TWM552182U - Package assembly structure - Google Patents

Description

Package assembly structure

This creation relates to the field of semiconductor technology, and in particular to packaged assembly structures in the field of semiconductor technology.

With the increasing power consumption of semiconductor package structures and the reduction of board space, high-efficiency, high-density package assembly structures have become a trend in electronic devices. However, the existing two-dimensional package assembly structure can not adapt to this trend, the main reasons are: First, the integration of multiple functional components directly on the germanium die, such as MOSFET (Metal-Oxide - Semiconductor Field Effect Transistors) Whole piece of large germanium grain; and the cost of such a process is high; second, if a plurality of functional components are co-packaged together in a two-dimensional package assembly structure side by side The footprint of the package assembly structure on the package board is very large; third, since the power consumption of the package assembly structure increases with the increase of the package density, the package assembly structure is The operating temperature should be effectively controlled. In summary, in the prior art, whether a plurality of functional components are integrated on a single die or the functional components are co-packaged in parallel cannot provide a small-sized package assembly structure, nor can it reduce cost and effectively control temperature. Therefore, the industry needs to improve the existing package assembly structure to optimize its footprint, thermal efficiency and cost.

One of the purposes of this creation is to provide a package assembly structure that combines excellent thermal characteristics with low cost advantages when providing a small footprint. One of the purposes of this creation is also to eliminate the wire bond problem in the package assembly structure to further improve the product reliability of the package assembly structure. The package assembly structure according to an embodiment of the present invention includes: an external pin, a plurality of functional elements, at least one conductive connection component, and an integrated circuit control. Each electrically conductive connection assembly is stacked over each of the plurality of functional elements and configured to bridge the two functional elements to provide a single signal path for the two functional elements. An integrated circuit control is stacked over the at least one electrically conductive connection component and configured to electrically connect the plurality of functional components and the external pins, respectively, to electrically interconnect the plurality of functional components and the external pins. In an embodiment of the present invention, the at least one conductive connection component may be a metal piece, for example, the at least one conductive connection component is a copper piece. The plurality of functional elements are semiconductor germanium elements in which internal signals are vertically flowing and can be output on the surface thereof, for example, the plurality of functional elements are MOSFETs. A plurality of functional elements may be disposed on the lead frame, and the lead frames of any two bridged functional elements are separated, and the lead frames of the two functional elements that are not bridged among the plurality of functional elements may be separated or connected. The integrated circuit control is configured to be electrically coupled to a plurality of functional components and external leads by leads, which may be dies or wafers. Between the plurality of functional components and the at least one electrically conductive connection component, the at least one electrically conductive connection component and the integrated circuit control component may be adhesively fixed by an adhesive. The plurality of functional elements can also be bonded to the lead frame. In another embodiment of the present invention, the package assembly structure further includes a double-sided printed circuit board between the at least one electrically conductive connection component and the integrated circuit control member, the double-sided printed circuit having a top surface thereof Through hole with the bottom surface. The integrated circuit control is configured to be flip-chip mounted on a top surface of the printed circuit board, and electrically coupled to the at least one electrically conductive connection component and the plurality of functional components by the printed circuit board. The at least one electrically conductive connection component can be formed on a bottom surface of the double-sided printed circuit. In still another embodiment of the present invention, the package assembly structure further includes a substrate between the at least one conductive connection component and the integrated circuit control member, and the top surface and the bottom surface of the substrate are provided with a conductive pattern. The integrated circuit control is configured to be flip-chip mounted on a top surface of the substrate, and electrically coupled to the at least one electrically conductive connection component and the plurality of functional elements by the substrate. The at least one electrically conductive connection component can be formed on a bottom surface of the substrate. The package assembly structure provided by the present embodiment has a three-dimensional structure, which not only saves the high cost of integrating multiple functional components on a single chip, but also uses low-resistance conductive, in addition to the size advantage. The connection assembly bridges multiple functional components for superior thermal characteristics. In the case of eliminating the lead, the present embodiment can effectively improve the reliability of the product.

With the development of semiconductor technology and the trend toward smaller miniaturization of electronic products, more and more functional components, such as MOSFETs, need to be integrated in semiconductor packages. At present, there are two main technologies involved in this package: one is to directly form a plurality of functional elements on a single die; however, this technique is complicated and costly on the one hand, and difficult to obtain and separate on the other hand. Similar electrical performance of functional components. The other is to package the functional components together in a side-by-side manner. Such a planar arrangement is bound to make the functional components occupy a lot of packaging area, which is not suitable for the existing product miniaturization trend. The package assembly structure according to an embodiment of the present invention can solve the above problems well without worrying about the problems of the prior art. In one embodiment of the present invention, the package assembly structure is a three-dimensional package assembly structure comprising: an external lead, a plurality of functional components, at least one electrically conductive connection component, and an integrated circuit control. Each electrically conductive connection assembly is stacked over two functional elements and configured to bridge the two functional elements to provide a single signal path for the two functional elements. The integrated circuit control is stacked over the at least one electrically conductive connection component and configured to electrically connect the plurality of functional components and the external pins, respectively, to electrically interconnect the plurality of functional components and the external pins. Since the signal path provided by the conductive connection component has a single path with a minimum resistance, even if the current signal flowing through the channel is relatively large, no large power consumption is caused. At the same time, since the input and output of the functional components are not directly connected to the external pins of the package assembly structure, the occupied area of the package assembly structure is greatly reduced, and the package size can be miniaturized. 1 is a schematic top perspective view of a package assembly structure 10 in accordance with an embodiment of the present invention. As shown in FIG. 1 , the package assembly structure 10 mainly includes a pair of functional components 12 , and a conductive connector 14 stacked on the pair of functional components 12 to bridge the pair of functional components 12 , and stacked on the conductive connector 14 . The integrated circuit control 18 is controlled to electrically control the pair of functional components 12 and to electrically connect the external leads 16 of the package assembly structure 10. The fixing between the functional element 12, the conductive connecting member 14 and the integrated circuit control member 18 can be bonded using an adhesive. In particular, package assembly structure 10 may include more functional elements 12 in other embodiments. The functional component 12 can be a MOSFET or other types of semiconductor germanium components that serve other functions to establish system level functionality in the package. Preferably, the internal signals of these functional elements 12 flow vertically and can be output on their surface. The functional components 12 can be disposed on the lead frame 11, and are fixed to the conductive frame 11 by a similar adhesive bonding method as described above, and in the present embodiment, the lead frames 11 in which the pair of functional elements 12 are located are separated. . The conductive connectors 14 bridge each pair of functional components 12, so in other embodiments, as the number of functional components 12 increases, the conductive connectors 14 also tend to increase. In this embodiment, the conductive connecting member 14 may be a metal piece such as a copper piece, preferably having a small electrical resistance. The conductive connecting member 14 can integrate the current signals of the bridged pair of functional elements 12 into a single current signal path, so that even in the case of a large current, since the resistance of the conductive connecting member 14 is small, it does not generate a large amount. The power consumption can effectively ensure the operating temperature of the package assembly structure 10 and improve the reliability of the product. The integrated circuit control 18 can be a die, wafer or other integrated circuit component with control functions. The integrated circuit control 18 can be configured to be electrically connected to other components (such as the leadframe 11, the functional component 12, and the external pins 16, etc.) by means of leads 13 or the like to achieve control of the functional component 12, such as The gate of MOSFET 12 (not shown) is connected by lead 13 and establishes the necessary electrical connections between functional component 12 and respective external leads 16. The input and output (not shown) of the functional component 12 need not be directly connected to the external leads 16 of the package assembly structure 10. This three-dimensional packaging greatly reduces the area occupied by the components in the planar arrangement. Moreover, the wiring between the two is more compact, and thus has a high dimensional advantage. Based on the basic structure shown in the embodiment shown in Fig. 1, the package assembly structure 10 including more of the functional elements 12 can be similarly deduced or not altered by the spirit of the invention. 2 is a top perspective view of a package assembly structure 20 according to another embodiment of the present invention, and FIG. 3 is a longitudinal cross-sectional side view of the package assembly structure 20 shown in FIG. 2. As can be seen in conjunction with Figures 2 and 3, the package assembly structure 20 is similar to the embodiment shown in Figure 1 with more functional components 12. Specifically, the package assembly structure 20 includes a plurality of functional elements 12 stacked on each pair of functional elements 12 to bridge at least one conductive connection 14 of the pair of functional elements 12, stacked on the at least one conductive connection. An integrated circuit control 18 is provided on the member 14 to control the pair of functional components 12 and to electrically connect the external leads 16 of the package assembly structure 10. The functional component 12 can be a MOSFET or other types of semiconductor germanium components that serve other functions to establish system level functionality in the package. These functional elements 12 can be disposed on the lead frame 11, and in the present embodiment, the lead frames 11 in which the pair of functional elements 12 are located are separated, i.e., have independent channels. Although only four functional elements 12 are shown in this embodiment, based on the teachings of the present specification, those skilled in the art can easily extend them to packaged assembly structures having more functional elements 12. Each of the conductive connectors 14 bridges a pair of functional elements 12 to integrate the current signals of the two into a single current signal path provided by the conductive connectors 14. Since the conductive connecting member 14 can be a copper piece or other metal piece with less resistance, no large power consumption is generated even under a large current condition, so that the package assembly structural member 10 has excellent thermal characteristics. . The integrated circuit control 18 can be a die, wafer or other integrated circuit component with control functions. The integrated circuit control 18 can be configured to be electrically connected to other components (such as the lead frame 11, the functional component 12, and the external pin 16) by means of a lead 13 or the like, thereby controlling the functional component 12 to be switched and functioning. Element 12 establishes the necessary electrical connections with respective external pins 16. By three-dimensional rather than two-dimensional circuit layout, the present invention can effectively avoid an increase in the occupied area caused by the connection between the functional component 12 and the integrated circuit control 18 and the external lead 16 by the lead 13. In addition to the single channel or 1:1 signal path structure described above, this creation can also be applied to a 2:1 signal path structure. 4 is a schematic top perspective view of a package assembly structure 30 in accordance with another embodiment of the present invention. As shown in FIG. 4, the package assembly structure 30 includes a plurality of functional elements 12 stacked on each pair of functional elements 12 to bridge at least one conductive connection 14 of the pair of functional elements 12, stacked on the at least one An integrated circuit control 18 is provided on the conductive connector 14 to control the plurality of functional components 12 and to electrically connect the external leads 16 of the package assembly structure 10. The fixing between the functional element 12, the conductive connecting member 14 and the integrated circuit control member 18 can be bonded using an adhesive. Also in the case of a MOSFET, these functional elements 12 can be bonded to the lead frame 11. However, unlike the previous embodiment, a pair of functional elements 12a are disposed on the interconnected lead frames 11a (which can be understood as the same lead frame), and the other two functional elements 10b are respectively disposed on the separated lead frames 11b. That is, one pair of functional elements 12a share a current signal path, and the other pair of functional elements 12b each have an independent current signal path. Each of the conductive connectors 14 still bridges a pair of functional elements 12, but the lead frames 11 in which any two bridged functional elements 12 are located are separated. Each of the two functional elements 11b disposed on the separated lead frame 11b is respectively bridged by a conductive connecting member 14 and a respective one disposed on the same lead frame 11a to form a current of 2:1. Signal channel. The integrated circuit control 18 can be configured to be electrically coupled to the leadframe 11, the functional component 12, and the external leads 16 by leads 13 to control the functional component 12 and to the functional component 12 and the respective external pins 16 Establish the necessary electrical connections. Although the present embodiment only shows a 2:1 signal path structure, those skilled in the art can fully understand that the embodiment of the present invention can also include various combinations of 1:1 and 2:1 signal path structures based on the teachings of the present specification. It is not limited to a single signal path structure type. Although the package assembly structure provided by the present embodiment also uses the common packaging method for the functional component 12 to avoid the high cost of single-chip integration, it uses three-dimensional instead of the traditional two-dimensional manner, and thus has several significant features. advantage. The conductive connectors 14 are stacked on the functional component 12 to properly integrate the signals in the vertical space, and the integrated circuit control member 18 of the control functional component 12 is further disposed above the conductive connectors 14, thereby greatly reducing The footprint of the package assembly structure. Moreover, since the electrical resistance of the conductive connecting member 14 is small, even if the current of the functional element 12 is large, the amount of heat that can be generated on the conductive connecting member 14 is low. In some embodiments according to the present invention, in order to further improve the reliability of the product and avoid the wire bonding space and reliability trouble that the lead 13 may cause, other connections may be used between the components of the package assembly structure, for example, A double-sided printed circuit board having a through hole or a substrate having a conductive pattern on both sides, and the like, instead of the lead 13. 5 is a schematic longitudinal cross-sectional view of a package assembly structure 40 according to an embodiment of the present invention, and FIG. 6 is a top plan view 43a of the printed circuit board 43 of the package assembly structure 40 of FIG. A schematic diagram of the combination of the bottom bottom view 43b. As shown in FIG. 5 and FIG. 6, the package assembly structure 40 includes a plurality of functional components 12 stacked on each pair of functional components 12 to bridge at least one conductive connector 14 of the pair of functional components 12, stacked thereon. At least one conductive connector 14 is mounted to control the integrated circuit control 18 of the plurality of functional components 12. The fixing between the functional element 12, the conductive connecting member 14 and the integrated circuit control member 18 can be bonded using an adhesive. Also in the case of a MOSFET, these functional elements 12 can be bonded to the lead frame 11. More specifically, the lead frames 11 in which the functional elements 12 are located may be separated from each other, or may have a lead frame 11 shared by two or more functional elements 12, depending on the design function. Each of the conductive connectors 14 bridges a pair of relatively independent functional components 12, i.e., functional components 12 that are separated from each other by the leadframe 11 to provide a bridged integrated current signal path. The integrated circuit control 18 can be configured to be electrically coupled to the leadframe 11, the functional component 12, and the external pins 16, etc., thereby controlling the functional component 12 and establishing the necessary power between the functional component 12 and the respective external pins 16. connection. Further, the package assembly structure 40 also includes a double-sided printed circuit board 43 (ie, the top surface 430 and the bottom surface 432 are provided with circuit traces 434), and the printed circuit board 43 has a top surface 430 and a bottom surface. 432 through hole 436. In other embodiments, the printed circuit board 43 can also be replaced by a substrate printed with conductive patterns on both sides. The integrated circuit control member 18 (such as a die or a wafer) is mounted on the top surface 430 of the printed circuit board 43 by flipping, and the conductive connecting member 14 is directly formed on the bottom surface of the printed circuit board 43. At 432, the integrated circuit control member 18 and the functional component 12 and the lead frame 11 can be connected to each other by a conductive path 438 or the like provided by the through hole 436 of the printed circuit board 43. Since the lead 13 is not used and the space for the arrangement of the leads 13 is saved, the size of the package assembly structure 40 of the present embodiment can be further reduced, and the reliability is further improved by the absence of cross-over or adhesion between the leads.

10‧‧‧Package assembly structural parts

11‧‧‧ lead frame

12‧‧‧Functional components

13‧‧‧ lead

14‧‧‧Electrical connectors

16‧‧‧External Pin

18‧‧‧Integrated circuit control

20‧‧‧Package assembly structural parts

30‧‧‧Package assembly structural parts

40‧‧‧Package assembly structural parts

43‧‧‧Printed circuit board

43a‧‧‧Top top view

43b‧‧‧ bottom view

430‧‧‧ top surface

432‧‧‧ bottom

434‧‧‧Circuit trace

436‧‧‧through hole

438‧‧‧ conductive path

1 is a schematic plan view of a package assembly structure according to an embodiment of the present invention. FIG. 2 is a schematic plan view of a package assembly structure according to another embodiment of the present invention. 2 is a schematic longitudinal cross-sectional view of the package assembly structure shown in FIG. 2, which is a schematic plan view of a package assembly structure according to another embodiment of the present invention. FIG. 5 is a schematic view showing an embodiment according to the present invention. FIG. 6 is a schematic view showing the combination of a top plan view and a bottom view of a printed circuit board of the package assembly structure of FIG.

10‧‧‧Package assembly structural parts

11‧‧‧ lead frame

12‧‧‧Functional components

13‧‧‧ lead

14‧‧‧Electrical connectors

16‧‧‧External Pin

18‧‧‧Integrated circuit control

Claims (15)

A package assembly structural member, characterized in that it comprises: an external pin; a plurality of functional elements; at least one electrically conductive connection component, each electrically conductive connection component being stacked on top of each of the plurality of functional elements and configured Providing a single signal path for the two functional elements by bridging the two functional elements; an integrated circuit control member stacked over the at least one electrically conductive connection assembly and configured to respectively associated with the plurality of functional elements and The external pins are electrically connected to electrically interconnect the plurality of functional components with the external pins. The package assembly structure of claim 1, wherein the at least one electrically conductive connection component is a metal sheet. The package assembly structure of claim 2, wherein the at least one electrically conductive connection component is a copper sheet. The package assembly structure of claim 1, wherein the plurality of functional elements are internal semiconductor signals that are vertically flowing and outputtable on a surface thereof. The package assembly structure of claim 4, wherein the plurality of functional elements are MOSFFT. The package assembly structure of claim 1, wherein the plurality of functional components are disposed in the lead frame The lead frame on which the two functional components are bridged is separated. The package assembly structure of claim 1, wherein the lead frames of the plurality of functional elements that are not bridged are separated or connected. The package assembly structure of claim 1, wherein the integrated circuit control is configured to be electrically coupled to the plurality of functional components and the external pins by leads. The package assembly structure of claim 1, wherein the package assembly structure further comprises a double-sided printed circuit board between the at least one electrically conductive connection component and the integrated circuit control member, the double-sided printed circuit having a through a through hole of the top surface and the bottom surface, the integrated circuit control member configured to be flipped on the top surface of the printed circuit board, and the at least one conductive connection component and the plurality of functional components by the printed circuit board Electrical connection. The package assembly structure of claim 1, wherein the package assembly structure further comprises a substrate between the at least one electrically conductive connection component and the integrated circuit control member, the top surface and the bottom surface of the substrate are provided with a conductive pattern The integrated circuit control member is configured to be flip-chip mounted on the top surface of the substrate, and is electrically connected to the at least one electrically conductive connection component and the plurality of functional elements by the substrate. The package assembly structure of claim 10, wherein the at least one electrically conductive connection component is formed on a bottom surface of the double-sided printed circuit. The package assembly structure of claim 11, wherein the at least one electrically conductive connection component is formed The bottom surface of the substrate. The package assembly structure of claim 1, wherein the integrated circuit control is a die or a wafer. The package assembly structure of claim 1, wherein between the plurality of functional components and the at least one electrically conductive connection component, the at least one electrically conductive connection component and the integrated circuit control component are adhesively fixed by an adhesive. The package assembly structure of claim 6, wherein the plurality of functional elements are bonded to the lead frame.