TWM523954U - Inductive coil assembly - Google Patents

Description

Induction coil assembly

The present invention relates to the configuration of inductive components, and more particularly to a planarized inductive coil assembly.

Inductor coils are widely used in filtering, voltage conversion, rectification or other power conversion devices, and can provide different functions through different configurations and connections between coils.

The conventional coil is mainly a three-dimensional structure formed by winding an enameled wire on a bobbin. The above-mentioned three-dimensional winding structure is not conducive to miniaturization, and cannot be applied to the case where the size and the thickness are required to be miniaturized, and in the process of miniaturization, the accuracy of the actual performance due to the dimensional error is not in conformity with the design. Claim.

Therefore, based on the foregoing problems, the design of the planarized spiral coil has been developed in the prior art, and a planar winding turn can be fabricated on a circuit board in a general printed circuit board process, thereby replacing the three-dimensional winding structure. Such a planar coil has the advantages of being easy to miniaturize and facilitating mass production and maintaining high accuracy.

However, due to the planarized structure, the mutual matching and circuit connection between the plurality of planar coils becomes difficult, and it is not easy to configure a complicated planar coil combination on a single circuit board.

To achieve the above objective, the present invention discloses an induction coil assembly including a printed circuit board, a first planar winding set, a second planar winding set, and at least one auxiliary inductive component.

The printed circuit board has a first circuit layer, a second circuit layer, a third circuit layer, a fourth circuit layer, a fifth circuit layer, a sixth circuit layer, a seventh circuit layer, and an eighth circuit layer which are sequentially stacked, and printed A first block and a second block are defined on the circuit board. The first planar winding set has a plurality of planar inductive elements connected in series, disposed around the first block, and distributed in respective circuit layers of the printed circuit board. The second planar winding set has a plurality of planar inductive elements connected in series, disposed around the first block and distributed in respective circuit layers of the printed circuit board; and the planar inductive component of the first planar winding set and the second The planar inductive elements of the planar winding set are arranged in a staggered arrangement on the upper and lower adjacent circuit layers. The auxiliary inductive component is disposed on one of the circuit layers of the printed circuit board, disposed around the second block, and connected to the first planar winding set or the second planar winding set.

In a specific embodiment, the planar inductive component of the first planar winding group includes: a first planar inductive component disposed on the first circuit layer; a second planar inductive component disposed on the third circuit layer; a planar inductive component disposed on the fifth circuit layer; and a fourth planar inductive component disposed on the seventh circuit layer, wherein the first, second, third, and fourth planar inductive components are connected in series to surround the first block Settings.

In a specific embodiment, the planar inductive component of the second planar winding group includes: a fifth planar inductive component disposed on the second circuit layer; a sixth planar inductive component disposed on the fourth circuit layer; Planar inductive component, disposed on the sixth circuit layer; and an eighth The planar inductive component is disposed on the eighth circuit layer, and the fifth, sixth, seventh, and eighth planar inductive components are connected in series to each other and disposed around the first block.

In a specific embodiment, the first planar winding group further includes a first tap disposed on one of the circuit layers of the printed circuit board, and the first tap is connected to the two planar inductive components of the first planar winding group. between.

In one embodiment, the first tap is coupled between the second planar inductive component and the third planar inductive component and forms a first tap contact on the printed circuit board.

In one embodiment, the first planar inductive component and the fourth planar inductive component form a signal connection endpoint on the first circuit layer.

In a specific embodiment, the second planar winding group further includes a second tap disposed on one of the circuit layers of the printed circuit board, and the second tap is connected to the two planar inductive components of the second planar winding group between.

In one embodiment, the second tap is coupled between the sixth planar inductive component and the seventh planar inductive component and forms a second tap contact on the printed circuit board.

In one embodiment, the auxiliary inductive component is connected in series to one of the planar inductive components of the second planar winding set.

In a specific embodiment, the auxiliary inductive component is disposed on the first circuit layer and extends to the second circuit layer, and is connected in series to the fifth planar inductive component in the second circuit layer.

In one embodiment, the auxiliary inductive component forms a signal connection termination on the printed circuit board.

In a specific embodiment, the auxiliary inductive component is disposed on the seventh circuit layer and extends to the eighth circuit layer, and is connected in series to the eighth planar inductive component in the eighth circuit layer.

In one embodiment, the auxiliary inductive component extends through the line over the first circuit layer to form a signal connection endpoint.

In one embodiment, the printed circuit board further includes a first through slot and a second through slot respectively extending through the first block and the second block of the printed circuit board.

In one embodiment, the inductive coil assembly further includes a magnetic core, a portion of which is embedded in the first through slot and the second through slot of the printed circuit board.

The features, implementations, and effects of the present invention are described in detail below with reference to the drawings.

1‧‧‧Induction coil assembly

100‧‧‧Printed circuit board

101‧‧‧First circuit layer

102‧‧‧Second circuit layer

103‧‧‧ third circuit layer

104‧‧‧fourth circuit layer

105‧‧‧ fifth circuit layer

106‧‧‧ sixth circuit layer

107‧‧‧ seventh circuit layer

108‧‧‧ eighth circuit layer

110‧‧‧First Plane Winding Group

111‧‧‧First planar inductive component

112‧‧‧Second planar inductive component

113‧‧‧ Third planar inductive component

114‧‧‧4th planar inductive component

120‧‧‧Second plane winding group

125‧‧‧ fifth planar inductive component

126‧‧‧ sixth planar inductive component

127‧‧‧ seventh planar inductive component

128‧‧‧ eighth planar inductive component

131‧‧‧First auxiliary inductance component

132‧‧‧Second auxiliary inductance component

140‧‧‧ magnetic core

A1‧‧‧ first block

A2‧‧‧Second block

CT1‧‧‧first tap

CT2‧‧‧second tap

Cx‧‧‧first tap contact

Cy‧‧‧second tap contact

TH1‧‧‧first through slot

TH2‧‧‧Second through slot

X+, X-‧‧‧ signal connection endpoint

Y+, Y-‧‧‧ signal connection endpoint

Fig. 1 is an exploded perspective view showing the induction coil assembly of the new embodiment.

Fig. 2 is a perspective view of the induction coil assembly of the new embodiment.

Referring to FIG. 1 and FIG. 2 , an induction coil assembly 1 according to the present invention includes a printed circuit board 100 , a first planar winding set 110 , and a second planar winding set 120 .

As shown in FIG. 1, the printed circuit board 100 has eight circuit layers 101, 102, 103, 104, 105, 106, 107, 108, which are respectively a first circuit layer 101 to an eighth circuit layer 108, and a first block A1 and a second area are defined on the printed circuit board 100. Block A2, each circuit layer 101, 102, 103, 104, 105, 106, 107, 108 has a first block A1 and a second block A2. A first planar winding set 110 and a second planar winding set 120 are integrated in the printed circuit board 100.

As shown in FIG. 1, the first planar winding group 110 has a plurality of planar inductive elements 111, 112, 113, 114 connected in series, respectively disposed on the first circuit layer 101 and the third circuit layer. 103. The fifth circuit layer 105 and the seventh circuit layer 107. The planar inductive elements 111, 112, 113, 114 of the first planar winding set 110 each have a plurality of wound coils connected in series, disposed around the first block A1. The winding directions of the planar inductive elements 111, 112, 113, 114 of the first planar winding group 110 may be the same or opposite to each other.

The number of windings of the planar inductive elements 111, 112, 113, 114 of the first planar winding group 110 may be a ratio of one to one, or may be a ratio of other multiples, and the number of windings of the planar inductive elements 111, 112, 113, 114 may be changed according to design requirements.

As shown in FIG. 1, the second planar winding group 120 also has a plurality of planar inductive elements 125, 126, 127, 128 connected in series, respectively disposed on the second circuit layer 102, the fourth circuit layer 104, the sixth circuit layer 106, and the eighth. Circuit layer 108. The planar inductive elements 125, 126, 127, 128 of the second planar winding set 120 each have a plurality of wound coils connected in series, disposed around the first block A1. The winding directions of the planar inductive elements 125, 126, 127, 128 of the second planar winding set 120 may be the same or opposite to each other.

Similarly, the number of windings of the planar inductive components 125, 126, 127, 128 of the second planar winding group 120 may be a ratio of one to one, or may be a ratio of other multiples. The number of windings of the planar inductive components 125, 126, 127, 128 may be designed according to the design requirements. Changed.

Similarly, the total number of coils of the first planar winding group 110 and the second planar winding group 120 is also changed according to design requirements.

The planar inductive elements 111, 112, 113, 114 of the first planar winding set 110 and the planar inductive elements 125, 126, 127, 128 of the second planar winding set 120 are alternately disposed adjacent to the upper and lower adjacent circuit layers 101, 102, 103, 104, 105, 106, 107, 108.

Details of the induction coil assembly 1 of the first embodiment are further explained below.

As shown in FIG. 1, the circuit layer of the printed circuit board 100 includes at least a first circuit layer 101, a second circuit layer 102, a third circuit layer 103, a fourth circuit layer 104, a fifth circuit layer 105, and a sixth circuit layer. 106, the seventh circuit layer 107 and the eighth circuit layer 108, the aforementioned circuit layers are sequentially stacked.

The planar inductive component of the first planar winding set 110 includes a first planar inductive component 111, a second planar inductive component 112, a third planar inductive component 113, and a fourth planar inductive component 114. The first planar inductive component 111 is disposed on the first circuit layer 101, the second planar inductive component 112 is disposed on the third circuit layer 103, the third planar inductive component 103 is disposed on the fifth circuit layer 105, and the fourth planar inductive component 104 is disposed on the first circuit layer 101. The seventh circuit layer 107. The first, second, third, and fourth planar inductive elements 111, 112, 113, 114 are connected in series with each other, and the four inductive elements 111, 112, 113, 114 are disposed around the first block A1.

The planar inductive component of the second planar winding set 120 includes a fifth planar inductive component 125, a sixth planar inductive component 126, a seventh planar inductive component 127, and an eighth inductive component 128. The fifth planar inductive component 125 is disposed on the second circuit layer 102, the sixth planar inductive component 126 is disposed on the fourth circuit layer 104, the seventh planar inductive component 127 is disposed on the sixth circuit layer 106, and the eighth planar inductive component 128 is disposed. In the eighth circuit layer 108. The aforementioned fifth, sixth, seventh, and eighth planar inductive elements 125, 126, 127, 128 are connected in series with each other, and four inductive elements 125, 126, 127, 128 are disposed around the first block A1.

As shown in FIG. 1 and FIG. 2, the first planar winding group 110 further includes a first tap CT1 disposed on one of the circuit layers 101, 102, 103, 104, 105, 106, 107, 108 of the printed circuit board 100, and the first tap CT1 is connected to the first plane. Between two planar inductive elements of the winding set 110, for example, the first tap CT1 is connected to the second planar inductive element 112 and the third flat A first tap contact Cx is formed between the surface inductive elements 113 and on the surface of the printed circuit board 100 (eg, the first circuit layer 101). The first planar inductive component 111 and the fourth planar inductive component 114 form a signal connection terminal X+, X- on the surface of the printed circuit board 100.

As shown in FIG. 1 and FIG. 2, the second planar winding group 120 further includes a second tap CT2 disposed on one of the circuit layers 101, 102, 103, 104, 105, 106, 107, 108 of the printed circuit board 100, and the second tap CT2 is connected to the second plane. Between the two planar inductive elements of the winding set 120, for example, the second tap CT2 is connected between the sixth planar inductive element 126 and the seventh planar inductive element 127, and on the surface of the printed circuit board 100 (eg, the first circuit layer) A second tap contact Cy is formed on 101).

Further, the first tap contact Cx, the signal connection end point X+, X- may be disposed at one end of the rectangular printed circuit board 100, and the second tap contact point Cy is disposed at the other end of the rectangular printed circuit board 100.

As shown in FIG. 1 and FIG. 2, a second block A2 is further defined on the printed circuit board 100, and each circuit layer 101, 102, 103, 104, 105, 106, 107, 108 has a second block A2. The induction coil assembly 1 further includes a plurality of auxiliary inductance elements, each of which is disposed on one of the circuit layers 101, 102, 103, 104, 105, 106, 107, 108, disposed around the second block A2, and connected to the first planar winding group 110 or the second plane. Line group 120.

As shown in FIG. 1 , in an embodiment, the induction coil assembly 1 includes a first auxiliary inductance element 131 and a second auxiliary inductance element 132 .

As shown in FIG. 1, the first auxiliary inductance element 131 is disposed on one or a combination of the circuit layers 101, 102, 103, 104, 105, 106, 107, 108 of the printed circuit board 100, and is serially connected to one of the planar inductive elements 125, 126, 127, 128 of the second planar winding group 120. For example, the first auxiliary inductance element 131 is disposed on the first circuit layer 101 and further extends to the second circuit layer 102, and is connected in series to the fifth planar inductance element 125 at the second circuit layer 102, that is, connected in series to the second plane. One end of the winding group 120. At the same time, the first auxiliary inductance component 131 is disposed around the second block A2, and the first auxiliary inductance component 131 forms a signal connection terminal Y+ on the first circuit layer 101, and the signal connection terminal Y+ and the second tap contact Cy are located. The same end of the rectangular printed circuit board 100. The first auxiliary inductance element 131 may be the same or opposite in the winding direction of the first circuit layer 101 and the second circuit layer 102.

As shown in FIG. 1, the second auxiliary inductance element 132 is disposed on one or a combination of the circuit layers 101, 102, 103, 104, 105, 106, 107, 108 of the printed circuit board 100, and is serially connected to one of the planar inductive elements 125, 126, 127, 128 of the second planar winding group 120. . For example, the second auxiliary inductance element 132 is disposed on the seventh circuit layer 107 and further extends to the eighth circuit layer 108 to increase the inductive reactance, and is connected in series to the eighth planar inductive element 128, that is, in series, in the eighth circuit layer 108. The other end of the second planar winding group 120. At the same time, the second auxiliary inductance element 132 is disposed around the second block A2 and can interact with the first auxiliary inductance element 131. In addition, the second auxiliary inductance component 132 is formed on the first circuit layer 101 through the line to form a signal connection terminal Y-, and the signal connection terminal Y- and the second tap contact Cy are located at the same end of the rectangular printed circuit board 100. The second auxiliary inductance element 132 may be the same or opposite to the winding direction of the seventh circuit layer 107 and the eighth circuit layer 108 to change the inductive reactance characteristics.

As described above, the electrical connection between the circuit layers 101, 102, 103, 104, 105, 106, 107, 108 can be achieved through the through holes of the circuit layers 101, 102, 103, 104, 105, 106, 107, 108, and the circuit between the circuit layers 101, 102, 103, 104, 105, 106, 107, 108 can be electrically connected through the through-hole inner wall circuit metal film. connection. The application of the through hole is printing The technical means common in the technical field of the circuit board 100 will not be described below.

The inductive coil assembly 1 of the present invention is applied to filtering, voltage conversion or other power conversion applications.

As shown in FIG. 1 and FIG. 2, the printed circuit board 100 further includes a first through slot TH1 and a second through slot TH2. The first through slot TH1 extends through the first block A1 of the printed circuit board 100, and The second through slot TH2 extends through the second block A2 of the printed circuit board 100.

As shown in FIGS. 1 and 2, the induction coil assembly 1 further includes a magnetic core 140. A portion of the magnetic core 140 is embedded in the first through slot TH1 and the second through slot TH2 of the printed circuit board 100. In the preferred embodiment, the magnetic core 140 can be separated into two parts, and the half of the core 140 is separated into a C-shape, which facilitates assembly and adjustment of the parameters of the magnetic core 140.

In addition, the structural size of the magnetic core 140 can be determined according to design requirements, and the material of the magnetic core 140 can be a metal having magnetic permeability characteristics, for example, a metal containing different ratios of nickel, manganese, and zinc components. The magnetic core 140 can form a closed magnetic line of force between the wound coils to enhance the inductive effect between the wound coils.

1‧‧‧Induction coil assembly

100‧‧‧Printed circuit board

101‧‧‧First circuit layer

102‧‧‧Second circuit layer

103‧‧‧ third circuit layer

104‧‧‧fourth circuit layer

105‧‧‧ fifth circuit layer

106‧‧‧ sixth circuit layer

107‧‧‧ seventh circuit layer

108‧‧‧ eighth circuit layer

110‧‧‧First Plane Winding Group

111‧‧‧First planar inductive component

112‧‧‧Second planar inductive component

113‧‧‧ Third planar inductive component

114‧‧‧4th planar inductive component

120‧‧‧Second plane winding group

125‧‧‧ fifth planar inductive component

126‧‧‧ sixth planar inductive component

127‧‧‧ seventh planar inductive component

128‧‧‧ eighth planar inductive component

131‧‧‧First auxiliary inductance component

132‧‧‧Second auxiliary inductance component

140‧‧‧ magnetic core

A1‧‧‧ first block

A2‧‧‧Second block

CT1‧‧‧first tap

CT2‧‧‧second tap

Cx‧‧‧first tap contact

Cy‧‧‧second tap contact

TH1‧‧‧first through slot

TH2‧‧‧Second through slot

X+, X-‧‧‧ signal connection endpoint

Y+, Y-‧‧‧ signal connection endpoint

Claims (13)

An induction coil assembly comprising: a printed circuit board having a first circuit layer, a second circuit layer, a third circuit layer, a fourth circuit layer, a fifth circuit layer, a sixth circuit layer, and a seventh layer which are sequentially stacked a circuit layer and an eighth circuit layer, and a first block and a second block are defined on the printed circuit board; a first planar winding group having a plurality of planar inductive components connected in series, surrounding the first Blocks are disposed and distributed in respective circuit layers of the printed circuit board; a second planar winding group having a plurality of planar inductive elements connected in series, disposed around the first block, and distributed over the printed circuit In each circuit layer of the board; and the planar inductive component of the first planar winding group and the planar inductive component of the second planar winding group are alternately disposed adjacent to each other; and at least one auxiliary inductive component is disposed One of the circuit layers of the printed circuit board is disposed around the second block and connected to the first planar winding group or the second planar winding group. The inductive coil assembly of claim 1, wherein the planar inductive component of the first planar winding group comprises a first planar inductive component disposed on the first circuit layer; and a second planar inductive component disposed on a third circuit layer; a third planar inductive component disposed on the fifth circuit layer; and a fourth planar inductive component disposed on the seventh circuit layer, and the first, second, third, fourth The planar inductive elements are connected in series to each other and are disposed around the first block. The induction coil assembly of claim 2, wherein the planar inductance of the second planar winding group The component includes: a fifth planar inductive component disposed on the second circuit layer; a sixth planar inductive component disposed on the fourth circuit layer; a seventh planar inductive component disposed on the sixth circuit layer; An eighth planar inductive component is disposed on the eighth circuit layer, and the fifth, sixth, seventh, and eighth planar inductive components are connected in series to each other and disposed around the first block. The induction coil assembly of claim 3, wherein the first planar winding group further comprises a first tap disposed on one of the circuit layers of the printed circuit board, and the first tap is connected to the first Between two planar inductive components of a planar winding set. The induction coil assembly of claim 4, wherein the first tap is connected between the second planar inductive component and the third planar inductive component, and a first tap contact is formed on the printed circuit board . The inductive coil assembly of claim 4, wherein the first planar inductive component and the fourth planar inductive component form a signal connection endpoint on the first circuit layer. The induction coil assembly of claim 3, wherein the second planar winding group further comprises a second tap disposed on one of the circuit layers of the printed circuit board, and the second tap is connected to the first Between two planar inductive components of a two-plane winding set. The induction coil assembly of claim 7, wherein the second tap is connected between the sixth planar inductive component and the seventh planar inductive component, and a second tap contact is formed on the printed circuit board. . The induction coil assembly of claim 3, wherein the auxiliary inductance element is connected in series to one of the planar inductive elements of the second planar winding group. The induction coil assembly of claim 9, wherein the auxiliary inductance element is disposed on the first circuit layer and extends to the second circuit layer, and the second circuit layer is serially connected to the fifth planar inductor An element, and the auxiliary inductive element forms a signal connection end point on the printed circuit board. The induction coil assembly of claim 9, wherein the auxiliary inductance element is disposed on the seventh circuit layer and extends to the eighth circuit layer, and the eighth circuit layer is serially connected to the eighth planar inductor An element, and the auxiliary inductive element extends through the line to form a signal connection end point on the printed circuit board. The induction coil assembly of claim 1, wherein the printed circuit board further comprises a first through slot and a second through slot respectively extending through the first block and the second block of the printed circuit board. The induction coil assembly of claim 12, further comprising a magnetic core, a portion of the first through slot and the second through slot embedded in the printed circuit board.