TWM531354U - 加工裝置 - Google Patents

加工裝置 Download PDF

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TWM531354U
TWM531354U TW105206396U TW105206396U TWM531354U TW M531354 U TWM531354 U TW M531354U TW 105206396 U TW105206396 U TW 105206396U TW 105206396 U TW105206396 U TW 105206396U TW M531354 U TWM531354 U TW M531354U
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processing
workpiece
quality
data
signal
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TW105206396U
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Po-Cheng Su
Hsin-Hong Hou
Fan-Tien Cheng
Haw-Ching Yang
Hao Tieng
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Factory Automation Technology
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Priority to TW105206396U priority Critical patent/TWM531354U/zh
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Priority to US15/587,360 priority patent/US20170322186A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4409—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison
    • G01N29/4427—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison with stored values, e.g. threshold values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4472—Mathematical theories or simulation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
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    • G06N5/04—Inference or reasoning models
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/025—Change of phase or condition
    • G01N2291/0258—Structural degradation, e.g. fatigue of composites, ageing of oils

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Description

加工裝置
本新型是有關於一種加工裝置，特別是指一種將加工過程中蒐集的表面加工訊號分類彙整的加工裝置。
為了提升工件加工的效率與品質，業界係以數值控制的數位加工裝置為加工機具進行加工，更配合目前較新的工件加工品質預測技術，以期更有效地在加工過程即時掌握工件的加工品質，前述工件加工品質的預測技術如中華民國專利證書號TW I481978 B「工具機之加工品質的預測方法」(主張美國專利申請案號61/722,250優先權)，其在工件的加工過程中可預測該工件加工後的品質數據，前述預測的品質數據目前並無分類彙整運用或分析應用，例如輸出的電流訊號、或振動訊號，未能進一步轉換成其他如顯示加工表面粗糙度的數據，以供參考，進而了解該批加工工件的表面紋路的好壞程度，因此，若能進一步充分運用輸出的訊號，更能提升資源運用的效能。
因此，本新型之目的即在提供一種可充分應用工件表面加工資訊之加工裝置。
於是，本新型加工裝置具有一可輸出工件表面加工訊號之加 工品質預測單元，一可儲存工件表面加工訊號之儲存單元，以及一可判讀工件表面加工訊號之工件表面資訊管理單元，該工件表面資訊管理單元係可將表面加工訊號轉換成工件表面品質數據；利用該工件表面資訊管理單元分別對加工品質預測單元提供的工件表面加工訊號判讀，並且轉換成工件表面紋路粗糙程度的數據，而可清楚地提供工件表面的品質資訊，充分運用加工過程偵測的訊號，進而增加加工裝置的附加價值，提高加工裝置的使用效能。
1‧‧‧加工裝置
2‧‧‧加工品質預測單元
3‧‧‧加工單元
4‧‧‧儲存單元
5‧‧‧工件表面資訊管理單元
第1圖是本新型加工裝置的方塊圖。
參閱第1圖，本新型之一較佳實施例加工裝置1係用以對工件進行加工，並彙整加工過程輸出的工件表面加工資訊，以供加工者或購買者參考，其具有一加工品質預測單元2、一加工單元3、一儲存單元4及一工件表面資訊管理單元5，該加工品質預測單元2係與該加工單元3與儲存單元4電訊連接，該工件表面資訊管理單元5係與該儲存單元4電訊連結。
該加工品質預測單元2係運用中華民國專利證書號TW I481978 B「工具機之加工品質的預測方法」之技術，其主要先以電腦輔助設計(CAD)形成工件的輪廓及其尺寸與公差，再利用電腦輔助製造(CAM)將前述之尺寸與公差及加工單元3的特性產生加工路徑，另外，需指定至少一產品準確度項目，前述產品準確度項目係包含粗糙度和/或尺寸偏離等，而尺寸偏離度包含有直線度、稜角度、垂直度、平行度和/或圓度等，同時 將產品準確度項目連結至加工路徑，而獲得產品準確度項目與加工路徑間的複數個關係，接著，利用加工單元3對工件依加工路徑來處理複數個工件樣本，並蒐集在加工期間與加工路徑相關的多個工件樣本之複數組樣本偵測資料，在完成樣本操作後，以演算法抑止偵測資料之雜訊，同時轉換工件樣本偵測資料為對應特徵型式的樣本特徵資料，完成工件樣本之加工操作後，以量測機台量測工件樣本的產品準確度項目，而獲得一組品質樣本資料(準確度值)，進而使用工件樣本的特徵資料與品質樣本資料，以預測演算法和前述之產品準確度項目與加工路徑間之關係，來建立針對產品準確度項目的一預測模型，亦即，藉由加工單元3對工件樣本進行加工時取得的特徵資料、品質樣本資料與工件的準確度值來形成一預測模型。
簡言之，該加工品質預測單元2對於欲加工之工件依設定的尺寸、公差及參數產生工件的加工路徑，並且虛擬預測工件的加工品質，同時輸出精確的工件表面品質數據，前述工件表面品質數據可包含有電流訊號、工件加工振動訊號或工件表面影像訊號，以電流訊號為例，若電流訊號瞬間增強，表示加工過程的順暢度不佳，如刀具鈍化或進刀量不恰當等因素，均有可能造成工件表面的粗糙度增加，反之，若電流訊號在一定的數值之內，則表示加工順暢，工件表面的加工品質符合要求，同樣地，振動訊號的強弱，亦可轉換成工件表面加工品質的數據，工件表面影像訊號亦同。
該儲存單元4係用以儲存該加工品質預測單元2輸出的各種工件表面品質數據，在本實施例中，該儲存單元4可為雲端的儲存裝置，以建立加工訊號的大數據(Big Data)。
該工件表面資訊管理單元5係用以判讀儲存單元4中每一筆訊號是否符合加工表面品質的要求，並分別將加工品質預測單元2輸出的電流訊號、工件加工振動訊號或工件表面影像訊號轉換成工件表面加工品質數據，亦即工件表面加工紋路粗糙度，以供了解該批加工工件的表面情況，該工件表面資訊管理單元5在本實施例中係以程式化之人工智慧裝置對每一筆來自儲存單元4的訊號加以判讀，故可快速且精確地顯示工件表面加工的品質數據，以供設計者或購買者參考之用。
本新型加工裝置1係利用該工件表面資訊管理單元5分別對加工品質預測單元2提供的工件表面加工訊號判讀，並且轉換成工件表面紋路粗糙程度的數據，而可清楚地提供工件表面的品質資訊，充分運用加工過程偵測的訊號，進而增加加工裝置1的附加價值，提高加工裝置1的使用效能。
1‧‧‧加工裝置
2‧‧‧加工品質預測單元
3‧‧‧加工單元
4‧‧‧儲存單元
5‧‧‧工件表面資訊管理單元

Claims (2)

  1. 一種加工裝置，其具有一可輸出工件表面加工訊號之加工品質預測單元，一可儲存工件表面加工訊號之儲存單元，以及一可判讀工件表面加工訊號之工件表面資訊管理單元，該工件表面資訊管理單元係可將表面加工訊號轉換成工件表面品質數據。
  2. 依據申請專利範圍第1項所述之加工裝置，其中，該加工品質預測單元係可輸出振動、電流或影像等訊號，該工件表面資訊管理單元係可以人工智慧程式判讀該等訊號。
TW105206396U 2016-05-04 2016-05-04 加工裝置 TWM531354U (zh)

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TWI737867B (zh) * 2017-01-23 2021-09-01 日商不二越機械工業股份有限公司 工件硏磨方法及工件硏磨裝置

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TWI625615B (zh) * 2016-11-29 2018-06-01 財團法人工業技術研究院 預測模型建立方法及其相關預測方法與電腦程式產品
US11347520B2 (en) * 2020-02-13 2022-05-31 Dell Products L.P. Unavailable memory device initialization system

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US5579232A (en) * 1993-03-29 1996-11-26 General Electric Company System and method including neural net for tool break detection

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI737867B (zh) * 2017-01-23 2021-09-01 日商不二越機械工業股份有限公司 工件硏磨方法及工件硏磨裝置

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