TWM520670U - Heat dissipation module with dust removal unit - Google Patents
Heat dissipation module with dust removal unit Download PDFInfo
- Publication number
- TWM520670U TWM520670U TW104219754U TW104219754U TWM520670U TW M520670 U TWM520670 U TW M520670U TW 104219754 U TW104219754 U TW 104219754U TW 104219754 U TW104219754 U TW 104219754U TW M520670 U TWM520670 U TW M520670U
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- air inlet
- dust removing
- side opening
- dissipation module
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本創作有關一種除塵結構,尤指一種在散熱模組的進風處的除塵結構以及相關的散熱模組。The present invention relates to a dust removal structure, and more particularly to a dust removal structure and associated heat dissipation module at the inlet of the heat dissipation module.
大部分的電子元件在運作時均會產生熱量,對於某些高頻率運作的微晶片如中央處理器、繪圖顯示晶片…等,其所產生的高熱更需要另外以散熱導管、鰭片等方式將之帶走,以避免高熱造成元件的故障。目前常用的散熱模組的散熱器主要由多個具有高導熱效果的金屬鰭片堆疊構成,晶片所產生的高熱由直接接觸的高導熱金屬(一般以銅為材質)經由銅導管傳導至這些金屬鰭片,並由金屬鰭片一側的散熱風扇提供強力的散熱氣流,流經這些金屬鰭片以將熱帶走。Most of the electronic components generate heat during operation. For some high-frequency operation microchips such as central processing units, graphics display chips, etc., the high heat generated by them needs to be additionally provided by heat pipes, fins, etc. Take it away to avoid component failure caused by high heat. At present, the heat sink of the commonly used heat dissipation module is mainly composed of a plurality of metal fins with high heat conduction effect, and the high heat generated by the wafer is transmitted to the metal through the copper conduit through the high thermal conductivity metal (usually made of copper) which is in direct contact. Fins, and a cooling fan on one side of the metal fins provides a powerful cooling airflow that flows through these metal fins to move the tropics.
也正由於散熱器一般均需搭配散熱風扇產生散熱氣流,因此空氣中的灰塵也非常容易隨著氣流的流動而堆積在散熱器的金屬鰭片一端的進風處。長期的灰塵累積會影響散熱氣流的流動,造成散熱系統的排熱能力降低,主機內部的溫度居高不下,進而影響到系統主機的效能以及壽命。It is also because the heat sink generally needs to be equipped with a heat-dissipating fan to generate a heat-dissipating airflow, so that the dust in the air is also easily accumulated in the air inlet at one end of the metal fin of the heat sink as the airflow flows. The long-term accumulation of dust will affect the flow of the heat-dissipating airflow, which will reduce the heat-dissipating capacity of the heat-dissipating system, and the internal temperature of the host will remain high, which will affect the performance and life of the system host.
為了解決上述普遍存在於散熱器結構的灰塵堆積的問題,本創作的實施例中提供了一種應用於散熱模組的除塵結構以及相關的散熱模組。In order to solve the above problem of dust accumulation which is ubiquitous in the heat sink structure, an embodiment of the present invention provides a dust removing structure and a related heat dissipation module applied to the heat dissipation module.
本創作的實施例中所提供的具有除塵結構的散熱模組包含有一散熱器、一第一風扇、一除塵結構以及一第二風扇。該散熱器具有一進風面。該第一風扇設置於該散熱器的該進風面處,用來沿一第一方向向該散熱器提供散熱氣流。該除塵結構設置於該第一風扇以及該進風面之間,該除塵結構沿一第二方向延伸且具有一進風口以及一出風口,於該進風口以及該出風口間形成一除塵風道。該第二風扇設置於該除塵結構的該進風口,該第二風扇用來沿該第二方向於該除塵風道內提供除塵氣流。The heat dissipation module with the dust removal structure provided in the embodiment of the present invention includes a heat sink, a first fan, a dust removing structure and a second fan. The radiator has an air inlet surface. The first fan is disposed at the air inlet surface of the heat sink to provide a heat dissipation airflow to the heat sink in a first direction. The dust removing structure is disposed between the first fan and the air inlet surface, and the dust removing structure extends along a second direction and has an air inlet and an air outlet, and a dust removal duct is formed between the air inlet and the air outlet. . The second fan is disposed at the air inlet of the dust removing structure, and the second fan is configured to provide a dust removing airflow in the dust removing air duct along the second direction.
於本創作所提供的散熱模組的實施例中,其中該除塵結構具有一第一側開口以及一第二側開口,該第一側開口以及該第二側開口彼此相對,該第二側開口相鄰於該進風面,該第一風扇卡合於該除塵結構且對應該第一側開口的位置,以自該第一側開口沿該第一方向向該第二側開口以及該進風面提供散熱氣流。In an embodiment of the heat dissipation module provided by the present invention, the dust removing structure has a first side opening and a second side opening, the first side opening and the second side opening being opposite to each other, the second side opening Adjacent to the air inlet surface, the first fan is engaged with the dust removing structure and corresponds to the position of the first side opening, and the first side opening is opened from the first side to the second side and the air inlet The surface provides a cooling airflow.
於本創作所提供的散熱模組的實施例中,其中該進風面所代表的平面與該第二側開口所形成的平面平行,且相距一間隔,或延伸於該除塵結構內且位於該第一側開口以及該第二側開口之間。In the embodiment of the heat dissipation module provided by the present invention, the plane represented by the air inlet surface is parallel to the plane formed by the second side opening, and is spaced apart from each other or extends in the dust removing structure and is located in the Between the first side opening and the second side opening.
於本創作所提供的散熱模組的實施例中,其中該散熱器另包含一固定框,固定於該進風面處,該除塵結構另外卡合於該固定框且該固定框對應該第二側開口的位置。In the embodiment of the heat dissipation module provided by the present invention, the heat sink further includes a fixing frame fixed to the air inlet surface, the dust removing structure is additionally engaged with the fixing frame and the fixing frame corresponds to the second The position of the side opening.
於本創作所提供的散熱模組的實施例中,其中該固定框具有複數個第一卡勾,該除塵結構對應該複數個卡勾的位置具有複數個卡槽,該複數個卡勾分別卡合於該複數個卡槽,使該除塵結構卡合於該固定框。In the embodiment of the heat dissipation module provided by the present invention, the fixed frame has a plurality of first hooks, and the dust removing structure has a plurality of card slots corresponding to the positions of the plurality of hooks, and the plurality of hooks respectively The plurality of card slots are engaged to engage the dust removing structure with the fixing frame.
於本創作所提供的散熱模組的實施例中,其中該除塵結構對應該複數個卡槽的位置具有複數個第二卡勾,分別卡合於該第一風扇以將該第一風扇卡合於該除塵結構且對應該第一側開口的位置,其中該複數個第二卡勾與該複數個第一卡勾具有相同的結構。In the embodiment of the heat dissipation module provided by the present invention, the dust removing structure has a plurality of second hooks corresponding to the positions of the plurality of card slots, respectively engaging the first fan to engage the first fan. And a position corresponding to the dust removing structure and corresponding to the opening of the first side, wherein the plurality of second hooks have the same structure as the plurality of first hooks.
於本創作所提供的散熱模組的實施例中,其中該第一風扇以螺絲卡合於該除塵結構。In an embodiment of the heat dissipation module provided by the present invention, the first fan is screwed to the dust removing structure.
於本創作所提供的散熱模組的實施例中,其中該散熱器具有複數個彼此平行排列的散熱鰭片,該複數個散熱鰭片的一端共同形成該進風面。In an embodiment of the heat dissipation module provided by the present invention, the heat sink has a plurality of heat dissipation fins arranged in parallel with each other, and one end of the plurality of heat dissipation fins jointly form the air inlet surface.
於本創作所提供的散熱模組的實施例中,其中該除塵結構的該除塵風道沿該第二方向延伸,使該出風口與該散熱器切齊、使該出風口位於該散熱模組所在之一機殼外、或使該出風口位於該機殼內之一特定位置。In the embodiment of the heat dissipation module provided by the present invention, the dust removal duct of the dust removing structure extends along the second direction, so that the air outlet is aligned with the heat sink, and the air outlet is located at the heat dissipation module. One of the outer casings, or the air outlet is located at a specific location within the casing.
於本創作所提供的散熱模組的實施例中,其中該第二方向垂直於該第一方向,該除塵氣流以平行於該進風面的方向對該進風面除塵。In an embodiment of the heat dissipation module provided by the present invention, wherein the second direction is perpendicular to the first direction, the dust removal airflow dedusts the air inlet surface in a direction parallel to the air inlet surface.
本創作所提供的散熱模組,可以在散熱器的進風面處另外提供橫向的除塵氣流,以有效地將容易堆積在進風面的灰塵帶走,避免灰塵堵塞於進風面而影響散熱氣流流經散熱器的鰭片進行散熱的效率。The heat dissipation module provided by the creation can additionally provide a horizontal dust removal airflow at the air inlet surface of the radiator to effectively remove the dust which is easy to accumulate on the air inlet surface, thereby preventing dust from being blocked on the air inlet surface and affecting heat dissipation. The efficiency of heat dissipation by the flow of air through the fins of the heat sink.
在說明書及後續的申請專利範圍當中使用了某些詞彙來指稱特定的元件。所屬領域中具有通常知識者應可理解,製造商可能會用不同的名詞來稱呼同一個元件。本說明書及後續的申請專利範圍並不以名稱的差異來作為區分元件的方式,而是以元件在功能上的差異來作為區分的準則。在通篇說明書及後續的請求項當中所提及的「包含」係為一開放式的用語,故應解釋成「包含但不限定於」。此外,「耦接」或「連接」一詞在此係包含任何直接及間接的結構連接手段。因此,若文中描述一第一裝置耦接/連接於一第二裝置,則代表該第一裝置可直接結構連接於該第二裝置,或透過其他裝置或連接手段間接地結構連接至該第二裝置。Certain terms are used throughout the description and following claims to refer to particular elements. Those of ordinary skill in the art should understand that a manufacturer may refer to the same component by a different noun. The scope of this specification and the subsequent patent application do not use the difference of the names as the means for distinguishing the elements, but the difference in function of the elements as the criterion for distinguishing. The term "including" as used throughout the specification and subsequent claims is an open term and should be interpreted as "including but not limited to". In addition, the term "coupled" or "connected" is used herein to include any direct and indirect structural means of attachment. Therefore, if a first device is coupled/connected to a second device, it means that the first device can be directly connected to the second device, or indirectly connected to the second device through other devices or connection means. Device.
請參考第1~3圖,其中第1圖為本創作的散熱模組一第一實施例的示意圖,第2圖、第3圖為第1圖的散熱模組第一實施例各元件在兩個不同角度的爆炸示意圖。第一實施例的散熱模組1包含有一散熱器10、一除塵結構30、一第一風扇50以及一第二風扇70。在本實施例中,散熱器10為具有銅導管及多個散熱鰭片14(但不以此為限)所組成的散熱結構,散熱鰭片14彼此平行排列,並於一端共同形成散熱器10的一進風面12。第一風扇50設置於散熱器10的進風面12處,用來沿著圖中的第一方向D1向散熱器10提供散熱氣流,散熱氣流流經平行排列的散熱鰭片14時可將導至散熱鰭片14的熱能帶離開散熱器10,從而達到散熱的效果。在本創作的實施例中,散熱模組1另包含一固定框90,固定框90以螺絲94穿過其上的安裝孔95並鎖附於散熱器10的螺絲孔16上,以將固定框90固定於散熱器10的進風面12處,而固定框90同時可透過卡勾96卡合於散熱器10的進風面12處。Please refer to FIG. 1 to FIG. 3 , wherein FIG. 1 is a schematic view of a first embodiment of the heat dissipation module of the present invention, and FIG. 2 and FIG. 3 show the components of the first embodiment of the heat dissipation module of FIG. 1 in two A schematic diagram of the explosion at different angles. The heat dissipation module 1 of the first embodiment includes a heat sink 10, a dust removing structure 30, a first fan 50, and a second fan 70. In this embodiment, the heat sink 10 is a heat dissipation structure composed of a copper conduit and a plurality of heat dissipation fins 14 (not limited thereto). The heat dissipation fins 14 are arranged in parallel with each other and form a heat sink 10 at one end. One into the wind surface 12. The first fan 50 is disposed at the air inlet surface 12 of the heat sink 10 for providing a heat dissipation airflow to the heat sink 10 along the first direction D1 in the figure. The heat dissipation airflow can be guided through the heat dissipation fins 14 arranged in parallel. The heat energy band to the heat sink fins 14 leaves the heat sink 10 to achieve the heat dissipation effect. In the embodiment of the present invention, the heat dissipation module 1 further includes a fixing frame 90. The fixing frame 90 passes through the mounting hole 95 of the screw 94 and is locked to the screw hole 16 of the heat sink 10 to fix the frame. The fixing frame 90 is fixed to the air inlet surface 12 of the heat sink 10 , and the fixing frame 90 is simultaneously engaged with the air inlet surface 12 of the heat sink 10 through the hook 96 .
固定框90另外具有複數個第一卡勾92,在未加入除塵結構30之前,第一卡勾92可以直接卡合第一風扇50,以將第一風扇50固定於固定框90上而設置於進風面12處。在本創作的實施例中,則是將除塵結構30設置於第一風扇50與進風面12之間。除塵結構30為沿著第二方向D2延伸的結構,具有一進風口31以及一出風口32,而在進風口31以及出風口32之間則形成一除塵風道33。第二風扇70則設置於除塵結構30的進風口31處,於本創作的實施例中,第二風扇70以螺絲72鎖固於除塵結構30上而鄰接進風口31。當第二風扇70啟動時,其可帶動空氣流動而沿著第二方向D2於除塵風道33內提供除塵氣流。The fixing frame 90 has a plurality of first hooks 92. Before the dust removing structure 30 is added, the first hook 92 can directly engage the first fan 50 to fix the first fan 50 to the fixing frame 90. At the wind surface 12 . In the embodiment of the present invention, the dust removing structure 30 is disposed between the first fan 50 and the air inlet surface 12. The dust removing structure 30 has a structure extending along the second direction D2, and has an air inlet 31 and an air outlet 32, and a dust removing duct 33 is formed between the air inlet 31 and the air outlet 32. The second fan 70 is disposed at the air inlet 31 of the dust removing structure 30. In the embodiment of the present invention, the second fan 70 is locked to the dust removing structure 30 by a screw 72 to abut the air inlet 31. When the second fan 70 is activated, it can drive the air to flow to provide a dust removal airflow in the dust removal duct 33 along the second direction D2.
除塵結構30對應固定框90的複數個第一卡勾92的位置分別具有複數個卡槽36,並且除塵結構30另外具有一第一側開口34以及一第二側開口35,第一側開口34與第二側開口35彼此相對,且第一側開口34相鄰於進風面12。除塵結構30的複數個卡槽36分別與固定框90的第一卡勾92卡合,使除塵結構30卡合於固定框90上。當除塵結構30卡合於固定框90時,除塵結構30中對應複數個卡槽36的位置具有複數個第二卡勾37,且於一較佳實施例中,第一卡勾92與第二卡勾37具有相同的結構,而除塵結構30則可以藉由第二卡勾37分別卡合第一風扇50以將第一風扇50卡合於除塵結構30上,且第一風扇50對應第一側開口34的位置。這樣一來,當固定框90、除塵結構30以及第一風扇50如第1圖所示安裝於散熱器10的進風面12時,第一風扇50可以自除塵結構30的第一側開口34沿著第一方向D1向第二側開口35以及進風面12提供散熱氣流。另外要說明的是,除了透過第二卡勾37以將第一風扇50固定於除塵結構30外,另外也可利用螺絲52將第一風扇50卡合鎖固於除塵結構30上,本創作並不以實施例的態樣為限。The dust removing structure 30 has a plurality of card slots 36 corresponding to the positions of the plurality of first hooks 92 of the fixing frame 90, and the dust removing structure 30 additionally has a first side opening 34 and a second side opening 35, and the first side opening 34 The second side opening 35 is opposed to each other, and the first side opening 34 is adjacent to the air inlet face 12. The plurality of card slots 36 of the dust removing structure 30 are respectively engaged with the first hooks 92 of the fixing frame 90, so that the dust removing structure 30 is engaged with the fixing frame 90. When the dust removing structure 30 is engaged with the fixing frame 90, the position of the plurality of card slots 36 in the dust removing structure 30 has a plurality of second hooks 37, and in a preferred embodiment, the first hooks 92 and the second The hooks 37 have the same structure, and the dust removing structure 30 can respectively engage the first fan 50 by the second hooks 37 to engage the first fan 50 on the dust removing structure 30, and the first fan 50 corresponds to the first The position of the side opening 34. In this way, when the fixing frame 90, the dust removing structure 30, and the first fan 50 are mounted on the air inlet surface 12 of the heat sink 10 as shown in FIG. 1, the first fan 50 can be self-contained from the first side opening 34 of the dust removing structure 30. A heat dissipation airflow is provided to the second side opening 35 and the air inlet surface 12 along the first direction D1. In addition, in addition to the first hook 50 being fixed to the dust removing structure 30 through the second hook 37, the first fan 50 can be locked and locked to the dust removing structure 30 by using the screw 52. It is not limited to the embodiment.
本創作的散熱模組1在加入了除塵結構30後,除了保有原來第一風扇50沿著第一方向D1向散熱器10吹送的散熱氣流以外,由第二風扇70在除塵結構30的進風口31沿著除塵風道33吹送的除塵氣流可以有效地帶走堆積在進風面12的灰塵。而在本實施例中,第二方向D2較佳地垂直於第一方向D1,也就是說,進入除塵風道33的除塵氣流以平行於進風面12的方向對進風面12除塵,這種以側向吹拂的方式可確保達到最佳的除塵效率,然而本創作不以此為限,也就是除塵風道33的方向並不一定與第一方向D1的散熱氣流垂直,只要除塵風道33延伸的第二方向D2不與第一方向D1為同一方向,均可對進風面12達到一定的除塵效果。After the dust removing structure 30 is added, the heat dissipating module 1 of the present invention is provided with the second air fan 70 at the air inlet of the dust removing structure 30, except for the heat dissipating airflow that the original first fan 50 blows toward the heat sink 10 along the first direction D1. The dust removal airflow blown along the dust removal duct 33 can effectively remove the dust accumulated on the air inlet surface 12. In the present embodiment, the second direction D2 is preferably perpendicular to the first direction D1, that is, the dust-removing airflow entering the dust-removing air passage 33 dedusts the air-intake surface 12 in a direction parallel to the air-intake surface 12, which The method of laterally blowing can ensure the best dust removal efficiency. However, the present invention is not limited thereto, that is, the direction of the dust removal duct 33 is not necessarily perpendicular to the heat dissipation airflow of the first direction D1, as long as the dust removal duct The second direction D2 of the extension 33 is not in the same direction as the first direction D1, and can achieve a certain dust removal effect on the air inlet surface 12.
請參考第4圖以及第5圖,其中第4圖為第1圖的散熱模組第一實施例的俯視示意圖,第5圖為第4圖沿A-A線段的截面示意圖。在第一實施例的散熱模組1中,進風面12所形成的平面由固定框90的分隔而與除塵結構30的第二側開口35所形成的平面平行且相隔一間距。請參考第6圖以及第7圖,其中第6圖為本創作的散熱模組一第二實施例的俯視示意圖,第7圖為第6圖沿C-C線段的截面示意圖。在第二實施例中的散熱模組2中,散熱器10的各個散熱鰭片14的一端則可更向外延伸,使其共同形成的進風面12所代表的平面進一步經由固定框90而自第二側開口35延伸於除塵結構30的除塵風道33內,並且位於第一側開口34以及第二側開口35之間。這樣一來,流經除塵風道33的除塵氣流可以直接接觸進風面12,更有效率地將堆積於散熱鰭片14一端的灰塵帶走。Please refer to FIG. 4 and FIG. 5 , wherein FIG. 4 is a schematic plan view of the first embodiment of the heat dissipation module of FIG. 1 , and FIG. 5 is a schematic cross-sectional view taken along line A-A of FIG. 4 . In the heat dissipation module 1 of the first embodiment, the plane formed by the air inlet surface 12 is separated from the plane formed by the second side opening 35 of the dust removing structure 30 by a partition of the fixing frame 90 and spaced apart by a distance. Please refer to FIG. 6 and FIG. 7 , wherein FIG. 6 is a schematic top view of a second embodiment of the heat dissipation module of the present invention, and FIG. 7 is a schematic cross-sectional view taken along line C-C of FIG. 6 . In the heat dissipation module 2 of the second embodiment, one end of each of the heat dissipation fins 14 of the heat sink 10 can extend further outward, so that the plane represented by the air inlet surface 12 formed together is further passed through the fixing frame 90. The second side opening 35 extends into the dust removal duct 33 of the dust removing structure 30 and is located between the first side opening 34 and the second side opening 35. In this way, the dust-removing airflow flowing through the dust-removing air passage 33 can directly contact the air-intake surface 12, and the dust accumulated on one end of the heat-dissipating fins 14 can be more efficiently carried away.
請參考第8圖、第9圖以及一併參考第3圖,其中第8圖為本創作的散熱模組一第三實施例設置於一機殼內的示意圖,第9圖為本創作的散熱模組一第四實施例設置於一機殼內的示意圖。在本創作的實施例中,除塵結構30的出風口32位置也可有不同的變化,例如在第3圖的第一實施例中,除塵結構30的出風口32與散熱器10切齊而未向外延伸,而在第8圖的第三實施例中,設置於機殼100內的散熱模組3的除塵結構30的出風口32進一步由散熱器10處向外延伸,並且可任意改變延伸的方向而位於機殼100內的一特定位置,至於在第9圖的第四實施例中,設置於機殼100內的散熱模組4的除塵結構30的出風口32也是進一步由散熱器10處向外延伸,並且繼續延伸出機殼100外,而將除塵氣流所夾帶的灰塵帶出機殼100外。Please refer to FIG. 8 and FIG. 9 and refer to FIG. 3 together. FIG. 8 is a schematic view showing a third embodiment of the heat dissipation module of the present invention disposed in a casing, and FIG. 9 is a heat dissipation of the present invention. A schematic diagram of a fourth embodiment of the module disposed in a casing. In the embodiment of the present invention, the position of the air outlet 32 of the dust removing structure 30 may also have different changes. For example, in the first embodiment of FIG. 3, the air outlet 32 of the dust removing structure 30 is aligned with the heat sink 10. Extending outwardly, in the third embodiment of FIG. 8, the air outlet 32 of the dust removing structure 30 of the heat dissipation module 3 disposed in the casing 100 is further extended outward from the heat sink 10, and can be arbitrarily changed and extended. The direction of the air is located at a specific position in the casing 100. As shown in the fourth embodiment of FIG. 9, the air outlet 32 of the dust removing structure 30 of the heat dissipation module 4 disposed in the casing 100 is further provided by the heat sink 10. The portion extends outward and continues to extend out of the casing 100, and the dust entrained by the dust removing air is carried out of the casing 100.
1,2,3,4‧‧‧散熱模組
10‧‧‧散熱器
12‧‧‧進風面
14‧‧‧散熱鰭片
16‧‧‧螺絲孔
30‧‧‧除塵結構
31‧‧‧進風口
32‧‧‧出風口
33‧‧‧除塵風道
34‧‧‧第一側開口
35‧‧‧第二側開口
36‧‧‧卡槽
37‧‧‧第二卡勾
50‧‧‧第一風扇
52‧‧‧螺絲
70‧‧‧第二風扇
72‧‧‧螺絲
90‧‧‧固定框
92‧‧‧第一卡勾
94‧‧‧螺絲
95‧‧‧安裝孔
96‧‧‧卡勾
100‧‧‧機殼
D1‧‧‧第一方向
D2‧‧‧第二方向1,2,3,4‧‧‧ Thermal Module
10‧‧‧ radiator
12‧‧‧Into the wind
14‧‧‧Heat fins
16‧‧‧ screw holes
30‧‧‧Dust removal structure
31‧‧‧Air inlet
32‧‧‧air outlet
33‧‧‧Dust air duct
34‧‧‧ first side opening
35‧‧‧Second side opening
36‧‧‧ card slot
37‧‧‧Second card
50‧‧‧First fan
52‧‧‧ screws
70‧‧‧second fan
72‧‧‧ screws
90‧‧‧Fixed frame
92‧‧‧ first card hook
94‧‧‧ screws
95‧‧‧Installation holes
96‧‧‧ hook
100‧‧‧Chassis
D1‧‧‧ first direction
D2‧‧‧ second direction
第1圖為本創作的散熱模組一第一實施例的示意圖。 第2圖、第3圖為第1圖的散熱模組第一實施例各元件不同角度的爆炸示意圖。 第4圖為第1圖的散熱模組第一實施例的俯視示意圖。 第5圖為第4圖沿A-A線段的截面示意圖。 第6圖為本創作的散熱模組一第二實施例的俯視示意圖。 第7圖為第6圖沿C-C線段的截面示意圖。 第8圖為本創作的散熱模組一第三實施例設置於一機殼內的示意圖。 第9圖為本創作的散熱模組一第四實施例設置於一機殼內的示意圖。FIG. 1 is a schematic view of a first embodiment of a heat dissipation module of the present invention. 2 and 3 are exploded views of different elements of the first embodiment of the heat dissipation module of Fig. 1 at different angles. Fig. 4 is a top plan view showing the first embodiment of the heat dissipation module of Fig. 1. Fig. 5 is a schematic cross-sectional view taken along line A-A of Fig. 4. FIG. 6 is a top plan view of a second embodiment of the heat dissipation module of the present invention. Fig. 7 is a schematic cross-sectional view taken along line C-C of Fig. 6. FIG. 8 is a schematic view showing a third embodiment of the heat dissipation module of the present invention disposed in a casing. FIG. 9 is a schematic view showing a fourth embodiment of the heat dissipation module of the present invention disposed in a casing.
1‧‧‧散熱模組 1‧‧‧ Thermal Module
10‧‧‧散熱器 10‧‧‧ radiator
12‧‧‧進風面 12‧‧‧Into the wind
14‧‧‧散熱鰭片 14‧‧‧Heat fins
16‧‧‧螺絲孔 16‧‧‧ screw holes
30‧‧‧除塵結構 30‧‧‧Dust removal structure
31‧‧‧進風口 31‧‧‧Air inlet
32‧‧‧出風口 32‧‧‧air outlet
33‧‧‧除塵風道 33‧‧‧Dust air duct
34‧‧‧第一側開口 34‧‧‧ first side opening
35‧‧‧第二側開口 35‧‧‧Second side opening
36‧‧‧卡槽 36‧‧‧ card slot
37‧‧‧第二卡勾 37‧‧‧Second card
50‧‧‧第一風扇 50‧‧‧First fan
52‧‧‧螺絲 52‧‧‧ screws
70‧‧‧第二風扇 70‧‧‧second fan
72‧‧‧螺絲 72‧‧‧ screws
90‧‧‧固定框 90‧‧‧Fixed frame
92‧‧‧第一卡勾 92‧‧‧ first card hook
94‧‧‧螺絲 94‧‧‧ screws
95‧‧‧安裝孔 95‧‧‧Installation holes
96‧‧‧卡勾 96‧‧‧ hook
D1‧‧‧第一方向 D1‧‧‧ first direction
D2‧‧‧第二方向 D2‧‧‧ second direction
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104219754U TWM520670U (en) | 2015-12-09 | 2015-12-09 | Heat dissipation module with dust removal unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104219754U TWM520670U (en) | 2015-12-09 | 2015-12-09 | Heat dissipation module with dust removal unit |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM520670U true TWM520670U (en) | 2016-04-21 |
Family
ID=56362749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104219754U TWM520670U (en) | 2015-12-09 | 2015-12-09 | Heat dissipation module with dust removal unit |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM520670U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112987889A (en) * | 2021-03-17 | 2021-06-18 | 南阳理工学院 | Self-dust-removing type radiator for computer |
-
2015
- 2015-12-09 TW TW104219754U patent/TWM520670U/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112987889A (en) * | 2021-03-17 | 2021-06-18 | 南阳理工学院 | Self-dust-removing type radiator for computer |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7414841B2 (en) | Electronic cooling system having a ventilating duct | |
US7342787B1 (en) | Integrated circuit cooling apparatus and method | |
US6940717B2 (en) | CPU cooling using a heat pipe assembly | |
US7198094B2 (en) | Finned device for removing heat from an electronic component | |
US7626819B1 (en) | Air director | |
TWI495424B (en) | Heat dissipation device and electronic device having the same | |
TW201311129A (en) | Electronic device | |
TWI651039B (en) | Heat dissipation module and electronic device | |
US7256997B2 (en) | Heat dissipating device having a fan duct | |
WO2019227393A1 (en) | Heat dissipating system and photographic device | |
TW201324098A (en) | Housing of electronic device | |
TW201528908A (en) | Computer case | |
US7661461B2 (en) | Cooling device for CPU | |
TWM520670U (en) | Heat dissipation module with dust removal unit | |
US20080123294A1 (en) | Cooling apparatus for memory modules | |
TW201538063A (en) | Electronic device and cooling fan thereof | |
TWI518490B (en) | Thermal heat dissipating structure | |
TW201639440A (en) | Cooling module | |
US20170269647A1 (en) | Heat dissipation device and electronic device using the same | |
TW201325421A (en) | Cooling system | |
TWI593345B (en) | Server | |
CN204065970U (en) | A kind of heat abstractor and computer housing | |
TWI518491B (en) | Server and heat dissipation assembly thereof | |
TWI757176B (en) | External reversible liquid cooling device | |
CN107172862A (en) | Air conditioner and driving module radiator thereof |