TWM556721U - Adhesion structure of peeling device of flexible substrate carried on bearing plate - Google Patents

Adhesion structure of peeling device of flexible substrate carried on bearing plate Download PDF

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Publication number
TWM556721U
TWM556721U TW106216343U TW106216343U TWM556721U TW M556721 U TWM556721 U TW M556721U TW 106216343 U TW106216343 U TW 106216343U TW 106216343 U TW106216343 U TW 106216343U TW M556721 U TWM556721 U TW M556721U
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TW
Taiwan
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sealing ring
gas permeable
flexible sealing
flexible substrate
peeling
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TW106216343U
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Chinese (zh)
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Kun-Lin Chou
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Eclat Forever Machinery Co Ltd
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Priority to TW106216343U priority Critical patent/TWM556721U/en
Publication of TWM556721U publication Critical patent/TWM556721U/en

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Abstract

本創作係提供一種承載於承載板之可撓性基板的剝離裝置之吸附結構,係包含有一剝離組件;設於該剝離組件底面之一可撓性封圈,該可撓性封圈之截面係呈L型;以及頂面係連接該剝離組件之底面之一第一多孔隙材料層,該第一多孔隙材料層設於該可撓性封圈內。藉此,可將剝離組件設於剝離裝置之相關抽氣設備進行使用,而於吸附可撓性基板時,由於可撓性封圈與可撓性基板之接觸面積小,容易使可撓性基板的周圍產生形變,以達到使可撓性基板易於從承載板上剝離之功效。The present invention provides an adsorption structure of a peeling device carried on a flexible substrate of a carrier sheet, comprising a peeling assembly; a flexible sealing ring disposed on a bottom surface of the peeling assembly, the cross section of the flexible sealing ring An L-shaped; and a top surface is coupled to one of the bottom surfaces of the stripping assembly, the first porous material layer, the first porous material layer being disposed within the flexible sealing ring. Thereby, the peeling module can be used in the relevant suction device of the peeling device, and when the flexible substrate is adsorbed, since the contact area between the flexible sealing ring and the flexible substrate is small, the flexible substrate is easily formed. The deformation around the periphery is achieved to achieve the effect of facilitating the peeling of the flexible substrate from the carrier sheet.

Description

承載於承載板之可撓性基板的剝離裝置之吸附結構Adsorption structure of peeling device carried on flexible substrate of carrier plate

本創作係關於一種承載於承載板之可撓性基板的剝離裝置之吸附結構,尤指一種可運用於可撓性基板之剝離裝置者。The present invention relates to an adsorption structure of a peeling device for a flexible substrate carried on a carrier sheet, and more particularly to a peeling device that can be applied to a flexible substrate.

按,一般習用承載於承載板之可撓性基板之剝離裝置,通常會搭配一剝離組件進行使用,而該剝離組件係由相互層疊之支撐板與多孔隙材料所構成,而於該多孔隙材料之周緣係分別設有一密封件;藉此,可以多孔隙材料接觸該可撓性基板,並以抽氣設備連接至該剝離組件,使該支撐板與多孔隙材料之間利用密封件形成氣密,且由抽氣設備之吸力而讓可撓性基板壓縮多孔隙材料與密封件產生形變,進而將可撓性基板加以從一載載板上剝離,以便移至後續之相關製程。Generally, a peeling device for a flexible substrate carried on a carrier sheet is generally used in combination with a peeling member which is composed of a support plate and a porous material which are laminated to each other, and the porous material is formed. The periphery is respectively provided with a sealing member; thereby, the porous substrate can be contacted with the porous material, and connected to the peeling assembly by a suction device, so that the sealing plate and the porous material are sealed with airtightness. And the flexible substrate compresses the porous material and the sealing member by the suction of the suction device, thereby peeling the flexible substrate from a carrier plate for moving to a subsequent related process.

然,以習用之剝離組件而言,其係以多孔隙材料直接接觸可撓性基板而加以從承載板上吸附剝離可撓性基板,然而由於該多孔隙材料係具有一預定之體積與厚度,使得該多孔隙材料而之變形量有限,進而影響多孔隙材料之吸附效能。However, in the case of conventional peeling components, the porous substrate is directly contacted with the flexible substrate to adsorb the flexible substrate from the carrier sheet, however, since the porous material has a predetermined volume and thickness, The porosity of the porous material is limited, thereby affecting the adsorption efficiency of the porous material.

因此,如何創作出一種承載於承載板之可撓性基板的剝離裝置之吸附結構,以使其可獲得較佳之吸附方式,而達到使可撓性基板易於從承載板上剝離的目的,藉以有效改善習用之缺失,將是本創作所欲積極揭露之處。Therefore, how to create an adsorption structure of a peeling device carried on a flexible substrate of a carrier plate, so that a better adsorption mode can be obtained, and the flexible substrate can be easily peeled off from the carrier plate, thereby effectively Improving the lack of customary use will be the active disclosure of this creative work.

有鑑於上述習知技術之缺憾,創作人有感其未臻於完善,遂竭其心智悉心研究克服,進而研發出一種承載於承載板之可撓性基板的剝離裝置之吸附結構,以期可達到使可撓性基板易於從承載板上剝離的目的。In view of the shortcomings of the above-mentioned prior art, the creator feels that he has not perfected it, exhausted his mind to study and overcome it, and developed an adsorption structure of a peeling device carried on a flexible substrate of a carrier plate, with a view to achieving The purpose of making the flexible substrate easy to peel off from the carrier sheet.

為達上述目的及其他目的,本創作係提供一種承載於承載板之可撓性基板的剝離裝置之吸附結構,其包含有:一剝離組件;設於該剝離組件底面之一可撓性封圈,該可撓性封圈之截面係呈L型;以及設於該可撓性封圈內且頂面係連接該剝離組件之底面之一第一多孔隙材料層。To achieve the above and other objects, the present invention provides an adsorption structure of a peeling device carried on a flexible substrate of a carrier sheet, comprising: a peeling assembly; and a flexible sealing ring disposed on a bottom surface of the peeling assembly The flexible sealing ring has an L-shaped cross section; and a first porous material layer disposed in the flexible sealing ring and the top surface is connected to one of the bottom surfaces of the peeling assembly.

上述之承載於承載板之可撓性基板的剝離裝置之吸附結構中,該剝離組件係包括有一透氣下板、一透氣上板、至少一第二多孔隙材料層及一可撓性密封環,該第二多孔隙材料層係設於該透氣下板之頂面,該透氣上板係層疊於該第二多孔隙材料層之頂面,使該第二多孔隙材料層夾設於該透氣下板與該透氣上板之間,而該可撓性封圈及該第一多孔隙材料層係設於該透氣下板之底面,該可撓性密封環係密封該透氣下板、該透氣上板與該第二多孔隙材料層之周緣,該可撓性密封環之截面係呈弧型。In the above-mentioned adsorption structure of the peeling device of the flexible substrate of the carrier plate, the peeling assembly comprises a gas permeable lower plate, a gas permeable upper plate, at least a second porous material layer and a flexible sealing ring. The second porous material layer is disposed on the top surface of the gas permeable lower plate, and the gas permeable upper plate is laminated on the top surface of the second porous material layer, so that the second porous material layer is sandwiched by the gas permeable layer Between the plate and the gas permeable upper plate, the flexible sealing ring and the first porous material layer are disposed on a bottom surface of the gas permeable lower plate, the flexible sealing ring sealing the gas permeable lower plate, the gas permeable upper surface A perimeter of the plate and the second layer of porous material, the flexible seal ring having an arcuate profile.

上述之承載於承載板之可撓性基板的剝離裝置之吸附結構中,該透氣下板係具有多數下通氣孔,該等下通氣孔位於該可撓性密封環內,該透氣上板係具有多數上通氣孔,該等上通氣孔位於該可撓性密封環內。In the above-mentioned adsorption structure of the peeling device of the flexible substrate of the carrier plate, the gas permeable lower plate has a plurality of lower vent holes, and the lower vent holes are located in the flexible sealing ring, and the gas permeable upper plate has Most of the upper vents are located within the flexible sealing ring.

上述之承載於承載板之可撓性基板的剝離裝置之吸附結構中,該可撓性密封環係包含有一第一貼附環部、一第二貼附環部及一變形環部,該變形環部之截面係呈弧型,該第一貼附環部係與該第二貼附環部相對向,該變形環部係連接於該第一貼附環部與該第二貼附環部之一端緣,且該第一貼附環部之底面係結合於該透氣上板之頂面,該第二貼附環部之頂面係結合於該透氣下板之底面,而該變形環部係位於該透氣下板、該透氣上板與該第二等多孔隙材料層之周緣。In the above-mentioned adsorption structure of the peeling device of the flexible substrate of the carrier plate, the flexible sealing ring comprises a first attaching ring portion, a second attaching ring portion and a deforming ring portion, the deformation The cross section of the ring portion has an arc shape, and the first attaching ring portion is opposite to the second attaching ring portion, and the deforming ring portion is coupled to the first attaching ring portion and the second attaching ring portion One end edge, and the bottom surface of the first attachment ring portion is coupled to the top surface of the gas permeable upper plate, and the top surface of the second attachment ring portion is coupled to the bottom surface of the gas permeable lower plate, and the deformation ring portion And a periphery of the gas permeable lower plate, the gas permeable upper plate and the second porous material layer.

上述之承載於承載板之可撓性基板的剝離裝置之吸附結構中,該可撓性密封環係為橡膠、矽膠、PU或PE之材質。In the above-mentioned adsorption structure of the peeling device of the flexible substrate of the carrier sheet, the flexible sealing ring is made of rubber, silicone, PU or PE.

上述之承載於承載板之可撓性基板的剝離裝置之吸附結構中,該可撓性封圈係包括有一第一表面、一第二表面及一缺口部,該第一表面係位於該可撓性封圈之頂面且連接至該剝離組件之底面,該第二表面係位於該可撓性封圈之底面,該缺口部係位於該可撓性封圈之外側且鄰近該第二表面。In the above-mentioned adsorption structure of the stripping device of the flexible substrate of the carrier plate, the flexible sealing ring includes a first surface, a second surface and a notch, the first surface being located at the flexible The top surface of the sealing ring is connected to the bottom surface of the peeling assembly, and the second surface is located on the bottom surface of the flexible sealing ring, and the notch portion is located on the outer side of the flexible sealing ring and adjacent to the second surface.

上述之承載於承載板之可撓性基板的剝離裝置之吸附結構中,該第一表面係大於該第二表面。In the above-mentioned adsorption structure of the peeling device of the flexible substrate of the carrier sheet, the first surface is larger than the second surface.

藉此,本創作之承載於承載板之可撓性基板的剝離裝置之吸附結構,可將剝離組件設於剝離裝置之相關抽氣設備進行使用,而於吸附可撓性基板時,由於可撓性封圈與可撓性基板之接觸面積小,容易使可撓性基板的周圍產生形變,以達到使可撓性基板易於從承載板上剝離的目的。Therefore, the adsorption structure of the stripping device of the flexible substrate supported by the present invention can be used by the stripping device in the relevant pumping device of the stripping device, and is flexible when the flexible substrate is adsorbed. The contact area between the sealing ring and the flexible substrate is small, and it is easy to deform the periphery of the flexible substrate to facilitate the peeling of the flexible substrate from the carrier sheet.

為充分瞭解本創作之目的、特徵及功效,茲藉由下述具體之實施例,並配合所附之圖式,對本創作做一詳細說明,說明如後:In order to fully understand the purpose, features and effects of this creation, the following specific examples, together with the attached drawings, provide a detailed description of the creation, as explained below:

請參閱圖1至圖2,如圖所示:本創作係一種承載於承載板之可撓性基板的剝離裝置之吸附結構,其至少係由一剝離組件1、一可撓性封圈2以及一第一多孔隙材料層6所構成。Referring to FIG. 1 to FIG. 2 , the present invention is an adsorption structure of a peeling device of a flexible substrate supported on a carrier board, which is at least composed of a peeling component 1 , a flexible sealing ring 2 , and A first layer of porous material 6 is formed.

該可撓性封圈2係設於該剝離組件1之底面,該可撓性封圈2之截面係呈L型。The flexible sealing ring 2 is disposed on the bottom surface of the peeling assembly 1, and the flexible sealing ring 2 has an L-shaped cross section.

該第一多孔隙材料層6係設於該可撓性封圈2內且頂面係連接該剝離組件1之底面。The first porous material layer 6 is disposed in the flexible sealing ring 2 and the top surface is connected to the bottom surface of the peeling assembly 1.

於本創作之一實施例中,該剝離組件1係包括有一透氣下板11、一透氣上板12、至少一第二多孔隙材料層13及一可撓性密封環14,該第二多孔隙材料層13係設於該透氣下板11之頂面,該透氣上板12係層疊於該第二多孔隙材料層13之頂面,使該第二多孔隙材料層13夾設於該透氣下板11與該透氣上板12之間,而該可撓性封圈2之頂面及該第一多孔隙材料層6之頂面係設於該透氣下板11之底面,該可撓性密封環14係密封該透氣下板11、該透氣上板12與該第二多孔隙材料層13之周緣,該可撓性密封環14之截面係呈弧型,該透氣下板11係具有多數下通氣孔111,該等下通氣孔111位於該可撓性密封環14內,該透氣上板12係具有多數上通氣孔121,該等上通氣孔121位於該可撓性密封環14內。In an embodiment of the present invention, the peeling assembly 1 includes a gas permeable lower plate 11, a gas permeable upper plate 12, at least one second porous material layer 13 and a flexible sealing ring 14, the second porous The material layer 13 is disposed on the top surface of the gas permeable lower plate 11, and the gas permeable upper plate 12 is laminated on the top surface of the second porous material layer 13, so that the second porous material layer 13 is sandwiched by the gas permeable layer. Between the plate 11 and the gas permeable upper plate 12, and the top surface of the flexible sealing ring 2 and the top surface of the first porous material layer 6 are disposed on the bottom surface of the gas permeable lower plate 11, the flexible sealing The ring 14 seals the periphery of the gas permeable lower plate 11, the gas permeable upper plate 12 and the second porous material layer 13, the flexible sealing ring 14 has an arc shape, and the gas permeable lower plate 11 has a plurality of lower portions. The venting holes 111 are located in the flexible sealing ring 14 . The venting upper plate 12 has a plurality of upper venting holes 121 , and the upper venting holes 121 are located in the flexible sealing ring 14 .

另外,該可撓性密封環14係包含有一第一貼附環部141、一第二貼附環部142及一變形環部143,該變形環部143之截面係呈弧型,該第一貼附環部141係與該第二貼附環部142相對向,該變形環部143係連接於該第一貼附環部141與該第二貼附環部142之一端緣,且該第一貼附環部141之底面係結合於該透氣上板12之頂面,該第二貼附環部142之頂面係結合於該透氣下板11之底面,而該變形環部143係位於該透氣下板11、該透氣上板12與該第二多孔隙材料層13之周緣,該可撓性密封環14係為橡膠、矽膠、PU或PE之材質。In addition, the flexible sealing ring 14 includes a first attaching ring portion 141, a second attaching ring portion 142 and a deforming ring portion 143. The deforming ring portion 143 has an arc shape, the first The attaching ring portion 141 is opposite to the second attaching ring portion 142, and the deforming ring portion 143 is connected to one end edge of the first attaching ring portion 141 and the second attaching ring portion 142, and the first The bottom surface of the attachment ring portion 141 is coupled to the top surface of the gas permeable upper plate 12, and the top surface of the second attachment ring portion 142 is coupled to the bottom surface of the gas permeable lower plate 11, and the deformation ring portion 143 is located The gas permeable lower plate 11, the gas permeable upper plate 12 and the periphery of the second porous material layer 13, the flexible sealing ring 14 is made of rubber, silicone, PU or PE.

於本創作之一實施例中,該可撓性封圈2係包括有一第一表面21、一第二表面22及一缺口部23,該第一表面21係位於該可撓性封圈2之頂面且連接至該剝離組件1之透氣下板11之底面,該第二表面22係位於該可撓性封圈2之底面且連接至一可撓性基板5之頂面,該缺口部23係位於該可撓性封圈2之外側且鄰近該第二表面22,而該第一表面21係大於該第二表面22。In one embodiment of the present invention, the flexible sealing ring 2 includes a first surface 21, a second surface 22 and a notch 23, the first surface 21 being located in the flexible sealing ring 2 The top surface is connected to the bottom surface of the gas permeable lower plate 11 of the peeling assembly 1, and the second surface 22 is located on the bottom surface of the flexible sealing ring 2 and is connected to the top surface of a flexible substrate 5, the notch portion 23 It is located on the outer side of the flexible sealing ring 2 and adjacent to the second surface 22, and the first surface 21 is larger than the second surface 22.

當運用時,係將該剝離組件1設於剝離裝置之相關抽氣設備之固定座4下方,並以該可撓性封圈2及該第一多孔隙材料層6接觸該可撓性基板5 ,當該抽氣設備啓動時,係由該透氣上板12與該透氣下板11壓縮該第二多孔隙材料層13,並連帶使得該可撓性密封環14產生形變,藉以由該透氣上板12之該等上通氣孔121、該透氣下板11之該等下通氣孔111、該第二多孔隙材料層13以及該第一多孔隙材料層6相互配合,而對該可撓性基板5產生一吸附力,進而將該可撓性基板5從一承載板3上加以剝離,該承載板3可為承載玻璃且可由另一抽氣設備吸附固定;由於該剝離組件1與該可撓性基板5之間係設置該可撓性封圈2及該第一多孔隙材料層6,因此,於該承載板3上吸附該可撓性基板5時,係可藉由該可撓性封圈2之第二表面22,使該可撓性封圈2與該可撓性基板5間之接觸面積較小,而於剝離組件1進行吸附時,容易使該可撓性基板5的周圍產生形變,藉以可獲得較佳之吸附方式,而達到使可撓性基板易於從承載板上剝離之功效。When applied, the stripping assembly 1 is disposed under the fixing seat 4 of the associated pumping device of the stripping device, and the flexible substrate 2 and the first porous material layer 6 are in contact with the flexible substrate 5 When the air suction device is activated, the second porous material layer 13 is compressed by the gas permeable upper plate 12 and the gas permeable lower plate 11 and is coupled to cause the flexible sealing ring 14 to be deformed, thereby being ventilated. The upper venting holes 121 of the plate 12, the lower venting holes 111 of the ventilating lower plate 11, the second porous material layer 13 and the first porous material layer 6 cooperate with each other to the flexible substrate 5, generating an adsorption force, and then peeling the flexible substrate 5 from a carrier plate 3, the carrier plate 3 may be a carrier glass and may be adsorbed and fixed by another suction device; due to the peeling assembly 1 and the flexible The flexible sealing ring 2 and the first porous material layer 6 are disposed between the substrate 5, so that when the flexible substrate 5 is adsorbed on the carrier plate 3, the flexible sealing can be sealed by the flexible substrate 5 The second surface 22 of the ring 2 makes the contact area between the flexible sealing ring 2 and the flexible substrate 5 small, and Peeling adsorption assembly 1, the easily flexible substrate 5 around the deformed, thereby obtained adsorbed preferred embodiment, the flexible substrate can be achieved so easily peeled off from the carrier plate efficacy.

本創作在上文中已以較佳實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本創作,而不應解讀為限制本創作之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本創作之範疇內。因此,本創作之保護範圍當以申請專利範圍所界定者為準。The present invention has been disclosed in the above preferred embodiments, and it should be understood by those skilled in the art that the present invention is only intended to depict the present invention and should not be construed as limiting the scope of the present invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of this creation is subject to the definition of the scope of patent application.

1‧‧‧剝離組件
11‧‧‧透氣下板
111‧‧‧下通氣孔
12‧‧‧透氣上板
121‧‧‧上通氣孔
13‧‧‧第二多孔隙材料層
14‧‧‧可撓性密封環
141‧‧‧第一貼附環部
142‧‧‧第二貼附環部
143‧‧‧變形環部
2‧‧‧可撓性封圈
21‧‧‧第一表面
22‧‧‧第二表面
23‧‧‧缺口部
3‧‧‧承載板
4‧‧‧固定座
5‧‧‧可撓性基板
6‧‧‧第一多孔隙材料層
1‧‧‧ peeling components
11‧‧‧Ventilated lower plate
111‧‧‧ lower vent
12‧‧‧ Breathable upper plate
121‧‧‧Upper vent
13‧‧‧Second porous material layer
14‧‧‧Flexible seal ring
141‧‧‧First Attachment Ring
142‧‧‧Second Attachment Ring
143‧‧‧Transformation ring
2‧‧‧Flexible seal
21‧‧‧ first surface
22‧‧‧ second surface
23‧‧‧Gap section
3‧‧‧Loading board
4‧‧‧ Fixed seat
5‧‧‧Flexible substrate
6‧‧‧First porous material layer

[圖1]係本創作較佳具體實施例之剖面狀態示意圖。 [圖2]係本創作較佳具體實施例之可撓性封圈外觀示意圖。Fig. 1 is a schematic cross-sectional view showing a preferred embodiment of the present invention. [Fig. 2] is a schematic view showing the appearance of a flexible sealing ring in a preferred embodiment of the present invention.

Claims (7)

一種承載於承載板之可撓性基板的剝離裝置之吸附結構,係包含: 一剝離組件; 一可撓性封圈,係設於該剝離組件之底面,該可撓性封圈之截面係呈L型;以及 一第一多孔隙材料層,其設於該可撓性封圈內且頂面係連接該剝離組件之底面。An adsorption structure of a peeling device of a flexible substrate supported on a carrier board comprises: a peeling component; a flexible sealing ring disposed on a bottom surface of the peeling component, the flexible sealing ring has a cross section L-shaped; and a first porous material layer disposed in the flexible sealing ring and the top surface is connected to the bottom surface of the peeling assembly. 如請求項1所述之承載於承載板之可撓性基板的剝離裝置之吸附結構,其中該剝離組件係包括有一透氣下板、一透氣上板、至少一第二多孔隙材料層及一可撓性密封環,該第二多孔隙材料層係設於該透氣下板之頂面,該透氣上板係層疊於該第二多孔隙材料層之頂面,使該第二多孔隙材料層夾設於該透氣下板與該透氣上板之間,而該可撓性封圈及該第一多孔隙材料層係設於該透氣下板之底面,該可撓性密封環係密封該透氣下板、該透氣上板與該第二多孔隙材料層之周緣,該可撓性密封環之截面係呈弧型。The adsorption structure of the peeling device of the flexible substrate of the carrier sheet according to claim 1, wherein the peeling assembly comprises a gas permeable lower plate, a gas permeable upper plate, at least one second porous material layer and a a flexible sealing ring, the second porous material layer is disposed on a top surface of the gas permeable lower plate, and the gas permeable upper plate is laminated on a top surface of the second porous material layer to sandwich the second porous material layer Provided between the gas permeable lower plate and the gas permeable upper plate, and the flexible sealing ring and the first porous material layer are disposed on the bottom surface of the gas permeable lower plate, the flexible sealing ring sealing the gas permeable a periphery of the plate, the gas permeable upper plate and the second porous material layer, the flexible sealing ring having an arc shape. 如請求項2所述之承載於承載板之可撓性基板的剝離裝置之吸附結構,其中該透氣下板係具有多數下通氣孔,該等下通氣孔位於該可撓性密封環內,該透氣上板係具有多數上通氣孔,該等上通氣孔位於該可撓性密封環內。The adsorption structure of the peeling device of the flexible substrate of the carrier sheet according to claim 2, wherein the gas permeable lower plate has a plurality of lower vent holes, and the lower vent holes are located in the flexible sealing ring, The venting upper plate has a plurality of upper venting holes, the upper venting holes being located within the flexible sealing ring. 如請求項2所述之承載於承載板之可撓性基板的剝離裝置之吸附結構,其中該可撓性密封環係包含有一第一貼附環部、一第二貼附環部及一變形環部,該變形環部之截面係呈弧型,該第一貼附環部係與該第二貼附環部相對向,該變形環部係連接於該第一貼附環部與該第二貼附環部之一端緣,且該第一貼附環部之底面係結合於該透氣上板之頂面,該第二貼附環部之頂面係結合於該透氣下板之底面,而該變形環部係位於該透氣下板、該透氣上板與該第二多孔隙材料層之周緣。The adsorption structure of the peeling device of the flexible substrate of the carrier sheet according to claim 2, wherein the flexible sealing ring comprises a first attaching ring portion, a second attaching ring portion and a deformation a ring portion, the deformation ring portion has an arc shape, the first attachment ring portion is opposite to the second attachment ring portion, and the deformation ring portion is coupled to the first attachment ring portion and the first portion The bottom surface of the first attaching ring portion is coupled to the top surface of the gas permeable upper plate, and the top surface of the second attaching ring portion is coupled to the bottom surface of the gas permeable lower plate. The deformation ring portion is located at a periphery of the gas permeable lower plate, the gas permeable upper plate and the second porous material layer. 如請求項2所述之承載於承載板之可撓性基板的剝離裝置之吸附結構,其中該可撓性密封環係為橡膠、矽膠、PU或PE之材質。The adsorption structure of the peeling device of the flexible substrate of the carrier sheet according to claim 2, wherein the flexible sealing ring is made of rubber, silicone, PU or PE. 如請求項1所述之承載於承載板之可撓性基板的剝離裝置之吸附結構,其中該可撓性封圈係包括有一第一表面、一第二表面及一缺口部,該第一表面係位於該可撓性封圈之頂面且連接至該剝離組件之底面,該第二表面係位於該可撓性封圈之底面,該缺口部係位於該可撓性封圈之外側且鄰近該第二表面。The adsorption structure of the stripping device of the flexible substrate of the carrier sheet according to claim 1, wherein the flexible sealing ring comprises a first surface, a second surface and a notch, the first surface Located on the top surface of the flexible sealing ring and connected to the bottom surface of the peeling assembly, the second surface is located on the bottom surface of the flexible sealing ring, the notch portion is located on the outer side of the flexible sealing ring and adjacent to The second surface. 如請求項6所述之承載於承載板之可撓性基板的剝離裝置之吸附結構,其中該第一表面係大於該第二表面。The adsorption structure of the peeling device of the flexible substrate of the carrier sheet according to claim 6, wherein the first surface is larger than the second surface.
TW106216343U 2017-11-03 2017-11-03 Adhesion structure of peeling device of flexible substrate carried on bearing plate TWM556721U (en)

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Publication Number Publication Date
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