extending portion 43 has a plate shape parallel to the multilayer substrate 21 on both sides of the shell portion 42.
  • a screw insertion hole 46 is formed in the extending portion 43.
  • the screw insertion hole 46 is a through hole that penetrates the extending portion 43.
  • the first protrusion 25 and the second protrusion 28 are superimposed on the case 12 (more specifically, the lower case 12n). Further, the extending portion 43 is overlapped in a plane with respect to the first protrusion 25 and the second protrusion 28. The extending portion 43 is in surface contact with the first surface 21 a of the first protrusion 25 and the second protrusion 28. At this time, the screw insertion hole 46 formed in the extending portion 43 and the screw insertion hole 27 formed in the multilayer substrate 21 overlap.
  • the receptacle 10 further has a screw 36.
  • the screw 36 is made of metal.
  • the screw 36 is inserted into the screw insertion hole 46 and the screw insertion hole 27 from the first surface 21a side of the multilayer substrate 21 and is screwed into the case 12 (more specifically, the lower case 12n).
  • the multilayer substrate 21 is fixed to the case 12 by the screws 36.
  • the cover 41 (extending portion 43) is fixed to the case 12 together with the multilayer substrate 21 by screws 36.
  • the present invention is not limited thereto, and, for example, a clip or a bolt may be used.
  • a receptacle structure is assumed in which a pin member corresponding to the electrode group 24 is disposed in the shell, and the pin member is fixed to the substrate using solder.
  • the solder portion since stress is repeatedly applied to the solder portion as the plug is inserted and removed, the solder portion may be damaged.
  • the electrode group 24 is provided on the tongue portion 22 of the multilayer substrate 21 and the plug 70 is inserted into and removed from the tongue portion 22.
  • High durability for example, durability against 10,000 or more insertions / removals
  • the case 12 can be reduced in thickness.
  • the multilayer substrate 21 since the multilayer substrate 21 is fixed to the case 12 by the screw 36, the multilayer substrate 21 receives the stress accompanying the insertion / extraction of the plug integrally with the case 12. Thereby, higher durability can be exhibited with respect to the insertion and removal of the plug 70. Further, since the screw 36 for fixing the multilayer substrate 21 to the case 12 is provided adjacent to the tongue portion 22 into which the plug 70 is inserted and removed, durability against the insertion and removal of the plug 70 can be further enhanced.
  • the cover 41 further includes a shield part 44.
  • the shield part 44 is integrated with the shell part 42, for example, by welding.
  • the shield part 44 is provided so as to cover the circuit components mounted on the multilayer substrate 21.
  • the shield part 44 has a bottom part 44p, a first side part 44q, and a second side part 44r as its constituent parts.
  • the bottom portion 44p is disposed to face the first surface 21a of the multilayer substrate 21.
  • the bottom portion 44p continues from the other end 42k of the shell portion 42.
  • the bottom 44p is in contact with the heat dissipation sheet 32.
  • the first side portion 44q and the second side portion 44r rise from both ends of the bottom portion 44p and extend to the second surface 21b of the multilayer substrate 21.
  • the first side portion 44q and the second side portion 44r are provided to face each other in the direction indicated by the arrow 123 in FIG.
  • the shield portion 44 is provided on the first surface 21a of the multilayer substrate 21 so as to cover the Cin 54, the main switch 55, the SR 56, and the SMPS controller 57 among the components of the DC / DC converter 50.
  • the electromagnetic shield of the DC / DC converter 50 can be realized with a simple configuration.
  • the structure of the receptacle 10 according to the embodiment of the present invention described above will be described together.
  • the receptacle 10 according to the present embodiment is configured so that the plug 70 can be inserted and removed.
  • the receptacle 10 includes a multilayer substrate 21.
  • the multilayer substrate 21 has a tongue 22 located on the periphery when the multilayer substrate 21 is viewed in plan.
  • the receptacle 10 includes an electrode group 24 provided on both surfaces of the multilayer substrate 21 in the tongue portion 22, and a metal cover 41 connected to the multilayer substrate 21.
  • the cover 41 has a shell portion 42 disposed so as to surround the tongue portion 22, and a folded shape that is folded back from the shell portion 42 so as to approach the first surface 21 a as one surface of the multilayer substrate 21, and is elastically deformed.
  • a first folded portion 81 that can be configured, and a folded shape that is provided to face the first folded portion 81 and is folded back so as to approach the second surface 21 b as the other surface of the multilayer substrate 21 from the shell portion 42.
  • a second folded portion 86 configured to be elastically deformable.
  • the tongue portion 22 is disposed between the first folded portion 81 and the second folded portion 86 while elastically deforming the first folded portion 81 and the second folded portion 86 in directions away from each other.
  • the receptacle 10 configured as described above, it is possible to realize a receptacle that exhibits a high durability against plug insertion / extraction while having a simple configuration.
  • the receptacle according to the present invention is a receptacle configured so that a plug can be inserted and removed.
  • the receptacle includes a multilayer substrate.
  • the multilayer substrate has a tongue portion located at the periphery when the multilayer substrate is viewed in plan.
  • the receptacle includes an electrode group provided on both surfaces of the multilayer substrate at the tongue, and a metal cover connected to the multilayer substrate.
  • the cover has a shell portion disposed so as to surround the tongue portion, a first folded portion configured to be elastically deformable, having a folded shape that is folded from the shell portion so as to approach one surface of the multilayer substrate, A second folded portion is provided opposite to the first folded portion, has a folded shape that is folded back from the shell portion so as to approach the other surface of the multilayer substrate, and is configured to be elastically deformable.
  • the tongue portion is disposed between the first folded portion and the second folded portion while elastically deforming the first folded portion and the second folded portion in a direction away from each other.
  • the receptacle is a general term for a connector on an electronic device side that is electrically connected to a plug and a cable connected to the plug.
  • the first cover portion and the second return portion that can be elastically deformed are provided on the metal cover, thereby allowing the tongue portion to be held inside the shell portion with a simple configuration. can do.
  • the electrode group used as an electrical contact with a plug is provided in the tongue part of the multilayer board
  • the receptacle further includes a ground terminal provided on the multilayer substrate at the tongue. At least one of the first folded portion and the second folded portion is electrically connected to the ground terminal.
  • the receptacle further includes a plurality of ground terminals provided on the multilayer substrate at the tongue. The first folded portion and the second folded portion are electrically connected to a plurality of ground terminals.
  • the shell portion can function as an electromagnetic shield with a simple configuration.
  • the receptacle further includes a base member that supports the multilayer substrate and a fixing member that fixes the multilayer substrate to the base member.
  • the multilayer substrate is integrated with the base member and receives stress accompanying insertion and removal of the plug. Thereby, higher durability can be exhibited with respect to plug insertion / extraction.
  • the fixing members are provided on both sides of the tongue when the multilayer substrate is viewed in plan.
  • the fixing member is provided in the vicinity of the tongue portion into which the plug is inserted / extracted, whereby higher durability against plug insertion / extraction can be exhibited.
  • the cover further includes an extending portion that extends from the shell portion and is planarly superimposed on the multilayer substrate.
  • the extending portion is fixed to the base member together with the multilayer substrate by a fixing member.
  • the shell portion can be fixed to the base member with a simple configuration.
  • the receptacle further includes a DC / DC converter having an inductor, a capacitor, and a switching element and provided on the multilayer substrate.
  • a DC / DC converter having an inductor, a capacitor, and a switching element and provided on the multilayer substrate.
  • a circuit module including a DC / DC converter can be configured with a simple configuration.
  • This invention is applied to a receptacle of a USB connector, for example.

Landscapes

  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

This receptacle is provided with: a multilayer substrate (21) having a tongue part (22); an electrode group (24) provided to both surfaces of the multilayer substrate (21) in the tongue part (22); and a metal cover (41) connected to the multilayer substrate (21). The cover (41) is provided with: a shell part (42); a first folded-back part (81) which has a folded-back shape obtained as a result of being folded back from the shell part (42) towards a first surface (21a) of the multilayer substrate (21), and which is formed so as to be capable of elastic deformation; and a second folded-back part (86) which has a folded-back shape obtained as a result of being folded back from the shell part (42) towards a second surface (21b) of the multilayer substrate (21), and which is formed so as to be capable of elastic deformation. The tongue part (22) is disposed between the first folded-back part (81) and the second folded-back part (86), and causes the first folded-back part (81) and the second folded-back part (86) to elastically deform in directions heading away from each other.

Description

レセプタクルReceptacle
　この発明は、レセプタクルに関する。 This invention relates to a receptacle.
　従来のレセプタクルに関して、たとえば、特開２０１６－１０００８２号公報には、コンタクトをコネクタ内の所定の位置に保持する保持力を向上させることを目的とした、コネクタが開示されている（特許文献１）。 Regarding a conventional receptacle, for example, Japanese Patent Laying-Open No. 2016-100082 discloses a connector for the purpose of improving a holding force for holding a contact at a predetermined position in the connector (Patent Document 1). .
　特許文献１に開示されたコネクタは、上段コンタクト群と、下段コンタクト群と、上段コンタクト群および下段コンタクト群が、相手コネクタの嵌合方向の前方に向けて圧入される本体成形部品と、上段コンタクト群とインサートモールド成形によって一体化された上段コンタクトインサート部品とを備える。上段コンタクトインサート部品は、相手コネクタが嵌合される際に下段コンタクト群の移動を規制するように設けられている。 The connector disclosed in Patent Document 1 includes an upper contact group, a lower contact group, a main body molded part in which the upper contact group and the lower contact group are press-fitted forward in the mating direction of the mating connector, and an upper contact And an upper contact insert part integrated by insert molding. The upper contact insert part is provided so as to restrict the movement of the lower contact group when the mating connector is fitted.
特開２０１６－１０００８２号公報Japanese Unexamined Patent Publication No. 2016-100082
　上述の特許文献１に開示されるように、プラグを挿抜可能に構成されたレセプタクルが知られている。このようなレセプタクルにおいては、簡易な構成を備えつつ、繰り返し行われるプラグの挿抜に対して高い耐久性を発揮することが要求される。 As disclosed in Patent Document 1 described above, a receptacle configured to be capable of inserting and removing a plug is known. Such a receptacle is required to exhibit high durability against repeated plug insertion and removal while having a simple configuration.
　そこでこの発明の目的は、上記の課題を解決することであり、簡易な構成を備えつつ、プラグの挿抜に対して高い耐久性を発揮するレセプタクルを提供することである。 Therefore, an object of the present invention is to solve the above-described problems, and to provide a receptacle that exhibits a high durability against plug insertion and removal while having a simple configuration.
　この発明に従ったレセプタクルは、プラグを挿抜可能に構成されるレセプタクルである。レセプタクルは、多層基板を備える。多層基板は、多層基板を平面視した場合の周縁に位置する舌部を有する。レセプタクルは、舌部において多層基板の両面に設けられる電極群と、多層基板に接続される金属製のカバーとを備える。カバーは、舌部を取り囲むように配置されるシェル部と、シェル部から多層基板の一方の面に近づくように折り返される折り返し形状を有し、弾性変形可能に構成される第１折り返し部と、第１折り返し部と対向して設けられ、シェル部から多層基板の他方の面に近づくように折り返される折り返し形状を有し、弾性変形可能に構成される第２折り返し部とを有する。舌部は、第１折り返し部および第２折り返し部を互いに離れる方向に弾性変形させつつ、第１折り返し部および第２折り返し部の間に配置されている。 The receptacle according to the present invention is a receptacle configured so that a plug can be inserted and removed. The receptacle includes a multilayer substrate. The multilayer substrate has a tongue portion located at the periphery when the multilayer substrate is viewed in plan. The receptacle includes a group of electrodes provided on both surfaces of the multilayer substrate at the tongue, and a metal cover connected to the multilayer substrate. The cover has a shell portion disposed so as to surround the tongue portion, a first folded portion configured to be elastically deformable, having a folded shape that is folded from the shell portion so as to approach one surface of the multilayer substrate, A second folded portion is provided opposite to the first folded portion, has a folded shape that is folded back from the shell portion so as to approach the other surface of the multilayer substrate, and is configured to be elastically deformable. The tongue portion is disposed between the first folded portion and the second folded portion while elastically deforming the first folded portion and the second folded portion in a direction away from each other.
　この発明に従えば、簡易な構成を備えつつ、プラグの挿抜に対して高い耐久性を発揮するレセプタクルを提供することができる。 According to the present invention, it is possible to provide a receptacle that has a simple configuration and exhibits high durability against plug insertion / extraction.
この発明の実施の形態におけるレセプタクルの使用形態を示す斜視図である。It is a perspective view which shows the usage type of the receptacle in embodiment of this invention. 図１中のレセプタクルを示す断面図である。It is sectional drawing which shows the receptacle in FIG. 図２中の多層基板を第１面側から見た平面図である。It is the top view which looked at the multilayer substrate in FIG. 2 from the 1st surface side. 図２中の多層基板を第２面側から見た平面図である。It is the top view which looked at the multilayer substrate in FIG. 2 from the 2nd surface side. 図１中のレセプタクルにより構成される回路モジュールのブロック図である。It is a block diagram of the circuit module comprised by the receptacle in FIG. 図２中の多層基板を示す断面図である。It is sectional drawing which shows the multilayer board | substrate in FIG. 図２中のカバーおよび多層基板を示す分解組み立て図である。FIG. 3 is an exploded view illustrating a cover and a multilayer substrate in FIG. 2. 図２中のカバーおよび多層基板を示す上面図である。It is a top view which shows the cover and multilayer substrate in FIG. 図８中のＩＸ－ＩＸ線上の矢視方向から見たカバーおよび多層基板を示す断面図である。FIG. 9 is a cross-sectional view showing the cover and the multilayer substrate as seen from the direction of the arrow on the line IX-IX in FIG. 図９中のカバーおよび多層基板の接続工程を示す断面図である。It is sectional drawing which shows the connection process of the cover in FIG. 9, and a multilayer substrate. 図９中のレセプタクルにプラグを接続した状態を示す断面図である。FIG. 10 is a cross-sectional view showing a state in which a plug is connected to the receptacle in FIG. 9. 図９中のレセプタクルにプラグを接続する工程を示す断面図である。FIG. 10 is a cross-sectional view showing a step of connecting a plug to the receptacle in FIG. 9.
　この発明の実施の形態について、図面を参照して説明する。なお、以下で参照する図面では、同一またはそれに相当する部材には、同じ番号が付されている。 Embodiments of the present invention will be described with reference to the drawings. In the drawings referred to below, the same or corresponding members are denoted by the same reference numerals.
　図１は、この発明の実施の形態におけるレセプタクルの使用形態を示す斜視図である。図２は、図１中のレセプタクルを示す断面図である。図１および図２を参照して、レセプタクル１０は、プラグ７０を挿抜可能なように構成されている。 FIG. 1 is a perspective view showing a usage pattern of a receptacle according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing the receptacle in FIG. Referring to FIGS. 1 and 2, receptacle 10 is configured so that plug 70 can be inserted and removed.
　レセプタクル１０およびプラグ７０は、電子機器において、信号および電力の少なくともいずれか一方を授受するためのコネクタを構成している。本実施の形態では、代表的な例として、レセプタクル１０およびプラグ７０が、ＵＳＢタイプＣのコネクタを構成している。レセプタクル１０は、たとえば、携帯電話機やパーソナルコンピューターに搭載されている。 The receptacle 10 and the plug 70 constitute a connector for transmitting and receiving at least one of a signal and power in an electronic device. In the present embodiment, as a typical example, the receptacle 10 and the plug 70 constitute a USB type C connector. The receptacle 10 is mounted on, for example, a mobile phone or a personal computer.
　まず、レセプタクル１０の全体構造について説明する。レセプタクル１０は、カバー４１と、ケース１２（ベース部材）と、多層基板２１とを有する。カバー４１は、金属から形成されている。カバー４１は、プラグ７０をレセプタクル１０に挿入する際の挿入口１４を形成している。カバー４１および多層基板２１は、ケース１２に収容されている。 First, the overall structure of the receptacle 10 will be described. The receptacle 10 includes a cover 41, a case 12 (base member), and a multilayer substrate 21. The cover 41 is made of metal. The cover 41 forms an insertion port 14 when the plug 70 is inserted into the receptacle 10. The cover 41 and the multilayer substrate 21 are accommodated in the case 12.
　ケース１２は、レセプタクル１０を搭載する機器の外観をなしている。ケース１２は、薄板形状を有する。ケース１２は、上ケース１２ｍおよび下ケース１２ｎが組み合わさって構成されている。上ケース１２ｍおよび下ケース１２ｎの組み合わせ方向は、ケース１２の厚み方向である。ケース１２には、カバー４１による挿入口１４を露出させるように開口部１３が設けられている。開口部１３は、上ケース１２ｍおよび下ケース１２ｎの境界部分に設けられている。 The case 12 has the appearance of a device on which the receptacle 10 is mounted. The case 12 has a thin plate shape. The case 12 is configured by combining an upper case 12m and a lower case 12n. The combination direction of the upper case 12m and the lower case 12n is the thickness direction of the case 12. The case 12 is provided with an opening 13 so as to expose the insertion opening 14 formed by the cover 41. The opening 13 is provided at the boundary between the upper case 12m and the lower case 12n.
　カバー４１は、多層基板２１に接続されている。多層基板２１は、ケース１２の厚み方向に直交する面内に配置されている。多層基板２１は、ケース１２（より具体的には、下ケース１２ｎ）により支持されている。多層基板２１は、後述するねじ３６（固定部材）によって、ケース１２に固定されている。 The cover 41 is connected to the multilayer substrate 21. The multilayer substrate 21 is disposed in a plane orthogonal to the thickness direction of the case 12. The multilayer substrate 21 is supported by the case 12 (more specifically, the lower case 12n). The multilayer substrate 21 is fixed to the case 12 by screws 36 (fixing members) described later.
　多層基板２１は、第１表面２１ａと、第１表面２１ａの裏側に配置される第２表面２１ｂとを有する。第１表面２１ａは、ケース１２の厚み方向において、上ケース１２ｍと対向している。第２表面２１ｂは、ケース１２の厚み方向において、下ケース１２ｎと対向している。 The multilayer substrate 21 has a first surface 21a and a second surface 21b disposed on the back side of the first surface 21a. The first surface 21 a faces the upper case 12 m in the thickness direction of the case 12. The second surface 21b faces the lower case 12n in the thickness direction of the case 12.
　図３は、図２中の多層基板を第１面側から見た平面図である。図４は、図２中の多層基板を第２面側から見た平面図である。図５は、図１中のレセプタクルにより構成される回路モジュールのブロック図である。 FIG. 3 is a plan view of the multilayer substrate in FIG. 2 viewed from the first surface side. FIG. 4 is a plan view of the multilayer substrate in FIG. 2 viewed from the second surface side. FIG. 5 is a block diagram of a circuit module constituted by the receptacle in FIG.
　図３から図５を参照して、レセプタクル１０は、ＤＣ／ＤＣコンバータ５０と、高周波信号伝送部６０とをさらに有する。ＤＣ／ＤＣコンバータ５０および高周波信号伝送部６０は、多層基板２１に設けられている。 3 to 5, the receptacle 10 further includes a DC / DC converter 50 and a high-frequency signal transmission unit 60. The DC / DC converter 50 and the high-frequency signal transmission unit 60 are provided on the multilayer substrate 21.
　ＤＣ／ＤＣコンバータ５０は、チョークコイル５１と、ロードスイッチ５２と、コンデンサ（Ｃｂｕｓ）５３と、コンデンサ（Ｃｉｎ）５４と、メインスイッチ５５と、ＳＲ５６と、ＳＭＰＳ（Switched　Mode　Power　Supply）コントローラ５７とを有する。ＤＣ／ＤＣコンバータ５０を構成するこれら部品は、第１表面２１ａに設けられている。 The DC / DC converter 50 includes a choke coil 51, a load switch 52, a capacitor (Cbus) 53, a capacitor (Cin) 54, a main switch 55, an SR 56, and an SMPS (Switched Mode Power Supply) controller 57. Have. These components constituting the DC / DC converter 50 are provided on the first surface 21a.
　高周波信号伝送部６０は、ＭＵＸＥＱ６１を有する。ＭＵＸＥＱ６１は、第２表面２１ｂに設けられている。 The high-frequency signal transmission unit 60 has a MUXEQ 61. The MUXEQ 61 is provided on the second surface 21b.
　レセプタクル１０は、ＵＳＢＰＤ（Universal　Serial　Bus　Power　Delivery）コントローラ６２と、コネクタ６３とをさらに有する。ＵＳＢＰＤコントローラ６２およびコネクタ６３は、第２表面２１ｂに設けられている。 The receptacle 10 further includes a USB PD (Universal Serial Bus Power Delivery) controller 62 and a connector 63. The USBPD controller 62 and the connector 63 are provided on the second surface 21b.
　レセプタクル１０は、ＵＳＢ　ＰＤ規格を満たすものである。ＵＳＢ　ＰＤ規格には、（１）ＵＳＢケーブルで最大１００Ｗの電力供給が可能になり、（２）電力とUSBデータの送り手と受け手の役割をそれぞれ入れ替え（ロール・スワップ）でき、（３）DisplayPortやHDMI（登録商標）といった従来ＵＳＢでは通信できなかった通信規格の信号をＵＳＢケーブル上で伝送可能になる、といった３つの特徴がある。 The receptacle 10 satisfies the USB PD standard. In the USB PD standard, (1) It is possible to supply power up to 100W with a USB cable, (2) the roles of power and USB data sender and receiver can be switched (roll swap), and (3) DisplayPort And HDMI (registered trademark), which have three characteristics such that a signal of a communication standard that cannot be communicated by conventional USB can be transmitted via a USB cable.
　ＵＳＢＰＤコントローラ６２は、ＵＳＢ　ＰＤ規格に準拠した機器同士がつながる際の、機器間の通信処理を引き受ける制御回路である。 The USBPD controller 62 is a control circuit that takes over communication processing between devices when devices compliant with the USB PD standard are connected.
　レセプタクル１０には、信号Ｖｉｎ、Ｉ２Ｃ、Ｔｘ１、Ｔｘ２、Ｒｘ１、Ｒｘ２、ＤＰ、ＳＢＵ、Ｖｂｕｓ、ＣＣ、ＧＮＤ、Ｔｘ１、Ｔｘ２、Ｒｘ１、Ｒｘ２、ＳＢＵ、Ｄ＋、Ｄ－を送受信する端子が配置されている。レセプタクル１０にプラグ７０が表裏逆に挿入されても通信や送電が可能なように、端子は、点対称に配置されている。ＭＵＸＥＱ６１は、挿入向きを検出し、プラグ７０の端子を向きに応じた接続で内部回路に接続する機能（マルチプレクサ）と、信号の高周波成分を受信側で持ち上げるイコライザ機能とを有する。 The receptacle 10 has terminals for transmitting and receiving signals Vin, I2C, Tx1, Tx2, Rx1, Rx2, DP, SBU, Vbus, CC, GND, Tx1, Tx2, Rx1, Rx2, SBU, D +, D- Yes. The terminals are arranged symmetrically so that communication and power transmission are possible even when the plug 70 is inserted into the receptacle 10 upside down. The MUXEQ 61 has a function (multiplexer) for detecting the insertion direction and connecting the terminal of the plug 70 to the internal circuit by connection according to the direction, and an equalizer function for lifting the high-frequency component of the signal on the receiving side.
　図３および図４を参照して、多層基板２１は、全体として、矩形形状の平面視を有する。多層基板２１は、その構成部位として、舌部２２と、第１突部２５と、第２突部２８とを有する。 3 and 4, the multilayer substrate 21 has a rectangular planar view as a whole. The multilayer substrate 21 has a tongue portion 22, a first protrusion portion 25, and a second protrusion portion 28 as constituent parts thereof.
　舌部２２は、多層基板２１を平面視した場合の周縁に位置する。舌部２２は、多層基板２１の第１表面２１ａおよび第２表面２１ｂの周縁に位置する。舌部２２は、多層基板２１の平面視における矩形形状の端部に位置する。 The tongue 22 is located at the periphery when the multilayer substrate 21 is viewed in plan. The tongue 22 is located on the periphery of the first surface 21a and the second surface 21b of the multilayer substrate 21. The tongue 22 is located at the end of the rectangular shape of the multilayer substrate 21 in plan view.
　第１突部２５および第２突部２８は、舌部２２を挟んでその両側に位置する。舌部２２および第１突部２５は、第１切り欠き部２６を介して離間している。舌部２２および第２突部２８は、第２切り欠き部２９を介して離間している。舌部２２、第１突部２５および第２突部２８は、一方向に向けて突出する形状を有する。舌部２２は、第１突部２５および第２突部２８の間で舌形状をなしている。 The first protrusion 25 and the second protrusion 28 are located on both sides of the tongue 22. The tongue 22 and the first protrusion 25 are separated via the first notch 26. The tongue 22 and the second protrusion 28 are separated via the second notch 29. The tongue 22, the first protrusion 25, and the second protrusion 28 have a shape that protrudes in one direction. The tongue 22 has a tongue shape between the first protrusion 25 and the second protrusion 28.
　第１切り欠き部２６および第２切り欠き部２９は、舌部２２、第１突部２５および第２突部２８の突出方向が長手方向となるスリット形状を有する。第１突部２５、第１切り欠き部２６、舌部２２、第２切り欠き部２９および第２突部２８は、多層基板２１の平面視における矩形形状の一辺に沿って並んでいる。 The first cutout portion 26 and the second cutout portion 29 have a slit shape in which the protruding direction of the tongue portion 22, the first protrusion portion 25, and the second protrusion portion 28 is the longitudinal direction. The first protrusion 25, the first notch 26, the tongue 22, the second notch 29, and the second protrusion 28 are arranged along one side of the rectangular shape of the multilayer substrate 21 in plan view.
　ＤＣ／ＤＣコンバータ５０は、第１突部２５、舌部２２および第２突部２８を除いた多層基板２１の第１表面２１ａ上に設けられている。チョークコイル５１、ロードスイッチ５２およびコンデンサ（Ｃｂｕｓ）５３は、第１突部２５、舌部２２および第２突部２８から相対的に遠い第１表面２１ａ上の領域に設けられ、コンデンサ（Ｃｉｎ）５４、メインスイッチ５５、ＳＲ５６およびＳＭＰＳコントローラ５７は、第１突部２５、舌部２２および第２突部２８に相対的に近い第１表面２１ａ上の領域に設けられている。 The DC / DC converter 50 is provided on the first surface 21 a of the multilayer substrate 21 excluding the first protrusion 25, the tongue 22, and the second protrusion 28. The choke coil 51, the load switch 52 and the capacitor (Cbus) 53 are provided in a region on the first surface 21 a relatively far from the first protrusion 25, the tongue 22 and the second protrusion 28, and the capacitor (Cin) 54, the main switch 55, SR 56, and the SMPS controller 57 are provided in a region on the first surface 21 a that is relatively close to the first protrusion 25, the tongue 22, and the second protrusion 28.
　高周波信号伝送部６０、ＵＳＢＰＤコントローラ６２およびコネクタ６３は、第１突部２５、舌部２２および第２突部２８を除いた多層基板２１の第２表面２１ｂ上に設けられている。 The high-frequency signal transmission unit 60, the USBPD controller 62, and the connector 63 are provided on the second surface 21b of the multilayer substrate 21 excluding the first protrusion 25, the tongue 22, and the second protrusion 28.
　第１突部２５および第２突部２８には、ねじ挿入孔２７が形成されている。ねじ挿入孔２７は、多層基板２１をその厚み方向に貫通する貫通孔である。 A screw insertion hole 27 is formed in the first protrusion 25 and the second protrusion 28. The screw insertion hole 27 is a through hole that penetrates the multilayer substrate 21 in the thickness direction.
　図６は、図２中の多層基板を示す断面図である。図３から図６を参照して、多層基板２１の内部には、信号パターンと、ＧＮＤ（グランド）パターンとが設けられている。 FIG. 6 is a cross-sectional view showing the multilayer substrate in FIG. Referring to FIGS. 3 to 6, a signal pattern and a GND (ground) pattern are provided inside multilayer substrate 21.
　レセプタクル１０は、電極群２４と、接地電極２３とをさらに有する。電極群２４および接地電極２３は、舌部２２に設けられている。電極群２４および接地電極２３は、第１表面２１ａおよび第２表面２１ｂの両面に設けられている。電極群２４は、多層基板２１の内部の信号パターンに接続されている。接地電極２３は、多層基板２１の内部のＧＮＤパターンに接続されている。 The receptacle 10 further includes an electrode group 24 and a ground electrode 23. The electrode group 24 and the ground electrode 23 are provided on the tongue 22. The electrode group 24 and the ground electrode 23 are provided on both surfaces of the first surface 21a and the second surface 21b. The electrode group 24 is connected to a signal pattern inside the multilayer substrate 21. The ground electrode 23 is connected to the GND pattern inside the multilayer substrate 21.
　電極群２４は、複数の電極（より具体的には、８本の信号用電極、２本の電力用電極）、および、両端に設けられて電極群を取り囲むように延伸された接地電極）から構成されている。電極群２４は、舌部２２の先端側に設けられている。接地電極２３は、舌部２２の基端側に設けられている。接地電極２３は、舌部２２の先端側を除く三方から電極群２４を取り囲むように設けられている。 The electrode group 24 includes a plurality of electrodes (more specifically, eight signal electrodes and two power electrodes) and a ground electrode provided at both ends and extending so as to surround the electrode group). It is configured. The electrode group 24 is provided on the distal end side of the tongue 22. The ground electrode 23 is provided on the proximal end side of the tongue 22. The ground electrode 23 is provided so as to surround the electrode group 24 from three directions excluding the tip side of the tongue portion 22.
　図２を参照して、レセプタクル１０は、樹脂部３１と、放熱シート３２とをさらに有する。樹脂部３１は、第１表面２１ａ上に設けられている。樹脂部３１は、ＤＣ／ＤＣコンバータ５０を覆うように設けられている。放熱シート３２は、ケース１２（より具体的には、上ケース１２ｍ）と、樹脂部３１との間に介挿されている。 Referring to FIG. 2, receptacle 10 further includes a resin portion 31 and a heat dissipation sheet 32. The resin part 31 is provided on the first surface 21a. The resin part 31 is provided so as to cover the DC / DC converter 50. The heat radiation sheet 32 is interposed between the case 12 (more specifically, the upper case 12 m) and the resin portion 31.
　レセプタクル１０は、ベース基板３３をさらに有する。ベース基板３３は、多層基板２１と、ケース１２（より具体的には、下ケース１２ｎ）との間に配置されている。ベース基板３３は、多層基板２１と平行に配置されている。ベース基板３３は、多層基板２１の第２表面２１ｂと対面して設けられている。ベース基板３３は、コネクタ６３を介して多層基板２１と電気的に接続されている。 The receptacle 10 further includes a base substrate 33. The base substrate 33 is disposed between the multilayer substrate 21 and the case 12 (more specifically, the lower case 12n). The base substrate 33 is disposed in parallel with the multilayer substrate 21. The base substrate 33 is provided to face the second surface 21 b of the multilayer substrate 21. The base substrate 33 is electrically connected to the multilayer substrate 21 via the connector 63.
　続いて、カバー４１の構造と、カバー４１および多層基板２１の接続構造とについて詳細に説明する。 Subsequently, the structure of the cover 41 and the connection structure of the cover 41 and the multilayer substrate 21 will be described in detail.
　図７は、図２中のカバーおよび多層基板を示す分解組み立て図である。図８は、図２中のカバーおよび多層基板を示す上面図である。 FIG. 7 is an exploded view showing the cover and multilayer substrate in FIG. FIG. 8 is a top view showing the cover and the multilayer substrate in FIG.
　なお、図７中では、図２中のカバー４１および多層基板２１を、多層基板２１の第２表面２１ｂ側から見た形態が示されている。図８中では、図２中のカバー４１が２点鎖線により表わされている。 7 shows a form in which the cover 41 and the multilayer substrate 21 in FIG. 2 are viewed from the second surface 21b side of the multilayer substrate 21. In FIG. 8, the cover 41 in FIG. 2 is represented by a two-dot chain line.
　図１、図２、図７および図８を参照して、カバー４１は、シェル部４２を有する。シェル部４２は、筒形状を有する。シェル部４２は、プラグ７０の挿抜方向となる図７中の矢印１２１に示す方向に沿って筒状に延びている。シェル部４２は、プラグ７０の挿抜方向に直交し、ケース１２の厚み方向となる図７中の矢印１２２に示す方向において小さい厚みとなる扁平形状を有する。 Referring to FIGS. 1, 2, 7 and 8, cover 41 has shell portion 42. The shell part 42 has a cylindrical shape. The shell portion 42 extends in a cylindrical shape along the direction indicated by the arrow 121 in FIG. The shell portion 42 has a flat shape that is perpendicular to the insertion / extraction direction of the plug 70 and has a small thickness in the direction indicated by the arrow 122 in FIG.
　シェル部４２は、その筒状に延びる一方端４２ｊにて挿入口１４を形成している。シェル部４２の内側には、多層基板２１の舌部２２が挿入されている。舌部２２は、一方端４２ｊとは反対側のシェル部４２の他方端４２ｋ側から挿入されている。シェル部４２は、舌部２２を取り囲むように配置されている。言い換えれば、舌部２２は、シェル部４２の内側に配置されている。 The shell part 42 forms the insertion port 14 at one end 42j extending in a cylindrical shape. Inside the shell part 42, the tongue part 22 of the multilayer substrate 21 is inserted. The tongue portion 22 is inserted from the other end 42k side of the shell portion 42 opposite to the one end 42j. The shell portion 42 is disposed so as to surround the tongue portion 22. In other words, the tongue portion 22 is disposed inside the shell portion 42.
　シェル部４２は、舌部２２および第１突部２５の間において、第１切り欠き部２６に通されている。シェル部４２は、舌部２２および第２突部２８の間において、第２切り欠き部２９に通されている。第１突部２５および第２突部２８は、シェル部４２の外側に配置されている。 The shell portion 42 is passed through the first cutout portion 26 between the tongue portion 22 and the first protrusion 25. The shell portion 42 is passed through the second notch portion 29 between the tongue portion 22 and the second protrusion 28. The first protrusion 25 and the second protrusion 28 are disposed outside the shell part 42.
　図９は、図８中のＩＸ－ＩＸ線上の矢視方向から見たカバーおよび多層基板を示す断面図である。図１０は、図９中のカバーおよび多層基板の接続工程を示す断面図である。 FIG. 9 is a cross-sectional view showing the cover and the multilayer substrate as seen from the direction of the arrow on the line IX-IX in FIG. FIG. 10 is a cross-sectional view showing a connection step between the cover and the multilayer substrate in FIG.
　図１、図２、図７から図１０を参照して、カバー４１は、第１折り返し部８１と、第２折り返し部８６とをさらに有する。第１折り返し部８１および第２折り返し部８６は、シェル部４２と一体に設けられている。第１折り返し部８１および第２折り返し部８６は、シェル部４２を構成する金属板を折り曲げ加工することによって構成されている。 Referring to FIGS. 1, 2, and 7 to 10, the cover 41 further includes a first folded portion 81 and a second folded portion 86. The first folded portion 81 and the second folded portion 86 are provided integrally with the shell portion 42. The first folded portion 81 and the second folded portion 86 are configured by bending a metal plate that constitutes the shell portion 42.
　第１折り返し部８１は、多層基板２１の第１表面２１ａに面して設けられている。第１折り返し部８１は、シェル部４２から、多層基板２１の第１表面２１ａに近づくように折り返される折り返し形状を有する。より具体的には、第１折り返し部８１は、シェル部４２の他方端４２ｋ側の端部から略Ｕ字状に折り返され、シェル部４２の一方端４２ｊ側に向けて延びる折り返し形状を有する。 The first folded portion 81 is provided facing the first surface 21 a of the multilayer substrate 21. The first folded portion 81 has a folded shape that is folded from the shell portion 42 so as to approach the first surface 21 a of the multilayer substrate 21. More specifically, the first folded portion 81 has a folded shape that is folded back in a substantially U shape from the end portion on the other end 42 k side of the shell portion 42 and extends toward the one end 42 j side of the shell portion 42.
　第２折り返し部８６は、多層基板２１を挟んで第１折り返し部８１と対向して設けられている。第２折り返し部８６は、多層基板２１の第２表面２１ｂに面して設けられている。第２折り返し部８６は、シェル部４２から、多層基板２１の第２表面２１ｂに近づくように折り返される折り返し形状を有する。より具体的には、第２折り返し部８６は、シェル部４２の他方端４２ｋ側の端部から略Ｕ字状に折り返され、シェル部４２の一方端４２ｊ側に向けて延びる折り返し形状を有する。第２折り返し部８６は、多層基板２１を挟んで第１折り返し部８１と対称形状を有する。 The second folded portion 86 is provided to face the first folded portion 81 with the multilayer substrate 21 interposed therebetween. The second folded portion 86 is provided facing the second surface 21 b of the multilayer substrate 21. The second folded portion 86 has a folded shape that is folded from the shell portion 42 so as to approach the second surface 21 b of the multilayer substrate 21. More specifically, the second folded portion 86 has a folded shape that is folded back in a substantially U shape from the other end 42 k side end of the shell portion 42 and extends toward the one end 42 j side of the shell portion 42. The second folded portion 86 has a symmetrical shape with the first folded portion 81 across the multilayer substrate 21.
　第１折り返し部８１および第２折り返し部８６は、弾性変形可能に構成されている。すなわち、第１折り返し部８１および第２折り返し部８６は、ばね性を有する。第１折り返し部８１および第２折り返し部８６は、互いに離れる方向（図７中の矢印１２２に示す方向）に弾性変形可能なように構成されている。 The first folded portion 81 and the second folded portion 86 are configured to be elastically deformable. That is, the first folded portion 81 and the second folded portion 86 have spring properties. The first folded portion 81 and the second folded portion 86 are configured to be elastically deformable in directions away from each other (the direction indicated by the arrow 122 in FIG. 7).
　舌部２２は、第１折り返し部８１および第２折り返し部８６を互いに離れる方向に弾性変形させつつ、第１折り返し部８１および第２折り返し部８６の間に配置されている。これにより、第１折り返し部８１から舌部２２に対して、第１表面２１ａを付勢する付勢力が作用し、第２折り返し部８６から舌部２２に対して、第２表面２１ｂを付勢する付勢力が作用する。舌部２２は、第１折り返し部８１および第２折り返し部８６によって挟持されている。 The tongue portion 22 is disposed between the first folded portion 81 and the second folded portion 86 while elastically deforming the first folded portion 81 and the second folded portion 86 away from each other. As a result, a biasing force that biases the first surface 21 a acts on the tongue 22 from the first folded portion 81, and the second surface 21 b is biased on the tongue 22 from the second folded portion 86. The urging force to act acts. The tongue portion 22 is sandwiched between the first folded portion 81 and the second folded portion 86.
　このような構成により、レセプタクル１０の組み立て工程時、シェル部４２の内側に舌部２２が配置された状態を保持して、ケース１２に対するカバー４１および多層基板２１の組み付け作業を容易に行なうことができる。この際、第１折り返し部８１および第２折り返し部８６はシェル部４２に一体に設けられているため、シェル部４２に対する多層基板２１の保持を簡易な構成により実現することができる。 With such a configuration, during the assembly process of the receptacle 10, the assembly of the cover 41 and the multilayer substrate 21 to the case 12 can be easily performed while maintaining the state in which the tongue portion 22 is disposed inside the shell portion 42. it can. At this time, since the first folded portion 81 and the second folded portion 86 are provided integrally with the shell portion 42, the multilayer substrate 21 can be held on the shell portion 42 with a simple configuration.
　第１折り返し部８１は、第１表面２１ａ上の接地電極２３に電気的に接続されている。第１折り返し部８１は、第１表面２１ａ上の接地電極２３に接触している。第２折り返し部８６は、第２表面２１ｂ上の接地電極２３に電気的に接続されている。第２折り返し部８６は、第２表面２１ｂ上の接地電極２３に接触している。第１表面２１ａ上の電極群２４および第２表面２１ｂ上の電極群２４は、シェル部４２によって取り囲まれている。 The first folded portion 81 is electrically connected to the ground electrode 23 on the first surface 21a. The first folded portion 81 is in contact with the ground electrode 23 on the first surface 21a. The second folded portion 86 is electrically connected to the ground electrode 23 on the second surface 21b. The second folded portion 86 is in contact with the ground electrode 23 on the second surface 21b. The electrode group 24 on the first surface 21 a and the electrode group 24 on the second surface 21 b are surrounded by the shell portion 42.
　このような構成により、シェル部４２が、接地電位とされている。これにより、電極群２４を取り囲む電磁シールドを簡易な構成で実現することができる。 With this configuration, the shell portion 42 is set to the ground potential. Thereby, the electromagnetic shield surrounding the electrode group 24 can be realized with a simple configuration.
　図１０中に示すように、第１表面２１ａ上の接地電極２３と、第２表面２１ｂ上の接地電極２３との間の厚みがＬ１であり、舌部２２が挿入されていないシェル部４２単体の状態において、第１折り返し部８１および第２折り返し部８６間の最短長さがＬ２である場合に、Ｌ１＞Ｌ２の関係を満たす。 As shown in FIG. 10, the shell portion 42 alone in which the thickness between the ground electrode 23 on the first surface 21 a and the ground electrode 23 on the second surface 21 b is L1 and the tongue portion 22 is not inserted. In this state, when the shortest length between the first folded portion 81 and the second folded portion 86 is L2, the relationship of L1> L2 is satisfied.
　このような構成により、第１折り返し部８１および第２折り返し部８６による多層基板２１の保持状態をより確実に得ることができる。 With such a configuration, the holding state of the multilayer substrate 21 by the first folded portion 81 and the second folded portion 86 can be obtained more reliably.
　シェル部４２単体の状態において、第１折り返し部８１は、シェル部４２から略Ｕ字状に反転したあと、第１折り返し部８１および第２折り返し部８６の対向方向（図７中の矢印１２２に示す方向）において第２折り返し部８６に近づきながら、シェル部４２の一方端４２ｊ側に向けて延びている。シェル部４２単体の状態において、第２折り返し部８６は、シェル部４２から略Ｕ字状に反転したあと、第１折り返し部８１および第２折り返し部８６の対向方向（図７中の矢印１２２に示す方向）において第１折り返し部８１に近づきながら、シェル部４２の一方端４２ｊ側に向けて延びている。 In the state of the shell part 42 alone, the first folded part 81 is reversed from the shell part 42 into a substantially U shape, and then is opposed to the first folded part 81 and the second folded part 86 (in the direction of the arrow 122 in FIG. 7). In the direction shown), the shell portion 42 extends toward the one end 42j side while approaching the second folded portion 86. In the state of the shell part 42 alone, the second folded part 86 is reversed from the shell part 42 into a substantially U shape, and then is opposed to the first folded part 81 and the second folded part 86 (in the direction of the arrow 122 in FIG. 7). In the direction shown), the shell portion 42 extends toward the one end 42j while approaching the first folded portion 81.
　このような構成により、レセプタクル１０の組み立て工程時、シェル部４２の内側に舌部２２を挿入する際の作業性を向上させることができる。 With such a configuration, it is possible to improve workability at the time of inserting the tongue portion 22 inside the shell portion 42 during the assembly process of the receptacle 10.
　なお、第１折り返し部８１および第２折り返し部８６は、図９および図１０中に示す形状に限られない。たとえば、第１折り返し部８１および第２折り返し部８６は、シェル部４２の他方端４２ｋ側の端部から角部をなしながら反転された折り返し形状を有してもよい。 Note that the first folded portion 81 and the second folded portion 86 are not limited to the shapes shown in FIGS. 9 and 10. For example, the first folded portion 81 and the second folded portion 86 may have a folded shape that is inverted while forming a corner from the end of the shell portion 42 on the other end 42k side.
　図１１は、図９中のレセプタクルにプラグを接続した状態を示す断面図である。図１２は、図９中のレセプタクルにプラグを接続する工程を示す断面図である。 FIG. 11 is a cross-sectional view showing a state in which a plug is connected to the receptacle in FIG. 12 is a cross-sectional view showing a step of connecting a plug to the receptacle in FIG.
　図１１および図１２を参照して、プラグ７０は、外装体７１と、第１コンタクト７２と、第２コンタクト７３とを有する。 11 and 12, the plug 70 includes an exterior body 71, a first contact 72, and a second contact 73.
　外装体７１は、筒形状を有する。外装体７１は、一方向を向いて開口する開口部７１ｄを有する。 The exterior body 71 has a cylindrical shape. The exterior body 71 has an opening 71d that opens in one direction.
　第１コンタクト７２および第２コンタクト７３は、外装体７１に収容されている。第１コンタクト７２は、第１表面２１ａおよび第２表面２１ｂ上の電極群２４を構成する複数の電極に対応して設けられている。第２コンタクト７３は、第１表面２１ａおよび第２表面２１ｂ上の接地電極２３に対応して設けられている。開口部７１ｄから見て、第１コンタクト７２は、第２コンタクト７３よりも奥側に設けられ、第２コンタクト７３は、第１コンタクト７２よりも手前側に設けられている。 The first contact 72 and the second contact 73 are accommodated in the exterior body 71. The 1st contact 72 is provided corresponding to a plurality of electrodes which constitute electrode group 24 on the 1st surface 21a and the 2nd surface 21b. The second contact 73 is provided corresponding to the ground electrode 23 on the first surface 21a and the second surface 21b. When viewed from the opening 71 d, the first contact 72 is provided on the back side of the second contact 73, and the second contact 73 is provided on the near side of the first contact 72.
　第１コンタクト７２および第２コンタクト７３は、弾性変形可能に構成されている。レセプタクル１０に対するプラグ７０の接続時、第１コンタクト７２および第２コンタクト７３は、多層基板２１の第１表面２１ａおよび第２表面２１ｂに対して付勢力を作用させる。 The first contact 72 and the second contact 73 are configured to be elastically deformable. When the plug 70 is connected to the receptacle 10, the first contact 72 and the second contact 73 apply a biasing force to the first surface 21 a and the second surface 21 b of the multilayer substrate 21.
　プラグ７０をレセプタクル１０に接続すると、外装体７１が、挿入口１４を通じてシェル部４２の内部に進入するとともに、多層基板２１（より具体的には、舌部２２）が、開口部７１ｄを通じて外装体７１の内部に進入する。このとき、第１コンタクト７２が電極群２４に接触することによって、第１コンタクト７２および電極群２４の間が導通される。また、第２コンタクト７３が、第１折り返し部８１および第２折り返し部８６を介して接地電極２３に重ね合わされることによって、第２コンタクト７３および接地電極２３の間が導通される。 When the plug 70 is connected to the receptacle 10, the exterior body 71 enters the inside of the shell portion 42 through the insertion port 14, and the multilayer substrate 21 (more specifically, the tongue portion 22) passes through the opening 71 d. Enter inside 71. At this time, when the first contact 72 contacts the electrode group 24, the first contact 72 and the electrode group 24 are electrically connected. Further, the second contact 73 is superimposed on the ground electrode 23 via the first folded portion 81 and the second folded portion 86, whereby the second contact 73 and the ground electrode 23 are electrically connected.
　シェル部４２の第１折り返し部８１および第２折り返し部８６が、プラグ７０内部の第２コンタクト７３（グランドばね部）を挟んで接地電極２３により接地されているため、プラグ７０およびケーブルもシールドされる。すなわち、シェル部４２の第１折り返し部８１および第２折り返し部８６が、プラグ７０およびケーブルをシールドするためのＥＭＣパッドとしても機能する。 Since the first folded portion 81 and the second folded portion 86 of the shell portion 42 are grounded by the ground electrode 23 across the second contact 73 (ground spring portion) inside the plug 70, the plug 70 and the cable are also shielded. The That is, the first folded portion 81 and the second folded portion 86 of the shell portion 42 also function as an EMC pad for shielding the plug 70 and the cable.
　引き続いて、カバー４１の構造と、多層基板２１の支持構造とについて説明する。図２、図７および図８を参照して、カバー４１は、延出部４３をさらに有する。 Subsequently, the structure of the cover 41 and the support structure of the multilayer substrate 21 will be described. With reference to FIGS. 2, 7, and 8, cover 41 further includes an extending portion 43.
　延出部４３は、たとえば溶接によって、シェル部４２と一体とされている。延出部４３は、シェル部４２からその両側に延出するように設けられている。延出部４３は、シェル部４２から、図７中の矢印１２１に示す方向および矢印１２２に示す方向の双方に直交する矢印１２３に示す方向に延出している。 The extending portion 43 is integrated with the shell portion 42, for example, by welding. The extending portion 43 is provided so as to extend from the shell portion 42 to both sides thereof. The extending portion 43 extends from the shell portion 42 in the direction indicated by the arrow 123 that is orthogonal to both the direction indicated by the arrow 121 and the direction indicated by the arrow 122 in FIG.
　延出部４３は、シェル部４２の両側において多層基板２１に平行な板形状を有する。延出部４３には、ねじ挿入孔４６が形成されている。ねじ挿入孔４６は、延出部４３を貫通する貫通孔である。 The extending portion 43 has a plate shape parallel to the multilayer substrate 21 on both sides of the shell portion 42. A screw insertion hole 46 is formed in the extending portion 43. The screw insertion hole 46 is a through hole that penetrates the extending portion 43.
　第１突部２５および第２突部２８が、ケース１２（より具体的には、下ケース１２ｎ）に重ね合わされている。さらにその第１突部２５および第２突部２８に対して、延出部４３が平面的に重ね合わされている。延出部４３は、第１突部２５および第２突部２８における第１表面２１ａに面接触している。このとき、延出部４３に形成されたねじ挿入孔４６と、多層基板２１に形成されたねじ挿入孔２７とが、重なっている。 The first protrusion 25 and the second protrusion 28 are superimposed on the case 12 (more specifically, the lower case 12n). Further, the extending portion 43 is overlapped in a plane with respect to the first protrusion 25 and the second protrusion 28. The extending portion 43 is in surface contact with the first surface 21 a of the first protrusion 25 and the second protrusion 28. At this time, the screw insertion hole 46 formed in the extending portion 43 and the screw insertion hole 27 formed in the multilayer substrate 21 overlap.
　レセプタクル１０は、ねじ３６をさらに有する。ねじ３６は、金属から形成されている。ねじ３６は、多層基板２１の第１表面２１ａ側からねじ挿入孔４６およびねじ挿入孔２７に挿通され、ケース１２（より具体的には、下ケース１２ｎ）に螺合されている。このような構成により、多層基板２１は、ねじ３６によってケース１２に固定されている。カバー４１（延出部４３）は、ねじ３６によって、多層基板２１とともにケース１２に固定されている。 The receptacle 10 further has a screw 36. The screw 36 is made of metal. The screw 36 is inserted into the screw insertion hole 46 and the screw insertion hole 27 from the first surface 21a side of the multilayer substrate 21 and is screwed into the case 12 (more specifically, the lower case 12n). With such a configuration, the multilayer substrate 21 is fixed to the case 12 by the screws 36. The cover 41 (extending portion 43) is fixed to the case 12 together with the multilayer substrate 21 by screws 36.
　なお、本実施の形態では、多層基板２１をケース１２に固定する固定部材が、ねじ３６である場合を説明したが、これに限られず、たとえば、クリップやボルトが用いられてもよい。 In the present embodiment, the case where the fixing member that fixes the multilayer substrate 21 to the case 12 is the screw 36 has been described. However, the present invention is not limited thereto, and, for example, a clip or a bolt may be used.
　比較のため、電極群２４に対応するピン部材をシェル内に配置するとともに、半田を用いてそのピン部材を基板に固定するレセプタクルの構造を想定する。この場合、プラグの挿抜に伴って半田部分に応力が繰り返し加わるため、半田部分が破損する可能性がある。 For comparison, a receptacle structure is assumed in which a pin member corresponding to the electrode group 24 is disposed in the shell, and the pin member is fixed to the substrate using solder. In this case, since stress is repeatedly applied to the solder portion as the plug is inserted and removed, the solder portion may be damaged.
　これに対して、本実施の形態では、多層基板２１の舌部２２に電極群２４を設け、この舌部２２に対してプラグ７０を挿抜するため、レセプタクル１０が、プラグ７０の挿抜に対して高い耐久性（たとえば、１万回以上の挿抜に対する耐久性）を発揮することができる。また、このような構成により、多層基板２１がシェル部４２と同一の平面上に配置されるため、ケース１２を薄型化することができる。 On the other hand, in the present embodiment, the electrode group 24 is provided on the tongue portion 22 of the multilayer substrate 21 and the plug 70 is inserted into and removed from the tongue portion 22. High durability (for example, durability against 10,000 or more insertions / removals) can be exhibited. Moreover, since the multilayer substrate 21 is arrange | positioned on the same plane as the shell part 42 by such a structure, the case 12 can be reduced in thickness.
　さらに本実施の形態では、多層基板２１がねじ３６によってケース１２に固定されているため、プラグの挿抜に伴う応力を、多層基板２１がケース１２と一体となって受けることになる。これにより、プラグ７０の挿抜に対してさらに高い耐久性を発揮することができる。また、多層基板２１をケース１２に固定するねじ３６は、プラグ７０が挿抜される舌部２２に隣り合って設けられているため、プラグ７０の挿抜に対する耐久性をさらに高めることができる。 Further, in the present embodiment, since the multilayer substrate 21 is fixed to the case 12 by the screw 36, the multilayer substrate 21 receives the stress accompanying the insertion / extraction of the plug integrally with the case 12. Thereby, higher durability can be exhibited with respect to the insertion and removal of the plug 70. Further, since the screw 36 for fixing the multilayer substrate 21 to the case 12 is provided adjacent to the tongue portion 22 into which the plug 70 is inserted and removed, durability against the insertion and removal of the plug 70 can be further enhanced.
　カバー４１は、シールド部４４をさらに有する。シールド部４４は、たとえば溶接によって、シェル部４２と一体とされている。シールド部４４は、多層基板２１に実装された回路部品を覆うように設けられている。 The cover 41 further includes a shield part 44. The shield part 44 is integrated with the shell part 42, for example, by welding. The shield part 44 is provided so as to cover the circuit components mounted on the multilayer substrate 21.
　より具体的には、シールド部４４は、その構成部位として、底部４４ｐと、第１側部４４ｑおよび第２側部４４ｒとを有する。 More specifically, the shield part 44 has a bottom part 44p, a first side part 44q, and a second side part 44r as its constituent parts.
　底部４４ｐは、多層基板２１の第１表面２１ａと向かい合って配置されている。底部４４ｐは、シェル部４２の他方端４２ｋから連なっている。底部４４ｐは、放熱シート３２に接触している。第１側部４４ｑおよび第２側部４４ｒは、底部４４ｐの両端から立ち上がり、多層基板２１の第２表面２１ｂまで延在している。第１側部４４ｑおよび第２側部４４ｒは、図７中の矢印１２３に示す方向に対向して設けられている。 The bottom portion 44p is disposed to face the first surface 21a of the multilayer substrate 21. The bottom portion 44p continues from the other end 42k of the shell portion 42. The bottom 44p is in contact with the heat dissipation sheet 32. The first side portion 44q and the second side portion 44r rise from both ends of the bottom portion 44p and extend to the second surface 21b of the multilayer substrate 21. The first side portion 44q and the second side portion 44r are provided to face each other in the direction indicated by the arrow 123 in FIG.
　シールド部４４は、多層基板２１の第１表面２１ａ上において、ＤＣ／ＤＣコンバータ５０の構成部品のうちのＣｉｎ５４、メインスイッチ５５、ＳＲ５６およびＳＭＰＳコントローラ５７を覆うように設けられている。このような構成により、ＤＣ／ＤＣコンバータ５０の電磁シールドを簡易な構成により実現することができる。 The shield portion 44 is provided on the first surface 21a of the multilayer substrate 21 so as to cover the Cin 54, the main switch 55, the SR 56, and the SMPS controller 57 among the components of the DC / DC converter 50. With such a configuration, the electromagnetic shield of the DC / DC converter 50 can be realized with a simple configuration.
　以上に説明した、この発明の実施の形態におけるレセプタクル１０の構造についてまとめて説明すると、本実施の形態におけるレセプタクル１０は、プラグ７０を挿抜可能に構成されている。レセプタクル１０は、多層基板２１を備える。多層基板２１は、多層基板２１を平面視した場合の周縁に位置する舌部２２を有する。レセプタクル１０は、舌部２２において多層基板２１の両面に設けられる電極群２４と、多層基板２１に接続される金属製のカバー４１とを備える。カバー４１は、舌部２２を取り囲むように配置されるシェル部４２と、シェル部４２から多層基板２１の一方の面としての第１表面２１ａに近づくように折り返される折り返し形状を有し、弾性変形可能に構成される第１折り返し部８１と、第１折り返し部８１と対向して設けられ、シェル部４２から多層基板２１の他方の面としての第２表面２１ｂに近づくように折り返される折り返し形状を有し、弾性変形可能に構成される第２折り返し部８６とを有する。舌部２２は、第１折り返し部８１および第２折り返し部８６を互いに離れる方向に弾性変形させつつ、第１折り返し部８１および第２折り返し部８６の間に配置されている。 The structure of the receptacle 10 according to the embodiment of the present invention described above will be described together. The receptacle 10 according to the present embodiment is configured so that the plug 70 can be inserted and removed. The receptacle 10 includes a multilayer substrate 21. The multilayer substrate 21 has a tongue 22 located on the periphery when the multilayer substrate 21 is viewed in plan. The receptacle 10 includes an electrode group 24 provided on both surfaces of the multilayer substrate 21 in the tongue portion 22, and a metal cover 41 connected to the multilayer substrate 21. The cover 41 has a shell portion 42 disposed so as to surround the tongue portion 22, and a folded shape that is folded back from the shell portion 42 so as to approach the first surface 21 a as one surface of the multilayer substrate 21, and is elastically deformed. A first folded portion 81 that can be configured, and a folded shape that is provided to face the first folded portion 81 and is folded back so as to approach the second surface 21 b as the other surface of the multilayer substrate 21 from the shell portion 42. And a second folded portion 86 configured to be elastically deformable. The tongue portion 22 is disposed between the first folded portion 81 and the second folded portion 86 while elastically deforming the first folded portion 81 and the second folded portion 86 in directions away from each other.
　このように構成された、この発明の実施の形態におけるレセプタクル１０によれば、簡易な構成を備えつつ、プラグの挿抜に対して高い耐久性を発揮するレセプタクルを実現することができる。 According to the receptacle 10 according to the embodiment of the present invention configured as described above, it is possible to realize a receptacle that exhibits a high durability against plug insertion / extraction while having a simple configuration.
　以下、本発明の構成と、本発明により奏される作用効果とについて、まとめて説明する。 Hereinafter, the configuration of the present invention and the effects achieved by the present invention will be described together.
　この発明に従ったレセプタクルは、プラグを挿抜可能に構成されるレセプタクルである。レセプタクルは、多層基板を備える。多層基板は、多層基板を平面視した場合の周縁に位置する舌部を有する。レセプタクルは、舌部において多層基板の両面に設けられる電極群と、多層基板に接続される金属製のカバーとを備える。カバーは、舌部を取り囲むように配置されるシェル部と、シェル部から多層基板の一方の面に近づくように折り返される折り返し形状を有し、弾性変形可能に構成される第１折り返し部と、第１折り返し部と対向して設けられ、シェル部から多層基板の他方の面に近づくように折り返される折り返し形状を有し、弾性変形可能に構成される第２折り返し部とを有する。舌部は、第１折り返し部および第２折り返し部を互いに離れる方向に弾性変形させつつ、第１折り返し部および第２折り返し部の間に配置されている。 The receptacle according to the present invention is a receptacle configured so that a plug can be inserted and removed. The receptacle includes a multilayer substrate. The multilayer substrate has a tongue portion located at the periphery when the multilayer substrate is viewed in plan. The receptacle includes an electrode group provided on both surfaces of the multilayer substrate at the tongue, and a metal cover connected to the multilayer substrate. The cover has a shell portion disposed so as to surround the tongue portion, a first folded portion configured to be elastically deformable, having a folded shape that is folded from the shell portion so as to approach one surface of the multilayer substrate, A second folded portion is provided opposite to the first folded portion, has a folded shape that is folded back from the shell portion so as to approach the other surface of the multilayer substrate, and is configured to be elastically deformable. The tongue portion is disposed between the first folded portion and the second folded portion while elastically deforming the first folded portion and the second folded portion in a direction away from each other.
　なお、レセプタクルとは、プラグと、プラグに接続されたケーブルとに電気的に接続される電子機器側コネクタの総称である。 Note that the receptacle is a general term for a connector on an electronic device side that is electrically connected to a plug and a cable connected to the plug.
　このように構成されたレセプタクルによれば、金属製のカバーに、弾性変形可能な第１折り返し部および第２折り返し部を設けることによって、シェル部の内側における舌部の保持を簡易な構成により実現することができる。また、プラグとの電気的な接点となる電極群が多層基板の舌部に設けられているため、プラグの挿抜に対して高い耐久性を発揮することができる。 According to the receptacle configured in this manner, the first cover portion and the second return portion that can be elastically deformed are provided on the metal cover, thereby allowing the tongue portion to be held inside the shell portion with a simple configuration. can do. Moreover, since the electrode group used as an electrical contact with a plug is provided in the tongue part of the multilayer board | substrate, high durability can be exhibited with respect to plug insertion / extraction.
　また好ましくは、レセプタクルは、舌部において多層基板に設けられる接地端子をさらに備える。第１折り返し部および第２折り返し部の少なくともいずれか一方は、接地端子に電気的に接続される。また好ましくは、レセプタクルは、舌部において多層基板に設けられる複数の接地端子をさらに備える。第１折り返し部および第２折り返し部は、複数の接地端子に電気的に接続される。 Preferably, the receptacle further includes a ground terminal provided on the multilayer substrate at the tongue. At least one of the first folded portion and the second folded portion is electrically connected to the ground terminal. Preferably, the receptacle further includes a plurality of ground terminals provided on the multilayer substrate at the tongue. The first folded portion and the second folded portion are electrically connected to a plurality of ground terminals.
　このように構成されたレセプタクルによれば、簡易な構成により、シェル部を電磁シールドとして機能させることができる。 According to the receptacle configured as described above, the shell portion can function as an electromagnetic shield with a simple configuration.
　また好ましくは、レセプタクルは、多層基板を支持するベース部材と、多層基板をベース部材に固定する固定部材とをさらに備える。 Preferably, the receptacle further includes a base member that supports the multilayer substrate and a fixing member that fixes the multilayer substrate to the base member.
　このように構成されたレセプタクルによれば、多層基板がベース部材と一体となって、プラグの挿抜に伴う応力を受ける。これにより、プラグの挿抜に対してさらに高い耐久性を発揮することができる。 According to the receptacle configured as described above, the multilayer substrate is integrated with the base member and receives stress accompanying insertion and removal of the plug. Thereby, higher durability can be exhibited with respect to plug insertion / extraction.
　また好ましくは、固定部材は、多層基板を平面視した場合に舌部を挟んでその両側に設けられる。 Also preferably, the fixing members are provided on both sides of the tongue when the multilayer substrate is viewed in plan.
　このように構成されたレセプタクルによれば、固定部材を、プラグが挿抜される舌部に近接して設けることにより、プラグの挿抜に対してさらに高い耐久性を発揮することができる。 According to the receptacle configured as described above, the fixing member is provided in the vicinity of the tongue portion into which the plug is inserted / extracted, whereby higher durability against plug insertion / extraction can be exhibited.
　また好ましくは、カバーは、シェル部から延出し、多層基板に平面的に重ね合わされる延出部をさらに有する。延出部は、固定部材によって、多層基板とともにベース部材に固定される。 Also preferably, the cover further includes an extending portion that extends from the shell portion and is planarly superimposed on the multilayer substrate. The extending portion is fixed to the base member together with the multilayer substrate by a fixing member.
　このように構成されたレセプタクルによれば、簡易な構成により、シェル部をベース部材に固定することができる。 According to the receptacle configured as described above, the shell portion can be fixed to the base member with a simple configuration.
　また好ましくは、レセプタクルは、インダクタ、キャパシタおよびスイッチング素子を有し、多層基板に設けられるＤＣ／ＤＣコンバータをさらに備える。 Preferably, the receptacle further includes a DC / DC converter having an inductor, a capacitor, and a switching element and provided on the multilayer substrate.
　このように構成されたレセプタクルによれば、簡易な構成により、ＤＣ／ＤＣコンバータを備えた回路モジュールを構成することができる。 According to the receptacle configured as described above, a circuit module including a DC / DC converter can be configured with a simple configuration.
　今回開示された実施の形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は上記した説明ではなくて請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。 The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
　この発明は、たとえば、ＵＳＢコネクタのレセプタクルに適用される。 This invention is applied to a receptacle of a USB connector, for example.
　１０　レセプタクル、１２　ケース、１２ｍ　上ケース、１２ｎ　下ケース、１３，７１ｄ　開口部、１４　挿入口、２１　多層基板、２１ａ　第１表面、２１ｂ　第２表面、２２　舌部、２３　接地電極、２４　電極群、２５　第１突部、２６　第１切り欠き部、２７，４６　ねじ挿入孔、２８　第２突部、２９　第２切り欠き部、３１　樹脂部、３２　放熱シート、３３　ベース基板、３６　ねじ、４１　カバー、４２　シェル部、４２ｊ　一方端、４２ｋ　他方端、４３　延出部、４４　シールド部、４４ｐ　底部、４４ｑ　第１側部、４４ｒ　第２側部、５０　コンバータ、５１　チョークコイル、５２　ロードスイッチ、５３　コンデンサ（Ｃｂｕｓ）、５４　コンデンサ（Ｃｉｎ）、５５　メインスイッチ、５６　ＳＲ、５７　ＳＭＰＳコントローラ、６０　高周波信号伝送部、６１　ＭＵＸＥＱ、６２　ＵＳＢＰＤコントローラ、６３　コネクタ、７０　プラグ、７１　外装体、７２　第１コンタクト、７３　第２コンタクト、８１　第１折り返し部、８６　第２折り返し部。 10 receptacle, 12 case, 12m upper case, 12n lower case, 13, 71d opening, 14 insertion slot, 21 multilayer substrate, 21a first surface, 21b second surface, 22 tongue, 23 ground electrode, 24 electrode group, 25 1st protrusion, 26 1st notch, 27, 46 screw insertion hole, 28 2nd protrusion, 29 2nd notch, 31 resin part, 32 heat dissipation sheet, 33 base substrate, 36 screw, 41 cover , 42 shell part, 42j one end, 42k other end, 43 extension part, 44 shield part, 44p bottom part, 44q first side part, 44r second side part, 50 converter, 51 choke coil, 52 load switch, 53 capacitor (Cbus), 54 capacitor (Cin), 55 main switch, 56 SR, 57 SMPS controller, 60 high-frequency signal transmission unit, 61 MUXEQ, 62 USBPD controller, 63 connector, 70 plug 71 exterior body, 72 first contact 73 second contact 81 first folded portion, 86 second folded portion.

Claims (7)

  1. 　プラグを挿抜可能に構成されるレセプタクルであって、
    　多層基板を備え、
    　前記多層基板は、前記多層基板を平面視した場合の周縁に位置する舌部を有し、さらに、
    　前記舌部において前記多層基板の両面に設けられる電極群と、
    　前記多層基板に接続される金属製のカバーとを備え、
    　前記カバーは、
    　前記舌部を取り囲むように配置されるシェル部と、
    　前記シェル部から前記多層基板の一方の面に近づくように折り返される折り返し形状を有し、弾性変形可能に構成される第１折り返し部と、
    　前記第１折り返し部と対向して設けられ、前記シェル部から前記多層基板の他方の面に近づくように折り返される折り返し形状を有し、弾性変形可能に構成される第２折り返し部とを有し、
    　前記舌部は、前記第１折り返し部および前記第２折り返し部を互いに離れる方向に弾性変形させつつ、前記第１折り返し部および前記第２折り返し部の間に配置されている、レセプタクル。     A receptacle configured to allow insertion and removal of a plug,
    Equipped with a multilayer substrate,
    The multilayer substrate has a tongue portion located at a peripheral edge when the multilayer substrate is viewed in plan,
    A group of electrodes provided on both surfaces of the multilayer substrate in the tongue;
    A metal cover connected to the multilayer substrate,
    The cover is
    A shell portion arranged to surround the tongue portion;
    A first folded portion having a folded shape that is folded so as to approach one surface of the multilayer substrate from the shell portion, and configured to be elastically deformable;
    A second folded portion provided facing the first folded portion, having a folded shape that is folded from the shell portion so as to approach the other surface of the multilayer substrate, and configured to be elastically deformable. ,
    The receptacle is a receptacle disposed between the first folded portion and the second folded portion while elastically deforming the first folded portion and the second folded portion in a direction away from each other.
  2. 　前記舌部において前記多層基板に設けられる接地端子をさらに備え、
    　前記第１折り返し部および前記第２折り返し部の少なくともいずれか一方は、前記接地端子に電気的に接続される、請求項１に記載のレセプタクル。     A ground terminal provided on the multilayer substrate at the tongue;
    The receptacle according to claim 1, wherein at least one of the first folded portion and the second folded portion is electrically connected to the ground terminal.
  3. 　前記舌部において前記多層基板に設けられる複数の接地端子をさらに備え、
    　前記第１折り返し部および前記第２折り返し部は、前記複数の接地端子に電気的に接続される、請求項１に記載のレセプタクル。     A plurality of ground terminals provided on the multilayer substrate at the tongue;
    The receptacle according to claim 1, wherein the first folded portion and the second folded portion are electrically connected to the plurality of ground terminals.
  4. 　前記多層基板を支持するベース部材と、
    　前記多層基板を前記ベース部材に固定する固定部材とをさらに備える、請求項１から３のいずれか１項に記載のレセプタクル。     A base member for supporting the multilayer substrate;
    The receptacle according to any one of claims 1 to 3, further comprising a fixing member that fixes the multilayer substrate to the base member.
  5. 　前記固定部材は、前記多層基板を平面視した場合に前記舌部を挟んでその両側に設けられる、請求項４に記載のレセプタクル。 The receptacle according to claim 4, wherein the fixing member is provided on both sides of the tongue when the multilayer substrate is viewed in plan.
  6. 　前記カバーは、前記シェル部から延出し、前記多層基板に平面的に重ね合わされる延出部をさらに有し、
    　前記延出部は、前記固定部材によって、前記多層基板とともに前記ベース部材に固定される、請求項５に記載のレセプタクル。     The cover further includes an extending portion that extends from the shell portion and is planarly superimposed on the multilayer substrate;
    The receptacle according to claim 5, wherein the extending portion is fixed to the base member together with the multilayer substrate by the fixing member.
  7. 　インダクタ、キャパシタおよびスイッチング素子を有し、前記多層基板に設けられるＤＣ／ＤＣコンバータをさらに備える、請求項１から６のいずれか１項に記載のレセプタクル。 The receptacle according to any one of claims 1 to 6, further comprising a DC / DC converter provided on the multilayer substrate, having an inductor, a capacitor, and a switching element.
PCT/JP2018/005941 2017-03-13 2018-02-20 Receptacle WO2018168352A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017047324 2017-03-13
JP2017-047324 2017-03-13

Publications (1)

Publication Number Publication Date
WO2018168352A1 true WO2018168352A1 (en) 2018-09-20

Family

ID=63521989

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/005941 WO2018168352A1 (en) 2017-03-13 2018-02-20 Receptacle

Country Status (1)

Country Link
WO (1) WO2018168352A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110518387A (en) * 2019-08-30 2019-11-29 Oppo（重庆）智能科技有限公司 Plug connector and preparation method thereof, electronic equipment
JP2020053415A (en) * 2018-09-21 2020-04-02 日本航空電子工業株式会社 Connector, device with connector and manufacturing method of connector
JPWO2022034925A1 (en) * 2020-08-13 2022-02-17
EP3972061A1 (en) 2020-09-18 2022-03-23 Hosiden Corporation Connector and connector device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0584074U (en) * 1992-04-13 1993-11-12 矢崎総業株式会社 PCB connector
JPH0660082U (en) * 1993-01-26 1994-08-19 ミツミ電機株式会社 Wiring board connection structure
JPH07245157A (en) * 1994-03-02 1995-09-19 Oki Electric Ind Co Ltd Connector structure
JP2010055798A (en) * 2008-08-26 2010-03-11 Furukawa Electric Co Ltd:The Printing board and connector connecting structure
US20100216341A1 (en) * 2009-02-26 2010-08-26 Sandisk Il Ltd. Memory card and host device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0584074U (en) * 1992-04-13 1993-11-12 矢崎総業株式会社 PCB connector
JPH0660082U (en) * 1993-01-26 1994-08-19 ミツミ電機株式会社 Wiring board connection structure
JPH07245157A (en) * 1994-03-02 1995-09-19 Oki Electric Ind Co Ltd Connector structure
JP2010055798A (en) * 2008-08-26 2010-03-11 Furukawa Electric Co Ltd:The Printing board and connector connecting structure
US20100216341A1 (en) * 2009-02-26 2010-08-26 Sandisk Il Ltd. Memory card and host device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020053415A (en) * 2018-09-21 2020-04-02 日本航空電子工業株式会社 Connector, device with connector and manufacturing method of connector
JP7232006B2 (en) 2018-09-21 2023-03-02 日本航空電子工業株式会社 CONNECTOR, DEVICE INCLUDING CONNECTOR, AND CONNECTOR MANUFACTURING METHOD
CN110518387A (en) * 2019-08-30 2019-11-29 Oppo（重庆）智能科技有限公司 Plug connector and preparation method thereof, electronic equipment
JPWO2022034925A1 (en) * 2020-08-13 2022-02-17
JP7411150B2 (en) 2020-08-13 2024-01-11 株式会社ExH power supply connector
EP3972061A1 (en) 2020-09-18 2022-03-23 Hosiden Corporation Connector and connector device
US11670891B2 (en) 2020-09-18 2023-06-06 Hosiden Corporation Electrical connector with water evacuation features and connector device using the same

Similar Documents

Publication Publication Date Title
WO2018168352A1 (en) Receptacle
US8696388B2 (en) Edge connector for shielded adapter
US20130178075A1 (en) Electrical connector and electronic apparatus using the same
JP2015035407A (en) Connector terminal and electric connector
JP2009026667A (en) Electric connector
CN105098529B (en) Socket electric connector
JP2015135816A (en) Terminal, electric connector and electric connector assembly
US10020625B2 (en) Electrical connector
KR20120022624A (en) Electrical connector and circuit board assembly
TW201330384A (en) Connector
TW201914105A (en) Board to board connector
US20150156909A1 (en) Power semiconductor module
US10396505B2 (en) Filter connector
US9054466B2 (en) Integrated circuit assembly for high-frequency on-board printed circuit board testing,validation, and verification
WO2015045623A1 (en) Connector
KR102317945B1 (en) Receptacle
KR101488891B1 (en) Connector assembly for board-to-board
CN112351629B (en) Electronic device
WO2018168336A1 (en) Signal transmission module
US20090163049A1 (en) Electronic module
KR101263406B1 (en) cellullar phone having earphone jack module type
US10396506B2 (en) Cable connector with filter function
US11122699B2 (en) Input connection device
US20230006376A1 (en) Connector and electronic apparatus
US20230064606A1 (en) Connector, connector module, and electronic apparatus

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18768336

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18768336

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP