TWM544194U - Fixing module and heat dissipating device - Google Patents

Abstract

A fixing module includes two frames, fours fixing members, four resilient members and four restraining members. The frame has two through holes. The fixing member has a head portion and a rod portion. The rod portion is inserted into the through hole. The rod portion has a first recess. The first resilient member is sleeved on the rod portion. Opposite ends of the first resilient member abut against the head portion and the frame. The restraining member is sleeved on the rod portion. The restraining member has a plurality of restraining portions. The restraining portions extend into the first recess. The first resilient member and the restraining member are located at opposite sides of the frame.

Description

Fixed module and heat sink

The present invention relates to a fixed module and a heat sink, and more particularly to a fixed module for fixing a heat sink to a substrate and a heat sink mounted with the fixed module.

The heat sink is closely related to the development of electronic devices. Since the current in the circuit generates unnecessary thermal energy due to the influence of the impedance when the electronic device is in operation, if the thermal energy cannot be effectively eliminated and accumulated on the electronic components inside the electronic device, the electronic component may be continuously raised. The temperature is damaged. Therefore, the advantages and disadvantages of the heat sink affect the operation of the electronic device. At present, the most commonly used heat sink for electronic devices is to heat the electronic components by contacting one end of the heat pipe, and the heat sink is connected to the other end, and the heat sink is dissipated by the fan. Generally, the heat pipe is fixed to the electronic component by the heat sink, and the heat sink is fixed on the substrate carrying the electronic component. Therefore, how to firmly fix the heat sink to the substrate has become a major issue in design.

The present invention provides a fixed module for fixing a heat sink to a substrate and a heat sink mounted with the fixed module to solve the above problems.

According to an embodiment, the fixed module of the present invention comprises two brackets, four fixing members, four first elastic members and four limiting members. The bracket has two through holes. The fixing member has a head and a stem. The rod portion is bored in the through hole. The stem has a first recess. The first elastic member is sleeved on the rod portion. The two ends of the first elastic member abut against the head and the bracket, respectively. The limiting member is sleeved on the rod portion. The limiting member has a plurality of limiting portions. The limiting portion protrudes in the first groove. The first elastic member and the limiting member are located on opposite sides of the bracket.

According to another embodiment, the heat sink of the present invention is disposed on a substrate. The substrate provides four fixing holes. The heat sink includes a heat dissipation module and a fixed module. The heat dissipation module includes a heat sink. The fixing module comprises two brackets, four fixing members, four first elastic members and four limiting members. The bracket has two through holes. The fixing member has a head and a stem. The rod portion is bored in the through hole. The stem has a first recess. The first elastic member is sleeved on the rod portion. The two ends of the first elastic member abut against the head and the bracket, respectively. The limiting member is sleeved on the rod portion. The limiting member has a plurality of limiting portions. The limiting portion protrudes in the first groove. The first elastic member and the limiting member are located on opposite sides of the bracket. The two brackets are respectively abutted on opposite sides of the heat sink, and the four fixing members are respectively fixed in the four fixing holes, so that the heat sink is fixed on the substrate.

In summary, the two brackets of the fixed module are respectively abutted on opposite sides of the heat sink, and the two brackets are fixed on the substrate by four fixing holes on the corresponding fixing substrate of the four fixing members. Thereby, the heat sink can be firmly fixed to the substrate. The first elastic member can increase the stability of the fixing process when the fixing member is fixed in the fixing hole. In addition, the limiting member cooperates with the first groove of the fixing member to prevent the fixing member from being separated from the through hole of the bracket.

The advantages and spirit of this creation can be further understood by the following detailed description of the creation and the drawings.

1 to 5, FIG. 1 is a perspective view of a heat sink 1 according to an embodiment of the present invention, and FIG. 2 is a heat sink 1 of FIG. 1 with a heat sink 102, a heat pipe 104 and a fan 106 removed. The rear perspective view, FIG. 3 is an exploded view of the fixed module 12 and the heat sink 100 in FIG. 2, and FIG. 4 is a perspective view of the fixed module 12 in FIG. 3 from another perspective. FIG. 3 is an exploded view of the fixed module 12 in the figure.

As shown in FIG. 1 to FIG. 2 , the heat sink 1 includes a heat dissipation module 10 and a fixed module 12 . The heat dissipation module 10 includes a heat sink 100, a plurality of heat sinks 102, a plurality of heat pipes 104, and a fan 106. The heat sinks 102 are spaced apart and sleeved on the heat dissipation section of the heat pipe 104. The heat sink 100 has a plurality of receiving slots 1000. The heat absorption section of the heat pipe 104 is disposed in the accommodating groove 1000. The fan 106 is disposed on the heat sink 102.

In this embodiment, the heat sink 1 is disposed on a substrate 3. In practical applications, the substrate 3 can be a circuit board. The substrate 3 includes an electronic component 30 such as a processor, display card or other integrated circuit chip or the like. The heat sink 100 is disposed on the electronic component 30 such that the heat absorbing section of the heat pipe 104 is attached to the electronic component 30. After the heat absorption section of the heat pipe 104 absorbs the heat generated by the electronic component 30, the heat is conducted to the heat sink 102 via the heat dissipation section of the heat pipe 104, and the heat sink 102 is dissipated by the fan 106. Further, the substrate 3 is provided with four fixing holes 320. In this embodiment, a fixing base 32 is disposed on the substrate 3, and four fixing holes 320 are formed at four corners of the fixing base 32.

As shown in FIG. 4 and FIG. 5 , the fixing module 12 includes two brackets 120 , four fixing members 122 , four first elastic members 124 , and four limiting members 126 . The bracket 120 has two through holes 1200. The fixing member 122 has a head portion 1220, a rod portion 1222 and a thread 1224. The rod portion 1222 has a first groove 1226, and the first groove 1226 is located between the head portion 1220 and the thread 1224. In this embodiment, the fixing member 122 can be a screw, and the first elastic member 124 can be a spring.

The first elastic member 124 is sleeved on the rod portion 1222, and the rod portion 1222 of the fixing member 122 is inserted into the through hole 1200 of the bracket 120 so that the two ends of the first elastic member 124 are respectively abutted. The head 1220 of the fixing member 122 is connected to the bracket 120. Then, the limiting member 126 is sleeved from the end of the thread 1224 of the fixing member 122 on the rod portion 1222 of the fixing member 122. In this embodiment, the limiting member 126 is annular and has a plurality of inwardly protruding limiting portions 1260. Therefore, the limiting portion 1260 of the limiting member 126 can be protruded into the first recess 1226 of the rod portion 1222 to prevent the fixing member 122 from being separated from the through hole 1200 of the bracket 120. After the assembly is completed, the first elastic member 124 and the limiting member 126 are respectively located on opposite sides of the bracket 120, as shown in FIG.

When the user wants to fix the heat sink 100 to the substrate 3 by the fixing module 12, the heat sink 100 may be first disposed on the electronic component 30. Then, the two brackets 120 of the fixed module 12 are respectively abutted on opposite sides of the heat sink 100. Next, the four fixing members 122 are respectively fixed in the four fixing holes 320, so that the heat sink 100 is fixed on the substrate 3. In this embodiment, the fixing hole 320 can be a screw hole, so that the thread 1224 of the fixing member 122 can be screwed into the fixing hole 320. When the fixing member 122 is fixed in the fixing hole 320, the first elastic member 124 is compressed to generate an elastic force against the head portion 1220 of the fixing member 122, which can increase the stability of the fixing process.

In addition, the head 1220 of the fixing member 122 can have a second groove 1228 and an annular side wall 1230, wherein the annular side wall 1230 surrounds the circumference of the second groove 1228. In this embodiment, the second groove 1228 is in the shape of a cross. In another embodiment, the second groove 1228 can also be in a shape of a letter. Therefore, the user can rotate the fixing member 122 by fitting the dismounting tool (for example, a cross or a flat-shaped screwdriver) of the second recess 1228 to disassemble the fixing module 12. Since the annular side wall 1230 surrounds the circumference of the second groove 1228, when the user uses too much force to disengage the disassembly tool from the second groove 1228, the annular side wall 1230 can stop the disassembly tool to prevent the disassembly tool. The electronic components on the substrate 3 are damaged.

Please refer to FIG. 6 to FIG. 10 , FIG. 6 is a perspective view of a heat dissipating device 1 ′ according to an embodiment of the present invention, and FIG. 7 is a heat dissipating device 1 ′ of FIG. 6 with the heat dissipating fins 102 and the heat pipe 104 removed. A perspective view of the rear of the fan 106, FIG. 8 is an exploded view of the fixed module 12' and the heat sink 100 in FIG. 7, and FIG. 9 is a perspective view of the fixed module 12' in FIG. Figure 10 is an exploded view of the fixed module 12' in Figure 8.

The heat dissipating device 1' is mainly different from the above-described heat dissipating device 1 in that the fixing module 12' of the heat dissipating device 1' further comprises four second elastic members 128, as shown in Figs. 6 to 10. The second elastic member 128 is sleeved on the rod portion 1222 of the fixing member 122. The two ends of the second elastic member 128 abut against the limiting member 126 and the bracket 120 respectively. After the assembly is completed, the first elastic member 124 and the second elastic member 128 are respectively located on opposite sides of the bracket 120, as shown in FIG. In this embodiment, the second elastic member 128 can be a spring. The first elastic member 124 and the second elastic member 128 can maintain the perpendicularity of the fixing member 122, so that the user can easily fix the fixing member. The thread 1224 of the 122 is aligned with the fixing hole 320, thereby improving assembly efficiency. It should be noted that the components of the same reference numerals as those shown in FIGS. 1-5 are substantially the same, and are not described herein again.

In summary, the two brackets of the fixed module are respectively abutted on opposite sides of the heat sink, and the two brackets are fixed on the substrate by four fixing holes on the corresponding fixing substrate of the four fixing members. Thereby, the heat sink can be firmly fixed to the substrate. The first elastic member and/or the second elastic member can increase the stability of the fixing process when the fixing member is fixed in the fixing hole. In addition, when the first elastic member and the second elastic member are respectively located on opposite sides of the bracket, the first elastic member and the second elastic member can maintain the perpendicularity of the fixing member, so that the thread of the fixing member can be easily used by the user. The fixing holes are aligned to improve assembly efficiency. Furthermore, the limiting member cooperates with the first groove of the fixing member to prevent the fixing member from being separated from the through hole of the bracket. Moreover, the annular side wall of the head of the fixing member can stop the disassembly tool to prevent the disassembly tool from damaging the electronic components on the substrate.

The above descriptions are only preferred embodiments of the present invention, and all changes and modifications made by the scope of the patent application of the present invention should be covered by the present invention.

1, 1'‧‧‧ heat sink
3‧‧‧Substrate
10‧‧‧ Thermal Module
12, 12'‧‧‧ fixed module
30‧‧‧Electronic components
32‧‧‧ fixed seat
100‧‧‧ Heat sink
102‧‧‧ Heat sink
104‧‧‧heat pipe
106‧‧‧fan
120‧‧‧ bracket
122‧‧‧Fixed parts
124‧‧‧First elastic parts
126‧‧‧Limited parts
128‧‧‧Second elastic parts
320‧‧‧Fixed holes
1000‧‧‧ accommodating slots
1200‧‧‧through hole
1220‧‧‧ head
1222‧‧‧ Rod
1224‧‧‧Thread
1226‧‧‧first groove
1228‧‧‧second groove
1230‧‧‧Circular side wall
1260‧‧‧Limited

Fig. 1 is a perspective view of a heat sink according to an embodiment of the present invention. Figure 2 is a perspective view of the heat sink of Figure 1 with the heat sink, heat pipe and fan removed. Figure 3 is an exploded view of the fixed module and the heat sink in Figure 2. Figure 4 is a perspective view of the fixed module of Figure 3 in another perspective. Figure 5 is an exploded view of the fixed module in Figure 3. Figure 6 is a perspective view of a heat sink according to an embodiment of the present invention. Figure 7 is a perspective view of the heat sink of Figure 6 with the heat sink, heat pipe and fan removed. Figure 8 is an exploded view of the fixed module and the heat sink in Figure 7. Figure 9 is a perspective view of the fixed module of Figure 8 in another perspective. Figure 10 is an exploded view of the fixed module in Figure 8.

3‧‧‧Substrate

12‧‧‧Fixed modules

30‧‧‧Electronic components

32‧‧‧ fixed seat

100‧‧‧ Heat sink

120‧‧‧ bracket

122‧‧‧Fixed parts

124‧‧‧First elastic parts

1000‧‧‧ accommodating slots

Claims (10)

A fixing module comprises: two brackets, the bracket has two through holes; four fixing members, the fixing member has a head and a rod portion, the rod portion is disposed in the through hole, and the rod portion has a first portion a first elastic member, the first elastic member is sleeved on the rod portion, the two ends of the first elastic member abut against the head and the bracket respectively; and four limiting members, the limit The positional member is sleeved on the rod portion, the limiting member has a plurality of limiting portions, the limiting portions projecting in the first groove, the first elastic member and the limiting member are located on the bracket Relative to the two sides. The fixing module of claim 1, wherein the rod portion further has a thread, and the first groove is located between the head and the thread. The fixing module of claim 1, wherein the head has a second recess and an annular side wall surrounding the second recess. The fixing module of claim 1, further comprising four second elastic members, wherein the second elastic member is sleeved on the rod portion, and the two ends of the second elastic member respectively abut the limiting member and the support. A heat dissipating device is disposed on a substrate, wherein the substrate provides four fixing holes, the heat dissipating device comprises: a heat dissipating module comprising a heat sink; and a fixing module comprising two brackets, four fixing members, and four first elastic And the four limiting members, the bracket has a two-way hole, the fixing member has a head portion and a rod portion, the rod portion is disposed in the through hole, the rod portion has a first groove, the first portion The elastic member is sleeved on the rod portion, and the two ends of the first elastic member respectively abut the head portion and the bracket, the limiting member is sleeved on the rod portion, and the limiting member has a plurality of limits The first elastic member and the limiting member are located on opposite sides of the bracket; wherein the two brackets respectively abut the opposite side of the heat sink The four fixing members are respectively fixed in the four fixing holes, so that the heat sink is fixed on the substrate. The heat sink of claim 5, wherein the stem further has a thread, the first groove being located between the head and the thread. The heat sink of claim 5, wherein the head has a second recess and an annular side wall surrounding the second recess. The heat dissipation device of claim 5, wherein the fixing module further comprises four second elastic members, the second elastic member is sleeved on the rod portion, and the two ends of the second elastic member respectively abut the limit The piece and the bracket. The heat sink of claim 5, wherein the substrate comprises an electronic component, and the heat sink is disposed on the electronic component. The heat dissipation device of claim 5, wherein the heat dissipation module comprises a plurality of heat sinks, a plurality of heat pipes, and a fan, and the heat sinks are spaced apart and sleeved on the heat pipes, the heat sinks having a plurality of capacities The heat pipes are disposed in the accommodating grooves, and the fans are disposed on the heat sinks.