TWM536664U - Material moving device and operation equipment for its application - Google Patents

Description

Transfer device and its application equipment

In particular, the present invention provides a moving device capable of sucking various materials by a vacuum suction nozzle of a pick-and-place mechanism to ensure proper transfer of various materials, thereby improving the quality of work and ensuring smooth operation. Applied work equipment.

Nowadays, many automation equipments often need to use a material transfer device to transfer materials from a first position to a second position. In terms of the operation equipment of the circuit substrate, the circuit substrate to be executed is placed on the feeding device. Inside, the circuit board for performing the work is transferred to the work area by the transfer device to perform the work. When the work is completed, the circuit board that completes the work is transferred to the receipt and collection by the transfer device; see Figures 1 and 2 As shown in the figure, a laser printing operation device of a conventional circuit board is disposed on a side of the machine table 10 with a feeding device 11, a receiving device 12, a material feeding device 13, a stage device 14, and a working device. The feeding device 11 is configured to place a plurality of substrates A to be executed, and when the substrates A are stacked in the feeding device 11, the materials are placed between the substrates A to be light and thin (such as paper). The spacer B is made to prevent the substrate A from being damaged by contact with the friction, and the receiving device 12 is for placing the substrate A and the spacer B for completing the work; and the transferring device 13 is provided with a plurality of vacuum suctions. The pick-and-place mechanism 131 of the mouth 1311 is driven by a drive The structure 132 drives the pick-and-place mechanism 131 to be displaced in the horizontal direction and the vertical direction, and the pick-and-place mechanism 131 picks up the substrate A to be executed by the feeding device 11 and transfers it to the stage device 14, and then the stage device 14 The substrate A on which the job is performed is carried to the working device 15 to perform a laser printing operation, and when the laser printing operation is performed, the pick-and-place mechanism 131 is supplied by the feeding The device 11 picks up the spacer B and transfers it to the receiving device 12. When the laser printing operation is completed, the pick-and-place mechanism 131 further transfers the substrate A that has completed the work to the receiving device 12 by the loading device 14 to utilize The pick-and-place mechanism 131 of the moving device 13 picks up the transfer substrate A and the spacer B between the feeding device 11, the stage device 14, and the receiving device 12, and further separates the substrate A and the spacer B which are completed. In the receiving device 12, in general, since the spacer B is made of a light-weight material (such as paper), it is often breathable, and therefore, each vacuum suction of the pick-and-place mechanism 131 of the moving device 13 When the nozzle 1311 vacuum-sucks the spacer B, the vacuum suction force of each vacuum nozzle 1311 of the pick-and-place mechanism 131 is easily transmitted through the gas permeability of the spacer B, so that the substrate A under the spacer B is adsorbed and transferred together. In the receiving device 12 (as shown in FIG. 2), it is not possible to perform the work on each of the substrates A, and the work quality is affected. When the substrate A and the spacer B are stacked in the receiving device 12, It often happens that a plurality of spacers B are stacked between two substrates A, and the shift The apparatus 13 take place mechanism 131 and can not immediately detect this abnormal condition is caused by shifting the feeding device 131 of the pick and place mechanism 13 is not properly transfer substrates A and B the spacer, and thus the job can not be performed smoothly.

Referring to FIG. 3, in order to solve the above drawbacks, another shifting device 13 is provided with a first pick-and-place mechanism 131a having a plurality of vacuum nozzles 1311a and a plurality of vacuum nozzles 1311b. The second pick-and-place mechanism 131b, wherein each vacuum nozzle 1311a of the first pick-and-place mechanism 131a is adjusted to a large vacuum adsorption force (such as 90 kPa), and the substrate A is sucked by sufficient vacuum suction force. The vacuum suction nozzle 1311b of the second pick-and-place mechanism 131b is adjusted to a small vacuum suction force (for example, 60 kPa), and the transfer spacer B is sucked by an appropriate vacuum suction force, and the vacuum suction force of each vacuum suction nozzle 1311b is prevented from transmitting. The gas permeable spacer B is used to adsorb the substrate A, and the cycle of the first pick-and-place mechanism 131a and the second pick-and-place mechanism 131b can be used to complete the operation. The plate A and the spacer B are stacked in the receiving device 12; however, when the plurality of spacers B are stacked between the two substrates A, the first and second pick-and-place mechanisms 131a of the moving device 13 However, 131b still cannot detect the abnormal condition immediately, and the first and second pick-and-place mechanisms 131a and 131b of the material transfer device 13 cannot correctly transfer the substrate A and the spacer B, and the operation cannot be performed smoothly.

In view of this, the creator has been engaged in research and development and production experience of related industries for many years, and has conducted in-depth research on the problems currently faced. After long-term efforts and trials, he has finally developed a mobile device and its application equipment. In order to effectively improve the shortcomings of the knowledge, this is the design tenet of this creation.

The purpose of the present invention is to provide a material transfer device which is provided with at least one pick-and-place mechanism for a vacuum nozzle for feeding materials of different properties, and further provided on the pick-and-place mechanism The material sensor senses the difference in the nature of the material to be sucked, and transmits the sensing signal to the controller, and the controller controls the vacuum suction force of the vacuum nozzle of the pick-and-place mechanism according to the received sensing signal. The vacuum nozzle is used to absorb materials having different properties by appropriate vacuum adsorption force; thereby, when the vacuum suction nozzle of the material transfer device picks up and puts various materials in the feeding device of the working equipment, the pick-and-place mechanism can be The vacuum nozzle absorbs materials of different properties with appropriate vacuum adsorption force to ensure the correct transfer of various materials, and achieves the practical purpose of improving the quality of work and ensuring smooth operation.

The second object of the present invention is to provide a working device for applying a material moving device, which is provided with a feeding device, a receiving device, a loading device and a working device on a machine table, and the feeding device is provided with a device. For materials of different nature, the receiving device is used for receiving materials for completing the work, and the loading device is for carrying materials for positioning the work to be performed, and carrying the materials to be executed to the working device to execute the preset And the feeding device, the receiving device and the loading device are arranged above the feeding device, so as to Material of different nature is transferred between the feeding device, the receiving device and the stage device, and the material sensor on the pick-and-place mechanism senses the difference in the properties of the material to be sucked, and transmits the sensing signal to the controller, The controller controls the vacuum suction force of the vacuum nozzle of the pick-and-place mechanism according to the received sensing signal, so that the vacuum nozzle absorbs different materials with appropriate vacuum adsorption force to correctly transfer various materials to achieve A practical purpose to improve the quality of work and ensure smooth operation.

Conventional part:

10‧‧‧ machine

11‧‧‧Feeding device

12‧‧‧ Receiving device

13‧‧‧Transfer device

131‧‧‧ pick-and-place mechanism

1311‧‧‧Vacuum nozzle

131a‧‧‧First pick and place mechanism

1311a‧‧‧Vacuum nozzle

131b‧‧‧Second pick and place mechanism

1311b‧‧‧Vacuum nozzle

132‧‧‧ drive mechanism

14‧‧‧Terminal device

15‧‧‧Working device

A‧‧‧Substrate

B‧‧‧ Spacer

This creative part:

20‧‧‧Transfer device

21‧‧‧ drive mechanism

211‧‧‧ translation drive group

212‧‧‧ Lifting drive group

22‧‧‧ pick-and-place mechanism

221‧‧‧ Shelf

222‧‧‧Vacuum nozzle

23‧‧‧Vacuum generator

22a‧‧‧First pick and place mechanism

222a‧‧‧Vacuum nozzle

22b‧‧‧Second pick and place mechanism

222b‧‧‧Vacuum nozzle

24‧‧‧Material Sensor

241‧‧‧ 承件

24a‧‧‧Material Sensor

24b‧‧‧Material Sensor

25‧‧‧Control valve

30‧‧‧ machine

31‧‧‧Feeding device

32‧‧‧Receiving device

33‧‧‧Terminal device

34‧‧‧Working device

A‧‧‧Substrate

B‧‧‧ Spacer

Figure 1: Schematic diagram of a conventional laser printing device (1).

Figure 2: Schematic diagram of the operation of the conventional material transfer device.

Figure 3: Schematic diagram of a conventional laser printing device (2).

Figure 4: Top view of the creation.

Figure 5: The previous view of this creation.

Figure 6: Side view of the creation.

Figure 7: Schematic diagram of the first embodiment of the present application applied to a work device.

Fig. 8 is a schematic view (1) of the operation of the first embodiment of the present invention applied to the work equipment.

Fig. 9 is a schematic view showing the operation of the first embodiment of the present invention applied to the working device (2).

Fig. 10 is a schematic view showing the operation of the first embodiment of the present invention applied to the working device (3).

Fig. 11 is a schematic view showing the operation of the first embodiment of the present invention applied to the working device (4).

Fig. 12 is a schematic view showing the operation of the first embodiment of the present invention applied to the work equipment (5).

Figure 13: Schematic diagram of the operation of the first embodiment of the present invention applied to the work equipment (6).

Figure 14: Schematic diagram of the operation of the first embodiment of the present invention applied to the work equipment (7).

Fig. 15 is a schematic view showing the operation of the first embodiment of the present invention applied to the working device (8).

Figure 16: Schematic diagram of a second embodiment of the present application applied to a work device.

In order for your review board to further understand this creation, A preferred embodiment and the drawings are described in detail as follows: Referring to Figures 4, 5 and 6, the transfer device 20 of the present invention is provided with a drive mechanism 21 on the machine table for driving the pick and place. The mechanism 22 performs a reciprocating displacement in at least one direction. In the embodiment, the driving mechanism 21 includes a translation driving group 211 and a lifting driving group 212 for respectively moving the pick-and-place mechanism 22 horizontally and vertically. The lifting and lowering mechanism 22 is provided with a frame 221 coupled to the driving mechanism 21, and at least one vacuum nozzle is mounted on the frame 221 for feeding materials of different properties. In the embodiment, the plurality of vacuum nozzles 222 are mounted on the frame 221, and a vacuum generator 23 is connected to the vacuum nozzles 222 to generate vacuum adsorption force for the vacuum nozzles 222. The material sensing device 24 is mounted on the frame 221 of the pick-and-place mechanism 22 for sensing the difference in the properties of the material to be sucked; in the embodiment, the material sensor 24 is The mounting member 241 is connected to the frame 221 of the pick-and-place mechanism 22, and the material is sensed. The 24 series is a metal sensor for sensing whether the material to be sucked has a difference in the nature of the metal material; the material sensor 24 transmits the sensing signal to the controller (not shown in the drawing), and the controller is based on The received sensing signal discriminates the difference in the properties of the materials to be sucked, and controls the vacuum adsorption force of each vacuum nozzle 222 of the pick-and-place mechanism 22 to make the vacuum suction nozzles 222 suck with appropriate vacuum suction force. The material of different nature; in this embodiment, the controller controls the control valve 25 according to the received sensing signal and can be an electronically controlled proportional valve and communicates with the vacuum generator 23 to control the control valve 25 The flow rate of the gas flowing to the vacuum generator 23 causes the vacuum generator 23 to generate different degrees of vacuum, thereby controlling and adjusting the vacuum suction nozzles 222 to absorb materials having different properties with appropriate vacuum adsorption force; Further, according to the received sensing signal, the driving mechanism 21 drives the pick-and-place mechanism 22 to perform correct displacement, and correctly transfers materials with different properties to the predetermined position. .

Referring to FIG. 7, the mobile device 20 of the present invention is applied to a first embodiment of a working device for performing a test or performing laser printing, and the laser printing device of the circuit substrate is taken as an example, which is attached to the machine 30. The feeding device 31, the receiving device 32, the stage device 33, and the working device 34 are disposed, and the feeding device 31 is provided with a plurality of substrates A, and a spacer B and the like placed between the substrates A; The substrate A is a printed circuit board and has a metal material (such as copper), and the spacer B is made of a light and thin material (such as paper) and has gas permeability; the receiving device 32 is provided for receiving The substrate A and the spacer B are completed, and the stage device 33 is configured to carry the substrate A for positioning the work to be performed, and the substrate A to be executed is carried to the working device 34 to perform the laser printing of the substrate A. In the operation, the feeding device 20 is disposed above the feeding device 31, the receiving device 32 and the stage device 33 to transfer the substrate A and the space between the feeding device 31, the receiving device 32 and the stage device 33. Slice B.

Referring to Figures 8 and 9, the working device of the first embodiment of the present invention drives the pick-and-place mechanism 22 to be horizontal by the translation driving group 211 of the driving mechanism 21 of the loading device 20 when performing the printing operation. The traverse is moved to the upper side of the feeding device 31, and the lifting and lowering drive unit 22 drives the pick-and-place mechanism 22 to perform a vertical downward displacement, so that the vacuum suction nozzles 222 of the pick-and-place mechanism 22 are in contact with the uppermost substrate A; Referring to FIG. 10, when the vacuum nozzles 222 of the pick-and-place mechanism 22 contact the substrate A of the uppermost layer, the substrate sensor A is sensed by the material sensor 24, since the substrate A has a metal. Material (such as copper), the material sensor 24 senses the metal material (such as copper) of the substrate A to discriminate that the material to be sucked is the substrate A, and transmits the sensing signal to the controller, the controller Controlling the control valve 25 according to the received sensing signal to control the flow of the gas flowing to the vacuum generator 23 by the control valve 25, so that the vacuum generator 23 generates a large degree of vacuum, thereby controlling the adjustment. Each vacuum nozzle 222 has a large vacuum Absorbing force (such as 90 kPa) sucks the substrate A; see Figure 11, and then the moving device 20 The driving mechanism 21 drives the pick-and-place mechanism 22 to perform horizontal and vertical displacement, and the substrate A of the work to be performed is positioned on the stage device 33, and the substrate A of the work to be performed is performed by the stage device 33. Carrying to the working device 34 to perform the laser printing operation of the substrate A; please refer to the scanning driving group of the driving mechanism 21 of the loading device 20 during the execution of the laser printing operation as shown in Figs. The 211 drives the pick-and-place mechanism 22 to traverse horizontally to the top of the feeding device 31, and then drives the pick-and-place mechanism 22 to vertically descend the displacement by the lifting drive group 212, so that the vacuum nozzles of the pick-and-place mechanism 22 are 222 is in contact with the uppermost spacer B; as shown in FIG. 14, when the vacuum nozzles 222 of the pick-and-place mechanism 22 are in contact with the uppermost spacer B, the material sensor 24 senses that the material is to be aspirated. The spacer B is made of a thin material (such as paper) and has no metal material. The material sensor 24 discriminates that the material to be sucked is the spacer B, and transmits the sensing signal to Controller, which is based on the sense of receipt The signal is controlled to control the control valve 25 to control the flow of the gas flowing to the vacuum generator 23 by the control valve 25, so that the vacuum generator 23 generates a small degree of vacuum, thereby controlling and adjusting the vacuum nozzles 222. The smaller vacuum adsorption force (such as 60 kPa) sucks the spacer B, and prevents the vacuum adsorption force of the vacuum nozzles 222 from passing through the gas-permeable spacer B to avoid the substrate A under the spacer B. And the abnormal situation in which the adsorption device is transferred to the receiving device 32 ensures the correct transfer of the substrate A and the spacer B; as shown in Fig. 15, the driving mechanism 21 of the moving device 20 is used to drive the taking. The discharge mechanism 22 is horizontally and vertically displaced, and the spacer B is transferred to the receiving device 32, and the substrate A on which the work is completed on the stage device 33 is transferred to the receiving device 32, and the material is transferred. The cyclic displacement of the pick-and-place mechanism 22 of the device 20 to continuously perform the feeding and receiving operations; thereby, when the vacuum nozzles 222 of the pick-and-place mechanism 22 suck the substrate A or the spacer B, the material sensing device is utilized. 24 performing sensing of the substrate A and the spacer B to be sucked Difference in the nature of the material, and judged by the controller The material to be sucked is the substrate A or the spacer B, and the vacuum nozzles 222 of the pick-and-place mechanism 22 are controlled to absorb the substrate A or the spacer B by appropriate vacuum suction force, thereby preventing the vacuum nozzles 222 from being removed. The vacuum adsorption force is transmitted through the gas permeable spacer B to avoid an abnormal situation in which the substrate A under the spacer B is adsorbed and transferred to the receiving device 32. In addition, the controller discriminates the suction to be taken. After the material is the substrate A or the spacer B, the driving mechanism 21 controlling the feeding device 20 drives the pick-and-place mechanism 22 to perform correct displacement, and the substrate A or the spacer B is correctly transferred to a predetermined position, for example, When a plurality of spacers B are placed between the two substrates A, the controller controls the driving mechanism 21 of the loading device 20 to drive the pick-and-place mechanism 22 to correctly transfer the plurality of spacers B to the receiving device according to the received sensing signal. In the material device 32, the abnormal condition of transferring the spacer B to the stage device 33 is avoided, and the materials such as the substrate A and the spacer B can be accurately transferred, thereby achieving the practical benefit of improving the work quality and ensuring smooth operation. .

Please refer to FIG. 16 , which is a difference between the second embodiment of the laser printing apparatus applied to the present invention and the first embodiment, which is mainly related to the feeding device 31 and the receiving device 32 . And the loading device 20 is disposed above the stage device 33 to transfer the substrate A and the spacer B between the feeding device 31, the receiving device 32 and the stage device 33; in the embodiment, the moving device 20 The first pick-and-place mechanism 22a and the second pick-and-place mechanism 22b are disposed in the same manner as the pick-and-place mechanism, and the substrate is transferred by the first pick-and-place mechanism 22a and the second pick-and-place mechanism 22b. And the material such as the spacer B to save the working time; wherein the first pick-and-place mechanism 22a can transfer the substrate A to be executed to the stage device 33 by the feeding device 31 to execute the thunder of the substrate A When the vacuum suction nozzle 222a of the first pick-and-place mechanism 22a sucks the substrate A, the material sensor 24a senses the metal material (such as copper) of the substrate A to discriminate the waiting The material sucked is the substrate A, and the first pick-and-place mechanism 22a can be controlled. Each of the vacuum suction nozzles 222a sucks the substrate A with an appropriate vacuum suction force, and the second pick-and-place mechanism 22b can transfer the spacer B to the receiving device 32 by the feeding device 31, and the loading device 33 will complete The substrate A of the job is transferred to the receiving device 32, and when the vacuum nozzles 222b of the second pick-and-place mechanism 22b suck the spacer B or the substrate A, the material sensor 24b determines that the material to be sucked is Spacer B or substrate A, and the vacuum nozzles 222b can be controlled to absorb the spacer B or the substrate A with appropriate vacuum adsorption force; thereby, when the first and second pick-and-place mechanisms 22a, 22b of the material transfer device 20 When each of the vacuum nozzles 222a, 222b sucks the substrate A or the spacer B, it uses the material sensors 24a, 24b to respectively sense the difference in properties of the substrate A and the spacer B to be sucked, and is determined by the controller. The sucked material is the substrate A or the spacer B, and the vacuum suction nozzles 222a, 222b of the first and second pick-and-place mechanisms 22a, 22b of the pick-and-place mechanism 22 are sucked to take the substrate A or the spacer B with appropriate vacuum suction force. The vacuum adsorption force of the vacuum nozzles 222a, 222b can be prevented from transmitting. a gas permeable spacer B to avoid an abnormal situation in which the substrate A under the spacer B is adsorbed and transferred to the receiving device 32; in addition, the controller discriminates that the material to be sucked is the substrate A or After the spacer B, the driving mechanism 21 that controls the loading device 20 drives the pick-and-place mechanism 22 to make a correct displacement, and the substrate A or the spacer B is correctly transferred to a predetermined position, for example, when the two substrates A are When a plurality of spacers B are placed, the controller controls the driving mechanism 21 of the loading device 20 to drive the second pick-and-place mechanism 22b to correctly transfer the plurality of spacers B to the receiving device 32 according to the received sensing signal. Further, the first pick-and-place mechanism 22a is prevented from transferring the spacer B to the abnormal condition on the stage device 33, and the materials such as the substrate A and the spacer B are correctly transferred, thereby improving the work quality and ensuring smooth operation. Practical benefits.

Accordingly, this creation is a practical and progressive design, but there is no disclosure of the same products and publications, thus allowing for new patent applications. The law makes an application.

20‧‧‧Transfer device

21‧‧‧ drive mechanism

211‧‧‧ translation drive group

212‧‧‧ Lifting drive group

22‧‧‧ pick-and-place mechanism

221‧‧‧ Shelf

222‧‧‧Vacuum nozzle

23‧‧‧Vacuum generator

24‧‧‧Material Sensor

241‧‧‧ 承件

25‧‧‧Control valve

Claims (10)

A material loading device comprises: a pick-and-place mechanism: at least one vacuum nozzle is provided for sucking materials having different properties; and the material sensor is installed on the pick-and-place mechanism for sensing The difference in the nature of the material to be sucked; the controller: for receiving the sensing signal transmitted by the material sensor, and controlling the vacuum suction force of the vacuum nozzle of the pick-and-place mechanism according to the received sensing signal. The material transfer device according to claim 1, further comprising a driving mechanism for driving the pick-and-place mechanism to perform reciprocating displacement in at least one direction. The moving device of claim 2, wherein the driving mechanism comprises a translation driving group and a lifting driving group for respectively moving the pick-and-place mechanism for horizontal traverse and vertical lifting displacement. The material transfer device of claim 2, wherein the pick-and-place mechanism is provided with a frame coupled to the drive mechanism, and a plurality of vacuum nozzles are mounted on the frame. The material transfer device of claim 4, wherein the material sensor is attached to the rack of the pick-and-place mechanism by a bearing. The material transfer device of claim 1, wherein the material sensor is a metal sensor. The material transfer device of claim 1, wherein the vacuum nozzle of the pick-and-place mechanism is connected to a vacuum generator to generate a vacuum suction force. The material transfer device of claim 7, wherein the controller controls a control valve connected to the vacuum generator according to the received sensing signal to control the flow of the control valve to the vacuum generation. The gas flow rate of the device causes the vacuum generator to generate different degrees of vacuum to control the vacuum adsorption force of the vacuum nozzle that changes the pick-and-place mechanism. An operation device, comprising: a machine table; a feeding device: disposed on the machine table for receiving materials; and a receiving device: disposed on the machine table for receiving at least one completed operation Material; working device: is arranged on the machine for performing preset work on the material; the loading device is configured on the machine for carrying the material for positioning the work to be executed, and the material is Carrying to the working device; the transferring device according to claim 1 is disposed on the machine to transfer materials between the feeding device, the receiving device and the stage device. The working device according to claim 9, wherein the moving device is provided with a first pick-and-place mechanism and a second pick-and-place mechanism.