TWM556928U - Device for changing arrangement of electronic components - Google Patents

Abstract

The apparatus for changing the arrangement of electronic components of the present invention includes a first transportation system, a second transportation system, a photosensitive drum, and an activation system. The first transport system transports a carrier substrate. The carrier substrate has a plurality of electronic components arranged in a first manner. The second transport system delivers a target substrate. The photosensitive drum is rotatable and has an adsorption layer. The activation system selectively activates one or more regions of the adsorption layer of the rotating photosensitive drum such that the one or more regions that are activated are attractive to the electronic components. Among them, the photosensitive drum is continuously rotated. The adsorption layer is attached to the electronic components of the carrier substrate, and the attached electronic components are transferred to corresponding positions of the target substrate to form a second manner. The second mode arrangement is different from the first mode arrangement.

Description

Device for changing the arrangement of electronic components

This creation is related to electronic circuit manufacturing equipment, and in particular to a device that changes the arrangement of electronic components.

With the development of the wafer process, various transistor processes have been reduced to the nanometer level. The reduced transistor can not only reduce the volume but also reduce the power consumption. In contrast, the volume of the wafer composed of the transistor can also be reduced accordingly. Or put more transistors into the development of today's electronics (smart phones, tablets and monitors).

The structure of the Micro Light Emitting Diode Display is to pass through the micro-shaped LED array, and the micro-LED can be driven separately, so that the pixel distance of the display is reduced to the micrometer level.

In the circuit manufacturing, the miniaturized LED array not only has a smaller electronic component, but also has a higher density and a larger number of arrays. Therefore, the difficulty is not only beyond the current manufacturing method, but also requires more efficient electronic shortening. The time of component arrangement can achieve the purpose of mass production.

In addition, after the transfer of a large number of electronic components in the functional test is still easy to find some functional anomalies, such as electronic components damage and poor contact between the electronic components and solder, when the repair (repair), due to uneven location It is not fixed, so the repair work becomes difficult.

In view of the above-mentioned deficiencies, the purpose of the present invention is to provide an apparatus for changing the arrangement of electronic components to efficiently change the arrangement of electronic components while fixing the electronic components at appropriate positions on the target substrate for various applications.

In order to achieve the above object, the device for changing the arrangement of electronic components includes a The first transportation system, a second transportation system, a photosensitive drum, and an activation system. The first transport system transports a carrier substrate. The carrier substrate has a plurality of electronic components that are arranged in a first manner. The second transport system delivers a target substrate. The photosensitive drum is rotatable and has an adsorption layer. The activation system selectively activates one or more regions of the adsorption layer of the rotating photosensitive drum such that the one or more regions that are activated are attractive to the electronic components. Among them, the photosensitive drum is continuously rotated. The adsorption layer is attached to the electronic components of the carrier substrate, and the attached electronic components are transferred to corresponding positions of the target substrate to form a second manner. The second mode arrangement is different from the first mode arrangement.

Thus, the device for changing the arrangement of electronic components of the present invention can efficiently change the arrangement of electronic components for the purpose of more efficient production and repair.

The detailed steps, features, composition or mode of operation of the device for changing the arrangement of electronic components provided by this creation will be described in the detailed description of the subsequent embodiments. However, those of ordinary skill in the art should understand that the detailed description and specific embodiments of the present invention are merely illustrative of the present invention and are not intended to limit the scope of the invention.

10‧‧‧ Methodological process

11-17, 121, 141‧‧ steps

20‧‧‧Transfer substrate

21‧‧‧Work surface

22‧‧‧Negative charge

30, 743, 763‧‧‧ electromagnetic waves

40‧‧‧Loading substrate

41, 43, 45‧‧‧ Electronic components

411‧‧‧ feet

50‧‧‧ Target substrate

60‧‧‧ circuit board

61‧‧‧ Conductive layer

62‧‧‧ solder

70‧‧‧ Equipment

71‧‧‧First Transport System

711, 721, 722‧‧‧ support rollers

72‧‧‧Second transport system

73‧‧‧Photosensitive drum

731‧‧‧Photoconductor layer

74, 76‧‧‧ Activation system

741, 761‧‧‧ lighting module

742, 762‧‧‧ scan module

Figure 1 is a flow diagram of an embodiment of the method of the present apparatus for performing a method of changing the arrangement of electronic components.

Figure 2 is a flow chart for continuing the alternative method of Figure 1.

Figures 3 and 4 are cross-sectional views of the transfer substrate, showing a schematic cross-sectional view of the activation step.

Figures 5-6 are cross-sectional views of the transfer substrate and the carrier substrate, and represent schematic views of the introduction steps.

Figure 7 is a cross-sectional view of the transfer substrate and the target substrate, showing a schematic diagram of the transfer step.

Figure 8 is a schematic cross-sectional view of the carrier substrate.

Figure 9 is a cross-sectional view of the transfer substrate and the carrier substrate, showing a schematic view of the introduction step.

Figure 10 is a cross-sectional view of the transfer substrate and the target substrate, showing a schematic diagram of the transfer step.

Figure 11 is a cross-sectional view of the target substrate and the circuit substrate, showing a schematic view of the transfer step

Figure 12 is a schematic cross-sectional view of the circuit substrate.

Figure 13 is a schematic plan view of the circuit substrate.

Figure 14 is a top plan view showing the damage of some electronic components after the functional test of the circuit substrate.

Fig. 15 is a schematic plan view showing the transfer substrate in accordance with the electron-withdrawing element of Fig. 14.

Fig. 16 is a schematic plan view showing a circuit board repaired by the device of the present invention.

Figures 17-19 are schematic diagrams of the device used to change the arrangement of electronic components.

Hereinafter, the operation steps, manufacture, and achievement of the device for changing the arrangement of the electronic components of the present invention will be described with reference to the respective preferred embodiments. However, the steps of changing the arrangement of electronic components, the device components, the substrate size and the shape in each drawing are only used to illustrate the technical features of the present creation, and do not limit the creation.

As shown in Fig. 1, the figure is a flow chart of the process of changing the arrangement of electronic components. Method 10 depicts five steps, but this is not a limitation of the present creation, and in other embodiments, the creations may be performed in a different order, or there may be more or fewer steps. The method 10 begins with the step 11 of providing a carrier substrate. The carrier substrate 11 can be a tri-five semiconductor (III-V) material (such as gallium arsenide GaAs, gallium nitride GaN, gallium phosphide GaP, etc.), and a hexa-group semiconductor. (such as zinc sulfide (ZnS) and cadmium telluride (CdTe), etc.), germanium wafers, sapphire wafers, trays, tapes or other devices for storing electronic components. The electronic component can be a wafer of transistors or semiconductors or other semiconductor-processed products, such as passive components.

Step 12 is to activate the transfer substrate. This step can activate all or part of the working surface of the transfer substrate to form one or more adsorption regions. The adsorption region forms a specific pattern on the work surface and is used once. A part of the electronic components or all the electronic components on the carrier substrate are adsorbed on the adsorption region in stages. Conversely, an area that is not activated on the working surface does not adsorb electronic components. Furthermore, when the adsorption area is removed or reduced in activation, the adsorption area will no longer have the ability to adsorb electronic components.

Step 13 is to introduce the selected electronic component to the transfer substrate, in this step, the transfer substrate adsorbs the selected electronic component on the carrier substrate, and in this step, the selected electronic component may be one or more, electronic The component is attached to the transfer substrate in a manner that is permeable or non-contacting because electrostatic forces can attract electronic components through contact or non-contact. Step 14 is to provide a target substrate. Step 15 is to transfer the adsorbed electronic component from the transfer substrate to the target substrate, wherein the surface of the target substrate may form a debonding layer to temporarily adhere the electronic component, and the peelable layer may be peelable and electrostatic. force, Magnetic or van der Waals force or vacuum force to temporarily fix electronic components.

The electronic components on the carrier substrate are arranged in a first manner. Generally, the electronic components arranged in the first manner are at a fixed pitch and are closely arranged. The electronic components transferred to the target substrate are arranged in a second manner, and the second mode arrangement is different from the first mode arrangement, and the spacing of adjacent electronic components in the second mode arrangement is generally greater than that of adjacent electronic components in the first mode arrangement. In other embodiments, the first mode arrangement may also be a non-fixed pitch, and is not closely arranged. The present invention may also convert electronic components that are arranged at a larger pitch into electronic components that are arranged at a smaller pitch, or equally pitched. In this way, the arrangement of the electronic components is changed.

In other embodiments, the target substrate may also utilize the same composition as the transfer substrate to create an attractive force for the electronic component.

Continuing with Figure 1, the method of the present process includes additional steps. As shown in FIG. 2, the figure is a flow diagram of another embodiment of the method of the present method and includes four steps that can be selectively added. Step 121 is to first select different rows of electronic components on the carrier substrate. In this step, one of the ways of increasing the spacing of the electronic components exists, and there are other rows of electronic components between the different rows. Other methods will be described later, such as controlling the time at which the transfer substrate adsorbs electronic components during traveling or the traveling speed. Step 141 is to remove the activated transfer substrate. This step refers to removing the active substrate by removing or reducing the transfer substrate when the transfer substrate approaches or approaches the target substrate, so that the transfer substrate loses the adsorption capacity to release the electronic components, so that the electronic components on the target substrate are connected. The pads are all facing outwards for subsequent manufacturing. The fact that the pins of the electronic component face outward means that the pins are not facing the target substrate, but in other embodiments, the pins may also face the target substrate.

Step 16 is to provide a circuit substrate having an insulating layer, a conductive layer, and a plurality of solder. The insulating layer may be on or inside the circuit substrate. The conductive layer may also be on or inside the circuit substrate. The solder is connected to the conductive layer, the solder may be a solder paste or a conductive paste, the conductive paste comprises a combination of a resin and a metal particle, the metal particle is divided into a single metal and a metal alloy, a single metal such as indium, silver, tin, gold, and aluminum, etc., metal Alloys such as silver tin, gold tin and indium tin, etc.). In addition, the circuit board may be a hard board, a soft board or a soft and hard combination board, and the material may be metal, polymer, ceramic, glass, sapphire, and a printed circuit board material familiar to the industry. Step 17 is to transfer the electronic component to the circuit substrate so that the pins of the electronic component are electrically connected to the solder of the circuit substrate. In this step, the solder and the pins of the electronic component are heated to fix the electronic component. The pins of the solder or electronic component can also be heated separately in the embodiment. Since the electronic component is detachable from the target substrate, when the electronic component is fixed to the circuit substrate, the electronic component can be easily separated from the target substrate.

The working surface of the transfer substrate is activated according to step 12 of FIG. 1. The working surface is a photoconductive layer. The main components of the transfer substrate include a metal layer and a photoconductor layer coated on the metal layer. When the transfer substrate is charged, part or all of the photoconductor layer is distributed with an electrical charge, and then the conduction state can be changed by exposure, and the charge of the exposed portion or region is neutralized or lowered without being exposed. The part can retain the charge. As shown in FIG. 3, the working surface 21 of the transfer substrate 20 carries a negative charge 22. However, in other embodiments, the working surface 21 may also have a positive or no positive/negative charge. In other embodiments, the working surface of the transfer substrate may also be an adsorption layer composed of other materials or structures. The materials or structures have an adsorption force on the working surface of the transfer substrate, and the attraction force includes magnetic force or van der Waals in addition to the above static electricity. The force, the vacuum force or the adhesive force, for example, a vacuum channel is formed through the transfer substrate, and the adhesive force is transmitted through, for example, a peelable glue.

Then, in FIG. 4, one or more portions of the working surface 21 of the transfer substrate 20 are exposed to electromagnetic waves 30, such as laser light, radiation, etc., causing the negative charge to be removed or reduced. In the region not irradiated by the electromagnetic wave 30, the negative charge can be retained to carry out the introduction of the selected electronic component to the transfer substrate in step 13 of FIG. 1. As shown in FIG. 5, the arrangement of the electronic component 41 on the carrier substrate 40 is fixed. The pitch, and the negative charge 22 corresponds to the electronic component 41. As shown in FIG. 6, the carrier substrate 40 is accessed through the working surface 21, so that the negative charge 22 retained on the working surface 21 adsorbs the electronic component 41, and the electronic component 41 may be omitted. Charge or positive (inverse) charge. Then, as shown in FIG. 7, the target substrate 50 is provided to switch the electronic component 41 to an appropriate position of the target substrate 50, and the arrangement of the electronic components is changed.

In other embodiments, if the electronic component has a positive/negative charge, the adsorbed region may also select an uncharged region on the working surface, that is, to remove or reduce the charge of the adsorbed region by electromagnetic waves. Alternatively, an opposite electrical charge is formed (selected) on the working surface, and the polarity of the opposite charge is opposite to the polarity of the charge of the adsorbed region. In addition, the electronic component 41 is adsorbed onto the carrier substrate 40 and can also approach the working surface 21 through the movable carrier substrate 40, or both can move in close proximity to each other.

In another embodiment, as shown in FIG. 8, the figure corresponds to step 11 of FIG. 1, and the pads 411 of the electronic component 41 on the carrier substrate 40 are upwardly arranged at a fixed pitch. Corresponding to step 12 of Fig. 1 and Figs. 3 and 4, this part will not be described again. As shown in FIG. 9, those skilled in the art can understand from the figures and the description that the above-mentioned description of the pin 411 upward refers to the pin 411 facing the transfer substrate 20, and the figure corresponds to the step 13 of FIG. 1 to make the electronic component 41. It is adsorbed on the transfer substrate 20, and at this time, the pin 411 of the electronic component 41 is close to the work surface 21 of the transfer substrate 20. Then, as shown in FIG. 10, the transfer substrate 20 to which the electronic component 41 is adsorbed is aligned with the target substrate 50 so that the electronic component 41 is fixed on the target substrate 50. At this time, the pins 411 of the electronic component 41 are both outward. That is, it is not bonded to the target substrate 50. Next, in correspondence with steps 16 and 17 of FIG. 2 and referenced to FIG. 11, the circuit substrate 60 is provided and the electronic component 41 is transferred from the target substrate 50 to the circuit substrate 60 so that the pin 411 of the electronic component 41 and the circuit substrate 60 are provided. The solder 62 is electrically connected, and the solder 62 is electrically connected to the conductive layer 61.

The step of transferring includes heating the solder 62 and the pins 411 of the electronic component 41 to fix the electronic component 41 at an appropriate position on the circuit substrate 60, and to form the pin 411 of the electronic component 41 and the conductive layer 61 of the circuit substrate 60. Electrical connection.

As shown in FIGS. 12 and 13, the arrangement of the electronic components 41 on the circuit substrate 60 is different from the arrangement of the electronic components 41 on the carrier substrate 40, and the arrangement of the electronic components 41 can be efficiently transferred or changed. In other embodiments. In this way, electronic components can also be carried or picked up by the method of creation.

Further, with reference to FIGS. 12 and 13, the circuit substrate 60 may retain a plurality of solders, and the remaining solders 62 are electrically connected to the adjacent electronic components 41. The creation can also be used to repair the work. As shown in Fig. 14, when the function of the test circuit substrate 60 is found to be damaged or malfunctioning, one or more of the electronic components 43 can be repaired by the method of the present invention.

The electronic component 43 that finds the abnormal function in FIG. 14 can establish the relevant position by means of image recognition and human eye judgment, and retain the corresponding electric charge on the transfer substrate 20 by the above method to adsorb the electronic component 45 (eg, As shown in Fig. 15 , the electronic component 45 on the transfer substrate 20 is finally transferred to the target substrate for repair, and Fig. 16 shows the result of the final repair, so as to improve the repair efficiency. Among them, functional testing, image recognition and human eye judgment are known technologies, and will not be described here.

In other embodiments, the pin 411 of the electronic component 41 may be shielded by two or more conversions of the target substrate. Further, in other embodiments, the target substrate of steps 14 and 15 of FIG. 1 may be a circuit substrate.

Although the activation and transfer steps in the above embodiments are all performed by an electrostatic program to complete the mobile electronic component, in other embodiments, the movement can be achieved by one of a program of magnetic force, van der Waals force, vacuum, and adhesive. The purpose of huge electronic components.

The activation, introduction and retransmission steps in Figure 1 or Figure 2 can all be performed by a partial roll program. As shown in FIG. 17, the scrolling program is to arrange the electronic components 41 through the device 70. The device 70 includes a first transport system 71, a second transport system 72, a durum 73, and an activation system 74. The first transport system 71 is used to transport the carrier substrate 40. The second transport system 72 is used to transport the target substrate 50. The first transport system 71 and the second transport system 72 respectively have a plurality of support rollers 711, 721 for supporting and transporting the carrier substrate 40 and the target substrate 50, but in other embodiments, the first transport system 71 and the second transport System 72 can also transport substrates via air pressure, vacuum, track, and the like. The photosensitive drum 73 is rotatable and has a photoconductor layer 731 (adsorption layer). The function and structure of the photosensitive drum 73 are the same as those of the above-described transfer substrate, except for the appearance. Therefore, the appearance of the transfer substrate may be other geometric shapes. The activation system 74 selectively exposes at least a portion of the photoconductor layer 731 of the rotating photosensitive drum 73 so that the unexposed portion of the photoconductor layer 731 is attractive to the electronic component 41. The activation system 74 includes a lighting module 741 and a scanning module 742. The illumination module 741 irradiates the photoconductor layer 731 of the photosensitive drum 73 with electromagnetic waves 743, that is, exposure. The scanning module 742 scans the photoconductor layer 731 of the photosensitive drum 73.

The photosensitive drum 73 is continuously rotated, and the photoconductor layer 731 is attached to the electronic components 41 of the carrier substrate 40, and the attached electronic components 41 are transferred to corresponding positions of the target substrate 50.

Compared with FIG. 17, the carrier substrate and the target substrate may be selected as a soft material, such as a peelable dry film. As shown in FIG. 18, the first transport system 71 drives the carrier substrate 40 to move by rotating the support roller 711. When the electronic component 41 approaches the photosensitive drum 73, the photoconductor layer 731 of the photosensitive drum 73 is attached to the electronic component 41, and therefore, the arrangement of the electronic component 41 can be changed by controlling the rotational speed of the photosensitive drum 73. Finally, the photosensitive drum 73 drives the pair of the electronic component 41 to the target substrate 50. In position, the electronic component 41 and the pins of the conductive layer of the target substrate 50 are electrically connected. In particular, in this embodiment, the electronic component 41 is in contact with the target substrate 50 to form a connection. Therefore, the support roller 722 of the second transportation system 72 can support the flexible target substrate 50 to ensure that the electronic component 41 is switched to the target substrate 50. . However, in other embodiments, the connection manner of the electronic component 41 and the target substrate 50 may also be non-contact.

Further, a plurality of combinations of the photosensitive drums may be selected to adjust the arrangement of the electronic components 41 in accordance with the arrangement of the conductive layer pins of the target substrate. Continuing with the description of Fig. 17, in Fig. 19, the photosensitive drums 73, 75 are selected to be one large and one small, and therefore, two sets of activation systems 74, 76 are also required. The photoconductor layers 731 and 751 of the small photosensitive drum 73 and the large photosensitive drum 75 are activated by the electromagnetic waves 743 and 763 generated by the activation systems 74 and 76, respectively. The small photosensitive drum 73 first attaches the electronic component 41 from the carrier substrate 41, then the large photosensitive drum 75 attaches the electronic component 41 from the small photosensitive drum 73, and finally the electronic photosensitive member 74 attaches the electronic component 74 to the corresponding position of the target substrate 50. .

In other embodiments, the apparatus is also suitable for a hybrid application of a soft board and a hard board material, and a combination of photosensitive drums of various sizes, and the number of photosensitive drums may be two or more. Further, as apparent from the description of Figs. 1-16, the present invention can also be carried out using other devices, and is not limited to the scrolling device.

Thus, the method of changing the arrangement of electronic components of the present invention can efficiently manufacture the arrangement of electronic components on the electronic circuit, and can quickly change the distribution of the adsorption region of the transfer substrate, and can adapt to various circuit configurations.

Finally, it is emphasized that the constituent elements disclosed in the foregoing embodiments are merely illustrative and are not intended to limit the scope of the present invention. The substitution or variation of other equivalent elements should also be covered by the scope of the patent application of the present application. .

Claims (9)

An apparatus for changing an arrangement of electronic components, comprising: a first transportation system, conveying a carrier substrate, the carrier substrate having a plurality of electronic components, the electronic components being arranged in a first manner; and a second transportation system conveying a target a substrate; a photosensitive drum that is rotatable and has an adsorption layer; and an activation system that selectively activates one or more regions of the adsorption layer of the photosensitive drum that is rotating to activate the one or The plurality of regions are attractive to the electronic components; wherein the photosensitive drum is continuously rotated, the adsorption layer is attached to the electronic components of the carrier substrate, and the attached electronic components are reprinted to the target substrate A second mode arrangement is formed corresponding to the position, and the second mode arrangement is different from the first mode arrangement. The device for changing the arrangement of electronic components according to claim 1, wherein the carrier substrate is a wafer, and the electronic components are wafers, and the first mode arrangement is a fixed pitch. The apparatus for changing the arrangement of electronic components according to claim 1, wherein the pitch of the second mode arrangement is greater than the pitch of the first mode arrangement. The device for changing the arrangement of electronic components according to the first aspect of the invention, wherein the activation system comprises a lighting module and a scanning module, the lighting module exposing the adsorption layer of the photosensitive drum, the scanning module The group scans the adsorption layer of the photosensitive drum. An apparatus for changing an arrangement of electronic components according to claim 4, wherein the adsorption layer is a photoconductor layer. An apparatus for changing an arrangement of electronic components according to claim 1, wherein the entire surface of the adsorption layer has a charge; and the activation system irradiates electromagnetic waves to a portion of the surface of the photosensitive drum to remove charges and to make no charge The surface forms one or more adsorption zones. An apparatus for changing an arrangement of electronic components, as described in claim 6, wherein the electronic The component has a charge. An apparatus for changing an arrangement of electronic components according to claim 1, wherein the entire surface of the adsorption layer has a charge; and the activation system illuminates electromagnetic waves to a portion of the surface of the photosensitive drum to remove charges and to have an electric charge. The surface forms one or more adsorption zones. The apparatus for changing the arrangement of electronic components of claim 8, wherein the electronic component has an opposite charge, the polarity of the opposite charge being opposite to the polarity of the charge of the one or more adsorption regions.