TWM536751U - Automatic guiding education system of array probes - Google Patents

Automatic guiding education system of array probes Download PDF

Info

Publication number
TWM536751U
TWM536751U TW105213084U TW105213084U TWM536751U TW M536751 U TWM536751 U TW M536751U TW 105213084 U TW105213084 U TW 105213084U TW 105213084 U TW105213084 U TW 105213084U TW M536751 U TWM536751 U TW M536751U
Authority
TW
Taiwan
Prior art keywords
module
probe
unit
axial
displacement
Prior art date
Application number
TW105213084U
Other languages
Chinese (zh)
Inventor
Mao-Shan Lee
Yu-His Yu
Cheng-Wen Wu
Ching-Chao Yang
Sung-Lin Wu
Cheng-Hung Wu
Original Assignee
Gallant Precision Machining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gallant Precision Machining Co Ltd filed Critical Gallant Precision Machining Co Ltd
Priority to TW105213084U priority Critical patent/TWM536751U/en
Publication of TWM536751U publication Critical patent/TWM536751U/en

Links

Landscapes

  • Length Measuring Devices With Unspecified Measuring Means (AREA)

Description

列陣探針自動引導教育系統 Array probe automatic guidance education system

本創作是有關於一種列陣探針自動引導教育系統,且特別是有關於一種自動化調整探針與待測部位之裝置。 This creation is about an array probe automatic guidance education system, and in particular, a device for automatically adjusting the probe and the part to be tested.

電磁感應式觸控板。面板,其係廣泛地應用於各類顯示器、手持式通訊裝置或各類智能型裝置。然面板於製程中需要經過至少一次檢測,以確認面板是否有損壞。 Electromagnetic inductive touchpad. Panels are widely used in various types of displays, handheld communication devices or various types of smart devices. However, the panel needs to be tested at least once in the process to confirm whether the panel is damaged.

現有的面板檢測方式,其係以人工方式將陣列式探針對準所欲測試面板之電晶體,再以探針接觸電晶體,以進行檢測面板之程序。 The existing panel detecting method is to manually align the array probe to the transistor of the panel to be tested, and then contact the transistor with the probe to perform the procedure of detecting the panel.

如上所述之面板檢測方式,仍有缺點存在,其係因電晶體之面積甚小,工作人員要以高倍顯微鏡觀察探針與電晶體二者的相對位置,是否有妥善接觸,並適時調整探針相對於電晶體的位置。 As mentioned above, there are still some shortcomings in the panel detection method. Because the area of the transistor is very small, the staff should observe the relative position of the probe and the transistor with a high power microscope, whether there is proper contact, and timely adjustment. The position of the needle relative to the transistor.

綜合上述,現有的面板檢測方式需要使用人工方式調整探針與電晶體之間的位置,所以需要較長的工時,以進行調整,故若進行大量面板檢測時,並且面板種類甚多時,工時與人工的消耗係無形中增加,對廠商而言,成本亦無形中增加,故如何改善現有的面板檢測方式與降低成本就有可以討論的空間。 In summary, the existing panel detection method requires manual adjustment of the position between the probe and the transistor, so that a long working time is required for adjustment, so if a large number of panel inspections are performed and there are many types of panels, The consumption of labor and labor is invisibly increased. For manufacturers, the cost is also invisibly increased. Therefore, there is room for discussion on how to improve the existing panel inspection methods and reduce costs.

本創作提供一種列陣探針自動引導教育系統,其係利用自動化檢測待測部位與探針之位置,並調整待測部位與探針二者的位置,藉以縮短工時,以達到降低成本與精準檢測的效果。 The present invention provides an array probe automatic guiding education system, which utilizes automatic detection of the position of the portion to be tested and the probe, and adjusts the position of both the portion to be tested and the probe, thereby shortening the working hours, thereby reducing the cost and The effect of accurate detection.

本創作提出一種列陣探針自動引導教育系統,其包含有:一多軸向位移模組;一探針模組,其係設於該多軸向位移模組,該探針模組具有複數個探針;一監看視覺模組,其係設於該多軸向位移模組,以及一控制模組,其係訊號連接該多軸向位移模組、該監看視覺模組與該探針模組;其中,該多軸向位移模組係使該探針模組移動至一待測物的上方,該待測物具有多個待測部位;該監看視覺模組係擷取該些探針之探針影像資訊,以使該控制模組計算出第一座標系之第一水平座標值;該監看視覺模組係擷取該些待測部位之待測影像資訊,以使該控制模組計算出第二標系之第二水平座標值;該控制模組依據該第一水平座標值與該第二水平座標值座,以計算出該第一水平座標值與該第二水平座標值座之偏移量,若有該偏移量產生,則調整該探針模組之水平位置,以使該探針模組之水平位置符合該待測部位之水平位置後,再垂直移動該探針模組,並由監看視覺模組全程監測;當該些探針有水平滑移時,該探針模組停止移動,並判斷該探針已接觸該些待測部位,而得出該第一座標系相對該第二座標系之垂直座標值。 The present invention provides an array probe automatic guiding education system, which comprises: a multi-axial displacement module; a probe module is disposed on the multi-axis displacement module, the probe module has a plurality of a monitoring module; the monitoring visual module is disposed in the multi-axial displacement module, and a control module, wherein the signal is connected to the multi-axial displacement module, the monitoring visual module and the probe a needle module; wherein the multi-axis displacement module moves the probe module to an object to be tested, the object to be tested has a plurality of parts to be tested; and the monitoring visual module captures the The probe image information of the probes is such that the control module calculates the first horizontal coordinate value of the first coordinate system; the monitoring visual module captures the image information of the to-be-tested part to be tested, so that The control module calculates a second horizontal coordinate value of the second standard system; the control module calculates the first horizontal coordinate value and the second according to the first horizontal coordinate value and the second horizontal coordinate value seat The offset of the horizontal coordinate value seat, if the offset is generated, adjust the horizontal position of the probe module After the horizontal position of the probe module meets the horizontal position of the portion to be tested, the probe module is vertically moved and monitored by the monitoring visual module; when the probes are horizontally slipped The probe module stops moving, and determines that the probe has contacted the parts to be tested, and the vertical coordinate value of the first coordinate system relative to the second coordinate system is obtained.

於一實施例,一角度調整模組,該角度調整模組係設於該探 針模組與該多軸向位移模組之間,該角度調整模組係訊號連接該控制模組,該角度調整模組係使該探針模組進行一角度移動。 In an embodiment, an angle adjustment module is provided in the probe Between the needle module and the multi-axis displacement module, the angle adjustment module is connected to the control module, and the angle adjustment module moves the probe module at an angle.

於一實施例,該多軸向位移模組具有一第一軸向單元、一第二軸向單元與一第三軸向單元,該第二軸向單元係設於該第一軸向單元,該三軸向單元係設於該第二軸向單元,該探針模組係設於該第三軸向單元。 In one embodiment, the multi-axis displacement module has a first axial unit, a second axial unit and a third axial unit, and the second axial unit is disposed on the first axial unit. The triaxial unit is disposed on the second axial unit, and the probe module is disposed on the third axial unit.

於一實施例,至少一定位視覺模組,該定位視覺模組係設於該多軸向位移模組與該探針模組之間,該定位視覺模組係訊號連接該控制模組;該監看視覺單元具有一視覺單元與一位移單元,該位移單元係設於該多軸向位移模組,該視覺單元係設於該位移單元。 In one embodiment, at least one positioning vision module is disposed between the multi-axis displacement module and the probe module, and the positioning vision module is connected to the control module by a signal; The monitoring visual unit has a visual unit and a displacement unit, and the displacement unit is disposed on the multi-axial displacement module, and the visual unit is disposed in the displacement unit.

本創作提出一種列陣探針自動引導教育系統,其包含有:一角度調整模組;一探針模組,其係設於該角度調整模組,該探針模組具有複數個探針;一監看視覺模組,其係相鄰於該探針模組;以及一控制模組,其係訊號連接該角度調整模組、該監看視覺模組與該探針模組;其中,該探針模組係位於一待測物的上方,該待測物具有多個待測部位;該監看視覺模組係擷取該些探針之探針影像資訊,以使該控制模組計算出第一座標系之第一水平座標值;該監看視覺模組係擷取該些待測部位之待測影像資訊,以使該控制模組計算出第二座標系之第二水平座標值;該控制模組依據該第一水平座標值與該第二水平座標值,以計算出該第一水平座標值與該第二水平座標值之偏移量,若有該偏移量產生,則調 整該探針模組之水平位置,以使該探針模組之水平位置符合該待測部位之水平位置,該角度調整模組係使該探針模組進行一角度移動。 The present invention provides an array probe automatic guiding education system, which comprises: an angle adjustment module; a probe module, which is disposed in the angle adjustment module, the probe module has a plurality of probes; a monitoring visual module adjacent to the probe module; and a control module coupled to the angle adjustment module, the monitoring visual module and the probe module; wherein The probe module is located above an object to be tested, and the object to be tested has a plurality of parts to be tested; the monitoring visual module extracts probe image information of the probes to enable the control module to calculate a first horizontal coordinate value of the first coordinate system; the monitoring visual module extracts image information of the to-be-tested part to be tested, so that the control module calculates a second horizontal coordinate value of the second coordinate system The control module calculates an offset between the first horizontal coordinate value and the second horizontal coordinate value according to the first horizontal coordinate value and the second horizontal coordinate value, and if the offset is generated, Tune The horizontal position of the probe module is such that the horizontal position of the probe module conforms to the horizontal position of the portion to be tested, and the angle adjustment module moves the probe module at an angle.

基於上述,本創作係以自動化方式進行探針模組之位置校正,故能夠節省大量人工,並縮短工時,藉以降低成本支出,以及精準檢測。 Based on the above, the author performs the position correction of the probe module in an automated manner, thereby saving a lot of labor and shortening the working hours, thereby reducing the cost and accurate detection.

10‧‧‧基台 10‧‧‧Abutment

11‧‧‧龍門 11‧‧‧Longmen

12‧‧‧待測物 12‧‧‧Test object

120‧‧‧待測部位 120‧‧‧The part to be tested

13‧‧‧多軸向位移模組 13‧‧‧Multi-axial displacement module

130‧‧‧第一軸向單元 130‧‧‧First axial unit

131‧‧‧第二軸向單元 131‧‧‧Second axial unit

132‧‧‧第三軸向單元 132‧‧‧3rd axial unit

14‧‧‧探針模組 14‧‧‧ Probe Module

140‧‧‧探針 140‧‧‧Probe

15‧‧‧監看視覺模組 15‧‧‧Monitor visual module

150‧‧‧視覺單元 150‧‧ visual unit

151‧‧‧位移單元 151‧‧‧displacement unit

16‧‧‧角度調整模組 16‧‧‧Angle adjustment module

17‧‧‧定位視覺模組 17‧‧‧ Positioning Vision Module

18‧‧‧控制模組 18‧‧‧Control Module

S1~S4‧‧‧步驟 S1~S4‧‧‧ steps

第1圖為本創作之一種列陣探針自動引導教育系統之示意圖。 The first picture is a schematic diagram of an array of probe automatic guidance education system.

第2圖為本創作之一種列陣探針自動引導教育系統之局部示意圖。 Figure 2 is a partial schematic view of an array probe automatic guidance education system of the present invention.

第3圖為複數個探針與複數個待測部位之示意圖。 Figure 3 is a schematic diagram of a plurality of probes and a plurality of parts to be tested.

第4圖為複數個探針與複數個待測部位之又一示意圖。 Figure 4 is another schematic diagram of a plurality of probes and a plurality of parts to be tested.

第5圖為本創作應用於一種列陣探針自動引導教育方法之流程圖。 Figure 5 is a flow chart of the method for automatically guiding education of an array probe.

以下係藉由特定的具體實施例說明本創作之實施方式,所屬技術領域中具有通常知識者可由本說明書所揭示之內容,輕易地瞭解本創作之其他優點與功效。 The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present invention by the contents disclosed in the present specification.

請配合參考第1圖所示,本創作係一種列陣探針自動引導教育系統,其包含有一基台10、一龍門11、至少一多軸向位移模組13、至少一探針模組14、至少一監看視覺模組15、至少一角度調整模組16、至少一定位視覺模組17與一控制模組18。 Please refer to FIG. 1 , which is an array probe automatic guiding education system, which comprises a base 10 , a gantry 11 , at least one multi-axial displacement module 13 , and at least one probe module 14 . At least one monitoring visual module 15, at least one angle adjusting module 16, at least one positioning visual module 17 and a control module 18.

基台10的頂端承載有一待測物12。請配合參考第3圖 所示,待測物12具有多個待測部位120。舉例而言,待測物12能夠為一面板。待測部位120能夠為一電晶體。 The top end of the base 10 carries a test object 12. Please refer to Figure 3 As shown, the analyte 12 has a plurality of locations 120 to be tested. For example, the object to be tested 12 can be a panel. The portion to be tested 120 can be a transistor.

龍門11係設於基台10的一側,龍門11係能夠相對於基台10進行一軸向移動。或者基台10能夠相對於龍門11進行一軸向移動。 The gantry 11 is disposed on one side of the base 10, and the gantry 11 is capable of axial movement relative to the base 10. Alternatively, the base 10 can be moved axially relative to the gantry 11.

多軸向位移模組13係係設於龍門11,各多軸向位移模組13係以等距設於龍門11。多軸向位移模組13具有一第一軸向單元130、一第二軸向單元131與一第三軸向單元132。第一軸向單元130係設於龍門11,以提供一第一軸向移動。第二軸向單元131係設於第一軸向單元130,第二軸向單元131係提供一第二軸向移動。第三軸向單元132係設於第二軸向單元131,第三軸向單元132係提供一第三軸向移動。 The multi-axial displacement module 13 is disposed on the gantry 11 , and each of the multi-axial displacement modules 13 is disposed at the gantry 11 at an equal distance. The multi-axial displacement module 13 has a first axial unit 130, a second axial unit 131 and a third axial unit 132. The first axial unit 130 is coupled to the gantry 11 to provide a first axial movement. The second axial unit 131 is disposed on the first axial unit 130, and the second axial unit 131 provides a second axial movement. The third axial unit 132 is disposed on the second axial unit 131, and the third axial unit 132 provides a third axial movement.

各角度調整模組16係設於各第三軸向單元132。角度調整模組16係提供一角度移動。 Each angle adjustment module 16 is disposed in each of the third axial units 132. The angle adjustment module 16 provides an angular movement.

各監看視覺模組15係設於各多軸向位移模組13。各監看視覺單元15具有一視覺單元150與一位移單元151。位移單元151係設於第一軸向單元130。視覺單元150係設於位移單元151。 Each monitoring visual module 15 is disposed in each of the multi-axial displacement modules 13 . Each monitoring visual unit 15 has a visual unit 150 and a displacement unit 151. The displacement unit 151 is disposed in the first axial unit 130. The vision unit 150 is provided in the displacement unit 151.

各探針模組14係設於各角度調整模組16。請配合參考第2圖所示,各探針模組14具有多個探針140。 Each probe module 14 is provided in each angle adjustment module 16 . Referring to FIG. 2, each probe module 14 has a plurality of probes 140.

定位視覺模組17係設於位於龍門11之兩端的多軸向位移模組13。若更進一步論述,定位視覺模組17係設於第一軸向模組130。 The positioning vision module 17 is disposed on the multi-axial displacement module 13 at both ends of the gantry 11. As further discussed, the positioning vision module 17 is disposed in the first axial module 130.

控制模組18係訊號連接多軸向位移模組13、探針模組14、監看視覺模組15、角度調整模組16與定位視覺模組17。 The control module 18 is connected to the multi-axis displacement module 13, the probe module 14, the monitoring visual module 15, the angle adjustment module 16, and the positioning vision module 17.

請配合參考第4圖所示,本創作應用於一種列陣探針模組自動引導教育方法,其步驟包含有:請配合參考第1圖與第2圖所示。步驟S1,定位一待測物12。至少一定位視覺模組17係擷取待測物12的影像資訊,並傳送給控制模組18,以使控制模組18進行一定位程序,待定位程序完成後,再至步驟S2。舉例而言,於本實施例中,位於龍門11兩端的定位視覺模組17係擷取待測物12的影像資訊,並傳送給控制模組18,以使控制模組18進行一定位程序,以使待測物12進入視覺單元150之視野範圍。然於實際測試時,至少一定位視覺模組17係擷取待測物12的影像資訊,即可使控制模組18進行定位程序。 Please refer to Figure 4 for reference. This author is applied to an automatic guidance education method for array probe modules. The steps include: Please refer to Figure 1 and Figure 2. In step S1, a test object 12 is located. At least one positioning visual module 17 captures the image information of the object to be tested 12 and transmits it to the control module 18 to cause the control module 18 to perform a positioning process. After the positioning process is completed, the process proceeds to step S2. For example, in the embodiment, the positioning visual module 17 located at the two ends of the gantry 11 captures the image information of the object to be tested 12 and transmits the image information to the control module 18, so that the control module 18 performs a positioning process. The object to be tested 12 is allowed to enter the field of view of the visual unit 150. However, in the actual test, at least one positioning visual module 17 captures the image information of the object to be tested 12, so that the control module 18 performs the positioning process.

步驟S2,取得一第一座標系與一第二座標系。控制模組18依據步驟S1之影像資訊,以控制多軸向位移模組13,而使探針模組14係移動至待測物12的上方。舉例而言,第一軸向單元130係提供第一軸向移動,第二軸向單元131係提供第二軸向移動,第三軸向單元132係提供第三軸向移動。第一軸向移動至第三軸向移動係使探針模組14接近待測物12之待測部位120。於實際情況,第一軸向移動、第二軸向移動與第三軸向移動係可選擇性進行,而非第一軸向移動至第三軸向移動需要進行。舉例而言,該第一軸向移動可為X軸向移動。該第二軸向移動可為Y軸向移動。該第三軸向移動可為Z軸向移動或垂直移動。 In step S2, a first coordinate system and a second coordinate system are obtained. The control module 18 controls the multi-axis displacement module 13 according to the image information of step S1 to move the probe module 14 above the object to be tested 12. For example, the first axial unit 130 provides a first axial movement, the second axial unit 131 provides a second axial movement, and the third axial unit 132 provides a third axial movement. The first axial movement to the third axial movement causes the probe module 14 to approach the portion to be tested 120 of the object 12 to be tested. In the actual case, the first axial movement, the second axial movement and the third axial movement are selectively performed, and the non-first axial movement to the third axial movement is required. For example, the first axial movement can be an X-axis movement. The second axial movement can be a Y-axis movement. The third axial movement can be a Z-axis movement or a vertical movement.

若更進一步說明,如第3圖所示,監看視覺模組15係擷取探針140之探針影像資訊,並將探針影像資訊傳送給控制模組18,以使控制模組18計算出第一座標系之第一水平座標值;監看視覺模組15係擷取該些待測部位120之待測影像資訊,並將待測影像資訊傳送給控制模組18,以使控制模組18計算出第二座標系之第二水平座標值。 If further illustrated, as shown in FIG. 3, the monitoring visual module 15 captures the probe image information of the probe 140 and transmits the probe image information to the control module 18 to cause the control module 18 to calculate. The first horizontal coordinate value of the first coordinate system is obtained; the monitoring visual module 15 captures the image information to be tested of the to-be-tested parts 120, and transmits the image information to be tested to the control module 18 to make the control mode Group 18 calculates the second horizontal coordinate value of the second coordinate system.

舉例而言,視覺單元150係擷取探針影像資訊或待測影像資訊,控制模組18係依據探針影像資訊或待測影像資訊,已決定是否調整視覺單元150之位置,若需要調整視覺單元150之位置,則控制模組18控制位移單元151,以使位移單元151調整視覺單元150之位置。 For example, the visual unit 150 captures the probe image information or the image information to be tested, and the control module 18 determines whether to adjust the position of the visual unit 150 according to the probe image information or the image information to be tested. At the position of the unit 150, the control module 18 controls the displacement unit 151 to cause the displacement unit 151 to adjust the position of the visual unit 150.

因探針140為複數,為了便於論述,故該些探針140為第一探針140至第N探針140,N為一常數,移動視覺模組150,以擷取該第一探針140之針尖之第一針尖影像資訊。移動視覺單元150,以擷取第N探針140之針尖之第N針尖影像資訊。依據該第一針尖影像資訊與該第N針尖影像資訊,並配合控制模組18控制多軸向位移模組13之位置,而計算出一探針座標系之水平座標值,該探針座標系為該第一座標系之第一水平座標值。 Since the probes 140 are plural, the probes 140 are the first probes 140 to the Nth probes 140, and N is a constant, and the motion module 150 is moved to capture the first probes 140. The first tip image information of the tip of the needle. The vision unit 150 is moved to capture the Nth tip image information of the tip of the Nth probe 140. Calculating the horizontal coordinate value of a probe coordinate system according to the first tip image information and the Nth tip image information, and controlling the position of the multi-axis displacement module 13 with the control module 18, the probe coordinate system Is the first horizontal coordinate value of the first coordinate system.

同理,該些待測部位120為第一待測部位120至第N待測部位120,監看視覺模組15係避開該第一探針140之針尖。多軸向位移模組13係使探針模組14離開監看視覺模組15之視野範圍,以擷取該第一待測部位120之第一待測影像資訊,以及監看視覺模組15 係避開第N探針140之針尖,以擷取該第N待測部位120之第N待測影像資訊,依據該第一待測影像資訊與該第N待測影像資訊,並配合控制模組18控制多軸向位移模組13之位置,而使控制模組18計算出一待測部位座標系之水平座標值,該待測部位座標系為該第二座標系之第二水平座標值。 Similarly, the to-be-tested parts 120 are the first to-be-tested part 120 to the Nth to-be-tested part 120, and the monitoring visual module 15 avoids the needle tip of the first probe 140. The multi-axis displacement module 13 causes the probe module 14 to leave the field of view of the monitoring visual module 15 to capture the first image information to be tested of the first portion to be tested 120, and monitor the visual module 15 Avoiding the N-tip of the N-th probe 140 to capture the Nth image to be tested of the Nth portion to be tested 120, according to the first image information to be tested and the information of the Nth image to be tested, and matching the control mode The group 18 controls the position of the multi-axial displacement module 13, and causes the control module 18 to calculate the horizontal coordinate value of the coordinate system of the part to be tested, and the coordinate of the part to be tested is the second horizontal coordinate value of the second coordinate system. .

步驟S3,判斷該探針模組14是否需要調整相對於該待測物12之位置。控制模組18依據該第一座標系之第一水平座標值與該第二座標系之第二水平座標值,以計算出第一水平座標值與第二水平座標值之偏移量,若有偏移量產生,則調整探針模組14之位置,以使探針模組14之水平位置符合待測部位120之水平位置。 In step S3, it is determined whether the probe module 14 needs to adjust the position relative to the object to be tested 12. The control module 18 calculates the offset between the first horizontal coordinate value and the second horizontal coordinate value according to the first horizontal coordinate value of the first coordinate system and the second horizontal coordinate value of the second coordinate system, if any When the offset is generated, the position of the probe module 14 is adjusted so that the horizontal position of the probe module 14 conforms to the horizontal position of the portion to be tested 120.

舉例而言,若有偏移量產生,該偏移量為角度偏差,則角度調整模組16係提供一角度移動,即使探針模組14轉動一角度。若偏移量為水平偏移,即第一軸向或第二軸向之偏移,則多軸向位移模組13係提供第一軸向移動或第二軸向移動,而使探針模組14進行移動,並使探針140位於待測部位120的上方。 For example, if an offset is generated, the offset is an angular deviation, and the angle adjustment module 16 provides an angular movement even if the probe module 14 is rotated by an angle. If the offset is a horizontal offset, that is, a first axial or second axial offset, the multi-axial displacement module 13 provides a first axial movement or a second axial movement, and the probe mode is The group 14 is moved and the probe 140 is positioned above the site to be tested 120.

請配合參考第4圖所示,步驟S4,取得該第一座標系相對該第二座標系之垂直座標值。垂直移動探針模組14,並由監看視覺模組15全程監測,當探針140有水平滑移時,探針模組14停止移動,並判斷探針14已接觸待測部位120,而得出第一座標系相對第二座標系之垂直座標值。 Please refer to FIG. 4, step S4, to obtain the vertical coordinate value of the first coordinate system relative to the second coordinate system. The probe module 14 is vertically moved and monitored by the monitoring visual module 15. When the probe 140 is horizontally slipped, the probe module 14 stops moving, and it is judged that the probe 14 has contacted the portion to be tested 120, and The vertical coordinate value of the first coordinate system relative to the second coordinate system is obtained.

舉例而言,多軸向位移模組13係使探針模組14垂直 移動,監看視覺模組15係監看探針140,當控制模組18發覺監看視覺模組15所擷取之探針影像資訊中探針140有產生水平滑移時,控制模組18係使多軸向位移模組13停止作動,進而使探針模組14停止移動,此時應可判斷探針14已接觸待測部位120。控制模組18由探針模組14所進行之垂直移動的距離,以計算出第一座標系相對第二座標系之垂直座標值。 For example, the multi-axial displacement module 13 is such that the probe module 14 is vertical. The monitoring module 15 monitors the probe 140. When the control module 18 detects that the probe 140 has a horizontal slip in the probe image information captured by the monitoring visual module 15, the control module 18 The multi-axial displacement module 13 is stopped, and the probe module 14 is stopped. At this time, it can be judged that the probe 14 has contacted the portion to be tested 120. The control module 18 is vertically moved by the probe module 14 to calculate the vertical coordinate value of the first coordinate system relative to the second coordinate system.

如上所述,本創作係使用監看視覺模組15擷取探針影像資訊、待測部位影像資訊與探針140有產生水平滑移之影像資訊,藉以使控制模組18計算出第一水平座標值、第二水平座標值、偏移量與垂直座標值,進而調整探針模組14之探針140與待測部位120二者之相對位置,並能確保探針140係接觸待測部位120,而使探針140能對待測部位120進行一檢測程序。 As described above, the author uses the monitoring visual module 15 to capture the probe image information, the image information of the portion to be tested, and the image information of the probe 140 to generate horizontal slip, so that the control module 18 calculates the first level. The coordinate value, the second horizontal coordinate value, the offset and the vertical coordinate value, thereby adjusting the relative positions of the probe 140 of the probe module 14 and the portion to be tested 120, and ensuring that the probe 140 is in contact with the portion to be tested. 120, and the probe 140 can perform a detection procedure on the site to be tested 120.

因本創作係以自動化方式進行探針模組14之位置校正,故能夠節省大量人工,並縮短工時,藉以降低成本支出,以及精準檢測。 Since the creation of the probe module 14 is performed in an automated manner, it is possible to save a lot of labor and shorten the working hours, thereby reducing the cost and accurate detection.

綜上所述,雖然本創作已以實施例揭露如上,然其並非用以限定本創作,任何所屬技術領域中具有通常知識者,在不脫離本創作之精神和範圍內,當可作些許之更動與潤飾,故本創作之保護範圍當視後附之申請專利範圍所界定者為準。 In summary, although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any person having ordinary knowledge in the technical field can make some changes without departing from the spirit and scope of the present invention. Changes and refinements, the scope of protection of this creation is subject to the definition of the scope of the patent application attached.

10‧‧‧基台 10‧‧‧Abutment

11‧‧‧龍門 11‧‧‧Longmen

12‧‧‧待測物 12‧‧‧Test object

13‧‧‧多軸向位移模組 13‧‧‧Multi-axial displacement module

130‧‧‧第一軸向單元 130‧‧‧First axial unit

131‧‧‧第二軸向單元 131‧‧‧Second axial unit

132‧‧‧第三軸向單元 132‧‧‧3rd axial unit

14‧‧‧探針模組 14‧‧‧ Probe Module

15‧‧‧監看視覺模組 15‧‧‧Monitor visual module

150‧‧‧視覺單元 150‧‧ visual unit

151‧‧‧位移單元 151‧‧‧displacement unit

16‧‧‧角度調整模組 16‧‧‧Angle adjustment module

17‧‧‧定位視覺模組 17‧‧‧ Positioning Vision Module

18‧‧‧控制模組 18‧‧‧Control Module

Claims (7)

一種列陣探針自動引導教育系統,其包含有:一多軸向位移模組;一探針模組,其係設於該多軸向位移模組,該探針模組具有複數個探針;一監看視覺模組,其係設於該多軸向位移模組,以及一控制模組,其係訊號連接該多軸向位移模組、該監看視覺模組與該探針模組;其中,該多軸向位移模組係使該探針模組移動至一待測物的上方,該待測物具有多個待測部位;該監看視覺模組係擷取該些探針之探針影像資訊,以使該控制模組計算出第一座標系之第一水平座標值;該監看視覺模組係擷取該些待測部位之待測影像資訊,以使該控制模組計算出第二標系之第二水平座標值;該控制模組依據該第一水平座標值與該第二水平座標值座,以計算出該第一水平座標值與該第二水平座標值座之偏移量,若有該偏移量產生,則調整該探針模組之水平位置,以使該探針模組之水平位置符合該待測部位之水平位置後,再垂直移動該探針模組,並由監看視覺模組全程監測;當該些探針有水平滑移時,該探針模組停止移動,並判斷該探針已接觸該些待測部位,而得出該第一座標系相對該第二座標系之垂直座標值。 An array probe automatic guiding education system comprises: a multi-axial displacement module; a probe module is disposed on the multi-axis displacement module, the probe module has a plurality of probes a monitoring visual module, which is disposed in the multi-axis displacement module, and a control module, wherein the signal is connected to the multi-axis displacement module, the monitoring visual module and the probe module Wherein the multi-axial displacement module moves the probe module to an object to be tested, the object to be tested has a plurality of parts to be tested; and the monitoring visual module captures the probes The probe image information is such that the control module calculates the first horizontal coordinate value of the first coordinate system; the monitoring visual module captures the image information of the to-be-tested part to be tested, so that the control mode The group calculates a second horizontal coordinate value of the second standard system; the control module calculates the first horizontal coordinate value and the second horizontal coordinate value according to the first horizontal coordinate value and the second horizontal coordinate value seat The offset of the seat, if the offset is generated, adjust the horizontal position of the probe module to make the After the horizontal position of the needle module meets the horizontal position of the part to be tested, the probe module is vertically moved and monitored by the monitoring visual module; when the probes are horizontally slipped, the probe mode The group stops moving and judges that the probe has contacted the parts to be tested, and the vertical coordinate value of the first coordinate system relative to the second coordinate system is obtained. 如申請專利範圍第1項所述之列陣探針自動引導教育系統,其更具有一角度調整模組,該角度調整模組係設於該探針模組與該多軸向位移模組之間,該角度調整模組係訊號連接該控制模組,該角度調整模組係使該探針 模組進行一角度移動,該多軸向位移模組係設於一龍門。 For example, the array probe automatic guiding education system described in claim 1 has an angle adjustment module, and the angle adjustment module is disposed in the probe module and the multi-axis displacement module. The angle adjustment module is connected to the control module, and the angle adjustment module is configured to enable the probe The module performs an angular movement, and the multi-axial displacement module is disposed in a gantry. 如申請專利範圍第1項所述之列陣探針自動引導教育系統,其中該多軸向位移模組具有一第一軸向單元、一第二軸向單元與一第三軸向單元,該第二軸向單元係設於該第一軸向單元,該三軸向單元係設於該第二軸向單元,該探針模組係設於該第三軸向單元,該多軸向位移模組係設於一龍門。 The array probe automatic guiding education system of claim 1, wherein the multi-axis displacement module has a first axial unit, a second axial unit and a third axial unit, The second axial unit is disposed on the first axial unit, the three axial unit is disposed on the second axial unit, and the probe module is disposed on the third axial unit, the multiaxial displacement The module is located in a gantry. 如申請專利範圍第1項所述之列陣探針自動引導教育系統,其更具有至少一定位視覺模組,該定位視覺模組係設於該多軸向位移模組與該探針模組之間,該定位視覺模組係訊號連接該控制模組;該監看視覺單元具有一視覺單元與一位移單元,該位移單元係設於該多軸向位移模組,該視覺單元係設於該位移單元,該多軸向位移模組係設於一龍門。 The array probe automatic guidance education system of claim 1, further comprising at least one positioning vision module, wherein the positioning vision module is disposed on the multi-axis displacement module and the probe module The positioning visual module is connected to the control module; the monitoring visual unit has a visual unit and a displacement unit, and the displacement unit is disposed on the multi-axis displacement module, and the visual unit is The displacement unit, the multi-axial displacement module is disposed on a gantry. 一種列陣探針自動引導教育系統,其包含有:一角度調整模組;一探針模組,其係設於該角度調整模組,該探針模組具有複數個探針;一監看視覺模組,其係相鄰於該探針模組;以及一控制模組,其係訊號連接該角度調整模組、該監看視覺模組與該探針模組;其中,該探針模組係位於一待測物的上方,該待測物具有多個待測部位;該監看視覺模組係擷取該些探針之探針影像資訊,以使該控制模組計算出第一座標系之第一水平座標值;該監看視覺模組係擷取該些待測部位之待測影像資訊,以使該控制模組計算出第二座標系之第二水平座標值;該控制模組依據該第一水平座標值與該第二水平座標值,以計算出 該第一水平座標值與該第二水平座標值之偏移量,若有該偏移量產生,則調整該探針模組之水平位置,以使該探針模組之水平位置符合該待測部位之水平位置,該角度調整模組係使該探針模組進行一角度移動。 An array probe automatic guiding education system includes: an angle adjustment module; a probe module is disposed in the angle adjustment module, the probe module has a plurality of probes; a vision module adjacent to the probe module; and a control module coupled to the angle adjustment module, the monitoring vision module and the probe module; wherein the probe module The group is located above an object to be tested, and the object to be tested has a plurality of parts to be tested; the monitoring visual module extracts probe image information of the probes, so that the control module calculates the first a first horizontal coordinate value of the coordinate system; the monitoring visual module extracts image information of the to-be-tested part to be tested, so that the control module calculates a second horizontal coordinate value of the second coordinate system; the control The module calculates the first horizontal coordinate value and the second horizontal coordinate value according to the value And offsetting the first horizontal coordinate value from the second horizontal coordinate value, if the offset is generated, adjusting a horizontal position of the probe module, so that the horizontal position of the probe module conforms to the waiting The horizontal position of the measuring portion, the angle adjusting module moves the probe module at an angle. 如申請專利範圍第5項所述之列陣探針自動引導教育系統,其更具有一多軸向位移模組,該多軸向位移模組係訊號連接該控制模組,該多軸向位移模組具有一第一軸向單元、一第二軸向單元與一第三軸向單元,該第二軸向單元係設於該第一軸向單元,該三軸向單元係設於該第二軸向單元,該探針模組係設於該第三軸向單元,該多軸向位移模組係設於一龍門。 The array probe automatic guiding education system according to claim 5, further comprising a plurality of axial displacement modules, wherein the multi-axial displacement module is connected to the control module, the multi-axial displacement The module has a first axial unit, a second axial unit and a third axial unit. The second axial unit is disposed on the first axial unit, and the three axial unit is disposed on the first axial unit. The two-axis unit is disposed on the third axial unit, and the multi-axial displacement module is disposed on a gantry. 如申請專利範圍第5項所述之列陣探針自動引導教育系統,其更具有至少一定位視覺模組,該定位視覺模組係設於該多軸向位移模組,該定位視覺模組係訊號連接該控制模組;該監看視覺單元具有一視覺單元與一位移單元,該位移單元係設於該多軸向位移模組,該視覺單元係設於該位移單元,該多軸向位移模組係設於一龍門。 The array probe automatic guidance education system of claim 5, further comprising at least one positioning vision module, wherein the positioning vision module is disposed in the multi-axis displacement module, the positioning vision module The monitoring signal is connected to the control module; the monitoring visual unit has a visual unit and a displacement unit, and the displacement unit is disposed on the multi-axis displacement module, and the visual unit is disposed on the displacement unit, the multi-axis The displacement module is located in a gantry.
TW105213084U 2016-08-26 2016-08-26 Automatic guiding education system of array probes TWM536751U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW105213084U TWM536751U (en) 2016-08-26 2016-08-26 Automatic guiding education system of array probes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105213084U TWM536751U (en) 2016-08-26 2016-08-26 Automatic guiding education system of array probes

Publications (1)

Publication Number Publication Date
TWM536751U true TWM536751U (en) 2017-02-11

Family

ID=58607082

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105213084U TWM536751U (en) 2016-08-26 2016-08-26 Automatic guiding education system of array probes

Country Status (1)

Country Link
TW (1) TWM536751U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI716045B (en) * 2018-08-27 2021-01-11 日商日本麥克隆尼股份有限公司 Inspection device and inspection method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI716045B (en) * 2018-08-27 2021-01-11 日商日本麥克隆尼股份有限公司 Inspection device and inspection method
US10989738B2 (en) 2018-08-27 2021-04-27 Kabushiki Kaisha Nihon Micronics Inspection apparatus and inspection method

Similar Documents

Publication Publication Date Title
TWI605258B (en) Array probe auto guiding teaching system and method using the same
Jiang et al. A method of testing position independent geometric errors in rotary axes of a five-axis machine tool using a double ball bar
CN103091521B (en) Method of probe and lead foot automatic aiming and probe station testing system thereof
TWI512875B (en) System and method for adjusting the position and orientation of a feed arm associated with a wafer handling robot
CN206132356U (en) HUD image test equipment
US20150362552A1 (en) Probe Device
WO2010125172A3 (en) Device for spatially orienting at least two subgroup components and method
CN103620482A (en) Defect inspection device and defect inspection method
CN204287496U (en) α, β surface contamination detection instrument automatic Verification/calibration/pick-up unit
US20210181222A1 (en) Autosampler
CN105627917A (en) Large-scale structural component assembly joining measurement method based on visual principle
CN107607852B (en) The bearing calibration of the control method and positioning accuracy of the kinematic axis of flying probe tester
CN107255463A (en) Positioning measurement device and positioning measurement method
TW201732272A (en) Method for detecting defects of thin-film transistor panel and device thereof
KR101202320B1 (en) Instrumentation system using alignment scope and method for determining system parameters of alignment scope
CN106287126A (en) Camera fixing device and there is the visual identity equipment of this camera fixing device
CN104990689A (en) Positioning method and positioning device in optical test
WO2013128738A1 (en) Defect detection method, defect detection device, and method for producing semiconductor substrate
TWM536751U (en) Automatic guiding education system of array probes
CN107782921A (en) Array probe guides educational system and its method automatically
CN103925877A (en) Multi-lens size quick measuring equipment
JP5314328B2 (en) Arm offset acquisition method
KR101751801B1 (en) Defect inspecting device for substrate and inspecting method using the same
TWI614549B (en) Detecting or compensating position system and method thereof
JPH02201110A (en) Inspection of printed wiring circuit, especially,inspection of component part of card and apparatus applying the same