TWM553055U - Distributed photoelectric module - Google Patents

Description

Decentralized photovoltaic module

This creation is about a decentralized optoelectronic module, especially a modular LED and power supply that simplifies the installation and maintenance of the optoelectronic module. When one or a few of the LED chips are damaged, the rest are The LED chip can maintain a predetermined brightness, and can be individually disassembled for maintenance, to achieve a photoelectric module of an LED lamp that can maintain a predetermined brightness and is easy to replace and repair.

According to the light-emitting diode (LED), it is a kind of luminescent semiconductor electronic component, which is a composite light source composed of trivalent and pentavalent elements. Such electronic components appeared as early as 1962, and only in the early days were able to emit low-light red light. Immediately afterwards, other versions of monochromatic light were developed, and today, the light that can be emitted has spread over visible light, infrared rays, and ultraviolet rays, and the luminosity has also increased to a relatively high degree. From the initial indicator lights and display panels, etc., with the advent of white light-emitting diodes, it has gradually developed into a lighting application in recent years.

The light-emitting diode can only be turned on in one direction (energized), which is called forward bias. When current flows, the electron and the hole overlap in each other to emit monochromatic light, which is called electroluminescence effect, and the light is The wavelength, color, and the type of semiconductor material used are related to the intentional incorporation of elemental impurities. Traditional light sources with high efficiency, long life, not easy to break, fast response, high reliability, etc. The advantages. The luminous efficiency of white LEDs has improved in recent years. The cost per thousand lumens has also been reduced due to the large amount of capital investment, and more and more are used in light sources.

The LED lamp used in the AC-DC power supply is usually connected in parallel or in series with a plurality of LED chips, and the LED lamp generates a stable bright source through the voltage regulator and the rectifier, and has a regulated driving mode or a constant current. Drive mode, in addition, AC power direct drive mode power supply and light source integrated on the same circuit board, with regulated drive mode or constant current drive mode, which is complicated by the circuit and LED wiring, and the power supply and light source are integrated The circuit board on the same circuit board is limited to a fixed power. If the power source or the light source fails, the entire group needs to be scrapped. The process needs to integrate surface adhesion and LED package process integration, which is costly.

However, as far as the above is concerned, the AC power supply directly drives the LED mode on the same substrate, the yield control of the extension process is not easy (especially LED Chip on Board), and the cost is high, and as a relatively large searchlight or outdoor When the lamp is used, when the internal LED chip is damaged, the overall brightness is lowered or even extinguished, and the user is dangerous because the LED lamp is dim or extinguished, and the maintenance is very difficult, and the professional needs to carry out the whole set of LED lights for the lamp. Disassembly and repair and replacement, so the general public can not immediately repair a single LED chip, and can only replace a new set of LED lights for use, therefore, the cost is also a burden for the user. It is a big drawback, and it needs to be improved.

This creation provides a decentralized photovoltaic module that includes: A set of connecting modules has a plurality of grouping ports, and the group of ports is further provided with a plurality of combining ends; a plurality of electrical connecting lines are pivotally disposed at the grouping module, and are arranged with each of the groups Each of the combined ends of the mouth is electrically connected; a plurality of connected terminals are disposed at the surface of the set of modules, and are electrically connected to the electrical connections; a plurality of LED chips are provided At the grouping port of the group of modules, there is a base end, which has a plate-like shape as a whole; an active end is disposed at one side of the base end for generating a light source; a plurality of connecting ends Each of the LED chips is electrically connected to the respective ends of the set of ports; an electronic circuit substrate is provided for each of the LED chips to maintain a predetermined brightness as a whole, and has a plurality of connection terminals a compensation circuit for sensing the damage of each of the LED chips, and enhancing the brightness of the remaining LED chips to complement and maintain the predetermined brightness; and a power connection end through which the power is supplied; and the connection ends Point, the compensation circuit and the power connection end are connected to the electronic circuit substrate The electrical connection state; a plurality of connecting lines, one end of each of the connecting lines is disposed at an electrical connection state of the assembly end of the connection module, and the other end is disposed at a connection end of the electronic circuit substrate The electrical connection state is provided; wherein the assembly module is presented in any one of a circuit board mode, a cable connection mode or a terminal block mode; wherein the component connection module is further provided with a circuit board mode a through hole passing through the front and rear ends for the connection line to pass through the through hole; Wherein the LED chip is selected from the group consisting of a wafer direct encapsulation technology (COB) or a surface mount (SMT) process technology; wherein the connection line is disposed in the assembly module and the electron In the case of the circuit board, it is connected by any one of a soldering method, a screw-locking method, a male-female plug method, and a latching method, and is electrically connected; wherein the assembly module is further provided with at least one heat dissipation. The unit is disposed in a state of being attached to the base end of each of the LED chips for heat dissipation during use; wherein the LED chip is disposed in the group by any one of a screw lock method, a soldering method, and a carding method. The power supply connection end of the electronic circuit substrate is presented in a grouping manner; wherein the power connection end of the electronic circuit substrate is presented in a grouping manner, and the male and female latches are further screw-locked The electronic circuit substrate is further provided with a conversion circuit, which is selected from the group consisting of an AC linear electronic circuit, and the compensation circuit is provided by any one of a mode and a card type. The connection between the power supply terminal was electrically connected state.

The main purpose of this creation is to: especially a modular LED and power supply, which simplifies the installation and maintenance of the photovoltaic module, wherein when the single or a few of the LED chips are damaged, the remaining LED chips are It can maintain the predetermined brightness, and can be disassembled for easy maintenance, and achieves the photoelectric module of the LED lamp which can maintain the predetermined brightness and is easy to replace and repair.

The main function of the decentralized photovoltaic module is that the creation is used for LED lighting, and the group module has a plurality of group ports, and the group is provided. There are a plurality of bonding ends for each of the LED chips, and each of the LED chips is individually selected from a wafer having a maximum brightness and slightly less than a predetermined brightness, and one or a few of the LED chips are available. In the event of a failure, the remaining LED chips are maintained at a predetermined brightness, and each of the LED chips has the base end, which is in a plate-like shape as a whole; the active end is disposed at one side of the base end for generating a light source. And a plurality of connecting ends respectively disposed at the base end and electrically connected to the respective connecting ends of the set of ports; and further comprising the connecting end points via the electronic circuit substrate; the compensation circuit Sensing the damage of each of the LED chips, and controlling the brightness of the remaining LED chips to maintain a predetermined brightness; and a power connection end through which the power source is input; and each of the connection terminals, The compensation circuit and the power connection end are electrically connected to the electronic circuit substrate; one end of each of the connection lines is electrically connected to the assembly end of the connection module, and the other end is electrically connected. Set at The connection end of the electronic circuit board is electrically connected. Therefore, when the single LED chip is damaged during use, the remaining LED chips can be increased in brightness, and the overall brightness is maintained at a predetermined brightness, which is not caused by a single LED chip. Damage to the overall brightness is reduced, and the LED chip does not need to be replaced immediately. It can be replaced and replaced easily without replacement of the entire set during replacement; thereby providing an LED and power module to simplify installation and maintenance. The photoelectric module, wherein when each one or a few of the LED chips are damaged, the remaining LED chips can maintain a predetermined brightness, and can be individually disassembled for maintenance, so that the predetermined brightness can be maintained and the replacement can be easily repaired. The photoelectric module of the LED light.

1‧‧‧Set module

11‧‧‧Settings

111‧‧‧Binding end

12‧‧‧Electrical connection

13‧‧‧Group endpoint

14‧‧‧through hole

2‧‧‧LED chip

21‧‧‧Base end

22‧‧‧Action

23‧‧‧Connected end

3‧‧‧Electronic circuit substrate

31‧‧‧Connected endpoints

32‧‧‧Compensation circuit

33‧‧‧Power connection

34‧‧‧Transition circuit

4‧‧‧Connecting line

5‧‧‧heating unit

Figure 1 is a perspective view of a preferred embodiment of the present invention.

Figure 2 is a block diagram of the electronic circuit substrate of the present invention.

Figure 3 is a partially exploded perspective view of a preferred embodiment of the present invention.

Figure 4 is a front elevational view of the LED wafer of the preferred embodiment of the present invention.

Figure 5 is a schematic view (1) of the assembled state of the preferred embodiment of the present invention.

Figure 6 is a schematic view of the assembled state of the preferred embodiment of the present invention (2).

Figure 7 is a schematic diagram of the heat sink unit combination of the preferred embodiment of the present invention.

First, please refer to the first to seventh figures. The "decentralized photovoltaic module" of the present invention comprises: a set of connection modules 1, a plurality of LED chips 2, an electronic circuit board 3 and a plurality of The connection line 4; wherein: the assembly module 1 has a plurality of grouping ports 11, and the group of ports 11 is further provided with a plurality of bonding ends 111; a plurality of electrical wires 12 are pivoted in the group Connected to the module 1 and electrically connected to the respective bonding ends 111 of the group of ports 11; and a plurality of grouping terminals 13 disposed at the surface of the grouping module 1 The electrical connection 12 is electrically connected; each of the LED chips 2 is disposed at the grouping port 11 of the assembly module 1 and has a base end 21, which is in a plate-like state as a whole; The end 22 is disposed at one side of the base end 21 for use in generating a light source; and a plurality of connecting ends 23 are respectively disposed at the base end 21 and at the respective joint ends 111 of the set port 11 Electrically connected; The electronic circuit board 3 is configured to maintain a predetermined brightness of each of the LED chips 2, and has a plurality of connection terminals 31. A compensation circuit 32 senses damage of each of the LED chips 2 and enhances the remaining portions. The brightness of the LED chip 2 is further complemented and maintained at a predetermined brightness; and a power connection terminal 33 through which the power source is input; and each of the connection terminals 31, the compensation circuit 32 and the power connection terminal 33 The electronic circuit board 3 is electrically connected to each other; each of the connecting lines 4, one end of each of the connecting lines 4 is disposed at an electrical connection state of the assembly end point 13 of the assembly module 1, and the other end is The connection end point 31 of the electronic circuit board 3 is electrically connected; as described above, the structure is further detailed as follows: the assembly module 1 is in a circuit board manner and a cable In the manner of the method or the terminal block, the connection module 1 is further provided with a through hole 14 through the front and rear ends, and the connection line 4 is passed through the through hole 14 . The LED chip 2 is selected from the direct sealing of the wafer. (COB) or a wafer made by any of the techniques of surface mount (SMT) process technology; each of the connecting wires 4 is disposed on the assembly module 1 and the electronic circuit substrate 3, and is soldered. Any one of the screw-locking method, the male-female plug method, and the latching method is electrically connected; the rear of the set of the module 1 is further provided with at least one heat dissipating unit 5, and each of the LED crystals The base end 21 of the sheet 2 is in an attached state for heat dissipation during use; wherein the LED chip 2 is disposed in the assembly module 1 by any one of a screw lock method, a soldering method, and a cassette method. The power connection end 33 of the electronic circuit board 3 is presented in a group manner; wherein the power connection end 33 of the electronic circuit board 3 is presented in a grouping manner, and is further screw-locked, male and female The electronic circuit board 3 is further provided with a conversion circuit 34, which is selected from the group consisting of AC linear electronic circuits, and the electronic circuit board 3 is disposed at the electronic circuit board 3 The compensating circuit 32 and the power connection end 33 are electrically connected to each other; and as described above, the author defines a set of connection modules for the use state of the preferred embodiment of the "dispersive optoelectronic module" of the present invention. 1. A plurality of LED chips 2, an electronic circuit board 3, and a plurality of connecting lines 4. The integrated module 1, the LED chips 2, the electronic circuit board 3, and each of the connecting lines 4 are integrally formed. The structure has been described above, so it is no longer First, through the set of modules 1 , each of the set of ports 11 is provided, and the set of ports 11 is further provided with a plurality of connecting ends 111; a plurality of electrical wires 12 are pivotally disposed in the group The surface of the module 1 is electrically connected to each of the bonding ends 111 of the group of ports 11; and a plurality of connecting terminals 13 are disposed at the surface of the grouping module 1 The electrical connection 12 is electrically connected; and each of the LED chips 2 is individually selected from crystals having a maximum brightness and slightly less than a predetermined brightness. When the single LED chip 2 is faulty, and the remaining LED chips 2 maintain a predetermined brightness, each of the LED chips 2 is disposed at the grouping port 11 of the group module 1 and has a base end. 21, the whole is in a plate shape; an active end 22 is disposed at one side of the base end 21 for generating a light source; and a plurality of connecting ends 23 are respectively disposed at the base end 21 and associated with Each of the bonding ends 111 of the set of ports 11 is electrically connected; the electronic circuit board 3 has a plurality of connection terminals 31; and a compensation circuit 32 senses damage of each of the LED chips 2, And enhancing the brightness of the remaining LED chips 2 while maintaining the required predetermined brightness; and a power connection end 33 through which the power supply is input; and each of the connection terminals 31, the compensation circuit 32 and the The power connection terminals 33 are electrically connected to the electronic circuit board 3; through each of the connection lines 4, one end of each of the connection lines 4 is disposed at the assembly end point 13 of the assembly module 1 a connection state, and the other end is disposed at the connection end 31 of the electronic circuit board 3 The electrical connection state; thereby, when the present invention is installed, it can be seen that the assembly module 1 and the electronic circuit substrate 3 are separated by the connection line 4, so that the creation can be performed by the group during the installation process. The connection method is more convenient to install, and the circuit board mode, the cable arrangement mode or the terminal block mode of the connection module 1 is presented, and can be applied to different situations of use and installation, and each of the LEDs Wafer 2 is a wafer made by direct package (COB) technology or a wafer with surface mount (SMT) process technology. Therefore, it has better light flux density, reduces glare and has better heat dissipation. Each of the LED chips 2 at the upper end of the assembly module 1 can be separately disassembled separately. For the user to easily disassemble and replace; further, the compensation circuit 32 of the electronic circuit substrate 3 can maintain the total brightness generated by each of the LED chips 2 at a predetermined brightness, and each of the LED chips used in the present creation 2 is a wafer whose individual brightness is slightly smaller than a predetermined brightness, and the LEDs 2 can be individually turned on to the brightest and the total brightness generated by each of the LED chips 2 can be used to achieve the set predetermined brightness. Increasing the service life, when one of the LED chips 2 is damaged and the overall brightness is lowered, the overall power output can be improved by the compensation circuit 32 of the electronic circuit substrate 3, and the brightness of each of the LED chips 2 is increased. Maintaining the overall predetermined brightness without exceeding the allowable use range of each of the LED chips 2, therefore, when a small number of the LED chips 2 are damaged during use, the overall brightness is not affected, and the damaged ones are not required to be replaced immediately. The LED chip 2; further illustrated, the present invention is in the maintenance, the power connection end 33 of the electronic circuit substrate 3 used can be screw-locked, male-female plug-in, and cassette-type Each of the connecting wires 4 is connected to the electronic circuit board 3 in a manner of being screw-locked, a male-female plug-in method, or a latching method, and is electrically connected. Moreover, each of the LED chips 2 is presented in a screw-locking manner or a jamming manner. Therefore, it can be individually disassembled and replaced for maintenance, and the whole group is not required to be replaced, thereby saving cost, and when the joint is in the male-female plug manner. When provided, the electronic circuit board 3 is further provided with a conversion circuit 34, an AC linear electronic circuit, and the electronic circuit board 3 is at the connection end of the compensation circuit 32 and the power supply. 33 presentations The electrical connection state, and the AC power can be directly used through the electronic circuit board 3, and the power converter is not required to be connected, thereby reducing the space used for installation; in particular, the set of modules used The heat dissipating unit 5 is disposed behind the group 1 and is in a state of being attached to the base end 21 of each of the LED chips 2 for heat dissipation during use, and the electronic circuit board 3 is connected to each of the connecting wires 4 The assembly module 1 is connected to the end point 13 and can be disposed at a distance from the assembly module 1 so that the heat generated during heat dissipation does not affect the electronic circuit substrate 3, thereby causing damage and improving the overall service life.

Through the above, the decentralized photovoltaic module of the present invention achieves the effect that the present invention is used for the illumination of LED lamps, and the assembly module 1 has a plurality of grouping ports 11 and the group The port 11 is provided with a plurality of bonding ends 111 for each of the LED chips 2, and each of the LED chips 2 is individually selected from a wafer having a maximum brightness and slightly less than a predetermined brightness, and is available for use therein. One or a few of the LED chips 2 are maintained at a predetermined brightness by the remaining LED chips 2, each of the LED chips 2 having the base end 21, which has a plate-like shape as a whole; the active end 22 is provided at One side of the base end 21 is used for generating a light source; and a plurality of connecting ends 23 are respectively disposed at the base end 21 and electrically connected to the respective connecting ends 111 of the set of ports 11; The electronic circuit board 3 has each of the connection terminals 31; a compensation circuit 32 senses the occurrence of damage of each of the LED chips 2, and can control the brightness of the remaining LED chips 2 to maintain a predetermined brightness; And a power connection end 33 through which the power supply is connected via the power connection end 33 In; and each of the connection terminals 31, 32 connected to the power terminal of the compensation circuit 33 based on the form of the electronic circuit board 3 An electrical connection state; one end of each of the connection lines 4 is electrically connected to the connection end 13 of the assembly module 1 , and the other end is disposed at the connection end 31 of the electronic circuit substrate 3 The electrical connection state, therefore, when the single LED chip 2 is damaged during use, the remaining LED chips 2 can be increased in brightness, and the overall brightness is maintained at a predetermined brightness, so that the overall brightness of the LED chip 2 is not damaged. The LED chip 2 is reduced and does not need to be replaced immediately, and can be replaced and replaced easily without replacement of the entire set during replacement; thereby providing an LED and a power module that can simplify the installation and maintenance of the photoelectric module. When one or a few of the LED chips 2 are damaged, the remaining LED chips 2 can maintain a predetermined brightness, and can be individually disassembled for maintenance, and the LED can still maintain a predetermined brightness and is easy to replace and repair. The photoelectric module of the lamp.

In summary, a decentralized optoelectronic module has not been seen in various books or publicly used, and it is in line with the requirements of the new patent application, so please ask the Bureau to express the patent and grant the patent as soon as possible. To be clear, the above is the specific embodiment of the creation and the technical principles applied. If the changes made according to the concept of this creation, the functional role produced by it does not exceed the spirit of the manual and the drawings. At the time, it should be combined with Chen Ming within the scope of this creation.

1‧‧‧Set module

11‧‧‧Settings

111‧‧‧Binding end

12‧‧‧Electrical connection

13‧‧‧Group endpoint

14‧‧‧through hole

2‧‧‧LED chip

3‧‧‧Electronic circuit substrate

31‧‧‧Connected endpoints

33‧‧‧Power connection

4‧‧‧Connecting line

Claims (10)

A decentralized photovoltaic module, comprising: a set of connection modules, having a plurality of grouping ports, wherein the group of ports further comprises a plurality of bonding ends; a plurality of electrical wires are pivotally disposed in the group The module is electrically connected to each of the combined ends of the set of ports; a plurality of assembled end points are disposed at the surface of the set of modules, and are electrically connected to the electrical connections a plurality of LED chips each disposed at a grouping port of the group of modules, having a base end, the whole of which is in a plate shape; and an active end disposed at one side of the base end For use in generating a light source; a plurality of connecting ends are respectively disposed at the base end and electrically connected to the respective bonding ends of the set of ports; an electronic circuit substrate is provided for maintaining the LED chip as a whole The predetermined brightness has a plurality of connection terminals; a compensation circuit senses damage of each of the LED chips, and enhances brightness of the remaining LED chips, thereby complementing and maintaining the predetermined brightness; and a power connection terminal for providing Power is input via this; and each of the connection terminals, the compensation circuit, and the power The connecting end is electrically connected to the electronic circuit board; a plurality of connecting lines, one end of each of the connecting lines is electrically connected to the grouping end of the grouping module, and the other end is set The connection ends of the electronic circuit board are electrically connected. The distributed photovoltaic module according to claim 1, wherein the assembled module is presented in any one of a circuit board mode, a wire arrangement mode, or a terminal block mode. The distributed photovoltaic module of claim 2, wherein the assembled module is in a circuit board manner When presenting, a through hole is further provided, and before and after the through, the connecting line is pierced through the through hole. The decentralized photovoltaic module of claim 1, wherein the LED chip is selected from the group consisting of wafer direct encapsulation (COB) or surface mount (SMT) process technology. The distributed photovoltaic module according to claim 1, wherein each of the connecting wires is disposed on the assembled module and the electronic circuit substrate, and is further welded, screw-locked, male-female plug, and cassette. Either way is connected and presented in an electrically connected state. The decentralized photovoltaic module of claim 1, wherein the assembly module is further provided with at least one heat dissipating unit, and is in a state of being attached to the base end of each of the LED chips for heat dissipation during use. The decentralized photovoltaic module according to claim 1, wherein the LED chip is provided in the assembly module by any one of a screw locking method, a welding method and a clamping method. The distributed photovoltaic module of claim 1, wherein the power connection end of the electronic circuit substrate is presented in a group manner. The decentralized photovoltaic module according to claim 1, wherein the power connection end of the electronic circuit substrate is presented in a grouping manner, and is further in the form of a screw lock, a male-female plug, or a jam. Presented in either mode or in any combination. The decentralized photovoltaic module of claim 1, wherein the electronic circuit substrate further comprises a conversion circuit, which is selected from an AC linear electronic circuit, and between the electronic circuit substrate, the compensation circuit and the power connection end. Electrically connected.