TWM553544U - Membrane thin color film - Google Patents
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本創作係有關於用於印刷電路板之覆蓋膜,尤係關於用於軟性印刷電路板之有色薄型化覆蓋膜及其製法。 The present invention relates to a cover film for a printed circuit board, and more particularly to a colored thinned cover film for a flexible printed circuit board and a method of making the same.
目前電子系統朝向輕薄短小、高耐熱性、多功能性、高密度化、高可靠性且低成本的方向發展,而在功能上,則需要強大且高速訊號傳輸。在高頻領域,無線基礎設施需要提供足夠低的插損、更低的介電常數與損耗,才能有效提高能源利用率。隨著5G時代與USB3.1等應用需求來臨,射頻產品需要提供更寬的頻寬,並且向下相容3G、4G業務。當前市面上的覆蓋膜的材料常見的是使用黑色聚醯亞胺薄膜,在薄型化的設計上,其瓶頸之處在於做出厚度在5μm以下的黑色聚醯亞胺有巨大困難,且加工操作性不好,此外,使用環氧樹脂系的接著劑存在離子純度不佳、電性不良和成本高昂之問題,這些都使得覆蓋膜難以應對當前超細線化線路和高頻高速傳輸的趨勢。而另一種油墨型的有色高頻覆蓋膜,係於5至7.5μm黃色超薄聚醯亞胺薄膜上塗佈有色油墨,但此方法同樣有成本高和厚度較大的問題。 At present, electronic systems are moving toward thin, short, high heat resistance, versatility, high density, high reliability, and low cost, while functionally, powerful and high-speed signal transmission is required. In the high-frequency field, wireless infrastructure needs to provide low enough insertion loss, lower dielectric constant and loss to effectively improve energy efficiency. With the advent of applications such as the 5G era and USB 3.1, RF products need to provide wider bandwidth and are compatible with 3G and 4G services. The material of the cover film currently on the market is commonly used with a black polyimide film. In the thin design, the bottleneck is that it is extremely difficult to make a black polyimine having a thickness of 5 μm or less, and the processing operation In addition, the use of an epoxy-based adhesive has problems of poor ion purity, poor electrical properties, and high cost, which makes it difficult for the cover film to cope with the current trend of ultra-fine line and high-frequency high-speed transmission. Another ink-type colored high-frequency cover film is coated with a colored ink on a 5 to 7.5 μm yellow ultra-thin polyimide film, but this method also has the problems of high cost and large thickness.
有鑑於此,業界仍需研發和改良覆蓋膜,俾滿足目前細線化線路的設計,並滿足其高耐熱性、多功能性、高密度化、高可靠性且低成本的發展方向,以及在功能上需要強大且高速訊號傳輸的需求。 In view of this, the industry still needs to develop and improve the cover film to meet the current design of thin wire, and to meet its high heat resistance, versatility, high density, high reliability and low cost development direction, as well as in function. There is a need for powerful and high speed signal transmission.
本創作提供一種有色薄型化覆蓋膜,其製造方法簡單,且該有色薄型化覆蓋膜具有極低的介電常數與損耗、極低的離子遷移性、良好的接著力、高散熱性、高柔軟性和低反彈力,可低溫加工,特別適合在當前線寬線距低於35/35μm的高密度組裝之高頻高速、超細線化線路中使用。 The present invention provides a colored thinned cover film, which is simple in manufacturing method, and has a low dielectric constant and loss, extremely low ion mobility, good adhesion, high heat dissipation, and high softness. It has low resilience and low temperature processing. It is especially suitable for high-frequency, high-speed, ultra-thin lined circuits with high-density assembly with a line width of less than 35/35μm.
本創作提供一種有色薄型化覆蓋膜,係包括:上離型層;有色油墨層,係形成於該上離型層上,且該有色油墨層的厚度為1至10μm;低介電膠層,係形成於該有色油墨層上,使該有色油墨層位於該上離型層和該低介電膠層之間,且該低介電膠層的厚度為3至25μm,並令該有色油墨層和該低介電膠層兩者的厚度之和為4至35μm;以及下離型層,係形成於該低介電膠層上,使該低介電膠層位於該有色油墨層和該下離型層之間。 The present invention provides a colored thinned cover film comprising: an upper release layer; a colored ink layer formed on the upper release layer, and the colored ink layer has a thickness of 1 to 10 μm; a low dielectric adhesive layer, Formed on the colored ink layer such that the colored ink layer is between the upper release layer and the low dielectric adhesive layer, and the low dielectric adhesive layer has a thickness of 3 to 25 μm, and the colored ink layer is formed And a thickness of both of the low dielectric adhesive layers is 4 to 35 μm; and a lower release layer is formed on the low dielectric adhesive layer such that the low dielectric adhesive layer is located under the colored ink layer and Between the release layers.
於一具體實施態樣中,該低介電膠層之Dk值為2.4至2.8(10GHz)、Df值為0.002至0.006(10GHz)、吸水率介於0.05至0.2%、線間絕緣阻抗大於1011Ω、表面電阻大於1012Ω,且體積電阻大於1013Ω‧cm。 In a specific embodiment, the low dielectric adhesive layer has a Dk value of 2.4 to 2.8 (10 GHz), a Df value of 0.002 to 0.006 (10 GHz), a water absorption ratio of 0.05 to 0.2%, and an interline insulation resistance of more than 10 11 Ω, surface resistance greater than 10 12 Ω, and volume resistance greater than 10 13 Ω ‧ cm.
於一具體實施態樣中,形成該低介電膠層的材料係包 括選自氟系樹脂、環氧樹脂、丙烯酸系樹脂、胺基甲酸酯系樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂和聚醯亞胺樹脂所組成群組中的至少一種樹脂。 In a specific embodiment, the material package of the low dielectric adhesive layer is formed The invention is selected from the group consisting of a fluorine resin, an epoxy resin, an acrylic resin, a urethane resin, a ruthenium rubber resin, a polyparaxylene resin, a bismaleimide resin, and a polyimide resin. At least one resin in the group consisting of.
於一具體實施態樣中,該低介電膠層包括燒結二氧化矽、鐵氟龍、氟系樹脂、磷系耐燃劑和聚醯亞胺樹脂,且該燒結二氧化矽、該鐵氟龍、該氟系樹脂和該磷系耐燃劑的總含量係佔該低介電膠層之總固含量的8至50重量%,該聚醯亞胺樹脂之含量係佔該低介電膠層之總固含量的40至90重量%。 In a specific embodiment, the low dielectric adhesive layer comprises sintered cerium oxide, Teflon, a fluorine resin, a phosphorus-based flame retardant, and a polyimide resin, and the sintered cerium oxide, the Teflon The total content of the fluorine-based resin and the phosphorus-based flame retardant is from 8 to 50% by weight based on the total solid content of the low dielectric adhesive layer, and the content of the polyimide resin is in the low dielectric adhesive layer. 40 to 90% by weight of the total solid content.
於一具體實施態樣中,形成該有色油墨層的材料係包括選自環氧樹脂、丙烯酸系樹脂、氨基甲酸酯系樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂、聚醯亞胺樹脂、聚醯胺醯亞胺及聚醯胺樹脂所組成群組中的至少一種樹脂。 In a specific embodiment, the material for forming the colored ink layer comprises an epoxy resin, an acrylic resin, a urethane resin, a ruthenium rubber resin, a polyparaxylene resin, and a double horse. At least one resin selected from the group consisting of a quinone imine resin, a polyimine resin, a polyamidimide, and a polyamide resin.
於一具體實施態樣中,形成該上離型層和該下離型層之材料係獨立選自聚丙烯、雙向拉伸聚丙烯和聚對苯二甲酸乙二醇酯所組成群組中的至少一種聚合物。 In one embodiment, the material forming the upper release layer and the lower release layer is independently selected from the group consisting of polypropylene, biaxially oriented polypropylene, and polyethylene terephthalate. At least one polymer.
於一具體實施態樣中,該燒結二氧化矽之含量係佔該低介電膠層之總固含量的2至15重量%,該鐵氟龍之含量係佔該低介電膠層之總固含量的2至10重量%,該氟系樹脂之含量係佔該低介電膠層之總固含量的2至10重量%,該磷系耐燃劑之含量係佔該低介電膠層之總固含量的2至15重量%。 In one embodiment, the content of the sintered cerium oxide is 2 to 15% by weight of the total solid content of the low dielectric adhesive layer, and the content of the Teflon is the total of the low dielectric adhesive layer. 2 to 10% by weight of the solid content, the content of the fluorine-based resin is 2 to 10% by weight of the total solid content of the low dielectric adhesive layer, and the content of the phosphorus-based flame retardant is occupied by the low dielectric adhesive layer. 2 to 15% by weight of the total solid content.
於一具體實施態樣中,該有色油墨層包括無機顏料或有機顏料,其中,該無機顏料為鎘紅、鎘檸檬黃、橘鎘黃、二氧化鈦、碳黑、黑色氧化鐵或黑色錯合無機顏料,該有機顏料為苯胺黑、苝黑、蒽醌黑、聯苯胺類黃色顏料、酞青藍或酞青綠。 In a specific embodiment, the colored ink layer comprises an inorganic pigment or an organic pigment, wherein the inorganic pigment is cadmium red, cadmium lemon yellow, orange cadmium yellow, titanium dioxide, carbon black, black iron oxide or black miscellaneous inorganic pigment. The organic pigment is aniline black, phthalocyanine, phthalocyanine, benzidine yellow pigment, indigo blue or indigo green.
於一具體實施態樣中,該有色油墨層的厚度為3至5μm,該低介電膠層的厚度為3至10μm。 In one embodiment, the colored ink layer has a thickness of 3 to 5 μm, and the low dielectric adhesive layer has a thickness of 3 to 10 μm.
根據本創作的有色薄型化覆蓋膜,至少具有以下優點:一、本創作採用低介電膠層,低介電較層的Dk值為2.4至2.8,且Df值為0.002至0.006,Dk/Df值較低,可減少信號傳輸過程中的損耗,進一步提高信號傳輸品質,完全能勝任FPC高頻高速化、散熱導熱快速化以及生產成本最低化發展的需求;二、本創作低介電膠層的配方中含有燒結二氧化矽、鐵氟龍、氟系樹脂、磷系耐燃劑和聚醯亞胺樹脂,使其具有較低的吸水率(0.05至0.2%),吸水後性能穩定,具有較佳的電氣性能,可減少訊號傳輸插入損耗;三、本創作的低介電膠層由於具有極低並且在高溫濕度環境下穩定的Dk/Df值,使得本創作適合低溫(低於190℃)固化,製程加工性強,而且對製作設備要求低,進而降低生產成本;四、本創作具有較低的反彈力,適合下游高密度組裝製程; 五、本創作有色油墨層和低介電膠層兩者的厚度之和最低可達4至7μm,符合目前FPC細線化線路的設計需求。 According to the colored thinned cover film of the present invention, at least the following advantages are obtained: 1. The low dielectric layer is used in the creation, and the Dk value of the low dielectric layer is 2.4 to 2.8, and the Df value is 0.002 to 0.006, Dk/Df. The lower value can reduce the loss during signal transmission, further improve the signal transmission quality, and fully meet the requirements of FPC high-speed high-speed, rapid heat dissipation and heat conduction, and minimum development cost. Second, the creation of low dielectric adhesive layer The formulation contains sintered cerium oxide, Teflon, fluorine resin, phosphorus-based flame retardant and polyimide resin, which has a low water absorption (0.05 to 0.2%) and stable performance after water absorption. Good electrical performance can reduce signal transmission insertion loss; Third, the low dielectric adhesive layer of this creation is suitable for low temperature (below 190 °C) due to its extremely low Dk/Df value in high temperature and humidity environment. ) curing, strong processability, and low requirements on production equipment, thereby reducing production costs; Fourth, the creation has a low rebound force, suitable for downstream high-density assembly process; 5. The sum of the thicknesses of the inventive colored ink layer and the low dielectric adhesive layer can be as low as 4 to 7 μm, which is in line with the design requirements of the current FPC thin line.
100‧‧‧上離型層 100‧‧‧Upper release layer
200‧‧‧有色油墨層 200‧‧‧Colored ink layer
201‧‧‧第一有色油墨層 201‧‧‧The first colored ink layer
202‧‧‧第二有色油墨層 202‧‧‧Second colored ink layer
300‧‧‧低介電膠層 300‧‧‧Low dielectric layer
400‧‧‧下離型層 400‧‧‧Under release layer
第1圖是本創作單層有色油墨層的結構示意圖;第2圖是本創作雙層有色油墨層的結構示意圖; Figure 1 is a schematic view showing the structure of the single-layer colored ink layer of the present invention; and Figure 2 is a schematic view showing the structure of the double-layer colored ink layer of the present invention;
以下藉由特定的具體實施例說明本創作之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本創作之其他優點及功效。 The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily appreciate other advantages and functions of the present invention from the disclosure of the present disclosure.
須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本創作可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本創作所能產生之功效及所能達成之目的下,均應仍落在本創作所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如「上」、「第一」、「第二」及「一」等之用語,亦僅為便於敘述之明瞭,而非用以限定本創作可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本創作可實施之範疇。 It is to be understood that the structure, the proportions, the size and the like of the drawings are only used in conjunction with the disclosure of the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effectiveness and the purpose of the creation. The technical content revealed by the creation can be covered. In the meantime, the terms "upper", "first", "second" and "one" as used in this specification are for convenience only, and are not intended to limit the scope of the creation of the creation. Changes or adjustments in their relative relationship are considered to be within the scope of the creation of the creation of the product without substantial changes.
如第1圖所示,本創作提供一種有色薄型化覆蓋膜,係包括上離型層100、有色油墨層200、低介電膠層300和下離型層400,該有色油墨層200位於該上離型層100和 該低介電膠層300之間,該低介電膠層300位於該有色油墨層200和該下離型層400之間。 As shown in FIG. 1, the present invention provides a colored thinned cover film comprising an upper release layer 100, a colored ink layer 200, a low dielectric adhesive layer 300 and a lower release layer 400, wherein the colored ink layer 200 is located thereon. Upper release layer 100 and Between the low dielectric adhesive layers 300, the low dielectric adhesive layer 300 is located between the colored ink layer 200 and the lower release layer 400.
該有色油墨層200和該低介電膠層300兩者的厚度之和為4至35μm,其中,該有色油墨層200的厚度為1至10μm,該低介電膠層300的厚度為3至25μm。 The sum of the thicknesses of both the colored ink layer 200 and the low dielectric adhesive layer 300 is 4 to 35 μm, wherein the colored ink layer 200 has a thickness of 1 to 10 μm, and the low dielectric adhesive layer 300 has a thickness of 3 to 25 μm.
此外,該低介電膠層300之Dk值為2.4至2.8(10GHz)、Df值為0.002至0.006(10GHz)、吸水率介於0.05至0.2%、線間絕緣阻抗大於1011Ω、表面電阻大於1012Ω,且體積電阻大於1013Ω‧cm。 In addition, the low dielectric adhesive layer 300 has a Dk value of 2.4 to 2.8 (10 GHz), a Df value of 0.002 to 0.006 (10 GHz), a water absorption ratio of 0.05 to 0.2%, an interline insulation resistance of more than 10 11 Ω, and a surface resistance. Greater than 10 12 Ω and volume resistance greater than 10 13 Ω ‧ cm.
形成該低介電膠層300的材料係包括選自氟系樹脂、環氧樹脂、丙烯酸系樹脂、胺基甲酸酯系樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂、聚醯亞胺樹脂、聚醯胺醯亞胺及聚醯胺樹脂所組成群組中的至少一種樹脂。 The material for forming the low dielectric adhesive layer 300 includes a selected from the group consisting of a fluorine resin, an epoxy resin, an acrylic resin, a urethane resin, a silicone rubber resin, a polyparaxylene resin, and a double horse. At least one resin selected from the group consisting of a quinone imine resin, a polyimine resin, a polyamidimide, and a polyamide resin.
該極低介電膠層300包括燒結二氧化矽、鐵氟龍、氟系樹脂、磷系耐燃劑和聚醯亞胺樹脂,且該燒結二氧化矽、該鐵氟龍、該氟系樹脂和該磷系耐燃劑的總含量係佔該低介電膠層之總固含量的8至50重量%,該聚醯亞胺樹脂之含量係佔該低介電膠層之總固含量的40至90重量%。 The extremely low dielectric adhesive layer 300 includes sintered cerium oxide, Teflon, a fluorine resin, a phosphorus-based flame retardant, and a polyimide resin, and the sintered cerium oxide, the Teflon, the fluorine resin, and The total content of the phosphorus-based flame retardant is 8 to 50% by weight of the total solid content of the low dielectric adhesive layer, and the content of the polyimide resin is 40% of the total solid content of the low dielectric adhesive layer. 90% by weight.
形成該有色油墨層200的材料係包括選自環氧樹脂、丙烯酸系樹脂、氨基甲酸酯系樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂、聚醯亞胺樹脂、聚醯胺醯亞胺及聚醯胺樹脂所組成群組中的至少一種樹脂。 The material for forming the colored ink layer 200 includes an epoxy resin, an acrylic resin, a urethane resin, a ruthenium rubber resin, a polyparaxylene resin, a bismaleimide resin, and a poly At least one resin selected from the group consisting of a quinone imine resin, a polyamidimide, and a polyamide resin.
形成該上離型層100和該下離型層400係為離型膜或 離型紙,且其二者材料係獨立選自聚丙烯、雙向拉伸聚丙烯和聚對苯二甲酸乙二醇酯所組成群組中的至少一種聚合物。 Forming the upper release layer 100 and the lower release layer 400 as a release film or The release paper, and the materials of the two are independently selected from the group consisting of polypropylene, biaxially oriented polypropylene, and polyethylene terephthalate.
該燒結二氧化矽之含量係佔該低介電膠層之總固含量的2至15重量%,該鐵氟龍之含量係佔該低介電膠層之總固含量的2至10重量%,該氟系樹脂之含量係佔該低介電膠層之總固含量的2至10重量%,該磷系耐燃劑之含量係佔該低介電膠層之總固含量的2至15重量%。 The content of the sintered cerium oxide is 2 to 15% by weight of the total solid content of the low dielectric adhesive layer, and the content of the Teflon is 2 to 10% by weight of the total solid content of the low dielectric adhesive layer. The content of the fluorine-based resin is 2 to 10% by weight of the total solid content of the low dielectric adhesive layer, and the content of the phosphorus-based flame retardant is 2 to 15 by weight of the total solid content of the low dielectric adhesive layer. %.
該有色油墨層200包括無機顏料或有機顏料,其中,該無機顏料為鎘紅、鎘檸檬黃、橘鎘黃、二氧化鈦、碳黑、黑色氧化鐵或黑色錯合無機顏料,該有機顏料為苯胺黑、苝黑、蒽醌黑、聯苯胺類黃色顏料、酞青藍或酞青綠。 The colored ink layer 200 includes an inorganic pigment or an organic pigment, wherein the inorganic pigment is cadmium red, cadmium citrate, orange cadmium yellow, titanium dioxide, carbon black, black iron oxide or black miscible inorganic pigment, and the organic pigment is aniline black. , black, black, benzidine yellow pigment, indigo blue or indigo green.
有色油墨層為紅色油墨層、黃色油墨層、黑色油墨層、白色油墨層、藍色油墨層或綠色油墨層。 The colored ink layer is a red ink layer, a yellow ink layer, a black ink layer, a white ink layer, a blue ink layer, or a green ink layer.
若要有色油墨層的表面為霧面,可將硫酸鈣、二氧化矽、二氧化鈦、硫化鋅、氧化鋯、碳酸鈣及黏土等任意組合搭配添加入油墨層中,達到消光目的,使得有色油墨層呈現霧面狀態。 If the surface of the colored ink layer is a matte surface, any combination of calcium sulfate, cerium oxide, titanium dioxide, zinc sulfide, zirconia, calcium carbonate and clay may be added to the ink layer to achieve the purpose of extinction, so that the colored ink layer A matte state is present.
該有色油墨層200的厚度為3至5μm,該低介電膠層300的厚度為3至10μm。本創作對於上離型層及下離型層的厚度並無特殊限制。 The colored ink layer 200 has a thickness of 3 to 5 μm, and the low dielectric adhesive layer 300 has a thickness of 3 to 10 μm. The present invention has no particular limitation on the thickness of the upper release layer and the lower release layer.
本創作之有色薄型化覆蓋膜的製備方法係包括下述步驟: 步驟一、在上離型層100的下表面塗佈有色油墨原 料,並於50至180℃固化該有色油墨原料,以形成有色油墨層200;步驟二、由塗佈法或轉印法將低介電膠層300形成於該有色油墨層200的下表面;以及步驟三、使下離型層400貼覆於該低介電膠層300的下表面。 The preparation method of the colored thinned cover film of the present invention comprises the following steps: Step 1. Applying a colored ink to the lower surface of the upper release layer 100 And curing the colored ink material at 50 to 180 ° C to form a colored ink layer 200; step 2, forming a low dielectric adhesive layer 300 on the lower surface of the colored ink layer 200 by a coating method or a transfer method; And step 3, the lower release layer 400 is attached to the lower surface of the low dielectric adhesive layer 300.
如第2圖所示,係為本創作有色薄型化覆蓋膜之另一實施態樣,該有色薄型化覆蓋膜可以依次包括上離型層100、第一有色油墨層201、第二有色油墨層202、低介電膠層300和下離型層400,即該有色油墨層具有兩層或甚至更多層。於一具體實施例中,該第一有色油墨層201和該第二有色油墨層202的厚度皆為2至3μm。第一有色油墨層201和第二有色油墨層202的雙層疊構有利於解決塗佈製程中存在的微孔問題。 As shown in FIG. 2, in another embodiment of the present invention, the colored thinned cover film may sequentially include an upper release layer 100, a first colored ink layer 201, and a second colored ink layer. 202. A low dielectric adhesive layer 300 and a lower release layer 400, that is, the colored ink layer has two or even more layers. In one embodiment, the first colored ink layer 201 and the second colored ink layer 202 each have a thickness of 2 to 3 μm. The double layered structure of the first colored ink layer 201 and the second colored ink layer 202 is advantageous for solving the micropore problems existing in the coating process.
下表1係記載本創作實施例1至實施例4之低介電膠層中燒結二氧化矽、鐵氟龍、氟系樹脂、磷系耐燃劑和聚醯亞胺系樹脂的具體重量百分比。 Table 1 below shows the specific weight percentages of sintered cerium oxide, Teflon, fluorine-based resin, phosphorus-based flame retardant, and polyimide-based resin in the low dielectric adhesive layers of the present invention examples 1 to 4.
下表2係記載實施例1至實施例4的低介電膠層、有色油墨層的具體疊構,且與現有FPC板進行基本性能比較,並將結果紀錄於表2中。 Table 2 below shows the specific stacking of the low dielectric adhesive layer and the colored ink layer of Examples 1 to 4, and the basic performance comparison with the existing FPC board, and the results are recorded in Table 2.
由表2可知,本創作的有色薄型化覆蓋膜具有較高的熱傳導係數、較低的熱傳導效率、較低的耐擊穿電壓和較低的Dk/Df值。 As can be seen from Table 2, the inventive colored thinned cover film has a higher heat transfer coefficient, lower heat transfer efficiency, lower breakdown voltage and lower Dk/Df value.
上述實施例係用以例示性說明本創作之原理及其功效,而非用於限制本創作。任何熟習此項技藝之人士均可在不違背本創作之精神及範疇下,對上述實施例進行修改。因此本創作之權利保護範圍,應如後述之申請專利範圍所列。 The above embodiments are intended to illustrate the principles of the present invention and its effects, and are not intended to limit the present invention. Anyone who is familiar with the art may modify the above embodiments without departing from the spirit and scope of the creation. Therefore, the scope of protection of this creation should be as listed in the scope of patent application described later.
100‧‧‧上離型層 100‧‧‧Upper release layer
200‧‧‧有色油墨層 200‧‧‧Colored ink layer
300‧‧‧低介電膠層 300‧‧‧Low dielectric layer
400‧‧‧下離型層 400‧‧‧Under release layer
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