TWM522518U - Infrared remote control apparatus - Google Patents
Infrared remote control apparatus Download PDFInfo
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- TWM522518U TWM522518U TW104220905U TW104220905U TWM522518U TW M522518 U TWM522518 U TW M522518U TW 104220905 U TW104220905 U TW 104220905U TW 104220905 U TW104220905 U TW 104220905U TW M522518 U TWM522518 U TW M522518U
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Description
本新型是有關於一種遙控裝置，特別是指一種紅外線遙控裝置。The present invention relates to a remote control device, and more particularly to an infrared remote control device.
參閱圖1，傳統的紅外線遙控裝置1包含一電路板11、多數紅外線發射元件12，及一接收控制元件13。該電路板11包括一板體111與一設置於該板體111的電路結構112。該等紅外線發射元件12分別是以發光二極體晶片配合透光樹脂塊封裝而成，再依序設置於該板體111並與該電路結構112電連接。該接收控制元件13亦是以IC晶片封裝而成，再設置於該板體111並與該電路結構112電連接，用於接收一控制訊號進而控制該等紅外線發射元件12。Referring to FIG. 1, a conventional infrared remote control device 1 includes a circuit board 11, a plurality of infrared ray emitting elements 12, and a receiving control element 13. The circuit board 11 includes a board body 111 and a circuit structure 112 disposed on the board body 111. The infrared ray emitting elements 12 are respectively packaged by a light emitting diode chip and a light-transmissive resin block, and are sequentially disposed on the board body 111 and electrically connected to the circuit structure 112. The receiving control element 13 is also packaged in an IC chip, and is further disposed on the board body 111 and electrically connected to the circuit structure 112 for receiving a control signal and controlling the infrared emitting elements 12.
當傳統的紅外線遙控裝置1之該接收控制元件13接收該控制訊號時，該接收控制元件13控制該等紅外線發射元件12中的其中至少一發出紅外線訊號，藉以遠端遙控家電設備。When the receiving control component 13 of the conventional infrared remote control device 1 receives the control signal, the receiving control component 13 controls at least one of the infrared emitting components 12 to emit an infrared signal, thereby remotely controlling the home appliance.
雖然，現有的紅外線遙控裝置1可以藉由該接收控制元件3接收控制訊號後，再令該等紅外線發射元件12發出紅外線訊號而達到遠端遙控家電設備的功效，但是，由於該等紅外線發射元件12均是先封裝完成後，再人工焊接設置於該電路板11上，因此，體積較大之外，整體製造程序也相當繁瑣。The infrared remote control device 1 can receive the control signal from the receiving control component 3, and then cause the infrared emitting component 12 to emit an infrared signal to achieve the function of the remote remote control home appliance, but due to the infrared emitting component 12 is the first package, and then manually soldered to the circuit board 11, so the overall manufacturing process is quite cumbersome.
此外，該等紅外線發射元件12由於封裝樹脂塊的圓錐狀結構而具有單一指向性，因此，傳統的紅外線遙控裝置1還存在有該等紅外線發射元件12所產生的紅外線信號強度在空間中分布不均勻，信號傳輸效率較低的缺點。In addition, the infrared ray emitting elements 12 have a single directivity due to the conical structure of the encapsulating resin block. Therefore, the conventional infrared remote control device 1 also has the infrared signal intensity generated by the infrared ray emitting elements 12 not distributed in the space. Uniform, low signal transmission efficiency.
因此，本新型之目的，即在提供一種微型化且高信號傳輸效率的紅外線遙控裝置。Therefore, the object of the present invention is to provide an infrared remote control device which is miniaturized and has high signal transmission efficiency.
於是，本新型紅外線遙控裝置，包含一電路板與一接收控制元件。Thus, the novel infrared remote control device comprises a circuit board and a receiving control element.
該電路板包括一板體、一設置於該板體的電路結構，及多數分別以表面黏著(surface-mount device, SMD)方式設置於該板體並與該電路結構電連接的紅外線發射晶片。The circuit board comprises a board body, a circuit structure disposed on the board body, and an infrared ray emitting chip which is disposed on the board body and electrically connected to the circuit structure, respectively, in a surface-mounting device (SMD) manner.
該接收控制元件設置於該板體並與該電路結構電連接，用於接收一控制訊號而令該等紅外線發射晶片中的其中至少一發出紅外線訊號。The receiving control component is disposed on the board and electrically connected to the circuit structure for receiving a control signal to cause at least one of the infrared emitting chips to emit an infrared signal.
本新型之功效在於：該電路板具有利用表面黏著技術固定的該等紅外線發射晶片，大幅縮小裝置整體體積，也簡化生產流程而降低生產成本，同時，發出的紅外線信號強度在空間中分布均勻，信號傳輸效率較高。The effect of the novel is that the circuit board has the infrared emitting wafers fixed by surface adhesion technology, which greatly reduces the overall volume of the device, simplifies the production process and reduces the production cost, and at the same time, the intensity of the emitted infrared signals is evenly distributed in the space. Signal transmission efficiency is high.
參閱圖2，本新型紅外線遙控裝置的一實施例包含一殼座2、一電路板3、一接收控制元件4、一紅外線接收元件5、一儲存元件6，及一無線區域網路接收元件7，用於發出紅外線訊號以遠端遙控家電設備。Referring to FIG. 2, an embodiment of the novel infrared remote control device includes a housing 2, a circuit board 3, a receiving control component 4, an infrared receiving component 5, a storage component 6, and a wireless area network receiving component 7. It is used to send infrared signals to remotely control home appliances.
該殼座2成半球狀並可供紅外線訊號通過，界定一容設該電路板3、該接收控制元件4、該紅外線接收元件5、該儲存元件6，及該無線區域網路接收元件7的容置空間20。The housing 2 is hemispherical and is permeable to infrared signals, defining a circuit board 3, the receiving control component 4, the infrared receiving component 5, the storage component 6, and the wireless local area network receiving component 7. The accommodation space 20 is accommodated.
該電路板3包括一成方形的板體31、一設置於該板體31的電路結構32、多數紅外線發射晶片33，及多數透光的樹脂塊34，該板體31是多層基板，該電路結構32形成於該板體31，該等紅外線發射晶片33分別以表面黏著方式，並配合以該等樹脂塊34包覆該等紅外線發射晶片33地設置於該板體31，同時與該電路結構32電連接，較佳地，該等紅外線發射晶片33平均分布於一圓周上，而能均勻向四周傳輸紅外線訊號，在本實施例中，該等紅外線發射晶片33的數量是三個，且等間距地排列而概成三角形態樣，進而使該等紅外線發射晶片33所發出的紅外線訊號透過該殼座2成半球型區域傳送，而使紅外線信號強度分布均勻。The circuit board 3 includes a square plate body 31, a circuit structure 32 disposed on the board body 31, a plurality of infrared emitting chips 33, and a plurality of light transmissive resin blocks 34. The board body 31 is a multi-layer substrate. The structure 32 is formed on the plate body 31, and the infrared ray-emitting wafers 33 are respectively disposed on the surface of the plate body 31 in a surface-adhesive manner, and the infrared ray-emitting wafers 33 are covered with the resin blocks 34, and the circuit structure 32, electrically connected, preferably, the infrared emitting wafers 33 are evenly distributed on a circumference, and can uniformly transmit infrared signals to the periphery. In the embodiment, the number of the infrared emitting wafers 33 is three, and the like. Arranged at a pitch to form a triangular shape, and the infrared signals emitted by the infrared ray emitting chips 33 are transmitted through the housing 2 into a hemispherical region, so that the infrared signal intensity distribution is uniform.
該接收控制元件4、該紅外線接收元件5、儲存元件6、無線區域網路(Wi-Fi)接收元件7等分別是具有預定功能的IC晶片封裝而成，再分別銲黏於該板體31上。The receiving control element 4, the infrared receiving element 5, the storage element 6, the wireless area network (Wi-Fi) receiving element 7, and the like are respectively packaged with IC chips having predetermined functions, and are respectively soldered to the board body 31. on.
該接收控制元件4為一中央處理單元或一微處理器，用於令該等紅外線發射晶片33中的至少一發出紅外線訊號。The receiving control component 4 is a central processing unit or a microprocessor for causing at least one of the infrared emitting wafers 33 to emit an infrared signal.
該紅外線接收元件5設置於該板體31之邊緣並與該電路結構32電連接，用於自外部接收一儲存有相關於遙控頻率內碼的紅外線信號，並將該紅外線信號儲存於該儲存元件6中，以供該接收控制元件4讀取，此部分請容後再詳細說明。The infrared receiving component 5 is disposed at an edge of the board body 31 and electrically connected to the circuit structure 32 for receiving an infrared signal stored with respect to the remote frequency internal code from the outside, and storing the infrared signal in the storage component 6 is for reading by the receiving control element 4, and this part will be described in detail later.
該儲存元件6位於該等紅外線發射晶片33中的其中二紅外線發射晶片33間地設置於該板體31上，並與該電路結構32電連接，用於儲存該紅外線接收元件5接收到的該紅外線信號的遙控頻率內碼。The storage element 6 is disposed on the plate body 31 between the two infrared emission chips 33 in the infrared emission chip 33, and is electrically connected to the circuit structure 32 for storing the infrared receiving component 5 received by the infrared receiving component 5. The remote frequency internal code of the infrared signal.
該無線區域網路(Wi-Fi)接收元件7位於該板體31上，且與該儲存元件6間隔設置，並與該電路結構32電連接，用於接收一儲存有相關於遙控頻率內碼的無線信號。The wireless local area network (Wi-Fi) receiving component 7 is located on the board body 31, and is spaced apart from the storage component 6 and electrically connected to the circuit structure 32 for receiving a stored internal code associated with the remote control frequency. Wireless signal.
特別地，上述本新型紅外線遙控裝置的實施例於操作學習遙控器的遙控功能時，將該遙控器對準於該紅外線接收元件5，令該紅外線接收元件5接收一儲存有該遙控器之遙控頻率內碼的紅外線信號，並使該遙控器之遙控頻率內碼儲存於該儲存元件6。In particular, when the remote control function of the remote control device is operated, the remote controller is aligned with the infrared receiving component 5, and the infrared receiving component 5 receives a remote control storing the remote controller. The infrared signal of the frequency inner code and the remote frequency internal code of the remote controller are stored in the storage element 6.
當本新型紅外線遙控裝置的實施例於完成學習該遙控器後，該接收控制元件4可接收一控制訊號並根據該遙控頻率內碼令該其中至少一紅外線發射晶片33發出紅外線訊號，藉此遙控一原可受該遙控器操控的家電設備，而遠端遙控該家電設備。When the remote control device of the present invention completes learning the remote controller, the receiving control component 4 can receive a control signal and cause at least one of the infrared emitting chips 33 to emit an infrared signal according to the remote frequency internal code, thereby remotely controlling A home appliance that can be controlled by the remote controller, and remotely controls the home appliance.
特別值得一提的，本新型紅外線遙控裝置的實施例的該等紅外線發射晶片33是藉由表面黏著技術設置於該板體31並與該電路結構32電連接，因此，毋須如傳統的紅外線遙控裝置一般，需先將發光二極體晶片封裝成紅外線發射元件12，之後再銲黏於電路板上，因此，可以節省晶片封裝成元件的製程程序、降低生產成本，也可以縮減晶片封裝成元件的體積，從而縮減整體紅外線遙控裝置的體積，達成電氣產品走向輕、薄、小巧的方向的目標。It is particularly worth mentioning that the infrared emitting wafers 33 of the embodiment of the novel infrared remote control device are disposed on the board body 31 by the surface adhesion technology and are electrically connected to the circuit structure 32. Therefore, there is no need for a conventional infrared remote control. In general, the LED chip is first packaged into an infrared emitting device 12, and then soldered to the circuit board. Therefore, the process of packaging the package into components can be saved, the production cost can be reduced, and the package can be reduced into components. The volume, thus reducing the size of the overall infrared remote control device, to achieve the goal of the electrical product to a light, thin, compact direction.
綜上所述，本新型主要是提供一種直接將紅外線發射晶片33以表面黏著技術設置於電路板，進而縮減整體體積的紅外線遙控裝置，以改善現有的紅外線遙控裝置體積較大、生產流程較為繁瑣，且發出的紅外線信號強度分布不均勻的缺點，確實可達到本新型之目的。In summary, the present invention mainly provides an infrared remote control device that directly sets the infrared emitting chip 33 on the circuit board by surface adhesion technology, thereby reducing the overall volume, so as to improve the size of the existing infrared remote control device and the cumbersome production process. And the shortcoming of the intensity distribution of the infrared signal emitted is indeed the purpose of the present invention.
惟以上所述者，僅為本新型之較佳實施例而已，當不能以此限定本新型實施之範圍，凡是依本新型申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本新型專利涵蓋之範圍內。However, the above is only a preferred embodiment of the present invention, and when it is not possible to limit the scope of the present invention, any simple equivalent changes and modifications made in accordance with the scope of the present patent application and the contents of the patent specification are It is still within the scope of this new patent.
2‧‧‧殼座
34‧‧‧樹脂塊
20‧‧‧容置空間
4‧‧‧接收控制元件
3‧‧‧電路板
5‧‧‧紅外線接收元件
31‧‧‧板體
6‧‧‧儲存元件
32‧‧‧電路結構
7‧‧‧無線區域網路接收元件
33‧‧‧紅外線發射晶片2‧‧‧Shell
34‧‧‧ resin block
20‧‧‧ accommodating space
4‧‧‧ Receiving control components
3‧‧‧Circuit board
5‧‧‧Infrared receiving components
31‧‧‧ board
6‧‧‧Storage components
32‧‧‧Circuit structure
7‧‧‧Wireless Area Network Receiving Components
33‧‧‧Infrared emitting chip
本新型之其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中： 圖1是架構示意圖，說明一種傳統的紅外線遙控裝置；及 圖2是立體示意圖，說明本新型紅外線遙控裝置的一實施例。Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: FIG. 1 is a schematic diagram showing a conventional infrared remote control device; and FIG. 2 is a perspective view showing the novel infrared remote control An embodiment of the device.
2‧‧‧殼座 2‧‧‧Shell
20‧‧‧容置空間 20‧‧‧ accommodating space
3‧‧‧電路板 3‧‧‧Circuit board
31‧‧‧板體 31‧‧‧ board
32‧‧‧電路結構 32‧‧‧Circuit structure
33‧‧‧紅外線發射晶片 33‧‧‧Infrared emitting chip
34‧‧‧樹脂塊 34‧‧‧ resin block
4‧‧‧接收控制元件 4‧‧‧ Receiving control components
5‧‧‧紅外線接收元件 5‧‧‧Infrared receiving components
6‧‧‧儲存元件 6‧‧‧Storage components
7‧‧‧無線區域網路接收元件 7‧‧‧Wireless Area Network Receiving Components
Claims (8)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104220905U TWM522518U (en) | 2015-12-28 | 2015-12-28 | Infrared remote control apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104220905U TWM522518U (en) | 2015-12-28 | 2015-12-28 | Infrared remote control apparatus |
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| Publication Number | Publication Date |
|---|---|
| TWM522518U true TWM522518U (en) | 2016-05-21 |
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| TW104220905U TWM522518U (en) | 2015-12-28 | 2015-12-28 | Infrared remote control apparatus |
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| TW (1) | TWM522518U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110246827A (en) * | 2014-12-16 | 2019-09-17 | 旺宏电子股份有限公司 | Semiconductor element and its manufacturing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110246827A (en) * | 2014-12-16 | 2019-09-17 | 旺宏电子股份有限公司 | Semiconductor element and its manufacturing method |
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