TWM511730U - Apparatus for continuous manufacturing - Google Patents

Abstract

An apparatus for continuous manufacturing includes a development equipment, a rinse equipment, a deoxidized equipment, a pre-plating treatment equipment, a baking equipment, and a plating equipment. The rinse equipment is continuously connected to the development equipment. The deoxidized equipment is continuously connected to the rinse equipment. The pre-plating treatment equipment is continuously connected to the deoxidized equipment, in which the pre-plating treatment equipment is configured to provide a circuit board to be manufactured with an adhesion promoter. The baking equipment is continuously connected to the pre-plating treatment equipment. The plating equipment is continuously connected to the baking equipment.

Description

Continuous production equipment

The present invention relates to a continuous production apparatus, and more particularly to a continuous production apparatus for manufacturing a circuit board.

With the advancement of technology, more and more consumer electronic products have been developed, and no matter what kind of electronic products, they often have a circuit board as a bridge for connecting various components. As a result, circuit boards that are widely used in related industries are also closely related to the cost of the electronic products produced. In the current production process of the circuit board, the process includes multiple processes, for example, it includes steps of exposure, development, plating, and etching.

However, between different processes, boards that have not yet been manufactured are often manually transferred to the equipment used in the next process. During the transportation process, if there are unexpected factors, such as oxidation or contamination of the board that has not been manufactured, or damage caused by the impact, such external factors will cause the circuit board to be scrapped, thereby making Costs have also increased. In other words, in the manufacturing process of the board, the details of the board between the various processes are also an important consideration in manufacturing cost.

In view of this, one aspect of the present invention provides a continuous manufacturing apparatus which is composed of successively connected (or connected) devices, so that the circuit board to be fabricated can be developed from it without manual transmission. The process is transferred to the electroplating process. Therefore, the continuous manufacturing equipment can reduce the unexpected external factors that occur in the transmission of the circuit board between the various processes, in addition to effectively reducing the cost of the manufactured circuit board, the yield can also be improved. With manufacturing quality.

One aspect of the present invention provides a continuous manufacturing apparatus comprising a developing device, a cleaning device, a deoxidizing device, a pre-plating processing device, a drying device, a plating device, and a moving unit. The cleaning device is connected and connected to the developing device. The deoxidation device is connected and connected to the cleaning device. The electroplating pretreatment device is connected and connected to the deoxidation device, wherein the electroplating pretreatment device is arranged to provide an adhesion promoter to the circuit board to be fabricated. The drying device is connected and connected to the pre-plating treatment device. The plating device is connected and connected to the drying device. The mobile unit is arranged to sequentially pass the self-developing device to be manufactured by the cleaning device, the deoxidizing device, the pre-plating processing device, the drying device and the plating device.

In some embodiments, the mobile unit is comprised of a scroll wheel. The roller self-developing device is extended to the plating device.

In some embodiments, the developing device, the cleaning device, the deoxidizing device, the pre-plating processing device, the drying device, and the plating device are connected in the same configuration direction, and the transmission direction of the circuit board to be mounted on the roller is parallel to the configuration direction.

In some embodiments, the mobile unit includes a gripper. The holder is arranged to suspend the circuit board to be mounted on the developing device, the cleaning device, and the deoxidizing device One of the pretreatment, electroplating pretreatment devices, drying devices, and electroplating devices. The holder is movable between the developing device and the plating device in the vertical direction.

In some embodiments, the pre-plating treatment apparatus has an immersion tank, and the adhesion promoter is filled in the immersion tank.

In some embodiments, the continuous manufacturing apparatus further includes a roller. The roller is arranged to sequentially pass the self-developing device of the circuit board to be cleaned, the deoxidizing device, the pre-plating pre-processing device, the drying device and the electroplating device, wherein some of the rollers located in the pre-plating processing device are located at the liquid level of the dipping pool. under.

In some embodiments, the continuous manufacturing apparatus further includes a nozzle. The nozzle is disposed in the pre-plating treatment device, and the pre-plating treatment device provides an adhesion promoter through the nozzle.

In some embodiments, the continuous manufacturing apparatus further includes a print head. The print head is disposed in the pre-plating processing apparatus, and the pre-plating processing apparatus provides an adhesion promoter through the print head.

In some embodiments, the continuous production apparatus further includes an inlet and an outlet. The inlet is disposed in the developing device for providing the circuit board to be fabricated into the continuous manufacturing apparatus. The outlet is disposed in the electroplating apparatus, wherein the circuit board to be fabricated placed in the continuous manufacturing apparatus through the inlet exits the continuous manufacturing apparatus through the outlet.

In some embodiments, the continuous production device further includes an exception handling unit and an exception handling mobile unit. The abnormal processing mobile unit is configured to transport an abnormal circuit board to be abnormal in one of the developing device, the cleaning device, the deoxidizing device, the pre-plating processing device, the drying device, and the plating device to an abnormality Processing unit.

100‧‧‧Continuous production equipment

101‧‧‧ Pressing device

102‧‧‧Exposure device

103‧‧‧Developing device

104‧‧‧cleaning device

106‧‧‧Deoxidation unit

108‧‧‧Electroplating pretreatment device

110‧‧‧Drying device

112‧‧‧Electroplating unit

114‧‧‧Exception handling unit

120‧‧‧Mobile unit

122, 122’‧‧‧Rollers

124‧‧‧Clamps

126‧‧‧Adhesion promoter

128‧‧‧dip pool

130‧‧‧Nozzles

132‧‧‧Print head

134‧‧‧ entrance

136‧‧‧Export

140, 140’‧‧‧Son-made circuit boards

D‧‧‧Transport direction

FIG. 1A is a schematic view showing the configuration of an embodiment of a press-making device, an exposure device, and a continuous production apparatus of the present invention.

FIG. 1B is a schematic view showing the continuous production apparatus of FIG. 1A.

2A and 2B are schematic views showing different embodiments of the mobile unit in the continuous production apparatus of FIG. 1A.

3A to 3C are schematic views showing different embodiments of the pre-plating processing apparatus of FIG. 2 to provide an adhesion promoter to a circuit board to be fabricated.

4A to 4C are schematic views showing different embodiments of the pre-plating processing apparatus of FIG. 2B for providing an adhesion promoter to a circuit board to be fabricated.

The embodiments are described in detail below with reference to the drawings, but the embodiments are not intended to limit the scope of the present invention, and the description of structural operations is not intended to limit the order of execution, and any components are recombined. The structure of the device, which produces equal devices, is the scope covered by the creation. In addition, the drawings are for illustrative purposes only and are not drawn to the original dimensions. For ease of understanding, the same elements in the following description will be denoted by the same reference numerals.

In view of the fact that the circuit board that has not been manufactured is in the process of transportation, if there are unexpected factors, it will result in a decrease in manufacturing quality and an increase in cost. The continuous production equipment of the creation is continuously connected (or connected) The device is configured such that the circuit board to be manufactured can be transported from the developing process to the electroplating process without manual transmission. Therefore, the continuous manufacturing apparatus can reduce the unexpected external factors that occur in the transmission of the circuit board to be processed between the various processes, and thereby improve the quality of the manufactured circuit board.

Please refer to Figure 1A and Figure 1B. FIG. 1A is a schematic diagram showing the configuration of one embodiment of the press-making device 101, the exposure device 102, and the continuous production device 100 of the present invention. FIG. 1B is a schematic diagram showing the continuous production apparatus 100 of FIG. 1A. In Fig. 1A, the pressing device 101, the exposure device 102, and the continuous manufacturing apparatus 100 can constitute a circuit board making device. That is, the circuit board (not shown) can be sequentially processed through the pressing device 101, the exposure device 102, and the continuous manufacturing apparatus 100.

The continuous production apparatus 100 includes a developing device 103, a cleaning device 104, a deoxidizing device 106, a pre-plating processing device 108, a drying device 110, and a plating device 112. The cleaning device 104 is connected and connected to the developing device 103. The deoxidation unit 106 is coupled to and continues to the cleaning unit 104, wherein the deoxidation unit 106 provides a deoxidation process which is comprised of a pickling process whereby the oxide on the surface of the board to be fabricated is removed. The pre-plating processing unit 108 is coupled to and connected to the deoxidizing unit 106, wherein the pre-plating unit 108 is configured to provide an adhesion promoter (not shown) to the board to be fabricated. The drying device 110 is connected and connected to the pre-plating processing device 108. The plating apparatus 112 is connected and connected to the drying apparatus 110.

In the embodiment, the continuous manufacturing apparatus 100 is a plurality of processes for performing a continuous process on the circuit board to be processed, and sequentially includes a developing process, a cleaning process, a deoxidation process, a pre-plating process, and drying of the circuit board to be processed. Process and plating process. In other words, the circuit board to be fabricated does not need to be transmitted manually. The self-developing process can be carried out and transported to the electroplating process. Therefore, the continuous manufacturing apparatus 100 can reduce unintended external factors, such as contamination or oxidation, which occur in the transmission of the circuit board to be processed between the processes, thereby improving the quality of the circuit board to be fabricated in the electroplating process.

In FIG. 1B, the continuous manufacturing apparatus 100 further includes an inlet 134 and an outlet 136. The inlet 134 is disposed in the developing device 103 for providing the circuit board to be fabricated in the continuous manufacturing apparatus, that is, the circuit board to be fabricated can be cast through the inlet 134. The outlet 136 is disposed in the electroplating apparatus 112, wherein the circuit board to be fabricated placed (or plated) through the inlet 134 in the continuous manufacturing apparatus 100 can exit the continuous manufacturing apparatus 100 through the outlet 136.

In other words, when the operator places the circuit board to be fabricated into the continuous manufacturing apparatus 100 through the inlet 134, the circuit board on which the plating process has been completed can be taken out at the outlet 136. Furthermore, the transmission of the circuit board to be manufactured between the processes is not in contact with the outside world. Through continuous connection (or connection) of the devices, the process of transporting the circuit board from the developing device 103 to the plating device 112 is accomplished without manual transmission, thereby reducing unintended external factors.

In addition, in FIG. 1A, the continuous production apparatus 100 further includes a detecting unit (not shown), an abnormality processing unit 114, and an abnormality processing moving unit (not shown), wherein the detecting unit is disposed in each device. The detection unit in each device can be coupled to an external display or computer. The detecting unit can be, for example, an optical lens, so as to observe whether the surface or the appearance of the circuit board to be manufactured has a heavy work demand or an abnormal condition such as flaws.

The exception processing unit 114 may be disposed on one side of the opposite device, wherein the exception processing unit 114 includes a development exception processing unit, and a cleaning exception processing Unit, deoxidation abnormal processing unit, pre-plating abnormal processing unit, drying abnormal processing unit, and plating abnormal processing unit.

When an abnormality occurs in one of the developing device 103, the cleaning device 104, the deoxidizing device 106, the pre-plating processing device 108, the drying device 110, and the plating device 112, the abnormality processing unit 114 can transmit an abnormality. The mobile unit transmits a circuit board to be processed having a problem or an abnormality to an abnormality processing unit corresponding to each device. For example, when the detecting unit among the developing device 103 finds that the circuit board to be manufactured has a dirty development condition, the abnormality processing unit 114 can convey the developing board abnormally moving unit to the developing abnormality of the abnormality processing unit 114 through the abnormal moving unit. Among the processing units. The above description is for further explanation of the technical content of the continuous production device 100 of the present invention, but is not limited thereto.

The transfer of the circuit board to be fabricated in the continuous production apparatus 100 can be accomplished automatically, as will be further explained below. Please refer to FIG. 2A and FIG. 2B . FIG. 2A and FIG. 2B are schematic diagrams showing different embodiments of the mobile unit 120 in the continuous production apparatus 100 of FIG. 1A . In the present embodiment, the continuous production device 100 further includes a mobile unit 120. The moving unit 120 is disposed to sequentially pass the circuit board 140 to be manufactured from the developing device 103 through the cleaning device 104, the deoxidizing device 106, the pre-plating processing device 108, the drying device 110, and the plating device 112. In other words, the circuit board 140 to be fabricated can be transported from the position of the circuit board 140 to be placed to the position of the circuit board 140' to be fabricated.

The circuit board 140 to be manufactured can be transferred through the mobile unit 120 in the continuous production apparatus 100, and the transmission is an automatic transmission. Through this automated transmission, the position of the circuit board 140 to be fabricated in the continuous production apparatus 100 The placement (e.g., height) can be controlled so that the environmental factors of the circuit board 140 to be fabricated in the process are more easily controlled, so that the yield of the manufactured circuit board can be improved.

In FIG. 2A, the mobile unit 120 is composed of a scroll wheel 122. The roller 122 is extended from the developing device 103 to the plating device 112. Further, the developing device 103, the cleaning device 104, the deoxidizing device 106, the pre-plating processing device 108, the drying device 110, and the plating device 112 are connected in the same arrangement direction. This embodiment is exemplified by the horizontal direction of the second AA. Not limited to this. The transmission direction D of the circuit board 140 to be mounted on the roller 122 is parallel to the arrangement direction.

Through the configuration of the roller 122, when the circuit board 140 to be manufactured is cast from the inlet 134 (see FIG. 1B) disposed on the developing device 103, the circuit board 140 to be manufactured can be sequentially passed through the devices and sequentially Various processes. In addition, in the embodiment in which the mobile unit 120 is configured with the roller 122, the transmission of the circuit board 140 to be manufactured in the continuous manufacturing apparatus 100 can be regarded as horizontal transmission, that is, the circuit board 140 to be manufactured is horizontal in the transmission process. Place in the direction.

In FIG. 2B, the mobile unit 120 includes a gripper 124. The holder 124 is suspended by the circuit board 140 to be suspended from the developing device 103, the cleaning device 104, the deoxidizing device 106, the pre-plating processing device 108, the drying device 110, and the plating device 112. in. The holder 124 has a movable property in the vertical direction between the developing device 103 and the plating device 112.

Through the configuration of the holder 124, the circuit board 140 to be manufactured can also sequentially pass through the devices in the continuous manufacturing apparatus 100 and sequentially perform various processes. Moreover, the holder 124 provides the degree of freedom of the circuit board 140 to be formed in the horizontal and vertical directions, that is, the horizontal and vertical directions or a pair of mutually perpendicular directions. The degree is such that the circuit board 140 to be fabricated can satisfy the position when it is processed in each device. In addition, in the embodiment in which the mobile unit 120 is configured by the holder 124, the transmission of the circuit board 140 to be manufactured in the continuous manufacturing apparatus 100 can be regarded as vertical transmission, that is, the circuit board 140 to be manufactured is in the transmission process. Place it in a vertical direction.

The circuit board 140 to be fabricated can be automatically transferred through the roller 122 or the holder 124 in the continuous manufacturing apparatus 100, so that the yield of the manufactured circuit board can be improved. In addition, since the pre-plating processing device 108 is provided in the continuous manufacturing apparatus 100, the quality of the circuit board 140 to be fabricated in the electroplating process can be further improved, as described below.

Referring to FIGS. 3A-3C, FIGS. 3A-3C illustrate schematic views of the pre-plating processing apparatus 108 of FIG. 2A providing the adhesion promoter 126 to the circuit board 140 to be fabricated in different embodiments. The description of FIGS. 3A-3C is described with respect to the configuration of the roller 122 in conjunction with the mobile unit 120 of the continuous production apparatus 100 (see FIG. 2A). This embodiment illustrates, in various embodiments, different ways in which the pre-plating processing apparatus 108 provides the adhesion promoter 126 to the circuit board 140 to be fabricated.

The pre-plating treatment device 108 can enhance the adhesion of the ionic solution used in the subsequent electroplating process by providing the adhesion promoter 126 to the circuit board 140 to be fabricated, thereby improving the quality of the electroplating. For example, when the circuit board 140 to be fabricated is first formed with openings or through holes (not shown) in the developing device 103 (see FIG. 1A), the plating pre-processing device 108 can provide the adhesion promoter 126 to be prepared. Among the openings or through holes of the circuit board 140, by the adhesion promoter, the adhesion of the copper ion solution in the electroplating process to the circuit board 140 to be fabricated can be lifted by the adhesion promoter 126 to improve the copper plating filling. The quality of the hole. In addition, The adhesion promoter 126 can also improve the effect of using a dielectric material composed of a special dry film material for electroplating and filling, wherein the dielectric material composed of the special dry film material comprises a photosensitive material.

In FIG. 3A, the continuous manufacturing apparatus 100 further includes a nozzle 130 in which the nozzle 130 is disposed in the pre-plating processing apparatus 108. When the circuit board 140 to be fabricated is transferred into the pre-plating processing device 108 through the roller 122, the pre-plating processing device 108 can provide the adhesion promoter 126 to the circuit board 140 to be fabricated through the nozzle 130. The adhesion promoter 126 may be attached to the surface of the circuit board 140 to be fabricated or may enter/flow into its opening/via.

In FIG. 3B, the continuous manufacturing apparatus 100 further includes a print head 132 in which the print head 132 is disposed in the pre-plating processing apparatus 108. When the circuit board 140 to be fabricated is transferred into the pre-plating processing device 108 through the roller 122, the pre-plating processing device 108 can provide the adhesion promoter 126 to the circuit board 140 to be fabricated through the print head 132. Likewise, the adhesion promoter 126 may be attached to the surface of the circuit board 140 to be fabricated, or may enter/flow into its opening/via.

In FIG. 3C, the pre-plating treatment unit 108 has an immersion tank 128 in which the adhesion promoter 126 is filled in the immersion tank 128, and the roller 122 partially located in the pre-plating treatment unit 108 is located below the liquid level of the immersion tank 128. When the circuit board 140 to be manufactured is transferred into the pre-plating processing device 108 through the roller 122, since the portion of the roller 122' is located below the liquid level of the immersion tank 128, the circuit board 140 to be fabricated on the roller 122' will also be It is located below the level of the immersion tank 128 and is immersed in the adhesion promoter 126 as shown by the circuit board 140' to be fabricated. Therefore, the adhesion promoter 126 can enter into the opening or through hole of the circuit board 140' to be fabricated.

After the pre-plating processing device 108 completes providing the adhesion promoter 126 to the circuit board 140 to be fabricated, the circuit board 140 to be fabricated will be transferred into the drying device 110 by the roller 122 to remove the adhesion to the circuit board 140 to be fabricated. The solvent contained in the adhesion promoter 126. For example, the solvent contained in the adhesion promoter 126 may be volatilized by the high temperature environment provided by the baking process, wherein the temperature and time of the baking process may depend on the volatilization temperature of the solvent contained in the adhesion promoter 126.

Referring to FIGS. 4A-4C, FIG. 4A to FIG. 4C are schematic diagrams showing different embodiments of the pre-plating processing apparatus 108 of FIG. 2B providing the adhesion promoter 126 to the circuit board 140 to be fabricated. The description of FIGS. 4A-4C is described in terms of the configuration of the gripper 124 in conjunction with the mobile unit 120 of the continuous manufacturing apparatus 100 (see FIG. 2B). As such, the present embodiment is a different embodiment of the manner in which the pre-plating processing device 108 provides the adhesion promoter 126 to the circuit board 140 to be fabricated in a number of embodiments.

In FIGS. 4A and 4B, the circuit board 140 to be fabricated is suspended in the pre-plating processing apparatus 108 through the holder 124. The continuous manufacturing apparatus 100 can provide the adhesion promoter 126 to the circuit board 140 to be fabricated through the nozzle 130/print head 132 so that the adhesion promoter 126 can be attached to the surface of the circuit board to be fabricated, or can enter/flow into the opening/ In the through hole.

In FIG. 4C, the circuit board 140 to be fabricated is suspended in the pre-plating processing apparatus 108 through the holder 124. Likewise, the pre-plating treatment unit 108 has an immersion tank 128 in which the adhesion promoter 126 is filled. As described above, the holder 124 can be movable in the vertical direction. Therefore, the circuit board 140 to be manufactured can be moved toward the immersion tank through the holder 124 and immersed in the adhesion promoter 126 in the immersion tank 128. In the middle, the adhesion promoter 126 can be accessed to Its opening or its through hole.

In summary, the continuous production equipment of the present invention is composed of successively connected (or connected) devices, so that the circuit board to be manufactured can be transported from the development process to the electroplating process without manual transmission. Therefore, the continuous manufacturing equipment can reduce the unexpected external factors that occur in the transmission of the circuit board between the various processes, and thereby improve the quality of the circuit board to be fabricated in the electroplating process. In addition, the pre-plating treatment device can provide the adhesion promoter to the circuit board to be fabricated by various means, such as through a nozzle, a print head or a immersion tank, to enhance the adhesion of the ionic solution used in the subsequent electroplating process. Force to improve the quality of plating.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

100‧‧‧Continuous production equipment

101‧‧‧ Pressing device

102‧‧‧Exposure device

103‧‧‧Developing device

104‧‧‧cleaning device

106‧‧‧Deoxidation unit

108‧‧‧Electroplating pretreatment device

110‧‧‧Drying device

112‧‧‧Electroplating unit

114‧‧‧Exception handling unit

Claims (10)

A continuous manufacturing apparatus comprising: a developing device; a cleaning device connected and connected to the developing device; a deoxidizing device connected and connected to the cleaning device; a plating pretreatment device connected and connected to the deoxidizing device a device configured to provide an adhesion promoter to a circuit board to be fabricated; a drying device coupled to and connected to the plating pretreatment device; and a plating device coupled to and connected to the drying device; and a mobile unit The circuit board is configured to sequentially pass the cleaning device, the deoxidizing device, the pre-plating processing device, the drying device, and the plating device from the developing device. The continuous manufacturing apparatus of claim 1, wherein the moving unit is composed of a plurality of rollers, wherein the rollers are extended from the developing device to the plating device. The continuous production apparatus of claim 2, wherein the developing device, the cleaning device, the deoxidizing device, the pre-plating processing device, the drying device, and the plating device are connected in the same configuration direction, The transmission direction of the circuit board on the rollers is parallel to the arrangement direction. The continuous manufacturing apparatus of claim 1, wherein the moving unit comprises a holder, the holder is arranged to suspend the circuit board to be mounted on the developing device, the cleaning device, and the deoxidizing device The electricity Among the pre-plating treatment device, the drying device, and the plating device, and the holder has a movable property in a vertical direction between the developing device and the plating device. The continuous production apparatus of claim 1, wherein the plating pretreatment apparatus has an immersion tank, and the adhesion promoter is filled in the immersion tank. The continuous manufacturing apparatus of claim 5, further comprising a plurality of rollers arranged to sequentially pass the circuit board to be processed from the developing device to the cleaning device, the deoxidizing device, and the pre-plating treatment The device, the drying device and the plating device, wherein the rollers located in the pre-plating pretreatment device are located below the liquid level of the immersion tank. The continuous manufacturing apparatus of claim 1, further comprising a nozzle disposed in the pre-plating processing apparatus, the pre-plating processing apparatus providing the adhesion promoter through the nozzle. The continuous manufacturing apparatus of claim 1, further comprising a printing head disposed in the pre-plating processing apparatus, the pre-plating processing apparatus providing the adhesion promoter through the printing head. The continuous manufacturing apparatus of claim 1, further comprising: an inlet disposed in the developing device for providing the circuit board to be fabricated And the outlet device is disposed in the electroplating device, wherein the circuit board to be fabricated inserted into the continuous manufacturing device through the inlet exits the continuous manufacturing device through the outlet. The continuous manufacturing apparatus of claim 1, 2 or 4, further comprising: an abnormal processing unit; and an abnormal processing moving unit configured to be transported at the developing device, the cleaning device, the deoxidizing device, The abnormality of the electroplating pretreatment device, the drying device, and the plating device to the abnormal processing unit.