TWM526752U - Slurry supplying apparatus - Google Patents

Description

Slurry supply device

The present invention relates to a slurry supply device, and more particularly to a slurry supply device having both adjustable and quantitative control.

The chemical mechanical polishing (CMP) process is a very important part of the manufacturing process of semiconductor wafers, mainly for flattening the surface of wafers. Generally, the polishing pad is attached to the polishing platform, and the surface of the polishing pad is impregnated with a slurry (Slurry), and the surface of the wafer is brought into contact with the surface of the polishing pad to generate a relative rotation of the polishing platform and the wafer. Mechanical friction to flatten the surface of the wafer. The slurry is usually supplied to the storage tank of the slurry in advance.

For example, the Chinese Utility Model Patent Publication No. CN203045540U proposes a slurry supply device including a frame on which a liquid storage tank for storing the polishing liquid is installed, and at least one of the liquid storage tanks is connected thereto. a liquid supply pipe communicating with the inner cavity of the liquid storage tank, wherein the liquid supply pipe is provided with a pump and a liquid supply valve arranged in sequence along the flow direction of the polishing liquid, characterized in that: a liquid return pipe is further included, and the liquid returning pipe One end of the tube is in communication with the supply pipe section between the pump and the liquid supply valve, and the other end is in communication with the inner cavity of the liquid storage tank.

According to the above prior art, before the existing slurry supply device is used, the slurry is first introduced into the measuring container for measurement, and after the measurement is completed, the polishing liquid in the measuring container is introduced into the slurry storage tank. However, the above-mentioned extraction grinding is performed. The liquid method is easy to cause too much or too little extraction liquid due to human error. Among them, too much will be wasted due to incomplete use and the cost will be relatively increased. Too little will cause the process to stop due to insufficient polishing liquid during the grinding process, even more The problem of wafer damage.

The main object of the present invention is to solve the problem that the conventional polishing liquid supply device cannot adjust and carry out quantitative introduction of the polishing liquid, thereby causing an increase in polishing cost.

In order to achieve the above object, the present invention provides a slurry supply device for providing a polishing liquid to at least one polishing system, the slurry supply device comprising a supply tank, a liquid supply unit, an exhaust unit and an adjustment quantitative unit The supply tank includes a top end and an accommodating space, and the liquid supply unit has a liquid supply line disposed in the supply barrel and communicating with the accommodating space, the venting unit having a supply tank disposed in the supply tank The accommodating space of the accommodating space, the adjusting and calibrating unit includes a screw and a float switch, the screw is disposed at the top end and penetrates the supply tub, and the float switch is disposed at a bottom of the screw, wherein The height of the float switch in the accommodating space is adjusted by rotating the screw, so that the float switch detects whether the slurry flowing into the accommodating space reaches a rated capacity.

It can be seen from the above that the efficiency of the present invention over the prior art is that the present invention utilizes the screw and the arrangement of the float switch, and adjusts the float switch in the accommodating space by rotating the screw. The height is used to determine whether the amount of the slurry flowing into the accommodating space reaches the rated capacity. Therefore, the slurry supply device of the present invention can be excluded from the human error factor as compared with the conventional slurry supply device. The cost of grinding is not easy to cause wafer process shutdown and reduce wafer damage rate.

The detailed description and technical content of this new model are described below with the following diagram:

Please refer to FIG. 1 to FIG. 2B for a schematic perspective view of a slurry supply device according to an embodiment of the present invention, a schematic view of a slurry supply device according to an embodiment of the present invention, and an AA of FIG. 2A. Schematic cross-sectional view, the present invention is a slurry supply device for providing a polishing liquid to at least one polishing system, the slurry supply device comprising a supply tank 10, a liquid supply unit 20, an exhaust unit 30, and a row The liquid unit 40 and an adjustment and quanting unit 50 include a top end 11, an accommodating space 12, and a feeding port communicating with the accommodating space 12. In an embodiment of the present invention, the feed port has a first buffer, and the feed port is supplied with a raw material to the accommodating space 12.

The liquid supply unit 20 has a liquid supply line 21 disposed in the supply tank 10 and communicating with the accommodating space 12 to transport the polishing liquid to the accommodating space 12. In an embodiment, the liquid supply unit 20 includes a feed valve 22 disposed in the feed line 21 and controlling the flow rate of the slurry. The exhaust unit 30 has an exhaust line 31 disposed in the supply tub 10 and communicating with the accommodating space 12 to discharge an excess gas in the accommodating space 12. In an embodiment, the venting unit 30 The gas unit 30 further includes an exhaust valve 32 and a first detector 33. The exhaust valve 32 and the first detector 33 are respectively disposed in the exhaust line 31, and the first detector 33 detects the volume. The amount of the slurry in the space 12 is set and the exhaust valve 32 is controlled to determine the excess gas discharge amount in the accommodating space 12. The liquid discharge unit 40 has a drain line 41 disposed in the supply tank 10 and communicating with the accommodating space 12. In an embodiment, the drain unit 40 further includes a drain valve 42 and a second The detector 43 is disposed in the draining line 41, and the second detector 43 detects the amount of the slurry in the accommodating space 12 and controls the draining The valve 42 determines the discharge amount of the polishing liquid in the accommodating space 12.

The adjustment and quanting unit 50 includes a screw 51 and a float switch 52. The screw 51 is disposed at the top end 11 and penetrates the supply tub 10. The float switch 52 is disposed at a bottom 511 of the screw 51, wherein The screw 51 is rotated to adjust a height of the float switch 52 to the accommodating space 12, so that the float switch 52 detects whether the slurry flowing into the accommodating space 12 reaches a rated capacity. In an embodiment of the present invention, the adjustment and quanting unit 50 further includes a second buffer disposed outside the float switch 52.

In the present invention, the first buffer and the second buffer are used to avoid fluctuations in the liquid level due to the difference between the feed port and a liquid level of the slurry during the feeding process. , affecting the detection accuracy of the float switch 52.

In actual operation, it is mainly divided into adjustment mode and quantitative control. The adjustment method is: rotating the screw 51 to adjust the height of the float switch 52 in the accommodating space 12, and determining the rated capacity of the polishing liquid at the time; the quantitative control is: first opening the liquid supply valve And flowing the slurry through the liquid supply line 21 into the accommodating space 12, opening the exhaust valve 32, and discharging the excess gas in the accommodating space 12 through the exhaust line 31 and closing the row. The liquid valve 42 determines that the amount of the slurry flowing into the accommodating space 12 has reached the rated capacity and the liquid supply valve 22 and the exhaust valve are closed when the slurry switch 52 detects the slurry. 32. If the liquid supply valve 22 fails, the slurry will be continuously supplied to the accommodating space 12, and when the first detector 33 detects that the slurry in the accommodating space 12 has exceeded the rated capacity, it is forced Closing the liquid supply valve 22 and opening the exhaust valve 32 and the liquid discharge valve 42 respectively, respectively, an external gas enters the accommodating space 12 and discharges the polishing liquid to the accommodating space 12, when the second detector 43. Detecting that the slurry in the accommodating space 12 is equal to or less than the rated capacity, the drain valve 42 and the exhaust valve 32 are closed to achieve more precise quantitative control.

In summary, the present invention utilizes the screw and the arrangement of the float switch to adjust the rated capacity by rotating the screw and to perform quantitative control through the float switch, which is not conventionally used in advance. The amount is re-introduced into the liquid storage tank, so the polishing liquid supply device of the present invention has lower polishing cost, less difficulty in causing wafer process shutdown, and lowering the damage rate of the wafer than the conventional polishing liquid supply device.

The present invention has been described in detail above, but the above is only a preferred embodiment of the present invention, and the scope of the present invention is not limited. That is, the equal changes and modifications made in accordance with the scope of this new application shall remain within the scope of the patent of this new type.

10‧‧‧ supply bucket
11‧‧‧Top
12‧‧‧ accommodating space
20‧‧‧liquid supply unit
21‧‧‧Supply line
22‧‧‧Supply valve
30‧‧‧Exhaust unit
31‧‧‧Exhaust line
32‧‧‧Exhaust valve
33‧‧‧First detector
40‧‧‧Draining unit
41‧‧‧Draining line
42‧‧‧Drain valve
43‧‧‧Second detector
50‧‧‧Adjustment of quantitative units
51‧‧‧ screw
511‧‧‧ bottom
52‧‧‧Float switch

FIG. 1 is a perspective view of a polishing liquid supply device according to an embodiment of the present invention. 2A is a side view showing a slurry supply device according to an embodiment of the present invention. Fig. 2B is a schematic cross-sectional view taken along line A-A of Fig. 2A.

10‧‧‧ supply bucket

11‧‧‧Top

20‧‧‧liquid supply unit

21‧‧‧Supply line

22‧‧‧Supply valve

30‧‧‧Exhaust unit

31‧‧‧Exhaust line

32‧‧‧Exhaust valve

33‧‧‧First detector

40‧‧‧Draining unit

41‧‧‧Draining line

42‧‧‧Drain valve

43‧‧‧Second detector

50‧‧‧Adjustment of quantitative units

51‧‧‧ screw

Claims (7)

A slurry supply device for providing a polishing liquid to at least one polishing system, the slurry supply device comprising: a supply tank including a top end and an accommodating space; and a liquid supply unit having a supply tank And communicating with the accommodating space to transport the slurry to the liquid supply line of the accommodating space; an exhaust unit having a supply tank disposed in the supply tub and communicating with the accommodating space to accommodate the accommodating space An exhaust line for exhausting excess gas; and an adjustment dosing unit comprising a screw and a float switch disposed at the top end and extending through the supply barrel, the float switch being disposed at a bottom of the screw And rotating the screw to adjust a height of the float switch in the accommodating space, so that the float switch detects whether the slurry flowing into the accommodating space reaches a rated capacity. The slurry supply device according to claim 1, further comprising a drain unit having a drain line disposed in the supply tub and communicating with the receiving space. The slurry supply device of claim 2, wherein the liquid discharge unit further comprises a drain valve and a second detector, wherein the drain valve and the second detector are respectively disposed on the drain tube The second detector detects the amount of the slurry in the accommodating space and controls the drain valve to determine the discharge amount of the slurry in the accommodating space. The slurry supply device of claim 1, wherein the liquid supply unit further comprises a liquid supply valve disposed in the liquid supply line and controlling the flow rate of the slurry. The slurry supply device of claim 1, wherein the exhaust unit further comprises an exhaust valve and a first detector, wherein the exhaust valve and the first detector are respectively disposed on the exhaust pipe The first detector detects the amount of the slurry in the accommodating space and controls the vent valve to determine the excess gas discharge amount in the accommodating space. The slurry supply device of claim 1, wherein the supply tank further comprises a feed port communicating with the accommodating space, the feed port having a first damper. The slurry supply device of claim 1, wherein the adjustment and metering unit has a second buffer disposed outside the float switch.