TWM512254U - Insulation pad structure for coaxial cable adapting head - Google Patents
Insulation pad structure for coaxial cable adapting head Download PDFInfo
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- TWM512254U TWM512254U TW104210690U TW104210690U TWM512254U TW M512254 U TWM512254 U TW M512254U TW 104210690 U TW104210690 U TW 104210690U TW 104210690 U TW104210690 U TW 104210690U TW M512254 U TWM512254 U TW M512254U
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- coaxial cable
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Description
本創作係有關一種結構簡單、成本低、組裝容易且可有效達到防水及與芯線穩定結合之用於同軸電纜轉接頭之絕緣墊片結構。The present invention relates to an insulating gasket structure for a coaxial cable adapter which is simple in structure, low in cost, easy to assemble, and can effectively achieve waterproofing and stable integration with a core wire.
同軸電纜係為一種已廣泛應用於電視與網路系統中之訊號傳輸線,供高頻訊號的載攜與傳輸,並藉由設置在末端的同軸電纜接頭而鎖固於影音或網路設備上對應之同軸電纜連接座。其中常見的F型同軸電纜接頭,其係以一套筒連接同軸電纜,該套筒的前端係設有一可迴轉的環狀螺帽,該環狀螺帽的內表面設有一母螺紋,且其外表面係設有六角形外壁,供以手指或夾持工具將同軸電纜接頭鎖合至同軸電纜連接座上。Coaxial cable is a signal transmission line widely used in TV and network systems for carrying and transmitting high-frequency signals, and is locked to audio-visual or network equipment by a coaxial cable connector disposed at the end. Coaxial cable connector. The common F-type coaxial cable joint is a sleeve connected to the coaxial cable, and the front end of the sleeve is provided with a rotatable annular nut, the inner surface of the annular nut is provided with a female thread, and The outer surface is provided with a hexagonal outer wall for locking the coaxial cable connector to the coaxial cable connector with a finger or a gripping tool.
在配置同軸電纜時,常利用轉接頭將相異的纜線彼此電連接,一般而言,上述F型同軸電纜接頭所使用之轉接頭包括設置於本體兩端之導電外公螺紋、軸向設置於本體內之導電端子、以及設置於導電端子與導電外公螺紋之間的絕緣襯套。When the coaxial cable is configured, the different cables are often electrically connected to each other by using a adapter. Generally, the adapter used in the F-type coaxial cable connector includes an electrically conductive male thread disposed at both ends of the body and an axial direction. a conductive terminal disposed in the body and an insulating bushing disposed between the conductive terminal and the conductive male male thread.
然而,該絕緣襯套作為與同軸電纜芯線之首要接觸之元件,在其預設之供該同軸電纜芯線穿置之孔洞上,並無法達到與芯線良好之密合之效果,同時該絕緣襯套之結構設計亦無法緊密貼合於該轉接頭內,使得氣密與防水效果大打折扣,因此,如何使該絕緣襯套更為有效結合於該 轉接頭內,使以維持良好的電接觸,一直為本創作人研究之方向。However, the insulating bushing serves as the primary contact element with the core of the coaxial cable, and the hole for the core of the coaxial cable is preset to be inaccessible to the core wire, and the insulating bushing is not well formed. The structural design also cannot be closely attached to the adapter, so that the airtightness and the waterproof effect are greatly reduced. Therefore, how to make the insulating bushing be more effectively combined with the In the adapter, maintaining good electrical contact has always been the direction of the creator's research.
本創作之主要目的在提供一種結構簡單、成本低、組裝容易且可有效達到防水及與芯線穩定結合之用於同軸電纜轉接頭之絕緣墊片結構。The main purpose of the present invention is to provide an insulating gasket structure for a coaxial cable adapter which is simple in structure, low in cost, easy to assemble, and can effectively achieve waterproofing and stable integration with a core wire.
為達上述之目的,本創作所設之一種用於同軸電纜轉接頭之絕緣墊片結構,包括一圓形且具有彈性之本體,供結合於同軸電纜轉接頭之一端面上,其中該本體兩側係分別形成有一第一接合面與一第二接合面,該第一接合面之周圍係形成一階級部,而該第二接合面向內則設有一凹陷部,且該本體中央位置處於第一接合面與第二接合面之間係設有一通道,該通道朝向第一接合面之一端係形成為一開放之孔洞,而該通道朝向第二接合面之一端係則為封閉狀態,藉以使當另一同軸電纜轉接頭之芯線穿過該孔洞後,可破壞該通道朝於該第二接合面封閉狀態之一端,而穩固穿置於該本體上。For the above purposes, an insulating gasket structure for a coaxial cable adapter is provided in the present invention, comprising a circular and elastic body for coupling to one end surface of the coaxial cable adapter, wherein A first joint surface and a second joint surface are respectively formed on the two sides of the body, the first joint surface is formed with a step portion, and the second joint surface is provided with a recess portion, and the center of the body is at a position A passage is formed between the first joint surface and the second joint surface, the passage is formed as an open hole toward one end of the first joint surface, and the passage is closed to one end of the second joint surface, thereby being closed. After the core wire of the other coaxial cable adapter is passed through the hole, the passage can be broken toward one end of the closed state of the second joint surface and firmly placed on the body.
實施時,該通道朝向第一接合面之一端係向內形成一凹陷之弧面,而該孔洞係形成於該弧面之中央位置。In practice, the channel forms a concave arcuate surface inwardly toward one end of the first joint surface, and the hole is formed at a central position of the arcuate surface.
實施時,該本體之直徑係大於或等於該同軸電纜轉接頭端面之直徑。In practice, the diameter of the body is greater than or equal to the diameter of the end face of the coaxial cable adapter.
為進一步了解本創作,以下舉較佳之實施例,配合圖式、圖號,將本創作之具體構成內容及其所達成的功效詳細說明如下。In order to further understand the present invention, the preferred embodiments of the present invention, together with the drawings and figure numbers, detail the specific components of the present creation and the effects achieved thereby.
1‧‧‧本體1‧‧‧ Ontology
11‧‧‧第一接合面11‧‧‧First joint
111‧‧‧階級部111‧‧‧Class Department
12‧‧‧第二接合面12‧‧‧Second joint
121‧‧‧凹陷部121‧‧‧Depression
13‧‧‧通道13‧‧‧ channel
131‧‧‧孔洞131‧‧‧ holes
2‧‧‧同軸電纜轉接頭2‧‧‧Coaxial cable adapter
21‧‧‧端面21‧‧‧ end face
3‧‧‧同軸電纜轉接頭3‧‧‧Coaxial cable adapter
31‧‧‧芯線31‧‧‧core
4‧‧‧轉接座4‧‧‧Adapter
第1圖係為本創作實施例本體之外觀示意圖。FIG. 1 is a schematic view showing the appearance of the main body of the present embodiment.
第2圖係為本創作實施例本體結合於同軸電纜轉接頭後之剖面示意圖。FIG. 2 is a schematic cross-sectional view showing the main body of the present invention after being coupled to a coaxial cable adapter.
第3圖係為本創作實施例中兩同軸電纜轉接頭結合前之外觀示意圖。Figure 3 is a schematic view showing the appearance of the two coaxial cable adapters before the combination of the present embodiment.
第4圖係為本創作實施例應用於另一形式同軸電纜轉接頭之剖面示意圖。Figure 4 is a cross-sectional view showing another embodiment of the present invention applied to another form of coaxial cable adapter.
第5圖係為第4圖中a部分之放大圖。Fig. 5 is an enlarged view of a portion in Fig. 4.
第6圖係為本創作應用於轉接座之示意圖。Figure 6 is a schematic diagram of the application of the creation to the adapter.
請參閱第1-5圖,其為本創作一種用於同軸電纜轉接頭之絕緣墊片結構。Please refer to Figure 1-5, which is an insulating spacer structure for a coaxial cable adapter.
該用於同軸電纜轉接頭之絕緣墊片結構,包括一圓形且具有彈性之本體1,供結合於同軸電纜轉接頭2之一端面21上,且該本體1之直徑係大於或等於該同軸電纜轉接頭2端面21之直徑。其中,該本體1兩側係分別形成有一第一接合面11與一第二接合面12,該第一接合面11之周圍係形成一階級部111,而該第二接合面12向內則設有一凹陷部121,且該本體1中央位置處於第一接合面11與第二接合面12之間係設有一通道13,該通道13朝向第一接合面11之一端係形成為一開放之孔洞131,該通道13朝向第一接合面11之一端係向內形成一凹陷之弧面,而該孔洞131係形成於該弧面之中央位置,而該通道13朝向第二接合面12之一端係則為封閉狀態,藉以使當另一同軸電纜轉接頭3之芯線31穿過該孔洞131後,可破壞該通道13朝於該第二接合面12封閉狀態之一端,而穩固穿置於該本體1上。The insulating gasket structure for a coaxial cable adapter includes a circular and elastic body 1 for coupling to one end surface 21 of the coaxial cable adapter 2, and the diameter of the body 1 is greater than or equal to The diameter of the end face 21 of the coaxial cable adapter 2. The first joint surface 11 and the second joint surface 12 are respectively formed on the two sides of the main body 1. The first joint surface 11 is formed with a step portion 111, and the second joint surface 12 is formed inward. There is a recessed portion 121, and a central portion 13 is disposed between the first joint surface 11 and the second joint surface 12, and the passage 13 is formed as an open hole 131 toward one end of the first joint surface 11. The passage 13 is formed inwardly toward one end of the first joint surface 11 to form a concave arc surface, and the hole 131 is formed at a central position of the curved surface, and the passage 13 is oriented toward one end of the second joint surface 12 In a closed state, after the core wire 31 of the other coaxial cable adapter 3 passes through the hole 131, one end of the closed state of the channel 13 toward the second joint surface 12 can be broken, and the body is stably placed on the body. 1 on.
組裝時,首先令本體1之第二接合面12朝向同軸電纜轉接頭2 內部,而第一接合面11朝向外部,使第一接合面11上之開放之孔洞131可接合之後插入之另一同軸電纜轉接頭3之芯線31。由於該本體1之直徑係大於或等於該同軸電纜轉接頭2端面21之直徑,因此置入於該同軸電纜轉接頭2之端面21內時,該本體1係呈局部彎曲狀(如第2、4、5圖所示),使該本體1第一接合面11之階級部111係可與該同軸電纜轉接頭2端面21內壁緊密貼合,而本體1第二接合面12之凹陷部121則可緊密抵靠在同軸電纜轉接頭2內部之塑膠導引部22上(如第2或4圖所示),因此,當如第3圖與另一同軸電纜轉接頭3結合時,該芯線31通過該本體1第一接合面11之孔洞131與通道13而前進後,可穿破該第二接合面12之封閉面,使該第二接合面12可與該芯線31形成緊密且貼合之穿置狀態。When assembling, firstly, the second joint surface 12 of the body 1 faces the coaxial cable adapter 2 Internally, the first joint surface 11 faces outward, so that the open hole 131 on the first joint surface 11 can engage the core wire 31 of another coaxial cable adapter 3 that is inserted later. Since the diameter of the body 1 is greater than or equal to the diameter of the end surface 21 of the coaxial cable adapter 2, the body 1 is partially curved when placed in the end surface 21 of the coaxial cable adapter 2 (eg, 2, 4, 5), the step portion 111 of the first joint surface 11 of the body 1 can be closely adhered to the inner wall of the end surface 21 of the coaxial cable adapter 2, and the second joint surface 12 of the body 1 The recessed portion 121 can be closely abutted against the plastic guiding portion 22 inside the coaxial cable adapter 2 (as shown in FIG. 2 or FIG. 4), and thus, as in FIG. 3 and another coaxial cable adapter 3 When the core wire 31 is advanced through the hole 131 and the channel 13 of the first joint surface 11 of the body 1 , the closed surface of the second joint surface 12 can be pierced so that the second joint surface 12 can be connected to the core wire 31 . Forms a tight and conformable wear state.
藉此,本創作絕緣墊片結構之設計結構,透過該本體兩側所 設之凹陷部與階級部,使提高與同軸電纜轉接頭內部緊密結合,且第二接合面封閉之設計在實施時,芯線穿過後可有效增加密合之效果。Thereby, the design structure of the insulating gasket structure of the present invention is transmitted through both sides of the body The recessed portion and the stepped portion are provided to improve the tight connection with the inside of the coaxial cable adapter, and the design of the second joint surface is closed, and the core wire is passed through to effectively increase the adhesion effect.
此外,如第6圖所示,本創作絕緣墊片結構之設計結構亦可應用在具有多個同軸電纜轉接頭之轉接座4上,同樣可達到前述之效果。In addition, as shown in FIG. 6, the design structure of the inventive insulating spacer structure can also be applied to the adapter 4 having a plurality of coaxial cable adapters, which can also achieve the aforementioned effects.
以上所述乃是本創作之具體實施例及所運用之技術手段,根據本文的揭露或教導可衍生推導出許多的變更與修正,仍可視為本創作之構想所作之等效改變,其所產生之作用仍未超出說明書及圖式所涵蓋之實質精神,均應視為在本創作之技術範疇之內,合先陳明。The foregoing is a specific embodiment of the present invention and the technical means employed, and many variations and modifications can be derived therefrom based on the disclosure or teachings herein, and can still be regarded as equivalent changes made by the inventive concept. The role of the spirit and the spirit of the text and the scope of the text should be considered within the technical scope of this creation.
綜上所述,依上文所揭示之內容,本創作確可達到新型之預期目的,提供一種用於同軸電纜轉接頭之絕緣墊片結構,極具產業上利用之價值,爰依法提出新型專利申請。In summary, according to the content disclosed above, this creation can achieve the new intended purpose, providing an insulating gasket structure for coaxial cable adapters, which is of great industrial value, and proposes a new type according to law. patent application.
1‧‧‧本體1‧‧‧ Ontology
11‧‧‧第一接合面11‧‧‧First joint
111‧‧‧階級部111‧‧‧Class Department
12‧‧‧第二接合面12‧‧‧Second joint
121‧‧‧凹陷部121‧‧‧Depression
13‧‧‧通道13‧‧‧ channel
131‧‧‧孔洞131‧‧‧ holes
Claims (3)
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TW104210690U TWM512254U (en) | 2015-07-02 | 2015-07-02 | Insulation pad structure for coaxial cable adapting head |
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TW104210690U TWM512254U (en) | 2015-07-02 | 2015-07-02 | Insulation pad structure for coaxial cable adapting head |
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-
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- 2015-07-02 TW TW104210690U patent/TWM512254U/en unknown
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US11101370B2 (en) | 2016-05-02 | 2021-08-24 | Asm Ip Holding B.V. | Method of forming a germanium oxynitride film |
US11649546B2 (en) | 2016-07-08 | 2023-05-16 | Asm Ip Holding B.V. | Organic reactants for atomic layer deposition |
US11094582B2 (en) | 2016-07-08 | 2021-08-17 | Asm Ip Holding B.V. | Selective deposition method to form air gaps |
US11749562B2 (en) | 2016-07-08 | 2023-09-05 | Asm Ip Holding B.V. | Selective deposition method to form air gaps |
US11694892B2 (en) | 2016-07-28 | 2023-07-04 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US11610775B2 (en) | 2016-07-28 | 2023-03-21 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US11205585B2 (en) | 2016-07-28 | 2021-12-21 | Asm Ip Holding B.V. | Substrate processing apparatus and method of operating the same |
US11532757B2 (en) | 2016-10-27 | 2022-12-20 | Asm Ip Holding B.V. | Deposition of charge trapping layers |
US11810788B2 (en) | 2016-11-01 | 2023-11-07 | Asm Ip Holding B.V. | Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US11396702B2 (en) | 2016-11-15 | 2022-07-26 | Asm Ip Holding B.V. | Gas supply unit and substrate processing apparatus including the gas supply unit |
US11222772B2 (en) | 2016-12-14 | 2022-01-11 | Asm Ip Holding B.V. | Substrate processing apparatus |
US12000042B2 (en) | 2016-12-15 | 2024-06-04 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
US11851755B2 (en) | 2016-12-15 | 2023-12-26 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
US11447861B2 (en) | 2016-12-15 | 2022-09-20 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
US11581186B2 (en) | 2016-12-15 | 2023-02-14 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus |
US11970766B2 (en) | 2016-12-15 | 2024-04-30 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus |
US11251035B2 (en) | 2016-12-22 | 2022-02-15 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US12043899B2 (en) | 2017-01-10 | 2024-07-23 | Asm Ip Holding B.V. | Reactor system and method to reduce residue buildup during a film deposition process |
US11390950B2 (en) | 2017-01-10 | 2022-07-19 | Asm Ip Holding B.V. | Reactor system and method to reduce residue buildup during a film deposition process |
US11410851B2 (en) | 2017-02-15 | 2022-08-09 | Asm Ip Holding B.V. | Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures |
US11848200B2 (en) | 2017-05-08 | 2023-12-19 | Asm Ip Holding B.V. | Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures |
US12040200B2 (en) | 2017-06-20 | 2024-07-16 | Asm Ip Holding B.V. | Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus |
US11306395B2 (en) | 2017-06-28 | 2022-04-19 | Asm Ip Holding B.V. | Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus |
US11976361B2 (en) | 2017-06-28 | 2024-05-07 | Asm Ip Holding B.V. | Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus |
US11164955B2 (en) | 2017-07-18 | 2021-11-02 | Asm Ip Holding B.V. | Methods for forming a semiconductor device structure and related semiconductor device structures |
US11695054B2 (en) | 2017-07-18 | 2023-07-04 | Asm Ip Holding B.V. | Methods for forming a semiconductor device structure and related semiconductor device structures |
US11802338B2 (en) | 2017-07-26 | 2023-10-31 | Asm Ip Holding B.V. | Chemical treatment, deposition and/or infiltration apparatus and method for using the same |
US11417545B2 (en) | 2017-08-08 | 2022-08-16 | Asm Ip Holding B.V. | Radiation shield |
US11587821B2 (en) | 2017-08-08 | 2023-02-21 | Asm Ip Holding B.V. | Substrate lift mechanism and reactor including same |
US11769682B2 (en) | 2017-08-09 | 2023-09-26 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US11830730B2 (en) | 2017-08-29 | 2023-11-28 | Asm Ip Holding B.V. | Layer forming method and apparatus |
US11056344B2 (en) | 2017-08-30 | 2021-07-06 | Asm Ip Holding B.V. | Layer forming method |
US11069510B2 (en) | 2017-08-30 | 2021-07-20 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11581220B2 (en) | 2017-08-30 | 2023-02-14 | Asm Ip Holding B.V. | Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures |
US11295980B2 (en) | 2017-08-30 | 2022-04-05 | Asm Ip Holding B.V. | Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures |
US11387120B2 (en) | 2017-09-28 | 2022-07-12 | Asm Ip Holding B.V. | Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber |
US12033861B2 (en) | 2017-10-05 | 2024-07-09 | Asm Ip Holding B.V. | Method for selectively depositing a metallic film on a substrate |
US11094546B2 (en) | 2017-10-05 | 2021-08-17 | Asm Ip Holding B.V. | Method for selectively depositing a metallic film on a substrate |
US12040184B2 (en) | 2017-10-30 | 2024-07-16 | Asm Ip Holding B.V. | Methods for forming a semiconductor structure and related semiconductor structures |
US11127617B2 (en) | 2017-11-27 | 2021-09-21 | Asm Ip Holding B.V. | Storage device for storing wafer cassettes for use with a batch furnace |
US11682572B2 (en) | 2017-11-27 | 2023-06-20 | Asm Ip Holdings B.V. | Storage device for storing wafer cassettes for use with a batch furnace |
US11639811B2 (en) | 2017-11-27 | 2023-05-02 | Asm Ip Holding B.V. | Apparatus including a clean mini environment |
US11501973B2 (en) | 2018-01-16 | 2022-11-15 | Asm Ip Holding B.V. | Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures |
US11393690B2 (en) | 2018-01-19 | 2022-07-19 | Asm Ip Holding B.V. | Deposition method |
US11482412B2 (en) | 2018-01-19 | 2022-10-25 | Asm Ip Holding B.V. | Method for depositing a gap-fill layer by plasma-assisted deposition |
US11972944B2 (en) | 2018-01-19 | 2024-04-30 | Asm Ip Holding B.V. | Method for depositing a gap-fill layer by plasma-assisted deposition |
US11735414B2 (en) | 2018-02-06 | 2023-08-22 | Asm Ip Holding B.V. | Method of post-deposition treatment for silicon oxide film |
US11387106B2 (en) | 2018-02-14 | 2022-07-12 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
US11685991B2 (en) | 2018-02-14 | 2023-06-27 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
US11482418B2 (en) | 2018-02-20 | 2022-10-25 | Asm Ip Holding B.V. | Substrate processing method and apparatus |
US11939673B2 (en) | 2018-02-23 | 2024-03-26 | Asm Ip Holding B.V. | Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment |
US11473195B2 (en) | 2018-03-01 | 2022-10-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus and a method for processing a substrate |
US11629406B2 (en) | 2018-03-09 | 2023-04-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate |
US11114283B2 (en) | 2018-03-16 | 2021-09-07 | Asm Ip Holding B.V. | Reactor, system including the reactor, and methods of manufacturing and using same |
US11398382B2 (en) | 2018-03-27 | 2022-07-26 | Asm Ip Holding B.V. | Method of forming an electrode on a substrate and a semiconductor device structure including an electrode |
US12020938B2 (en) | 2018-03-27 | 2024-06-25 | Asm Ip Holding B.V. | Method of forming an electrode on a substrate and a semiconductor device structure including an electrode |
US11230766B2 (en) | 2018-03-29 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US12025484B2 (en) | 2018-05-08 | 2024-07-02 | Asm Ip Holding B.V. | Thin film forming method |
US11469098B2 (en) | 2018-05-08 | 2022-10-11 | Asm Ip Holding B.V. | Methods for depositing an oxide film on a substrate by a cyclical deposition process and related device structures |
US11361990B2 (en) | 2018-05-28 | 2022-06-14 | Asm Ip Holding B.V. | Substrate processing method and device manufactured by using the same |
US11908733B2 (en) | 2018-05-28 | 2024-02-20 | Asm Ip Holding B.V. | Substrate processing method and device manufactured by using the same |
US11270899B2 (en) | 2018-06-04 | 2022-03-08 | Asm Ip Holding B.V. | Wafer handling chamber with moisture reduction |
US11837483B2 (en) | 2018-06-04 | 2023-12-05 | Asm Ip Holding B.V. | Wafer handling chamber with moisture reduction |
US11718913B2 (en) | 2018-06-04 | 2023-08-08 | Asm Ip Holding B.V. | Gas distribution system and reactor system including same |
US11286562B2 (en) | 2018-06-08 | 2022-03-29 | Asm Ip Holding B.V. | Gas-phase chemical reactor and method of using same |
US11296189B2 (en) | 2018-06-21 | 2022-04-05 | Asm Ip Holding B.V. | Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures |
US11530483B2 (en) | 2018-06-21 | 2022-12-20 | Asm Ip Holding B.V. | Substrate processing system |
US11952658B2 (en) | 2018-06-27 | 2024-04-09 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
US11814715B2 (en) | 2018-06-27 | 2023-11-14 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
US11492703B2 (en) | 2018-06-27 | 2022-11-08 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
US11499222B2 (en) | 2018-06-27 | 2022-11-15 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
US11168395B2 (en) | 2018-06-29 | 2021-11-09 | Asm Ip Holding B.V. | Temperature-controlled flange and reactor system including same |
US11923190B2 (en) | 2018-07-03 | 2024-03-05 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US11646197B2 (en) | 2018-07-03 | 2023-05-09 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US11430674B2 (en) | 2018-08-22 | 2022-08-30 | Asm Ip Holding B.V. | Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
US11804388B2 (en) | 2018-09-11 | 2023-10-31 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US11274369B2 (en) | 2018-09-11 | 2022-03-15 | Asm Ip Holding B.V. | Thin film deposition method |
US11885023B2 (en) | 2018-10-01 | 2024-01-30 | Asm Ip Holding B.V. | Substrate retaining apparatus, system including the apparatus, and method of using same |
US11232963B2 (en) | 2018-10-03 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US11414760B2 (en) | 2018-10-08 | 2022-08-16 | Asm Ip Holding B.V. | Substrate support unit, thin film deposition apparatus including the same, and substrate processing apparatus including the same |
US11251068B2 (en) | 2018-10-19 | 2022-02-15 | Asm Ip Holding B.V. | Substrate processing apparatus and substrate processing method |
US11664199B2 (en) | 2018-10-19 | 2023-05-30 | Asm Ip Holding B.V. | Substrate processing apparatus and substrate processing method |
US11087997B2 (en) | 2018-10-31 | 2021-08-10 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
US11735445B2 (en) | 2018-10-31 | 2023-08-22 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
US11499226B2 (en) | 2018-11-02 | 2022-11-15 | Asm Ip Holding B.V. | Substrate supporting unit and a substrate processing device including the same |
US11866823B2 (en) | 2018-11-02 | 2024-01-09 | Asm Ip Holding B.V. | Substrate supporting unit and a substrate processing device including the same |
US11572620B2 (en) | 2018-11-06 | 2023-02-07 | Asm Ip Holding B.V. | Methods for selectively depositing an amorphous silicon film on a substrate |
US11798999B2 (en) | 2018-11-16 | 2023-10-24 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
US11411088B2 (en) | 2018-11-16 | 2022-08-09 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
US11244825B2 (en) | 2018-11-16 | 2022-02-08 | Asm Ip Holding B.V. | Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process |
US12040199B2 (en) | 2018-11-28 | 2024-07-16 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
US11217444B2 (en) | 2018-11-30 | 2022-01-04 | Asm Ip Holding B.V. | Method for forming an ultraviolet radiation responsive metal oxide-containing film |
US11488819B2 (en) | 2018-12-04 | 2022-11-01 | Asm Ip Holding B.V. | Method of cleaning substrate processing apparatus |
US11158513B2 (en) | 2018-12-13 | 2021-10-26 | Asm Ip Holding B.V. | Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures |
US11769670B2 (en) | 2018-12-13 | 2023-09-26 | Asm Ip Holding B.V. | Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures |
US11658029B2 (en) | 2018-12-14 | 2023-05-23 | Asm Ip Holding B.V. | Method of forming a device structure using selective deposition of gallium nitride and system for same |
US11390946B2 (en) | 2019-01-17 | 2022-07-19 | Asm Ip Holding B.V. | Methods of forming a transition metal containing film on a substrate by a cyclical deposition process |
US11959171B2 (en) | 2019-01-17 | 2024-04-16 | Asm Ip Holding B.V. | Methods of forming a transition metal containing film on a substrate by a cyclical deposition process |
US11171025B2 (en) | 2019-01-22 | 2021-11-09 | Asm Ip Holding B.V. | Substrate processing device |
US11127589B2 (en) | 2019-02-01 | 2021-09-21 | Asm Ip Holding B.V. | Method of topology-selective film formation of silicon oxide |
US11342216B2 (en) | 2019-02-20 | 2022-05-24 | Asm Ip Holding B.V. | Cyclical deposition method and apparatus for filling a recess formed within a substrate surface |
US11227789B2 (en) | 2019-02-20 | 2022-01-18 | Asm Ip Holding B.V. | Method and apparatus for filling a recess formed within a substrate surface |
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US11251040B2 (en) | 2019-02-20 | 2022-02-15 | Asm Ip Holding B.V. | Cyclical deposition method including treatment step and apparatus for same |
US11798834B2 (en) | 2019-02-20 | 2023-10-24 | Asm Ip Holding B.V. | Cyclical deposition method and apparatus for filling a recess formed within a substrate surface |
US11615980B2 (en) | 2019-02-20 | 2023-03-28 | Asm Ip Holding B.V. | Method and apparatus for filling a recess formed within a substrate surface |
US11629407B2 (en) | 2019-02-22 | 2023-04-18 | Asm Ip Holding B.V. | Substrate processing apparatus and method for processing substrates |
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US11114294B2 (en) | 2019-03-08 | 2021-09-07 | Asm Ip Holding B.V. | Structure including SiOC layer and method of forming same |
US11742198B2 (en) | 2019-03-08 | 2023-08-29 | Asm Ip Holding B.V. | Structure including SiOCN layer and method of forming same |
US11901175B2 (en) | 2019-03-08 | 2024-02-13 | Asm Ip Holding B.V. | Method for selective deposition of silicon nitride layer and structure including selectively-deposited silicon nitride layer |
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US11551925B2 (en) | 2019-04-01 | 2023-01-10 | Asm Ip Holding B.V. | Method for manufacturing a semiconductor device |
US11447864B2 (en) | 2019-04-19 | 2022-09-20 | Asm Ip Holding B.V. | Layer forming method and apparatus |
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US11781221B2 (en) | 2019-05-07 | 2023-10-10 | Asm Ip Holding B.V. | Chemical source vessel with dip tube |
US11289326B2 (en) | 2019-05-07 | 2022-03-29 | Asm Ip Holding B.V. | Method for reforming amorphous carbon polymer film |
US11355338B2 (en) | 2019-05-10 | 2022-06-07 | Asm Ip Holding B.V. | Method of depositing material onto a surface and structure formed according to the method |
US11996309B2 (en) | 2019-05-16 | 2024-05-28 | Asm Ip Holding B.V. | Wafer boat handling device, vertical batch furnace and method |
US11515188B2 (en) | 2019-05-16 | 2022-11-29 | Asm Ip Holding B.V. | Wafer boat handling device, vertical batch furnace and method |
USD947913S1 (en) | 2019-05-17 | 2022-04-05 | Asm Ip Holding B.V. | Susceptor shaft |
USD975665S1 (en) | 2019-05-17 | 2023-01-17 | Asm Ip Holding B.V. | Susceptor shaft |
USD935572S1 (en) | 2019-05-24 | 2021-11-09 | Asm Ip Holding B.V. | Gas channel plate |
US11345999B2 (en) | 2019-06-06 | 2022-05-31 | Asm Ip Holding B.V. | Method of using a gas-phase reactor system including analyzing exhausted gas |
US11453946B2 (en) | 2019-06-06 | 2022-09-27 | Asm Ip Holding B.V. | Gas-phase reactor system including a gas detector |
US11476109B2 (en) | 2019-06-11 | 2022-10-18 | Asm Ip Holding B.V. | Method of forming an electronic structure using reforming gas, system for performing the method, and structure formed using the method |
US11908684B2 (en) | 2019-06-11 | 2024-02-20 | Asm Ip Holding B.V. | Method of forming an electronic structure using reforming gas, system for performing the method, and structure formed using the method |
USD944946S1 (en) | 2019-06-14 | 2022-03-01 | Asm Ip Holding B.V. | Shower plate |
USD931978S1 (en) | 2019-06-27 | 2021-09-28 | Asm Ip Holding B.V. | Showerhead vacuum transport |
US11390945B2 (en) | 2019-07-03 | 2022-07-19 | Asm Ip Holding B.V. | Temperature control assembly for substrate processing apparatus and method of using same |
US11746414B2 (en) | 2019-07-03 | 2023-09-05 | Asm Ip Holding B.V. | Temperature control assembly for substrate processing apparatus and method of using same |
US11605528B2 (en) | 2019-07-09 | 2023-03-14 | Asm Ip Holding B.V. | Plasma device using coaxial waveguide, and substrate treatment method |
US11664267B2 (en) | 2019-07-10 | 2023-05-30 | Asm Ip Holding B.V. | Substrate support assembly and substrate processing device including the same |
US11664245B2 (en) | 2019-07-16 | 2023-05-30 | Asm Ip Holding B.V. | Substrate processing device |
US11996304B2 (en) | 2019-07-16 | 2024-05-28 | Asm Ip Holding B.V. | Substrate processing device |
US11615970B2 (en) | 2019-07-17 | 2023-03-28 | Asm Ip Holding B.V. | Radical assist ignition plasma system and method |
US11688603B2 (en) | 2019-07-17 | 2023-06-27 | Asm Ip Holding B.V. | Methods of forming silicon germanium structures |
US11643724B2 (en) | 2019-07-18 | 2023-05-09 | Asm Ip Holding B.V. | Method of forming structures using a neutral beam |
US11282698B2 (en) | 2019-07-19 | 2022-03-22 | Asm Ip Holding B.V. | Method of forming topology-controlled amorphous carbon polymer film |
US11557474B2 (en) | 2019-07-29 | 2023-01-17 | Asm Ip Holding B.V. | Methods for selective deposition utilizing n-type dopants and/or alternative dopants to achieve high dopant incorporation |
US11430640B2 (en) | 2019-07-30 | 2022-08-30 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11443926B2 (en) | 2019-07-30 | 2022-09-13 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11587815B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11227782B2 (en) | 2019-07-31 | 2022-01-18 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11587814B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11876008B2 (en) | 2019-07-31 | 2024-01-16 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11680839B2 (en) | 2019-08-05 | 2023-06-20 | Asm Ip Holding B.V. | Liquid level sensor for a chemical source vessel |
USD965044S1 (en) | 2019-08-19 | 2022-09-27 | Asm Ip Holding B.V. | Susceptor shaft |
USD965524S1 (en) | 2019-08-19 | 2022-10-04 | Asm Ip Holding B.V. | Susceptor support |
US11639548B2 (en) | 2019-08-21 | 2023-05-02 | Asm Ip Holding B.V. | Film-forming material mixed-gas forming device and film forming device |
US11594450B2 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Method for forming a structure with a hole |
TWD211226S (en) | 2019-08-22 | 2021-05-01 | 荷蘭商Asm Ip私人控股有限公司 | Insulator for semiconductor processing apparatus |
USD949319S1 (en) | 2019-08-22 | 2022-04-19 | Asm Ip Holding B.V. | Exhaust duct |
US12040229B2 (en) | 2019-08-22 | 2024-07-16 | Asm Ip Holding B.V. | Method for forming a structure with a hole |
USD979506S1 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Insulator |
USD930782S1 (en) | 2019-08-22 | 2021-09-14 | Asm Ip Holding B.V. | Gas distributor |
USD940837S1 (en) | 2019-08-22 | 2022-01-11 | Asm Ip Holding B.V. | Electrode |
US12033849B2 (en) | 2019-08-23 | 2024-07-09 | Asm Ip Holding B.V. | Method for depositing silicon oxide film having improved quality by PEALD using bis(diethylamino)silane |
US11827978B2 (en) | 2019-08-23 | 2023-11-28 | Asm Ip Holding B.V. | Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film |
US11286558B2 (en) | 2019-08-23 | 2022-03-29 | Asm Ip Holding B.V. | Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film |
US11527400B2 (en) | 2019-08-23 | 2022-12-13 | Asm Ip Holding B.V. | Method for depositing silicon oxide film having improved quality by peald using bis(diethylamino)silane |
US11898242B2 (en) | 2019-08-23 | 2024-02-13 | Asm Ip Holding B.V. | Methods for forming a polycrystalline molybdenum film over a surface of a substrate and related structures including a polycrystalline molybdenum film |
US11495459B2 (en) | 2019-09-04 | 2022-11-08 | Asm Ip Holding B.V. | Methods for selective deposition using a sacrificial capping layer |
US11823876B2 (en) | 2019-09-05 | 2023-11-21 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11562901B2 (en) | 2019-09-25 | 2023-01-24 | Asm Ip Holding B.V. | Substrate processing method |
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