TWM537642U - Lamp structure - Google Patents

Abstract

A lamp structure includes a semiconductor light emitting module, a bearing member and an enclosing member. The enclosing member encloses the semiconductor light emitting module and the bearing member and includes a first lens. The enclosing member is integrated with the semiconductor light emitting module and the bearing member to form such an enclosing integrated structure, and light emitting from the semiconductor light emitting module passes through the first lens. The enclosing structure prevents elements from peeling off due to degumming of adhesive and also provides an excellent water-proof effect.

Description

Lamp

This creation relates to a luminaire, and more particularly to a luminaire using a semiconductor illuminating assembly.

The body of the conventional projection lamp is mostly made of glass material, and a reflective aluminum layer is coated on the inner surface of the main body to reflect light. Such a structure is not only environmentally friendly but also has a poor heat dissipation effect, thereby affecting the service life of the lamp. In addition, conventional projection lamps often use a glass lens, and the lens is adhered to the main body by the adhesive, which causes a safety problem when the component is peeled off due to the degumming.

The purpose of the present invention is to provide a luminaire which encloses a light source and an electronic component associated with the light source by integrally forming a cover member. Since such a structure does not use adhesive bonding, there is no degumming and the component is detached. The problem, and the overall encapsulated structure can have a waterproof effect on the light source and the electronic component, and at the same time form a lens and a heat dissipation hole on the cover member, which can produce a desired light pattern and solve the problem of heat dissipation, and is also made of plastic. Another lens is formed on the main body to enhance the optical effect, so that it is not necessary to apply a reflective aluminum layer on the inner surface of the main body, so that the product is more environmentally friendly.

An embodiment of the luminaire provided by the present invention includes a semiconductor light emitting assembly, a carrier, and a cover. The carrier carries a semiconductor light emitting component, the cladding covers the semiconductor light emitting component and the carrier and has a first lens, wherein the covering covers the semiconductor light emitting component and the carrier, and has a first lens covering the semiconductor light emitting component The cover member is an integrally formed structure. The present invention utilizes an integrally formed manner to form a structure in which the cover member covers the semiconductor light-emitting assembly and the carrier member, so that there is no prior art in which the adhesive is adhered and may be degummed. The problem of the component falling off, in addition, the structure of the cover member covering the semiconductor light-emitting component and the carrier member can also achieve a fairly good waterproof effect, and the light emitted by the semiconductor light-emitting component can be emitted through the first lens, thereby generating hope Light type.

In another embodiment, the cover has a top portion defining a recess at the top, the first lens being disposed in the recess and above the semiconductor light emitting assembly.

In another embodiment, the carrier comprises a circuit board, ie the electronic components associated with the semiconductor lighting assembly can be enclosed in the cladding together with the semiconductor lighting assembly.

In another embodiment, the carrier includes a plurality of terminals that extend from the circuit board to the exterior of the cladding.

In another embodiment, the semiconductor light emitting assembly includes at least one light emitting diode.

In another embodiment, the cover member has at least one heat dissipation hole formed on the outer peripheral wall of the cover member, and the position of the heat dissipation hole corresponds to the semiconductor light emitting assembly, so that the heat generated by the semiconductor light emitting assembly can pass through the heat dissipation hole. Dissipates to the outside for heat dissipation.

In another embodiment, the cover has at least one groove formed in the outer peripheral wall of the cover and corresponding to the carrier.

In another embodiment, the luminaire further includes a lamp cover coupled to the cover member, and the light emitted by the semiconductor illuminating assembly is sequentially irradiated to the outside through the first lens and the lamp cover.

In another embodiment, the lamp cover is sleeved on the outer peripheral wall of the cover member.

In another embodiment, the covering member further includes a flange formed on the outer peripheral wall of the covering member. When the lamp cover is sleeved on the outer peripheral wall of the covering member, the bottom edge of the lamp cover abuts against the flange.

In another embodiment, the lamp cover includes a second lens and a reflective surface, the second lens covers the first lens and the reflective surface surrounds the second lens and the semiconductor light emitting component, and the light emitted by the semiconductor light emitting component sequentially passes through the first lens and the second The lens emits light, and part of the light is reflected by the reflecting surface to emit light. Since the lampshade has a second lens, the optical effect can be enhanced again, so that it is not necessary to apply an aluminum film on the reflecting surface of the lampshade, which is more in line with environmental standards.

In another embodiment, the reflective surface is a conical surface.

The luminaire of the present invention forms the covering member to cover the semiconductor illuminating component and the supporting member by means of integral forming, so that there is no problem that the component is detached due to debonding in the prior art by the adhesive bonding, and the integrally formed covering member The structure of the semiconductor light-emitting component and the carrier can also achieve a relatively good waterproof effect. In addition, in an embodiment, since the lampshade has a second lens, the optical effect can be improved again, so that it is not required to be coated on the reflective surface of the lamp cover. The aluminum film makes the lamps of this creation more environmentally friendly.

The above and other objects, features and advantages of the present invention will become more apparent and understood.

Referring to Figures 1 and 2, an embodiment of the luminaire of the present invention is shown. The luminaire 100 of the present invention includes a semiconductor light emitting assembly 110, a carrier 120, and a cover member 130. The carrier 120 carries the semiconductor light emitting component 110, and the covering member 130 covers the semiconductor light emitting component 110 and the carrier 120 and has a first lens 132 covering the semiconductor light emitting component 110. The covering component 130 is an integrally formed covered semiconductor light emitting device. The component 110 and the structure of the carrier 120, the light emitted by the semiconductor light emitting component 110 passes through the first lens 132. In the present embodiment, the cover member 130 has a top portion 134, and a recess portion 136 is formed in the top portion 134. The first lens 132 is disposed in the recess portion 136 and is located above the semiconductor light emitting assembly 110.

In this embodiment, the covering member 130 can integrally encapsulate the semiconductor light emitting component 110 and the carrier 120 by means of burying, that is, the semiconductor light emitting component 110 and the carrier 120 are assembled first and then embedded in the mold. And fixing the two sides of the semiconductor light emitting component 110 with special clips, so that the buried semiconductor light emitting component 110 and the carrier 120 are not skewed during the process of injecting the plastic, and then the plastic is injected into the mold and The semiconductor light emitting component 110 and the carrier 120 pre-placed in the mold are coated. After the plastic is cooled and formed, the structure in which the covering member 130 integrally covers the semiconductor light emitting component 110 and the carrier 120 is formed. Further, in the present embodiment, the plastic of the covering member 130 is, for example, silicone, and the present embodiment forms the covering member 130 by, for example, a technique of forming a low-temperature flow path. Because of its high coefficient of thermal expansion, silicone rubber expands when heated, and only slightly shrinks during cooling. It is difficult to accurately control the size of the finished product. With low-temperature flow forming technology, the silicone can be kept at a lower temperature and maintain its fluidity. Precision control of finished product size.

In the present embodiment, the semiconductor light emitting component 110 includes at least one semiconductor light emitting element such as a light emitting diode, an organic light emitting diode, a laser diode, or other semiconductor light emitting element. When the number of the semiconductor light emitting elements is plural, they may be arranged in an array of semiconductor light emitting elements. Hereinafter, an example in which a light-emitting diode is used will be described. The carrier 120 includes a circuit board that carries the light-emitting diodes, and the light-emitting diodes are electrically connected to the circuit board, and the circuit board also carries electronic components associated with the semiconductor light-emitting component 110. In addition, the carrier 120 further includes a plurality of terminals 122 electrically connected to the circuit board and extending from the circuit board to the outside of the cover member 130. In this embodiment, the carrier 120 includes two terminals 122. The two terminals 122 can be connected to an external power source to power the carrier 120 and the semiconductor lighting assembly 110. In addition, it is worth noting that the use of silicone as the material of the cover member 130 causes a change in the color temperature of the light emitted. This is called "color temperature drift", which is mainly because the thickness of the cover member 130 made of silicone rubber affects the light output. The color temperature changes. For example, in the case of a light-emitting diode in which yellow phosphor is excited by blue light to mix white light, when the thickness of the covering member 130 is thin, the color temperature drift of the light exiting falls to ±500 K, because the covering member 130 covers the semiconductor. After the light-emitting component 110, the position of the blue light-reflecting interface emitted by the blue light-emitting diode chip is changed, so that the blue light of the light-emitting is increased, and the blue light of the total reflection is reduced, thereby reducing the generation of yellow light, that is, the blue light of the light is increased. Since the yellow light is reduced and the color temperature is changed, the color temperature of the light can be controlled by changing the thickness of the covering member 130.

The cover member 130 has at least one heat dissipation hole 138. The heat dissipation hole 138 is formed on the outer peripheral wall 135 of the cover member 130, and the position of the heat dissipation hole 138 corresponds to the semiconductor light-emitting assembly 110. Thus, the heat generated by the semiconductor light-emitting assembly 110 can be dissipated through heat. The hole 138 is dissipated to the outside to achieve a heat dissipation effect. In the present embodiment, two heat dissipation holes 138 are formed in the outer peripheral wall 135 of the covering member 130 at positions opposite to the outer peripheral wall 135, but are not limited thereto, and one or two or more may be provided.

In this embodiment, the cover member 130 further has at least one recess 137 formed on the outer peripheral wall 135 of the cover member 130 and corresponding to the carrier 120. The function of the recess 137 is mainly to fix the luminaire 100. In the lamp holder.

In the present embodiment, the luminaire 100 may further include a lamp cover 140. The lamp cover 140 is coupled to the cover member 130. The light emitted by the semiconductor light-emitting assembly 110 is sequentially irradiated to the outside through the first lens 132 and the lamp cover 140. The cover 140 is sleeved on the outer peripheral wall 135 of the cover member 130. In the embodiment, the cover member 130 further includes a flange 139. The flange 139 is also formed on the outer peripheral wall 135 of the cover member 130. When disposed on the outer peripheral wall 135 of the cover member 130, the bottom edge 142 of the lamp cover 140 abuts against the flange 139, thereby positioning the lamp cover 140 at the cover member 130. The lamp cover 140 includes a second lens 144 and a reflective surface 146. The second lens 144 covers the first lens 132 and the reflective surface 146 surrounds the second lens 144. The light emitted by the semiconductor light emitting component 110 sequentially passes through the first lens 132 and the second lens 144. The light is emitted, and part of the light is reflected by the reflecting surface 146 to emit light. In this embodiment, the lamp cover 140 has a truncated cone shape and can be made of a plastic material, and has a first opening 141 and a second opening 143. The first opening 141 and the second opening 143 are formed on opposite end faces of the lamp cover 140. The second opening 143 extends toward the inside of the lamp cover 140 to form a boss 145. The inside of the boss 145 is hollow and defines a recessed portion 147. The recessed portion 147 is sleeved on the outer peripheral wall 135 of the cover member 130 and coated with adhesive. The wall surface of the recessed portion 147, whereby the lamp cover 140 is fixed to the outer peripheral wall 135 of the covering member 130. The top of the boss 145 forms a second lens 144. The reflecting surface 146 is an inner peripheral surface of the globe 140 and extends from the bottom edge of the boss 145 to the first opening 141, so that the reflecting surface 146 is a conical surface. In the present embodiment, a mesh pattern is formed on the reflecting surface 146 ( For example, the score can make the light more uniform after being reflected by the reflecting surface 146. The light emitted by the semiconductor light-emitting component 110 is emitted through the first lens 132 and the second lens 144, and part of the light is reflected by the reflective surface 146 to make the overall light into a desired light pattern.

Referring to Figures 3 and 4, another embodiment of the luminaire of the present invention is shown. In the luminaire 100' of the present embodiment, except for the first lens 132' and the second lens 144', the remaining structures and components are the same as those of the embodiment shown in FIGS. 1 and 2, so the same components are given the same The symbols are omitted and their descriptions are omitted. In the present embodiment, the curvature of the first lens 132' is larger than that of the first lens 132 of the embodiment shown in FIGS. 1 and 2, and the curvature of the second lens 144' is also higher than the embodiment shown in FIGS. 1 and 2. The first lens 132 is large, so that the lamp of the embodiment can produce a different light pattern than the lamp of the embodiment shown in FIGS. 1 and 2, and the thickness of the first lens 132' of the present embodiment is greater than that of FIG. 1 and FIG. The first lens 132 of the embodiment shown in Fig. 2 has a large thickness. As described above, the thickness of the silicone affects the color temperature of the light, and thus the color temperature of the light is also different.

The luminaire of the present invention integrally encapsulates the semiconductor light emitting component 110 and the carrier 120 with the covering member 130, and does not need to combine the light source with the main body as in the prior art, thereby preventing the problem of debonding and causing the component to fall off. The created integrated enveloping structure can also achieve the waterproof and moisture-proof effect, and further increase the life of the luminaire. In addition, the luminaire of the present invention can generate a secondary optical effect on the light emitted by forming the second lens 144 in the lamp cover 140, so The aluminum layer is coated on the reflective surface 146, so the luminaire of the present invention is more environmentally friendly than the prior art luminaire.

Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and those skilled in the art to which the present invention pertains may be modified and modified without departing from the spirit and scope of the present invention. Retouching, therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application attached.

100, 100’‧‧‧ lamps

110‧‧‧Semiconductor lighting components

120‧‧‧Carrier

122‧‧‧terminal

130‧‧‧Cover parts

132, 132'‧‧‧ first lens

134‧‧‧ top

135‧‧‧ peripheral wall

136‧‧‧ recess

137‧‧‧ Groove

138‧‧‧ vents

139‧‧‧Front

140‧‧‧shade

141‧‧‧ first opening

142‧‧‧ bottom edge

143‧‧‧ second opening

144, 144'‧‧‧ second lens

145‧‧‧Boss

146‧‧‧reflecting surface

147‧‧‧Depression

1 is an exploded perspective view of an embodiment of the luminaire of the present invention. 2 is a cross-sectional view of the embodiment of the luminaire of FIG. 1 after assembly. 3 is an exploded perspective view of another embodiment of the luminaire of the present invention. 4 is a cross-sectional view of the embodiment of the luminaire of FIG. 3 in combination.

100‧‧‧Lights

110‧‧‧Semiconductor lighting components

120‧‧‧Carrier

122‧‧‧terminal

130‧‧‧Cover parts

132‧‧‧First lens

134‧‧‧ top

135‧‧‧ peripheral wall

136‧‧‧ recess

138‧‧‧ vents

139‧‧‧Front

140‧‧‧shade

141‧‧‧ first opening

142‧‧‧ bottom edge

143‧‧‧ second opening

144‧‧‧second lens

145‧‧‧Boss

146‧‧‧reflecting surface

147‧‧‧Depression

Claims (12)

A luminaire comprising: a semiconductor light emitting component; a carrier carrying the semiconductor light emitting component; and a covering member covering the semiconductor light emitting component and the carrier and having a first lens covering the semiconductor light emitting component Wherein the covering member is an integrally formed structure. The luminaire of claim 1, wherein the covering member has a top portion, and a recess is formed at the top portion, the first lens is disposed in the recess portion and located above the semiconductor light emitting assembly. The luminaire of claim 1, wherein the carrier comprises a circuit board. The luminaire of claim 3, wherein the carrier further comprises a plurality of terminals extending from the circuit board to the outside of the cover member. The luminaire of claim 1, wherein the semiconductor light emitting component comprises at least one light emitting diode. The luminaire of claim 1, wherein the covering member has at least one heat dissipation hole, the at least one heat dissipation hole is formed on an outer peripheral wall of the covering member, and the position of the at least one heat dissipation hole corresponds to the semiconductor Light-emitting component. The luminaire of claim 1, wherein the covering member has at least one groove formed on an outer peripheral wall of the covering member and corresponding to the carrier. The luminaire of claim 1, further comprising a lamp cover coupled to the cover member and covering the first lens of the semiconductor light emitting assembly. The luminaire of claim 8, wherein the covering member has a top portion, and a recess is formed at the top portion, the first lens is disposed in the recess portion and located above the semiconductor light emitting assembly, the lamp cover A peripheral wall provided at the top. The luminaire of claim 9, wherein the covering member further comprises a flange formed on the outer peripheral wall of the covering member when the lamp cover is sleeved on the outer peripheral wall of the top portion The bottom edge of the lampshade abuts the flange. The luminaire of claim 8, wherein the lamp cover comprises a second lens and a reflective surface, the second lens covers the first lens and the reflective surface surrounds the second lens and the semiconductor light emitting component. The luminaire of claim 11, wherein the reflecting surface is a conical surface.