TWM549445U - Substrate processing device - Google Patents
Substrate processing device Download PDFInfo
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- TWM549445U TWM549445U TW106205843U TW106205843U TWM549445U TW M549445 U TWM549445 U TW M549445U TW 106205843 U TW106205843 U TW 106205843U TW 106205843 U TW106205843 U TW 106205843U TW M549445 U TWM549445 U TW M549445U
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Description
本創作涉及一種基板處理裝置,尤其涉及一種利用處理液處理在形成於裝置本體之腔室內搬送之基板的處理裝置。 The present invention relates to a substrate processing apparatus, and more particularly to a processing apparatus for processing a substrate conveyed in a chamber formed in a device body by a processing liquid.
在液晶顯示裝置或半導體裝置的製程中,會利用處理液處理在形成於裝置本體之腔室內搬送之基板,例如台灣專利證書號第I347865號所揭露的「基板之處理裝置及處理方法」,該基板之處理裝置具有:裝置本體,係形成有利用處理液進行處理之腔室者;搬送滾輪,係沿著腔室內之預定方向搬送基板;主排氣管,係位於基板上方,且沿著基板之搬送方向配置於與基板之搬送方向交叉之前述腔室的寬方向中央部分;及多數支排氣管,係其中一端與主排氣管連通,而另一端形成於位於腔室之寬方向端部且用以吸引腔室內的環境氣體之吸引口,同時,以主排氣管為中心對稱地設於腔室之寬方向上者。 In the process of the liquid crystal display device or the semiconductor device, the substrate to be transported in the chamber formed in the device body is processed by the processing liquid, for example, the "processing device and processing method for the substrate" disclosed in Taiwan Patent No. I347865. The substrate processing apparatus includes: a device body formed with a chamber processed by the processing liquid; and a conveying roller that transports the substrate along a predetermined direction in the chamber; the main exhaust pipe is located above the substrate and along the substrate The conveying direction is disposed at a central portion in the width direction of the chamber intersecting the conveying direction of the substrate; and a plurality of exhaust pipes are one end connected to the main exhaust pipe and the other end being formed at a wide end end of the chamber The portion is configured to attract the suction port of the ambient gas in the chamber, and is disposed symmetrically in the width direction of the chamber centering on the main exhaust pipe.
在面板蝕刻製程的部分,酸液、酸氣的防護涉及人身安全,是設備的主要設計重點之一,惟上述基板之處理裝置為單層防護設計,若運用在蝕刻製程上,酸液、酸氣仍有可能溢散而導致危害。 In the part of the panel etching process, the protection of acid and acid gas involves personal safety and is one of the main design priorities of the device. However, the processing device of the above substrate is a single-layer protection design. If applied to the etching process, acid and acid are used. Gas may still be spilled and cause harm.
綜上所述,本創作人有感上述缺陷可改善,乃特潛心研究並配合學理的應用,終於提出一種設計合理且有效改善上述缺陷的創作。 In summary, the creator feels that the above defects can be improved, and he has devoted himself to research and cooperates with the application of academics, and finally proposes a design that is reasonable in design and effective in improving the above defects.
本創作所要解決的技術問題,在於提供一種基板處理裝置,採用雙層蓋設計,雙重防護可避免酸液、酸氣洩漏之工安事件。 The technical problem to be solved by the present invention is to provide a substrate processing device which adopts a double-layer cover design, and double protection can avoid the industrial safety event of acid and acid gas leakage.
為了解決上述的技術問題,本創作提供一種基板處理裝置,包括:一裝置本體,其內部形成有腔室;至少一內層蓋,其蓋置於該腔室的上端處,該至少一內層蓋的下方形成第一排氣通道;以及至少一外層蓋,其蓋置於該腔室的上端處,該至少一外層蓋設置於該至少一內層蓋的上方,該至少一外層蓋及該至少一內層蓋之間形成第二排氣通道,能通過該第一排氣通道及該第二排氣通道而對該裝置本體進行抽氣。 In order to solve the above technical problem, the present invention provides a substrate processing apparatus, comprising: a device body having a chamber formed therein; at least one inner layer cover having a cover disposed at an upper end of the chamber, the at least one inner layer Forming a first exhaust passage under the cover; and at least one outer cover disposed at an upper end of the chamber, the at least one outer cover being disposed above the at least one inner cover, the at least one outer cover and the outer cover A second exhaust passage is formed between the at least one inner cover, and the device body can be evacuated through the first exhaust passage and the second exhaust passage.
較佳的,還包括至少一導氣裝置,該至少一導氣裝置與該第一排氣通道及該第二排氣通道相連通,以通過該第一排氣通道、該第二排氣通道及該至少一導氣裝置進行抽氣。 Preferably, the method further includes at least one air guiding device, wherein the at least one air guiding device communicates with the first exhaust passage and the second exhaust passage to pass the first exhaust passage and the second exhaust passage And the at least one air guiding device performs pumping.
較佳的,該至少一導氣裝置包含一導氣管,該導氣管的一端設有第一開口,該第一開口與該第一排氣通道相連通,該導氣管上設有第二開口,該第二開口與該第二排氣通道相連通。該導氣管呈錐狀,該導氣管的口徑朝向該腔室的方向呈擴張狀。 Preferably, the at least one air guiding device comprises an air guiding tube, and one end of the air guiding tube is provided with a first opening, the first opening is in communication with the first exhaust passage, and the air guiding tube is provided with a second opening. The second opening is in communication with the second exhaust passage. The air guiding tube has a tapered shape, and the diameter of the air guiding tube is expanded toward the chamber.
本創作的有益效果: The beneficial effects of this creation:
本創作裝置本體的腔室的上端處蓋置有內層蓋及外層蓋,使其形成雙層蓋設計,雙重防護可避免酸液、酸氣洩漏之工安事件。再者,本創作的腔室內部除了可通過第一排氣通道進行抽氣外,在內層蓋及外層蓋之間另設有第二排氣通道進行抽氣,以確保酸氣不會外溢。 The upper end of the chamber of the main body of the authoring device is covered with an inner layer cover and an outer layer cover to form a double-layer cover design, and the double protection can avoid the industrial safety event of acid and acid gas leakage. Furthermore, in addition to the pumping through the first exhaust passage, the interior of the chamber is additionally provided with a second exhaust passage between the inner cover and the outer cover for pumping to ensure that the acid gas does not overflow. .
為使能更進一步瞭解本創作的特徵及技術內容,請參閱以下有關本創作的詳細說明與附圖,然而附圖僅提供參考與說明用,並非用來對本創作加以限制者。 In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and explanation, and are not intended to limit the creation.
1‧‧‧裝置本體 1‧‧‧ device body
11‧‧‧腔室 11‧‧‧ chamber
12‧‧‧輸入口 12‧‧‧ input port
13‧‧‧輸出口 13‧‧‧Outlet
14‧‧‧第一排氣通道 14‧‧‧First exhaust passage
15‧‧‧第二排氣通道 15‧‧‧Second exhaust passage
16‧‧‧通氣口 16‧‧‧ vent
2‧‧‧內層蓋 2‧‧‧ inner cover
3‧‧‧外層蓋 3‧‧‧ outer cover
4‧‧‧導氣裝置 4‧‧‧Gas guide
41‧‧‧導氣管 41‧‧‧ air duct
42‧‧‧第一開口 42‧‧‧ first opening
43‧‧‧第二開口 43‧‧‧second opening
44‧‧‧管接頭 44‧‧‧ pipe joint
45‧‧‧抽氣調整機構 45‧‧‧Exhaust gas adjustment mechanism
451‧‧‧門板 451‧‧‧ door panel
452‧‧‧滑軌 452‧‧‧rails
453‧‧‧固定螺絲 453‧‧‧ fixing screws
46‧‧‧通氣調節機構 46‧‧‧Ventilation adjustment mechanism
461‧‧‧蓋板 461‧‧‧ Cover
462‧‧‧鎖附螺絲 462‧‧‧Locking screws
463‧‧‧滑槽 463‧‧ ‧ chute
圖1為本創作基板處理裝置的立體圖。 1 is a perspective view of the substrate processing apparatus of the present invention.
圖2為本創作基板處理裝置部分外層蓋掀開的立體圖。 2 is a perspective view showing a portion of an outer cover of a substrate processing apparatus of the present invention.
圖3為本創作基板處理裝置的側視圖。 Fig. 3 is a side view of the substrate processing apparatus of the present invention.
圖4為本創作基板處理裝置的剖視圖。 4 is a cross-sectional view of the substrate processing apparatus of the present invention.
圖5為本創作基板處理裝置內部結構的立體圖(一)。 Fig. 5 is a perspective view (1) of the internal structure of the substrate processing apparatus of the present invention.
圖6為本創作基板處理裝置內部結構的立體圖(二)。 Fig. 6 is a perspective view (2) of the internal structure of the substrate processing apparatus of the present invention.
圖7為本創作基板處理裝置內部結構的俯視圖。 Fig. 7 is a plan view showing the internal structure of the substrate processing apparatus of the present invention.
圖8為本創作抽氣調整機構的立體圖。 Figure 8 is a perspective view of the creation of the pumping adjustment mechanism.
圖9為本創作通氣調節機構的立體圖。 Figure 9 is a perspective view of the creation ventilation adjustment mechanism.
以下藉由特定的具體實例說明本創作基板處理裝置的實施方式,熟悉此技術的人士可由本說明書所揭示的內容輕易地瞭解本創作的其他優點與功效。本創作亦可藉由其他不同的具體實例加以施行或應用,本說明書中的各項細節亦可基於不同觀點與應用,在不悖離本創作的精神下進行各種修飾與變更。又本創作的圖式僅為簡單說明,並非依實際尺寸描繪,亦即未反應出相關構成的實際尺寸,先予敘明。以下的實施方式進一步詳細說明本創作的觀點,但並非以任何觀點限制本創作範疇。 The embodiments of the present invention substrate processing apparatus will be described below by way of specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in the present specification. The present invention may also be implemented or applied by other specific examples. The details of the present specification may also be based on different viewpoints and applications, and various modifications and changes may be made without departing from the spirit of the present invention. The drawing of this creation is only a brief description, and is not depicted in actual size, that is, the actual size of the relevant composition is not reflected, which will be described first. The following embodiments further illustrate the views of the present work, but do not limit the scope of the creation by any point of view.
請參閱圖1至圖4,本創作提供一種基板處理裝置,尤其涉及一種利用處理液處理在形成於裝置本體之腔室內搬送之基板的處理裝置,該基板處理裝置包括一裝置本體1、至少一內層蓋2及至少一外層蓋3。 Referring to FIG. 1 to FIG. 4 , the present invention provides a substrate processing apparatus, and more particularly to a processing apparatus for processing a substrate conveyed in a chamber formed in a device body by using a processing liquid, the substrate processing apparatus including a device body 1 , at least one The inner cover 2 and at least one outer cover 3.
該裝置本體1為一中空體,裝置本體1的內部形成有腔室11,亦即在裝置本體1內在基板傳送方向上,可劃分形成有多個腔室11,該些腔室11的上端處形成開口狀。腔室11內沿著基板的搬 送方向可設有搬送機構(圖略),搬送機構可為間隔設置的多個搬送滾輪,藉由旋轉驅動該些搬送滾輪,可用以搬送基板沿著搬送方向前進。腔室11內可設有多個噴嘴(圖略),以便將處理液噴至基板上來進行處理。裝置本體1相對的兩側分別設有一輸人口12及一輸出口13,輸入口12及輸出口13呈狹長狀的開口,可供基板通過。輸入口12及輸出口13與腔室11相連通,以便將待處理的基板經由輸入口12輸入至腔室11內部,經過處理後的基板,再通過輸出口13向外輸出。 The device body 1 is a hollow body. The inside of the device body 1 is formed with a chamber 11 , that is, a plurality of chambers 11 are formed in the substrate body 1 in the substrate conveying direction, and the upper ends of the chambers 11 are Form an opening. Moving along the substrate in the chamber 11 A transport mechanism (not shown) may be provided in the transport direction, and the transport mechanism may be a plurality of transport rollers provided at intervals, and the transport rollers may be rotationally driven to advance the transport substrate in the transport direction. A plurality of nozzles (not shown) may be provided in the chamber 11 to spray the treatment liquid onto the substrate for processing. The opposite sides of the device body 1 are respectively provided with a population 12 and an output port 13. The input port 12 and the output port 13 have an elongated opening for the substrate to pass through. The input port 12 and the output port 13 communicate with the chamber 11 to input the substrate to be processed into the interior of the chamber 11 via the input port 12, and the processed substrate is then outputted outward through the output port 13.
該內層蓋2可設置一個或多個,在本實施例中,內層蓋2設置有多個,使得該些內層蓋2可以單獨的掀開及蓋置。內層蓋2可呈方形的蓋體,內層蓋2的形狀並不限制,內層蓋2蓋置於腔室11的上端處,用以封閉腔室11的上端處,以避免腔室11內的酸液、酸氣溢散。內層蓋2的下方可形成一或多個第一排氣通道14,第一排氣通道14位於腔室11內。 The inner cover 2 may be provided with one or more. In the embodiment, the inner cover 2 is provided in plurality so that the inner cover 2 can be separately opened and covered. The inner cover 2 may have a square cover. The shape of the inner cover 2 is not limited. The inner cover 2 is placed at the upper end of the chamber 11 to close the upper end of the chamber 11 to avoid the chamber 11. The acid and acid inside are overflowing. One or more first exhaust passages 14 may be formed below the inner cover 2, and the first exhaust passage 14 is located within the chamber 11.
該外層蓋3可設置一個或多個,在本實施例中,外層蓋3設置有多個,使得該些外層蓋3可以單獨的掀開及蓋置。外層蓋3可呈方形的蓋體,外層蓋3的形狀並不限制,外層蓋3蓋置於腔室11的上端處,用以封閉腔室11的上端處,以避免腔室11內的酸液、酸氣溢散。外層蓋3設置於內層蓋2的上方,外層蓋3與內層蓋2之間形成一或多個第二排氣通道15,在對裝置本體1進行抽氣時,能使腔室11內的酸液、酸氣經由第一排氣通道14排出,若腔室11內的酸液、酸氣有溢散至該內層蓋2與外層蓋3之間者,可經由該第二排氣通道15排出。 The outer cover 3 may be provided with one or more. In the embodiment, the outer cover 3 is provided in plurality, so that the outer cover 3 can be separately opened and covered. The outer cover 3 may have a square cover. The shape of the outer cover 3 is not limited. The outer cover 3 is placed at the upper end of the chamber 11 to close the upper end of the chamber 11 to avoid acid in the chamber 11. Liquid and acid gas overflow. The outer cover 3 is disposed above the inner cover 2, and one or more second exhaust passages 15 are formed between the outer cover 3 and the inner cover 2. When the device body 1 is evacuated, the chamber 11 can be The acid solution and the acid gas are discharged through the first exhaust passage 14, and if the acid liquid or the acid gas in the chamber 11 overflows between the inner layer cover 2 and the outer layer cover 3, the second exhaust gas can be passed through the second exhaust gas. The passage 15 is discharged.
內層蓋2及外層蓋3亦可呈傾斜狀設置,亦即內層蓋2及外層蓋3的一側可形成高點,相對的另一側可形成低點,使得凝結而附著於內層蓋2或外層蓋3上的液體可往低點流動,從而具有導水的功能,以利外層蓋3或內層蓋2能保持透明度,以利操作人員於裝置外部觀察裝置內部的基板處理狀況。 The inner cover 2 and the outer cover 3 may also be disposed in an inclined manner, that is, one side of the inner cover 2 and the outer cover 3 may form a high point, and the opposite side may form a low point to cause condensation to adhere to the inner layer. The liquid on the cover 2 or the outer cover 3 can flow to a low point to have a water guiding function, so that the outer cover 3 or the inner cover 2 can maintain transparency, so that the operator can observe the substrate processing condition inside the device outside the device.
本創作的基板處理裝置還可包括至少一導氣裝置4,導氣裝置4與第一排氣通道14及第二排氣通道15相連通,導氣裝置4可連接於抽氣裝置(圖略),以便通過第一排氣通道14、第二排氣通道15及導氣裝置4進行抽氣,使腔室11內之酸液、酸氣能隨第一排氣通道14經由導氣裝置4而導引至廠務端;再者,若腔室11內的酸液、酸氣有溢散至該內層蓋2與外層蓋3之間者,可經由該第二排氣通道15而導引至廠務端。 The substrate processing apparatus of the present invention may further include at least one air guiding device 4, the air guiding device 4 is in communication with the first exhaust passage 14 and the second exhaust passage 15, and the air guiding device 4 is connectable to the air extracting device. So that the first exhaust passage 14, the second exhaust passage 15 and the air guiding device 4 are pumped, so that the acid and acid gas in the chamber 11 can pass through the air guiding device 4 along the first exhaust passage 14. And guiding to the factory side; further, if the acid and acid gas in the chamber 11 overflow to the inner cover 2 and the outer cover 3, the second exhaust passage 15 can be guided. Lead to the factory side.
請參閱圖5至圖7,在本實施例中,導氣裝置4設有多個,且該些導氣裝置4設置於裝置本體1的同一側,亦即該些導氣裝置4可設置於裝置本體1沒有設置輸入口12及輸出口13的一側。導氣裝置4各包含一導氣管41,導氣管41為一中空體,導氣管41的一端設有第一開口42,第一開口42與第一排氣通道14相連通,第一開口42可呈方形孔,但第一開口42的形狀並不限制。導氣管41上設有第二開口43,第二開口43與第二排氣通道15相連通,第二開口43可設有多個,該些第二開口43可設於導氣管41的頂部等處,第二開口43可呈圓形孔,但第二開口43的形狀並不限制。 Referring to FIG. 5 to FIG. 7 , in the embodiment, a plurality of air guiding devices 4 are disposed, and the air guiding devices 4 are disposed on the same side of the device body 1 , that is, the air guiding devices 4 can be disposed on the same. The apparatus body 1 is not provided with one side of the input port 12 and the output port 13. The air guiding device 4 includes an air guiding tube 41. The air guiding tube 41 is a hollow body. One end of the air guiding tube 41 is provided with a first opening 42. The first opening 42 communicates with the first exhaust passage 14, and the first opening 42 can be The square holes are formed, but the shape of the first opening 42 is not limited. The air guiding tube 41 is provided with a second opening 43, the second opening 43 is in communication with the second exhaust passage 15, and the second opening 43 is provided in plurality. The second openings 43 can be disposed at the top of the air guiding tube 41. The second opening 43 may have a circular hole, but the shape of the second opening 43 is not limited.
導氣管41可呈錐狀,亦即導氣管41的口徑可朝向腔室11的方向呈擴張狀,使導氣管41呈喇叭口狀,藉此,使得氣體流動平順無死角,且可加大第一開口42的面積,用以提升抽風效率。導氣管41的另一端則可通過管接頭44及管路連接於適當的抽氣裝置。 The air guiding tube 41 can be tapered, that is, the diameter of the air guiding tube 41 can be expanded toward the direction of the chamber 11, so that the air guiding tube 41 has a bell mouth shape, thereby making the gas flow smooth and without dead angle, and can increase the number The area of an opening 42 for improving the efficiency of the exhaust. The other end of the air guiding tube 41 can be connected to a suitable air suction device through a pipe joint 44 and a pipe.
本創作裝置本體1的腔室11的上端處蓋置有內層蓋2及外層蓋3,使其形成雙層蓋設計,雙重防護可避免酸液、酸氣洩漏之工安事件。再者,本創作的腔室11內部除了可通過第一排氣通道14進行抽氣外,在內層蓋2及外層蓋3之間另設有第二排氣通道15進行抽氣,以確保酸氣不會外溢。 The inner end cover 2 and the outer cover 3 are disposed at the upper end of the chamber 11 of the main body 1 of the authoring device to form a double-layer cover design, and the double protection can avoid the industrial safety event of acid and acid gas leakage. Furthermore, in the interior of the chamber 11 of the present invention, in addition to being evacuated through the first exhaust passage 14, a second exhaust passage 15 is additionally provided between the inner cover 2 and the outer cover 3 for pumping to ensure Acid gas will not overflow.
請參閱圖8,本創作亦可進一步在導氣管41的第一開口42處設有抽氣調整機構45,能用以調整第一開口42的通氣量。該抽氣調整機構45可包含一門板451,該門板451設置於導氣管41的第一開口42處,門板451的兩側可滑動配合於兩個滑軌452,使門板451可以上、下移動調整,藉以調整第一開口42的通氣量,使得腔室11內的抽氣效果更均勻。該門板451的兩側螺接有固定螺絲453,可在門板451調整完成時,將門板451固定於兩個滑軌452。 Referring to FIG. 8 , the present invention can further provide an air suction adjusting mechanism 45 at the first opening 42 of the air guiding tube 41 , which can be used to adjust the ventilation amount of the first opening 42 . The air suction adjusting mechanism 45 can include a door panel 451 disposed at the first opening 42 of the air guiding tube 41. Both sides of the door panel 451 can be slidably fitted to the two sliding rails 452, so that the door panel 451 can move up and down. Adjustment, thereby adjusting the ventilation amount of the first opening 42, so that the pumping effect in the chamber 11 is more uniform. A fixing screw 453 is screwed to both sides of the door panel 451, and the door panel 451 can be fixed to the two rails 452 when the door panel 451 is adjusted.
請參閱圖9,本創作亦可進一步在裝置本體1的一側設有至少一通氣口16(如圖1及2所示),在本實施例中設有多個通氣口16,該些通氣口16設在裝置本體1上與導氣裝置4相對的一側,亦可在通氣口16處設有通氣調節機構46,能用以調節通氣口16的通氣量。該通氣調節機構46可包含一蓋板461,該蓋板461可移動的設置於通氣口16處,例如蓋板461的兩側可配合有鎖附螺絲462,兩個鎖附螺絲462滑動配合於裝置本體1相對應的兩個滑槽463,使蓋板461可以上、下移動調整,藉以控制蓋板461開啟及關閉通氣口16,也能用以調節通氣口16的通氣量,使得腔室11內的抽氣效果較佳。該蓋板461調整完成時,可利用旋緊鎖附螺絲462將蓋板461固定。 Referring to FIG. 9, the present invention may further include at least one vent 16 on one side of the device body 1 (as shown in FIGS. 1 and 2). In this embodiment, a plurality of vents 16 are provided, and the vents are provided. The mouth 16 is provided on the side of the apparatus body 1 opposite to the air guiding device 4, and a ventilation adjusting mechanism 46 may be provided at the venting port 16 for adjusting the ventilation amount of the venting port 16. The venting adjustment mechanism 46 can include a cover 461, and the cover 461 is movably disposed at the vent 16 . For example, the cover 461 can be fitted with a locking screw 462 on both sides thereof, and the two locking screws 462 are slidably engaged with The two sliding slots 463 of the device body 1 enable the cover plate 461 to be moved up and down to control the opening and closing of the venting opening 16 of the cover plate 461, and can also be used to adjust the ventilation of the venting opening 16 so that the chamber The pumping effect in 11 is better. When the adjustment of the cover 461 is completed, the cover 461 can be fixed by the tightening of the locking screw 462.
最後,在本創作之另一實施例中,其係與圖4相同,惟,該第一排氣通道14與該第二排氣通道15係個別以獨立管路連通至廠務端。 Finally, in another embodiment of the present invention, it is the same as that of FIG. 4, except that the first exhaust passage 14 and the second exhaust passage 15 are individually connected to the factory end by independent pipelines.
以上所述僅為本創作的優選實施例,非意欲侷限本創作的專利保護範圍,故凡是運用本創作說明書及附圖內容所作的等效變化,均同理皆包含於本創作的權利保護範圍內。 The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of patent protection of the present invention. Therefore, equivalent changes made by using the present specification and the contents of the drawings are all included in the scope of protection of the present invention. Inside.
1‧‧‧裝置本體 1‧‧‧ device body
13‧‧‧輸出口 13‧‧‧Outlet
16‧‧‧通氣口 16‧‧‧ vent
2‧‧‧內層蓋 2‧‧‧ inner cover
3‧‧‧外層蓋 3‧‧‧ outer cover
4‧‧‧導氣裝置 4‧‧‧Gas guide
41‧‧‧導氣管 41‧‧‧ air duct
43‧‧‧第二開口 43‧‧‧second opening
44‧‧‧管接頭 44‧‧‧ pipe joint
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW106205843U TWM549445U (en) | 2017-04-26 | 2017-04-26 | Substrate processing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW106205843U TWM549445U (en) | 2017-04-26 | 2017-04-26 | Substrate processing device |
Publications (1)
Publication Number | Publication Date |
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TWM549445U true TWM549445U (en) | 2017-09-21 |
Family
ID=60764361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW106205843U TWM549445U (en) | 2017-04-26 | 2017-04-26 | Substrate processing device |
Country Status (1)
Country | Link |
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TW (1) | TWM549445U (en) |
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2017
- 2017-04-26 TW TW106205843U patent/TWM549445U/en unknown
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