TWI445488B - Heat dissipating device and bracket thereof - Google Patents

Description

Heat sink and its bracket

The present invention relates to a heat sink and a bracket therefor.

Electronic devices, such as computer cases or server cabinets, typically require a fan to dissipate heat. Generally, the fan has two fixing methods inside the computer case, one is to fix the fan and the CPU heat sink together; the other is to fix the fan on the wall of the chassis. Since the fan needs to be fixed to a specific component of the computer case, the fan fixing method in the chassis is relatively simple and limited.

In view of the above, it is necessary to provide a heat sink having a flexible fixing method and a bracket therefor.

A heat dissipating device for mounting a board body of an electronic device, comprising a bracket and a heat dissipating component, the bracket comprising a first fixing portion for fixing the heat dissipating component and a second fixing portion, the second The fixing portion is screwed to the first fixing portion and can be fastened to the plate body. The plate body is provided with at least one through hole, and the second fixing portion includes at least one fastening component, and the fastening component comprises a buckle portion. The buckle portion includes a plurality of blocks spaced apart from each other to be engaged with the through holes of the plate body, and each of the blocks includes two guiding faces extending toward each other.

A bracket for fixing a heat dissipating component to a board body, comprising a first fixing portion and a second fixing portion, wherein the first fixing portion is for fixing the heat dissipating component, and the second fixing portion is buckled The plate body has a first fixing portion screwed to the second fixing portion.

The heat dissipating device of the present invention can be flexibly fixed to the heat dissipating component through the bracket body.

10‧‧‧fan

12‧‧‧Fixed holes

20‧‧‧First Fixed Department

21‧‧‧ bottom wall

22‧‧‧ frame

222‧‧‧through hole

224‧‧‧ positioning slot

24‧‧‧ side wall

25‧‧‧End wall

252‧‧‧ openings

26‧‧‧容容

28‧‧‧ Stud

30‧‧‧Second fixed department

34‧‧‧ bushings

36‧‧‧Card fasteners

361‧‧‧ screw

362‧‧‧Snap Department

38‧‧‧ nuts

40‧‧‧ card sales

100‧‧‧heating device

1 is an exploded view of a preferred embodiment of a heat sink of the present invention.

2 is an enlarged view of the snap member of FIG. 1.

Figure 3 is an assembled view of Figure 1.

4 is a perspective view of the heat sink and a board of FIG. 3.

Figure 5 is an assembled view of Figure 4.

Referring to FIG. 1 and FIG. 4 together, the heat dissipating device 100 of the present invention is used for mounting a board 50 of an electronic device. The preferred embodiment includes a heat dissipating component such as a fan 10 and a fan 10 is fixed to the board. The bracket of the body 50. The bracket includes a first fixing portion 20 and a second fixing portion 30. A fixing hole 12 is defined in each of the four corners of the fan 10.

The first fixing portion 20 is configured to fix the fan 10 and includes a hollow frame 22 and two studs 28 . The frame 22 includes a bottom wall 21, a top wall, two side walls 24, and an end wall 25. The top wall, the bottom wall 21, the side wall 24 and the end wall 25 enclose a receiving cavity 26 for receiving the fan 10. The end wall 25 is provided with a square opening 252 to correspond to the fan 10. A through hole 222 is defined in each of the two opposite corners of the end wall 25. The end wall 25 is provided with two elongated positioning grooves 224 perpendicular to each other from the other two opposite corners. One positioning groove 224 is perpendicular to the bottom wall 21, and the other positioning groove 224 is parallel to the bottom wall 21. The two studs 28 are vertically disposed on the outer side of the bottom wall 21.

The second fixing portion 30 includes two bushings 34, two latching members 36 and two nuts 38 as resisting members. Referring to FIG. 2 together, each of the fastening members 36 includes a screw 361 and is disposed therein. A locking portion 362 at one end of the screw 361. The latching portion 362 includes a plurality of latching blocks 364 spaced apart in the circumferential direction. The top surface and the bottom surface of each of the latching blocks 364 form opposite guiding surfaces 366 and 365. The guiding surfaces 365 and 366 are beveled or curved. surface. The sleeve 34 is internally threaded, and the internal thread of the upper portion of the sleeve 34 corresponds to the thread of the stud 28, and the internal thread of the lower portion of the sleeve 34 corresponds to the thread of the screw 361 of the clip member 36.

Referring to FIG. 3 , when the heat dissipating device 100 is assembled, the fan 10 is received in the accommodating cavity 26 of the first fixing portion 20 and penetrates through the positioning slots 224 of the frame 22 through the two pairs of elastic latching pins 40 . The through hole 222 and the fixing hole 12 of the fan 10 fix the fan 10 to the first fixing portion 20. The two nuts 38 are rotatably sleeved on the screws 361 of the two fastening members 36. The two sleeves 34 are respectively rotatably sleeved on the two studs 28 and the two screws 361. In other embodiments, different sizes of fans can be installed at different positions of the positioning slot 224 through the adjustment bayonet 40.

Referring to FIG. 4 and FIG. 5, in the embodiment, the board body 50 is a motherboard of a computer, and a pair of through holes 52 are defined therein. The two through holes 52 are provided in the vicinity of a CPU (Central Processing Unit) (not shown) of the main board. The through hole 52 has a smaller diameter than the outer diameter of the latching portion 362 of the latching member 36. In other embodiments, the two through holes 52 can be disposed at other positions of the computer according to heat dissipation requirements.

When the heat dissipating device 100 is fixed to the plate body 50, the locking portions 362 of the two latching members 36 are opposite to the through holes 52 of the plate body 50, and the two latching members are biased toward the plate body 50. The snap block 364 of 36 is slightly deformed and slides along its guiding surface 365 into the through hole 52 of the plate body 50, so that the two latching blocks 364 are stuck to the baffle body 50. The two nuts 38 are rotated such that the lower end faces abut against the plate body 50 to securely fix the heat sink 100 to the plate body 50. When disassembling, a force is applied in a direction away from the plate body 50, so that the locking block 364 of the two latching portions 362 is slightly deformed and slides out the through hole 52 of the plate body 50 along the guiding surface 366 thereof, thereby dissipating the heat dissipation. Loading The set 100 is detached from the plate body 50.

In the present embodiment, the two sleeves 34 can be rotated as needed to adjust the distance between the fan 10 and the plate 50.

In other embodiments, the two studs 28 and the sleeve 34 can be omitted, and only the bottom wall 21 of the frame 22 is screwed with the screw 361 of the latching member 36 of the second fixing portion 30. Threaded bushing. A fixing block may be directly formed as a resisting member near the end of the two latching members 362 away from the latching portion 362. The distance between the fixing block and the latching portion 362 is approximately equal to the thickness of the board body 50.

The heat dissipating device 100 of the present invention can be assembled at any position of the board body 50 according to requirements, that is, only the through hole is correspondingly disposed in the board body 50, and the heat dissipating device 100 can also adjust the gap between the fan 10 and the board body 50. distance.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧fan

12‧‧‧Fixed holes

20‧‧‧First Fixed Department

21‧‧‧ bottom wall

22‧‧‧ frame

222‧‧‧through hole

224‧‧‧ positioning slot

24‧‧‧ side wall

25‧‧‧End wall

252‧‧‧ openings

26‧‧‧容容

28‧‧‧ Stud

30‧‧‧Second fixed department

34‧‧‧ bushings

36‧‧‧Card fasteners

361‧‧‧ screw

362‧‧‧Snap Department

38‧‧‧ nuts

40‧‧‧ card sales

100‧‧‧heating device

Claims (9)

A heat dissipating device for mounting a board body of an electronic device, comprising a bracket and a heat dissipating component, the bracket comprising a first fixing portion for fixing the heat dissipating component and a second fixing portion, the second The fixing portion is screwed to the first fixing portion and can be fastened to the plate body. The plate body is provided with at least one through hole, and the second fixing portion includes at least one fastening component, and the fastening component comprises a buckle portion. The buckle portion includes a plurality of blocks spaced apart from each other to be engaged with the through holes of the plate body, and each of the blocks includes two guiding faces extending toward each other. The heat dissipating device of claim 1, wherein the latching member is further provided with a screw, the latching portion is disposed at one end of the screw, the first fixing portion includes at least one stud, and the second fixing portion Also included is a sleeve that is threadedly coupled to the screw and stud, respectively. The heat dissipating device of claim 2, wherein the second fixing portion further comprises at least one resisting member, the resisting member rotating the screw of the locking member and abutting the plate body. The heat dissipating device of claim 2, wherein the first fixing portion comprises a hollow frame, the frame body comprises a bottom wall, a top wall, two side walls and an end wall, the top wall and the bottom wall, The side wall and the end wall enclose a receiving cavity for receiving the heat dissipating component, and the screw is connected to the outer side surface of the bottom wall. The heat dissipating device of claim 4, wherein the heat dissipating component is a fan, the end wall corresponding to the fan is provided with an opening, and the end wall is respectively provided with a through hole at two opposite corners, the end wall The other two diagonal corners are provided with two mutually perpendicular elongated positioning grooves. A bracket for fixing a heat dissipating component to a board body includes a first fixing portion for fixing the heat dissipating component and a second fixing portion including at least one clip The latching member includes a latching portion, and the latching portion includes a plurality of latching blocks that are disposed to be engaged with the through hole of the board body, and each of the latching blocks includes two guiding surfaces extending toward each other, and the latching block can be card The first fixing portion is screwed to the second fixing portion. The bracket of claim 6, wherein the latching member is further provided with a screw, the latching portion is disposed at one end of the screw, the first fixing portion includes at least one stud, and the second fixing portion further A sleeve is integrally threadedly connected to the screw and the stud. The bracket of claim 7, wherein the second fixing portion further comprises at least one resisting member that rotates the screw of the locking member and can abut the plate. The bracket of claim 7, wherein the first fixing portion comprises a hollow frame, the frame body comprises a bottom wall, a top wall, two side walls and an end wall, the top wall, the bottom wall and the side wall And the end wall encloses a receiving cavity for receiving the heat dissipating component, and the screw is connected to the outer side surface of the bottom wall.